JP5815421B2 - Component mounting apparatus, component mounting method, control program for component mounting apparatus, recording medium - Google Patents

Description

  The present invention relates to a technology for performing component mounting in which a predetermined component is mounted at a predetermined location on a substrate, and more particularly to a technology when component mounting is interrupted.

  Patent Document 1 describes a component mounting apparatus that sequentially mounts components on a plurality of boards carried from the outside of the apparatus. In addition, the component mounting apparatus has a configuration in which maintenance of nozzles used for component mounting is executed after component mounting on the board is completed.

Japanese Patent Laid-Open No. 10-070395

  As described above, the configuration in which predetermined processing such as maintenance is performed after the completion of component mounting on the board has an advantage that, for example, the component mounting after the maintenance can be appropriately performed by the nozzle that has been maintained. However, the predetermined processing performed after the completion of component mounting on the board does not always end promptly, and the time required for this predetermined processing may affect the tact time.

  Further, as another factor affecting the tact time, there is a case where some abnormality occurs during the component mounting on the board and the component mounting is interrupted. In such a case, the time required for the predetermined processing is further accumulated in the component mounting interruption time, and the tact time may be significantly increased.

  The present invention has been made in view of the above problems, and in a configuration capable of executing a predetermined process other than component mounting after completion of component mounting on the board, even if the component mounting on the board is interrupted, the tact time It is an object of the present invention to provide a technology that can suppress an increase in the amount of noise.

  A component mounting apparatus according to the present invention is a component mounting apparatus that sequentially executes component mounting for mounting a predetermined component at a predetermined location using a mounting head on a plurality of boards being conveyed. In order to achieve the above, a detection unit that detects an abnormality that occurs during component mounting on one board, a notification unit that notifies the worker that the detection unit has detected an abnormality, and a detection unit that has detected the abnormality Depending on the situation, the component mounting on one board is interrupted, and when the abnormality is resolved by the operator, the control unit that resumes the component mounting on the one board and the component mounting on the one board are not interrupted. A processing execution unit that executes a predetermined process other than component mounting after completion of component mounting on one board, and the processing execution unit, when an interruption period occurs in which component mounting on one board is interrupted, During ~ If there is no, it is a predetermined process that is scheduled to be performed after the completion of component mounting on one board, and an executable process that does not prevent execution of component mounting after restarting on one board is performed even if it is performed during an interruption period. It is characterized in that it is executed during an interruption period instead of after the completion of component mounting.

  A component mounting method according to the present invention is a component mounting method for sequentially executing component mounting for mounting a predetermined component at a predetermined location on a plurality of substrates, in order to achieve the above object, When component mounting is performed on the circuit board and an abnormality is detected in the component mounting on one board, the component mounting on the one board is interrupted while notifying the operator of the abnormality detection, and the abnormality is resolved by the operator. A mounting process for restarting component mounting on one board, and when component mounting on one board is not interrupted, a predetermined process other than component mounting is executed after completion of component mounting on one board; If there is an interruption period in which component mounting on the board is interrupted, it is a predetermined process scheduled to be performed after the completion of component mounting on one board if there is no such interruption, Against The executable process that does not interfere with the execution of the component mounting after resumption, is characterized by performing the interruption period instead of after the completion of the mounting of components to one substrate.

  The component mounting apparatus control program according to the present invention controls a component mounting apparatus that sequentially executes component mounting for mounting a predetermined component at a predetermined location using a mounting head on a plurality of conveyed boards. In order to achieve the above object, a detection function for detecting an abnormality that occurred during component mounting on one board, and a notification function for notifying an operator that the detection function has detected an abnormality, In response to the detection function detecting an abnormality, the component mounting on one board is interrupted, and when the abnormality is resolved by the operator, the component mounting on the one board is resumed, and the component on the one board If the mounting is not interrupted, the computer realizes a processing execution function for executing a predetermined process other than the component mounting after completing the component mounting on one board, and the processing The row function is a predetermined process that is scheduled to be performed after completion of component mounting on one board if there is no interruption during which the component mounting on one board is interrupted. Further, the present invention is characterized in that an executable process that does not prevent execution of component mounting after restarting on one board is executed during an interruption period instead of after completion of component mounting on one board.

  The recording medium according to the present invention is characterized in that a control program for the component mounting apparatus is recorded.

  In the invention configured as described above (component mounting apparatus, component mounting method, control program for component mounting apparatus, and recording medium), when an abnormality is detected in component mounting on one board, this abnormality detection is detected by the operator. And the component mounting on one board is interrupted. Then, after this abnormality is eliminated by the operator, component mounting on one board is resumed. Such a component mounting interruption period affects the tact time. In addition, since the present invention executes a predetermined process other than the component mounting after the completion of the component mounting on one board, if the time required for the predetermined process is accumulated as it is during the component mounting interruption period, the tact time There was a risk of a significant increase.

  In order to deal with such a problem, the present invention is intended to be performed after completion of component mounting on one board if there is no interruption when there is an interruption period in which component mounting on one board is interrupted. Predetermined processing is executed during the interruption period. That is, an increase in tact time is suppressed by effectively using the interruption period. However, by performing such a predetermined process during the component mounting interruption period (that is, before restarting the component mounting), execution of the component mounting after the restart is prevented, and it takes time to restart or restart the component mounting. If the time required for subsequent component mounting increases, the tact time may increase as a result. Therefore, the present invention relates to an executable process that does not prevent execution of component mounting after restarting one board even during an interruption period among predetermined processes scheduled to be performed after completion of component mounting on one board. , Instead of after completion of component mounting on one board, it is configured to be executed during an interruption period. Therefore, without taking time to resume component mounting or increasing the time required for component mounting after restarting, the predetermined processing that was scheduled to be performed after completion of component mounting on one board is suspended. Can be executed. As a result, it is possible to reduce the time required for the predetermined processing performed after the completion of component mounting on one board by the time of the predetermined processing whose execution timing is shifted during the interruption period. Thus, according to the present invention, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  At this time, in the component mounting apparatus that executes the component mounting by switching the use nozzle used for component mounting from a plurality of types of nozzles, the processing execution unit, when the component mounting on one board is interrupted, Determine whether or not to use the nozzle used as the nozzle used before the interruption for component mounting on the one substrate after restarting. If not, the next substrate on which the component is mounted next to the one substrate The component mounting apparatus may be configured to execute the process of switching the nozzle to be used for the nozzle scheduled to be used for mounting the component as an executable process during the interruption period. In such a configuration, the nozzle is switched to the nozzle to be used for component mounting on the next substrate during the component mounting suspension period for one substrate (that is, before restarting component mounting). However, the nozzle after this switching is not used for component mounting after resumption on one board. Therefore, even if the use nozzle is switched in this way, execution of component mounting after restarting on one board is not hindered. Moreover, the use nozzle is switched during the suspension period of component mounting on one board instead of after completion of component mounting on one board, thereby requiring a predetermined process to be performed after completion of component mounting on one board. You can save time. As a result, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  In addition, when the component mounting on one board is interrupted, the process execution unit executes the process for inspecting the mounting state of the component already mounted on the one board before the interruption as an executable process in the interruption period. A component mounting apparatus may be configured. In other words, even if such an inspection of the mounted state of a mounted component is performed during the suspension period of component mounting on one board (that is, before restarting component mounting), component mounting after restarting on one board is not performed. There is no hindrance. In addition, the inspection of the mounted state of the mounted component is performed during the suspension period of component mounting on one board instead of after completion of component mounting on one board, thereby performing predetermined processing performed after completion of component mounting on one board. The time required can be shortened. As a result, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  In addition, when the component mounting on one board is interrupted, the process execution unit may configure the component mounting apparatus to execute the process of performing the maintenance of the mounting head as an executable process in the interrupt period. In other words, even if such maintenance is performed during the suspension period of component mounting on one board (that is, before restarting component mounting), component mounting after restarting on one board is not hindered. In addition, the maintenance of such a mounting head is performed during a component mounting interruption period for one board instead of after completion of the component mounting for one board, thereby requiring a predetermined process to be performed after the completion of component mounting for one board. You can save time. As a result, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  As described above, according to the present invention, it is necessary for the predetermined process to be performed after the completion of component mounting on one board for the time of the predetermined process in which the execution timing is shifted during the suspension period in component mounting on one board. You can save time. Thus, according to the present invention, it is possible to suppress an increase in tact time even when component mounting is interrupted.

It is a top view which shows schematic structure of the component mounting apparatus which can apply this invention. FIG. 2 is a partial front view of the component mounting apparatus shown in FIG. It is a partial side view which shows the nozzle vicinity of the mounting head with which the component mounting apparatus of FIG. 1 is provided. It is a block diagram which shows the main electrical structures of the component mounting apparatus shown in FIG. 2 is a timing chart illustrating an example of operations performed by the component mounting apparatus of FIG. 1 in the first embodiment. 3 is a flowchart illustrating an example of an operation executed by the component mounting apparatus in FIG. 1. It is a flowchart which shows an example of the subroutine performed in the flowchart of FIG. 6 in 1st Embodiment. It is a timing chart which shows an example of the operation | movement performed with the component mounting apparatus of FIG. 1 in 2nd Embodiment. It is a flowchart which shows an example of the subroutine performed in 2nd Embodiment by the flowchart of FIG. It is a flowchart which shows an example of the subroutine performed in 3rd Embodiment by the flowchart of FIG.

First Embodiment FIG. 1 is a plan view showing a schematic configuration of a component mounting apparatus to which the present invention is applicable. FIG. 2 is a partial front view of the component mounting apparatus shown in FIG. FIG. 3 is a partial side view showing the vicinity of a nozzle of a mounting head provided in the component mounting apparatus of FIG. FIG. 4 is a block diagram showing the main electrical configuration of the component mounting apparatus shown in FIG. In FIG. 1 to FIG. 3, XYZ rectangular coordinate axes are shown in order to clarify the directional relationship of each figure.

  In the component mounting apparatus 1, the board transport mechanism 2 is disposed on the base 11, and the board S can be transported in a predetermined transport direction X. More specifically, the substrate transport mechanism 2 has a pair of conveyors 21 and 21 that transport the substrate S from the right side to the left side of FIG. And the conveyors 21 and 21 operate | move according to the operation command from the drive control part 82 of the control unit 8, carry in the board | substrate S, and stop at a predetermined mounting work position (position of the board | substrate S shown in the figure). The substrate S is fixed and held by a holding device (not shown). Then, the electronic component P supplied from the component supply unit 4 is transferred to the substrate S by the mounting head 61 provided in the head unit 6. When all the electronic components P to be mounted on the substrate S have been mounted on the substrate S, the substrate transport mechanism 2 unloads the substrate S. A component recognition camera 7 is disposed on the base 11. The component recognition camera 7 includes an illumination unit, a CCD (Charge Coupled Device) camera, and the like, and images the electronic component P held by the suction nozzle 62 of each mounting head 61 of the head unit 6 from below. It is like that.

  The component supply unit 4 is arranged on the front side (+ Y axis direction side) and the rear side (−Y axis direction side) of the substrate transport mechanism 2 configured as described above. These component supply units 4 include a number of tape feeders 41. Each tape feeder 41 is provided with a reel (not shown) around which a tape storing and holding the electronic component P is wound, so that the electronic component P can be supplied to the head unit 6. That is, each tape stores and holds small chip electronic components P such as an integrated circuit (IC), a transistor, and a capacitor at predetermined intervals. Then, the tape feeder 41 feeds the tape from the reel toward the head unit 6, whereby the electronic component P in the tape is intermittently fed to the component suction position, and as a result, is mounted on the mounting head 61 of the head unit 6. The pickup nozzle 62 can pick up the electronic component P.

  The head unit 6 transports the electronic component P to the substrate S while being sucked and held by the suction nozzle 62 of the mounting head 61 and transfers the electronic component P to the component mounting position designated by the user. Then, a total of twelve mounting heads 61 including six mounting heads 61F arranged in a line in the X-axis direction on the front side and six mounting heads 61R arranged in a line in the X-axis direction on the rear side are arranged. Have. That is, as shown in FIGS. 1 and 2, in the head unit 6, six mounting heads 61F extending in the vertical direction Z are arranged at an equal pitch in the X-axis direction (the direction in which the substrate S is transported by the substrate transport mechanism 2). It is provided in a row. Further, a rear row configured in the same manner as the front row is provided on the rear side (−Y-axis direction side) with respect to the mounting head 61F. That is, six mounting heads 61 </ b> R extending in the vertical direction Z are provided in a row at an equal pitch in the X-axis direction. In the present embodiment, the mounting head 61F and the mounting head 61R are arranged with a half pitch shift in the X-axis direction, and are arranged in a zigzag shape in plan view as shown in FIG. Therefore, when viewed from the Y-axis direction, as shown in FIG. 2, the twelve mounting heads 61 are arranged in a line in the X-axis direction without overlapping each other.

  Further, the suction nozzle 62 mounted at the tip of each mounting head 61 can communicate with any one of a negative pressure generator, a positive pressure generator, and the atmosphere via a pressure switching mechanism (not shown). The pressure applied to the suction nozzle 62 can be switched by the unit 8 controlling the pressure switching mechanism. That is, by applying a negative pressure suction force from the negative pressure generator to the suction nozzle 62 by switching the pressure, the lower end portion (tip portion) of the suction nozzle 62 sucks the upper surface of the electronic component P and can hold the component. It has become. Conversely, when a positive pressure from the positive pressure generator is supplied to the suction nozzle 62, the suction holding of the electronic component P by the mounting head 61 is released, and the electronic component P is instantaneously mounted on the substrate S by the positive pressure. Then, after mounting the electronic components, the suction nozzle 62 is opened to the atmosphere. Thus, in the head unit 6, the electronic component P can be attached and detached by controlling the negative pressure adsorption force and the positive pressure supply by the control unit 8.

  Incidentally, the mounting head 61 is configured to be able to switch the nozzle used for component mounting from among a plurality of types of suction nozzles 62. That is, in the component mounting apparatus 1, an auto nozzle changer ANC is provided between the component supply unit 4 on the rear side and the mounting work position, and the suction nozzle 62 attached to the mounting head 61 is switched in this auto nozzle changer ANC. (Nozzle change). Thus, the suction nozzle 62 attached to the mounting head 61 is used as a use nozzle in the subsequent component mounting.

  Each mounting head 61 can be moved up and down (moved in the Z-axis direction) with respect to the head unit 6 by a nozzle lifting / lowering drive mechanism (not shown) and rotated about the nozzle center axis by a nozzle rotation driving mechanism (not shown) (FIG. 2). In the R direction). Among these drive mechanisms, the nozzle raising / lowering drive mechanism raises and lowers the mounting head 61 between a lowered position (falling end) when sucking or mounting and a rising position (raising end) when carrying. . On the other hand, the nozzle rotation driving mechanism is a mechanism for rotating the suction nozzle 62 as required, and can position the electronic component P in a predetermined R-axis direction during mounting by rotation driving. These drive mechanisms are each composed of a Z-axis servo motor 72, an R-axis servo motor 73, and a predetermined power transmission mechanism. The drive control unit 82 of the control unit 8 controls the Z-axis servo motor 72 and the R-axis. By controlling the servo motor 73, each mounting head 61 is moved in the Z direction and the R direction.

  Further, since the head unit 6 transports the electronic component P sucked by these mounting heads 61 between the component supply unit 4 and the substrate S and mounts it on the substrate S, the X-axis is extended over a predetermined range of the base 11. It is possible to move in the direction and the Y-axis direction (direction orthogonal to the X-axis and Z-axis directions). That is, the head unit 6 is supported so as to be movable along the X axis with respect to the mounting head support member 63 extending in the X axis direction. Further, both ends of the mounting head support member 63 are supported by a fixed rail 64 in the Y-axis direction, and are movable along the fixed rail 64 in the Y-axis direction. The head unit 6 is driven in the X-axis direction by the X-axis servomotor 65 via the ball screw 66, and the mounting head support member 63 is driven in the Y-axis direction by the Y-axis servomotor 67 via the ball screw 68. Is done. In this way, the head unit 6 can transport the electronic component P attracted by the mounting head 61 from the component supply unit 4 to the target position.

  Furthermore, the head unit 6 includes a component inspection camera 91. The component inspection camera 91 includes an illumination unit and a CCD camera, and is used for inspecting the mounting state of each electronic component mounted on the substrate S. Specifically, the drive control unit 82 moves the head unit 6 as appropriate, thereby moving the component inspection camera 91 above the mounting position of the electronic component P. In this state, the image of the electronic component P captured by the component inspection camera 91 is transferred to the image processing unit 84. The image processing unit 84 determines the quality of the mounted state of the electronic component P from the transferred image of the electronic component P.

  In addition, the component mounting apparatus 1 includes a display 92 and a notification device 93 that function as an interface with an operator. In addition to the function of displaying the operation state of the component mounting apparatus 1, the display 92 includes a touch panel and has a function as an input terminal that receives input from an operator. Further, the alarm 93 notifies the operator of an error (abnormality) that has occurred in the component mounting apparatus 1, and is constituted by an emergency light that is notified by light, an emergency buzzer that is notified by a buzzer sound, or a combination thereof. . The input / output control for the display 92 and the alarm 93 is executed by the input / output control unit 88 of the control unit 8.

By the way, as an expected error,
・ Part out-of-part error when some types of electronic parts P are used up ・ Mark recognition error that failed to recognize fiducial marks, bad marks, etc. ・ Part suction error that suction nozzle 62 fails to pick up electronic parts P A component recognition error that fails to recognize an electronic component that is picked up by the suction nozzle 62 is included.

  The overall operation of the component mounting apparatus 1 configured as described above is controlled centrally by the main control unit 85. That is, the main control unit 85 controls the entire apparatus 1 by exchanging signals with each unit of the control unit 8 via the bus 87 based on programs and data stored in the storage unit 86. The program 861 stored in the recording medium 862 such as a CD (compact disk), a DVD (digital versatile disk), or a USB (Universal Serial Bus) memory is stored in the storage unit 86.

  For example, when producing a plurality of mounting boards, the main control unit 85 reads out a production program 861 (production program) stored in the storage unit 86. The main control unit 85 controls each part of the control unit 8 according to the program 861 so that component mounting is sequentially performed on the plurality of boards S that are carried in, and a plurality of mounting boards are produced. .

  Specifically, component mounting is performed in which a predetermined electronic component P is mounted on each mounting position of one substrate S carried in and fixed at the mounting work position. When electronic components P are mounted on all mounting positions on one substrate S (that is, when component mounting is completed), one substrate S is unloaded from the mounting work position and the next substrate S is mounted. It is carried in and fixed at the position (board transfer), and a new component mounting is executed on the next board S. Such an operation is repeatedly executed to produce a plurality of mounting boards.

  Further, the program 861 causes the component mounting apparatus 1 to execute a predetermined process such as a nozzle change in addition to the operation of repeatedly mounting the component on the board S to be carried in. Particularly in this embodiment, the execution timing of this nozzle change is controlled according to the situation in the component mounting apparatus 1. In other words, while component mounting is being executed sequentially according to the production plan without causing any error, the nozzle change is performed in parallel with the substrate transport for unloading the mounted substrate S and loading the next substrate. Executed. On the other hand, when an error occurs during component mounting, the nozzle change is executed during an interruption period in which component mounting is interrupted due to the occurrence of an error. Specifically, the main control unit 85 includes a detection unit 851 and a process execution unit 852. When the detection unit 851 detects an error that occurs during component mounting, the process execution unit 852 generates the error. The nozzle change is executed during the interruption period. Next, details of such operations executed by the component mounting apparatus 1 will be described.

  FIG. 5 is a timing chart showing an example of an operation executed by the component mounting apparatus of FIG. 1 in the first embodiment. The production plan is shown in the upper column, while the actual operation when an error occurs in the lower column It is shown. In FIG. 5, symbols S (n) and S (n + 1) indicate the substrates S that have been loaded into the nth and n + 1th sheets, respectively. As shown in the upper column of the figure, in this production plan, when the component mounting on the substrate S (n) is completed, the substrate S (n + 1) is loaded while the substrate S (n) is unloaded. In parallel with the conveyance, the nozzle change is executed. Incidentally, the time T1 required for the nozzle change is longer by the time ΔT than the time T2 required for the substrate transfer (T1 = T2 + ΔT). Further, in this production plan, when board conveyance and nozzle change are completed, component mounting on the board S (n + 1) is executed. Then, as long as no error occurs in component mounting, the operation according to the production plan is executed. On the other hand, when an error occurs in component mounting, an actual operation at the time of the error occurrence shown in the lower column of FIG. This actual operation will be described with reference to the flowchart of FIG.

  FIG. 6 is a flowchart showing an example of an operation executed by the component mounting apparatus of FIG. This flowchart is incorporated in the program 861 and is executed by the main control unit 85. The main control unit 85 monitors the progress of the operation being executed in the component mounting apparatus 1 while comparing it with the production plan. Then, when the main control unit 85 confirms from the detection result of the detection unit 851 that an error has occurred during component mounting, the main processing unit 85 executes the flowchart of FIG. More specifically, if an error occurs during component mounting on the board S (n), step S101 is executed and the error content is displayed on the display 92 (error display). The operator is notified of the occurrence of an error (operator call). In subsequent step S102, it is determined whether or not the error that has occurred is an error in which the component mounting apparatus 1 (machine) is operable. If it is determined that the component mounting apparatus 1 is inoperable and it is necessary to immediately stop the component mounting apparatus 1 itself (in the case of “NO” in step S102), the process proceeds to step S103, and the component mounting apparatus 1 Is stopped. As a result, the component mounting on the board S (n) is stopped, and if there is an operation in parallel with the component mounting on the board S (n), this operation is also stopped. 1 is in a state of waiting for repair work by the worker.

  On the other hand, when it is determined in step S102 that the component mounting apparatus 1 is operable and it is not necessary to stop the component mounting apparatus 1 itself (in the case of “YES” in step S102), step S104 is executed. The That is, for example, when a component shortage error has occurred, it is not necessary to stop the component mounting apparatus 1 itself, so step S104 is executed. In step S104, it is determined whether there is an electronic component P that can be mounted. If there is a mountable electronic component P (“YES” in step S104), the mounting of the electronic component P on the substrate S (n) is continued (step S105). That is, specifically, when there is a normal one that can mount a component regardless of the occurrence of an error among the suction nozzles 62 that are scheduled to mount the electronic component P on the substrate S (n) after the occurrence of the error. In this normal suction nozzle 62, the electronic component P is mounted even after an error occurs. Steps S104 and S105 are repeatedly executed until there is no electronic component P that can be mounted.

  On the other hand, when there is no mountable electronic component P (in the case of “NO” in step S104), the component mounting on the electronic component P on the substrate S (n) is interrupted. That is, the component mounting of the substrate S (n) is interrupted while the electronic component P is not mounted at some mounting positions. Then, a predetermined process (nozzle change) that can be executed in the interruption period T3 is searched from a predetermined process (nozzle change) that is scheduled to be performed after the component mounting of the substrate S (n). Specifically, in this step S106, a subroutine shown in FIG. 7 is executed.

  FIG. 7 is a flowchart showing an example of a subroutine executed in the flowchart of FIG. 6 in the first embodiment. This flowchart is incorporated in the program 861 and is executed by the process execution unit 852 of the main control unit 85. First, in step S201, one of the twelve mounting heads 61 provided in the head unit 6 is selected as a determination target, and component mounting by the target head 61 has already been completed when an error occurs. Is determined. If it is incomplete (in the case of “NO” in step S201), the target head 61 uses the suction nozzle 62 currently selected as the use nozzle in the component mounting after resuming from the interruption. Since it is necessary to perform mounting, the nozzle change of the target head 61 is not performed, and the process proceeds to step S204.

  That is, if the nozzle change is uniformly performed for all the mounting heads 61 that need to change the nozzle for mounting the component on the next substrate S (n + 1) without making the determination in step S201, There is a possibility that even the suction nozzle 62 of the mounting head 61 scheduled to be used for mounting components on the substrate S (n) may be switched. As a result, when the component is mounted on the substrate S (n) after the restart, it is necessary to change the nozzle of the mounting head 61 again in order to return to the suction nozzle 62 that has been switched to use. Therefore, when this nozzle change is performed before restarting the component mounting on the substrate S (n), the restart of the component mounting on the substrate S (n) is delayed, or the substrate S ( When performing the component mounting on n), the component mounting on the substrate S (n) after the restart will be extended from the schedule. That is, in any case, component mounting on the substrate S (n) after resumption is hindered, and the tact time may increase. Therefore, among the predetermined processing (nozzle change) scheduled to be performed after the completion of component mounting on one substrate S (n), even if it is performed during the interruption period T3, component mounting after restarting on the substrate S (n) is hindered. The determination in step S201 is made so that only the executable process (executable nozzle change) that is not executed is executed during the interruption period T3.

  On the other hand, if it is determined in step S201 that the mounting of the component by the target head 61 has already been completed at the time of the error occurrence (in the case of “YES”), the component on the next substrate S (n + 1) For mounting, it is determined whether or not it is necessary to switch the suction nozzle 62 of the target head 61 by changing the nozzle for the target head 61. If it is determined that there is no need to change the nozzle (in the case of “NO” in step S202), the nozzle change of the target head 61 is not performed and the process proceeds to step S204. On the other hand, if it is determined that a nozzle change is necessary (“YES” in step S202), after adding the target head 61 to the nozzle change target list stored in the storage unit 86 in step S203, Proceed to step S204. In step S204, it is determined whether or not the above determination has been performed for all of the twelve mounting heads 61. If there is an undetermined mounting head 61, this is selected as the target head 61 and the step is performed. Return to S201.

  In this way, a nozzle change target list is generated as a result of searching the mounting heads 61 that require the nozzle change and can execute the nozzle change during the interruption period T3 from the 12 mounting heads 61. Thereafter, returning to the flowchart of FIG. 6 which is the main routine, step S108 is executed. In step S108, it is determined whether there is an operation that can be performed during the component mounting interruption period T3. Specifically, based on the nozzle change target list stored in the storage unit 86, it is determined whether or not there is a mounting head 61 that is the target of nozzle change. When there is no mounting head 61 subject to nozzle change (in the case of “NO” in step S108), the component mounting apparatus 1 (machine) is stopped and waits for repair work by the operator. (Step S103).

  On the other hand, when there is a mounting head 61 subject to nozzle change (when “YES” in step S108), steps S109 and S110 are executed, and the mounting head 61 subject to nozzle change is executed. Nozzle change is executed for Specifically, the target mounting head 61 moves to the auto nozzle changer ANC, and the suction nozzle 62 is switched by the auto nozzle changer ANC. When there are a plurality of target mounting heads 61, the plurality of mounting heads 61 are sequentially moved to the auto nozzle changer ANC, and the suction nozzle 62 is switched. In this way, as shown in FIG. 5, during the period T4 in the interruption period T3, the nozzle change is executed for all the mounting heads 61 that are the target of the nozzle change. When all the nozzle changes are completed, the component mounting apparatus 1 (machine) is stopped and waits for repair work by the operator (step S103).

  Step S111 following step S103 is performed by the operator. That is, the operator who notices the operator call generated in step S101 rushes to the component mounting apparatus 1 and checks the content of the error display, and then repairs the error of the component mounting apparatus 1. Then, when the error is eliminated by the recovery work of the worker in the period T5 in the interruption period T3 shown in FIG. 5, the operation of the component mounting apparatus 1 (machine) is resumed, and the component mounting on the board S (n) is performed. Is resumed. Further, as shown in “actual operation when an error occurs” in FIG. 5, the next substrate S (n + 1) is taken out while the substrate S (n) is unloaded in the period T6 after the completion of component mounting on the substrate S (n). Is carried into the substrate. In addition, in the transfer period T6, the mounting head 61 in which the nozzle change was not executed in the interruption period T3 (in other words, the mounting head 61 that was not the target of the executable nozzle change) and the next substrate S ( Nozzle change is executed for the mounting head 61 that requires nozzle change for component mounting to (n + 1). Then, after this nozzle change is completed, component mounting on the board S (n + 1) is executed.

  In the actual operation example described above, the nozzle change of all the mounting heads 61 listed in the nozzle change target list is executed during the interruption period T3. However, among the mounting heads 61 listed on the nozzle change target list, only the nozzle changes of some of the mounting heads 61 may be performed during the interruption period T3, and the nozzle changes of the remaining mounting heads 61 may be performed during the transport period T6. . Specifically, when the operator who notices the operator call performs some operation on the component mounting apparatus 1, the nozzle change is stopped, and the incomplete nozzle change is performed in the transport period T6. Also good. Alternatively, the average time from the operator call until the worker rushes to the component mounting apparatus 1 is obtained, the length of the nozzle change period T4 is set to this average time, and the number of nozzles that fit within this period T4 Only the change may be performed in the interruption period T3, and the remaining nozzle changes may be performed in the transport period T6.

  As described above, in this embodiment, when an abnormality is detected in component mounting on one substrate S (n), the abnormality detection is notified to the operator and one substrate S (n) is detected. The component mounting for is interrupted. Then, after this abnormality is eliminated by the operator, component mounting on one board S (n) is resumed. The component mounting interruption period T3 affects the tact time. In addition, in this embodiment, after completing the component mounting on one substrate S (n), a predetermined process (nozzle change) other than the component mounting is executed. If they are stacked as they are during the interruption period T3, the tact time may be significantly increased.

  In order to cope with such a problem, in the present embodiment, when an interruption period T3 in which the component mounting on one board S (n) is interrupted occurs, if this interruption does not occur, the first board S (n) can be applied. A nozzle change (predetermined process) scheduled to be performed after completion of component mounting is executed during the interruption period T3. That is, an increase in tact time is suppressed by effectively using the interruption period T3. However, by performing such a nozzle change during the component mounting interruption period T3 (that is, before restarting component mounting), execution of component mounting after restart is hindered, and it takes time to restart component mounting. If the time required for component mounting after resumption increases, the tact time may increase as a result. Therefore, in this embodiment, among the nozzle changes that are scheduled to be performed after completion of component mounting on one board S (n), execution of component mounting after restarting on one board is performed even during the interruption period T3. An executable nozzle change that is not obstructed is executed in the interruption period T3 instead of after completion of component mounting on one board S (n). Therefore, the nozzle change that was scheduled to be executed after completion of component mounting on one board S (n) without taking time to restart component mounting or increasing the time required for component mounting after restarting. Can be executed during the interruption period T3. As a result, the time required for the nozzle change after the completion of component mounting on one board S (n) can be shortened by the time of the nozzle change whose execution timing is shifted to the interruption period T3. Thus, in this embodiment, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  In particular, in this embodiment, when the component mounting on one board S (n) is interrupted, the component mounting on the one board S (n) after restarting the suction nozzle 62 used as the use nozzle before the interruption is performed. It is determined whether or not to use. And when not in use, a nozzle change for switching the nozzle to be used to mount the component on the next board S (n + 1) on which the component is mounted next to the one board S (n), This is executed during the interruption period T3 as an executable nozzle change. In such a configuration, the suction nozzle is used as the nozzle used for component mounting on the next substrate S (n + 1) during the component mounting suspension period T3 (that is, before restarting component mounting) on the one substrate S (n). 62 is switched. However, the suction nozzle 62 after this switching is not used for component mounting after resumption on one substrate S (n). For this reason, even if the nozzles to be used are switched in this way, execution of component mounting after restarting on one board S (n) is not hindered. In addition, switching of the nozzles to be used is performed during the suspension period T3 of component mounting on one substrate S (n) instead of after completion of component mounting on one substrate S (n). ) The time required for the nozzle change after the completion of component mounting can be shortened. As a result, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  By the way, in the first embodiment, the nozzle change is executed as a predetermined process executed during the suspension period T3 of the component mounting on the board S (n). However, the predetermined process that can be executed in the interruption period T3 is not limited to the nozzle change. Therefore, it can be configured as in the following second and third embodiments.

Second Embodiment FIG. 8 is a timing chart showing an example of an operation executed by the component mounting apparatus in FIG. 1 in the second embodiment, where an upper column shows a production plan and an error occurs in a lower column. The actual operation at the time is shown. In FIG. 8, symbols S (n) and S (n + 1) indicate the substrates S that have been loaded into the nth and n + 1th sheets, respectively. As shown in the upper column of the figure, in this production plan, when the component mounting on the substrate S (n) is completed, the component inspection camera 91 images each electronic component P mounted on the substrate S (n), and Component inspection is performed to inspect the mounting state of each electronic component P based on the imaging result. Further, after completion of the component inspection, the board conveyance for carrying in the next board S (n + 1) while carrying out the board S (n) is executed, and the component mounting on the board S (n + 1) is executed. Is done. Then, as long as no error occurs in component mounting, the operation according to the production plan is executed. On the other hand, when an error occurs in component mounting, an actual operation at the time of the error occurrence shown in the lower column of FIG.

  The actual operation when this error occurs is basically executed according to the same flow as in FIG. 6 described in the first embodiment. However, in the second embodiment, the process execution unit 852 executes an inspection of the electronic component P mounted on the board as the predetermined process performed during the interruption period T3. Specifically, a subroutine shown in FIG. 9 is incorporated in the program 861 as a subroutine executed in step S107 of the flowchart of FIG. 6, and this is executed by the process execution unit 852 of the main control unit 85.

  FIG. 9 is a flowchart illustrating an example of a subroutine executed in the flowchart of FIG. 6 in the second embodiment. When the component mounting on the board S (n) is interrupted in step S106 of FIG. 6, the subroutine of FIG. 9 is executed in step S107 to search for the electronic component P to be inspected. Specifically, first, in step S301, a mounting position to be determined is selected from the mounting position of the electronic component P on the substrate S (n), and the electronic component P is selected with respect to the target mounting position. It is determined whether or not is mounted (step S301). If not mounted (in the case of “NO” in step S301), the mounting position is not inspected and the process proceeds to step S304.

  On the other hand, when it is determined in step S301 that the electronic component P is mounted at the target mounting position (in the case of “YES”), the electronic component P mounted at the target mounting position is replaced by the substrate S. It is determined whether or not the inspection is scheduled after the component mounting for (n) is completed. If it is determined that the inspection is not scheduled (NO in step S302), the electronic component P is not inspected and the process proceeds to step S304. On the other hand, if it is determined that the inspection is scheduled ("YES" in step S302), the electronic component P is added to the inspection object list stored in the storage unit 86 in step S303, and then step S304. Proceed to In step S304, it is determined whether or not the above determination has been performed for all the mounting positions of the substrate S (n). If there is an undetermined mounting position, this is selected as the target mounting position. The process returns to step S301.

  In this way, an inspection object list that is a result of searching for mounted electronic components P that can be inspected during the interruption period T3 is generated. Thereafter, returning to the flowchart of FIG. 6 which is the main routine, as in the nozzle change in the first embodiment, the mounting state of each electronic component P listed as the inspection target during the period T4 in the interruption period T3. Is inspected. Specifically, the component inspection camera 91 moves above the electronic component P to be inspected and images the electronic component P, and the image processing unit 84 determines whether or not the electronic component P is mounted based on the imaging result. Such an operation is performed for each electronic component P listed in the inspection target list.

  As shown in the “actual operation when an error occurs” in FIG. 8, following the completion of the component inspection, when the recovery by the worker in the period T5 of the interruption period T3 is completed, the component mounting on the board S (n) resumes. To do. Further, when the component mounting on the board S (n) is completed, the electronic component P that has not been inspected in the interruption period T3 (in other words, the electronic that has not been mounted on the board S (n) when the component mounting is interrupted). A mounting state inspection is performed on the component P). Then, after this inspection is completed, the board conveyance for carrying in the next board S (n + 1) while carrying out the board S (n) is executed, and the component mounting on the next board S (n + 1) is performed. Is started.

  In the actual operation example described above, the inspection for all the electronic components P listed in the inspection object list is executed during the interruption period T3. However, among the electronic components P listed in the inspection target list, only some of the electronic components P are inspected during the interruption period T3, and the remaining electronic components P are inspected for completion of component mounting on the substrate S (n). It may be performed in a later period T6. Specifically, when an operator who notices the operator call performs some operation on the component mounting apparatus 1, the component inspection is stopped, and the uninspected electronic component P is performed in the period T6. Also good. Alternatively, the average time from the operator call to the worker rushing to the component mounting apparatus 1 is obtained, the length of the component inspection period T4 is set to this average time, and the parts that fit within this period T4 are set. Only the inspection may be performed in the interruption period T3, and the remaining parts inspection may be performed in the period T6.

  As described above, this embodiment also has the same configuration as that of the first embodiment. Specifically, when an interruption period T3 in which component mounting on one board S (n) is interrupted occurs, it is scheduled to be performed after completion of component mounting on one board S (n). The parts inspection (predetermined processing) is executed during the interruption period T3. That is, an increase in tact time is suppressed by effectively using the interruption period T3. As a result, the time required for component inspection after completion of component mounting on one substrate S (n) can be shortened by the time of component inspection whose execution timing is shifted to the interruption period T3. Thus, in this embodiment, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  In particular, in this embodiment, when the component mounting on one board S (n) is interrupted, the component inspection for inspecting the mounting state of the electronic component P mounted on one board S (n) before the interruption is performed. It is executed as an executable process during the interruption period T3. That is, even if such mounting state inspection of the mounted electronic component P is performed during the component mounting suspension period T3 for one substrate S (n) (that is, before restarting component mounting), the one substrate S Execution of component mounting after restart for (n) is not hindered. In addition, the inspection of the mounting state of the mounted electronic component P is performed during the component mounting interruption period T3 for one substrate S (n) instead of after completion of the component mounting for one substrate S (n). It is possible to reduce the time required for the component inspection performed after the completion of component mounting on the substrate S (n). As a result, it is possible to suppress an increase in tact time even when component mounting is interrupted.

Third Embodiment In the first embodiment, the nozzle change is executed as the predetermined process, whereas in the third embodiment, the maintenance work of the mounting head 61 is executed instead of the nozzle change. Specifically, at least one of nozzle check and buffing check is performed as maintenance work. Here, the nozzle check is to check whether the suction nozzle 62 is dirty with a camera. In addition, the buffing check is provided in order to mitigate the impact applied to the suction nozzle 62 when the suction nozzle 62 mounts the electronic component P on the substrate S, for example, a buffing mechanism described in JP 2010-56334 A or the like. This is to confirm the operation.

  The third embodiment differs from the second embodiment in that the processing execution unit 852 executes maintenance work as a predetermined process instead of the nozzle change, and is otherwise common to the second embodiment. Therefore, in the following, description will be made with a focus on differences from the second embodiment, and description of common parts will be omitted as appropriate. In addition, it cannot be overemphasized that the same effect is show | played also in 3rd Embodiment by having the structure which is common in 2nd Embodiment.

  FIG. 10 is a flowchart illustrating an example of a subroutine executed in the flowchart of FIG. 6 in the third embodiment. When the component mounting on the board S (n) is interrupted in step S106 of FIG. 6, the subroutine of FIG. 9 is executed in step S107. Specifically, first, in step S401, it is determined whether or not there is a maintenance work to be performed in the transfer period T6 after the component mounting of the board S (n) is completed. Then, when there is no maintenance work scheduled to be performed (in the case of “NO” in step S401), the subroutine of FIG. 10 is terminated and the process returns to the main routine of FIG. On the other hand, when there is a maintenance work scheduled to be performed (in the case of “YES” in step S402), after adding the maintenance work to the execution target list stored in the storage unit 86, the subroutine of FIG. Returning to the main routine of FIG.

  In this way, an execution target list that is a result of searching for maintenance work that can be executed during the interruption period T3 is generated. Thereafter, returning to the flowchart of FIG. 6 which is the main routine, the maintenance work listed in the execution target list is executed during the period T4 in the interruption period T3, similarly to the nozzle change in the first embodiment.

  As described above, this embodiment also has the same configuration as that of the first embodiment. Specifically, when an interruption period T3 in which component mounting on one board S (n) is interrupted occurs, it is scheduled to be performed after completion of component mounting on one board S (n). Maintenance work (predetermined processing) is executed during the interruption period T3. That is, an increase in tact time is suppressed by effectively using the interruption period T3. As a result, the time required for maintenance work after completion of component mounting on one board S (n) can be shortened by the maintenance work time whose execution timing has been shifted to the interruption period T3. Thus, in this embodiment, it is possible to suppress an increase in tact time even when component mounting is interrupted.

  In particular, in this embodiment, when the component mounting on one board S (n) is interrupted, the maintenance work for maintaining the mounting head 61 is executed as an executable process in the interruption period T3. That is, even if such maintenance work is performed during the component mounting interruption period T3 for one board S (n) (that is, before the restart of component mounting), the component mounting after the restart for one board S (n) is performed. Will not be disturbed. Moreover, the maintenance work of the mounting head 61 is performed during the component mounting interruption period T3 for one substrate S (n) instead of after the completion of component mounting for the one substrate S (n). The time required for maintenance work after the completion of component mounting for S (n) can be shortened. As a result, it is possible to suppress an increase in tact time even when component mounting is interrupted.

Others As described above, in the first embodiment, the nozzle change corresponds to the “predetermined process” of the present invention, and in the second embodiment, the component inspection corresponds to the “predetermined process” of the present invention. The maintenance work corresponds to the “predetermined process” of the present invention. Moreover, in the said embodiment, the component mounting apparatus 1 is corresponded to the "component mounting apparatus" of this invention, the mounting head 61 is equivalent to the "mounting head" of this invention, and the alarm device 93 is the "notification part" of this invention. The main control unit 85 corresponds to the “detection unit”, “control unit”, and “process execution unit” of the present invention. In particular, the detection unit 851 corresponds to the “detection unit” of the present invention and the process execution unit 852. Corresponds to the “processing execution unit” of the present invention. Further, the main controller 85 corresponds to the “computer” of the present invention, the program 861 corresponds to the “control program for the component mounting apparatus” of the present invention, and the recording medium 862 corresponds to the “recording medium” of the present invention. .

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, in the above-described embodiment, any one of nozzle change, component inspection, and maintenance work is executed as the predetermined process. However, a plurality of processes selected from these may be executed as predetermined processes.

  Further, the specific contents of the “predetermined process” of the present invention are not limited to those described above, and various processes can be executed as the “predetermined process” of the present invention.

  Moreover, the component mounting apparatus 1 of the said embodiment was the structure which switches the adsorption | suction nozzle 62 of the mounting head 61 by the auto nozzle changer ANC. However, for example, as described in JP 2010-135487 A, a plurality of types of suction nozzles are attached around a rotatable nozzle assembly block, and the nozzle assembly block is used by rotating the nozzle assembly block. The present invention can also be applied to the component mounting apparatus 1 that switches the suction nozzle. Even in this case, it is possible to obtain an effect of suppressing an increase in tact time by executing the nozzle change as the “predetermined process” of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus 61 ... Mounting head 62 ... Adsorption nozzle 8 ... Control unit 85 ... Main control part 851 ... Detection part 852 ... Processing execution part 86 ... Storage part 861 ... Program 862 ... Recording medium 91 ... Component inspection camera 93 ... Information ANC ... Auto nozzle changer P ... Electronic components S ... Board

Claims (4)

Using a mounting head for mounting the component by switching a use nozzle used for component mounting to mount a predetermined component at a predetermined location from among a plurality of types of nozzles, a plurality of substrates to which the component mounting is conveyed In the component mounting device that executes sequentially on the
A detection unit for detecting an abnormality occurring during the mounting of the component on one substrate;
A notifying unit for notifying an operator that the detecting unit has detected an abnormality; and
In response to detecting the abnormality by the detection unit, the component mounting on the one substrate is interrupted, and when the abnormality is resolved by the operator, the control unit restarts the component mounting on the one substrate;
When the component mounting on the one substrate is not interrupted, the component mounting on the next substrate that performs the component mounting on the one substrate after the completion of the component mounting on the one substrate is performed. A process execution unit that executes a process of switching the use nozzle to the nozzle to be used ,
In the case where an interruption period in which the component mounting on the one substrate is interrupted occurs, the processing execution unit mounts the component on the one substrate after restarting the nozzle used as the use nozzle before the interruption. In the case of not using, in the case of not using, the process of switching the used nozzle to the nozzle scheduled to be used for mounting the component on the next board is performed by mounting the component on the one board. The component mounting apparatus is executed during the interruption period instead of after the completion of the step . The component mounting is performed sequentially on a plurality of substrates by using a mounting head that switches the use nozzle used for component mounting to mount a predetermined component at a predetermined location from among a plurality of types of nozzles and mounts the component. In the component mounting method to
When mounting the component on one substrate and detecting an abnormality in the component mounting on the one substrate, interrupting the component mounting on the one substrate while notifying the operator of the detection of the abnormality, A mounting step of resuming mounting of the component on the one board when the abnormality is resolved by a person,
When the component mounting on the one substrate is not interrupted, the component mounting on the next substrate that performs the component mounting on the one substrate after the completion of the component mounting on the one substrate is performed. While performing the process of switching the used nozzle to the nozzle to be used ,
Whether or not to use the nozzle used as the use nozzle before the interruption in the component mounting on the one board after resumption when the interruption period in which the component mounting on the one board is interrupted occurs . If not used, the process of switching the used nozzle to the nozzle scheduled to be used for mounting the component on the next board is replaced with the process after the mounting of the component on the one board is completed. A component mounting method which is executed during an interruption period . Using a mounting head for mounting the component by switching a use nozzle used for component mounting to mount a predetermined component at a predetermined location from among a plurality of types of nozzles, a plurality of substrates to which the component mounting is conveyed In the component mounting device control program to be executed sequentially,
A detection function for detecting an abnormality occurring during the mounting of the component on one board;
A notification function for notifying an operator that the detection function has detected an abnormality; and
In response to detecting the abnormality in the detection function, the component mounting on the one board is interrupted, and when the abnormality is resolved by the operator, the control function to resume the component mounting on the one board;
When the component mounting on the one substrate is not interrupted, the component mounting on the next substrate that performs the component mounting on the one substrate after the completion of the component mounting on the one substrate is performed. The computer implements a process execution function for executing a process of switching the used nozzle to the nozzle to be used ,
In the case where an interruption period occurs in which the component mounting on the one board is interrupted, the processing execution function is configured to mount the component on the one board after restarting the nozzle used as the use nozzle before the interruption. In the case of not using, in the case of not using, the process of switching the used nozzle to the nozzle scheduled to be used for mounting the component on the next board is performed by mounting the component on the one board. A program for controlling a component mounting apparatus, which is a function to be executed during the interruption period instead of after completion . A recording medium in which the control program for the component mounting apparatus according to claim 3 is recorded.

Images