New! View global litigation for patent families

USRE46146E1 - Liquid crystal display device and method of manufacturing the same - Google Patents

Liquid crystal display device and method of manufacturing the same Download PDF

Info

Publication number
USRE46146E1
USRE46146E1 US13960713 US201313960713A USRE46146E1 US RE46146 E1 USRE46146 E1 US RE46146E1 US 13960713 US13960713 US 13960713 US 201313960713 A US201313960713 A US 201313960713A US RE46146 E1 USRE46146 E1 US RE46146E1
Authority
US
Grant status
Grant
Patent type
Prior art keywords
sealant
uv
substrate
formed
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US13960713
Inventor
Moo Yeol Park
Sung Su Jung
Young Sang Byun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Display Co Ltd
Original Assignee
LG Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers, also spacers with conducting properties; Sealing of the cell

Abstract

An LCD device and a method of manufacturing the same are disclosed, in which a sealant concentrated upon the end of a dispensing device is formed in a dummy region on a substrate, so that a liquid crystal layer is not contaminated when both substrates are attached to each other and a cell cutting process can easily be performed. The method of manufacturing an LCD device includes preparing a lower substrate and an upper substrate, forming an auxiliary UV sealant in a dummy region on one of the lower and upper substrate and forming a main UV sealant, applying a liquid crystal on one of the lower and upper substrates, attaching the lower and upper substrates, and irradiating UV light onto the attached substrates.

Description

This application claims the benefit of the Korean Application No. P2002-8900 filed on Feb. 20, 2002, which is hereby incorporated by reference for all purposes as if fully set forth herein.

This application incorporates by reference two applications, Ser. No. 10/184,096, filed on Jun. 28, 2002, entitled “SYSTEM AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICES”and Ser. No. 10/184,088, filed on Jun. 28, 2002, entitled “SYSTEM FOR FABRICATING LIQUID CRYSTAL DISPLAY AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY USING THE SAME”, as if fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a liquid crystal display (LCD) device, and more particularly, to a sealant pattern of an LCD device manufactured by applying a liquid crystal to the surface of a substrate.

2. Discussion of the Related Art

Generally, ultra thin flat panel displays have a display screen with a thickness of several centimeters or less. In particular, flat panel LCD devices are widely used in monitors for notebook computers, spacecraft, and aircraft because such LCD devices have low power consumption and are easy to carry.

Such an LCD device includes a lower substrate, an upper substrate, and a liquid crystal layer. A thin film transistor (TFT) and a pixel electrode are formed on the lower substrate. The upper substrate is formed to oppose the lower substrate. A light-shielding layer, a color filter layer, and a common electrode are formed on the upper substrate. The liquid crystal layer is formed between the lower and upper substrates. In operation an electric field is formed between the lower and upper substrates by the pixel electrode and the common electrode so that the electric field “drives” the alignment of molecules in the liquid crystal layer. Light transmittivity is controlled by driving the liquid crystal layer so that a picture image is displayed.

In the aforementioned LCD device, to form the liquid crystal layer between lower and upper substrates, a vacuum injection method based on capillary phenomenon and pressure difference has been conventionally used. However, such a vacuum injection method has a problem in that it takes long time to inject the liquid crystal into a large display panel, thereby reducing manufacturing productivity.

To solve such a problem, a method of applying liquid crystal on the substrate has been developed and is generally described with reference to FIGS. 1A to 1D. Although the drawings illustrate only one unit cell, a plurality of unit cells may be formed depending upon the size of the substrate.

As shown in FIG. 1A, a lower substrate 1 and an upper substrate 3 are prepared. A plurality of gate and data lines (not shown) are formed on the lower substrate 1. The gate lines cross the data lines to define a pixel region. A thin film transistor (not shown) is formed at each crossing point between the gate and data lines. A pixel electrode (not shown) connected with the thin film transistor is formed in the pixel region.

A light-shielding layer (not shown) is formed on the upper substrate 3 to prevent light from leaking out from the gate and data lines and the thin film transistor. Color filter layers of red(R), green(G), and blue(B) are formed on the light-shielding layer, and a common electrode is formed on the color filter layers. An alignment film (not shown) is formed on at least one of the lower substrate 1 and the upper substrate 3 to initially align the liquid crystal molecules.

As shown in FIG. 1B, a sealant 7 is formed on the lower substrate 1 and a liquid crystal 5 is applied thereon, so that a liquid crystal layer is formed. A spacer (not shown) is spread or sprayed onto the upper substrate 3 to maintain a cell gap between the upper and lower substrates.

In the method of manufacturing the LCD device based on the liquid crystal application method, a liquid crystal layer is formed on attached substrates before the sealant 7 is hardened. Therefore, if a thermo-hardening sealant is used as the sealant 7, the liquid crystal heats and expands so that it flows out of the substrate when it is heated. For this reason, a problem arises in that the liquid crystal 5 is contaminated. Therefore, in the method of manufacturing the LCD based on the liquid crystal application method, a sealant that is at least partially curable by ultraviolet (UV) light is used as the sealant 7.

The UV sealant is formed by a screen printing method or a dispensing method. In the screen printing method, since a screen comes into contact with the substrate, the alignment film formed on the substrate may be damaged. Also, if the substrate has a large sized area, loss of the sealant increases. In these respects, the dispensing method is preferably used.

As shown in FIG. 1C, the lower substrate 1 is attached to the upper substrate 3.

As shown in FIG. 1D, UV light is irradiated through a UV irradiating device 9 so that the sealant 7 is hardened.

Thereafter, although not shown, a cell cutting process and a final test process are performed, thereby completing a liquid crystal cell.

Meanwhile, FIGS. 2A and 2B are perspective views illustrating a process of forming a UV sealant using a dispensing method. In the method of applying liquid crystal to one of the substrates before attaching the the substrates, since no liquid crystal injection hole is required, a sealant 7 having no injection hole is formed on a lower substrate 1 using a dispensing device 8.

However, since the sealant 7 has high viscosity, it is concentrated upon the end of a nozzle of the dispensing device 8 before the sealant 7 is dispensed. For this reason, a blob “A” of the sealant 7 is excessively deposited at the point where deposition of the sealant 7 on the substrate is started.

As shown in FIG. 2C, the excessively distributed sealant spreads into an active region (central part of the substrate) and a dummy region (outer part of the substrate) when the lower substrate 1 is attached to the upper substrate 3. In this case, a problem arises in that the sealant spreads into the active region and contaminates the liquid crystal while the sealant spread out to the dummy region makes the cell cutting process difficult, especially after the sealant is cured.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an LCD device and a method of manufacturing the same that substantially obviates one or more problems due to limitations and disadvantages of the related art.

An advantage of the present invention is to provide an LCD device and a method of manufacturing the same in which a sealant is formed so that a liquid crystal is not contaminated when both substrates are attached to each other and so that a cell cutting process can be easily performed.

Additional advantages and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. These and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, a method of manufacturing an LCD device according to the present invention includes preparing a lower substrate and an upper substrate; forming an auxiliary sealant and subsequently forming a main sealant on one of the lower and upper substrates, wherein the auxiliary sealant is formed in a dummy region and connect to the main sealant; applying a liquid crystal on one of the lower and upper substrates; attaching the lower and upper substrates; and curing at least the main sealant.

In one embodiment of the present invention, the supplementary UV sealant does not perform the ordinary the function of a sealant, that is, it does not prevent the liquid crystal from leaking out. While the main UV sealant acts as a sealant to confine the liquid crystal.

In another aspect of the present invention, a method of manufacturing a liquid crystal display (LCD) device includes preparing a lower substrate and an upper substrate; forming an auxiliary UV sealant and a main UV sealant on one of the lower and upper substrates, wherein the auxiliary UV sealant is formed in a dummy region and extends from the main UV sealant; applying a liquid crystal on one of the lower and upper substrates; attaching the lower and upper substrates; and irradiating UV light on the attached substrates.

In one aspect of the present invention, the supplementary UV sealant is formed in a dummy region on the substrate and then the closed type main UV sealant is formed, so that the sealant concentrated upon the end of a nozzle of a dispensing device is formed in the dummy region on the substrate.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principle of the invention.

In the drawings:

FIGS. 1A to 1D are perspective views illustrating a method of manufacturing an LCD device according to a related art liquid crystal application method;

FIGS. 2A and 2B are perspective views illustrating a process of forming a UV sealant using a related art dispensing method;

FIG. 2C is a perspective view illustrating a sealant formed by a related art dispensing method after attaching substrates to each other;

FIGS. 3A to 3D are perspective views illustrating a method of manufacturing an LCD device according to a first embodiment of the present invention;

FIGS. 4A to 4D are perspective views illustrating a process of forming a UV sealant in manufacturing an LCD device according to a second embodiment of the present invention of the present invention;

FIGS. 5A and 5B are perspective views illustrating a process of forming a UV sealant in a method of manufacturing an LCD device according to a third embodiment of the present invention of the present invention;

FIG. 6 is a perspective view illustrating an LCD device according to a fourth embodiment of the present invention; and

FIGS. 7A and 7B are sectional views taken along lines I-I and II-II of FIG. 6.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Reference will now be made in detail to the illustrated embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

FIGS. 3A to 3D are perspective views illustrating a method of manufacturing an LCD device according to the first embodiment of the present invention;

Although the drawings illustrate only one unit cell, a plurality of unit cells may be formed depending upon the size of the substrate.

As shown in FIG. 3A, a lower substrate 10 and an upper substrate 30 are prepared for the process. A plurality of gate and data lines (not shown) are formed on the lower substrate 10. The gate lines cross the data lines to define a pixel region. A thin film transistor (not shown) having a gate electrode, a gate insulating layer, a semiconductor layer, an ohmic contact layer, source/drain electrodes, and a protection layer is formed at each crossing point of the gate lines and the data lines. A pixel electrode (not shown) connected with the thin film transistor is formed in the pixel region.

An alignment film (not shown) is formed on the pixel electrode to initially align the molecules of liquid crystal. The alignment film may be formed of polyamide or polyimide based compound, polyvinylalcohol (PVA), and polyamic acid by rubbing. Alternatively, the alignment film may be formed of a photosensitive material, such as polyvinvylcinnamate (PVCN), polysilioxanecinnamate (PSCN) or cellulosecinnamate (CelCN) based compound, by using a photo-alignment method.

A light-shielding layer (not shown) is formed on the upper substrate 30 to shield light leakage from the gate lines, the data lines, and the thin film transistor regions. A color filter layer (not shown) of R, G, and B is formed on the light-shielding layer. A common electrode (not shown) is formed on the color filter layer. Additionally, an overcoat layer (not shown) may be formed between the color filter layer and the common electrode. The alignment film is formed on the common electrode.

Silver (Ag) dots are formed outside the lower substrate 10 to apply a voltage to the common electrode on the upper substrate 30 after the lower and upper substrates 10 and 30 are attached to each other. Alternatively, the silver dots may be formed on the upper substrate 30.

For an in plane switching (IPS) mode LCD, the common electrode is formed on the lower substrate like the pixel electrode, and so that an electric field can be horizontally induced between the common electrode and the pixel electrode. The silver dots are not formed on the substrate.

As shown in FIG. 3B, a liquid crystal 50 is applied onto the lower substrate 10 to form a liquid crystal layer.

An auxiliary UV curable sealant 70a is formed in a dummy area at a corner region of the upper substrate 30, subsequently, a main UV curable sealant 70b having no injection hole is formed, using a dispensing method.

The auxiliary UV sealant 70a is prevents any problem that may occur due to a sealant concentrated upon the end of a nozzle of a dispensing device. Therefore, it does not matter where the auxiliary UV sealant 70a is formed in the dummy area of the substrate, i.e., any blob of-sealant will be formed away from the active region of the liquid crystal display device and away from a region where the liquid crystal panel will be cut away from the mother substrate assembly. Formation of the main UV sealant 70b is preceded by the formation of the auxiliary UV sealant 70a. The auxiliary UV sealant 70a may be formed in a straight line as shown. Alternatively, the auxiliary UV sealant 70a may be formed in a curved line or other shape as long as it is formed in a dummy region.

Monomers or oligomers each having both ends coupled to the acrylic group, mixed with an initiator are used as the UV sealants 70a and 70b. Alternatively, monomers or oligomers each having one end coupled to the acrylic group and the other end coupled to the epoxy group, mixed with an initiator are used as the UV sealants 70a and 70b.

Also, the liquid crystal 50 may be contaminated if it comes into contact with the main UV sealant 70b before the main UV sealant 70b is hardened. Accordingly, the liquid crystal 50 may preferably be applied on the central part of the lower substrate 10. In this case, the liquid crystal 50 is gradually spread even after the main UV sealant 70b is hardened. Thus, the liquid crystal 50 is uniformly distributed on the substrate.

The liquid crystal 50 may be formed on the upper substrate 30 while the UV sealants 70a and 70b may be formed on the lower substrate 10. Alternatively, the liquid crystal 50 and the UV sealants 70a and 70b may be formed on one substrate. In this case, there is an imbalance between the processing times of the substrate with the liquid crystal and the sealants and the substrate without the liquid crystal and the sealants in the manufacturing process. For this reason, the total manufacturing process time increases. Also, when the liquid crystal and the sealants are formed on one substrate, the substrate may not be cleaned even if the sealant contaminates the panel before the substrates are attached to each other.

Accordingly, a cleaning process for cleaning the upper substrate 30 may additionally be provided before the attaching process after the UV sealants 70a and 70b are formed on the upper substrate 30.

Meanwhile, spacers may be formed on either of the two substrates 10 and 30 to maintain a cell gap. Preferably, the spacers may be formed on the upper substrate 30.

Ball spacers or column spacers may be used as the spacers. The ball spacers may be formed in such a manner that they are mixed with a solution having an appropriate concentration and then spread at a high pressure onto the substrate from a spray nozzle. The column spacers may be formed on portions of the substrate corresponding to the gate lines or data lines. Preferably, column spacers may be used for the large sized substrate since the ball spacers may cause an uneven cell gap for the large sized substrate. The column spacers may be formed of a photosensitive organic resin.

As shown in FIG. 3C, the lower substrate 10 and the upper substrate 30 are attached to each other by the following processes. First, one of the substrates having the liquid crystal dropped thereon is placed at the lower side. The other substrate is placed at the upper side by turning by 180 degrees so that its portion having layers faces into the substrate at the lower side. Thereafter, the substrate at the upper side is pressed, so that both substrates are attached to each other. Alternatively, the space between the substrates may be maintained under the vacuum state so that both substrates are attached to each other by releasing the vacuum state.

Then, as shown in FIG. 3D, UV light is irradiated upon the attached substrates through a UV irradiating device 90.

Upon irradiating the UV light, monomers or oligomers activated by an initiator constituting the UV sealants are polymerized and hardened, thereby bonding the lower substrate 10 to the upper substrate 30.

If monomers or oligomers each having one end coupled to the acrylic group and the other end coupled to the epoxy group, mixed with an initiator are used as the UV sealants, the epoxy group is not completely polymerized by the application of UV light. Therefore, the sealants may have to be additionally heated at about 120° C. for one hour after the UV irradiation, thereby hardening the sealants completely.

Afterwards, although not shown, the bonded substrates are cut into a unit cells and final test processes are performed.

In the cutting process, a scribing process is performed by forming a cutting line on surfaces of the substrates with a pen or wheel of a material having hardness greater than that of glass, such as diamond, and then the substrates are cut along the cutting line by mechanical impact (breaking process). Alternatively, the scribing process and the breaking process may simultaneously be performed using a pen or wheel of a diamond or other hard material.

The cutting line of the cutting process is formed between the start point of the auxiliary sealant, which may be a blob A of sealant, and a main UV sealant across the initially formed auxiliary UV sealant 70a. Consequently, a substantial portion of the excessively distributed auxiliary UV sealant 70a is removed.

FIGS. 4A to 4D are perspective views illustrating a process of irradiating UV light in the method of manufacturing an LCD device according to the second embodiment of the present invention. The second embodiment is similar to the first embodiment except for the UV irradiation process. In the second embodiment, a region where the sealants are not formed is covered with a mask before the UV light is irradiated. Since the other elements of the second embodiment are the same as those of the first embodiment, the same reference numerals will be given to the same elements and their detailed description will be omitted.

If the UV light is irradiated upon the entire surface of the attached substrates, the UV light may deteriorate characteristics of devices such as a thin film transistor on the substrate and may change a pre-tilt angle of an alignment film formed for the initial alignment of the liquid crystal.

Therefore, in the second embodiment of the present invention, the UV light is irradiated when the area where no sealant is formed is covered with a mask.

Referring to FIG. 4A, a region where the auxiliary UV sealant 70a and the main UV sealant 70b are formed is covered with a mask 80. The mask 80 is placed at an upper side of the attached substrates, and the UV light is irradiated.

Also, the mask 80 may be placed at a lower side of the attached substrates. Also, although the UV light is irradiated upon the upper substrate 30 of the attached substrates as shown, the UV light may be irradiated upon the lower substrate 10 by turning the attached substrates.

If the UV light from a UV irradiating device 90 is reflected and irradiated upon an opposite side, it may deteriorate characteristics of devices, such as the thin film transistor on the substrate and the alignment film, as described above. Therefore, masks are preferably formed at lower and upper sides of the attached substrates.

That is, as shown in FIG. 4B, masks 80 and 82 that cover the region where the sealants 70a and 70b are not formed are placed are at upper and lower sides of the attached substrates. The UV light is then irradiated thereupon.

Meanwhile, since the auxiliary UV sealant 70a does not act as a sealant, it does not require hardening. Also, since the region of the auxiliary UV sealant 70a overlaps the cell cutting line during the later cell cutting process, it is more desirable for the cell cutting process that the auxiliary UV sealant 70 is not hardened.

Referring to FIGS. 4C and 4D, the auxiliary UV sealant 70a is not hardened by irradiating the UV light when only the area where the main UV sealant 70b is not formed is covered with the mask, i.e., the auxiliary sealant 70a is also covered by a mask.

In this case, in FIG. 4C, the UV light is irradiated with the mask 80 in place at a lower or upper side of the attached substrates. In FIG. 4D, the UV light is irradiated when the mask 80 is respectively placed at lower and upper sides of the attached substrates.

FIGS. 5A and 5B are perspective views illustrating a process of forming a UV sealant in a method of manufacturing an LCD device according to the third embodiment of the present invention of the present invention.

The third embodiment is identical to the second embodiment except for the UV irradiation process. In the third embodiment, the UV light is irradiated at a tilt angle. Since the other elements of the third embodiment are identical to those of the second embodiment, the same reference numerals will be given to the same elements and their detailed description will be omitted.

If a light-shielding layer and a metal line such as gate and data lines are formed on a region where the UV sealant is formed, the UV light is not irradiated upon the region, thereby failing to harden the sealant. For this reason, adherence between the lower and upper substrates is reduced.

Therefore, in the third embodiment of the present invention, the UV light is irradiated at a tilt angle upon the substrate where the UV sealant is formed, so that the UV sealant is hardened even if the light-shielding layer or the metal line layer is formed between the UV irradiating surface and the sealant.

To irradiate the UV light at a tilt angle, as shown in FIG. 5A, the attached substrates are horizontally arranged and a UV irradiating device 90 is arranged at a tilt angle of θ. Alternatively, as shown in FIG. 5B, the attached substrates may be arranged at a tilt angle and the UV irradiating device 90 may horizontally be arranged.

Also, the UV light may be irradiated at a tilt angle when the area where the sealant is not formed is covered with the mask as shown in FIGS. 4A to 4D.

FIG. 6 is a perspective view illustrating an LCD device according to the fourth embodiment of the present invention, and FIGS. 7A and 7B are sectional views taken along lines I-I and II-II of FIG. 6.

As shown in FIGS. 6 and 7, an LCD device according to the present invention includes lower and upper substrates 10 and 30, a UV sealant between the lower and upper substrates 10 and 30, having an auxiliary UV sealant 70a in a dummy area and a perimeter of main UV sealant 70b connected to the auxiliary UV sealant 70a, and a liquid crystal layer 50 between the lower and upper substrates 10 and 30.

At this time, although not shown, a thin film transistor, a pixel electrode, and an alignment film are formed on the lower substrate 10. A black matrix layer (not shown), a color filter layer (not shown), a common electrode (not shown) and an alignment film (not shown) are formed on the upper substrate 30. Also, spacers are formed between the lower and upper substrates 10 and 30 to maintain a cell gap between the substrates.

As aforementioned, the LCD device and the method of manufacturing the same according to the present invention have the following advantages.

Since the sealant concentrated upon the end of the nozzle of the dispensing device is formed in the dummy area on the substrate, the liquid crystal layer is not contaminated by the attaching process of the substrates and the cell cutting process is easily performed.

Furthermore, if the UV light is irradiated upon the substrate when the mask is formed at the lower and/or upper side of the attached substrates, the UV light is irradiated upon only the region where the UV sealant is formed. In this case, the alignment film formed on the substrate is not damaged and the characteristics of the devices, such as the thin film transistor, are not deteriorated.

Finally, if the UV light is irradiated at a tilt angle, the sealant can be hardened even if the light-shielding layer or the metal line is formed on the sealant, thereby avoiding reducing adherence between the lower and upper substrates.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention. Thus, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

Claims (38)

What is claimed is:
1. A method of manufacturing a liquid crystal display (LCD) device comprising:
preparing a lower substrate and an upper substrate;
forming an auxiliary sealant and subsequently forming a main sealant on one of the lower and upper substrates, wherein the auxiliary sealant is formed in a dummy region and connects to the main sealant, and wherein the auxiliary sealant and the main sealant are contiguous;
applying a liquid crystal on one of the lower and upper substrates;
attaching the lower and upper substrates; and
curing at least the main sealant.
2. The method of claim 1, wherein the main sealant and the auxiliary sealant are at least partially curable by irradiating UV light and curing the main sealant includes irradiating UV light.
3. The method of claim 2 31, wherein curing the main sealant includes irradiating UV light, and the sealant is formed using oligomers each having both ends coupled to an acrylic group.
4. The method of claim 2 31, wherein curing the main sealant includes irradiating UV light, and the sealant is formed using monomers each having both ends coupled to an acrylic group.
5. The method of claim 2, wherein the sealant is formed using oligomers each having one end coupled to an acrylic group and the other end coupled to an epoxy group.
6. The method of claim 5, further comprising heating the sealant after irradiating the UV light.
7. The method of claim 2 31, wherein curing the main sealant includes irradiating UV light, and the sealant is formed using monomers each having one end coupled to an acrylic group and the other end coupled to an epoxy group.
8. The method of claim 7, further comprising heating the sealant after irradiating the UV light.
9. The method of claim 2, further comprising heating the sealant after irradiating the UV light.
10. The method of claim 2 31, wherein curing the main sealant includes irradiating UV light, and a region where the sealant is not formed is covered with a mask during the irradiating with UV light.
11. The method of claim 2, wherein a region where the main UV sealant is not formed is covered with a mask during the irradiating with UV light.
12. The method of claim 2 31, wherein curing the main sealant includes irradiating UV light, and the UV light is irradiated at a tilt angle with respect to the attached substrates.
13. The method of claim 2 31, wherein curing the main sealant includes irradiating UV light, the method further comprising:
providing a mask over a region where the main sealant is not formed before irradiating UV light such that the auxiliary sealant is not exposed to the UV light; and
cutting the attached substrates.
14. The method of claim 1 31, further comprising forming column spacers on the upper substrate.
15. The method of claim 1 31, wherein the main and auxiliary sealants are formed on the upper substrate and the liquid crystal is applied to the lower substrate.
16. The method of claim 1, further comprising cutting the attached substrates.
17. The method of claim 16, wherein the attached substrates are cut across a portion of the auxiliary sealant.
18. The method of claim 1 31, wherein the applying the liquid crystal includes dropping the liquid crystal onto the one of the upper and lower substrates.
19. The method of claim 18, wherein the liquid crystal is applied in a predetermined pattern onto the one of the upper and lower substrates.
20. The method of claim 1, wherein the auxiliary sealant contacts the main sealant.
21. A method of manufacturing a liquid crystal display (LCD) device comprising:
preparing a lower substrate and an upper substrate;
forming an auxiliary UV sealant and a main UV sealant on one of the lower and upper substrates, wherein the auxiliary UV sealant is formed in a dummy region and extends outside from the main UV sealant, wherein the auxiliary UV sealant contacts the main UV sealant;
applying a liquid crystal on one of the lower and upper substrates;
attaching the lower and upper substrates; and
irradiating UV light on the attached substrates.
22. The method of claim 21 23, wherein the UV light is irradiated at a tilt angle with respect to the attached substrates.
23. A method of manufacturing a liquid crystal display (LCD) device comprising:
preparing a lower substrate and an upper substrate;
forming an auxiliary UV sealant and a main UV sealant on one of the lower and upper substrates, wherein:
the main UV sealant has no injection hole;
the auxiliary UV sealant is formed in a dummy region and extends outside from the main UV sealant;
the auxiliary UV sealant includes a sealant blob at a sealant deposition starting point; and
the auxiliary UV sealant contacts the main UV sealant;
applying a liquid crystal on one of the lower and upper substrates;
attaching the lower and upper substrates; and
irradiating UV light on the attached substrates.
24. The method of claim 23, wherein the sealant blob is deposited completely outside of an area enclosed by the main UV sealant.
25. The method of claim 23, wherein the auxiliary UV sealant contacts the main UV sealant at a substantially 90-degree angle.
26. The method of claim 23, wherein the auxiliary UV sealant forms a substantially straight line between the sealant blob and the main UV sealant.
27. The method of claim 23, wherein the auxiliary UV sealant forms a curve between the sealant blob and the main UV sealant.
28. The method of claim 23, further comprising cutting the attached substrates across a portion of the auxiliary UV sealant between the sealant blob and the main UV sealant.
29. The method of claim 23, wherein the main UV sealant defines a completely enclosed active region on one of the lower and upper substrates.
30. The method of claim 23, wherein the auxiliary UV sealant is not connected to an injection hole.
31. A method of manufacturing a liquid crystal display (LCD) device comprising:
preparing a lower substrate and an upper substrate;
forming an auxiliary sealant that is at least partially curable by ultraviolet light and subsequently forming a main sealant that is at least partially curable by ultraviolet light on one of the lower and upper substrates, wherein:
the main sealant has no injection hole;
the auxiliary sealant is formed in a dummy region and connects to the main sealant;
the auxiliary sealant includes a sealant blob at a sealant deposition starting point; and
the auxiliary sealant and the main sealant are contiguous;
applying a liquid crystal on one of the lower and upper substrates;
attaching the lower and upper substrates; and
curing at least the main sealant.
32. The method of claim 31, wherein the sealant blob is deposited completely outside of an area enclosed by the main sealant.
33. The method of claim 31, wherein the auxiliary sealant connects to the main sealant at a substantially 90-degree angle.
34. The method of claim 31, wherein the auxiliary sealant forms a substantially straight line between the sealant blob and the main sealant.
35. The method of claim 31, wherein the auxiliary sealant forms a curve between the sealant blob and the main sealant.
36. The method of claim 31, further comprising cutting the attached substrates across a portion of the auxiliary sealant between the sealant blob and the main sealant.
37. The method of claim 31, wherein the main sealant defines a completely enclosed active region on one of the lower and upper substrates.
38. The method of claim 31, wherein the auxiliary sealant is not connected to an injection hole.
US13960713 2002-02-20 2013-08-06 Liquid crystal display device and method of manufacturing the same Active USRE46146E1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR2002-8900 2002-02-20
KR0208900 2002-02-20
US10184118 US7218374B2 (en) 2002-02-20 2002-06-28 Liquid crystal display device and method of manufacturing the same
US13960713 USRE46146E1 (en) 2002-02-20 2013-08-06 Liquid crystal display device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13960713 USRE46146E1 (en) 2002-02-20 2013-08-06 Liquid crystal display device and method of manufacturing the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10184118 Reissue US7218374B2 (en) 2002-02-20 2002-06-28 Liquid crystal display device and method of manufacturing the same

Publications (1)

Publication Number Publication Date
USRE46146E1 true USRE46146E1 (en) 2016-09-13

Family

ID=56881161

Family Applications (1)

Application Number Title Priority Date Filing Date
US13960713 Active USRE46146E1 (en) 2002-02-20 2013-08-06 Liquid crystal display device and method of manufacturing the same

Country Status (1)

Country Link
US (1) USRE46146E1 (en)

Citations (245)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165656A (en) 1974-12-04 1976-06-07 Shinshu Seiki Kk
US3978580A (en) 1973-06-28 1976-09-07 Hughes Aircraft Company Method of fabricating a liquid crystal display
US4094058A (en) 1976-07-23 1978-06-13 Omron Tateisi Electronics Co. Method of manufacture of liquid crystal displays
JPS5738414A (en) 1980-08-20 1982-03-03 Showa Denko Kk Spacer for display panel
JPS5788428A (en) 1980-11-20 1982-06-02 Ricoh Elemex Corp Manufacture of liquid crystal display body device
JPS5827126A (en) 1981-08-11 1983-02-17 Nec Corp Production of liquid crystal display panel
JPS5957221A (en) 1982-09-28 1984-04-02 Asahi Glass Co Ltd Production of display element
JPS59195222A (en) 1983-04-19 1984-11-06 Matsushita Electric Ind Co Ltd Manufacture of liquid-crystal panel
JPS60111221A (en) 1983-11-19 1985-06-17 Nippon Denso Co Ltd Method and device for charging liquid crystal
JPS60164723A (en) 1984-02-07 1985-08-27 Seiko Instr & Electronics Ltd Liquid crystal display device
JPS60217343A (en) 1984-04-13 1985-10-30 Matsushita Electric Ind Co Ltd Liquid crystal display device and its preparation
JPS617822A (en) 1984-06-22 1986-01-14 Canon Inc Production of liquid crystal element
JPS6155625A (en) 1984-08-24 1986-03-20 Nippon Denso Co Ltd Manufacture of liquid crystal element
JPS6254228A (en) 1985-07-15 1987-03-09 Semiconductor Energy Lab Co Ltd Manufacturing method for liquid crystal display
JPS6254225A (en) 1985-07-15 1987-03-09 Semiconductor Energy Lab Co Ltd Manufacturing method for liquid crystal display
US4653864A (en) 1986-02-26 1987-03-31 Ovonic Imaging Systems, Inc. Liquid crystal matrix display having improved spacers and method of making same
JPS6289025A (en) 1985-10-15 1987-04-23 Matsushita Electric Ind Co Ltd Liquid crystal display panel and its production
JPS6290622A (en) 1985-10-17 1987-04-25 Seiko Epson Corp Liquid crystal display device
US4691995A (en) 1985-07-15 1987-09-08 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal filling device
JPS62205319A (en) 1986-03-06 1987-09-09 Canon Inc Ferroelectric liquid crystal element
JPS63110425A (en) 1986-10-29 1988-05-14 Toppan Printing Co Ltd Cell for sealing liquid crystal
JPS63109413A (en) 1986-10-27 1988-05-14 Fujitsu Ltd Production of liquid crystal display
JPS63128315A (en) 1986-11-19 1988-05-31 Victor Co Of Japan Ltd Liquid crystal display element
US4775225A (en) 1985-05-16 1988-10-04 Canon Kabushiki Kaisha Liquid crystal device having pillar spacers with small base periphery width in direction perpendicular to orientation treatment
JPS63311233A (en) 1987-06-12 1988-12-20 Toyota Motor Corp Liquid crystal cell
JPH039549A (en) 1989-05-16 1991-01-17 Motorola Inc Compound integrated storage device
US5089358A (en) * 1988-11-05 1992-02-18 Brother Kogyo Kabushiki Kaisha Optical recording medium
JPH0536426A (en) 1991-07-31 1993-02-12 Mitsubishi Heavy Ind Ltd Solid electrolytic fuel cell
JPH0536425A (en) 1991-02-12 1993-02-12 Tokyo Electric Power Co Inc:The Alloy separator for solid electrolytic fuel cell and manufacture of the same
JPH05107533A (en) 1991-10-16 1993-04-30 Shinetsu Eng Kk Method and device for sticking glass substrate for liquid crystal display plate
JPH05127179A (en) 1991-11-01 1993-05-25 Ricoh Co Ltd Production of liquid crystal display element
JPH05154923A (en) 1991-12-06 1993-06-22 Hitachi Ltd Substrate assembling device
US5247377A (en) 1988-07-23 1993-09-21 Rohm Gmbh Chemische Fabrik Process for producing anisotropic liquid crystal layers on a substrate
JPH05265011A (en) 1992-03-19 1993-10-15 Seiko Instr Inc Production of liquid crystal display element
JPH05281557A (en) 1992-04-01 1993-10-29 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal panel
JPH05281562A (en) 1992-04-01 1993-10-29 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal panel
US5263888A (en) 1992-02-20 1993-11-23 Matsushita Electric Industrial Co., Ltd. Method of manufacture of liquid crystal display panel
JPH0618829A (en) 1992-06-30 1994-01-28 Shinetsu Eng Kk Laminating device for glass substrate for liquid crystal display board
JPH0651256A (en) 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd Device for discharging liquid crystal
JPH0664229A (en) 1992-08-24 1994-03-08 Toshiba Corp Optical printing head
US5307190A (en) * 1991-08-19 1994-04-26 Matsushita Electric Industrial Co., Ltd. Ferroelectric liquid crystal panel and method of manufacturing same
JPH06148657A (en) 1992-11-06 1994-05-27 Matsushita Electric Ind Co Ltd Method and device for manufacturing cell for liquid crystal display
JPH06160871A (en) 1992-11-26 1994-06-07 Matsushita Electric Ind Co Ltd Liquid crystal display panel and its production
JPH06194637A (en) 1992-12-24 1994-07-15 Shinetsu Eng Kk Method for sticking glass substrate for liquid crystal display plate
JPH06235925A (en) 1993-02-10 1994-08-23 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display element
JPH06265915A (en) 1993-03-12 1994-09-22 Matsushita Electric Ind Co Ltd Discharge device for filling liquid crystal
JPH06313870A (en) 1993-04-28 1994-11-08 Hitachi Ltd Substrate assembly device
US5379139A (en) 1986-08-20 1995-01-03 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal device and method for manufacturing same with spacers formed by photolithography
JPH0784268A (en) 1993-09-13 1995-03-31 Hitachi Ltd Method for plotting sealing material
US5406989A (en) 1993-10-12 1995-04-18 Ayumi Industry Co., Ltd. Method and dispenser for filling liquid crystal into LCD cell
US5410423A (en) * 1992-02-21 1995-04-25 Canon Kabushiki Kaisha Method of fabricating a liquid crystal panel using a dummy seal which is closed after hardening
JPH07128674A (en) 1993-11-05 1995-05-19 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH07181507A (en) 1993-12-21 1995-07-21 Canon Inc Liquid crystal display device and information transmission device having the liquid crystal display device
JPH07275771A (en) 1994-04-11 1995-10-24 Hitachi Techno Eng Co Ltd Coating applicator for paste
JPH07275770A (en) 1994-04-06 1995-10-24 Hitachi Techno Eng Co Ltd Paste applicator
US5499128A (en) 1993-03-15 1996-03-12 Kabushiki Kaisha Toshiba Liquid crystal display device with acrylic polymer spacers and method of manufacturing the same
JPH0876133A (en) 1994-09-02 1996-03-22 Shinetsu Eng Kk Surface plate structure in laminating device for glass substrate for liquid crystal display plate
JPH0895066A (en) 1994-09-27 1996-04-12 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal element and device thereof
US5507323A (en) 1993-10-12 1996-04-16 Fujitsu Limited Method and dispenser for filling liquid crystal into LCD cell
JPH08101395A (en) 1994-09-30 1996-04-16 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH08106101A (en) 1994-10-06 1996-04-23 Fujitsu Ltd Production of liquid crystal display panel
JPH08110504A (en) 1994-10-13 1996-04-30 Shinetsu Eng Kk Heater of glass substrate for liquid crystal display
US5517344A (en) * 1994-05-20 1996-05-14 Prime View Hk Limited System for protection of drive circuits formed on a substrate of a liquid crystal display
JPH08136937A (en) 1994-11-09 1996-05-31 Shinetsu Eng Kk Method for pressurizing and heating glass substrate for liquid crystal display plate and device therefor
JPH08171094A (en) 1994-12-19 1996-07-02 Nippon Soken Inc Liquid crystal injecting method and liquid crystal injecting device to liquid crystal display device
JPH08173874A (en) 1994-12-26 1996-07-09 Hitachi Techno Eng Co Ltd Paste coater
US5539545A (en) 1993-05-18 1996-07-23 Semiconductor Energy Laboratory Co., Ltd. Method of making LCD in which resin columns are cured and the liquid crystal is reoriented
JPH08190099A (en) 1995-01-11 1996-07-23 Fujitsu Ltd Production of liquid crystal display device and apparatus for producing liquid crystal display device
US5548429A (en) 1993-06-14 1996-08-20 Canon Kabushiki Kaisha Process for producing liquid crystal device whereby curing the sealant takes place after pre-baking the substrates
JPH08240807A (en) 1995-03-06 1996-09-17 Fujitsu Ltd Method for sealing liquid crystal display panel
JPH091026A (en) 1995-06-23 1997-01-07 Hitachi Techno Eng Co Ltd Paste coating machine
JPH095762A (en) 1995-06-20 1997-01-10 Matsushita Electric Ind Co Ltd Production of liquid crystal panel
JPH0915614A (en) 1995-06-30 1997-01-17 Matsushita Electric Ind Co Ltd Liquid crystal display element and its production
JPH0926578A (en) 1995-07-10 1997-01-28 Fujitsu Ltd Liquid crystal display panel and manufacture thereof
JPH0961829A (en) 1995-08-21 1997-03-07 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH0973075A (en) 1995-09-05 1997-03-18 Matsushita Electric Ind Co Ltd Production of liquid crystal display element and apparatus for producing liquid crystal display element
JPH0973096A (en) 1995-09-05 1997-03-18 Matsushita Electric Ind Co Ltd Production of liquid crystal display device
JPH0994500A (en) 1995-09-29 1997-04-08 Hitachi Ltd Paste applying machine
JPH09127528A (en) 1995-10-27 1997-05-16 Fujitsu Ltd Production of liquid crystal panel
US5642214A (en) 1991-07-19 1997-06-24 Sharp Kabushiki Kaisha Optical modulating element and electronic apparatus using it
JPH09230357A (en) 1996-02-22 1997-09-05 Canon Inc Production of liquid crystal panel and liquid crystal cell used for the same
US5677749A (en) * 1992-05-25 1997-10-14 Sharp Kabushiki Kaisha Method for producing an LCD having no spacers in the display area in which heating alleviates cell distortion or greater pressure is applied to the seal region
JPH09281511A (en) 1996-04-17 1997-10-31 Fujitsu Ltd Production of liquid crystal display panel
JPH09311340A (en) 1996-05-21 1997-12-02 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
US5724110A (en) * 1994-05-27 1998-03-03 Sharp Kabushiki Kaisha Liquid crystal panel and method for producing the same in which the seal section is formed from a mixture of liquid crystal and resin
US5742370A (en) 1996-09-12 1998-04-21 Korea Institute Of Science And Technology Fabrication method for liquid crystal alignment layer by magnetic field treatment
JPH10123538A (en) 1996-10-22 1998-05-15 Matsushita Electric Ind Co Ltd Production for liquid crystal display element
JPH10123537A (en) 1996-10-15 1998-05-15 Matsushita Electric Ind Co Ltd Liquid crystal display element and its production
US5757451A (en) 1995-09-08 1998-05-26 Kabushiki Kaisha Toshiba Liquid crystal display device spacers formed from stacked color layers
JPH10142616A (en) 1996-11-14 1998-05-29 Ayumi Kogyo Kk Liquid crystal injection method and liquid dispenser
US5771084A (en) * 1996-03-05 1998-06-23 Sharp Kabushiki Kaisha Liquid crystal display device and method for fabricating the same
JPH10177178A (en) 1996-12-17 1998-06-30 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH10174924A (en) 1996-12-17 1998-06-30 Hitachi Techno Eng Co Ltd Paste applying apparatus
JPH10221700A (en) 1997-02-10 1998-08-21 Fujitsu Ltd Liquid crystal display device manufacturing method
JPH10282512A (en) 1997-04-07 1998-10-23 Ayumi Kogyo Kk Method for injecting liquid crystal and dispenser used for the same
JPH10333159A (en) 1997-06-03 1998-12-18 Matsushita Electric Ind Co Ltd Liquid crystal display device
JPH10333157A (en) 1997-06-03 1998-12-18 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
US5852484A (en) 1994-09-26 1998-12-22 Matsushita Electric Industrial Co., Ltd. Liquid crystal display panel and method and device for manufacturing the same
US5861932A (en) 1997-03-31 1999-01-19 Denso Corporation Liquid crystal cell and its manufacturing method
JPH1114953A (en) 1997-06-20 1999-01-22 Matsushita Electric Ind Co Ltd Manufacture of multi-numbered liquid crystal display panel, and multi-numbered liquid crystal panel
JPH1138424A (en) 1997-07-23 1999-02-12 Fujitsu Ltd Liquid crystal display panel and its production
US5875922A (en) 1997-10-10 1999-03-02 Nordson Corporation Apparatus for dispensing an adhesive
JPH1164811A (en) 1997-08-21 1999-03-05 Matsushita Electric Ind Co Ltd Method and device for producing liquid crystal display element
JPH11109388A (en) 1997-10-03 1999-04-23 Hitachi Ltd Production of liquid crystal display device
US5898041A (en) 1995-03-01 1999-04-27 Matsushita Electric Industrial Co., Ltd. Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display
JPH11133438A (en) 1997-10-24 1999-05-21 Matsushita Electric Ind Co Ltd Liquid crystal display element and its production
JPH11142864A (en) 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
JPH11174477A (en) 1997-12-08 1999-07-02 Matsushita Electric Ind Co Ltd Production of liquid crystal display device
KR100211010B1 (en) 1994-12-15 1999-07-15 쓰지 하루오 Liquid crystal device and its fabrication method
JPH11212045A (en) 1998-01-26 1999-08-06 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal panel
US5946070A (en) * 1997-03-28 1999-08-31 Denso Corporation Liquid crystal cell having filling passage preventing turn-around flow of liquid crystal
US5952678A (en) 1995-01-23 1999-09-14 Mitsubishi Denki Kabushiki Kaisha SRAM cell with no PN junction between driver and load transistors and method of manufacturing the same
US5952676A (en) 1986-08-20 1999-09-14 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal device and method for manufacturing same with spacers formed by photolithography
JPH11248930A (en) 1998-03-06 1999-09-17 Matsushita Electric Ind Co Ltd Color filter substrate and manufacture thereof, and liquid crystal display element using same color filter substrate
US5956112A (en) 1995-10-02 1999-09-21 Sharp Kabushiki Kaisha Liquid crystal display device and method for manufacturing the same
JPH11264991A (en) 1998-01-13 1999-09-28 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display element
JPH11262712A (en) 1998-03-17 1999-09-28 Hitachi Techno Eng Co Ltd Paste application method and apparatus therefor
JPH11326922A (en) 1998-05-14 1999-11-26 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display panel
JPH11344714A (en) 1998-06-02 1999-12-14 Denso Corp Liquid crystal cell
US6001203A (en) 1995-03-01 1999-12-14 Matsushita Electric Industrial Co., Ltd. Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display
US6011609A (en) 1996-10-05 2000-01-04 Samsung Electronics Co., Ltd. Method of manufacturing LCD by dropping liquid crystals on a substrate and then pressing the substrates
JP2000002879A (en) 1998-06-12 2000-01-07 Matsushita Electric Ind Co Ltd Device for assembling liquid crystal panel and its method
US6016181A (en) 1996-11-07 2000-01-18 Sharp Kabushiki Kaisha Liquid crystal device having column spacers with portion on each of the spacers for reflecting or absorbing visible light and method for fabricating the same
US6016178A (en) 1996-09-13 2000-01-18 Sony Corporation Reflective guest-host liquid-crystal display device
JP2000029035A (en) 1998-07-09 2000-01-28 Minolta Co Ltd Liquid crystal element and its manufacture
JP2000056311A (en) 1998-08-03 2000-02-25 Matsushita Electric Ind Co Ltd Liquid crystal display device
JP2000066218A (en) 1998-08-21 2000-03-03 Shinetsu Engineering Kk Liquid crystal panel production apparatus
JP2000066165A (en) 1998-08-20 2000-03-03 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display panel
JP2000093866A (en) 1998-09-18 2000-04-04 Hitachi Techno Eng Co Ltd Method and device for paste coating
US6055035A (en) 1998-05-11 2000-04-25 International Business Machines Corporation Method and apparatus for filling liquid crystal display (LCD) panels
JP2000137235A (en) 1998-11-02 2000-05-16 Matsushita Electric Ind Co Ltd Sticking method of liquid crystal substrate
EP1003066A1 (en) 1998-11-16 2000-05-24 Matsushita Electric Industrial Co., Ltd. Method of manufacturing liquid crystal display devices
KR20000035302A (en) 1998-11-09 2000-06-26 마츠시타 덴끼 산교 가부시키가이샤 Manufacturing method and apparatus of liquid crystal display
JP2000193988A (en) 1998-12-25 2000-07-14 Fujitsu Ltd Production of liquid crystal display panel and apparatus for production
JP2000241824A (en) 1999-02-18 2000-09-08 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
JP2000284295A (en) 1999-03-30 2000-10-13 Hitachi Techno Eng Co Ltd Method and apparatus for assembling substrate
JP2000292799A (en) 1999-04-09 2000-10-20 Matsushita Electric Ind Co Ltd Liquid crystal display device and its production
US6137559A (en) * 1997-10-30 2000-10-24 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a liquid crystal display device using an airtight seal pattern
JP2000310759A (en) 1999-04-28 2000-11-07 Matsushita Electric Ind Co Ltd Device for manufacturing liquid crystal display element and its method
JP2000310784A (en) 1999-02-22 2000-11-07 Matsushita Electric Ind Co Ltd Liquid crystal panel, color filter and their production
JP2000338501A (en) 1999-05-26 2000-12-08 Matsushita Electric Ind Co Ltd Production of liquid crystal display panel
US6163357A (en) 1996-09-26 2000-12-19 Kabushiki Kaisha Toshiba Liquid crystal display device having the driving circuit disposed in the seal area, with different spacer density in driving circuit area than display area
JP2001005405A (en) 1999-06-18 2001-01-12 Hitachi Techno Eng Co Ltd Method for assembling substrate and apparatus therefor
JP2001005401A (en) 1999-06-21 2001-01-12 Hitachi Techno Eng Co Ltd Method for assembling substrates and device therefor
JP2001013506A (en) 1999-04-30 2001-01-19 Matsushita Electric Ind Co Ltd Liquid crystal display element and its manufacture
US6177976B1 (en) * 1996-05-01 2001-01-23 Nec Corporation Liquid crystal display
JP2001033793A (en) 1999-07-21 2001-02-09 Matsushita Electric Ind Co Ltd Liquid crystal display panel and manufacturing method therefor
JP2001042341A (en) 1999-08-03 2001-02-16 Hitachi Techno Eng Co Ltd Method for assembling liquid crystal substrate
JP2001051284A (en) 1999-08-10 2001-02-23 Matsushita Electric Ind Co Ltd Device for manufacturing liquid crystal display device
JP2001066615A (en) 2000-08-02 2001-03-16 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
JP2001091727A (en) 1999-09-27 2001-04-06 Matsushita Electric Ind Co Ltd Production method of color filter substrate, color filter substrate and liquid crystal display device
US6219126B1 (en) * 1998-11-20 2001-04-17 International Business Machines Corporation Panel assembly for liquid crystal displays having a barrier fillet and an adhesive fillet in the periphery
JP2001117105A (en) 1999-10-18 2001-04-27 Toshiba Corp Method of manufacturing for liquid crystal display device
JP2001117109A (en) 1999-10-21 2001-04-27 Matsushita Electric Ind Co Ltd Method of manufacturing for liquid crystal display device
US6226067B1 (en) 1997-10-03 2001-05-01 Minolta Co., Ltd. Liquid crystal device having spacers and manufacturing method thereof
JP2001133745A (en) 1999-11-08 2001-05-18 Hitachi Techno Eng Co Ltd Method of assembling substrate and device therefor
JP2001133794A (en) 1999-11-01 2001-05-18 Kyoritsu Kagaku Sangyo Kk Sealing agent for dropping process of lcd panel
US6236445B1 (en) 1996-02-22 2001-05-22 Hughes Electronics Corporation Method for making topographic projections
JP2001142074A (en) 1999-11-10 2001-05-25 Hitachi Ltd Liquid crystal display device
US6239855B1 (en) * 1997-08-25 2001-05-29 Sharp Kabushiki Kaisha Method for producing a liquid crystal display panel having dummy seal particles arranged in at least two arrays
JP2001147437A (en) 1999-11-19 2001-05-29 Nec Corp Liquid crystal display panel and method of producing the same
JP2001154211A (en) 1999-11-30 2001-06-08 Hitachi Ltd Liquid crystal panel and its manufacturing method
JP2001166272A (en) 1999-12-09 2001-06-22 Hitachi Techno Eng Co Ltd Method and device for assembling substrate
JP2001166310A (en) 1999-12-08 2001-06-22 Matsushita Electric Ind Co Ltd Method of producing liquid crystal display panel
JP2001183683A (en) 1999-10-05 2001-07-06 Matsushita Electric Ind Co Ltd Liquid crystal panel, its manufacturing and driving method
JP2001201750A (en) 2000-01-14 2001-07-27 Fujitsu Ltd Liquid crystal display device and method of producing the same
JP2001209057A (en) 2000-01-26 2001-08-03 Shinetsu Engineering Kk Device for manufacturing liquid crystal panel
JP2001209058A (en) 2000-01-26 2001-08-03 Shinetsu Engineering Kk Device for manufacturing liquid crystal panel
JP2001209056A (en) 2000-01-25 2001-08-03 Shinetsu Engineering Kk Device for production of liquid crystal panel
JP2001209060A (en) 2000-12-11 2001-08-03 Fujitsu Ltd Method of producing liquid crystal display panel
JP2001209052A (en) 2000-01-24 2001-08-03 Matsushita Electric Ind Co Ltd Liquid crystal display device and its manufacturing method
JP2001215459A (en) 2000-02-02 2001-08-10 Matsushita Electric Ind Co Ltd Divice for manufacturing liquid crystal display element
JP2001222017A (en) 1999-05-24 2001-08-17 Fujitsu Ltd Liquid crystal display device and its manufacturing method
JP2001235758A (en) 2000-02-23 2001-08-31 Fujitsu Ltd Liquid crystal display panel and its manufacturing method
JP2001255542A (en) 2000-03-14 2001-09-21 Sharp Corp Method and device for laminating substrate and method and device for manufacturing liquid crystal display device
JP2001264782A (en) 2000-03-16 2001-09-26 Ayumi Kogyo Kk Method of filling gap of flat panel substrate with viscous liquid material
US20010026348A1 (en) 2000-03-29 2001-10-04 Fujitsu Limited Method for manufacturing liquid crystal display
JP2001272640A (en) 2000-03-27 2001-10-05 Fujitsu Ltd Liquid crystal dropping device and liquid crystal dropping method
JP2001281675A (en) 2000-03-29 2001-10-10 Matsushita Electric Ind Co Ltd Production method for liquid crystal display device
JP2001282126A (en) 2000-03-30 2001-10-12 Hitachi Techno Eng Co Ltd Substrate assembling device
US6304306B1 (en) 1995-02-17 2001-10-16 Sharp Kabushiki Kaisha Liquid crystal display device and method for producing the same
JP2001305563A (en) 2000-04-19 2001-10-31 Hitachi Techno Eng Co Ltd Substrate sticking device
JP2001330840A (en) 2000-05-18 2001-11-30 Toshiba Corp Method for manufacturing liquid crystal display element
JP2001330837A (en) 2000-05-19 2001-11-30 Matsushita Electric Ind Co Ltd Hermetic structural, its manufacturing method, liquid crystal display device using the same and its manufacturing method
JP2001356353A (en) 2001-04-24 2001-12-26 Hitachi Industries Co Ltd Assembly device for substrate
JP2001356354A (en) 2000-06-13 2001-12-26 Matsushita Electric Ind Co Ltd Method for manufacturing liquid crystal display device
US6337730B1 (en) 1998-06-02 2002-01-08 Denso Corporation Non-uniformly-rigid barrier wall spacers used to correct problems caused by thermal contraction of smectic liquid crystal material
JP2002014360A (en) 2000-06-29 2002-01-18 Matsushita Electric Ind Co Ltd Method and device for manufacturing liquid crystal panel
JP2002023176A (en) 2000-07-05 2002-01-23 Seiko Epson Corp Liquid crystal filling system and method for filling liquid crystal
JP2002049045A (en) 2000-08-03 2002-02-15 Nec Corp Method for manufacturing liquid crystal display panel
JP2002080321A (en) 2000-06-20 2002-03-19 Kyowa Hakko Kogyo Co Ltd Cosmetic
JP2002079160A (en) 2000-09-04 2002-03-19 Hitachi Industries Co Ltd Paste coater
JP2002082340A (en) 2000-09-08 2002-03-22 Fuji Xerox Co Ltd Method for manufacturing flat panel display
JP2002090760A (en) 2000-09-12 2002-03-27 Matsushita Electric Ind Co Ltd Apparatus and method for manufacturing liquid crystal display panel
JP2002090759A (en) 2000-09-18 2002-03-27 Sharp Corp Apparatus and method for manufacturing liquid crystal display element
JP2002107740A (en) 2000-09-28 2002-04-10 Sharp Corp Method and device for manufacturing liquid crystal display panel
US6373544B1 (en) * 1997-06-17 2002-04-16 Seiko Epson Corporation Electro-optical device substrate, electro-optical device, electronic device, and projection display device
JP2002122873A (en) 2000-10-13 2002-04-26 Stanley Electric Co Ltd Method of manufacturing liquid crystal display device
JP2002122872A (en) 2000-10-12 2002-04-26 Hitachi Ltd Liquid crystal display device and method of manufacturing the same
JP2002122870A (en) 2000-10-13 2002-04-26 Fujitsu Ltd Liquid crystal display device, method of manufacturing the same and device for dropping liquid crystal
JP2002131762A (en) 2000-10-30 2002-05-09 Shinetsu Engineering Kk Lamination device and method for laminating substrate for liquid crystal panel
JP2002139734A (en) 2000-10-31 2002-05-17 Fujitsu Ltd Manufacturing method and manufacturing device of liquid crystal display device
JP2002156518A (en) 2000-11-16 2002-05-31 Matsushita Electric Ind Co Ltd Method for manufacturing color filter substrate
JP2002169166A (en) 2000-12-05 2002-06-14 Matsushita Electric Ind Co Ltd Liquid crystal display, method for manufacturing the same and equipment applying image display
JP2002169167A (en) 2000-12-05 2002-06-14 Matsushita Electric Ind Co Ltd Liquid crystal display, method for manufacturing the same and equipment applying image display
JP2002182222A (en) 2000-12-19 2002-06-26 Matsushita Electric Ind Co Ltd Method for manufacturing liquid crystal panel
US6414733B1 (en) 1999-02-08 2002-07-02 Dai Nippon Printing Co., Ltd. Color liquid crystal display with a shielding member being arranged between sealing member and display zone
JP2002202514A (en) 2000-12-28 2002-07-19 Matsushita Electric Ind Co Ltd Liquid crystal panel, and method and manufacturing apparatus for manufacturing the same
JP2002202512A (en) 2000-12-28 2002-07-19 Toshiba Corp Liquid crystal display device and method of manufacturing for the same
JP2002214626A (en) 2001-01-17 2002-07-31 Toshiba Corp Manufacturing method and sealing material for liquid crystal display
JP2002229042A (en) 2001-02-06 2002-08-14 Hitachi Industries Co Ltd Substrate-bonding device
JP2002236276A (en) 2001-02-08 2002-08-23 Hitachi Industries Co Ltd Method and apparatus for assembling substrate
JP2002236292A (en) 2001-02-09 2002-08-23 Matsushita Electric Ind Co Ltd Manufacturing method for liquid crystal panel and substrate sticking device
JP2002258299A (en) 2001-02-28 2002-09-11 Matsushita Electric Ind Co Ltd Liquid crystal display manufacturing method, manufacturing device and liquid crystal display
JP2002277865A (en) 2001-03-21 2002-09-25 Matsushita Electric Ind Co Ltd Liquid crystal display and its manufacturing method
JP2002277881A (en) 2001-03-16 2002-09-25 Matsushita Electric Ind Co Ltd Liquid crystal panel and its manufacturing method
JP2002277866A (en) 2001-03-21 2002-09-25 Matsushita Electric Ind Co Ltd Method for manufacturing liquid crystal panel
JP2002287156A (en) 2001-03-26 2002-10-03 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing liquid crystal panel
JP2002296605A (en) 2001-03-30 2002-10-09 Matsushita Electric Ind Co Ltd Method of laminating liquid crystal substrates
JP2002311442A (en) 2001-04-17 2002-10-23 Hitachi Industries Co Ltd Method for assembling liquid crystal substrate, its assembling device and liquid crystal supplying device
JP2002311440A (en) 2001-04-17 2002-10-23 Hitachi Industries Co Ltd Substrate sticking method and its device
JP2002311438A (en) 2001-04-13 2002-10-23 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing liquid crystal display element
US6473148B1 (en) * 2000-11-28 2002-10-29 Yafo Networks, Inc. Seal pattern for liquid crystal device
JP2002323694A (en) 2001-04-24 2002-11-08 Hitachi Industries Co Ltd Substrate laminating method and laminating device
JP2002323687A (en) 2001-04-25 2002-11-08 Hitachi Industries Co Ltd Method and device for assembling liquid crystal substrate
JP2002333635A (en) 2001-05-07 2002-11-22 Matsushita Electric Ind Co Ltd Liquid crystal display device, manufacturing method therefor and manufacturing device for liquid crystal display device
JP2002333628A (en) 2001-05-07 2002-11-22 Matsushita Electric Ind Co Ltd Liquid crystal display, color filter substrate, and array substrate
JP2002333843A (en) 2001-05-10 2002-11-22 Matsushita Electric Ind Co Ltd Method of bonding substrate and device for the same
JP2002341357A (en) 2001-05-14 2002-11-27 Matsushita Electric Ind Co Ltd Manufacturing method and manufacturing apparatus for liquid crystal display device
JP2002341329A (en) 2001-05-21 2002-11-27 Matsushita Electric Ind Co Ltd Liquid crystal display device
JP2002341359A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Method and device for manufacturing liquid crystal display element
JP2002341362A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Method of manufacturing liquid crystal display panel and apparatus for manufacturing liquid crystal panel
JP2002341356A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Gap forming method for liquid crystal display panel and apparatus for the same
JP2002341355A (en) 2001-05-16 2002-11-27 Matsushita Electric Ind Co Ltd Method of manufacturing liquid crystal display device and array substrate as well as liquid crystal display device
JP2002341358A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Manufacturing method for liquid crystal display panel
US6542215B2 (en) * 1999-12-29 2003-04-01 Lg. Philips Lcd, Co., Ltd. Method of forming a seal pattern for liquid crystal display device
US6573968B2 (en) * 1999-12-16 2003-06-03 Lg. Philips Lcd Co., Ltd. Seal pattern for liquid crystal display device and related method
JP2003222883A (en) 2002-01-31 2003-08-08 Toshiba Corp Method for manufacturing liquid crystal display element, and liquid crystal display element
US6628365B1 (en) * 2002-03-23 2003-09-30 Lg.Philips Lcd Co., Ltd. LCD with UV shielding part at dummy sealant region
US6778249B1 (en) * 1999-07-23 2004-08-17 Nec Lcd Technologies, Ltd. Liquid-crystal display element and method for manufacturing same
JP2001133799A5 (en) 2004-11-04
US6844910B2 (en) * 1999-12-28 2005-01-18 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and manufacturing method thereof
US7218374B2 (en) * 2002-02-20 2007-05-15 Lg.Philips Lcd Co., Ltd. Liquid crystal display device and method of manufacturing the same
US7362409B2 (en) * 2000-04-04 2008-04-22 Mitsubishi Electric Corporation Liquid crystal display device and method for manufacturing the same
JP2011083675A (en) 2009-10-14 2011-04-28 Panasonic Corp Dehumidifier

Patent Citations (256)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133799A5 (en) 2004-11-04
US3978580A (en) 1973-06-28 1976-09-07 Hughes Aircraft Company Method of fabricating a liquid crystal display
JPS5165656A (en) 1974-12-04 1976-06-07 Shinshu Seiki Kk
US4094058A (en) 1976-07-23 1978-06-13 Omron Tateisi Electronics Co. Method of manufacture of liquid crystal displays
JPS5738414A (en) 1980-08-20 1982-03-03 Showa Denko Kk Spacer for display panel
JPS5788428A (en) 1980-11-20 1982-06-02 Ricoh Elemex Corp Manufacture of liquid crystal display body device
JPS5827126A (en) 1981-08-11 1983-02-17 Nec Corp Production of liquid crystal display panel
JPS5957221A (en) 1982-09-28 1984-04-02 Asahi Glass Co Ltd Production of display element
JPS59195222A (en) 1983-04-19 1984-11-06 Matsushita Electric Ind Co Ltd Manufacture of liquid-crystal panel
JPS60111221A (en) 1983-11-19 1985-06-17 Nippon Denso Co Ltd Method and device for charging liquid crystal
JPS60164723A (en) 1984-02-07 1985-08-27 Seiko Instr & Electronics Ltd Liquid crystal display device
JPS60217343A (en) 1984-04-13 1985-10-30 Matsushita Electric Ind Co Ltd Liquid crystal display device and its preparation
JPS617822A (en) 1984-06-22 1986-01-14 Canon Inc Production of liquid crystal element
JPS6155625A (en) 1984-08-24 1986-03-20 Nippon Denso Co Ltd Manufacture of liquid crystal element
US4775225A (en) 1985-05-16 1988-10-04 Canon Kabushiki Kaisha Liquid crystal device having pillar spacers with small base periphery width in direction perpendicular to orientation treatment
JPS6254228A (en) 1985-07-15 1987-03-09 Semiconductor Energy Lab Co Ltd Manufacturing method for liquid crystal display
JPS6254225A (en) 1985-07-15 1987-03-09 Semiconductor Energy Lab Co Ltd Manufacturing method for liquid crystal display
US4691995A (en) 1985-07-15 1987-09-08 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal filling device
JPS6289025A (en) 1985-10-15 1987-04-23 Matsushita Electric Ind Co Ltd Liquid crystal display panel and its production
JPS6290622A (en) 1985-10-17 1987-04-25 Seiko Epson Corp Liquid crystal display device
US4653864A (en) 1986-02-26 1987-03-31 Ovonic Imaging Systems, Inc. Liquid crystal matrix display having improved spacers and method of making same
JPS62205319A (en) 1986-03-06 1987-09-09 Canon Inc Ferroelectric liquid crystal element
US5952676A (en) 1986-08-20 1999-09-14 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal device and method for manufacturing same with spacers formed by photolithography
US5379139A (en) 1986-08-20 1995-01-03 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal device and method for manufacturing same with spacers formed by photolithography
JPS63109413A (en) 1986-10-27 1988-05-14 Fujitsu Ltd Production of liquid crystal display
JPS63110425A (en) 1986-10-29 1988-05-14 Toppan Printing Co Ltd Cell for sealing liquid crystal
JPS63128315A (en) 1986-11-19 1988-05-31 Victor Co Of Japan Ltd Liquid crystal display element
JPS63311233A (en) 1987-06-12 1988-12-20 Toyota Motor Corp Liquid crystal cell
US5247377A (en) 1988-07-23 1993-09-21 Rohm Gmbh Chemische Fabrik Process for producing anisotropic liquid crystal layers on a substrate
US5089358A (en) * 1988-11-05 1992-02-18 Brother Kogyo Kabushiki Kaisha Optical recording medium
JPH039549A (en) 1989-05-16 1991-01-17 Motorola Inc Compound integrated storage device
JPH0536425A (en) 1991-02-12 1993-02-12 Tokyo Electric Power Co Inc:The Alloy separator for solid electrolytic fuel cell and manufacture of the same
US5642214A (en) 1991-07-19 1997-06-24 Sharp Kabushiki Kaisha Optical modulating element and electronic apparatus using it
JPH0536426A (en) 1991-07-31 1993-02-12 Mitsubishi Heavy Ind Ltd Solid electrolytic fuel cell
US5307190A (en) * 1991-08-19 1994-04-26 Matsushita Electric Industrial Co., Ltd. Ferroelectric liquid crystal panel and method of manufacturing same
JPH05107533A (en) 1991-10-16 1993-04-30 Shinetsu Eng Kk Method and device for sticking glass substrate for liquid crystal display plate
JPH05127179A (en) 1991-11-01 1993-05-25 Ricoh Co Ltd Production of liquid crystal display element
JPH05154923A (en) 1991-12-06 1993-06-22 Hitachi Ltd Substrate assembling device
US5263888A (en) 1992-02-20 1993-11-23 Matsushita Electric Industrial Co., Ltd. Method of manufacture of liquid crystal display panel
US5410423A (en) * 1992-02-21 1995-04-25 Canon Kabushiki Kaisha Method of fabricating a liquid crystal panel using a dummy seal which is closed after hardening
JPH05265011A (en) 1992-03-19 1993-10-15 Seiko Instr Inc Production of liquid crystal display element
JPH05281557A (en) 1992-04-01 1993-10-29 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal panel
JPH05281562A (en) 1992-04-01 1993-10-29 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal panel
US5511591A (en) 1992-04-13 1996-04-30 Fujitsu Limited Method and dispenser for filling liquid crystal into LCD cell
US5677749A (en) * 1992-05-25 1997-10-14 Sharp Kabushiki Kaisha Method for producing an LCD having no spacers in the display area in which heating alleviates cell distortion or greater pressure is applied to the seal region
JPH0618829A (en) 1992-06-30 1994-01-28 Shinetsu Eng Kk Laminating device for glass substrate for liquid crystal display board
JPH0651256A (en) 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd Device for discharging liquid crystal
JPH0664229A (en) 1992-08-24 1994-03-08 Toshiba Corp Optical printing head
JPH06148657A (en) 1992-11-06 1994-05-27 Matsushita Electric Ind Co Ltd Method and device for manufacturing cell for liquid crystal display
JPH06160871A (en) 1992-11-26 1994-06-07 Matsushita Electric Ind Co Ltd Liquid crystal display panel and its production
JPH06194637A (en) 1992-12-24 1994-07-15 Shinetsu Eng Kk Method for sticking glass substrate for liquid crystal display plate
JPH06235925A (en) 1993-02-10 1994-08-23 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display element
JPH06265915A (en) 1993-03-12 1994-09-22 Matsushita Electric Ind Co Ltd Discharge device for filling liquid crystal
US5499128A (en) 1993-03-15 1996-03-12 Kabushiki Kaisha Toshiba Liquid crystal display device with acrylic polymer spacers and method of manufacturing the same
JPH06313870A (en) 1993-04-28 1994-11-08 Hitachi Ltd Substrate assembly device
US5539545A (en) 1993-05-18 1996-07-23 Semiconductor Energy Laboratory Co., Ltd. Method of making LCD in which resin columns are cured and the liquid crystal is reoriented
US5680189A (en) 1993-05-18 1997-10-21 Semiconductor Energy Laboratory Co., Ltd. LCD columnar spacers made of a hydrophilic resin and LCD orientation film having a certain surface tension or alignment capability
US5548429A (en) 1993-06-14 1996-08-20 Canon Kabushiki Kaisha Process for producing liquid crystal device whereby curing the sealant takes place after pre-baking the substrates
JPH0784268A (en) 1993-09-13 1995-03-31 Hitachi Ltd Method for plotting sealing material
US5507323A (en) 1993-10-12 1996-04-16 Fujitsu Limited Method and dispenser for filling liquid crystal into LCD cell
US5406989A (en) 1993-10-12 1995-04-18 Ayumi Industry Co., Ltd. Method and dispenser for filling liquid crystal into LCD cell
JPH07128674A (en) 1993-11-05 1995-05-19 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH07181507A (en) 1993-12-21 1995-07-21 Canon Inc Liquid crystal display device and information transmission device having the liquid crystal display device
JPH07275770A (en) 1994-04-06 1995-10-24 Hitachi Techno Eng Co Ltd Paste applicator
JPH07275771A (en) 1994-04-11 1995-10-24 Hitachi Techno Eng Co Ltd Coating applicator for paste
US5517344A (en) * 1994-05-20 1996-05-14 Prime View Hk Limited System for protection of drive circuits formed on a substrate of a liquid crystal display
US5724110A (en) * 1994-05-27 1998-03-03 Sharp Kabushiki Kaisha Liquid crystal panel and method for producing the same in which the seal section is formed from a mixture of liquid crystal and resin
JPH0876133A (en) 1994-09-02 1996-03-22 Shinetsu Eng Kk Surface plate structure in laminating device for glass substrate for liquid crystal display plate
US5852484A (en) 1994-09-26 1998-12-22 Matsushita Electric Industrial Co., Ltd. Liquid crystal display panel and method and device for manufacturing the same
US5854664A (en) 1994-09-26 1998-12-29 Matsushita Electric Industrial Co., Ltd. Liquid crystal display panel and method and device for manufacturing the same
JPH0895066A (en) 1994-09-27 1996-04-12 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal element and device thereof
JPH08101395A (en) 1994-09-30 1996-04-16 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH08106101A (en) 1994-10-06 1996-04-23 Fujitsu Ltd Production of liquid crystal display panel
JPH08110504A (en) 1994-10-13 1996-04-30 Shinetsu Eng Kk Heater of glass substrate for liquid crystal display
JPH08136937A (en) 1994-11-09 1996-05-31 Shinetsu Eng Kk Method for pressurizing and heating glass substrate for liquid crystal display plate and device therefor
KR100211010B1 (en) 1994-12-15 1999-07-15 쓰지 하루오 Liquid crystal device and its fabrication method
JPH08171094A (en) 1994-12-19 1996-07-02 Nippon Soken Inc Liquid crystal injecting method and liquid crystal injecting device to liquid crystal display device
JPH08173874A (en) 1994-12-26 1996-07-09 Hitachi Techno Eng Co Ltd Paste coater
JPH08190099A (en) 1995-01-11 1996-07-23 Fujitsu Ltd Production of liquid crystal display device and apparatus for producing liquid crystal display device
US5952678A (en) 1995-01-23 1999-09-14 Mitsubishi Denki Kabushiki Kaisha SRAM cell with no PN junction between driver and load transistors and method of manufacturing the same
US6304306B1 (en) 1995-02-17 2001-10-16 Sharp Kabushiki Kaisha Liquid crystal display device and method for producing the same
KR100232905B1 (en) 1995-03-01 1999-12-01 모리시타 요이찌 The manufacturing method of lcd panel and liquid crystal seal and lcd device
US5898041A (en) 1995-03-01 1999-04-27 Matsushita Electric Industrial Co., Ltd. Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display
US6001203A (en) 1995-03-01 1999-12-14 Matsushita Electric Industrial Co., Ltd. Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display
JPH08240807A (en) 1995-03-06 1996-09-17 Fujitsu Ltd Method for sealing liquid crystal display panel
JPH095762A (en) 1995-06-20 1997-01-10 Matsushita Electric Ind Co Ltd Production of liquid crystal panel
JPH091026A (en) 1995-06-23 1997-01-07 Hitachi Techno Eng Co Ltd Paste coating machine
JPH0915614A (en) 1995-06-30 1997-01-17 Matsushita Electric Ind Co Ltd Liquid crystal display element and its production
JPH0926578A (en) 1995-07-10 1997-01-28 Fujitsu Ltd Liquid crystal display panel and manufacture thereof
JPH0961829A (en) 1995-08-21 1997-03-07 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH0973096A (en) 1995-09-05 1997-03-18 Matsushita Electric Ind Co Ltd Production of liquid crystal display device
JPH0973075A (en) 1995-09-05 1997-03-18 Matsushita Electric Ind Co Ltd Production of liquid crystal display element and apparatus for producing liquid crystal display element
US5757451A (en) 1995-09-08 1998-05-26 Kabushiki Kaisha Toshiba Liquid crystal display device spacers formed from stacked color layers
JPH0994500A (en) 1995-09-29 1997-04-08 Hitachi Ltd Paste applying machine
US5956112A (en) 1995-10-02 1999-09-21 Sharp Kabushiki Kaisha Liquid crystal display device and method for manufacturing the same
JPH09127528A (en) 1995-10-27 1997-05-16 Fujitsu Ltd Production of liquid crystal panel
JPH09230357A (en) 1996-02-22 1997-09-05 Canon Inc Production of liquid crystal panel and liquid crystal cell used for the same
US6236445B1 (en) 1996-02-22 2001-05-22 Hughes Electronics Corporation Method for making topographic projections
US5771084A (en) * 1996-03-05 1998-06-23 Sharp Kabushiki Kaisha Liquid crystal display device and method for fabricating the same
JPH09281511A (en) 1996-04-17 1997-10-31 Fujitsu Ltd Production of liquid crystal display panel
US6177976B1 (en) * 1996-05-01 2001-01-23 Nec Corporation Liquid crystal display
JPH09311340A (en) 1996-05-21 1997-12-02 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
US5742370A (en) 1996-09-12 1998-04-21 Korea Institute Of Science And Technology Fabrication method for liquid crystal alignment layer by magnetic field treatment
US6016178A (en) 1996-09-13 2000-01-18 Sony Corporation Reflective guest-host liquid-crystal display device
US6163357A (en) 1996-09-26 2000-12-19 Kabushiki Kaisha Toshiba Liquid crystal display device having the driving circuit disposed in the seal area, with different spacer density in driving circuit area than display area
US6011609A (en) 1996-10-05 2000-01-04 Samsung Electronics Co., Ltd. Method of manufacturing LCD by dropping liquid crystals on a substrate and then pressing the substrates
JPH10123537A (en) 1996-10-15 1998-05-15 Matsushita Electric Ind Co Ltd Liquid crystal display element and its production
JPH10123538A (en) 1996-10-22 1998-05-15 Matsushita Electric Ind Co Ltd Production for liquid crystal display element
US6016181A (en) 1996-11-07 2000-01-18 Sharp Kabushiki Kaisha Liquid crystal device having column spacers with portion on each of the spacers for reflecting or absorbing visible light and method for fabricating the same
JPH10142616A (en) 1996-11-14 1998-05-29 Ayumi Kogyo Kk Liquid crystal injection method and liquid dispenser
JPH10174924A (en) 1996-12-17 1998-06-30 Hitachi Techno Eng Co Ltd Paste applying apparatus
JPH10177178A (en) 1996-12-17 1998-06-30 Matsushita Electric Ind Co Ltd Production of liquid crystal display element
JPH10221700A (en) 1997-02-10 1998-08-21 Fujitsu Ltd Liquid crystal display device manufacturing method
US5946070A (en) * 1997-03-28 1999-08-31 Denso Corporation Liquid crystal cell having filling passage preventing turn-around flow of liquid crystal
US5861932A (en) 1997-03-31 1999-01-19 Denso Corporation Liquid crystal cell and its manufacturing method
JPH10282512A (en) 1997-04-07 1998-10-23 Ayumi Kogyo Kk Method for injecting liquid crystal and dispenser used for the same
JPH10333157A (en) 1997-06-03 1998-12-18 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
JPH10333159A (en) 1997-06-03 1998-12-18 Matsushita Electric Ind Co Ltd Liquid crystal display device
US6373544B1 (en) * 1997-06-17 2002-04-16 Seiko Epson Corporation Electro-optical device substrate, electro-optical device, electronic device, and projection display device
JPH1114953A (en) 1997-06-20 1999-01-22 Matsushita Electric Ind Co Ltd Manufacture of multi-numbered liquid crystal display panel, and multi-numbered liquid crystal panel
JPH1138424A (en) 1997-07-23 1999-02-12 Fujitsu Ltd Liquid crystal display panel and its production
JPH1164811A (en) 1997-08-21 1999-03-05 Matsushita Electric Ind Co Ltd Method and device for producing liquid crystal display element
US6239855B1 (en) * 1997-08-25 2001-05-29 Sharp Kabushiki Kaisha Method for producing a liquid crystal display panel having dummy seal particles arranged in at least two arrays
JPH11109388A (en) 1997-10-03 1999-04-23 Hitachi Ltd Production of liquid crystal display device
US6226067B1 (en) 1997-10-03 2001-05-01 Minolta Co., Ltd. Liquid crystal device having spacers and manufacturing method thereof
US5875922A (en) 1997-10-10 1999-03-02 Nordson Corporation Apparatus for dispensing an adhesive
JPH11133438A (en) 1997-10-24 1999-05-21 Matsushita Electric Ind Co Ltd Liquid crystal display element and its production
US6137559A (en) * 1997-10-30 2000-10-24 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a liquid crystal display device using an airtight seal pattern
JPH11142864A (en) 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
JPH11174477A (en) 1997-12-08 1999-07-02 Matsushita Electric Ind Co Ltd Production of liquid crystal display device
US6222603B1 (en) * 1998-01-13 2001-04-24 Matsushita Electric Industrial Co., Ltd. Method of manufacturing liquid crystal display device with a double seal
JPH11264991A (en) 1998-01-13 1999-09-28 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display element
JPH11212045A (en) 1998-01-26 1999-08-06 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal panel
JPH11248930A (en) 1998-03-06 1999-09-17 Matsushita Electric Ind Co Ltd Color filter substrate and manufacture thereof, and liquid crystal display element using same color filter substrate
JPH11262712A (en) 1998-03-17 1999-09-28 Hitachi Techno Eng Co Ltd Paste application method and apparatus therefor
US6055035A (en) 1998-05-11 2000-04-25 International Business Machines Corporation Method and apparatus for filling liquid crystal display (LCD) panels
JPH11326922A (en) 1998-05-14 1999-11-26 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display panel
JPH11344714A (en) 1998-06-02 1999-12-14 Denso Corp Liquid crystal cell
US6337730B1 (en) 1998-06-02 2002-01-08 Denso Corporation Non-uniformly-rigid barrier wall spacers used to correct problems caused by thermal contraction of smectic liquid crystal material
JP2000002879A (en) 1998-06-12 2000-01-07 Matsushita Electric Ind Co Ltd Device for assembling liquid crystal panel and its method
JP2000029035A (en) 1998-07-09 2000-01-28 Minolta Co Ltd Liquid crystal element and its manufacture
JP2000056311A (en) 1998-08-03 2000-02-25 Matsushita Electric Ind Co Ltd Liquid crystal display device
JP2000066165A (en) 1998-08-20 2000-03-03 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display panel
JP2000066218A (en) 1998-08-21 2000-03-03 Shinetsu Engineering Kk Liquid crystal panel production apparatus
JP2000093866A (en) 1998-09-18 2000-04-04 Hitachi Techno Eng Co Ltd Method and device for paste coating
JP2000137235A (en) 1998-11-02 2000-05-16 Matsushita Electric Ind Co Ltd Sticking method of liquid crystal substrate
KR20000035302A (en) 1998-11-09 2000-06-26 마츠시타 덴끼 산교 가부시키가이샤 Manufacturing method and apparatus of liquid crystal display
US6304311B1 (en) * 1998-11-16 2001-10-16 Matsushita Electric Industrial Co., Ltd. Method of manufacturing liquid crystal display device
JP2000147528A (en) 1998-11-16 2000-05-26 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display element
EP1003066A1 (en) 1998-11-16 2000-05-24 Matsushita Electric Industrial Co., Ltd. Method of manufacturing liquid crystal display devices
US6219126B1 (en) * 1998-11-20 2001-04-17 International Business Machines Corporation Panel assembly for liquid crystal displays having a barrier fillet and an adhesive fillet in the periphery
JP2000193988A (en) 1998-12-25 2000-07-14 Fujitsu Ltd Production of liquid crystal display panel and apparatus for production
US6414733B1 (en) 1999-02-08 2002-07-02 Dai Nippon Printing Co., Ltd. Color liquid crystal display with a shielding member being arranged between sealing member and display zone
JP2000241824A (en) 1999-02-18 2000-09-08 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
JP2000310784A (en) 1999-02-22 2000-11-07 Matsushita Electric Ind Co Ltd Liquid crystal panel, color filter and their production
JP2000284295A (en) 1999-03-30 2000-10-13 Hitachi Techno Eng Co Ltd Method and apparatus for assembling substrate
JP2000292799A (en) 1999-04-09 2000-10-20 Matsushita Electric Ind Co Ltd Liquid crystal display device and its production
JP2000310759A (en) 1999-04-28 2000-11-07 Matsushita Electric Ind Co Ltd Device for manufacturing liquid crystal display element and its method
JP2001013506A (en) 1999-04-30 2001-01-19 Matsushita Electric Ind Co Ltd Liquid crystal display element and its manufacture
JP2001222017A (en) 1999-05-24 2001-08-17 Fujitsu Ltd Liquid crystal display device and its manufacturing method
US7230669B1 (en) * 1999-05-24 2007-06-12 Sharp Kabushiki Kaisha Liquid crystal display and method of fabricating the same
US7199855B2 (en) * 1999-05-24 2007-04-03 Sharp Kabushiki Kaisha Liquid crystal display and method of fabricating the same
JP2000338501A (en) 1999-05-26 2000-12-08 Matsushita Electric Ind Co Ltd Production of liquid crystal display panel
JP2001005405A (en) 1999-06-18 2001-01-12 Hitachi Techno Eng Co Ltd Method for assembling substrate and apparatus therefor
JP2001005401A (en) 1999-06-21 2001-01-12 Hitachi Techno Eng Co Ltd Method for assembling substrates and device therefor
JP2001033793A (en) 1999-07-21 2001-02-09 Matsushita Electric Ind Co Ltd Liquid crystal display panel and manufacturing method therefor
US6778249B1 (en) * 1999-07-23 2004-08-17 Nec Lcd Technologies, Ltd. Liquid-crystal display element and method for manufacturing same
JP2001042341A (en) 1999-08-03 2001-02-16 Hitachi Techno Eng Co Ltd Method for assembling liquid crystal substrate
JP2001051284A (en) 1999-08-10 2001-02-23 Matsushita Electric Ind Co Ltd Device for manufacturing liquid crystal display device
JP2001091727A (en) 1999-09-27 2001-04-06 Matsushita Electric Ind Co Ltd Production method of color filter substrate, color filter substrate and liquid crystal display device
JP2001183683A (en) 1999-10-05 2001-07-06 Matsushita Electric Ind Co Ltd Liquid crystal panel, its manufacturing and driving method
JP2001117105A (en) 1999-10-18 2001-04-27 Toshiba Corp Method of manufacturing for liquid crystal display device
JP2001117109A (en) 1999-10-21 2001-04-27 Matsushita Electric Ind Co Ltd Method of manufacturing for liquid crystal display device
JP2001133794A (en) 1999-11-01 2001-05-18 Kyoritsu Kagaku Sangyo Kk Sealing agent for dropping process of lcd panel
JP2001133745A (en) 1999-11-08 2001-05-18 Hitachi Techno Eng Co Ltd Method of assembling substrate and device therefor
JP2001142074A (en) 1999-11-10 2001-05-25 Hitachi Ltd Liquid crystal display device
JP2001147437A (en) 1999-11-19 2001-05-29 Nec Corp Liquid crystal display panel and method of producing the same
JP2001154211A (en) 1999-11-30 2001-06-08 Hitachi Ltd Liquid crystal panel and its manufacturing method
JP2001166310A (en) 1999-12-08 2001-06-22 Matsushita Electric Ind Co Ltd Method of producing liquid crystal display panel
JP2001166272A (en) 1999-12-09 2001-06-22 Hitachi Techno Eng Co Ltd Method and device for assembling substrate
US6573968B2 (en) * 1999-12-16 2003-06-03 Lg. Philips Lcd Co., Ltd. Seal pattern for liquid crystal display device and related method
US6844910B2 (en) * 1999-12-28 2005-01-18 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and manufacturing method thereof
US6542215B2 (en) * 1999-12-29 2003-04-01 Lg. Philips Lcd, Co., Ltd. Method of forming a seal pattern for liquid crystal display device
JP2001201750A (en) 2000-01-14 2001-07-27 Fujitsu Ltd Liquid crystal display device and method of producing the same
JP2001209052A (en) 2000-01-24 2001-08-03 Matsushita Electric Ind Co Ltd Liquid crystal display device and its manufacturing method
JP2001209056A (en) 2000-01-25 2001-08-03 Shinetsu Engineering Kk Device for production of liquid crystal panel
JP2001209057A (en) 2000-01-26 2001-08-03 Shinetsu Engineering Kk Device for manufacturing liquid crystal panel
JP2001209058A (en) 2000-01-26 2001-08-03 Shinetsu Engineering Kk Device for manufacturing liquid crystal panel
JP2001215459A (en) 2000-02-02 2001-08-10 Matsushita Electric Ind Co Ltd Divice for manufacturing liquid crystal display element
US20010021000A1 (en) 2000-02-02 2001-09-13 Norihiko Egami Apparatus and method for manufacturing liquid crystal display
JP2001235758A (en) 2000-02-23 2001-08-31 Fujitsu Ltd Liquid crystal display panel and its manufacturing method
JP2001255542A (en) 2000-03-14 2001-09-21 Sharp Corp Method and device for laminating substrate and method and device for manufacturing liquid crystal display device
JP2001264782A (en) 2000-03-16 2001-09-26 Ayumi Kogyo Kk Method of filling gap of flat panel substrate with viscous liquid material
JP2001272640A (en) 2000-03-27 2001-10-05 Fujitsu Ltd Liquid crystal dropping device and liquid crystal dropping method
US20010026348A1 (en) 2000-03-29 2001-10-04 Fujitsu Limited Method for manufacturing liquid crystal display
JP2001281678A (en) 2000-03-29 2001-10-10 Fujitsu Ltd Method of manufacturing liquid crystal display device
JP2001281675A (en) 2000-03-29 2001-10-10 Matsushita Electric Ind Co Ltd Production method for liquid crystal display device
JP2001282126A (en) 2000-03-30 2001-10-12 Hitachi Techno Eng Co Ltd Substrate assembling device
US7362409B2 (en) * 2000-04-04 2008-04-22 Mitsubishi Electric Corporation Liquid crystal display device and method for manufacturing the same
JP2001305563A (en) 2000-04-19 2001-10-31 Hitachi Techno Eng Co Ltd Substrate sticking device
JP2001330840A (en) 2000-05-18 2001-11-30 Toshiba Corp Method for manufacturing liquid crystal display element
JP2001330837A (en) 2000-05-19 2001-11-30 Matsushita Electric Ind Co Ltd Hermetic structural, its manufacturing method, liquid crystal display device using the same and its manufacturing method
JP2001356354A (en) 2000-06-13 2001-12-26 Matsushita Electric Ind Co Ltd Method for manufacturing liquid crystal display device
JP2002080321A (en) 2000-06-20 2002-03-19 Kyowa Hakko Kogyo Co Ltd Cosmetic
JP2002014360A (en) 2000-06-29 2002-01-18 Matsushita Electric Ind Co Ltd Method and device for manufacturing liquid crystal panel
JP2002023176A (en) 2000-07-05 2002-01-23 Seiko Epson Corp Liquid crystal filling system and method for filling liquid crystal
JP2001066615A (en) 2000-08-02 2001-03-16 Matsushita Electric Ind Co Ltd Manufacture of liquid crystal display device
JP2002049045A (en) 2000-08-03 2002-02-15 Nec Corp Method for manufacturing liquid crystal display panel
JP2002079160A (en) 2000-09-04 2002-03-19 Hitachi Industries Co Ltd Paste coater
JP2002082340A (en) 2000-09-08 2002-03-22 Fuji Xerox Co Ltd Method for manufacturing flat panel display
JP2002090760A (en) 2000-09-12 2002-03-27 Matsushita Electric Ind Co Ltd Apparatus and method for manufacturing liquid crystal display panel
JP2002090759A (en) 2000-09-18 2002-03-27 Sharp Corp Apparatus and method for manufacturing liquid crystal display element
JP2002107740A (en) 2000-09-28 2002-04-10 Sharp Corp Method and device for manufacturing liquid crystal display panel
JP2002122872A (en) 2000-10-12 2002-04-26 Hitachi Ltd Liquid crystal display device and method of manufacturing the same
JP2002122873A (en) 2000-10-13 2002-04-26 Stanley Electric Co Ltd Method of manufacturing liquid crystal display device
JP2002122870A (en) 2000-10-13 2002-04-26 Fujitsu Ltd Liquid crystal display device, method of manufacturing the same and device for dropping liquid crystal
JP2002131762A (en) 2000-10-30 2002-05-09 Shinetsu Engineering Kk Lamination device and method for laminating substrate for liquid crystal panel
JP2002139734A (en) 2000-10-31 2002-05-17 Fujitsu Ltd Manufacturing method and manufacturing device of liquid crystal display device
JP2002156518A (en) 2000-11-16 2002-05-31 Matsushita Electric Ind Co Ltd Method for manufacturing color filter substrate
US6473148B1 (en) * 2000-11-28 2002-10-29 Yafo Networks, Inc. Seal pattern for liquid crystal device
JP2002169166A (en) 2000-12-05 2002-06-14 Matsushita Electric Ind Co Ltd Liquid crystal display, method for manufacturing the same and equipment applying image display
JP2002169167A (en) 2000-12-05 2002-06-14 Matsushita Electric Ind Co Ltd Liquid crystal display, method for manufacturing the same and equipment applying image display
JP2001209060A (en) 2000-12-11 2001-08-03 Fujitsu Ltd Method of producing liquid crystal display panel
JP2002182222A (en) 2000-12-19 2002-06-26 Matsushita Electric Ind Co Ltd Method for manufacturing liquid crystal panel
JP2002202512A (en) 2000-12-28 2002-07-19 Toshiba Corp Liquid crystal display device and method of manufacturing for the same
JP2002202514A (en) 2000-12-28 2002-07-19 Matsushita Electric Ind Co Ltd Liquid crystal panel, and method and manufacturing apparatus for manufacturing the same
JP2002214626A (en) 2001-01-17 2002-07-31 Toshiba Corp Manufacturing method and sealing material for liquid crystal display
JP2002229042A (en) 2001-02-06 2002-08-14 Hitachi Industries Co Ltd Substrate-bonding device
JP2002236276A (en) 2001-02-08 2002-08-23 Hitachi Industries Co Ltd Method and apparatus for assembling substrate
JP2002236292A (en) 2001-02-09 2002-08-23 Matsushita Electric Ind Co Ltd Manufacturing method for liquid crystal panel and substrate sticking device
JP2002258299A (en) 2001-02-28 2002-09-11 Matsushita Electric Ind Co Ltd Liquid crystal display manufacturing method, manufacturing device and liquid crystal display
JP2002277881A (en) 2001-03-16 2002-09-25 Matsushita Electric Ind Co Ltd Liquid crystal panel and its manufacturing method
JP2002277866A (en) 2001-03-21 2002-09-25 Matsushita Electric Ind Co Ltd Method for manufacturing liquid crystal panel
JP2002277865A (en) 2001-03-21 2002-09-25 Matsushita Electric Ind Co Ltd Liquid crystal display and its manufacturing method
JP2002287156A (en) 2001-03-26 2002-10-03 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing liquid crystal panel
JP2002296605A (en) 2001-03-30 2002-10-09 Matsushita Electric Ind Co Ltd Method of laminating liquid crystal substrates
JP2002311438A (en) 2001-04-13 2002-10-23 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing liquid crystal display element
JP2002311440A (en) 2001-04-17 2002-10-23 Hitachi Industries Co Ltd Substrate sticking method and its device
JP2002311442A (en) 2001-04-17 2002-10-23 Hitachi Industries Co Ltd Method for assembling liquid crystal substrate, its assembling device and liquid crystal supplying device
JP2002323694A (en) 2001-04-24 2002-11-08 Hitachi Industries Co Ltd Substrate laminating method and laminating device
JP2001356353A (en) 2001-04-24 2001-12-26 Hitachi Industries Co Ltd Assembly device for substrate
JP2002323687A (en) 2001-04-25 2002-11-08 Hitachi Industries Co Ltd Method and device for assembling liquid crystal substrate
JP2002333628A (en) 2001-05-07 2002-11-22 Matsushita Electric Ind Co Ltd Liquid crystal display, color filter substrate, and array substrate
JP2002333635A (en) 2001-05-07 2002-11-22 Matsushita Electric Ind Co Ltd Liquid crystal display device, manufacturing method therefor and manufacturing device for liquid crystal display device
JP2002333843A (en) 2001-05-10 2002-11-22 Matsushita Electric Ind Co Ltd Method of bonding substrate and device for the same
JP2002341357A (en) 2001-05-14 2002-11-27 Matsushita Electric Ind Co Ltd Manufacturing method and manufacturing apparatus for liquid crystal display device
JP2002341355A (en) 2001-05-16 2002-11-27 Matsushita Electric Ind Co Ltd Method of manufacturing liquid crystal display device and array substrate as well as liquid crystal display device
JP2002341356A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Gap forming method for liquid crystal display panel and apparatus for the same
JP2002341358A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Manufacturing method for liquid crystal display panel
JP2002341362A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Method of manufacturing liquid crystal display panel and apparatus for manufacturing liquid crystal panel
JP2002341359A (en) 2001-05-18 2002-11-27 Matsushita Electric Ind Co Ltd Method and device for manufacturing liquid crystal display element
JP2002341329A (en) 2001-05-21 2002-11-27 Matsushita Electric Ind Co Ltd Liquid crystal display device
JP2003222883A (en) 2002-01-31 2003-08-08 Toshiba Corp Method for manufacturing liquid crystal display element, and liquid crystal display element
US7218374B2 (en) * 2002-02-20 2007-05-15 Lg.Philips Lcd Co., Ltd. Liquid crystal display device and method of manufacturing the same
US6628365B1 (en) * 2002-03-23 2003-09-30 Lg.Philips Lcd Co., Ltd. LCD with UV shielding part at dummy sealant region
JP2011083675A (en) 2009-10-14 2011-04-28 Panasonic Corp Dehumidifier

Also Published As

Publication number Publication date Type
USRE46146E (en) grant

Similar Documents

Publication Publication Date Title
US7199855B2 (en) Liquid crystal display and method of fabricating the same
US5178571A (en) Method for manufacturing an electro-optical device
US6724458B2 (en) Liquid crystal display device and method of fabricating the same
US20050073638A1 (en) Liquid crystal display device and method for fabricating the same
US20020080323A1 (en) Method of producing micro-lenses and image display device with the same
US20060250535A1 (en) Liquid crystal display device and method for fabricating the same
JP2001209060A (en) Method of producing liquid crystal display panel
JPH1138424A (en) Liquid crystal display panel and its production
JP2005242297A (en) Liquid crystal display and its manufacturing method
JP2000066163A (en) Production of liquid crystal display element and substrate bonding device
JP2009115933A (en) Liquid crystal display device and method of manufacturing the same
US6593992B1 (en) Liquid crystal display and method for fabricating the same
JP2003075808A (en) Liquid crystal display and its manufacturing method
US20030103185A1 (en) Liquid crystal display panel and method for fabricating the same
US20030112405A1 (en) Liquid crystal display panel and method for fabricating the same
JPH09105946A (en) Liquid crystal display element and its production
JPH07159795A (en) Production of liquid crystal display panel
US7202931B2 (en) Liquid crystal display device and method of manufacturing the same comprising a plurality of seal patterns between a plurality of supporting patterns and a plurality of compensating patterns disposed below and aligned with the plurality of supporting patterns
JP2001083529A (en) Liquid crystal display device and its production
US20040105065A1 (en) Method for manufacturing liquid crystal display device
US20100182530A1 (en) Display cell
EP0772071A1 (en) Liquid crystal display element and fabrication process thereof
US6628365B1 (en) LCD with UV shielding part at dummy sealant region
US20030112404A1 (en) Liquid crystal display device and method of fabricating the same
US20030210311A1 (en) Apparatus and method for fabricating a liquid crystal display