JP3773866B2

JP3773866B2 - Substrate assembly method and apparatus

Info

Publication number: JP3773866B2
Application number: JP2002069448A
Authority: JP
Inventors: 聡八幡; 潔今泉; 政智遠藤
Original assignee: Sharp Corp
Current assignee: Sharp Corp
Priority date: 2002-03-14
Filing date: 2002-03-14
Publication date: 2006-05-10
Anticipated expiration: 2022-03-14
Also published as: JP2003273508A

Description

【０００１】
【発明の属する技術分野】
本発明は、真空チャンバ内で貼り合せる基板同士をそれぞれ保持して対向させ、減圧状態で間隔を狭めて貼り合わせる基板の組立方法とその装置に関する
【０００２】
【従来の技術】
液晶表示パネルの製造方法には、２つの方法がある。１つは、透明電極や薄膜トランジスタアレイを付けた２枚のガラス基板を数μｍ程度の極めて接近した間隔をもって接着剤（以下、シール剤ともいう）で貼り合わせ(以後、貼り合せ後の基板をセルと呼ぶ)、それによって形成される空間に液晶を封入する方法である。もう１つの方法は、注入口を設けないようにシール剤をクローズしたパターンに描画した一方の基板上に液晶を滴下しておいて他方の基板を一方の基板上に配置し真空中で上下の基板を接近させて貼り合せる方法がある。ところで、基板同士を貼り合せる装置として、特開２００１−１３３７４５号公報に記載のように、加圧力を加える前に上側基板を保持する方法として、粘着手段で保持し、基板間の間隔を狭めて貼り合せる装置が開示されている。また、具体的な実施例として、粘着手段は粘着シートを用いる方法と、加圧板内に開口部を設けて、その開口部を粘着部材が上下するよう、加圧板上部に設けたアクチュエータ設けた構成が開示されている。
【０００３】
【発明が解決しようとする課題】
上記従来技術では、大気中で粘着手段に基板を接触させて保持する構成としてある。このように大気中で粘着手段を用いて基板を保持すると、基板の凹凸や、基板のたわみ等により、基板と粘着手段の間に空気が入り込み、チャンバを減圧していくと、基板と粘着手段間の空気が膨張して、最悪の場合基板を保持できなくなる場合もある。
【０００４】
それゆえ本発明の目的は、基板サイズが大型化、薄板化しても、画面不良の発生しない高真空中で高精度に貼り合せるために、基板を確実に加圧板に保持できる基板貼り合わせ装置と基板貼り合わせ方法を提供することにある。
【０００５】
【課題を解決するための手段】
上記目的を達成する本発明の特徴とするところは、一方の基板を保持する加圧板に吸引吸着用の複数の吸引口と、粘着により基板を保持する複数の粘着手段を設け、前記粘着手段を設けた開口部と基板で構成される空間部を減圧する減圧流路を設けたことを特徴とする。また、他方の基板を保持するテーブルにも加圧板に設けた構成の吸引吸着用の複数の吸引口と粘着手段手段を設けた。また、粘着手段は粘着手段を設けた開口と基板とで形成される空間部を減圧状態にしてから、粘着手段を基板に押し付けて保持するようにした。
【０００６】
【発明の実施の形態】
以下、本発明の一実施形態を図に基づいて説明する。図１に本発明の基板貼り合わせ装置の全体構成を示す。
図１において、本発明になる基板組立装置１００は、下チャンバ部Ｔ１と上チャンバ部Ｔ２から構成され、下チャンバ部Ｔ１の下には、ＸＹθ駆動機構(図示を省略した)が備えられている。このＸＹ駆動機構により、下チャンバ部Ｔ１は、図面上で左右のＸ軸方向と、Ｘ軸と直交するＹ軸方向に往来できるようになっている。また、θ駆動機構により、シャフト２から真空シール３を介して下基板１ａを搭載するテーブル４を下チャンバユニット５に対して水平に回動可能としてある。下基板１ａは、テーブル４上に搭載されると、テーブル４に設けた吸引口７ｃに吸引吸着される。なお吸引口７ｃには、配管１６ａの一方端が接続され、他方端には図示していないバルブを介して減圧（負圧）源が接続されている。この負圧源から供給された負圧により、下基板１ａが吸引口７ｃに吸引吸着される構造になっている。
【０００７】
上チャンバ部Ｔ２は、上チャンバユニット６と、その内部に加圧板７を設けた構成となっており、上チャンバユニット６と加圧板７とはそれぞれ独立して上下動できる構造になっている。即ち、上チャンバユニット６は、リニアブッシュと真空シールを内蔵したハウジング８を有しており、シャフト９をガイドとしてフレーム１０に固定されたシリンダ１１により上下のＺ軸方向に移動する。また、加圧板７はシャフト９に設けた駆動装置(図示せず)により上下（Ｚ軸方向）に移動する。
【０００８】
また上基板１ｂは、加圧板７の下面に設けた吸引口７ｄに吸引吸着される。この吸引口７ｄは、配管１６ｂの一端側が接続され、配管１６ｂの他端側には図示していないバルブを介して負圧源が接続されている。この負圧源から負圧を供給することで、上基板１ｂが加圧板７に吸引吸着される構造になっている。
【０００９】
ＸＹθ駆動機構上の下チャンバ部Ｔ１が上チャンバー部Ｔ２の直下に移動して上チャンバユニット６が下降すると、下チャンバユニット５の周りに配置してあるＯリング１２に上チャンバユニット６のフランジが接触して一体となる。これにより、真空チャンバとして機能する状態になる。ここで、下チャンバユニット５の周囲に設置されたボールベアリング１３は、真空によるＯリング１２のつぶれ量を調整するもので、上下方向の任意の位置に設定可能となっている。Ｏリング１２のつぶれ量が真空チャンバ内を所定の減圧状態に保つことができ、かつ、最大の弾性が得られるように、その位置を設定する。チャンバ内を減圧することにより発生する大きな力は、ボールベアリング１３を介して下チャンバユニット５が受けている。そのため、後述する上下基板の貼り合わせ時に下チャンバ部Ｔ１をＯリング１２の弾性範囲内で容易に微動させ精密位置決することができる。
【００１０】
ハウジング８は、上チャンバユニット６が下チャンバユニット５と合体して真空チャンバを形成し、内部を減圧することで上チャンバユニットが変形しても、シャフト９に対し圧力漏れを起こさないで上下動できるように真空シールを内蔵している。このため、真空チャンバの変形がシャフト９に与える力を吸収することができ、シャフト９に支持された加圧板７の変形がほぼ防止できる。このため、加圧板７の下面に粘着部材１８ｂにより貼り付けて粘着保持された上基板１ｂと、テーブル４上に保持された下基板１ａとを平行を保った状態で貼り合せが可能となる。尚、前述のように加圧板７の上下動は、シャフト９の上部に設置された図示を省略した駆動機構で行う。
【００１１】
上チャンバユニット６の側面に配置された真空配管１４は、図示していない真空バルブと配管ホースで負圧源に接続されている。これらは真空チャンバ内を所定圧に減圧する時に使用される。また、リークバルブ１７は、真空チャンバ内の真空（減圧）度を増圧方向で任意に調整するために設けてある。ガスパージバルブとチューブ１５は、窒素ガス（Ｎ_２）やクリーンドライエアー等の圧力源に接続されており、これらは真空チャンバ内を大気圧に戻す時に使用される。
【００１２】
画像認識カメラ２２ａ、２２ｂは、上下各基板１ｂ、１ａに設けられている位置合わせマークを読み取るために設置してある。上チャンバユニット６に設けた穴６ａ、６ｂの上部には透明な認識用カメラ２２ａ、２２ｂ用の覗き窓２３ａ、２３ｂが設けてあり、穴６ａ、６ｂからチャンバ内に空気が流れ込まないように真空遮断する。更に、加圧板７にも小径の穴７ａ、７ｂが設けてあり、この穴７ａ、７ｂを介して基板に設けてある位置合わせマークを見ることができる。
【００１３】
次に、上基板１ｂを保持する粘着部及びその駆動部の機構を図１及び図２を用いて説明する。図２に粘着保持機構部の詳細構成を示す。
【００１４】
図２に示すように加圧板７又はテーブル４には開口３０が設けられおり、この開口３０内に粘着部材１８を取り付けたカートリッジ３５が、回転軸３３の端部に交換自在に取り付けてある。この回転軸３３の他方端部側に回転用アクチュエータ３２が設けてあり、この回転用アクチュエータ３２は移動テーブル３６に取り付けてある。また、移動テーブル３６には、固定部材３７に上下方向に移動する上下駆動軸３８の一端が固定され、上下駆動軸３８の他端に上下駆動用の上下用アクチュエータ３１が設けてある。更に、加圧板７又はテーブル４の内部には負圧源に接続された空道３９が設けられ、この空道３９から加圧板７及びテーブル４の一方側表面に貫通して吸引口７ｄ、７ｃが複数設けてある。また空道３９は開口３０にも連通している。
【００１５】
ここで、図２の各アクチュエータ３１、３２ついて、図１では加圧板側をｂ、テーブル側をａの符号を添付して示してある。加圧板側のアクチュエータ３１ｂ、３２ｂの動作で開口３０ｂ内で粘着部材１８ｂが上下、回転する。尚、軸３３ｂは、アクチュエータ３１ｂの直下で上下、回転自在にシール３４ｂでシールされている。更に、開口３０ｂは、空道３９と通じており、真空配管１６ｂに図示していないバルブを介して負圧源に接続され、上基板１ｂを吸引吸着できる構造になっている。なお、開口３０ｂと吸引口７ｄは図示のように加圧板７の内部で通じさせず、加圧板７の基板と接触する面に開口３０ｂと吸引口７ｄをつなぐ溝を形成し通じさせてもよい。
【００１６】
上基板１ｂは、粘着部材１８ｂの下面にその粘着作用で加圧板７の下面に吸引吸着をしなくても密着した形で保持できるようになっている。即ち、粘着部材１８ｂは、上基板１ｂを下基板１ａに対して水平に対向させるべく保持できるように、上基板１ｂの大きさや形状に合せて、適宜な粘着面積や間隔、位置に複数、加圧板７に設けられている。
【００１７】
なお、本実施形態では、粘着部材１８ｂを回転させる回転用アクチュエータ３２と上下させる上下用アクチュエータ３１を別々に設けているが、ボールネジ構造等にして一のアクチュエータで構成することも可能である。また、本実施形態のアクチュエータは圧縮気体方式を用いるもの、又電動方式によるもののいずれの形態でも実現可能であることは言うまでもない。
【００１８】
次に、下基板１ａは、上記したようにテーブル４上に吸引口７ｃより配管１６ａに、図示していないバルブと負圧源に接続され吸引吸着する構造になっている。更に、本実施形態では、加圧板７と同様の構造で、粘着部材１８ａが内蔵されている。テーブル４に設けた複数の開口３０ａの下方に、アクチュエータ３１ａ、３２ａが取り付けてある。そのアクチュエータ３１ａ、３２ａから上方に向かって伸びた軸３３ａの先端に、粘着部材１８ａが設けられている。アクチュエータ３１ａ、３２ａの動作で開口３０ａ内で粘着部材１８ａが上下、回転する。軸３３ａは、軸３３ｂと同様に、アクチュエータ３１ａの直ぐ上で上下、回転自在にシール３４ａでシールされている。更に、開口３０ａは吸引口７ｃと通じており、配管１６ａに図示していないバルブを介して負圧源に接続され、下基板１ａを吸引吸着できる構造になっている。
【００１９】
粘着部材１８ａも下基板１ａを安定保持できるように、下基板１ａの大きさや形状に合せて、適宜な粘着面積や間隔、位置でテーブル４に設けられている。なお、基板をテーブル４に固定するために、粘着部材１８ａを用いる代わりに、機械的なピンやローラを用いてもよい。下基板１ａを吸引吸着以外の粘着やピン、ローラで固定する理由は、チャンバ内の減圧を進めていく過程で、チャンバ内の真空（減圧）度が基板を吸引吸着する真空（減圧）度より高くなったとき下基板１ａをテーブル４に対して圧力差で固定できなくなる。そのため、装置自体の種々の駆動源、床、負圧源等の加振源からの振動、または、上下基板の貼り合わせ時のシールや液晶の接触時の抵抗により、下基板１ａがずれないようにするために粘着又は機械的なピンやローラにより下基板１ａを保持するものである。
【００２０】
次に、図３及至図６で本基板組立装置で基板を貼り合わせる工程について説明する。図３に基板貼り合わせの動作のフローチャートを示す。図４には装置の動作状態を示す。図５には、基板貼り合わせにおける粘着支持機構の動きを示す。図６に1次貼り合せ後に粘着支持機構を基板面から剥離する動作の説明図を示す。
【００２１】
まず、上基板１ｂはロボットハンド等で加圧板７の下に搬入する（Ｓ１）。その後、加圧板７に設けた吸引吸着口に負圧を供給することで、上基板１ｂは吸引吸着され保持される（Ｓ２）。また、下基板１ａは、ロボットハンド等でテーブル４上に搬入され（Ｓ３）、テーブル４に対して位置決めされた後、吸引吸着で固定される（Ｓ４）。尚、下基板１ａの上面の外周にはシール剤１９がクローズしたパターンで塗布されており、その内側には適量の液晶２０が滴下されている。なお本実施形態では、シール剤１９を下基板１ａに設けてあるが、上基板、又は両方の基板に設けても良い。この状態を図４（ａ）に示してある。
【００２２】
その後、下チャンバ部Ｔ１を上チャンバ部Ｔ２の位置に移動する（Ｓ５）。図４(ｂ)は、ＸＹθ駆動機構上の下チャンバ部Ｔ１が上チャンバ部Ｔ２の直下に移動し、下基板１ａと上基板１ｂが対向した状態である。上基板１ｂは、上記したようにすでに加圧板７に対して吸引口７ｄから吸引吸着で保持されている。更に、開口３０ｂも負圧源に連通する構成となっているため、開口３０ｂにも吸引吸着されている。この時、図５（ａ）に示すように粘着部材１８ｂは上基板１ｂ面と粘着部材１８ｂは離間した状態であり、粘着部材１８ｂの粘着面と上基板１ｂ間は所定の減圧（真空）状態になっている。この状態から、図４(ｂ)に示すように、アクチュエータ３１ｂの動作で粘着部材１８ｂを上基板面側に移動させ上基板１ｂに粘着させる（Ｓ６）。このように、上基板１ｂに粘着部材１８ｂを粘着動作させるときは、吸引吸着用の真空配管１６ｂを通じて開口３０ｂと基板面で形成された空間部も減圧した状態になっている。このため、基板と粘着部材間に空気が入ることなく、真空チャンバ内を減圧しても粘着性を保持できる。もし、開口３０ｂを減圧せずに基板と粘着部材間に空気が入いると、真空チャンバ内を減圧していくと、基板と粘着部材間の空気層が膨張することで粘着力が低下して基板を粘着保持することができなくなる。
【００２３】
また、本動作は、下基板１ａと粘着部材１８ａの間でも略同時に行われる（Ｓ６）が、前述のように下基板１ａは、重力方向でテーブル４上にあるので、粘着部材１８ａで固定せずに機械的なピンやローラで固定してもよい。
【００２４】
このように上下基板１ｂ、１ａをセットした後、図３(ｃ)に示すようにシリンダ１１により上チャンバユニット６を下降させ、下チャンバユニット５の周りに配置してあるＯリング１２に上チャンバユニット６のフランジを接触させ上下チャンバ部Ｔ１、Ｔ２を一体にする（Ｓ７）。その後、真空配管１４からチャンバ内の排気を行う（Ｓ８）。上チャンバユニット６と下チャンバユニット５が一体となった真空チャンバ内の減圧が進むにつれ、加圧板７から上基板１ｂを吸着する減圧度と真空チャンバ内の減圧度の差が小さくなり、加圧板７の吸引吸着作用は無くなるが、上基板１ｂは、粘着部材１８ｂにより保持されているので落下することはない。
【００２５】
この時、粘着部材１８ｂの粘着面と上基板１ｂ間は空気が入っていないため、粘着力が変化することなく固定状態を保持する。そのため、減圧中に空気の膨張による粘着力の低下や上基板１ｂが落下するという問題は起こらない。また、下基板１ａに対しても粘着部材１８ａの粘着面と下基板１ａ間は空気が入ることなく粘着固定されているので、空気の膨張による粘着力の低下や上基板１ｂの暴れは発生しない。
【００２６】
さて、真空チャンバ内が所定の真空度に達したら、図５(ａ)に示すように、上下両基板１ｂ、１ａの位置合わせを行いながらシャフト９上の図示していない上下駆動機構を動作させ加圧板７を降下させる。上下駆動機構の動作で、上基板１ｂが、下基板１ａの上面の外周にクローズしたパターンで塗布されたシール剤１９を隙間なく接触、または潰すことができる加圧力が加わり上下両基板１ｂ、１ａを所望間隔に貼り合わせる（Ｓ９）。図５(ａ)は、拡大した図である。この段階で、下基板１ａと上基板１ｂはシール剤１９を介して密閉されたことになるので、この後、真空チャンバ内を増圧しても、クローズしたシールパターン内は、上記した所定の減圧度が保たれ、結果、完成した貼り合わせ基板内に入り込む空気は、非常に少ないものになる。
【００２７】
次に、上記したように、真空チャンバ内をリークバルブ１７により微小に大気を導入して、吸引口７ｄ内の負圧よりも高い所定の減圧度に増圧し、その圧力差により上下それぞれの基板の保持を可能にする（Ｓ１０）。この保持力を用いて更に位置決めを行いながら所定の最終加圧力まで加圧板７で加圧する（Ｓ１１）。この動作を行う理由は、上基板１ｂがシール剤１９に接触した後の加圧過程でも位置決めを行わないと、加圧時の液晶やシール剤の抵抗により基板がずれてしまうからである。
【００２８】
因みに、基板同士の位置合わせは、上チャンバユニット６に設けた覗き窓２３ａ、２３bから画像認識カメラ２２ａ、２２bで上下各基板に設けられている位置合わせマークを読み取って画像処理により位置を計測し下チャンバＴ１の図示していないＸＹθ駆動機構を微動させて、高精度な位置合わせを行なう。この微動において、Ｏリング１２が極端に変形しないで減圧状態が維持されるように、ボールベア１３が上下チャンバユニット６、５の間隔を維持している。
【００２９】
貼り合わせ終了後、上下それぞれの基板１ｂ、１ａから粘着部材１８ｂ、１８ａを剥がす時は、図５(ｂ)に示すようにする。即ち、上基板１ｂ側は、アクチュエータ３２ｂを矢印方向に回転動作させ、粘着部材１８ｂを捻りながら、または捻ってから、アクチュエータ３１ｂを動作させて粘着部材１８ｂを基板面から退行させる。下基板１ａ側も同様に、アクチュエータ３２ａを矢印方向に回転動作させ、粘着部材１８ａを捻りながら、または捻ってから、アクチュエータ３１ａを動作させて基板面から退行させる（Ｓ１２）。上記の捻り動作は、基板から粘着部材を剥がし易くするために必要な手段である。捻り方向は、図５(ｂ)に示す方向と逆でもよい。また、粘着部材を退行させるときは、それぞれの開口３０ａ、３０ｂの周縁部がそれぞれの基板１ｂ、１ａの移動を阻止する。従って、上記した捻りと退行動作で、容易に粘着部材を基板から剥がすことができる。
【００３０】
その後、真空チャンバ内にガスパージバルブ１５を開けて窒素ガス（Ｎ_２）やクリーンドライエアー等を供給し内部をパージしつつ大気圧に戻し（Ｓ１３）、吸引口７ｄからの基板吸着を解除し加圧板７を上昇させる（Ｓ１４）。この後、上チャンバユニット６を上昇させ、下チャンバ部Ｔ１を最初の位置(図３（ａ）)の位置に移動し（Ｓ１５）、貼り合せた後のセルｐｃをテーブル４から取り出す（Ｓ１６）。貼り合わせ後の上下基板、即ちセルｐｃは、周りの大気圧で上下面が均一に押され、精度よく所定のセルギャップに到達する。以上の動作で基板の貼り合せ動作が完了する。上記大気中で所定のセルギャップになると、シール剤に光を照射して硬化させて貼り合せ作業が完了する。なお、機械的な加圧終了後（ステップＳ１２終了後）に光を照射してシール剤を仮固定する場合もある。又、粘着部材による基板の保持動作を下チャンバＴ１を移動した後で行うようにしているが、下チャンバを移動する前に行っても良い。更に、粘着部材を基板面から剥離する動作に関しても、真空チャンバ内を大気圧に戻してから行っても良い。
【００３１】
更に、上記実施形態では加圧板側の粘着部材を剥離する動作を加圧板による最終加圧が終了してから行っている。これに対して、吸引吸着による保持のできない状態（粘着保持の状態）で基板を一次加圧した後、チャンバ内を増圧して、吸引吸着で基板を保持した状態にしたときに粘着部材を、捻りながら基板面から剥離し、その後加圧板により位置合わせしながら最終加圧力を加えても良い。
【００３２】
次に、図６、図７で本発明の他の実施形態の基板貼り合わせを説明する。
【００３３】
この他の実施形態では、上下基板を前述した実施形態の如く加圧板とテーブルにセットした後、真空チャンバ内を所定の減圧状態にする。その後、図６(ａ)で説明したように、上下両基板１ｂ、１ａの位置合わせを行いながら、シャフト９上の図示していない上下駆動機構を動作させ加圧板７を降下させる。これにより、上基板１ｂが、下基板１ａの上面の外周にクローズしたパターンで塗布されたシール剤１９に接触するまで近接させる。前述した実施形態はこの後、真空チャンバ内の圧力を吸引口７ｄ内の圧力よりも高い所定の減圧度に増圧し、その圧力差により上下それぞれの基板を吸引力で保持し、更に位置決めを行いながら所定の最終加圧力まで加圧した。
【００３４】
しかし、この他の実施形態は、真空チャンバの増圧による圧力差を利用しない。即ち、加圧板７およびテーブル４の基板との接触面に、図７に示すように摩擦係数の大きい樹脂２４あるいはゴム２５を部分的に形成する。そして、加圧位置決め時に、加圧板７とテーブル４に対する基板１ａ、１ｂの水平方向の滑りを摩擦力で防止する。これにより、チャンバ内を増圧せず、そのままの減圧度を保った状態で、更に位置決めを行いながら所定の最終加圧力まで加圧板７にて加圧する。上記の樹脂２４あるいはゴム２５は、全面に形成しても良い。尚、図７は、簡略したため、吸引口、開口、粘着部材や周囲の部分は、省略してある。
【００３５】
貼り合わせ後の上下それぞれの基板から粘着部材を剥がす時および、それ以後の動作は、前述した実施形態と同様に行う。
【００３６】
本発明は以上説明した実施形態に限らず、以下の様に実施しても良い。
【００３７】
（１）粘着部材１８ｂの粘着面と上基板１ｂ間に空気が入ることなく粘着可能にするため、吸引口７ｄと開口３０ｂは通じている構造としているが、この構造とせず、粘着部材１８ｂの粘着面にも基板を吸着する１箇所以上の吸引吸着口を設け、大気中で粘着面を基板に接触させ吸着と粘着で保持した後、減圧を進める過程で発生する粘着面と基板の間の膨張した空気を直ぐに粘着面の吸引吸着手段で吸引して基板の落下を防止してもよい。この場合、開口３０ｂは、真空チャンバ内と通じさせる。尚、下基板１ａ側の構造も同様になる。また、開口３０ｂを吸引口７ｄと連通するのではなく別に負圧源と連通する構成としても良い。
【００３８】
（２）上記(１)の他の方法として、粘着部材１８ｂの粘着面を凹凸状に形成し、大気中で粘着時に凸部分に空気が入り難くし、かつ、減圧を進める過程で発生する粘着面の凸部分と基板の間の膨張した空気を直ぐに凹部分から真空チャンバ内に逃がして基板の落下を防止してもよい。この場合、開口３０ｂは、真空チャンバ内と通じさせる。尚、下基板１ａ側の構造も同様になる。
【００３９】
（３）吸引口は、加圧板７またはテーブル４にディンプル加工を行い、この溝部を利用してそれぞれの基板を吸引吸着しても良い。
【００４０】
【発明の効果】
以上説明したように本発明によれば、基板サイズが大型化、薄板化しても真空中で不良の発生がなく、かつ、高精度に同程度の基板同士を貼り合せることができる。
【図面の簡単な説明】
【図１】本発明の一実施形態を示す基板組立装置の概略断面図である。
【図２】粘着保持機構の一例の詳細図である。
【図３】基板貼り合せのフローチャートである。
【図４】上下両基板を貼り合わせる工程を示す要部の断面図である。
【図５】粘着保持機構による粘着時の動作説明図。
【図６】粘着保持機構の基板面より剥離する時の動作説明図である。
【図７】加圧板、及びテーブルに増摩擦部材を設けた場合の一例を示した図である。
【符号の説明】
１ａ…下基板、１ｂ…上基板、２…シャフト、３…真空シール、４…テーブル、５…下チャンバユニット、６…上チャンバユニット、７…加圧板、７ｃ、７ｄ…吸着口、８…ハウジング、９…シャフト、１０…フレーム、１１…シリンダ、１８…粘着部材、３０…開口、３１…上下用アクチュエータ、３２…回転用アクチュエータ。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for assembling substrates to be bonded by holding the substrates to be bonded in a vacuum chamber so as to face each other and narrowing the interval in a reduced pressure state.
[Prior art]
There are two methods for manufacturing a liquid crystal display panel. First, two glass substrates with transparent electrodes and thin film transistor arrays are bonded with an adhesive (hereinafter also referred to as a sealing agent) with a very close distance of about several μm (hereinafter, the bonded substrates are referred to as cells). This is a method of encapsulating liquid crystal in the space formed thereby. Another method is to drop the liquid crystal on one substrate drawn in a pattern in which the sealing agent is closed so as not to provide an injection port, and place the other substrate on one substrate and move the top and bottom in a vacuum. There is a method in which the substrates are brought close to each other and bonded together. By the way, as an apparatus for bonding substrates together, as described in Japanese Patent Application Laid-Open No. 2001-133745, as a method of holding the upper substrate before applying pressure, it is held by an adhesive means and the interval between the substrates is reduced. An apparatus for pasting is disclosed. Further, as a specific example, the adhesive means is a method using an adhesive sheet, and an opening provided in the pressure plate, and an actuator provided on the upper portion of the pressure plate so that the adhesive member moves up and down the opening. Is disclosed.
[0003]
[Problems to be solved by the invention]
In the prior art, the substrate is held in contact with the adhesive means in the atmosphere. When the substrate is held using the adhesive means in the atmosphere as described above, air enters between the substrate and the adhesive means due to unevenness of the substrate or deflection of the substrate, and when the pressure in the chamber is reduced, the substrate and the adhesive means In the worst case, the substrate may not be held in the worst case.
[0004]
Therefore, an object of the present invention is to provide a substrate bonding apparatus capable of securely holding a substrate on a pressure plate in order to bond the substrate with high accuracy in a high vacuum that does not cause a screen defect even when the substrate size is increased or thinned. It is to provide a method for bonding substrates.
[0005]
[Means for Solving the Problems]
A feature of the present invention that achieves the above object is that a pressure plate for holding one substrate is provided with a plurality of suction ports for suction and suction, and a plurality of adhesive means for holding the substrate by adhesion. The present invention is characterized in that a depressurizing channel for depressurizing a space formed by the provided opening and the substrate is provided. Further, the table for holding the other substrate was also provided with a plurality of suction ports and suction means for suction suction constructed as provided on the pressure plate. Further, the adhesive means is configured to press and hold the adhesive means against the substrate after the space formed by the opening provided with the adhesive means and the substrate is in a reduced pressure state.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows the overall configuration of the substrate bonding apparatus of the present invention.
In FIG. 1, a substrate assembly apparatus 100 according to the present invention includes a lower chamber portion T1 and an upper chamber portion T2, and an XYθ drive mechanism (not shown) is provided below the lower chamber portion T1. . With this XY drive mechanism, the lower chamber portion T1 can come and go in the left and right X-axis directions and the Y-axis direction orthogonal to the X-axis in the drawing. Further, the table 4 on which the lower substrate 1 a is mounted from the shaft 2 through the vacuum seal 3 can be rotated horizontally with respect to the lower chamber unit 5 by the θ drive mechanism. When the lower substrate 1 a is mounted on the table 4, the lower substrate 1 a is sucked and attracted to the suction port 7 c provided on the table 4. Note that one end of a pipe 16a is connected to the suction port 7c, and a decompression (negative pressure) source is connected to the other end via a valve (not shown). The lower substrate 1a is sucked and attracted to the suction port 7c by the negative pressure supplied from the negative pressure source.
[0007]
The upper chamber portion T2 has a configuration in which an upper chamber unit 6 and a pressure plate 7 are provided therein, and the upper chamber unit 6 and the pressure plate 7 can move up and down independently. That is, the upper chamber unit 6 has a housing 8 incorporating a linear bush and a vacuum seal, and moves in the vertical Z-axis direction by a cylinder 11 fixed to the frame 10 with a shaft 9 as a guide. The pressure plate 7 is moved up and down (Z-axis direction) by a driving device (not shown) provided on the shaft 9.
[0008]
The upper substrate 1b is sucked and adsorbed by a suction port 7d provided on the lower surface of the pressure plate 7. The suction port 7d is connected to one end of a pipe 16b, and a negative pressure source is connected to the other end of the pipe 16b via a valve (not shown). By supplying a negative pressure from the negative pressure source, the upper substrate 1b is sucked and adsorbed to the pressure plate 7.
[0009]
When the lower chamber T1 on the XYθ drive mechanism moves directly below the upper chamber T2 and the upper chamber unit 6 is lowered, the flange of the upper chamber unit 6 is attached to the O-ring 12 arranged around the lower chamber unit 5. Contact and become one. Thereby, it will be in the state which functions as a vacuum chamber. Here, the ball bearing 13 installed around the lower chamber unit 5 adjusts the amount of collapse of the O-ring 12 by vacuum, and can be set at an arbitrary position in the vertical direction. The position of the O-ring 12 is set so that the collapse amount of the O-ring 12 can maintain a predetermined reduced pressure in the vacuum chamber and the maximum elasticity is obtained. A large force generated by reducing the pressure in the chamber is received by the lower chamber unit 5 via the ball bearing 13. For this reason, the lower chamber portion T1 can be easily finely moved within the elastic range of the O-ring 12 when the upper and lower substrates to be described later are bonded to each other for precise positioning.
[0010]
The housing 8 moves up and down without causing a pressure leak with respect to the shaft 9 even if the upper chamber unit is deformed by depressurizing the inside by forming the vacuum chamber by combining the upper chamber unit 6 with the lower chamber unit 5. Built-in vacuum seal so that you can. For this reason, the force which the deformation | transformation of a vacuum chamber gives to the shaft 9 can be absorbed, and the deformation | transformation of the pressurization plate 7 supported by the shaft 9 can be prevented substantially. For this reason, it becomes possible to bond the upper substrate 1b adhered and adhered to the lower surface of the pressure plate 7 by the adhesive member 18b and the lower substrate 1a retained on the table 4 in a parallel state. As described above, the pressure plate 7 is moved up and down by a drive mechanism (not shown) installed on the upper portion of the shaft 9.
[0011]
The vacuum pipe 14 arranged on the side surface of the upper chamber unit 6 is connected to a negative pressure source by a vacuum valve and a pipe hose (not shown). These are used when the pressure in the vacuum chamber is reduced to a predetermined pressure. The leak valve 17 is provided to arbitrarily adjust the degree of vacuum (decompression) in the vacuum chamber in the pressure increasing direction. The gas purge valve and the tube 15 are connected to a pressure source such as nitrogen gas (N ₂ ) or clean dry air, and these are used when the inside of the vacuum chamber is returned to the atmospheric pressure.
[0012]
The image recognition cameras 22a and 22b are installed for reading the alignment marks provided on the upper and lower substrates 1b and 1a. Transparent viewing cameras 23a and 23b for the recognition cameras 22a and 22b are provided above the holes 6a and 6b provided in the upper chamber unit 6, and vacuum is applied so that air does not flow into the chamber from the holes 6a and 6b. Cut off. Further, the pressure plate 7 is provided with small-diameter holes 7a and 7b, and the alignment marks provided on the substrate can be seen through the holes 7a and 7b.
[0013]
Next, the adhesive section that holds the upper substrate 1b and the mechanism of the drive section will be described with reference to FIGS. FIG. 2 shows the detailed configuration of the adhesive holding mechanism.
[0014]
As shown in FIG. 2, an opening 30 is provided in the pressure plate 7 or the table 4, and a cartridge 35 having the adhesive member 18 attached in the opening 30 is attached to the end of the rotating shaft 33 in a replaceable manner. A rotation actuator 32 is provided on the other end side of the rotation shaft 33, and the rotation actuator 32 is attached to the moving table 36. In addition, one end of a vertical drive shaft 38 that moves in the vertical direction is fixed to the moving table 36 on the fixed member 37, and a vertical actuator 31 for vertical drive is provided on the other end of the vertical drive shaft 38. Further, an air passage 39 connected to a negative pressure source is provided inside the pressure plate 7 or the table 4, and the suction ports 7 d and 7 c penetrate from the air passage 39 to one surface of the pressure plate 7 and the table 4. Are provided. The airway 39 also communicates with the opening 30.
[0015]
Here, for the actuators 31 and 32 in FIG. 2, in FIG. 1, the pressure plate side is indicated by b and the table side by a. The adhesive member 18b rotates up and down in the opening 30b by the operation of the actuators 31b and 32b on the pressure plate side. The shaft 33b is sealed with a seal 34b so as to be rotatable up and down just below the actuator 31b. Further, the opening 30b communicates with the airway 39, and is connected to a negative pressure source through a valve (not shown) in the vacuum pipe 16b so that the upper substrate 1b can be sucked and adsorbed. It should be noted that the opening 30b and the suction port 7d may not be communicated with each other inside the pressure plate 7 as shown in the figure, but may be formed by forming a groove connecting the opening 30b and the suction port 7d on the surface of the pressure plate 7 that contacts the substrate. .
[0016]
The upper substrate 1b can be held in close contact with the lower surface of the adhesive member 18b without sucking and adsorbing to the lower surface of the pressure plate 7 due to its adhesive action. That is, a plurality of adhesive members 18b are added to appropriate adhesive areas, intervals, and positions according to the size and shape of the upper substrate 1b so that the upper substrate 1b can be held horizontally to the lower substrate 1a. The pressure plate 7 is provided.
[0017]
In this embodiment, the rotary actuator 32 that rotates the adhesive member 18b and the vertical actuator 31 that moves up and down are provided separately. However, a ball screw structure or the like may be used as a single actuator. In addition, it goes without saying that the actuator of this embodiment can be realized in any form using a compressed gas system or an electric system.
[0018]
Next, as described above, the lower substrate 1a is configured to be sucked and sucked on the table 4 from the suction port 7c to the pipe 16a through a valve (not shown) and a negative pressure source. Furthermore, in this embodiment, the adhesive member 18a is built in with the same structure as the pressure plate 7. Actuators 31 a and 32 a are attached below a plurality of openings 30 a provided in the table 4. An adhesive member 18a is provided at the tip of a shaft 33a extending upward from the actuators 31a and 32a. The adhesive member 18a rotates up and down in the opening 30a by the operation of the actuators 31a and 32a. As with the shaft 33b, the shaft 33a is sealed by a seal 34a so as to be rotatable up and down immediately above the actuator 31a. Further, the opening 30a communicates with the suction port 7c and is connected to a negative pressure source via a valve (not shown) in the pipe 16a so that the lower substrate 1a can be sucked and adsorbed.
[0019]
The adhesive member 18a is also provided on the table 4 at an appropriate adhesive area, interval, and position according to the size and shape of the lower substrate 1a so that the lower substrate 1a can be stably held. In order to fix the substrate to the table 4, a mechanical pin or roller may be used instead of using the adhesive member 18a. The reason why the lower substrate 1a is fixed with adhesive, pins, or rollers other than suction adsorption is that the degree of vacuum (decompression) in the chamber is higher than the degree of vacuum (decompression) in which the substrate is sucked and adsorbed in the process of depressurizing the chamber. When the height is increased, the lower substrate 1a cannot be fixed to the table 4 by a pressure difference. Therefore, the lower substrate 1a is prevented from shifting due to vibrations from various driving sources of the device itself, floors, negative pressure sources, and other vibration sources, or resistance when the upper and lower substrates are bonded to each other and the seals and liquid crystals are in contact with each other. Therefore, the lower substrate 1a is held by an adhesive or a mechanical pin or roller.
[0020]
Next, with reference to FIGS. 3 to 6, the process of bonding substrates with the substrate assembly apparatus will be described. FIG. 3 shows a flowchart of the substrate bonding operation. FIG. 4 shows the operating state of the apparatus. FIG. 5 shows the movement of the adhesive support mechanism during substrate bonding. FIG. 6 shows an explanatory view of the operation of peeling the adhesive support mechanism from the substrate surface after the primary bonding.
[0021]
First, the upper substrate 1b is carried under the pressure plate 7 by a robot hand or the like (S1). Thereafter, the upper substrate 1b is sucked and held by supplying a negative pressure to the suction suction port provided on the pressure plate 7 (S2). The lower substrate 1a is carried onto the table 4 by a robot hand or the like (S3), positioned with respect to the table 4, and then fixed by suction suction (S4). A sealing agent 19 is applied in a closed pattern on the outer periphery of the upper surface of the lower substrate 1a, and an appropriate amount of liquid crystal 20 is dropped inside. In this embodiment, the sealing agent 19 is provided on the lower substrate 1a, but may be provided on the upper substrate or both substrates. This state is shown in FIG.
[0022]
Thereafter, the lower chamber portion T1 is moved to the position of the upper chamber portion T2 (S5). FIG. 4B shows a state in which the lower chamber portion T1 on the XYθ drive mechanism moves directly below the upper chamber portion T2, and the lower substrate 1a and the upper substrate 1b face each other. As described above, the upper substrate 1b is already held on the pressure plate 7 by suction suction from the suction port 7d. Furthermore, since the opening 30b is configured to communicate with the negative pressure source, the opening 30b is also sucked and adsorbed. At this time, as shown in FIG. 5A, the adhesive member 18b is in a state where the upper substrate 1b surface and the adhesive member 18b are separated from each other, and a predetermined reduced pressure (vacuum) state is provided between the adhesive surface of the adhesive member 18b and the upper substrate 1b. It has become. From this state, as shown in FIG. 4B, the adhesive member 18b is moved to the upper substrate surface side by the operation of the actuator 31b to adhere to the upper substrate 1b (S6). In this manner, when the adhesive member 18b is adhered to the upper substrate 1b, the space formed by the opening 30b and the substrate surface is also decompressed through the vacuum pipe 16b for suction and adsorption. For this reason, adhesiveness can be maintained even if the inside of the vacuum chamber is decompressed without air entering between the substrate and the adhesive member. If air enters between the substrate and the adhesive member without depressurizing the opening 30b, the air pressure between the substrate and the adhesive member expands when the pressure in the vacuum chamber is reduced. The substrate cannot be adhered and held.
[0023]
In addition, this operation is performed almost simultaneously between the lower substrate 1a and the adhesive member 18a (S6). However, since the lower substrate 1a is on the table 4 in the direction of gravity as described above, the lower substrate 1a is fixed by the adhesive member 18a. Instead, it may be fixed with mechanical pins or rollers.
[0024]
After the upper and lower substrates 1b and 1a are set in this way, the upper chamber unit 6 is lowered by the cylinder 11 as shown in FIG. 3 (c), and the upper chamber is placed on the O-ring 12 arranged around the lower chamber unit 5. The flanges of the unit 6 are brought into contact with each other so that the upper and lower chamber portions T1 and T2 are integrated (S7). Thereafter, the inside of the chamber is evacuated from the vacuum pipe 14 (S8). As the pressure reduction in the vacuum chamber in which the upper chamber unit 6 and the lower chamber unit 5 are integrated proceeds, the difference between the pressure reduction degree that adsorbs the upper substrate 1b from the pressure plate 7 and the pressure reduction degree in the vacuum chamber becomes smaller. 7 is eliminated, but the upper substrate 1b is not dropped because it is held by the adhesive member 18b.
[0025]
At this time, since air does not enter between the adhesive surface of the adhesive member 18b and the upper substrate 1b, the fixed state is maintained without changing the adhesive force. Therefore, problems such as a decrease in adhesive force due to the expansion of air and a drop of the upper substrate 1b during decompression do not occur. In addition, since the adhesive surface of the adhesive member 18a and the lower substrate 1a are adhesively fixed to the lower substrate 1a without air entering, there is no decrease in the adhesive force due to the expansion of air and the ramping of the upper substrate 1b. .
[0026]
When the vacuum chamber reaches a predetermined degree of vacuum, as shown in FIG. 5 (a), the vertical drive mechanism (not shown) on the shaft 9 is operated while aligning the upper and lower substrates 1b and 1a. The pressure plate 7 is lowered. By the operation of the vertical drive mechanism, the upper substrate 1b is applied with a pressing force capable of contacting or crushing the sealing agent 19 applied in a closed pattern on the outer periphery of the upper surface of the lower substrate 1a without any gaps. Are pasted at desired intervals (S9). FIG. 5A is an enlarged view. At this stage, the lower substrate 1a and the upper substrate 1b are sealed through the sealant 19, so that even if the pressure in the vacuum chamber is increased thereafter, the closed seal pattern has the above-described predetermined pressure reduction. As a result, the amount of air entering the finished bonded substrate is very small.
[0027]
Next, as described above, the atmosphere is slightly introduced into the vacuum chamber by the leak valve 17, and the pressure is increased to a predetermined degree of decompression higher than the negative pressure in the suction port 7d. Can be held (S10). While further positioning is performed using this holding force, the pressure plate 7 is pressurized to a predetermined final pressure (S11). The reason for performing this operation is that if the positioning is not performed even during the pressurizing process after the upper substrate 1b contacts the sealing agent 19, the substrate is displaced due to the resistance of the liquid crystal or the sealing agent at the time of pressing.
[0028]
Incidentally, the alignment of the substrates is measured by reading the alignment marks provided on the upper and lower substrates with the image recognition cameras 22a and 22b from the observation windows 23a and 23b provided in the upper chamber unit 6, and measuring the positions by image processing. The XYθ drive mechanism (not shown) of the lower chamber T1 is finely moved to perform highly accurate alignment. In this fine movement, the ball bear 13 maintains the space between the upper and lower chamber units 6 and 5 so that the reduced pressure state is maintained without the O-ring 12 being deformed extremely.
[0029]
When the adhesive members 18b and 18a are peeled off from the upper and lower substrates 1b and 1a after completion of the bonding, respectively, as shown in FIG. That is, on the upper substrate 1b side, the actuator 32b is rotated in the direction of the arrow, and while the adhesive member 18b is twisted or twisted, the actuator 31b is operated to retract the adhesive member 18b from the substrate surface. Similarly, on the lower substrate 1a side, the actuator 32a is rotated in the direction of the arrow, and while twisting or twisting the adhesive member 18a, the actuator 31a is operated to retract from the substrate surface (S12). The above twisting operation is a means necessary for facilitating the peeling of the adhesive member from the substrate. The twisting direction may be opposite to the direction shown in FIG. Further, when the adhesive member is retracted, the peripheral portions of the respective openings 30a and 30b prevent the movement of the respective substrates 1b and 1a. Therefore, the adhesive member can be easily peeled from the substrate by the twisting and retraction operations described above.
[0030]
Thereafter, the gas purge valve 15 is opened in the vacuum chamber to supply nitrogen gas (N ₂ ), clean dry air, etc., and the inside is purged to return to the atmospheric pressure (S13), and the suction of the substrate from the suction port 7d is released. The pressure plate 7 is raised (S14). Thereafter, the upper chamber unit 6 is raised, the lower chamber portion T1 is moved to the initial position (FIG. 3A) (S15), and the bonded cell pc is taken out from the table 4 (S16). . The upper and lower substrates after bonding, that is, the cells pc, are uniformly pressed at the upper and lower surfaces by the surrounding atmospheric pressure, and reach a predetermined cell gap with high accuracy. The above operation completes the substrate bonding operation. When the predetermined cell gap is reached in the atmosphere, the sealing agent is irradiated with light and cured to complete the bonding operation. In some cases, the sealing agent is temporarily fixed by irradiating light after completion of mechanical pressurization (after completion of step S12). Further, the holding operation of the substrate by the adhesive member is performed after moving the lower chamber T1, but may be performed before moving the lower chamber. Further, the operation of peeling the adhesive member from the substrate surface may be performed after the inside of the vacuum chamber is returned to the atmospheric pressure.
[0031]
Furthermore, in the said embodiment, the operation | movement which peels the adhesive member by the side of a pressure plate is performed after the final pressurization by a pressure plate is complete | finished. On the other hand, after first pressurizing the substrate in a state where it cannot be held by suction adsorption (adhesion holding state), the pressure inside the chamber is increased, and when the substrate is held by suction suction, the adhesive member is It may be peeled off from the substrate surface while twisting, and then the final pressure may be applied while aligning with a pressure plate.
[0032]
Next, substrate bonding according to another embodiment of the present invention will be described with reference to FIGS.
[0033]
In this other embodiment, the upper and lower substrates are set on the pressure plate and the table as in the above-described embodiment, and then the inside of the vacuum chamber is brought into a predetermined reduced pressure state. Thereafter, as described with reference to FIG. 6 (a), while aligning the upper and lower substrates 1b and 1a, the vertical driving mechanism (not shown) on the shaft 9 is operated to lower the pressure plate 7. Thus, the upper substrate 1b is brought close to contact with the sealing agent 19 applied in a closed pattern on the outer periphery of the upper surface of the lower substrate 1a. In the embodiment described above, thereafter, the pressure in the vacuum chamber is increased to a predetermined degree of decompression higher than the pressure in the suction port 7d, the upper and lower substrates are held by suction force by the pressure difference, and further positioning is performed. The pressure was increased to a predetermined final pressure.
[0034]
However, this other embodiment does not utilize the pressure difference due to the increased pressure in the vacuum chamber. That is, a resin 24 or a rubber 25 having a large friction coefficient is partially formed on the contact surface between the pressure plate 7 and the table 4 as shown in FIG. And at the time of pressurization positioning, the horizontal slip of the board | substrates 1a and 1b with respect to the pressurization board 7 and the table 4 is prevented with a frictional force. As a result, without increasing the pressure in the chamber, the pressure plate 7 is pressurized to a predetermined final pressing force while further positioning is performed in a state where the degree of pressure reduction is maintained. The resin 24 or rubber 25 may be formed on the entire surface. Since FIG. 7 is simplified, the suction port, the opening, the adhesive member, and the surrounding portion are omitted.
[0035]
When the adhesive member is peeled off from the upper and lower substrates after bonding, and the subsequent operation is performed in the same manner as in the above-described embodiment.
[0036]
The present invention is not limited to the embodiment described above, and may be implemented as follows.
[0037]
(1) The suction port 7d and the opening 30b are connected to each other without allowing air to enter between the adhesive surface of the adhesive member 18b and the upper substrate 1b. The adhesive surface is also provided with one or more suction suction ports for adsorbing the substrate, and the adhesive surface is brought into contact with the substrate in the atmosphere and held by adsorption and adhesion, and then the pressure between the adhesion surface and the substrate generated in the process of depressurization. The expanded air may be immediately sucked by suction suction means on the adhesive surface to prevent the substrate from falling. In this case, the opening 30b communicates with the inside of the vacuum chamber. The structure on the lower substrate 1a side is the same. Further, the opening 30b may be communicated with a negative pressure source instead of communicating with the suction port 7d.
[0038]
(2) As another method of (1) above, the pressure-sensitive adhesive surface of the pressure-sensitive adhesive member 18b is formed in a concavo-convex shape, making it difficult for air to enter the convex portion during pressure-bonding in the atmosphere, and pressure-sensitive adhesive generated in the process of depressurization The expanded air between the convex portion of the surface and the substrate may be immediately released from the concave portion into the vacuum chamber to prevent the substrate from dropping. In this case, the opening 30b communicates with the inside of the vacuum chamber. The structure on the lower substrate 1a side is the same.
[0039]
(3) The suction port may perform dimple processing on the pressure plate 7 or the table 4 and suction and suck each substrate using this groove.
[0040]
【The invention's effect】
As described above, according to the present invention, even if the substrate size is increased or reduced in thickness, there is no occurrence of a defect in a vacuum, and substrates of the same degree can be bonded with high accuracy.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a board assembly apparatus showing an embodiment of the present invention.
FIG. 2 is a detailed view of an example of an adhesive holding mechanism.
FIG. 3 is a flowchart of substrate bonding.
FIG. 4 is a cross-sectional view of a main part showing a step of bonding the upper and lower substrates together.
FIG. 5 is an explanatory diagram of an operation during adhesion by the adhesion holding mechanism.
FIG. 6 is an operation explanatory diagram when peeling from the substrate surface of the adhesive holding mechanism.
FIG. 7 is a view showing an example when a friction increasing member is provided on a pressure plate and a table.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1a ... Lower substrate, 1b ... Upper substrate, 2 ... Shaft, 3 ... Vacuum seal, 4 ... Table, 5 ... Lower chamber unit, 6 ... Upper chamber unit, 7 ... Pressure plate, 7c, 7d ... Adsorption port, 8 ... Housing , 9 ... shaft, 10 ... frame, 11 ... cylinder, 18 ... adhesive member, 30 ... opening, 31 ... vertical actuator, 32 ... rotary actuator.

Claims

One of substrates bonded held by the adhesive holding mechanism provided in the pressure plate side, be bonded to hold the other substrate on the table to face, in an atmosphere under reduced pressure by an adhesive provided without Re of the substrate have In the method of assembling the substrates to be bonded together with a narrow interval,
The substrate of the one sucked adsorbed by the action of suction the suction force in the air, and holding the substrate with the adhesive member by operating the adhesive holding mechanism in this state, the two substrates to the inside of the chamber to a predetermined vacuum state Bonding is performed with a predetermined pressure, and then the inside of the chamber is pressurized to create an atmosphere in which a suction adsorption force acts, and then the adhesive holding mechanism is driven in a state where the pressure is applied to drive the adhesion from the substrate surface. A method for assembling a substrate, comprising peeling off an adhesive member .

The method of assembling a substrate according to claim 1.
When the adhesive member is peeled from the substrate surface, the adhesive member mounting shaft provided in the adhesive holding mechanism is driven to twist or peel the adhesive member while twisting the adhesive member. Assembly method.

One substrate to be bonded is held by an adhesive holding mechanism provided on the pressure plate side, the other substrate to be bonded is held on the table so as to face each other, and the pressure is reduced in an atmosphere reduced by an adhesive provided on one of the substrates. In the method of assembling the substrates to be bonded together,
One substrate is held by an adhesive means built in the pressure plate, and the pressure in the chamber is reduced to a predetermined degree of decompression, and then the pressure plate is operated to paste the adhesive provided on one of the substrates. After the alignment, the degree of decompression in the chamber is increased until the substrate can be sucked and held by suction, and the alignment mark is observed in the sucked and sucked state, and further reaches a predetermined pressure with the pressure plate while aligning the positions. A method for assembling a substrate, wherein the pressure-sensitive adhesive agent is retreated while being twisted.

A pressure plate for holding one substrate to be bonded, an adhesive holding mechanism provided on the pressure plate side, a table for holding the other substrate to be bonded, and a drive mechanism provided on at least one of the pressure plate or the table In the substrate assembly apparatus that performs bonding in an atmosphere reduced by an adhesive provided on at least one substrate by narrowing the interval between the substrates,
The pressure plate is provided with a plurality of suction ports for holding the substrate by negative pressure, and is provided with a gas flow path that communicates from the suction port to an opening that houses the adhesive member of the adhesive holding mechanism. A substrate assembly apparatus comprising: an adhesive member that holds a substrate; and a drive mechanism that retracts the adhesive member while twisting the substrate from the substrate surface while pressing the pressure plate surface against the substrate surface.

The board assembly apparatus according to claim 4, wherein
A substrate assembly apparatus, wherein the adhesive holding mechanism is also provided on the table side.

In the board | substrate assembly apparatus of Claim 5,
A substrate assembling apparatus, wherein the pressure plate and the table are partially provided with resin or rubber having a large friction coefficient.