KR101690622B1

KR101690622B1 - Probe for testing LED and Contact device having it

Info

Publication number: KR101690622B1
Application number: KR1020150060386A
Authority: KR
Inventors: 류호선
Original assignee: 주식회사 한라정밀엔지니어링
Priority date: 2015-04-29
Filing date: 2015-04-29
Publication date: 2016-12-28
Also published as: KR20160128668A

Abstract

The present invention relates to a probe used for inspecting an electrical connection state by applying power to an LED lead frame produced and a plurality of probes installed therein and associated with the contact device of the LED lead frame, And a probe pin electrically connected to the terminal of the LED chip and detachably connected to the receptacle, and a contact device for operating the probe.

Description

TECHNICAL FIELD [0001] The present invention relates to a probe for an LED probe and a contact device including the same,

The present invention relates to a probe used for inspecting an electrical connection state by applying power to the produced LED lead frame, and a plurality of probes installed therein, which are related to the contact device of the LED lead frame.

Before detaching the individual LED chips from the LED lead frame, it is checked whether or not each LED chip is defective by using the contact device.

The LED chip is arranged in the LED lead frame, and the contact device having the probe arranged corresponding thereto simultaneously contacts all the LED chips of the LED lead frame to apply power. In this way, it is possible to increase the inspection speed by performing the characteristic inspection in units of the LED lead frame.

On the other hand, in the case of a side view LED, a terminal is formed on the side surface of the LED, and electrical connection by the probe is also required on the side surface of the LED. Normally, the probes aligned in the contact device are moved up and down, and it is necessary to make a configuration change so as to come into contact with the terminal formed on the side surface of the side view LED through the upward movement of the probe. An invention to solve this problem has been disclosed in Korean Patent No. 10-1263703.

According to the related art, there is a disadvantage that an alignment position of the probe is easily disturbed by making electrical connection with a terminal formed on the side surface of the LED while elastically deforming the probe. In addition, as the number of times of inspection increases, the number of elastic deformation increases, and frequent replacement of the probe is required. It is difficult to individually replace the probe, which is a very small device, so that time and effort for maintenance are largely required.

Korean Registered Patent No. 10-1263703 (Feb. Korean Patent No. 10-1237140 (Feb.

The present invention proposes a separation structure for improving the convenience of maintenance of a probe electrically connected to an LED lead frame. And also improves the alignment performance of a plurality of probes provided in the contact apparatus.

Other objects and advantages of the present invention will become apparent to those skilled in the art from the following detailed description.

According to an embodiment of the present invention, there is provided a probe comprising: a receptacle in electrical contact with a power supply means of a contact device; and a probe pin detachably coupled to the receptacle and in contact with a terminal of the LED chip, present.

The probe pin may include a plate-shaped insert, a joint extending from the upper end of the insert, a bend extending from an upper end of the joint and curving toward the upper end, and a plate- And a connection unit.

The receptacle may include a support piece that is in surface contact with the fitting piece, a mounting portion that is connected to the lower end of the support piece and electrically connected to the contact device, and a connection portion that extends from the connection point of the support piece and the mounting portion, And an elastic portion that presses the fitting piece that is in contact with the supporting piece toward the supporting piece.

In another embodiment of the present invention, a rail mounting unit for temporarily fixing an LED lead frame to be inspected and a pin guide block to which a plurality of LED inspection probes are fixed are provided. The pin guide block is positioned above the pin guide block, There is provided a contact device including a pin guide for fixing a position of a pin, and a contact drive unit capable of moving up and down toward the rail mounting unit.

Wherein the pin guide block includes a bottom plate having a mounting hole into which the mounting portion is inserted and a plurality of protrusions that are spaced apart from the bottom plate to elastically deform the elastic portion toward the supporting piece upon mounting the receptacle, Side walls.

On the other hand, the diameter of the circular cross section of the joint part is formed to be larger than the thickness of the fitting piece, and the guide pin can be formed with a guide groove having a cross-sectional shape in contact with the outer peripheral surface of the joint part while allowing the insertion piece to pass through.

The rail mounting unit may be configured such that the probe pin is elastically deformed when the contact driving unit is lifted, and the inclined surface is in contact with the joint of the probe pin.

According to the embodiment of the present invention, the time and cost required for maintenance of the broken probe is reduced. In addition, the maintenance method is simplified, thereby improving convenience for the user.

The alignment of the probes is improved, and the inspection efficiency of the LED lead frame is increased. Further, there is an advantage that the contact between the terminal of the LED chip and the probe can be stably performed.

The effects of the present invention will be clearly understood and understood by those skilled in the art, either through the specific details described below, or during the course of practicing the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic perspective view of a contact device according to and in accordance with an embodiment of the present invention;
FIG. 2 is a perspective view illustrating an LED probe according to the embodiment shown in FIG. 1. FIG.
3 is a cross-sectional view of the embodiment shown in Fig.
FIG. 4 is a perspective view of a pin guide block employed in the embodiment shown in FIG. 1; FIG.
5 is an enlarged view of a portion A in Fig.
6 is a perspective view showing the pin guide employed in the embodiment shown in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings. It should be noted, however, that the same reference numerals are used for the same or similar components throughout the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, therefore, are not to be construed as limiting the technical spirit of the invention. It is to be understood that the invention is not to be limited by any of the details of the description to those skilled in the art from the standpoint of a person skilled in the art that any or all of the drawings shown in the drawings are not necessarily the shape,

FIG. 1 shows a main part of a contact apparatus according to an embodiment of the present invention.

The contact device 100 includes a rail mounting unit 10 for temporarily fixing an LED lead frame F to be inspected on an upper portion thereof and a probe 500 electrically connected to the right LED lead frame F on the rail mounting unit 10. [ And a contact drive unit (20) for connecting and performing a characteristic inspection.

The rail mounting unit 10 is formed with a rail-shaped upper surface on which a plate-shaped LED lead frame F is mounted. The rail mounting unit 10 has a through- A hole 11 is formed. The upper end of the probe 500 rises through the through-hole 11 to make electrical contact with a terminal formed on a side surface of the side view LED chip.

Although not shown, the rail mounting unit is further provided with a gripper for transporting the LED lead frame, and a mask for temporarily fixing the position where the right ELD lead frame is pressed or held on the rail mounting unit. Since the structures of such grippers and masks are widely used in the prior art, their detailed description is omitted.

The contact drive unit 20, on the other hand, has aligned probes, which rise from the bottom of the rail mounting unit to allow the probes to access the LED lead frame.

In the embodiment of the present invention, the contact drive unit 20 includes a pin guide block 21 to which the probe for inspecting the LED is fixed, and a pin guide block 21 which is located above the pin guide block 21 and grasps the probe 500, And a pin guide 22 for preventing the probe from moving arbitrarily.

The contact drive unit 20 further includes a printed circuit board 30 positioned below the pin guide block 21 for supplying power to the probe 500, a substrate fixing member 30 for fixing the printed circuit board 30 thereunder Plate (40).

And a control unit for applying power to the printed circuit board to determine whether or not the LED chip is defective based on whether or not each LED chip is energized, do.

Here, the driving unit may be configured to be movable in three dimensions (x-axis, y-axis, and z-axis directions) as well as in the vertical direction (z-axis) according to the embodiment.

FIG. 2 shows a probe according to an embodiment of the present invention.

The probe 500 is composed of two parts, that is, a receptacle 520 and a probe pin 510, which are assembled and used as one probe.

The receptacle 520 is connected to the printed circuit board 30 by soldering and is in electrical contact with the power supply means of the contact device.

The probe pin 510 is detachable from the receptacle 520 so that only the bad probe pin is replaced while the receptacle 520 is fixed to the printed circuit board 30. [ Thereby reducing the maintenance cost of the probe.

Specifically, the probe pin 510 includes a fitting portion 511 in the form of a long plate, a joint portion 512, a bending portion 513, and a connecting piece 514 that are sequentially connected to the upper portion of the fitting piece 511 ..

The fitting piece 511 is formed of a plate having a thickness, whereas the joining part 512 has a circular cross-section to increase the elasticity against bending. Repeated elastic deformation of the probe, which will be described later in more detail, is mainly performed in the joint portion 512. By forming the cross section of the joint portion into a circular shape, the probe pin 510 which has been elastically deformed can be more reliably restored.

The bent portion 513 extends from the upper end of the joint portion 512 and curves with a smaller curvature toward the upper portion. The connecting piece 514 formed at the upper end of the bent portion 513 is in a plate shape so as to be in contact with the terminal of the LED chip and to make stable surface contact with the terminal.

At this time, the connecting piece 514 and the fitting piece 511 are formed parallel to each other, meaning aligning the direction of the fitting piece 511 in accordance with the mounting direction of the probe pin 510.

On the other hand, the receptacle 520 includes a supporting piece 521, a mounting portion 522, and an elastic portion 523.

The supporting piece 521 is a plate-like portion that comes into surface contact with the fitting piece 511 of the probe pin 510.

The mounting portion 522 extends from the lower end of the supporting piece 521 and is electrically connected to the contact device. In other words, the mounting portion 522 is a portion fixed to the printed circuit board 30 by soldering.

The elastic portion 523 extends in an annular shape from a connection point between the support piece 521 and the mounting portion 522. The end portion of the elastic portion 523 faces the support piece 521 and presses the fitting piece 511 coming into contact with the support piece through the elasticity of the annular shape.

That is, the fitting piece 511 of the probe pin 510 enters between the supporting piece 521 and the elastic part 523, and at this time, the elastic part 523 presses the fitting piece 511 to press the supporting piece 521 and the elastic part 523, So that the fitting piece 511 placed between the upper and lower portions 523 is not detached.

Further, the support piece 521 can be slightly bent so that the end portion does not interfere with the insert piece 511 entering between the support piece 521 and the elastic portion 523 (refer to FIG. 5).

Figures 3 to 5 relate to the mounting and position fixing structure of the probe.

Referring to FIGS. 3 and 4, the arrangement of the receptacle 520 of the probe 500 is determined through the pin guide block 21.

In the bottom plate of the pin guide block 21, a plurality of mounting holes 212 through which the mounting portion 522 of the receptacle passes are vertically penetrated. A plurality of mounting holes 212 are arranged at specific intervals, and the arrangement relationship of the mounting holes 212 on the plane corresponds to the arrangement of LED chips provided in the LED lead frame. Therefore, the arrangement of the probes 500 in which the mounting portions are inserted into the mounting holes 212 is also matched with the arrangement of the LED chips to be inspected.

The lower end of the mounting portion 522 protrudes below the bottom plate through the mounting hole 212 and is electrically connected to the conductive pattern of the printed circuit board 30 by soldering.

On the other hand, a supporting side wall 213 is disposed between the mounting holes 212 formed side by side on the bottom plate 211. The support sidewalls 213 formed at the left and right of one of the mounting holes 212 are supported by the support piece 521 and the elastic portion 523 .

The support piece 521 and the resilient portion 523 of the receptacle 520 are in contact with the wall surface of the support side wall 213 so that the angle of the receptacles 520 mounted on the pin guide block 21 Are aligned in one direction. The mounting direction of the probe 500 inserted into the pin guide block 21 is consistently aligned while the elastic portion 523 and the supporting piece 521 are in surface contact with the supporting side wall 213. [

The gap between the support side walls 213 is formed to be smaller than the maximum width formed by the support piece 521 and the elastic portion 523 of the receptacle 520. When the receptacle 520 is inserted and the elastic portion 523 And is pressed against the support side wall 213 to elastically deform the support piece 521. So that the sandwiching portion of the probe pin entering between the elastic portion and the supporting piece is gripped more firmly.

Figures 3 and 6 relate to pin guides.

The plurality of probes 500 erected through the pin guide block 21 are cantilevered by the mounting portion 522 constituting the lower portion of the receptacle 520. [ Accordingly, the upper end of the probe which is in contact with the terminal of the LED chip may be easily displaced.

The pin guide 22 prevents the position of the upper end of the probe pin 510 where the connection piece 514 is located from being shifted by holding the intermediate portion of the probe pin 510. [ The pin guide 22 is fixed to the pin guide block 21 and grasps the arranged probes, respectively.

Referring to FIGS. 2 and 6, a plurality of guide grooves 221 for holding the probe pins 510 are formed in the pin guide 22 of the illustrated embodiment. The arrangement of the guide grooves 221 corresponds to the arrangement of LED chips on the LED lead frame to be inspected as in the arrangement of the mounting holes 212 of the pin guide block 21. [

On the other hand, in the probe pin 510, the diameter of the circular cross section of the joint 512 is larger than the thickness of the insert 511. The guide groove 221 of the pin guide 22 has a sectional shape that allows the fitting piece 511 and the joint part 512 to pass through in order according to the shape characteristic of the probe pin 510.

6 shows a guide groove 221 of a shape in which a substantially rectangular shape for passing the fitting piece 511 passes and a circular cross-sectional shape for gripping the joint portion are superimposed.

As a result, the probe pin 510 can be replaced through the guide groove 221 without detaching the pin guide 22 as shown in FIG. It is not necessary to separate the pin guide, the pin guide block, the printed circuit board, and the like in replacing the wrong probe pin. Therefore, the time required for the maintenance can be greatly reduced and the convenience is greatly improved.

After the insertion piece 511 passes, the joint 512 is held by the inner wall of the arcuate cross section facing the center of the guide groove 221. The joint 512 held on the inner wall of the arc-shaped cross-section does not allow movement of the joint 512 except for the vertical direction.

The lower end portion is gripped by the receptacle 520 and the middle portion of the joint 512 is held by the guide groove of the pin guide 22 so that the probe pin 510 is not displaced from the aligned initial position despite frequent elastic deformation . So that electrical contact with the LED chip repeatedly performed is stably performed.

Further, a process of aligning the mounting direction uniformly in mounting the probe pin 510 will be described. After the erroneous probe pin 510 is removed, the operator inserts a new probe pin along the guide groove 221 of the pin guide 22 and mounts it.

The lower end of the probe pin 510 descends vertically because the fitting portion 511 of the probe pin 510 and the joint portion descend along the long guide groove 221. Since the fitting piece 511 and the guide groove 221 have a non-circular section when the fitting piece 511 passes through the guide groove 221, the fitting piece 511 and the guide groove 221 are not arbitrarily rotated about the longitudinal direction of the probe pin 510 Do not. That is, the probe pin is lowered almost vertically without any rotation.

The fitting piece 511 enters between the supporting piece 521 of the receptacle and the elastic part 523 so that the large surface of the supporting piece 521 comes in contact with the supporting piece 521 and the elastic part 523 . The direction in which the insertion piece is coupled to the receptacle 520 is determined and the direction in which the connection piece 514 of the upper end of the probe pin 510 faces is also determined.

In this way, since the probe pins are mounted, the directions of the probes exposed on the pin guides are uniformly aligned.

3, the inclined surface 111 formed on the inner wall of the through hole 11 of the rail mounting unit 10 and the inclination angle of the probe pin 510 .

The inner wall of the through hole 11 is formed by the inclined surface 111. When the probe 500 rises as the contact drive unit 20 is lifted up, the joint portion 512 of the probe pin 510 is inclined to the inclined surface 111 And elastically deforms the probe pin 510 to move the connecting piece 514 in the lateral direction. At this time, although not shown, terminals formed on the side surface of the LED chip and the connection piece are electrically connected.

After the characteristic inspection is completed, the contact drive unit 20 is lowered and the probe pin 510 bent by the inclined surface 111 is restored to its original position and separated from the terminal of the LED chip.

The probe pin according to the embodiment of the present invention is divided into two parts, and only the probe pin can be replaced at the time of replacement, thereby reducing the maintenance cost and effort. In addition, the probe pin and the receptacle are fixed through physical coupling, thus improving the maintenance convenience.

Since the alignment of the protruding probes is very stable, the probability of failure of the electrical contact between the probe and the side view LED chips is greatly reduced. Accordingly, operation errors of the con- tact device can be reduced, and the time required for maintenance for the probe reordering can be reduced, thereby improving the inspection efficiency of the lead frame.

100:
10: rail mounting unit 11: through hole 111: inclined surface
20: contact drive unit
21: pin guide block 211: bottom plate 212: mounting hole 213: support side wall
22: pin guide 221: guide groove
30: printed circuit board 40: substrate fixing plate
500: Probe
510: probe pin 511: fitting piece 512: joint part 513: bent part 514:
520: receptacle 521: supporting piece 522: mounting portion 523:
F: LED lead frame

Claims

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A rail mounting unit for temporarily fixing the LED lead frame to be inspected and
And a pin guide which is located on an upper portion of the pin guide block and holds a joint of the probe to fix a position of the probe, Comprising: a contact drive unit
The probe for inspecting the LED includes a receptacle in electrical contact with the power supply means of the contact device, and a probe pin detachably coupled to the receptacle and in electrical contact with the terminal of the LED chip,
The probe pin may include a plate-shaped insert, a joint extending from the upper end of the insert, a bend extending from an upper end of the joint and curving toward the upper end, and a plate- Comprising:
In the probe pin, the fitting piece is formed of a plate having a thickness, and the joint part has a circular cross section to increase the elasticity against bending, and the diameter of the circular cross section of the joint part is formed larger than the thickness of the fitting part,
The pin guide has a plurality of guide grooves for holding the probe pins. The guide grooves have a rectangular shape for passing the insertion pieces of the probe pins and a circular cross-sectional shape for gripping the joints of the probe pins Wherein the probe pin and the coupling portion of the probe pin are allowed to pass through the guide groove in order,
The connection piece is moved in the lateral direction while the joint portion of the probe pin is brought into contact with the inclined surface formed on the inner wall of the through hole of the rail mounting unit in accordance with the upward movement of the contact drive unit
Contact device.

3. The method of claim 2,
Wherein the receptacle includes:
A supporting piece in surface contact with the fitting piece,
A mounting portion connected to the lower end of the supporting piece and electrically connected to the power supply means of the contact device,
And an elastic portion extending in an annular shape from a connection point between the support piece and the mounting portion and pressing an end piece which is in contact with the support piece toward the support piece,
The pin guide block includes:
A bottom plate having a mounting hole into which the mounting portion is inserted,
And a plurality of supporting sidewalls spaced apart from the bottom plate to elastically deform the elastic portion toward the supporting piece upon mounting the receptacle,
Contact device.

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