KR200456946Y1 - Jig for connecting lead pin - Google Patents

Jig for connecting lead pin Download PDF

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Publication number
KR200456946Y1
KR200456946Y1 KR2020100009870U KR20100009870U KR200456946Y1 KR 200456946 Y1 KR200456946 Y1 KR 200456946Y1 KR 2020100009870 U KR2020100009870 U KR 2020100009870U KR 20100009870 U KR20100009870 U KR 20100009870U KR 200456946 Y1 KR200456946 Y1 KR 200456946Y1
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KR
South Korea
Prior art keywords
lead pin
lead
jig
plate
wires
Prior art date
Application number
KR2020100009870U
Other languages
Korean (ko)
Inventor
최은호
Original Assignee
휴먼플러스(주)
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Publication date
Application filed by 휴먼플러스(주) filed Critical 휴먼플러스(주)
Priority to KR2020100009870U priority Critical patent/KR200456946Y1/en
Application granted granted Critical
Publication of KR200456946Y1 publication Critical patent/KR200456946Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The present invention relates to a jig for connecting a lead pin, the lead pin connecting jig for coupling the lead pins and wires for connecting to at least one circuit element according to the present invention, corresponding to the shape of the lead pins A lower plate on which lead pin seating grooves of a structure are formed; The upper plate is coupled to the lower plate and provided with a top plate for preventing detachment of the lead pins seated in the lead pin seating grooves, and a guide groove for guiding the wires corresponding to the lead pin seating grooves on one side of the top plate. Are formed, and the other side thereof has a structure in which a spring for fitting and fixing the wire is disposed adjacent to the guide grooves.
According to the present invention, by using the lead pin connecting jig, it is possible to mass-produce, reduce the manufacturing cost, and can easily respond to changes in the size or shape of the lead pin.

Description

Jig for connecting lead pin

The present invention relates to a jig device, and more particularly, to a plurality of lead pins can be soldered by connecting the wires at the same time, and relates to a lead pin connection jig that can respond to variations in shape or size of the lead pins.

In general, electrical and electronic components in which lead pins and wires are connected by soldering are widely used in various devices.

That is, the lead insertion hole is formed at one end of the wire insertion hole, and a wire connected to the signal of the chip into the wire insertion hole is soldered to connect the lead pin and the wire to manufacture the electrical and electronic components.

Conventionally, the lead pins and wires were connected by connecting wires to respective lead pin insertion holes and manually soldering them one by one with a soldering machine.

However, since the conventional method is made by hand, the production time is long, the production efficiency is low, and there is a problem that the manufacturing cost is high.

Therefore, an object of the present invention is to provide a jig for connecting a lead pin that can overcome the above-mentioned conventional problems.

Another object of the present invention is to provide a jig for connecting a lead pin that can easily connect a plurality of wires to a plurality of lead pins.

Another object of the present invention is to provide a jig for connecting a lead pin that can improve the production efficiency.

Still another object of the present invention is to provide a jig for connecting a lead pin that can cope with variations in lead pin size or shape.

According to an embodiment of the present invention for achieving some of the technical problems described above, a jig for connecting a lead pin for connecting to at least one circuit element according to the present invention and a lead pin for connecting a wire by soldering or the like, the A lower plate on which lead pin seating grooves having a structure corresponding to the shape of the lead pins are formed; The upper plate is coupled to the lower plate and provided with a top plate for preventing detachment of the lead pins seated in the lead pin seating grooves. Are formed, and the other side thereof has a structure in which a spring for fitting and fixing the wire is disposed adjacent to the guide grooves.

The lower plate may further include a fixing means for preventing the upper plate from moving or detaching when the upper plate is coupled to the upper plate.

According to another embodiment of the present invention for achieving some of the technical problems described above, the jig for connecting the lead pin for connecting the wire with the lead pin for connecting to at least one circuit element according to the present invention, removable A lower plate on which a mounting groove for mounting the middle plate is formed; A middle plate having a structure in which lead pin mounting grooves having a structure corresponding to the shape of the lead pins are formed on an upper surface thereof, and a lower surface of which is mounted on the mounting groove of the lower plate; The upper plate is coupled to the middle plate and provided with a top plate for preventing separation of the lead pins seated in the lead pin seating grooves, and a guide groove for guiding the wires corresponding to the lead pin seating grooves on one side of the top plate. Are formed, and the other side thereof has a structure in which a spring for fitting and fixing the wire is disposed adjacent to the guide grooves.

The lower plate may further include a fixing means for preventing the upper plate and the middle plate from moving or detaching when the upper plate and the middle plate is combined.

According to the present invention, mass production is possible by connecting the lead pins and the wires of the parts through the lead pin connecting jig and soldering them all at once, and there is an advantage in that even if the lead pin shape varies widely.

1 is a bottom plate structure diagram of a jig for connecting a lead pin according to a first embodiment of the present invention,
Figure 2 is a top plate structural diagram of a lead pin connecting jig according to the present invention,
3 is an exploded perspective view of a jig for connecting a lead pin according to the first embodiment of the present invention,
4 is an assembled perspective view of FIG. 3,
5 is an exploded perspective view of a lead pin connecting jig according to a second embodiment of the present invention,
6 is an assembled perspective view of the jig for connecting the lead pin of FIG. 5.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings without any intention other than to provide a thorough understanding of the present invention to those skilled in the art.

1 and 2 are structural views of the lower plate and the upper plate of the lead pin connecting jig according to the first embodiment of the present invention, Figures 3 and 4 are disassembled of the lead pin connecting jig according to the first embodiment of the present invention A perspective view and an assembled perspective view are shown.

1 to 4, the jig for connecting the lead pins according to the first embodiment of the present invention is composed of the upper plate 100 and the lower plate 200.

The lower plate 200 has a rectangular shape and includes a lead pin seating portion 220 in a predetermined region, preferably at an edge portion. A plurality of lead pin seating grooves 220a having a predetermined interval for seating the lead pins 310 is formed in the lead pin seating part 220, and the leads seated in the lead pin seating grooves 220a. The through hole 290 is formed in a portion where the insertion hole 310a of the pins 310 is exposed.

The plurality of lead pin seating grooves 220a may be formed to allow the lead pins 310 having various shapes and sizes to be seated corresponding to the shape and size of the lead pins 310.

The plurality of lead pin seating grooves 220a may have a structure in which only both end portions thereof may be seated so that lead pins having the same shape at both ends and different shape of the middle portion may be seated in one seating groove 220a. Can be formed. Therefore, the plurality of lead pin seating grooves 220a may be formed to have a stepped structure, and only the portions where both end portions are seated may be formed with grooves. This may vary depending on the structure of the lead pins 310.

When the lead pins 310 are seated on the lead pin seating portion 220a, one end of the lead pins 310 is a through hole of the lower plate 200 at an edge of the lead pin seating groove 320a. The lead pin seating grooves 220a are formed to be exposed to the portion 290, and wires 400 may be inserted into one end of the lead pins 310 exposed to the through hole 290. Insertion hole 310a is formed to be.

In addition, the lower plate 200 is further provided with a fixing means 250 for preventing the upper plate 100 from moving or leaving when combined with the upper plate 100. The upper plate 100 may be fixed to or separated from the lower plate 200 through the fixing protrusion 250a by rotating the fixing means 250 having the fixing protrusion 250a that is in contact with the lower plate 200. It is configured to be.

The upper plate 100 is firmly coupled to the lower plate 200 by the fixing means 250 to prevent separation of the lead pins 310 seated in the lead pin seating grooves 220a.

The upper plate 100 may have a support protrusion (not shown) for supporting the lead pins 310 having various shapes on the lower surface thereof in a lengthwise direction, and the guide grooves 110 and the spring 130 on the upper surface. Is provided.

The guide grooves 110 are for guiding the wires 400 connected to a circuit element corresponding to each of the lead pin seating grooves 220a. The guide grooves 110 are the lead pin seating grooves. It may be provided as the number of 220a, it may be formed corresponding to the position of the lead pin seating grooves (220a). The guide grooves 110 guide the wires 400 so that one end of the wires 400 are inserted into the insertion hole 310a of the lead pins 310 seated in the lead pin seating grooves 220a. To be possible. For reference, the other ends (parts not connected to the lead pins) of the wires 400 may be connected to a circuit element or a socket for connecting a circuit element.

The spring 130 is disposed on the other side of the upper plate 100 adjacent to the guide grooves, and is firmly mounted to the upper plate 100 through a fixing bar 130a that is coupled with a screw or the like.

The spring 130 is used to fix the wires 400 connected to the lead pins 310 so as not to move. The wires 400 are positioned to the spring 130 along the guide grooves 110 in a state where the wires 400 are inserted into the insertion holes 310a at the ends of the lead pins 310, and are inserted between the springs 130. It is fixed. The spring 130 has elasticity, and when the wires 400 are sandwiched therebetween, the wires 400 may be elastically fixed to minimize movement of the wires 400.

In this embodiment, although the lead pin seating part 220 is formed on both edges of the lower plate 200, a plurality of lead pin seating parts 220 may be formed according to the size of the lower plate.

Referring to the process of connecting the lead pin and the wire using the lead pin connection jig as follows.

In the state in which the lead pins 310 are seated in the lead pin seating grooves 220a, the upper plate 100 and the lower plate 200 of FIGS. 1 and 2 are fixed through the fixing means 250 to FIG. 4. Assemble as shown.

In this state, the wires 400 are inserted into the insertion holes 310a of the lead pins 310, the wires 400 are bent to be seated in the guide groove 110, and between the springs 130. To fix it. When the inserting of the lead pins 310 and the wires 400 is completed, the soldering process of dipping the jig into the lead bath is performed to complete the soldering operation between the wires 400 and the lead pins 310. Soldering between the wires 400 and the lead pins 310 may be performed using other methods well known to those skilled in the art.

After completion of the soldering operation, the lead pins 310 connected to the wires are separated through cutting and trimming to be applied to actual circuit components or circuits.

5 is an exploded perspective view of a lead pin connecting jig according to a second embodiment of the present invention, Figure 6 is an assembled perspective view of FIG.

5 and 6, the jig for connecting the lead pins according to the second embodiment of the present invention is composed of a lower plate 200, the middle plate 300, and the upper plate (100).

The lower plate 200 has a rectangular shape and forms a middle plate mounting groove 260 in a predetermined region, preferably at an edge portion. The mounting groove 260 is formed corresponding to the shape and size of the middle plate 300 so that the middle plate 300 can be mounted. The through hole 290 is formed at the other end of the lower plate 200 on which the middle plate 300 is mounted.

In addition, the lower plate 200 is further provided with a fixing means 250 for preventing the upper plate 100 and the middle plate 300 is moved or separated when combined with the upper plate 100 and the middle plate 300. . The upper plate 100 may be fixed to or separated from the lower plate 200 through the fixing protrusion 250a by rotating the fixing means 250 including the fixing protrusion 250a that is in contact with the lower plate 200. It is configured to be.

A plurality of lead pin seating grooves 320a having a predetermined interval for seating the lead pins 310 is formed on an upper surface of the middle plate 300. The structure of the lead pin seating grooves 320a is the same as that of the lead pin seating grooves 220a of FIGS. 1 to 4.

The plurality of lead pin seating grooves 320a may be formed to allow the lead pins 310 having various shapes and sizes to be seated in correspondence to the shape and size of the lead pins 310.

The plurality of lead pin seating grooves 320a may have the same shape at both ends, and may be mounted only at both end portions thereof so that the lead pins having different shapes of the middle portion may be seated in one seating groove 320a. It can be formed as. Therefore, the plurality of lead pin seating grooves 320a may be formed to have a stepped structure, and only the portions where both end portions are seated may be formed with grooves. This may vary depending on the structure of the lead pins 310.

When the lead pins 310 are seated on the lead pin seating portion 320a, one end of the lead pins 310 is a through hole of the lower plate 200 at an edge portion of the lead pin seating groove 320a. The lead pin seating grooves 320a are formed to be exposed to the portion 290, and wires 400 may be inserted into one end of the lead pins 310 exposed to the through hole 290. Insertion hole 310a is formed to be.

The middle plate 300 may form lead pin mounting grooves 320a having various shapes and sizes corresponding to the shape or size of the lead pins 310. Accordingly, when the shape or size of the lead pins 310 is changed by providing a plurality of middle plates having lead pin seating grooves 320a having various shapes and sizes in advance, the corresponding lead pin seating grooves 320a may be formed. By assembling the branch plate, it is possible to easily correspond to the shape or size variation of the lead pins (310).

In addition, the lower plate 200 is further provided with a fixing means 250 for preventing the upper plate 100 from moving or leaving when combined with the upper plate 100. The upper plate 100 and the middle plate 300 are connected to the lower plate 200 through the fixing protrusion 250a by rotating the fixing means 250 having the fixing protrusion 250a that is in contact with the lower plate 200. It is configured to be fixed or detachable.

The upper plate 100 and the middle plate 300 are firmly coupled to the lower plate 200 by the fixing means 250 to prevent the lead pins 310 mounted on the lead pin mounting grooves 320a from being separated. do.

The upper plate 100 may have a support protrusion (not shown) for supporting the lead pins 310 having various shapes on the lower surface thereof in a lengthwise direction, and the guide grooves 110 and the spring 130 on the upper surface. Is provided. The structure of the upper plate 100 is the same as described with reference to FIGS.

That is, the guide grooves 110 are for guiding the wires 400 connected to the circuit elements corresponding to each of the lead pin seating grooves 320a. The guide grooves 110 are the lead pin seating grooves. It may be provided in the same number as the number (320a), it may be formed corresponding to the position of the lead pin seating grooves (320a). The guide grooves 110 guide the wires 400 so that one end of the wires 400 is inserted into the insertion hole 310a of the lead pins 310 seated in the lead pin seating grooves 320a. To be possible. For reference, the other ends (parts not connected to the lead pins) of the wires 400 may be connected to a circuit element or a socket for connecting a circuit element.

The spring 130 is disposed on the other side of the upper plate 100 adjacent to the guide grooves, and is firmly mounted to the upper plate 100 through a fixing bar 130a that is coupled with a screw or the like.

The spring 130 is used to fix the wires 400 connected to the lead pins 310. The wires 400 are positioned up to the spring 130 along the guide grooves 110 in a state where the wires 400 are inserted into the insertion holes at the ends of the lead pins 310, and are inserted and fixed between the springs 130. The spring 130 has elasticity, and when the wires 400 are sandwiched therebetween, the wires 400 may be elastically fixed to minimize movement of the wires 400.

A process of connecting the lead pins 310 to the wires 400 using the lead pin connecting jig will be described below.

In the state in which the lead pins 310 are seated in the lead pin seating grooves 320a, the upper plate 100, the middle plate 300, and the lower plate 200 of FIG. 5 are fixed by the fixing means 250. Assemble as shown in 6.

In this state, the wires 400 are inserted into the insertion holes 310a of the lead pins 310, the wires 400 are bent to be seated in the guide grooves 110, and between the springs 130. To fix it. When the inserting of the lead pins 310 and the wires 400 is completed, the soldering process of dipping the jig into the lead bath is performed to complete the soldering operation between the wires 400 and the lead pins 310. Soldering between the wires 400 and the lead pins 310 may be performed using other methods well known to those skilled in the art.

After completion of the soldering operation, the lead pins 310 connected to the wires are separated through cutting and trimming to be applied to actual circuit components or circuits.

As described above, according to the present invention, the mass production is possible by connecting the lead pins and wires through the lead pin connecting jig, and the productivity is improved, and even if the lead pin size or shape varies widely, it can be easily coped with. There is an advantage.

Since the description of the above embodiment is merely an example with reference to the drawings for a more thorough understanding of the present invention, it should not be construed as limiting the present invention. In addition, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the basic principles of the present invention.

100: upper plate 130: spring 200: lower plate
250: fixing means 300: medium plate

Claims (9)

In a lead pin for connecting to at least one circuit element and a lead pin connecting jig for coupling with wires:
A lower plate on which lead pin seating portions for seating the lead pins are formed; The upper plate is coupled to the lower plate to prevent detachment of the lead pins seated on the lead pin seating portion, and a guide groove for guiding the wires corresponding to the lead pin seating portion is formed on one side of the upper surface of the upper plate. The other side jig for connecting the lead pins, characterized in that the other side has a structure in which a spring for fixing the wire is arranged. The method according to claim 1,
The lower plate jig for connecting a lead pin, characterized in that the fixing means for further preventing the separation of the upper plate is further provided. The method according to claim 1,
Lead pin seating jig for the lead pin seating portion is formed in the lead pin seating groove for receiving the lead pins, the through-hole is formed in a portion where one end of the lead pins are exposed. The method according to claim 3,
The lead pin seating recess jig for connecting the lead pin, characterized in that the structure corresponding to the shape of the lead pin has a predetermined interval and formed in plurality. The method according to claim 1,
The spring is a jig for connecting the lead pins, characterized in that adjacent to the guide grooves are arranged on the other side of the top plate and mounted through a fixing bar. In the lead pin connecting jig for coupling the wires and the lead pins to the at least one circuit element:
A lower plate on which a mounting groove for mounting the middle plate is formed;
Lead plate seating grooves are formed on the upper surface, the middle plate having a structure that the lower surface is mounted to the mounting groove of the lower plate;
Coupled with a portion of the lower plate and the middle plate is provided with a top plate for preventing the separation of the lead pins seated in the lead pin seating grooves, one side of the top surface of the top plate is formed with guide grooves for guiding the wires, The jig for connecting a lead pin, characterized in that the side has a structure in which a spring for fixing the wire is arranged. The method of claim 6,
The lower plate jig for connecting a lead pin, characterized in that the fixing means for preventing the separation of the upper plate and the middle plate is further provided. The method of claim 6,
The lead pin seating recess jig for connecting the lead pin, characterized in that the structure corresponding to the shape of the lead pin has a predetermined interval and formed in plurality. The method of claim 6,
The spring is a jig for connecting the lead pins, characterized in that adjacent to the guide grooves are arranged on the other side of the top plate and mounted through a fixing bar.
KR2020100009870U 2010-09-20 2010-09-20 Jig for connecting lead pin KR200456946Y1 (en)

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KR2020100009870U KR200456946Y1 (en) 2010-09-20 2010-09-20 Jig for connecting lead pin

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Application Number Priority Date Filing Date Title
KR2020100009870U KR200456946Y1 (en) 2010-09-20 2010-09-20 Jig for connecting lead pin

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KR200456946Y1 true KR200456946Y1 (en) 2011-11-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112485647A (en) * 2020-12-10 2021-03-12 深圳市奥伦德元器件有限公司 Optocoupler high-voltage testing device with loop testing function and testing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200431623Y1 (en) 2006-07-25 2006-11-23 손광자 Connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200431623Y1 (en) 2006-07-25 2006-11-23 손광자 Connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112485647A (en) * 2020-12-10 2021-03-12 深圳市奥伦德元器件有限公司 Optocoupler high-voltage testing device with loop testing function and testing method thereof

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