JP3574865B2 - Substrate assembly method and apparatus - Google Patents

Substrate assembly method and apparatus Download PDF

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Publication number
JP3574865B2
JP3574865B2 JP31689699A JP31689699A JP3574865B2 JP 3574865 B2 JP3574865 B2 JP 3574865B2 JP 31689699 A JP31689699 A JP 31689699A JP 31689699 A JP31689699 A JP 31689699A JP 3574865 B2 JP3574865 B2 JP 3574865B2
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JP
Japan
Prior art keywords
substrate
substrates
adhesive sheet
vacuum
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP31689699A
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Japanese (ja)
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JP2001133745A (en
Inventor
潔 今泉
聡 八幡
明 平井
正行 齊藤
Original Assignee
株式会社 日立インダストリイズ
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Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for assembling substrates to be bonded to each other while holding and opposing substrates to be bonded in a vacuum chamber and narrowing an interval in vacuum.
[0002]
[Prior art]
In manufacturing a liquid crystal display panel, two glass substrates provided with a transparent electrode, a thin film transistor array, and the like are bonded with an adhesive (hereinafter, also referred to as a sealant) at an extremely close interval of about several μm (hereinafter, bonding). The subsequent substrate is called a cell), and there is a step of sealing the liquid crystal in a space formed by the cell.
[0003]
To seal the liquid crystal, the liquid crystal is dropped on one substrate in which a sealing agent is drawn in a closed pattern so that an injection port is not provided, and the other substrate is disposed on the one substrate, and the liquid crystal is sealed in a vacuum. A method proposed in Japanese Patent Application Laid-Open No. 62-165622, in which the upper and lower substrates are brought close to each other, or a pattern is drawn on a sealant so as to provide an injection port on one of the substrates, and the substrates are bonded in a vacuum. After that, there is a method proposed in Japanese Patent Application Laid-Open No. 10-26763 in which liquid crystal is injected from an injection port.
[0004]
[Problems to be solved by the invention]
In the above prior art, both substrates are bonded in a vacuum, before and after the pattern drawing of the sealant, but in a vacuum, the substrates are suction-adsorbed by a pressure difference from the atmosphere as in the atmospheric state. I can't.
[0005]
Therefore, when the edge of the substrate located on the upper side (hereinafter, referred to as an upper substrate) is mechanically held, the central portion of the substrate bends, and the deflection becomes larger as the recent tendency of the substrate to become larger and thinner. ing.
[0006]
Before bonding, optical positioning is performed using the alignment marks provided on the peripheral edges (ends) of the upper and lower substrates, but the larger the deflection, the wider the distance between the ends of both substrates In addition, it is difficult to focus on the alignment mark, so that accurate alignment is difficult.
[0007]
Also, when bonding, the bent central portion of the upper substrate comes into contact with the lower substrate (hereinafter, referred to as the lower substrate) before the peripheral edge portion. The spacers scattered between them move and damage the alignment film and the like formed on the substrate.
[0008]
In addition, there is a tendency that the upper and lower substrates to be bonded have the same size, and the sealant is provided at a position just near the peripheral edge of the substrate. In such a case, there is a problem that the margin for holding the upper substrate can hardly be removed.
[0009]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate assembling method and apparatus capable of bonding with high precision in a vacuum even if the substrate size is increased and thinned.
[0010]
Another object of the present invention is to provide a method of assembling a substrate which can easily hold the upper substrate even when an adhesive is provided at the periphery of the substrate and can be bonded without damaging the alignment film and the like. It is to provide a device.
[0011]
[Means for Solving the Problems]
The present invention provides an assembling method of a substrate, in which one of the substrates to be bonded is held and opposed on the other substrate to be bonded, and is bonded in a vacuum with an adhesive provided on any one of the substrates. One substrate is held below the pressure plate by the adhesive force on the lower surface of the adhesive sheet, the other substrate is held on a table, and a tensile force is applied to the adhesive sheet in a direction parallel to the main surface of the one substrate. The first feature is that the two substrates are kept substantially parallel to each other, and the two substrates are bonded via an adhesive sheet by narrowing the gap between the pressure plate and the table in a vacuum. The gripper grips the end of the adhesive sheet and moves it horizontally to apply a pulling force to the adhesive sheet in a direction parallel to the main surface of one of the substrates. To cut in a direction to the second feature.
Further, in the present invention, a pressure plate for holding one substrate above the inside of the vacuum chamber and a table for holding the other substrate to be bonded below the inside of the vacuum chamber are provided, and the position of the one substrate is adjusted. In a substrate assembling apparatus in which the distance between the two substrates is reduced in a vacuum by an adhesive provided on one substrate and the substrates are bonded to each other, a tensile force is applied to the adhesive sheet in a direction parallel to the main surface of the one substrate. Then, the two substrates are maintained substantially parallel to each other and then positioned on the other substrate, the inside of the vacuum chamber is evacuated, and the pressure plate and the table are narrowed to one side held by the adhesive sheet. A third feature is that the substrate and the substrate on the table are bonded to each other.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 and 2, a substrate assembling apparatus 1 according to the present invention includes a lower chamber T1 and an upper chamber T2, and an XYθ driving mechanism (not shown) is provided below the lower chamber T1. Have been. With this XY drive mechanism, the lower chamber portion T1 can move back and forth in the left and right X-axis directions and the Y-axis direction orthogonal to the X-axis in the drawing. Further, the table 4 on which the lower substrate 1a is mounted can be horizontally rotated with respect to the lower chamber unit 5 from the shaft 2 via the vacuum seal 3 by the θ drive mechanism. When the lower substrate 1a is mounted on the table 4, the lower substrate 1a has a structure in which the lower substrate 1a is mechanically positioned and fixed by pins, rollers, and the like, and a structure in which the lower substrate 1a is suction-adsorbed. Is omitted.
[0013]
In the upper chamber section T2, the upper chamber unit 6 and the pressurizing plate 7 inside the upper chamber unit 6 can move up and down independently of each other. That is, the upper chamber unit 6 has a housing 8 containing a linear bush and a vacuum seal, and is moved in the vertical Z-axis direction by a cylinder 11 fixed to a frame 10 using a shaft 9 as a guide.
[0014]
When the lower chamber unit T1 on the XYθ drive mechanism moves directly below the upper chamber unit T2 and the upper chamber unit 6 descends, the flange of the upper chamber unit 6 is attached to the O-ring 12 disposed around the lower chamber unit 5. They come into contact with each other and become a state functioning as a vacuum chamber. Here, the ball bearing 13 installed around the lower chamber unit 5 adjusts the amount of crushing of the O-ring 12 due to vacuum, and can be set at an arbitrary position in the vertical direction. The amount of collapse of the O-ring 12 is set at a position where the inside of the vacuum chamber can be kept at a vacuum and the maximum elasticity is obtained. The large force generated by the vacuum is received by the lower chamber unit 5 via the ball bearing 13, and the lower chamber unit T1 is easily finely moved within the elastic range of the O-ring 12 when the upper and lower substrates are bonded, which will be described later. Can be decided.
[0015]
The housing 8 has a built-in vacuum seal that can move up and down without causing a vacuum leak to the shaft 9 even if the upper chamber unit 6 forms a vacuum chamber with the lower chamber unit 5 and deforms at atmospheric pressure. The deformation of the vacuum chamber can absorb the force applied to the shaft 9, the deformation of the pressure plate 7 supported by the shaft 9 can be substantially prevented, and the upper plate 1 b affixed to the adhesive sheet 18 and the table 4 hold it. The bonding can be performed while maintaining the parallel state with the lower substrate 1a. The vertical movement of the pressure plate 7 is performed by a drive mechanism (not shown) installed above the shaft 9.
[0016]
Numeral 14 denotes a vacuum pipe arranged on the side of the upper chamber unit 6, which is connected to a vacuum source through a vacuum valve and a pipe hose (not shown), and these are used when the inside of the vacuum chamber is depressurized and evacuated. Reference numeral 15 denotes a gas purge valve and a tube, which are connected to a pressure source such as nitrogen gas (N 2 ) or clean dry air, and are used to return the vacuum chamber to atmospheric pressure.
[0017]
Next, the driving mechanism of the adhesive sheet 18 holding the upper substrate 1b will be described.
Reference numeral 17 in the upper chamber unit 6 denotes a spindle, which can drive and rotate the adhesive sheet 18 wound in a roll shape in the feeding direction, free rotation, rotation in the feeding direction in a state where a reverse torque is applied to the feeding direction, and rotation and fixing. It has become.
[0018]
The pressure-sensitive adhesive sheet 18 can be wound by a spindle 21 which is fixed to a position relatively to the roller 20 and is opposed to a rotatable roller 20 on the opposite side via a rotatable roller 19. The spindle 21 is capable of driving and rotating the pressure-sensitive adhesive sheet 18 in the winding direction, and is capable of reverse rotation and rotation fixing with a torque applied in the winding direction. The take-up spindle 21 fixed in position relative to the roller 20 can be driven horizontally in the direction of the spindle 17 while driving and rotating the adhesive sheet 18 in the take-up direction. Since the adhesive surface of the adhesive sheet 18 is wound so as to be on the lower side, when the upper substrate 1b is adhered to the adhesive sheet 18, it comes to face the lower substrate 1a.
[0019]
The rotation of the spindle 17 is performed by a motor 24 as shown in FIG. The rotation operation of the spindle 21 is performed by a motor 25, and the horizontal operation is realized by a ball nut 28 to which the motor 25 is fixed being rotated and moved by a ball screw 26 driven by a motor 27. The guide for horizontal movement of the ball nut 28 is not shown. 29, 30 are support bearings of the ball screw 26, the support bearing 29 is fixed to the upper chamber unit 6, the support bearing 30 is fixed to the bracket 31 together with the motor 24 and the shaft of the roller 19, and the bracket 31 is 6.
[0020]
Reference numerals 22a and 22b denote image recognition cameras which are installed to read alignment marks provided on the upper and lower substrates 1a and 1b. Reference numerals 23a and 23b denote transparent viewing windows, which perform vacuum shut-off of the holes 6a and 6b provided in the upper chamber unit 6.
[0021]
Reference numerals 7a and 7b denote small-diameter holes provided in the pressure plate 7 for viewing alignment marks on the substrate. Here, the width of the adhesive sheet 18 is set so that the adhesive sheet 18 does not block the field of view of the image recognition cameras 22a and 22b, as shown in FIG. It is preferable that the distance be slightly smaller than the distance in the Y direction.
[0022]
Next, a process of bonding substrates by the present substrate assembling apparatus 1 will be described with reference to FIGS.
FIG. 3A shows the initial state of the upper chamber portion T2 before the upper substrate 1b is held, and the spindle 21 is moved to the right side in the figure with the adhesive sheet 18 spread, and the pressing plate 7 Is waiting upwards.
[0023]
FIG. 3B shows a state in which the pressure plate 7 is lowered and brought into contact with the pressure-sensitive adhesive sheet 18 and then further lowered. At this time, the pressure-sensitive adhesive sheet 18 wound on the spindles 17 and 21 is sent out from both, and the pressure-sensitive adhesive sheet 18 is subjected to torque control by the respective motors for driving the spindles 17 and 21 to rotate. State. The pulling force is determined by the weight of the upper substrate 1b, and is set to such an amount that a gap is hardly formed between the upper substrate 1b and the pressing plate 7 even when the upper substrate 1b is stuck and held, as shown in FIG.
[0024]
After the upper substrate 1b is adhered and held on the adhesive sheet 18, the upper substrate 1b and the lower substrate 1a are attached to each other as shown in FIG.
[0025]
First, as shown in FIG. 4A, the lower chamber part T1 in which the lower substrate 1a is mounted on the table 4 is moved directly below the upper chamber part T2, and as shown in FIG. The upper chamber unit 6 is lowered, the flange of the upper chamber unit 6 is brought into contact with the O-ring 12 arranged around the lower chamber unit 5 to integrate the upper and lower chamber portions T1 and T2, and then the vacuum exhaust is performed from the vacuum pipe 14. Do.
[0026]
The lower substrate 1a is positioned and fixed on the table 4, and a sealant is drawn in a closed pattern on the outer periphery of the lower substrate 1a, and an appropriate amount of liquid crystal is dropped inside the lower surface.
[0027]
When the inside of the vacuum chamber formed by integrating the upper chamber unit 6 and the lower chamber unit 5 reaches a predetermined degree of vacuum, the upper and lower substrates 1a and 1b are aligned as shown in FIG. While performing, the vertical drive mechanism (not shown) on the shaft 9 is operated to lower the pressure plate 7, and the gap between the upper and lower substrates 1a and 1b is reduced with a predetermined pressing force so as to be bonded at a desired interval.
[0028]
Also at this time, as the pressure plate 7 descends, the adhesive sheet 18 wound on the spindles 17 and 21 is sent out from both. However, as described above, since the adhesive sheet 18 is always in a state where an appropriate pulling force is applied, The sheet 18 does not stretch or break. Due to this pulling force, the upper substrate 1b is almost in close contact with the pressure plate 7 via the adhesive sheet 18, and the central portion of the upper substrate 1b does not droop extremely, and the upper and lower substrates 1a and 1b are substantially parallel. Therefore, the central portion of the upper substrate 1b does not adversely affect the spacers scattered on the substrate 1a, and the positioning of the substrates is not impossible.
[0029]
Incidentally, the alignment between the substrates is performed by reading the alignment marks provided on the upper and lower substrates 1a, 1b by the image recognition cameras 22a, 22b from the viewing windows 23a, 23b provided in the upper chamber unit 6, and performing image processing. Is measured, and an XYθ driving mechanism (not shown) of the lower chamber portion T1 is finely moved to perform high-accuracy alignment. In this fine movement, the ball bearing 13 maintains the space between the upper and lower chamber units 6 and 5 so that the O-ring 12 is not deformed extremely and the vacuum is maintained.
[0030]
When bonding is completed, open the gas purge valve 15 by tightening the vacuum valve (not shown) is connected to the vacuum pipe 14, to supply N 2 and clean dry air into the vacuum chamber, the gas purge valve from returning to the atmospheric pressure 15 is closed, and the process proceeds to the step of taking out the cells formed by bonding shown in FIG.
[0031]
First, as shown in FIG. 5A, the upper chamber unit 6 is raised by the cylinder 11, and then the pressure plate 7 is raised.
[0032]
Since the adhesive sheet 18 is attached to the upper surface of the bonded upper substrate 1b, the operation of peeling the adhesive sheet 18 will be described below with reference to FIG.
[0033]
This operation is performed by rotating the spindle 21 and winding the pressure-sensitive adhesive sheet 18 and, at the same time, horizontally moving the adhesive sheet 18 in the direction of the spindle 17 which has been rotationally fixed at a speed synchronized with the winding speed.
[0034]
At this time, the pressure-sensitive adhesive sheet 18 is gradually and smoothly peeled off from the upper surface of the upper substrate 1b, and all of the pressure-sensitive adhesive sheet 18 is peeled off when the spindle 21 is closest to the spindle 17. is working.
[0035]
The bonded lower substrate 1a is suction-adsorbed on the table 4, so that the lower substrate 1a does not shift or lift even while the adhesive sheet 18 is being peeled off.
[0036]
When the above operation is completed, the lower chamber part T1 is moved to the left side of the figure as shown in FIG. 5B, the cell pc formed by attaching the upper and lower substrates 1b and 1a is removed from the table 4, and the spindle 17 is removed. In order to send out a new adhesive sheet 18, the spindle 21 is horizontally moved rightward while the spindle 21 is rotated and fixed, to prepare for the next bonding.
[0037]
Next, a description will be given of substrate bonding in a substrate bonding apparatus according to another embodiment of the present invention with reference to FIG.
[0038]
In FIG. 6, the same or corresponding components as those in the embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and description thereof is omitted.
[0039]
In this embodiment, instead of the winding of the adhesive sheet 18 by the spindle 21, a chuck mechanism 45 for the adhesive sheet 18 is provided, and the cutter 40 of the adhesive sheet 18 and the chuck of the adhesive sheet 18 are provided near the roller 19 on the spindle 17 side. Drive mechanism is provided.
[0040]
That is, in FIG. 6, the illustration of the upper substrate 1 b is omitted for simplification, but after the substrates are bonded, the cutter base 43 supporting the cutter table 41 via the actuator 42 is used by the actuator 44 to cut the blade of the cutter 40. Raise to the lower end position.
[0041]
Next, the cutter 40 is moved in the width direction (Y direction in the drawing) of the adhesive sheet 18 at the outer periphery of the cell pc, and the adhesive sheet 18 to which the upper substrate 1b is adhered is cut.
[0042]
The chuck 45 releases the grip of the adhesive sheet 18, takes out the cell pc with the adhesive sheet 18 attached, and peels the adhesive sheet 18 from the cell pc at an appropriate time. Until this peeling, the adhesive sheet 18 functions as a protective film for the cell pc. If UV light is irradiated to cure the sealant, most of the adhesive layer of the adhesive sheet 18 is deteriorated by the UV light, so that it is easy to peel off the adhesive sheet 18 at an appropriate time.
[0043]
After taking out the cell pc, the cutter table 41 is slightly lowered by the actuator 42 to make a margin for the chuck 45 at the end of the adhesive sheet 18. After the cutter 40 retreats (returns to the position shown in the figure), the ball screw 26 is rotated by the drive of the motor 27, and the chuck 45 goes to the roller 19 on the spindle 17 side to grip the end of the adhesive sheet 18. I do. A driving mechanism for holding the adhesive sheet 18 by the chuck 45 is built in the chuck 45.
[0044]
Thereafter, the cutter base 43 is lowered by the actuator 44, the chuck 45 is moved to the right side in the figure by the motor 27, and the adhesive sheet 18 is fed out and kept horizontal to prepare for holding the next upper substrate 1b.
[0045]
Next, a description will be given of substrate bonding in a substrate bonding apparatus according to still another embodiment of the present invention with reference to FIG.
[0046]
In FIG. 7, the same or corresponding components as those in the embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and description thereof will be omitted.
[0047]
In FIG. 7, reference numeral 50 denotes an opening provided in the pressure plate 7, which is provided with an actuator 51 above, and an adhesive member 52 is provided at a tip of a shaft extending downward from the actuator 51. By the operation of the actuator 51, the adhesive member 52 moves up and down in the opening 50.
[0048]
The upper substrate 1b is held on the lower surface of the adhesive member 52 in close contact with the lower surface of the pressure plate 7 by the adhesive action. That is, the openings 50 are provided in the pressure plate 7 at appropriate intervals and positions in accordance with the size and shape of the upper substrate 1b so that the upper substrate 1b can be held so as to horizontally face the lower substrate 1a. I have.
[0049]
The lower chamber portion T1 in which the lower substrate 1a is fixed on the table 4 is moved below the upper chamber portion T2 which holds the upper substrate 1b with the adhesive member 52.
[0050]
Thereafter, as shown in FIG. 6B, the upper chamber unit 6 is lowered by the cylinder 11 to form a vacuum chamber with the lower chamber unit 5, and then the inside is decompressed and evacuated.
[0051]
Next, the upper and lower substrates 1b and 1a are aligned, the pressure plate 7 is lowered by the shaft 9, and the upper substrate 1b is directly pressed by the pressure plate 7 to bond the upper and lower substrates 1b and 1a. In this case, since the adhesive member 52 is provided in the opening 50, the pressing force is applied equally to the upper substrate 1b.
[0052]
When the adhesive member 52 is peeled from the upper substrate 1b of the cell pc formed by bonding, the adhesive member 52 is raised (regressed) in the opening 50 by the actuator 51. Then, since the peripheral portion of the opening 50 of the pressure plate 7 prevents the movement of the upper substrate 1b, the adhesive member 52 and the upper substrate 1b can be easily separated from each other, and the pressure plate 7 serves as a peeling means of the adhesive member 52. work.
[0053]
Thereafter, nitrogen gas N 2 , clean dry air, or the like is supplied into the vacuum chamber to return the pressure to the atmospheric pressure while purging the inside. Then, the pressure plate 7 is raised to raise the upper chamber unit 6, and the lower chamber part T 1 is moved to the left side of the drawing. Then, the cell pc is taken out of the table 4.
[0054]
According to this embodiment, since the pressure-sensitive adhesive member is incorporated in the pressure plate 7, the inside of the upper chamber unit 6 is simplified, and the size of the vacuum chamber is reduced, so that the time for decompression and vacuuming can be reduced, and the number of processed wafers can be increased. be able to.
[0055]
In addition, since the central portion of the upper substrate 1b where the sag is caused can be lifted by the adhesive member built in the pressure plate 7, there is no fear that the central portion of the upper substrate bends and damages the alignment film and the like.
[0056]
The present invention is not limited to the above embodiment, and an adhesive member may be charged into the table 4 and used for fixing the lower substrate 1a. Also, instead of the adhesive sheet 18, a plurality of adhesive tapes are installed along the two parallel sides of the upper substrate 1b so as to be movable within the upper chamber unit by a mechanism like the one shown in FIGS. Then, the upper substrate 1b may be held parallel to the lower substrate 1a.
[0057]
In any of the embodiments, the upper substrate is held on the main surface side, so that the slack at the center can be eliminated, and the holding of the upper substrate is hindered even if the sealant is provided just around the periphery of the substrate. There is no.
[0058]
【The invention's effect】
As described above, according to the present invention, even if the size of the substrate is increased and the thickness of the substrate is reduced, the substrates can be bonded with high accuracy in a vacuum.
[0059]
Further, according to the present invention, even when an adhesive is provided near the periphery of the substrate, the upper substrate can be easily held and can be bonded without damaging the alignment film and the like.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view of a substrate assembling apparatus showing an embodiment of the present invention.
FIG. 2 is a perspective view of a driving mechanism of an adhesive sheet in the substrate assembling apparatus shown in FIG.
FIG. 3 is a sectional view of a main part showing an initial step of bonding both upper and lower substrates in the substrate assembling apparatus shown in FIG. 1;
FIG. 4 is a sectional view of a main part showing a step of bonding both upper and lower substrates in the substrate assembling apparatus shown in FIG. 1;
5 is a cross-sectional view of a main part showing a step of taking out a cell formed by bonding both upper and lower substrates in the substrate assembling apparatus shown in FIG. 1;
FIG. 6 is a perspective view of a main part showing a step of bonding both upper and lower substrates in a substrate assembling apparatus according to another embodiment of the present invention.
FIG. 7 is a cross-sectional view of a main part showing a step of bonding both upper and lower substrates in a substrate assembling apparatus according to still another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate assembling apparatus 1a Lower substrate 1b Upper substrate 4 Table 5 Lower chamber unit 6 Upper chamber unit 7 Pressure plate 12 O-ring 13 Ball bearing 14 Vacuum piping 17, 21 Spindle 18 Adhesive sheet

Claims (3)

  1. In a method of assembling substrates, one substrate to be bonded is held and opposed on the other substrate to be bonded, and is bonded in a vacuum with an adhesive provided on any one of the substrates.
    One substrate is held below the pressure plate by the adhesive force on the lower surface of the adhesive sheet, the other substrate is held on a table, and a tensile force is applied to the adhesive sheet in a direction parallel to the main surface of the one substrate. A method for assembling a substrate , comprising: maintaining the two substrates substantially parallel to each other; and bonding the two substrates via an adhesive sheet by narrowing a gap between the pressure plate and the table in a vacuum .
  2. The method for assembling a substrate according to claim 1,
    The edge of the adhesive sheet is gripped with a chuck, and the adhesive sheet is moved horizontally to apply a pulling force in a direction parallel to the main surface of one of the substrates. A method for assembling a substrate, comprising cutting .
  3. A pressure plate for holding one substrate above the vacuum chamber and a table for holding the other substrate to be bonded below the vacuum chamber are provided, and the position of the one substrate is aligned and provided on one of the substrates. In a substrate assembling apparatus that reduces the distance between both substrates in a vacuum with an adhesive and attaches the substrates together,
    The pressure-sensitive adhesive sheet is applied with a pulling force in a direction parallel to the main surface of one of the substrates to keep both substrates substantially parallel, and then is positioned on the other substrate, and the inside of the vacuum chamber is evacuated, A substrate assembling apparatus, wherein one of the substrates held by the adhesive sheet and the substrate on the table are bonded by narrowing a gap between the pressure plate and the table.
JP31689699A 1999-11-08 1999-11-08 Substrate assembly method and apparatus Expired - Fee Related JP3574865B2 (en)

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