JP2001166272A - Method and device for assembling substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for substrate assembling by which upper and lower substrates can be stuck together in a vacuum even when they are in the same shape. SOLUTION: The two substrates to be stuck together are set opposite to each other and stuck with adhesive provided on one of the substrates; and both substrates are stuck together by holding the substrates in a vacuum vertically and opposite to each other and dropping the upper substrate on the lower substrate by releasing the upper substrate from a held state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for assembling substrates to be bonded together, with two substrates to be bonded facing each other and the distance between the substrates being reduced in a vacuum.

[0002]

2. Description of the Related Art In manufacturing a liquid crystal display panel, an adhesive (hereinafter, referred to as a glass substrate) having two glass substrates provided with a transparent electrode and a thin film transistor array at an extremely close interval of about several micrometers.
There is a step of bonding together (hereinafter, the substrate after bonding is called a cell) by sealing with a liquid crystal in a space formed by the bonding.

In order to seal the liquid crystal, the liquid crystal is dropped on one of the substrates on which a sealing agent is drawn in a closed pattern so that no injection port is provided, and the other substrate is disposed on the one of the substrates. Then, a method proposed in Japanese Patent Application Laid-Open No. 62-165622, in which the upper and lower substrates are brought close together in a vacuum, or a sealing agent is patterned so as to provide an injection port on one of the substrates, JP-A-10-26763 in which substrates are bonded to each other and liquid crystal is injected from a sealing agent injection port
And the method proposed in Japanese Patent Publication No.

[0004]

In the above technique, the two substrates are bonded in a vacuum. However, in a vacuum, the substrates cannot be suctioned and adsorbed due to a pressure difference from the atmosphere. ) Is mechanically held.
Therefore, in order to lower the upper substrate while performing alignment with the substrate on the table (hereinafter, referred to as the lower substrate), it is convenient to provide a holding margin on the upper substrate so that the holding portion does not interfere with the lower substrate. Therefore, it is necessary to make the upper substrate large, and the upper and lower substrates cannot be formed in the same shape.

Further, since the upper substrate is moved down while detecting the alignment marks of the upper and lower substrates while performing the alignment, it takes a long time to bond the substrates and the productivity is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method and apparatus for assembling a substrate which can be bonded in a vacuum even if the upper and lower substrates have the same shape.

It is a further object of the present invention to provide a method and apparatus for assembling a substrate capable of improving the productivity by bonding the substrates in a short time in a vacuum.

[0008]

A feature of the present invention that achieves the above object is that two substrates to be bonded are opposed to each other, and both substrates are bonded to each other by an adhesive provided on one of the substrates. An object of the present invention is to hold both substrates up and down in a vacuum, release the holding of the upper substrate, drop the substrate on the lower substrate, and bond the two substrates together.

When the upper substrate is dropped in the air, the air existing between the two substrates hinders the drop of the upper substrate, so that the upper substrate does not drop onto the lower substrate in the open state. That is why leaves and paper flutter down. If the object is thin, it will not fall as it is due to viscous resistance with air even if the weight increases, resulting in displacement.

According to the present invention, based on the absence of gas between the two substrates in a vacuum, the two substrates are bonded by simply opening the upper substrate and utilizing the fact that the upper substrate falls onto the lower substrate. Things.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

1 to 3, the substrate assembling apparatus according to the present invention comprises a liquid crystal dropping portion S1 and a substrate bonding portion S2, both of which are disposed adjacent to each other on the gantry 2. Above the gantry 2, there is a frame 3 that supports the substrate bonding portion S2. An XYθ stage T1 is provided on the upper surface of the gantry 2. The X stage 4a can be moved by the drive motor 5 in the left and right X-axis directions on the drawing, that is, between the liquid crystal dropping portion S1 and the substrate bonding portion S2. Y
The stage 4b is on the X stage 4a,
Thus, the X stage 4a can move in the Y axis direction orthogonal to the X axis direction which is the moving direction of the X stage 4a.

The θ stage 4c is on the Y stage 4b, is rotatable horizontally with respect to the Y stage 4b by a drive motor 8 via a rotary bearing 7, and mounts the lower substrate 1a on the θ stage 4c. The table 9 is fixed. The table 9 has a built-in means for holding and mounting the lower substrate 1a by vacuum suction (suction suction). The lower chamber unit 10 is fixed to the Y stage 4b with a plate 13. stage 4c is rotatably mounted on the lower chamber unit 10 via a rotary bearing 11 and a vacuum seal 12, so that even when the θ stage 4c rotates, the lower chamber unit 10 is connected and does not rotate.

The liquid crystal dropping section S1 is provided with a dispenser 17 supported by a bracket 14 protruding from the frame 3 for dropping a desired amount of liquid crystal agent onto the lower substrate 1a held on the table 9, and for moving the dispenser 17 up and down. Z axis stage 1
5 and a motor 16 for driving it. XYθ stage T1 holding and mounting lower substrate 1a on table 9
Moves in the X and Y axis directions with respect to the nozzle 18 of the dispenser 17 for dropping the liquid crystal agent. As a result, a desired amount of the liquid crystal agent is dropped at an arbitrary position on the lower substrate 1a. XYθ stage T on which the lower substrate 1a is mounted and held after liquid crystal is dropped
1 is moved by the drive motor 5 to the lower part of the substrate bonding part S2.

In the substrate bonding portion S2, the upper chamber unit 21 and the pressure plate 27 having a vacuum suction function can move up and down independently of each other. That is, the upper chamber unit 21 has a housing 30 containing a linear bush and a vacuum seal, and is moved in the vertical Z-axis direction by a cylinder 22 fixed to the frame 3.

When the XYθ stage T1 moves to the substrate bonding portion S2 and the upper chamber unit 21 descends, the O-ring 44 disposed around the lower chamber unit 10
Then, the flange 21a of the upper chamber unit 21 comes into contact with the upper chamber unit 21 to be integrated, and at this time, a state of functioning as a vacuum chamber is established.

23 is a vacuum valve, 24 is a piping hose,
Connected to vacuum sources not shown, these are used to depressurize and evacuate the vacuum chamber. Reference numeral 25 denotes a gas purge valve, and reference numeral 26 denotes a gas tube, which is connected to a pressure source such as nitrogen gas or clean dry air, and is used for returning the vacuum chamber to atmospheric pressure.

The housing 30 includes the upper chamber unit 2
Even if the vacuum chamber 1 is deformed by forming the vacuum chamber with the lower chamber unit 10, the vacuum chamber gives the shaft 29 due to the built-in vacuum seal that can move up and down without causing a vacuum leak to the shaft 29. The force can be absorbed, the deformation of the pressing plate 27 fixed to the shaft 29 can be substantially prevented, and the pressing plate 27 can descend (fall) while keeping parallel to the table 9.

The upper substrate 1b is held on the lower surface of the pressure plate 27 by vacuum suction (suction suction) in the atmosphere. That is, 41 is a suction / suction joint, 42 is a suction tube, which is connected to a vacuum source (not shown), and a plurality of suction holes connected to the lower surface of the pressure plate 27 are provided.

The pressure plate 27 is attached to a shaft 29, and the shaft 29 is fixed to the housings 31, 32. The housing 31 is attached to the frame 2 by a linear guide 34, and the pressing plate 27 has a structure capable of moving up and down. The vertical drive is performed by a motor 4 fixed to a bracket 38 on a frame 35 connected to the frame 3.
Performed with 0. The transmission of the drive is executed by the ball screw 36 and the nut housing 37. Nut housing 3
Reference numeral 7 is connected to the housing 32 via the load meter 33, and operates integrally with the pressing plate 27 below the housing 32. Therefore, when the shaft 29 is lowered by the motor 40, the pressure plate 27
Is lowered, and a pressing force can be applied to the bonded upper substrate 1b and lower substrate 1a.

In this case, the load meter 33 functions as a pressure sensor, and by controlling the motor 40 based on the sequentially fed-back signal, it becomes possible to apply a desired pressure to the upper and lower substrates 1a and 1b. ing.

After the lower substrate 1a is held by suction on the table 9 by vacuum suction and the upper substrate 1b is held by suction on the pressing plate 27 by vacuum suction, when the vacuum chamber is depressurized, the upper and lower substrates become up and down in the process of becoming vacuum. Since the suction force holding the substrates 1a and 1b disappears, the lower substrate 1a and the table 9
Air or between the upper substrate 1b and the pressure plate 27 escapes, and the lower substrate 1a dances,
Since the upper substrate 1b may fall under its own weight,
The lower chamber unit 10 is provided with a mechanism for preventing movement of the lower substrate 1a and holding the upper substrate 1b, and a mechanism for dropping the upper substrate 1b to a predetermined position (shown in FIGS. 2 and 3). That is, as shown in FIG. 2 and FIG. 3, the mechanism for preventing the movement, holding the substrate, and dropping the substrate to a predetermined position is to move the four corners of the lower substrate 1a placed on the table 9 horizontally from the X direction and the Y direction. Direction and position the upper substrate 1b
And a guide mechanism 56 that pushes the four corners of the lower substrate 1a placed on the table 9 in the horizontal direction from the X and Y directions to position and drop the upper substrate 1b to a predetermined position. , The θ stage 4c is guided by a linear guide 52, and the positioning holding piece 51 and the guide mechanism 56 are pulled toward the inner wall side of the lower chamber unit 10 by a spring 53. On the outer periphery of the flange portion 10a of the lower chamber unit 10, a positioning holding piece 51 and a guide mechanism 5 inside the lower chamber unit 10 are provided.
A cylinder 54 having a plunger 54a extended toward 6 is provided via a bracket 55. The cylinder 54 pushes the side surface of the lower substrate 1a with the positioning holding piece 51 against the pulling force of the spring 53 with the plunger 54a, and pushes the side surfaces of the upper and lower substrates 1a and 1b with the guide mechanism 56.

The positioning holder 51 has a vertical portion 51a and a horizontal portion 51b extending from the vertical portion 51a in parallel with the substrate. As shown in FIG. 2, the horizontal portion 51b is separated from the upper surface of the lower substrate 1a on the lower side and abuts on the lower surface of the upper substrate 1b on the upper side. Further, as shown in FIG. 2, the vertical portion 51a is in contact with the side surface of the lower substrate 1a.

As shown in FIG. 2, the guide mechanism 56 is in contact with the side surfaces of the upper and lower substrates 1a and 1b. The pressing plate 27 has a recess 27 extending in the Z-axis direction to be fitted with the guide mechanism 56.
a, the movement when the pressing plate 27 descends is smooth even if the guide mechanism 56 is present.

Next, a description will be given of a step of bonding substrates by the present substrate assembling apparatus.

First, in FIG. 1, a lower substrate 1a in which a sealant is drawn in a closed pattern so as not to have an injection port is mounted on a table 9, and positioning holding pieces 51 at each of four corners are driven by a cylinder 54. After the lower substrate 1a is positioned and held on the table 9 by vacuum suction, each plunger 54a is retracted, and each positioning holding piece 51 is retracted. Thereafter, the upper substrate 1b is held on the pressure plate 27 by suction (vacuum) suction using a robot hand (not shown) or the like. Then, the XYθ stage T1 is moved to the substrate bonding part S2 side by the drive motor 5, and the upper chamber unit 21 is moved.
Each substrate 1 is connected to an image processing camera (not shown)
Read the alignment marks of a and 1b, and
The substrate 1 is slightly moved to align the two substrates 1a and 1b.
In this alignment, the ball screw 36 may be rotated by the motor 40, and the pressing plate 27 may be slightly lowered so that the alignment marks of the substrates 1a and 1b can be easily captured by the camera. Thereafter, the lower substrate 1a is moved to the liquid crystal dropping portion S by the XYθ stage T1.
Then, a desired amount of liquid crystal is supplied from the dispenser 17 to the inside of the sealant having a closed pattern on the lower substrate 1a. Then, the lower substrate 1a is moved to the substrate bonding portion S2 again on the XYθ stage T1. The amount of movement at this time can be confirmed by the amount of rotation of the drive motor 5, so that both substrates 1a,
No displacement occurs between 1b.

Next, the positioning holding piece 51 is
And the vertical and horizontal portions 51a and 51b of the positioning and holding piece 51 hold the side and top surfaces of the lower substrate 1a at four corners, respectively. Next, the pressure plate 27 is lowered to bring the lower surface of the upper substrate 1b closer to the upper surface of the horizontal portion 51b of the positioning holding piece 51, and then the guide mechanism 56 is moved by the plunger 54a of the cylinder 54 to move the upper and lower substrates 1b.
The sides of a and 1b are gently held down at the four corners just in case.

Thereafter, the upper chamber unit 21 is lowered by the cylinder 22 to form a vacuum chamber, and pressure reduction is started. As the pressure is reduced, the air existing between the substrates 1a and 1b and the table 9 or the pressure plate 27 escapes, but the movement of the substrates 1a and 1b is regulated by the positioning and holding pieces 51 and the guide mechanism 56. There is no movement due to the air flow. That is, even if the lower substrate 1a rises, the lower surface of the horizontal portion 51b presses the lower substrate 1a, and the vertical portion 51a and the guide mechanism 56 regulate the movement in the X and Y directions.

The upper substrate 1b drops on the upper surface of the horizontal portion 51b of the positioning holding piece 51 and is held by its own weight due to the disappearance of the suction force of the pressure plate 27. When falling, the guide mechanism 56 regulates the movement in the X direction and the Y direction.

When the vacuum chamber reaches a desired degree of vacuum, the positioning holding piece 51 is retracted, the upper substrate 1b is dropped onto the lower substrate 1a, and the upper and lower substrates 1a and 1b are bonded.

The upper substrate 1b falls onto the lower substrate 1a only by retracting the positioning and holding pieces 51.
The bonding of the substrates 1a and 1b can be completed in a short time.
b can be of the same size. If necessary, different sizes may be attached.

When the upper substrate 1b falls onto the lower substrate 1a, the guide mechanism 56 restricts the movement of the upper substrate 1b in the X direction and the Y direction even if the upper substrate 1b is likely to shift due to an unexpected cause. Therefore, it falls to a predetermined position on the lower substrate 1a.

Then, the pressing plate 27 is further lowered, and the upper and lower substrates 1a and 1b are pressed to bond the substrates 1a and 1b at a desired interval. Even in the process of bonding and pressing, the two substrates 1a and 1b are not displaced because the movement in the X and Y directions is regulated by the guide mechanism 56.

In the above-described embodiment, the movement of the upper substrate 1b when the upper substrate 1b is dropped is regulated by the guide mechanism 56 just in case. However, even if the guide mechanism 56 is not used, the positioning holding pieces 51 are synchronized with each other. Since it has been confirmed that the upper substrate 1b is naturally dropped by the inertia due to no air resistance in a vacuum by retreating at high speed, the guide mechanism 56 is retracted when the upper substrate 1b is dropped. After the upper substrate 1b is dropped, it may be pressed and bonded as it is,
The guide mechanism 56 may be omitted.

As a precautionary measure, after the upper substrate 1b is dropped, the guide mechanism 56 may be moved by the plunger 54a of the cylinder 54, and the side surfaces of the upper and lower substrates 1a, 1b may be held at four corners for positioning and bonding.

Although the guide mechanism 56 has a movable structure, it can be bonded without being moved.
It may be fixed to the stage 4c or the table 9.

After the bonding, the inside of the vacuum chamber is returned to the atmospheric pressure, the upper chamber unit 21 is raised by the cylinder 22, the XYθ stage T1 is returned to the liquid crystal dropping unit S1, and the substrates 1a and 1b integrated from the table 9 are integrated. Remove (cell).

FIG. 4 is a view showing a second embodiment according to the present invention, and the same portions as those shown in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted.

In this embodiment, the lower surface of the upper substrate 1b is lowered by lowering the pressure plate 27 so that the horizontal portion 51
Then, the inside of the vacuum chamber is depressurized after being brought into contact with the upper surface of b.

Then, the attraction force holding the upper substrate 1b disappears, and the upper substrate 1b is held on the positioning holding piece 51 by its own weight. At this time, the upper substrate 1b is
Since the movement is restricted by contacting the upper surface of the first horizontal portion 51b, it does not move due to the flow of air generated at the time of pressure reduction.

Since the upper substrate 1b held on the positioning and holding piece 51 bends under its own weight, the horizontal portion 5 of the positioning and holding piece 51
The height of the upper substrate 1b is set to a height at which the upper substrate 1b bends and contacts the lower substrate 1a.

When the desired degree of vacuum is attained, the upper and lower substrates 1a and 1b are bonded by dropping the positioning and holding piece 51 and dropping the upper substrate 1b onto the lower substrate 1a.

Since the upper and lower substrates 1a and 1b are in contact with the bent portions of the upper substrate, a frictional resistance is generated between the substrates 1a and 1b when falling. Since the movement of the upper substrate 1b is regulated by this frictional resistance, the upper substrate 1b shown in FIG.
Without the guide mechanism 56 of FIG.
Fall to the determined position above. And, furthermore, the pressing plate 2
7 and pressurize the upper and lower substrates 1a, 1b to
a and 1b are bonded at desired intervals. In particular, the upper substrate 1a
If the two opposing sides and corners of the upper substrate 1a are held by the positioning holding piece 51, the opposing two sides and corners of the upper substrate 1a contact the lower substrate 1a in a strip shape. , 1b, the positioning accuracy utilizing the image recognition camera is improved.

By providing a columnar spacer or an adhesive bead on the lower substrate 1a in advance, even if the upper substrate 1b is bent and comes into contact with the lower substrate 1a, the upper and lower substrates 1a and 1b are bonded together. The intervals can be uniform. Further, as shown in FIG. 2, a guide mechanism 56 may be used in combination.

FIG. 5 is a view showing a third embodiment according to the present invention. Like FIG. 4, the same parts as those shown in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted.

In FIG. 5, reference numeral 57 denotes a positioning piece, 58 denotes a substrate holding guide, and 59 denotes an axis. A substrate holding guide 58 that rotates about the axis 59 is provided near the four corners of the upper substrate 1b. Has a plane portion 58a. In addition, positioning pieces 57 are provided near the four corners of the lower substrate 1a instead of the positioning holding pieces 51 of FIG.

As shown in FIG. 5A, the lower surface of the upper substrate 1b is brought into contact with the upper surface of the flat portion 58a of the substrate holding guide 58 by lowering the pressure plate 27 which has vacuum-adsorbed the upper substrate 1b. Reduce the pressure inside the chamber. Then, the upper substrate 1b
The upper substrate 1b is held by the substrate holding guide 58 by its own weight. At this time, the upper substrate 1b
Since the four corners are sandwiched between the upper surface of the flat portion 58a of the substrate holding guide 58 and the pressing plate 27 and are restricted from moving,
It does not move due to the flow of air generated by the decompression.

When the inside of the vacuum chamber reaches a desired degree of vacuum, as shown in FIG. 5B, all the substrate holding guides 58 are simultaneously rotated 90 degrees in the direction of the arrow so that the plane portions 58a are vertical. Let it. Then, the upper substrate 1b falls on the lower substrate 1a.

The flat portion 58a of the substrate holding guide 58 functions as a guide for the upper substrate 1b on which the upper substrate 1b falls.
The movement in the direction and the Y direction is regulated, and the robot falls to a predetermined position. Then, the pressing plate 27 is further lowered, and the upper and lower substrates 1 are moved.
The substrates 1a and 1b are bonded at a desired interval by applying pressure to the substrates 1a and 1b.

The substrate holding guide 58 may have any shape as long as it has a flat portion 58a.

FIG. 6 is a view showing a fourth embodiment of the present invention. Similar to FIG. 5, the same parts as those shown in FIG. 2 are denoted by the same reference numerals, and duplicate description is omitted.

In FIG. 6, 57 is a positioning piece similar to that shown in FIG. 5, 60 is a board holding piece, and 59 is a shaft. The substrate holding piece 60 that rotates around the shaft 59 corresponds to the substrate holding guide 58 shown in FIG. 5, but differs in that the cross section is a cross shape.

As shown in FIG. 6A, similarly to the embodiment of FIG. 5, the pressing plate 27 is lowered to bring the lower surface of the upper substrate 1b into contact with the horizontal portion of the substrate holding piece 60 as shown in the figure. Then, when the pressure in the vacuum chamber is reduced, the suction attraction holding the upper substrate 1b disappears, and the upper substrate 1b is held by the substrate holding piece 60 by its own weight. At this time, since the movement of the upper substrate 1b is restricted by the vertical portion of the substrate holding piece 60, the upper substrate 1b does not move due to the flow of air at the time of pressure reduction.

When the inside of the vacuum chamber reaches a desired degree of vacuum, as shown in FIG. 6B, all the substrate holding pieces 60 are simultaneously rotated by 90 degrees in the direction of the arrow, and the upper substrate 1b is moved to the lower substrate 1a.
Then, the upper and lower substrates 1a and 1b are bonded together.
Since there is no air resistance in a vacuum and the upper substrate 1b falls vertically due to the gravitational force of the earth, the upper substrate 1b falls to a predetermined position. Then, the pressing plate 27 is further lowered, and the upper and lower substrates 1a and 1b are pressed to bond the substrates 1a and 1b at a desired interval.

In this embodiment, since the substrate holding piece 60 releases the holding in the direction of dropping the upper substrate 1b, the upper substrate 1b is easily dropped vertically. Although not shown in the drawing, the guide mechanism 56 may be used in combination as shown in FIG.

FIG. 7 is a view showing a fifth embodiment according to the present invention. As in FIG. 5, the same parts as those shown in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted.

In FIG. 7, reference numeral 61 denotes a positioning and holding guide. In this embodiment, the positioning holding piece 51 shown in FIG.
The positioning and holding guide 61 having a vertical portion on the upper surface of the substrate is provided at the four corners of the substrate.

As shown in FIG. 7A, the pressure plate 27 holding the upper substrate 1b is lowered to bring the lower surface of the upper substrate 1b closer to the positioning and holding guide 61, and then the pressure in the vacuum chamber is reduced. The suction attraction force holding the upper substrate 1b disappears, and the upper substrate 1b falls by its own weight and is held by the positioning and holding guide 61 as shown in the figure. At this time, since the upper substrate 1b is restricted from moving in the X and Y directions by the positioning and holding guide 61, it does not move in the X and Y directions due to the flow of air or the like.

When the desired degree of vacuum is reached, the positioning and holding guides 61 are simultaneously retracted, the upper substrate 1b is dropped onto the lower substrate 1a, and the upper and lower substrates 1a and 1b are bonded. Since there is no air resistance in vacuum and the upper substrate 1b falls vertically, the upper substrate 1b falls to a predetermined position on the lower substrate 1a. Thereafter, the positioning and holding guide 61 is moved forward to hold the side surfaces of the upper and lower substrates 1a and 1b at the four corners. Then, the pressing plate 27 is further lowered to press the upper and lower substrates 1a and 1b, and the substrates 1a and 1b are bonded to each other at a desired interval.

In this embodiment, the number of parts is reduced by combining the positioning holding piece 51 and the guide mechanism 56 shown in FIG. 2, and the apparatus can be simplified.

Although not shown in the drawing, the guide mechanism 56 may be used together as shown in FIG. 2, or the pressure may be applied while the positioning and holding guide 61 is retracted.

FIGS. 8 and 9 show the sixth and seventh embodiments according to the present invention. The press plate 27 has a built-in function to hold the upper substrate 1b even under a vacuum condition. .

In both figures, the same parts as those shown in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted.

The pressing plate 27 in FIG. 8 is formed of an insulating member having an electrode plate built therein, and has an electrostatic attraction function capable of holding the upper substrate 1b.

The pressure plate 27 shown in FIG. 9 has a built-in adhesive portion 62 using an adhesive capable of holding the upper substrate 1b and a cylinder 63 for driving the adhesive portion.

In both figures, the upper substrate 1b is
Is held by the electrostatic adsorption function or the adhesive portion 62, and then the pressure in the vacuum chamber is reduced.

At this time, since the upper substrate 1b is held by the electrostatic attraction function and the adhesive portion 62, each of the pressing plates 27
The upper substrate 1b does not fall and does not move.

When the inside of the vacuum chamber reaches a desired degree of vacuum, the holding of the upper substrate 1b is released (the electrostatic attraction function is released or the adhesive portion 62 is retracted in the pressure plate 27 by the cylinder 63). 1b is dropped on the lower substrate 1a, and the upper and lower substrates 1a and 1b are bonded.

Since there is no air resistance in vacuum and the upper substrate 1b falls vertically, the upper substrate 1b falls to a predetermined position on the lower substrate 1a. Then, the pressing plate 27 is further lowered to press the upper and lower substrates 1a and 1b, and the both substrates 1a and 1b are pressed.
Are bonded at desired intervals.

As shown in FIGS. 8 and 9, the positioning and holding guide mechanism 56 may be used in combination or may be omitted.

In both embodiments described above, the upper and lower substrates 1
The same size can be used as a and 1b. Also, since the substrate does not move in the X direction and the Y direction in the process of dropping and bonding the substrate at a desired interval, it is not necessary to perform positioning at the stage of bonding. In addition, productivity is improved because the sheets are stuck in a short time by dropping.

The present invention is not limited to the embodiment described above,
You may implement as follows. (1) The movement preventing mechanism and the holding mechanism for the lower substrate 1a and the upper substrate 1b may be built in the θ stage 4c or the table 9. Further, it may be provided on the upper chamber unit 21 side.

(2) The movement preventing mechanism and the holding mechanism may be used in combination with each other.

(3) In the present invention, the upper and lower substrates 1a and 1b can have the same shape. However, even if the upper and lower substrates 1a and 1b have different shapes, the movement preventing mechanism and the holding mechanism can be made to conform to the shapes. Can be laminated.

(4) The present invention can be applied not only to the bonding of the substrates of the liquid crystal display panel but also to the bonding of other substrates.

[0076]

As described above, according to the present invention,
Even if the upper and lower substrates have the same shape, both substrates can be bonded in a vacuum. Further, according to the present invention, productivity can be improved by bonding substrates in a short time in a vacuum.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an overall configuration of a board assembling apparatus showing an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a substrate bonding section showing a situation when substrates are bonded by the substrate assembling apparatus shown in FIG. 1;

FIG. 3 is a partial plan view of a substrate bonding section showing a state where substrates are bonded by the substrate assembling apparatus shown in FIG. 1;

FIG. 4 is a partial cross-sectional view of a substrate bonding portion showing a state of bonding substrates according to a second embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of a substrate bonding portion illustrating a state in which substrates are bonded according to a third embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of a substrate bonding portion illustrating a state in which substrates are bonded according to a fourth embodiment of the present invention.

FIG. 7 is a partial cross-sectional view of a substrate bonding portion illustrating a state in which substrates are bonded according to a fifth embodiment of the present invention.

FIG. 8 is a partial cross-sectional view of a substrate bonding portion illustrating a state in which substrates are bonded according to a sixth embodiment of the present invention.

FIG. 9 is a partial cross-sectional view of a substrate bonding portion showing a state where substrates are bonded according to a seventh embodiment of the present invention.

[Explanation of symbols]

 S1 ... Liquid crystal dropping part S2 ... Substrate bonding part 1a ... Lower substrate 1b ... Upper substrate 9 ... Table 10 ... Lower chamber unit 21 ... Upper chamber unit 27 ... Pressing plate 51 ... Positioning holding piece 56 ... Guide mechanism 57 ... Positioning piece 58 ... board holding guide 59 ... shaft 60 ... board holding piece 61 ... positioning and holding guide 62 ... adhesive section 63 ... cylinder

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masayuki Saito 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Pref. Hitachi Techno Engineering Co., Ltd. (72) Inventor Akira Hirai 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Hitachi TECHNO ENGINEERING CORPORATION Development Laboratory F-term (reference) 2H088 FA01 FA09 FA16 FA17 FA30 HA01 MA20

Claims (7)

[Claims] 1. A method for assembling two substrates to be bonded, wherein the two substrates to be bonded are opposed to each other, and the two substrates are bonded to each other by an adhesive provided on one of the substrates. And releasing the holding of the substrate and dropping the substrate onto a lower substrate to bond the two substrates together. 2. The method of assembling a substrate according to claim 1, wherein the upper substrate is dropped onto a lower substrate while guiding the upper substrate to fall. 3. The method for assembling a substrate according to claim 1, wherein the upper substrate is dropped onto the lower substrate while the bent portion of the upper substrate is in contact with the lower substrate which is held horizontally. A method for assembling a substrate, comprising: 4. The method for assembling a substrate according to claim 1, wherein before or after the upper substrate is dropped onto the lower substrate.
A method of assembling a substrate, wherein the two substrates are aligned with each other. 5. An assembling apparatus for a substrate, in which two substrates to be bonded are opposed to each other and both substrates are bonded by an adhesive provided on either one of the substrates, wherein the upper substrate is opposed to the lower substrate and held in a vacuum. And a holding / opening means for releasing the holding and dropping the upper substrate onto the lower substrate. 6. The board assembling apparatus according to claim 5, further comprising a table for horizontally holding the lower board. 7. An apparatus for assembling a substrate according to claim 5, wherein said holding and releasing means holds opposite sides or diagonals of the upper substrate, and flexes the upper substrate by holding. A substrate assembling apparatus comprising: means for contacting a lower portion of a substrate with a lower substrate which is held horizontally.