JP2011165946A - Parts management system, part management method, and program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a parts management system capable of preventing the changeover of a production lot in the middle of the production of one substrate by a component mounting apparatus, and to provide a part management method and a program. <P>SOLUTION: The part management system monitors whether a remaining quantity is smaller than or not larger than the total quantity of a required quantity and a combined spare quantity (Step 101). When the remaining quantity is equal to or larger than the total quantity, the component mounting apparatus continues mounting processing by the mounting mechanism (Step 102). When the remaining quantity becomes smaller than the total quantity, the production of a circuit substrate is interrupted (Step 103). The quantity (necessary quantity) of parts which includes the spare quantity of electronic parts predetermined as necessary for the production of the circuit substrate is managed. By this, even in the case that an electronic part is discarded due to a holding error of the electronic part by an adsorption nozzle and the like during the production of the circuit substrate which is caused by a defective part and the like, it is possible to prevent the changeover of the production lot of parts in the middle of the production of one substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component management apparatus, a component management method, and a program for a component mounting apparatus that mounts an electronic component or the like on a substrate.

  A component mounting apparatus is known as an apparatus for mounting electronic components such as resistors, capacitors, and IC packages on a circuit board. Generally, a component mounting apparatus includes a head for holding an electronic component and mounting it on a circuit board. The component mounting apparatus includes a component supply unit that sequentially supplies electronic components, and the head receives the electronic components supplied from the component supply unit.

  Some products of electronic components supplied from the component supply unit have variations for each product. When electronic components having such variations are mounted on a substrate by a conventional general component mounting apparatus, the following problems occur. In other words, when a predetermined number of electronic components to be mounted on one board is cut out in the middle, and when trying to mount the same type of components on the board in succession, the production lot of the electronic components is switched. End up. Therefore, in this case, there is a possibility that variations occur among a plurality of electronic components of the same type within the same substrate. If the production lot is not switched, the board that has been manufactured halfway (execution of the mounting process) and the electronic components mounted thereon will be discarded.

  The component mounting apparatus described in Patent Document 1 monitors the remaining number of electronic components, and issues a warning when the remaining number decreases to a predetermined number (see, for example, paragraph [0018] of Patent Document 1).

JP 2002-299899 A

  However, as in the component mounting apparatus of Patent Document 1, it is not possible to prevent the production lot from being switched only by issuing a warning, so that electronic components of different production lots are mounted on the same substrate.

  Therefore, a method for managing the number of electronic components necessary for manufacturing one substrate is conceivable. For example, before the start of manufacturing the board (before starting mounting), if the remaining number of electronic components is less than the number of electronic parts required to manufacture the board, a warning or a method of stopping the manufacturing of the board is there. However, if a component holding error or a recognition error occurs when a component is imaged by a camera due to a component failure or the like, the component may be discarded. In such a case, parts are cut out in one production lot during the production, and the same problem as in the case of the conventional component mounting apparatus occurs.

  In view of the circumstances as described above, an object of the present invention is to provide a component management apparatus and a component management method capable of preventing a component production lot from being switched while a component mounting apparatus is manufacturing one substrate. And providing the program.

In order to achieve the above object, a component management apparatus according to an aspect of the present invention includes a storage unit and a processing unit.
The storage means includes a storage unit that stores a component, and the component mounting apparatus that mounts the component on a board has information on the remaining number of the component stored in the storage unit, and information on the spare number of the component. Remember memorize.
The processing means accommodates the total number obtained by adding the necessary number, which is the predetermined number of the parts necessary for manufacturing the substrate for each substrate, and the stored spare number, in the accommodating portion. The number of remaining parts is compared, and when the number of remaining parts is equal to or less than the total number or less than the total number, a first process for notifying information to that effect is executed.

  In the present invention, a predetermined number of components necessary for manufacturing at least one substrate is managed, including a spare number of components. As a result, even if there is a component holding error during board production or a recognition error when imaging a component with a camera due to a component defect or the like, For example, the component mounting apparatus can give a warning or stop the production before the component breakage occurs. Therefore, it is possible to prevent the production lot from being switched during the production of one substrate.

  The component management device further includes a variable unit that monitors a mounting history of the component by the component mounting device and variably controls the reserve number stored in the storage unit based on the mounting history information. May be. As a result, depending on the mounting history, for example, there may be a case where the number of spares can be reduced as much as possible, so that the waste of parts can be reduced.

  The variable means is a number that includes the number of the components that the component mounting apparatus has taken out from the housing portion during mounting of the one substrate, and that includes the number of the components that are not actually mounted on the substrate. A certain number of pick-ups may be monitored for each manufactured substrate, and the reserve number may be determined and updated based on the number of pick-ups.

  In this case, the variable means may determine and update the reserve number at a predetermined timing based on the average value, median value, or maximum value as described below.

  The processing means compares the remaining number of the parts accommodated in the accommodating portion with the necessary number, and when the necessary number is equal to or less than the remaining number or less than the remaining number, information to that effect It may be possible to execute the second process for notifying. In this case, the component management unit further includes a switching unit that selectively switches the first process and the second process by the processing unit. That is, one of the first and second processing by the processing means is selected by switching by the user or automatic switching according to a predetermined condition.

  The component management apparatus may further include an update unit that updates the remaining number of the components stored in the storage unit according to the number of the components stored in the storage unit.

  The component may be an LED (Light Emitting Diode). In particular, in the case of LEDs, since there is a variation in luminance for each production lot, in the production of at least one substrate, it is better that the parts are produced in one production lot. In the present invention, the quality of the LED illumination board can be improved.

The component management method by the component management apparatus according to the present invention includes information on the remaining number of the components housed in the housing portion of a component mounting apparatus having a housing portion for housing the component and mounting the component on a substrate. And information on the number of spare parts.
A total number obtained by adding the necessary number, which is the number of the predetermined parts necessary for manufacturing the substrate for each substrate, and the stored spare number, and the number of the components accommodated in the accommodating portion. The remaining number is compared.
As a result of the comparison, when the remaining number of parts becomes equal to or less than the total number or less than the total number, a process for notifying information to that effect is executed.

  A program according to the present invention causes a component management apparatus to execute the component management method.

  As described above, according to the present invention, it is possible to prevent a component production lot from being switched while the component mounting apparatus is manufacturing one substrate.

FIG. 1 is a front view showing a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view in which a part of the component mounting apparatus is broken. FIG. 3 is a side view showing the component mounting apparatus. FIG. 4 is a block diagram illustrating a configuration of a component management apparatus that manages electronic components in the component mounting apparatus. 5A and 5B are diagrams showing a component management table stored in the storage unit. FIG. 6 is a flowchart showing the operation of the component management apparatus. FIG. 7 is a flowchart showing an operation according to another embodiment (second embodiment) of the component management apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First embodiment]
FIG. 1 is a front view showing a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view in which a part of the component mounting apparatus 10 is broken. FIG. 3 is a side view showing the component mounting apparatus 10.

  The component mounting apparatus 10 is provided with a substrate placement unit 40 provided substantially at the center, on which a circuit board W is placed, and a tape feeder 100 provided on, for example, both sides of the board placement unit 40 and having a function of accommodating the electronic component 4. A tape feeder arrangement unit 60. In addition, the component mounting apparatus 10 includes a mounting mechanism 50 that mounts the electronic component 4 supplied from the tape feeder 100 on the circuit board W arranged in the board arrangement unit 40.

  For example, in the component mounting apparatus 10, the base unit 12, a machine base 13 that supports the base unit 12, and a plurality of support posts 14 erected on the machine support 13, for example, two support posts 14, are bridged. A beam 15 is provided. For example, four columns 14 are provided, and two beams 15 are provided, for example. In the following description, the direction in which the beam 15 extends may be referred to as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane may be referred to as the Y-axis direction, and the vertical direction may be referred to as the Z-axis direction.

  The mounting mechanism 50 includes a suction nozzle 18 for taking out the electronic component 4 from the tape feeder 100, a tool head 17 on which the suction nozzle 18 is mounted and rotatably provided, and a carriage 30 for holding the tool head 17. A movable body 16 that extends in the Y-axis direction and is movable in the X-axis direction is bridged over the beam 15. The carriage 30 is attached so as to be movable along the moving body 16 in the Y-axis direction. Therefore, the suction nozzle 18 mounted on the tool head 17 is configured to be movable in the horizontal plane (in the XY plane) by the carriage 30 and the moving body 16.

  Typically, a guide rail 21 extends in the X-axis direction on the lower surface of the beam 15. Fixed guided bodies 22 are slidably engaged with the guide rails 21 on the upper surfaces of both ends of the moving body 16. As a result, the moving body 16 can move along the beam 15 in the X-axis direction.

  Further, as described above, the carriage 30 can be moved in the Y-axis direction by driving a ball screw provided in the movable body 16.

  A fixing mechanism 20 that supports and fixes the circuit board W from below is provided in the board placement unit 40. The circuit board W is positioned by the fixing mechanism 20. In the present embodiment, two circuit boards W are arranged on the board placement unit 40 while being separated by a predetermined distance, but the number of circuit boards W to be arranged is not limited.

  The tool head 17 is provided so as to be suspended from the carriage 30. The tool head 17 can be rotated forward and backward by a built-in motor (not shown). As shown in FIG. 1, the rotation main axis a1 of the tool head 17 is provided in a state inclined with respect to the Z-axis direction.

  For example, twelve suction nozzles 18 are arranged at equal intervals in the circumferential direction at a portion near the outer periphery of the tool head 17. The suction nozzle 18 is mounted on the tool head 17 so that the axis of the suction nozzle 18 is inclined with respect to the rotation main axis a <b> 1 of the tool head 17. The inclination is such that the upper end of the suction nozzle 18 approaches the rotation main axis a <b> 1 of the tool head 17. That is, as a whole, the 12 suction nozzles 18 are arranged so as to expand toward the end with respect to the tool head 17.

  The suction nozzle 18 is supported so as to be movable in the axial direction with respect to the tool head 17. When the suction nozzle 18 is positioned at an operation position described later, the suction nozzle 18 is pressed from above by a pressing mechanism (not shown) and descends.

  The axis of the suction nozzle 18 located on the right end in FIG. 1 on the rear end side of the tool head 17 in the suction nozzle 18 is directed to the Z-axis direction, and the position on the rear end side is the above-described operation. Corresponds to position. The electronic component 4 is sucked or removed by the suction nozzle 18 positioned at the operation position and facing the vertical direction.

  There are a plurality of types of electronic components 4 mounted on one circuit board W. Thus, the different electronic components 4 cannot be mounted by being sucked by the single kind of suction nozzle 18. Therefore, a plurality of types of suction nozzles 18 are provided, and the corresponding electronic component 4 is sucked and mounted by an optimal suction nozzle. Examples of the electronic component 4 include an IC chip, a resistor, a capacitor, a diode, and a light emitting diode (LED) as a light emitting element. The LED may be organic or inorganic.

  The suction nozzle 18 is connected to an air compressor (not shown), and negative pressure and positive pressure (normal pressure) are switched at a predetermined timing at the tip of the suction nozzle 18 positioned at the operation position. As a result, the electronic component 4 is attracted or separated at the tip.

  An area occupied by the circuit board W positioned and held by the fixing mechanism 20 constitutes a component mounting area M.

  As shown in FIG. 2, a plurality of tape feeders 100 are detachably provided in the tape feeder arrangement portions 60 on both the left and right sides of the component mounting region M. The plurality of tape feeders 100 are arranged in the X-axis direction, for example. For example, although 40 tape feeders 100 can be mounted in one tape feeder placement unit 60, the number of tape feeders 100 is not limited. The same many electronic components 4 are accommodated in a carrier tape (not shown) included in one tape feeder 100. The tape feeder 100 supplies these electronic components 4 to the suction nozzle 18 as necessary.

  In the tape feeder 100, different types of electronic components 4 may be stored for each tape feeder 100, and the same type of electronic components 4 may be stored in two or more tape feeders 100. The “type” here means physical and functional types such as resistors, capacitors, and LEDs. For each tape feeder 100, the electronic component 4 of one manufacturing lot is accommodated. Then, the suction nozzle 18 and the tape feeder 100 are selected for each type and size of the electronic component 4, and the selected electronic component 4 is sucked by the selected suction nozzle 18.

  In this embodiment, the tape feeder arrangement part 60 is provided on both the left and right sides of the component mounting area M. However, the tape feeder arrangement part 60 may be provided only on one of the left and right sides of the component mounting area M. Good.

  A component supply port 125 is provided at one end of the tape feeder 100. Each tape feeder 100 is mounted on the tape feeder arrangement portion 60 so that one end portion provided with the component supply port 125 faces the component mounting region M side. The suction nozzle 18 takes out the electronic component 4 through the component supply port 125. Thus, the suction nozzle 18 when the electronic component 4 is taken out, or the region of the tool head 17 at that time (the region including the operation position) is defined as the component supply region S. In the tool head 17, the suction nozzle 18 that has come to the operation position moves within the range of the component supply region S, the component mounting region M, and the region connecting these regions S and M.

  The tool head 17 first moves onto the component supply area S, and sequentially sucks predetermined electronic components 4 by twelve suction nozzles 18 provided in the tool head 17. Then, the tool head 17 moves to the component mounting area M, and the components sucked by the suction nozzle 18 are sequentially mounted at predetermined positions on the circuit board W while adjusting the movement in the X-axis direction and the Y-axis direction. . The movement of the tool head 17 in the X-axis direction and the Y-axis direction is performed by the moving body 16 and the carriage 30 described above. By repeating this operation, the electronic component 4 is mounted on the circuit board W.

  The component mounting apparatus 10 is equipped with a camera (not shown). With this camera, the suction state of the electronic component 4 sucked by the suction nozzle 18 is imaged. The suction state is, for example, the position or posture of the electronic component 4 with respect to the suction nozzle 18. An image captured by the camera is subjected to image processing by a computer, whereby it is determined whether or not a suction error has occurred. If the position or posture of the electronic component 4 is not the intended posture or position, or if the electronic component 4 is not picked up, it is processed that a suction error has occurred. When a suction error due to position or orientation occurs, the electronic component 4 is discarded or reused later depending on the type of electronic component.

  If the suction state cannot be recognized by the camera or the computer, it is processed as a recognition error. In this case as well, the electronic component 4 is discarded and reused as described above.

  FIG. 4 is a block diagram illustrating a configuration of a component management apparatus that manages the electronic component 4 in the component mounting apparatus 10.

  The component management apparatus 200 has computer functions, and includes a CPU (Central Processing Unit) 201, a ROM 202 (Read Only Memory), a RAM (Random Access Memory) 203, an input / output interface 205, and a bus 204 that connects these components to each other. Is provided.

  A display unit 206, an input unit 207, a storage unit 208, a communication unit 209, and the like are connected to the input / output interface 205. For example, the display unit 206 may be a display unit mounted on the component mounting apparatus 10. User settings are input to the input unit 207 by the user. When the input unit 207 includes a touch panel, the touch panel can be integrated with the display unit 206.

  The storage unit 208 is a non-volatile storage device, such as an HDD (Hard Disk Drive), a flash memory, or other solid-state memory.

  The communication unit 209 is a device (not shown) other than the component mounting apparatus 10 or a device that communicates with the tape feeder 100, and performs communication according to a predetermined standard.

  The ROM 202 and the storage unit 208 store a program for performing processing necessary for managing the electronic component 4. For example, the program is a program for managing the remaining number of electronic components and the number of spares as will be described later, and a program for executing predetermined processing based on information on the remaining number and the number of spares.

  The component management device 200 may be a device mounted on the component mounting device 10 or may be a device connected to the component mounting device 10 by wire or wireless via the communication unit 209 or the like.

FIG. 5A shows a component management table stored in the storage unit 208, for example. As shown in this component management table, for each tape feeder (for each tape feeder number), the type of electronic component, the remaining number of electronic components, and one (or more than one) circuit board W are manufactured. Each information of a predetermined number of electronic components necessary for the above (hereinafter referred to as necessary number) and a spare number of electronic components is stored. At this time, the storage unit 208 (or RAM 203) or the like functions as a storage unit.
In addition, description of (1), (2) etc. of the kind of components is convenient here, for example, LED (1) and LED (2) are different parameters (output, Color, size, shape, manufacturer, standard, etc.).

  The remaining number of electronic components (hereinafter simply referred to as the remaining number) is sequentially updated according to the number of electronic components 4 accommodated in the tape feeder 100 during the actual mounting process by the mounting mechanism 50 of the component mounting apparatus 10. The Typically, the remaining number is a value obtained by subtracting the number taken out from the tape feeder 100 by the suction nozzle 18 from a predetermined initial value of the remaining number. Each time the suction nozzle 18 takes out the electronic component 4 from the tape feeder 100, the carrier tape is fed out from the tape feeder 100. Therefore, a sensor (or a motor or the like for feeding out the carrier tape) of the tape feeder 100 and a processor can record the number taken out from the tape feeder 100 by the suction nozzle 18. In such an update process, the CPU 201 or the like functions as an update unit.

  Next, the operation of the component management apparatus 200 configured as described above will be described. FIG. 6 is a flowchart showing the operation.

  The component management apparatus 200 holds the component management table shown in FIG. 5A in the initial state. The component management apparatus 10 monitors whether the remaining number is less than the total number obtained by adding the necessary number and the reserve number (or less than the total number) (step 101). If the remaining number is equal to or greater than the total number, the component mounting apparatus 10 starts the mounting process by the mounting mechanism 50 and continues manufacturing the board (step 102). During the mounting process, as shown in FIG. 5B, the remaining number is updated each time the tape feeder 100 sends out.

  When the remaining number becomes less than the total number, the component management apparatus 200 interrupts the process for notifying information to that effect, typically the manufacture of the circuit board W (step 103). FIG. 5B shows a state where the remaining number (100) is less than the total number (103) of the LED (2) which is an electronic component housed in the tape feeder 100 of number 103. In this case, specifically, when the remaining number reaches 102, the manufacture of the circuit board W is interrupted.

  As described above, the component management apparatus 200 manages the number of parts (required number) determined in advance necessary for manufacturing the circuit board W including the spare number of the electronic components 4. As a result, even when an error in holding the electronic component 4 by the suction nozzle 18 or a recognition error when the electronic component 4 is imaged by the camera occurs during the manufacture of the circuit board W due to a component defect or the like. no problem.

  When a holding error or a recognition error occurs, the electronic component 4 is not actually mounted on the circuit board W and discarded, but the remaining number is counted (decremented), and conventionally, it is a part in one production lot. Out of stock occurred and became a problem. For example, in the state shown in FIG. 5B, since the remaining number satisfies the necessary number, the production of the substrate has been continued in the past. However, when an adsorption error or a recognition error occurs, May discard the electronic component 4. In this case, the number of components necessary for manufacturing the circuit board W is not satisfied, and thus the component is cut off during the manufacturing. However, according to the present embodiment, by including the number of spares, the manufacturing can be interrupted before the parts run out in one manufacturing lot during the manufacturing. Therefore, it is possible to prevent the production lot from being switched during the production of one circuit board W.

  Further, conventionally, there is no need to discard the circuit board W that was in the process of being manufactured when a component break occurs, and the number of circuit boards W that are wasted can be reduced.

  In particular, when the electronic component 4 is an LED, even if it is the same LED, there is a variation in luminance for each production lot. Therefore, in the production of at least one substrate, it is better that the component is produced in one production lot. In the present embodiment, it is possible to suppress luminance unevenness in a single LED illumination board on which a plurality of LEDs are mounted, which is a board to be manufactured.

  In step 103, the component mounting apparatus 10 or the like may warn the user so that the user can recognize by at least one of visual and auditory senses, without being limited to the production interruption of the circuit board W. For example, there are an indicator light and a buzzer.

[Second Embodiment]
In the first embodiment, the spare number of the electronic components 4 is fixed. However, the component management apparatus 200 uses the information on the mounting history of the electronic components 4 by the component mounting apparatus 10 as shown in FIG. And the reserve number of electronic components in the component management table shown in (B) may be variably controlled.

  For example, the mounting mechanism 50 includes the number of electronic components 4 actually taken out from the tape feeder 100 during the mounting process of one substrate and the number of electronic components 4 that are not actually mounted on the circuit board W. The component management apparatus 200 monitors the number of pick-ups, which is a number, for each circuit board W. The number of electronic components 4 taken out by the mounting mechanism 50 is the number of times the mounting mechanism 50 has accessed the tape feeder 100. The number of electronic components 4 that are not actually mounted on the circuit board W is the number of electronic components 4 discarded. The number obtained by subtracting the number of discards from the number taken out is the number of electronic components 4 actually mounted on the circuit board W. The component management apparatus 200 can determine and update the number of spares based on such information on the number of pick-ups. At this time, the CPU 201 and the like function as variable means for variably controlling the reserve number.

  In this case, the component management apparatus 200 can recognize the number of picked-up units by counting the number of discarded electronic components 4 using a camera or other sensor. For example, as shown in FIG. 7, when the discard number of the electronic component 4 is smaller than the previously set discard number threshold T (at the time of manufacturing the previous circuit board W) (YES in Step 201), the current circuit board W is displayed. In the manufacturing of (2), the number of spare electronic parts 4 is reduced (step 202). On the other hand, when the discard number is larger than the previously set threshold value T (YES in step 203), the spare number of the electronic components 4 is increased in the current manufacture of the circuit board W (step 204). When the number of discards matches the threshold T (NO in step 203), the reserve number is not changed (step 205).

  The flowchart shown in FIG. 7 is merely an example. In addition to the processing shown in FIG. 7, when the number of discards is zero during the manufacturing of one circuit board W, or when the state of the number of discards continues in a predetermined number of circuit boards W For the circuit board W to be manufactured later, the component management apparatus 200 can also realize the operation of reducing the number of spares. Thereby, since the number of reserves can be reduced as much as possible, waste of the electronic component 4 can be reduced.

  Alternatively, the parts management apparatus 200 may determine and update the reserve number at a predetermined timing based on the above average value, median value, or maximum value of the number of pick-ups. The predetermined timing includes, every time the component mounting apparatus 10 manufactures one board, a predetermined number of boards, an arbitrary timing by the user, or a combination of at least two of them. For example, when the required number is 100, if the number of extractions for the first circuit board W is 101 and the number of extractions for the second circuit board W is 105, it is the maximum value so far. Five can be determined as the reserve number.

[Third embodiment]
The component management apparatus 200 compares the remaining number to be updated with the necessary number, and when the necessary number becomes less than the remaining number (or less than the remaining number), the component mounting apparatus 10 performs as described above. The production of the circuit board W may be interrupted. When this is set to the second mode and the processing according to the flowchart shown in FIG. 6 of the first embodiment is set to the first mode, the component mounting apparatus 10 sets the first and second modes to a predetermined mode. You may selectively switch according to conditions. In this case, the CPU 201 and the like function as switching means.

  The predetermined condition is, for example, an electronic component (for example, an LED or the like) on which the electronic component 4 mounted on one circuit board W is a component in one manufacturing lot, and the like For example, it is possible to distinguish an electronic component (for example, a resistor or the like) for which no condition is imposed. That is, the first mode is selected in the former case, and the second mode is selected in the latter case. In this case, the part management apparatus 200 may execute the mode switching based on the part management table (automatic switching), or the user may manually select the mode via the input unit 207 of the part management apparatus 200. Good.

  Thus, convenience and practicality can be improved by switching between the first and second modes according to the type of the electronic component 4.

[Other embodiments]
The embodiment according to the present invention is not limited to the embodiment described above, and other various embodiments are realized.

  The component management apparatus is not limited to the apparatus having the configuration shown in FIG. Instead of the CPU 201 (and other hardware), a DSP (Digital Signal Processor), an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), or the like may be used.

  In the above-described embodiment, an example in which the sensor (or a motor for feeding) and the processor included in the tape feeder 100 record the number of electronic components taken out from the tape feeder 100 by the suction nozzle 18 has been described. However, instead of the tape feeder 100, the camera or control system of the component mounting apparatus 10 side may execute the processing.

  In the above embodiment, the number of the suction nozzles 18 of the tool head 17 is twelve, but only one suction nozzle may be used.

W ... Circuit board 4 ... Electronic component 10 ... Component mounting device 100 ... Tape feeder 200 ... Component management device 201 ... CPU
202 ... ROM
203 ... RAM
208: Storage unit

Claims (9)

In a component mounting apparatus that has a housing portion that houses a component and mounts the component on a substrate, information on the remaining number of the component housed in the housing portion and information on the spare number of the component are stored. Storage means;
A total number obtained by adding the necessary number, which is the number of the predetermined parts necessary for manufacturing the substrate for each substrate, and the stored spare number, and the number of the components accommodated in the accommodating portion. Processing means for comparing the remaining number and executing a first process for notifying the information when the remaining number of the parts is equal to or less than the total number or less than the total number. Parts management device. The component management apparatus according to claim 1,
A component management apparatus further comprising variable means for monitoring a mounting history of the component by the component mounting apparatus and variably controlling the reserve number stored in the storage means based on the information of the mounting history. The component management apparatus according to claim 2,
The variable means is a number that includes the number of the components that the component mounting apparatus has taken out from the housing portion during mounting of the one substrate, and that includes the number of the components that are not actually mounted on the substrate. A component management apparatus that monitors a certain number of pick-ups for each board to be manufactured, and determines and updates the spare number based on the number of pick-ups. The component management apparatus according to claim 3,
The variable means determines and updates the reserve number based on the maximum value of the number of pick-ups among the plurality of boards to be manufactured. The component management device according to any one of claims 1 to 4,
The processing means compares the remaining number of the parts accommodated in the accommodating portion with the necessary number, and when the necessary number is equal to or less than the remaining number or less than the remaining number, information to that effect It is possible to execute a second process for notifying
The component management apparatus further includes a switching unit that selectively switches between the first process and the second process by the processing unit. The component management apparatus according to any one of claims 1 to 5,
The component management apparatus further comprising an updating unit that updates the remaining number of the components stored in the storage unit according to the number of the components stored in the storage unit. The component management apparatus according to any one of claims 1 to 6,
The component is a component management device that is an LED (Light Emitting Diode). A component mounting apparatus for mounting the component on a substrate having a storage portion for storing the component, storing information on the remaining number of the component stored in the storage portion, and information on the spare number of the component,
A total number obtained by adding the necessary number, which is the number of the predetermined parts necessary for manufacturing the substrate for each substrate, and the stored spare number, and the number of the components accommodated in the accommodating portion. Compare the remaining number,
As a result of the comparison, when the remaining number of parts becomes equal to or less than the total number or less than the total number, a process for notifying information to that effect is executed. A component mounting apparatus for mounting the component on a substrate having a storage portion for storing the component, storing information on the remaining number of the component stored in the storage portion, and information on the spare number of the component,
A total number obtained by adding the necessary number, which is the number of the predetermined parts necessary for manufacturing the substrate for each substrate, and the stored spare number, and the number of the components accommodated in the accommodating portion. Compare the remaining number,
As a result of the comparison, when the remaining number of parts becomes equal to or less than the total number or less than the total number, a program that causes the parts management apparatus to execute processing for notifying information to that effect.

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