CN107851603B - Substrate mounting method, film forming method, and method for manufacturing electronic device - Google Patents

Substrate mounting method, film forming method, and method for manufacturing electronic device Download PDF

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Publication number
CN107851603B
CN107851603B CN201780002058.1A CN201780002058A CN107851603B CN 107851603 B CN107851603 B CN 107851603B CN 201780002058 A CN201780002058 A CN 201780002058A CN 107851603 B CN107851603 B CN 107851603B
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China
Prior art keywords
substrate
clamping
mounting
state
mask
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CN201780002058.1A
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CN107851603A (en
Inventor
石井博
铃木健太郎
鸟泻光太郎
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Canon Tokki Corp
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Canon Tokki Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Abstract

A substrate mounting method for mounting a substrate on a mounting body, comprising: a first clamping step of clamping a peripheral edge portion of the substrate by a clamping mechanism; a releasing step of releasing the clamping of the substrate by the clamping mechanism; and a second clamping step of clamping the peripheral edge portion of the substrate by a clamping mechanism in a state where the substrate is placed on the placement body after the releasing step. This improves the adhesion between the large-sized and thin substrate and the mask in a simple manner.

Description

Substrate mounting method, film forming method, and method for manufacturing electronic device
Technical Field
The invention relates to a substrate mounting method, a film forming method, a method for manufacturing an electronic device, a substrate mounting apparatus, and a film forming apparatus.
Background
In recent years, the size and thickness of the substrate have been increased, and the influence of the warpage due to the weight of the substrate has been increased. In addition, since the film formation region is provided in the central portion of the substrate, the region capable of holding the substrate is limited to the peripheral portion of the substrate.
Therefore, when the substrate is placed on the mask with the peripheral portion (for example, a pair of opposing side portions) of the substrate held between the substrate supports, the substrate held at the peripheral portion is prevented from freely moving when the central portion bent by the weight of the substrate comes into contact with the mask, and the substrate is distorted.
This distortion causes a gap between the mask and the substrate, which reduces the adhesion between the mask and the substrate, resulting in film blur or the like.
Therefore, for example, in order to make the substrate and the mask adhere to each other well even if the substrate or the like is large, a technique as disclosed in patent document 1 has been proposed, but further improvement is desired.
In addition, when a film is formed without sandwiching a substrate placed on a mask, the substrate vibrates due to vibration generated by movement of an evaporation source and a conveyance mechanism driven in a film forming apparatus, and the substrate and the mask rub against each other along with the vibration, and a processing surface of the substrate may be damaged.
[ Prior art documents ]
[ patent document ]
Patent document 1: japanese patent laid-open publication No. 2009-277655
Disclosure of Invention
The present invention has been made in view of the above-described situation, and provides a technique capable of improving the adhesion between a large-sized and thin-sized substrate and a mask by a simple method.
A first aspect of the present invention provides a substrate mounting method for mounting a substrate on a mounting body, wherein a peripheral portion of the substrate is held by a holding mechanism in a state where the substrate is mounted on the mounting body.
A second aspect of the present invention provides a film forming method for forming a film in a predetermined pattern on a substrate, including the step of placing the substrate on the mounting body by the substrate mounting method of the first aspect; and a step of forming a film on the substrate.
A third aspect of the present invention provides a method for manufacturing an electronic device having an organic film formed on a substrate, wherein the organic film is formed by the film forming method of the third aspect.
A fourth aspect of the present invention provides a substrate mounting apparatus for mounting a substrate on a mounting body, comprising: a substrate holding unit having a clamping mechanism for clamping a peripheral edge portion of the substrate; and a control unit that controls the substrate holding unit to shift from a released state in which the chucking mechanism does not chuck the substrate to a chucked state in which the chucking mechanism chucks the substrate in a state in which the substrate is mounted on the mounting body.
A fifth aspect of the present invention provides a film forming apparatus for forming a film of a predetermined pattern on a substrate, comprising: a substrate mounting apparatus according to a fourth aspect for mounting the substrate on a mounting body; and a means for forming a film on the substrate.
The present invention is made in view of the above circumstances, and an object of the present invention is to provide a method for improving adhesion between a large-sized and thin-sized substrate and a mask.
Drawings
Fig. 1 is a sectional view schematically showing a substrate mounting apparatus according to embodiment 1.
Fig. 2 is a sectional view schematically showing a clamping mechanism according to embodiment 1.
Fig. 3 is an explanatory view of the substrate mounting method of example 1.
Fig. 4 is an explanatory view of the substrate mounting method of example 1.
Fig. 5 is an explanatory view of the substrate mounting method of example 1.
Fig. 6 is an explanatory view of the substrate mounting method of example 1.
Fig. 7 is an explanatory view of the substrate mounting method of example 1.
Fig. 8 is an explanatory view of the substrate mounting method of example 1.
Fig. 9 is a sectional view schematically showing a substrate mounting apparatus according to example 2.
Fig. 10 is an explanatory view of a substrate mounting method of example 2.
Fig. 11 is an explanatory view of a substrate mounting method of example 2.
Fig. 12 is an explanatory view of a substrate mounting method of example 2.
Fig. 13 is an explanatory view of a substrate mounting method of example 2.
Fig. 14 is an explanatory view of a substrate mounting method of example 2.
Fig. 15 is an explanatory view of a substrate mounting method of example 2.
Fig. 16 is an explanatory view of a substrate mounting method of example 3.
Fig. 17 is an explanatory view of a substrate mounting method of example 3.
Fig. 18 is an explanatory view of a substrate mounting method of example 3.
Fig. 19 is an explanatory view of a substrate mounting method of example 3.
Fig. 20 is an explanatory view of a substrate mounting method of example 4.
Fig. 21 is an explanatory view of a substrate mounting method of example 5.
Fig. 22 is an explanatory view of a substrate mounting method of example 6.
Fig. 23 is a plan view schematically showing a part of an apparatus for manufacturing an electronic device.
FIG. 24 is a sectional view schematically showing the structure of a film forming apparatus.
Fig. 25 is a perspective view of the substrate holding member.
Fig. 26 (a) is a perspective view of the organic EL display device, and (b) is a cross-sectional structural view of one pixel.
Fig. 27 is a modification of the second alignment process of embodiment 3.
Fig. 28 is a modification of the second alignment process of embodiment 3.
Fig. 29 is a modification of the second alignment process of embodiment 3.
Fig. 30 is a modification of the second alignment process of embodiment 3.
(symbol description)
1. 20: a mask; 2. 10: a substrate; 6. 210: a substrate holding member; 7. 300, and (2) 300: a support tool; 8. 302: a pressing tool; 60: an organic EL display device.
Detailed Description
Preferred embodiments and examples of the present invention will be described below with reference to the accompanying drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, the process flow, the manufacturing conditions, the dimensions, the materials, the shapes, and the like are not particularly limited, and the scope of the present invention is not limited thereto.
The present invention relates to a film deposition apparatus for forming a thin film on a substrate and a control method thereof, and more particularly to a technique for highly accurate conveyance and position adjustment of a substrate. The present invention can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern on the surface of a substrate, which is a parallel flat plate, by vacuum evaporation. As a material of the substrate, any material such as glass, resin, metal, or the like can be selected, and as a vapor deposition material, any material such as an organic material, an inorganic material (metal, metal oxide, or the like) can be selected. The technique of the present invention is specifically applicable to manufacturing apparatuses for organic electronic devices (e.g., organic EL display devices, thin-film solar cells), optical components, and the like. In particular, the manufacturing apparatus of the organic EL display device is one of preferable application examples of the present invention because the substrate is increased in size or the display panel is highly refined, and further improvement in the accuracy of substrate conveyance and the accuracy of alignment between the substrate and the mask is required.
< manufacturing apparatus and manufacturing Process >
Fig. 23 is a plan view schematically showing a part of the structure of an apparatus for manufacturing an electronic device. The manufacturing apparatus of fig. 23 is used for manufacturing a display panel of an organic EL display device for a smart phone, for example. In the case of a display panel for a smartphone, for example, a plurality of small-sized panels are produced by forming organic EL films on a substrate having a size of about 1800mm × about 1500mm and a thickness of about 0.5mm, and then cutting the substrate.
As shown in fig. 23, the electronic device manufacturing apparatus generally includes a plurality of film forming chambers 111 and 112 and a transfer chamber 110. A transfer robot 119 that holds and transfers the substrate 10 is provided in the transfer chamber 110. The transfer robot 119 is, for example, a robot having a structure in which a robot for holding a substrate is attached to a multi-joint arm, and carries in/out the substrate 10 to/from each film forming chamber.
Each of the film forming chambers 111 and 112 is provided with a film forming device (also referred to as a vapor deposition device). The film deposition apparatus automatically performs a series of film deposition processes, such as delivering and receiving the substrate 10 to and from the transfer robot 119, adjusting (aligning) the relative positions of the substrate 10 and the mask, fixing the substrate 10 to the mask, and performing film deposition (vapor deposition). The film forming apparatuses in the respective film forming chambers have slightly different portions such as differences in vapor deposition sources and differences in masks, but have a substantially common basic structure (particularly, a structure relating to transfer and alignment of substrates). The common structure of the film forming apparatuses in the respective film forming chambers will be described below.
< film Forming apparatus >
FIG. 24 is a sectional view schematically showing the structure of a film forming apparatus. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction is used. In the film formation, the substrate is fixed so as to be parallel to a horizontal plane (XY plane), the width direction (direction parallel to the short side) of the substrate at this time is the X direction, and the length direction (direction parallel to the long side) is the Y direction. In addition, the rotation angle around the Z axis is represented by θ.
The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen. The vacuum chamber 200 is provided with a substrate holding member 210, a mask 220, a mask stage 221, a cooling plate 230, and a vapor deposition source 240. The substrate holding member 210 is a unit that holds and transports the substrate 10 received from the transport robot 119, and is also referred to as a substrate holder. The mask 220 is a metal mask having an opening pattern corresponding to a thin film pattern to be formed on the substrate 10, and is fixed on a frame-shaped mask stage 221. During film formation, the substrate 10 is placed on the mask 220. Therefore, the mask 220 also plays a role as a carrier on which the substrate 10 is mounted. The cooling plate 230 is a plate member having a function of pressing the substrate 10 against (a surface of) the mask 220 to bring the substrate 10 into close contact with the mask 220, and a function of suppressing the deterioration of the organic material by suppressing the temperature rise of the substrate 10 at the time of film formation. The cooling plate 230 may also function as a magnet plate. The magnet plate is a member that attracts the mask 220 by magnetic force to improve the adhesion between the substrate 10 and the mask 220 during film formation. The vapor deposition source 240 includes a vapor deposition material, a heater, a shutter, a driving mechanism for an evaporation source, an evaporation rate monitor, and the like (all not shown).
A substrate Z actuator 250, a chuck Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), and a θ actuator (not shown) are provided above (outside) the vacuum chamber 200. These actuators are constituted by, for example, a motor and a ball screw, a motor and a linear guide, and the like. The substrate Z actuator 250 is a driving unit for raising and lowering (moving in the Z direction) the entire substrate holding member 210. The chuck Z actuator 251 is a driving unit for opening and closing a chucking mechanism (described later) of the substrate holding member 210. The cooling plate Z actuator 252 is a driving unit for raising and lowering the cooling plate 230. The X actuator, the Y actuator, and the θ actuator (hereinafter collectively referred to as "XY θ actuator") are driving units for alignment of the substrate 10. The XY θ actuator moves the entire substrate holding member 210 and cooling plate 230 in the X direction, the Y direction, and θ rotation. In the present embodiment, X, Y and θ of the substrate 10 are adjusted with the mask 220 fixed, but the alignment of the substrate 10 and the mask 220 may be performed by adjusting the position of the mask 220 or adjusting the positions of both the substrate 10 and the mask 220.
Cameras 260 and 261 for measuring the positions of the substrate 10 and the mask 220 are provided above (outside) the vacuum chamber 200 to align the substrate 10 and the mask 220. The cameras 260 and 261 photograph the substrate 10 and the mask 220 through windows provided in the vacuum chamber 200. By recognizing the alignment marks on the substrate 10 and the alignment marks on the mask 220 from the images thereof, the relative offsets in the XY position and the XY plane can be measured, respectively. In order to achieve alignment with high accuracy in a short time, two-stage alignment, that is, a first alignment in which position alignment is roughly performed (also referred to as "rough alignment") and a second alignment in which position alignment is performed with high accuracy (also referred to as "fine alignment"), is preferably performed. In this case, two cameras, i.e., a first alignment camera 260 having a low resolution and a wide field of view and a second alignment camera 261 having a narrow field of view and a high resolution, may be used. In the present embodiment, the alignment marks added to two portions of a pair of opposing sides are measured by two first alignment cameras 260 and the alignment marks added to four corners of the substrate 10 and the mask 220 are measured by four second alignment cameras 261, respectively, with respect to the substrate 10 and the mask 220.
The film forming apparatus includes a control unit 270. The controller 270 has functions of controlling the substrate Z actuator 250, the jig Z actuator 251, the cooling plate Z actuator 252, the XY θ actuator, and the cameras 260 and 261, as well as functions of carrying and aligning the substrate 10, controlling the vapor deposition source, controlling the film formation, and the like. The control unit 270 can be configured by a computer having a processor, a memory, a storage device, an I/O, and the like, for example. In this case, the functions of the control section 270 are realized by the processor executing a program stored in the memory or the storage device. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, a part or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or an FPGA. The controller 270 may be provided for each of the film forming apparatuses, or a plurality of film forming apparatuses may be controlled by one controller 270.
Further, the components related to holding/conveying and alignment of the substrate 10 (the substrate holding member 210, the substrate Z actuator 250, the jig Z actuator 251, the XY θ actuator, the cameras 260, 261, the control section 270, and the like) are also referred to as a "substrate placing device", a "substrate chucking device", a "substrate conveying device", and the like.
< substrate holding Member >
Referring to fig. 25, the structure of the substrate holding member 210 will be described. Fig. 25 is a perspective view of the substrate holding member 210.
The substrate holding member 210 is a unit that holds/conveys the substrate 10 by clamping the peripheral edge of the substrate 10 by a clamping mechanism. Specifically, the substrate holding member 210 includes: a support frame 301 provided with a plurality of support tools 300 for supporting four sides of the substrate 10 from below; and a jig member 303 provided with a plurality of pressing tools 302 for sandwiching the substrate 10 between the supporting tools 300. A clamping mechanism is constituted by a pair of supporting means 300 and pressing means 302. In the example of fig. 25, three support tools 300 are arranged along the short sides of the substrate 10, six clamping mechanisms (pairs of the support tools 300 and the pressing tools 302) are arranged along the long sides, and two long sides are clamped. However, the configuration of the chucking mechanism is not limited to the example of fig. 25, and the number and arrangement of the chucking mechanisms may be appropriately changed in accordance with the size and shape of the substrate to be processed, the film deposition conditions, and the like. Further, the support tool 300 is also referred to as a "receiving claw" or "finger", and the pressing tool 302 is also referred to as a "gripper".
For example, the substrate 10 is delivered from the transfer robot 119 to the substrate holding member 210 as follows. First, the gripper Z actuator 251 raises the gripper member 303, and the pressing tool 302 is separated from the supporting tool 300, thereby bringing the gripping mechanism into the released state. After the substrate 10 is introduced between the supporting tool 300 and the pressing tool 302 by the transfer robot 119, the jig member 303 is lowered by the jig Z actuator 251, and the pressing tool 302 is pressed against the supporting tool 300 with a predetermined pressing force. Thereby, the substrate 10 is clamped between the pressing tool 302 and the supporting tool 300. In this state, the substrate holding member 210 is driven by the substrate Z actuator 250, whereby the substrate 10 can be moved up and down (moved in the Z direction). Further, the chuck Z actuator 251 is raised/lowered together with the substrate holding member 210, so even if the substrate holding member 210 is raised/lowered, the state of the chucking mechanism does not change.
In fig. 25, reference numeral 101 denotes a second alignment mark attached to four corners of the substrate 10, and reference numeral 102 denotes a first alignment mark attached to the center of the short side of the substrate 10.
< example 1>
A substrate mounting method according to example 1 of the present invention will be briefly described with reference to fig. 1 to 8. Fig. 1 to 8 are schematic views showing a substrate holding member 6 of a film deposition apparatus and a portion of a mask 1 as a carrier for a substrate 2 for convenience of explanation.
Example 1 is a substrate mounting method for mounting a substrate 2 on a mask 1 as a mounting body, and is characterized in that a peripheral portion of the substrate 2 is held by a holding mechanism of a substrate holding member 6 in a state where the substrate 2 is mounted on the mask 1. In other words, example 1 is the following method: after at least a part of the substrate 2 is placed on the mask 1, the substrate holding member 6 is controlled by the control section so that the chucking mechanism is shifted from the released state (non-chucked state) to the chucked state. By holding the peripheral edge portion of the substrate 2 in a state where the substrate 2 is placed on the mask 1, the warp (distortion) of the substrate 2 can be corrected.
That is, since the substrate 2 is bent by its own weight, when the substrate 2 and the mask 1 are relatively brought close to each other, the central portion of the substrate comes into contact with the mask 1 in advance. At this time, the peripheral edge portion of the substrate 2 is not clamped, so that the deformation of the substrate 2 due to the contact with the mask 1 is not inhibited by the clamping mechanism, and the substrate 2 is stretched outward. This enables the substrate 2 to be satisfactorily placed along the mask 1, and the substrate 2 can be held in close contact with the mask 1 without being distorted.
Therefore, film formation can be performed in a state where the substrate 2 is favorably brought into close contact with the mask 1 without a gap, and film blur caused by a decrease in the close contact between the mask 1 and the substrate 2 can be eliminated. Further, since the peripheral edge portion of the substrate 2 is held by the holding mechanism in a state where the substrate 2 is placed on the mask 1, friction between the mask 1 and the substrate 2 due to vibration generated inside the film deposition apparatus is prevented, and damage to the processing surface of the substrate 2 can be prevented.
Here, "a state in which the substrate 2 is placed on the mask (carrier) 1" means a state in which at least a part of the substrate 2 is in contact with the mask 1. That is, the "state in which the substrate 2 is placed on the mask 1" includes a state at any time point of "a time point at which the substrate 2 and the mask 1 start to contact" when the substrate 2 and the mask 1 are relatively brought close to each other, a time point (fig. 7) at which a contact area between the substrate 2 and the mask 1 increases as compared with the time point at which the contact starts to approach, and a time point (fig. 8) at which the entire substrate 2 is placed on the mask 1 as the substrate 2 approaches further. In view of the adhesion between the substrate 2 and the mask 1 after the substrate is placed, the state of fig. 7 is more preferable than the state of fig. 6, and the state of fig. 8 is more preferable with respect to the timing of sandwiching the peripheral portion of the substrate 2.
In the present embodiment, the present invention is applied to a film deposition apparatus in which a substrate 2 and a film deposition mask 1 having an opening for defining a film deposition pattern are disposed in a vacuum chamber 5 and a film deposition mechanism is used to perform film deposition.
Specifically, a mask 1 as a carrier is disposed in a vacuum chamber 5 in a state of being supported by a mask stage 4, and a moving mechanism 3 for changing a relative distance between the mask 1 and a substrate 2 is provided.
The mounting member may be a member other than the mask 1, such as a mounting table, on which the substrate 2 is temporarily mounted in order to eliminate warpage (distortion) of the substrate 2. In this case, the substrate 2 held in a state where the warp or the like is corrected before being placed on the mask 1 can be placed on the mask 1, and the substrate 2 and the mask 1 can be brought into good close contact with each other.
The fixed portion of the moving mechanism 3 is attached to the wall surface of the vacuum chamber 5, and a substrate holding member 6 is provided at the tip of the moving portion provided at the fixed portion so as to be movable forward and backward. Therefore, the substrate 2 supported by the substrate holding member 6 moves in contact with and away from the mask 1 by moving the moving portion forward and backward.
As shown in fig. 2, the substrate holding member 6 is provided with a supporting tool 7 which is in contact with the lower surface of the peripheral portion of the substrate 2, and a pressing tool 8 which is provided on the upper surface side of the substrate 2 so as to sandwich the substrate 2 with the supporting tool 7.
Specifically, the substrate holding member 6 is formed with sleeves extending perpendicularly from the right and left sides of the body, and the support tool 7 is provided to protrude inward from the distal ends of the sleeves. Further, base portions 9 on which pressing tools 8 are movably provided are provided so as to face the supporting tools 7, respectively.
The pressing tool 8 is configured to clamp the substrate 2 by protruding from the base 9 and pressing the substrate 2 against the supporting tool 7. The supporting tool 7 and the pressing tool 8 (clamping mechanism) can be appropriately switched between a clamped state in which the pressing tool 8 presses the substrate 2 and a released state in which the pressing tool 8 is retracted from the substrate 2 without clamping the substrate 2. Further, the released state in the present embodiment refers to a state in which the substrate 2 is not held by any holding mechanism.
A plurality of supporting tools 7 and pressing tools 8 (chucking mechanisms) are provided to chuck a plurality of side portions of the substrate 2. In the present embodiment, the supporting tool 7 and the pressing tool 8 are provided so as to sandwich a pair of opposing side portions of the substrate 2, respectively.
In the present embodiment, the pair of supporting tools 7 and the pressing tool 8 are configured to abut against one side portion substantially entirely in the longitudinal direction of the side portion. Further, a plurality of supporting tools 7 and pressing tools 8 may be provided for one side portion to support and clamp the one side portion at a plurality of points. Further, the corner of the substrate 2 may be sandwiched at a plurality of positions.
The substrate 2 is brought into contact with the mask 1 by using the moving mechanism 3 and the clamping mechanism having the above-described configurations, and the peripheral edge portion of the substrate 2 is clamped by the clamping mechanism in a state where the substrate is brought into contact with the mask 1. That is, in the present embodiment, the substrate 2 is brought into contact with the mask 1 in the released state and then clamped.
Specifically, the relative distance between the substrate 2 and the mask 1 is made closer by the moving mechanism 3 that changes the relative distance between the substrate 2 and the mask 1, and the substrate 2 is clamped at a point in time when the contact area between the substrate 2 and the mask 1 increases from the contact start time after the substrate 2 and the mask 1 are brought into contact with each other.
In the present embodiment, as shown in fig. 3 to 8, for example, the clamping mechanism is set in a released state at a time point (fig. 3) when the substrate 2 conveyed from the substrate conveying robot outside the vacuum chamber 5 is conveyed into the vacuum chamber 5 and received by the substrate holding member 6, a descent start time point (fig. 4) for placing the substrate 2 on the mask 1, a descent halfway time point (fig. 5), a time point (fig. 6) when the substrate 2 contacts the mask 1, and a time point (fig. 7) when the substrate 2 further descends while increasing the contact area after contacting the mask 1, and clamping is performed at a placement end time point (fig. 8) when the substrate 2 is superposed on the mask 1.
Accordingly, when the substrate 2 is lowered while the contact area with the mask 1 is increased, the substrate 2 is in contact with the mask 1 in the released state (non-clamped state), and therefore, the deformation of the substrate 2 is not hindered by the clamping mechanism, and the substrate 2 is extended outward. This enables the substrate 2 to be satisfactorily placed along the mask 1, and the substrate 2 can be held in close contact with the mask 1 without being distorted.
It was confirmed that if the process including the step of performing the chucking at the time point of fig. 8 was performed in the released state at the time point of fig. 6, the substrate was prevented from being rubbed at any one of the states of chucking and releasing at the time points of fig. 3 to 5 and 7.
< example 2>
Referring to fig. 9 to 15, a substrate mounting method according to example 2 of the present invention will be briefly described. Fig. 9 to 15 are schematic views showing the substrate holding member 6 of the film deposition apparatus and a portion of the mask 1 as a carrier for the substrate 2 for convenience of explanation.
Embodiment 2 is a substrate placing method for placing a substrate 2 on a mask 1 as a placing body, and the method is characterized in that clamping of the peripheral edge portion of the substrate 2 by a clamping mechanism in a state where the substrate 2 is placed on the mask 1 is performed again after clamping of the substrate 2 by the clamping mechanism is temporarily released. In other words, example 2 is a substrate mounting method including the steps of: a first clamping step of clamping the peripheral edge portion of the substrate 2 by a clamping mechanism; a releasing step of releasing the clamping of the substrate 2 in the first clamping step; and a second clamping step of clamping the peripheral edge portion of the substrate 2 by the clamping mechanism in a state where the substrate 2 is placed on the mask 1 as the placing body after the releasing step.
For example, the substrate 2 is conveyed to the vicinity of the mask 1 in a state where the peripheral edge portion of the substrate 2 is clamped by the clamping mechanism of the substrate holding member 6, the clamping mechanism is temporarily brought into a released state at a time point when at least a part of the substrate 2 comes into contact with the mask 1, and then the peripheral edge portion of the substrate 2 is clamped again by the clamping mechanism.
Since the chucking mechanism is temporarily released, the substrate 2 is not prevented from being deformed by the chucking mechanism due to contact with the mask 1, and the substrate 2 is stretched outward. This enables the substrate 2 to be satisfactorily placed along the mask 1, and the substrate 2 can be held in close contact with the mask 1 without being distorted.
Therefore, film formation can be performed in a state where the substrate 2 is favorably brought into close contact with the mask 1 without a gap, and film blur caused by a decrease in the close contact between the mask 1 and the substrate 2 can be eliminated. Further, since the peripheral edge portion of the substrate 2 is clamped again by the clamping mechanism in a state where the substrate 2 is placed on the mask 1, friction between the mask 1 and the substrate 2 due to vibration generated in the film deposition apparatus is prevented, and damage to the processing surface of the substrate 2 can be prevented.
Here, "a state in which the substrate 2 is placed on the mask (carrier) 1" means a state in which at least a part of the substrate 2 is in contact with the mask 1. That is, the "state in which the substrate 2 is placed on the mask 1" includes a state at any time point of "a time point at which the substrate 2 and the mask 1 start to contact" when the substrate 2 and the mask 1 are relatively brought close to each other, a time point (fig. 14) at which a contact area between the substrate 2 and the mask 1 increases as compared with the time point at which the contact starts to approach, and a time point (fig. 15) at which the entire substrate 2 is placed on the mask 1 as the substrate 2 approaches further. From the viewpoint of the adhesion between the substrate 2 and the mask 1 after the substrate is placed, the state of fig. 14 is more preferable than the state of fig. 13, and the state of fig. 15 is more preferable with respect to the timing of re-clamping the peripheral portion of the substrate 2.
In the present embodiment, the present invention is applied to a film deposition apparatus in which a substrate 2 and a film deposition mask 1 having an opening for defining a film deposition pattern are disposed in a vacuum chamber 5 and a film deposition mechanism is used to perform film deposition.
Specifically, a mask 1 as a carrier is disposed in a vacuum chamber 5 in a state of being supported by a mask stage 4, and a moving mechanism 3 for changing a relative distance between the mask 1 and a substrate 2 is provided.
The mounting member may be a member other than the mask 1, such as a mounting table, on which the substrate 2 is temporarily mounted in order to eliminate warpage (distortion) of the substrate 2. In this case, the substrate 2 held in a state where the warp or the like is corrected before being placed on the mask 1 can be placed on the mask 1, and the substrate 2 and the mask 1 can be brought into good close contact with each other.
The fixed portion of the moving mechanism 3 is attached to the wall surface of the vacuum chamber 5, and a substrate holding member 6 is provided at the tip of the moving portion provided at the fixed portion so as to be movable forward and backward. Therefore, the substrate 2 supported by the substrate holding member 6 moves in contact with and away from the mask 1 by moving the moving portion forward and backward.
The substrate holding member 6 is provided with a support tool 7 that contacts the lower surface of the peripheral edge portion of the substrate 2, and a pressing tool 8 that is provided on the upper surface side of the substrate 2 so as to sandwich the substrate 2 with the support tool 7.
Specifically, the substrate holding member 6 is formed with sleeves extending perpendicularly from the right and left sides of the body, and the support tool 7 is provided to protrude inward from the distal ends of the sleeves. Further, base portions 9 on which pressing tools 8 are movably provided are provided so as to face the supporting tools 7, respectively.
The pressing tool 8 is configured to clamp the substrate 2 by protruding from the base 9 and pressing the substrate 2 against the supporting tool 7. The supporting tool 7 and the pressing tool 8 (clamping mechanism) can be appropriately switched between a clamped state in which the pressing tool 8 is pressed against the substrate 2 and a released state in which the pressing tool 8 is retracted from the substrate 2 without clamping the substrate 2. Further, the released state in the present embodiment refers to a state in which the substrate 2 is not held by any holding mechanism.
A plurality of supporting tools 7 and pressing tools 8 (chucking mechanisms) are provided to chuck a plurality of side portions of the substrate 2. In the present embodiment, the supporting tool 7 and the pressing tool 8 are provided so as to sandwich a pair of opposing side portions of the substrate 2, respectively.
In the present embodiment, the pair of supporting tools 7 and the pressing tool 8 are configured to abut against one side portion substantially entirely in the longitudinal direction of the side portion. Further, a plurality of supporting tools 7 and pressing tools 8 may be provided for one side portion to support and clamp the one side portion at a plurality of points. Further, the corner of the substrate 2 may be sandwiched at a plurality of positions.
With the above configuration, the relative distance between the substrate 2 and the mask 1 is made close while the peripheral edge portion of the substrate 2 is held by the holding mechanism, and the holding mechanism is set to the released state at the time point when at least a part of the substrate 2 comes into contact with the mask 1. Then, the entire surface of the substrate 2 is placed on the mask 1 by further bringing the substrate 2 and the mask 1 closer to each other, and then the peripheral edge portion of the substrate 2 is clamped again by the clamping mechanism.
Specifically, as shown in fig. 10 to 15, for example, the substrate 2 conveyed by a substrate conveying robot outside the vacuum chamber 5 is clamped at a time point (fig. 10) when the substrate 2 is conveyed into the vacuum chamber 5 and received by the substrate holding member 6, a lowering start time point (fig. 11) when the substrate 2 is placed on the mask 1, a time point on the way of lowering (fig. 12), and a time point (fig. 13) when the substrate 2 comes into contact with the mask 1, and is released when the substrate 2 is further lowered after coming into contact with the mask 1 (fig. 14), and is clamped again at a time point when the substrate 2 is superimposed on the mask 1 (fig. 15).
Accordingly, when the substrate 2 is lowered while the contact area with the mask 1 is increased, the substrate 2 is in contact with the mask 1 in the released state (non-clamped state), and therefore, the deformation of the substrate 2 is not hindered by the clamping mechanism, and the substrate 2 is extended outward. This enables the substrate 2 to be satisfactorily placed along the mask 1, and the substrate 2 can be held in close contact with the mask 1 without being distorted. Therefore, the substrate 2 can be stably conveyed, and deformation when contacting the mask 1 can be prevented, thereby preventing film blur.
It was also confirmed that if the process including the step of releasing at the time point of fig. 14 and re-clamping at the time point of fig. 15 is included, the film-blur preventing effect is exhibited as long as clamping is performed at least at any one time point even if clamping is not performed at all time points of fig. 10 to 13.
Further, at the time point of fig. 10 to 13, since the substrate 2 is lowered in a state of being held, the substrate 2 is not displaced by the inertial force acting on the substrate 2 during the lowering.
< example 3>
A substrate mounting method according to example 3 of the present invention will be described with reference to fig. 16 to 19. Fig. 16 to 19 show a series of processes until the substrate holding member 210 receives the substrate 10 from the transfer robot 119 and places the substrate on the mask (placement body) 220.
Fig. 16 (a) shows a state immediately after the transfer robot 119 transfers the substrate 10 to the substrate holding member 210. The substrate 10 is bent downward at its center due to its own weight. Next, as shown in fig. 16 (b), the jig member 303 is lowered to press the pressing tool 302 against the supporting tool 300 with a predetermined pressing force. Thus, the left and right side portions of the substrate 10 are clamped by a clamping mechanism including the pressing tool 302 and the supporting tool 300.
Fig. 16 (c) shows the first alignment. The first alignment is a first position adjustment process of roughly adjusting the relative position of the substrate 10 and the mask 220 within the XY plane (in a direction parallel to the surface of the mask 220), and is also referred to as "coarse alignment". In the first alignment, the substrate alignment mark 102 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220 are recognized by the camera 260, and the relative displacement in the XY position and the XY plane is measured to perform the alignment. The camera 260 for the first alignment is a low-resolution but wide-field camera to enable rough position alignment. In the alignment, the position of the substrate 10 (substrate holding member 210), the position of the mask 220, or both the substrate 10 and the mask 220 may be adjusted.
If the first alignment process is completed, the substrate 10 is lowered as shown in fig. 17 (a). Then, as shown in fig. 17 (b), before the substrate 10 comes into contact with the mask 220, the pressing tool 302 is raised to release the chucking mechanism. Next, as shown in fig. 17 (c), after the substrate holding member 210 is lowered to the position where the second alignment is performed in the hold release state (non-clamped state), the peripheral portion of the substrate 10 is re-clamped by the clamping mechanism as shown in fig. 17 (d). The position where the second alignment is performed is a position where the substrate 10 is temporarily placed on the mask 220 in order to measure the relative displacement between the substrate 10 and the mask 220, and is, for example, a position where a support surface (upper surface) of the support tool 300 is slightly higher than a placement surface of the mask 220. At this time, the center portion of the substrate 10 is in contact with the mask 220, and the left and right side portions of the peripheral edge portion of the substrate 10 supported by the chucking mechanism are slightly separated (lifted) from the mounting surface of the mask 220.
In the present embodiment, as shown in fig. 17 (b) to 17 (d), the substrate holding member 210 brings the substrate 10 close to the mask 220 while maintaining the released state. Then, the peripheral portion of the substrate 10 is sandwiched at a time point when the substrate 10 contacts the mask 220 and the contact area between the substrate 2 and the mask 1 increases from the contact start time point. Therefore, when the substrate 10 bent by its own weight is returned to a flat state following the mask 220, the peripheral edge portion of the substrate 10 is displaced outward, and therefore no excessive stress is applied to the substrate 10. Therefore, the adhesion between the substrate 10 and the mask 220 is increased, and the positional displacement of the substrate 10 when the substrate 10 is placed on the mask 220 or the friction between the surface of the substrate 10 and the mask 220 can be suppressed.
Fig. 18 (a) to 18 (d) are views for explaining the second alignment. The second alignment is an alignment process for performing high-precision position alignment, and is also referred to as "fine alignment". First, as shown in fig. 18 (a), the substrate alignment mark 101 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220 are recognized by the camera 261, and the relative displacement in the XY position and the XY plane is measured. The camera 261 is a camera with a narrow field of view and high resolution so as to be capable of performing high-precision position alignment. When the measured deviation exceeds a threshold value, a position alignment process is performed. Hereinafter, a case where the measured deviation exceeds the threshold value will be described.
When the measured deviation exceeds the threshold value, as shown in fig. 18 (b), the substrate Z actuator 250 is driven to lift the substrate 10 away from the mask 220. In fig. 18 (c), the XY θ actuator is driven based on the deviation measured by the camera 261 to perform the alignment. In the alignment, the position of the substrate 10 (substrate holding member 210), the position of the mask 220, or both the substrate 10 and the mask 220 may be adjusted.
Thereafter, as shown in fig. 18 (d), the substrate 10 is lowered again to the position where the second alignment is performed, and the substrate 10 is placed on the mask 220 again. Then, the alignment marks of the substrate 10 and the mask 220 are photographed by the camera 261, and the misalignment is measured. When the measured deviation exceeds the threshold value, the above-described alignment process is repeated.
When the deviation is within the threshold value, as shown in fig. 19 (a) to 19 (b), the substrate holding member 210 is lowered while holding the substrate 10 therebetween, and the height of the support surface of the substrate holding member 210 and the height of the mask 220 are made equal to each other. Thereby, the entire substrate 10 is placed on the mask 220. Thereafter, cooling plate Z actuator 252 is driven to lower cooling plate 230 and bring it into close contact with substrate 10. Through the above steps, the mounting process of the substrate 10 on the mask 220 is completed, and the film forming process (vapor deposition process) is performed by the film forming apparatus.
(modification of second alignment treatment)
In the present embodiment, as shown in fig. 18 (a) to 18 (d), an example in which the second alignment is repeated while holding the substrate 10 clamped by the clamping mechanism is described, but as another example, the clamping mechanism may be set to a released state or the clamping force of the clamping mechanism may be weakened (clamping is eased) when the substrate 10 is placed on the mask 220. Fig. 27 to 30 show specific operation examples. In the following description, a clamp mechanism for supporting the right side portion in the drawing is referred to as a right clamp mechanism, and a clamp mechanism for supporting the left side portion in the drawing is referred to as a left clamp mechanism.
Fig. 27 shows an example of the operation of placing the substrate 10 on the mask 220 with the left and right clamping mechanisms released. The operations up to fig. 27 (a) to 27 (c) are the same as those in fig. 18 (a) to 18 (c). When the position adjustment of the substrate 10 is completed in fig. 27 c, the pressing tool 302 is raised to bring the clamping mechanisms on the left and right sides into a released state (a state where the clamping force is 0), as shown in fig. 27 d. Thereafter, as shown in fig. 27 (e), the substrate 10 is lowered to the position where the second alignment is performed while maintaining the released state, and the substrate 10 is again placed on the mask 220. Then, the alignment marks of the substrate 10 and the mask 220 are photographed by the camera 261, and the misalignment is measured. When the measured deviation exceeds the threshold value, the left and right clamping mechanisms are brought into a clamped state, and then the processing of fig. 27 (b) to 27 (e) is repeated. On the other hand, when the deviation is within the threshold value, the second alignment is terminated, and the process proceeds to the next operation (fig. 19, 21, or 22).
Fig. 28 shows an operation example in which the substrate 10 is placed on the mask 220 with only one of the clamping mechanisms released. The operations up to fig. 28 (a) to 28 (c) are the same as those in fig. 18 (a) to 18 (c). When the position adjustment of the substrate 10 is completed in fig. 28 c, as shown in fig. 28 d, only the pressing tool 302 on one side (the right side in the illustrated example) is raised, and only the right clamping mechanism is set to the released state (the state where the clamping force is 0). The left clamping mechanism holds the left side portion of the substrate 10. Thereafter, as shown in fig. 28 (e), the substrate 10 is lowered to a position where the second alignment is performed while holding only one side of the substrate 10, and the substrate 10 is placed on the mask 220 again. The subsequent processing is the same as the operation example of fig. 27.
Fig. 29 shows an operation example in which the substrate 10 is placed on the mask 220 in a state where the clamping force of one clamping mechanism is weaker than that of the other clamping mechanism. The operations up to fig. 29 (a) to 29 (c) are the same as those in fig. 18 (a) to 18 (c). When the position adjustment of the substrate 10 is completed in fig. 29 c, as shown in fig. 29 d, the pressing force of the pressing tool 302 on one side (the right side in the illustrated example) is reduced, and the clamping force of the right clamping mechanism is reduced as compared with the clamping force in a normal state (for example, in fig. 17 d). The clamping force of the clamping mechanism on the left side is kept in a normal state. The white arrows in the figure schematically indicate the strength of the clamping force. For example, the normal clamping force is preferably strong enough that the clamping position where the clamping mechanism clamps the substrate 10 does not easily shift even when a force in the horizontal direction acts on the substrate 10. On the other hand, the clamping force of the right clamping mechanism in the case of fig. 29 (d) is preferably strong enough to allow the clamping position of the substrate 10 to be relatively easily displaced when a horizontal force is applied to the substrate 10. Thereafter, as shown in fig. 29 (e), the substrate 10 is lowered to a position where the second alignment is performed while the clamping force on one side is kept weakened, and the substrate 10 is placed on the mask 220 again. The subsequent processing is the same as the operation example of fig. 27.
Fig. 30 shows an example of the operation of placing the substrate 10 on the mask 220 in a state where the clamping force of the clamping mechanisms on the left and right sides is weaker than that in a normal state. The operations up to fig. 30 (a) to 30 (c) are the same as those in fig. 18 (a) to 18 (c). When the position adjustment of the substrate 10 is completed in fig. 30 (c), as shown in fig. 30 (d), the pressing force of the pressing tool 302 is weakened, and the clamping force of the clamping mechanisms on the left and right sides is weaker than the clamping force in a normal state (for example, in fig. 17 (d)). The clamping force in the case of fig. 30 (d) is preferably strong enough to allow the clamping position where the clamping mechanism clamps the substrate 10 to be relatively easily displaced when a horizontal force is applied to the substrate 10. Thereafter, as shown in fig. 30 (e), the substrate 10 is lowered to a position where the second alignment is performed while the clamping force is kept weakened, and the substrate 10 is placed on the mask 220 again. The subsequent processing is the same as the operation example of fig. 27.
As illustrated in fig. 27 to 30, when the substrate 10 is placed on the mask 220 again in a state where the chucking mechanism is released or in a state where the chucking force is weaker than that in a normal state, the peripheral edge portion of the substrate 10 is displaced outward when the substrate 10 is bent to extend along the placing surface of the mask 220, and therefore, no excessive stress is applied to the substrate 10. Therefore, the adhesion between the substrate 10 and the mask 220 is increased, and the positional displacement of the substrate 10 when the substrate 10 is placed on the mask 220 or the friction between the surface of the substrate 10 and the mask 220 can be suppressed. As a result, the position alignment accuracy of the second alignment can be improved.
In fig. 27 to 30, after the position of the substrate 10 is adjusted and before the substrate 10 starts to descend, control is performed to release or weaken the chucking. However, since the above-described operational effects can be obtained if the clamping is released or weakened by controlling before the substrate 10 comes into contact with the mask 220 and the bending of the substrate 10 starts to extend, the clamping may be released or weakened before the position of the substrate 10 is adjusted or after the lowering of the substrate 10 is started (but before the substrate 10 comes into contact with the mask 220).
< example 4>
Referring to fig. 20, a substrate mounting method according to example 4 of the present invention will be described. Fig. 20 shows a process of transferring the substrate 10 to a position for the second alignment after the first alignment described in embodiment 3.
In fig. 16 (a) to 16 (c), if the first alignment process is completed, the substrate 10 is lowered as shown in fig. 20 (a). Then, as shown in fig. 20 (b), after a part of the substrate 10 (for example, the central portion of the substrate 10 bent by its own weight) comes into contact with the mask 220, the pressing tool 302 is raised to release the chucking mechanism. Next, as shown in fig. 20 (c), after the substrate holding member 210 is lowered to the position where the second alignment is performed while maintaining the released state (non-clamped state), the peripheral portion of the substrate 10 is re-clamped by the clamping mechanism as shown in fig. 20 (d). The subsequent treatment was the same as in example 3.
In the present embodiment, as shown in fig. 20 (a), before the substrate 10 contacts the mask 220, the substrate 10 is lowered in a state where the substrate 10 is held by the holding mechanism. Therefore, there is an advantage that the positional deviation of the substrate 10 in the process of bringing the substrate 10 close to the mask 20 can be prevented. In the present embodiment, as shown in fig. 20 (b) to 20 (d), the substrate 10 is placed on the mask 220 with the clamping mechanism in the released state at the time point when the substrate 10 contacts the mask 220, and the substrate 10 is held in the released state. Therefore, when the substrate 10 bent by its own weight is returned to a flat state following the mask 220, the peripheral edge portion of the substrate 10 is displaced outward, and therefore no excessive stress is applied to the substrate 10. Therefore, the adhesion between the substrate 10 and the mask 220 is increased, and the positional displacement of the substrate 10 when the substrate 10 is placed on the mask 220 or the friction between the surface of the substrate 10 and the mask 220 can be suppressed.
< example 5>
Referring to fig. 21, a substrate mounting method according to example 5 of the present invention will be described. Fig. 21 shows a process of bringing the entire surface of the substrate 10 into close contact with the mask 220 after the second alignment described in example 3.
In fig. 18 (a) to 18 (d), if the second alignment process is completed, the clamping mechanism is released again as shown in fig. 21 (a). Then, as shown in fig. 21 (b), the substrate holding member 210 is lowered, and the substrate holding member 210 is again brought into a clamped state with the supporting surface thereof aligned with the height of the mask 220. The subsequent processing is the same as in the other embodiments. According to the method of the present embodiment, the positional deviation of the substrate 10 generated after the second alignment can be suppressed. Further, as shown in fig. 27 (e), when the gripping mechanism is in the released state at the time point when the second alignment process is completed, the operation in fig. 21 (a) can be omitted.
< example 6>
Referring to fig. 22, a substrate mounting method according to example 6 of the present invention will be described. Fig. 22 shows a process of bringing the entire surface of the substrate 10 into close contact with the mask 220 after the second alignment described in example 3.
In fig. 18 (a) to 18 (d), if the second alignment process is completed, the clamping mechanism is released again as shown in fig. 22 (a). Then, as shown in fig. 22 (b), the substrate holding member 210 is lowered to make the height of the support surface of the substrate holding member 210 coincide with the height of the mask 220. Thereby, the entire substrate 10 is placed on the mask 220. Thereafter, cooling plate Z actuator 252 is driven to lower cooling plate 230 and bring it into close contact with substrate 10. The subsequent processing is the same as in the other embodiments. Further, as shown in fig. 27 (e), when the gripping mechanism is in the released state at the time point when the second alignment process is completed, the operation in fig. 22 (a) can be omitted.
The method of the present embodiment differs from embodiment 5 in that a series of processes of lowering (placing) the substrate 10, lowering the cooling plate 230, and fixing the substrate 10 by the cooling plate 230 are performed after the second alignment process while maintaining the chucking mechanism in the released state. In the method of the present embodiment as well, as in embodiment 5, the positional deviation of the substrate 10 generated after the second alignment can be suppressed.
< embodiment of method for manufacturing electronic apparatus >
Next, an example of a method for manufacturing an electronic device using the film formation apparatus of the present embodiment will be described. Hereinafter, the structure and the manufacturing method of the organic EL display device are exemplified as an example of the electronic apparatus.
First, an organic EL display device to be manufactured is explained. Fig. 26 (a) shows an overall view of the organic EL display device 60, and fig. 26 (b) shows a cross-sectional structure of one pixel.
As shown in fig. 26 (a), a plurality of pixels 62 each including a plurality of light-emitting elements are arranged in a matrix in a display region 61 of an organic EL display device 60. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel is a minimum unit that can display a desired color in the display region 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is configured by a combination of the first light-emitting element 62R, the second light-emitting element 62G, and the third light-emitting element 62B which exhibit mutually different light emissions. The pixel 62 is often formed by a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be formed by a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is not particularly limited as long as it is at least one color or more.
Fig. 26 (B) is a partial cross-sectional view of fig. 26 (a) taken along line a-B. The pixel 62 includes an organic EL element including a first electrode (anode) 64, a hole transport layer 65, any of light-emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. The hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light-emitting layer 66R is an organic EL layer that emits red, the light-emitting layer 66G is an organic EL layer that emits green, and the light-emitting layer 66B is an organic EL layer that emits blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements that emit red, green, and blue light (sometimes described as organic EL elements). In addition, a first electrode 64 is separately formed for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. In addition, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter, an insulating layer 69 is provided between the first electrodes 64. Further, the organic EL layer is deteriorated by moisture and oxygen, and therefore, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.
In order to form the organic EL layer in units of light-emitting elements, a method of forming a film through a mask is used. In recent years, high definition of display devices has been advanced, and a mask having an opening with a width of several tens of μm is used for formation of an organic EL layer. In the case of film formation using such a mask, if the mask is thermally deformed by heat from an evaporation source during film formation, the mask and the substrate are displaced from each other, and a pattern of a thin film formed on the substrate is formed at a desired position. Therefore, the film formation apparatus (vacuum deposition apparatus) according to the present invention is preferably used for forming these organic EL layers.
Next, an example of a method for manufacturing the organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and the substrate 63 on which the first electrode 64 is formed are prepared.
An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by photolithography so as to form an opening in a portion where the first electrode 64 is formed, thereby forming the insulating layer 69. The opening corresponds to a light-emitting region where the light-emitting element actually emits light.
The substrate 63 with the patterned insulating layer 69 is carried into the first film forming apparatus, the substrate is held by the substrate holding member, and the hole transport layer 65 is formed as a common layer on the first electrode 64 in the display region. The hole transport layer 65 is formed by vacuum evaporation. In practice, the hole transport layer 65 is formed to have a size larger than that of the display region 61, and therefore a high-definition mask is not required.
Next, the substrate 63 formed on the hole transport layer 65 is carried into the second film formation apparatus and held by the substrate holding member. Alignment between the substrate and the mask is performed, the substrate is placed on the mask, and the light-emitting layer 66R emitting red color is formed on a portion of the substrate 63 where the element emitting red color is to be disposed. According to this example, the mask and the substrate can be well overlapped, and highly accurate film formation can be performed.
Similarly to the formation of the light-emitting layer 66R, the light-emitting layer 66G emitting green light is formed by the third film-forming device, and the light-emitting layer 66B emitting blue light is formed by the fourth film-forming device. After the completion of the formation of the light-emitting layers 66R, 66G, and 66B, the fifth film formation device forms the electron transport layer 67 over the entire display region 61. The electron transport layer 67 is formed as a layer common to the light-emitting layers 66R, 66G, and 66B of three colors.
The substrate on which the electron transport layer 65 was formed was moved to a sputtering apparatus to form a film on the second electrode 68, and then moved to a plasma CVD apparatus to form a film on the protective layer 70, thereby completing the organic EL display device 60.
When the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, if the substrate is exposed to an atmosphere containing moisture and oxygen, the light-emitting layer made of an organic EL material may be degraded by moisture and oxygen. Therefore, in this example, the substrate is carried in and out between the film forming apparatuses in a vacuum atmosphere or an inert gas atmosphere.
In the organic EL display device thus obtained, the light-emitting layer is formed for each light-emitting element with high accuracy. Therefore, if the above-described manufacturing method is used, it is possible to suppress the occurrence of a defect in the organic EL display device due to the positional deviation of the light-emitting layer.
The present invention is not limited to the configuration of the above-described embodiment, and may be modified as appropriate within the scope of the technical idea thereof. For example, in the above-described embodiment, the substrate is moved by the substrate holding member, but the mask as the carrier or both the substrate and the mask may be moved. In this case, the moving means of the carrier may be provided in addition to the moving means of the substrate. In addition, in the above-described embodiment, in the first alignment and the second alignment, the cameras for measurement are separately used, but the same cameras may also be used in the first alignment and the second alignment, and both the cameras 260, 261 may also be used in the first alignment and the second alignment.

Claims (33)

1. A substrate mounting method for mounting a substrate on a mounting body, comprising:
a first clamping step of clamping a peripheral edge portion of the substrate by a clamping mechanism;
a releasing step of releasing the clamping of the substrate by the clamping mechanism; and
and a second clamping step of clamping the peripheral edge portion of the substrate by a clamping mechanism in a state where the substrate is placed on the placement body after the releasing step.
2. The substrate mounting method according to claim 1,
the state in which the substrate is placed on the placement body is a state in which at least a part of the substrate is in contact with the placement body.
3. The substrate mounting method according to claim 1,
the state in which the substrate is placed on the placement body is a state at a contact start time point when the substrate and the placement body come into contact with each other when the substrate and the placement body are relatively close to each other, or a state in which the substrate and the placement body are closer than the contact start time point and a contact area between the substrate and the placement body increases than the contact start time point.
4. The substrate mounting method according to claim 1,
the carrier is a mask having a predetermined opening pattern.
5. The substrate mounting method according to claim 1,
a step of relatively bringing the substrate and the carrier closer to each other after the first clamping step,
the releasing step is performed before the substrate is brought into contact with the mounting body.
6. The substrate mounting method according to claim 1,
a step of relatively bringing the substrate and the carrier closer to each other after the first clamping step,
the releasing step is performed after at least a part of the substrate is brought into contact with the mounting body.
7. The substrate mounting method according to any one of claims 1 to 6,
the method includes a first position adjustment step of adjusting a relative position between the substrate and the carrier in a direction parallel to a surface of the carrier between the first clamping step and the releasing step.
8. The substrate mounting method according to any one of claims 1 to 6,
and a second position adjusting step of adjusting a relative position between the substrate and the carrier in a direction parallel to the surface of the carrier after the second clamping step.
9. The substrate mounting method according to claim 8,
the second position adjustment process includes:
separating the substrate from the carrier; and
and adjusting a relative position between the substrate and the carrier in a direction parallel to a surface of the carrier.
10. The substrate mounting method according to claim 8,
the second position adjustment process includes:
measuring a relative displacement between the substrate and the mounting body in a state where the substrate is mounted on the mounting body;
separating the substrate from the carrier;
adjusting a relative position between the substrate and the carrier in a direction parallel to a surface of the carrier based on the measured relative displacement; and
and a step of placing the substrate on the placing body again after the relative position is adjusted.
11. The substrate mounting method according to claim 10,
the step of placing the substrate on the placing member again is performed in a state where the clamping of the substrate by the clamping mechanism is released or in a state where the clamping force of the clamping mechanism is weaker than the clamping force in the second clamping step.
12. The substrate mounting method according to claim 10,
the clamping mechanism is provided with two clamping mechanisms which respectively clamp two opposite side parts in the peripheral part of the substrate,
the step of placing the substrate on the carrier again is performed in a state where the substrate is released from being held by one of the two chucking mechanisms or in a state where the chucking force of one of the two chucking mechanisms is weaker than the chucking force of the other chucking mechanism.
13. The substrate mounting method according to claim 8, further comprising:
a mounting step of mounting the entire substrate on the mounting body after the second position adjustment step; and
and a sticking step of sticking the substrate to the mounting body by pressing a plate member against the substrate.
14. The substrate mounting method according to claim 13,
the mounting step is performed in a state where the clamping of the substrate by the clamping mechanism is released.
15. The substrate mounting method according to claim 13 or 14, further comprising:
a step of clamping the peripheral edge portion of the substrate by the clamping mechanism after the mounting step,
in the adhering step, the plate member is pressed against the substrate while the peripheral edge portion of the substrate is held by the holding mechanism.
16. The substrate mounting method according to claim 13 or 14,
in the adhesion step, the plate member is pressed against the substrate while holding and releasing the substrate from being clamped by the clamping mechanism.
17. A substrate mounting method for mounting a substrate on a mounting body, comprising:
a first clamping step of clamping a peripheral edge portion of the substrate by a clamping mechanism;
a releasing step of releasing the clamping of the substrate by the clamping mechanism; and
and a mounting step of relatively bringing the substrate and the mounting member closer to each other and mounting the entire substrate on the mounting member.
18. The substrate mounting method according to claim 17,
and a sticking step of sticking the substrate to the mounting body by pressing a plate member against the substrate after the mounting step.
19. The substrate mounting method according to claim 17 or 18,
the mounting step is performed in a state where the clamping of the substrate by the clamping mechanism is released.
20. The substrate mounting method according to claim 18,
includes a step of clamping the peripheral edge portion of the substrate by the clamping mechanism after the mounting step,
in the adhering step, the plate member is pressed against the substrate while the peripheral edge portion of the substrate is held by the holding mechanism.
21. The substrate mounting method according to claim 18,
in the adhesion step, the plate member is pressed against the substrate while holding and releasing the substrate from being held by the holding mechanism.
22. A film forming method for forming a film of a predetermined pattern on a substrate, comprising:
a step of placing the substrate on the placing member by the substrate placing method according to any one of claims 1 to 21; and
and forming a film on the substrate.
23. A method of manufacturing an electronic device having a metal film formed on a substrate,
the metal film is formed by the film formation method according to claim 22.
24. A method of manufacturing an electronic device having an organic film formed on a substrate,
the organic film is formed by the film formation method according to claim 22.
25. The method of manufacturing an electronic device according to claim 24,
the electronic apparatus is a display panel of an organic EL display device.
26. A substrate mounting apparatus for mounting a substrate on a mounting body, comprising:
a substrate holding unit having a clamping mechanism for clamping a peripheral edge portion of the substrate; and
a control unit that controls the substrate holding unit,
the control unit controls the substrate holding unit to shift from a first clamping state in which the peripheral portion of the substrate is clamped by the clamping mechanism to a release state in which clamping of the substrate by the clamping mechanism is released, and after shifting to the release state, in a state in which the substrate is placed on the placement body, to a second clamping state in which the substrate is clamped by the clamping mechanism.
27. The substrate carrier device according to claim 26,
the state in which the substrate is placed on the placement body is a state in which at least a part of the substrate is in contact with the placement body.
28. The substrate carrier device according to claim 26,
the state in which the substrate is placed on the placement body is a state at a contact start time point when the substrate and the placement body come into contact with each other when the substrate and the placement body are relatively close to each other, or a state in which the substrate and the placement body are closer than the contact start time point and a contact area between the substrate and the placement body increases than the contact start time point.
29. The substrate carrier device according to any one of claims 26 to 28,
the clamping mechanism is provided with:
a support tool for supporting the substrate; and
a pressing tool for pressing the substrate to the supporting tool.
30. The substrate carrier device according to any one of claims 26 to 28,
the substrate holding unit holds the substrate, the carrier, or both the substrate and the carrier.
31. The substrate carrier device according to any one of claims 26 to 28,
the substrate processing apparatus includes a position adjusting unit for adjusting a relative position of the substrate and the carrier in a direction parallel to a surface of the carrier.
32. The substrate carrier device according to any one of claims 26 to 28,
the carrier is a mask having a predetermined opening pattern.
33. A film forming apparatus for forming a film of a predetermined pattern on a substrate, comprising:
the substrate mounting apparatus according to any one of claims 26 to 32, which mounts the substrate on a mounting body; and
and a unit for forming a film on the substrate.
CN201780002058.1A 2016-06-24 2017-06-22 Substrate mounting method, film forming method, and method for manufacturing electronic device Active CN107851603B (en)

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