JP2019192820A - Workpiece processing apparatus and ball mounting apparatus - Google Patents

Abstract

To provide a plurality of workpiece processing apparatuses that can be arranged in any order corresponding to work processing, and a ball mounting apparatus in which the workpiece processing apparatuses can be combined arbitrarily and that can shorten a tact time, reduce size, and increase workpiece position accuracy.SOLUTION: A workpiece processing apparatus 1 includes a workpiece processing unit 11 including a workpiece stage 14, a first work transfer unit 15 in which a first workpiece placement table 12, the workpiece processing unit 11, and a second workpiece placement table 13 are arranged on a transfer locus L in this order, and that transfers a workpiece (wafer) W between the first workpiece placement table 12, the workpiece stage 14, and the second workpiece placement table 13, and a second workpiece transfer unit 16 that transfers the workpiece W between the second workpiece placement table 13 and the outside of the device, and ball mounting apparatuses 2, 3, 4, and 5 that include a plurality of workpiece processing apparatuses connected to each other, and in which one of the plurality of workpiece processing apparatuses 1 is a flux printing apparatus 56, and another is a ball transfer apparatus 57.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a workpiece processing apparatus and a ball mounting apparatus.

  In recent years, with the increase in the density of semiconductor chips, a ball mounting apparatus for mounting conductive balls having a small diameter on an electrode such as a substrate at a high density has been adopted as a semiconductor chip connecting means. The ball mounting apparatus prints a flux on an electrode such as a substrate as a workpiece and mounts a conductive ball on the electrode on which the flux is printed.

  Patent Document 1 discloses a ball mounting apparatus in which a flux printing unit that prints flux on a substrate and a ball transfer unit that transfers conductive balls onto the substrate on which flux is printed are linearly arranged on a first chassis. Is disclosed. In this ball mounting apparatus, the substrate moves on a common X rail in the order of a flux printing unit, which is a work processing apparatus, and a ball transfer unit, and performs flux printing and ball transfer in each unit. The substrate is transported from the material supply unit to the first moving work stage, and is transported to the flux printing apparatus while being placed on the first work stage. The substrate after flux printing is transported from the flux printing unit to the second moving work stage, and is transported to the ball transfer unit while being placed on the second moving work stage.

  A buffer unit is disposed between the flux printing unit and the ball transfer unit. The buffer unit temporarily sucks and holds the substrate on which the flux is printed by the handling unit, and when the second moving work stage moves below the buffer unit, the substrate is placed on the second moving work stage. To do. The first moving work stage conveys the substrate to the flux printing position. The second movable work stage conveys the substrate to the ball transfer position.

JP 2017-92342 A

  In the ball mounting device described in Patent Document 1, a flux printing unit and a ball transfer unit are linearly arranged on a common first chassis, and a buffer unit is arranged between the flux printing unit and the ball transfer unit. ing. Therefore, there is a problem that the overall length of the ball mounting device is increased and the device is enlarged. In addition, the control program is complicated because control related to substrate transfer such as driving of the buffer unit, transfer of the first moving work stage and transfer of the second moving work stage is individually performed. Have.

  Substrate conveyance from the flux printing unit to the ball transfer unit moves the first moving work stage to the buffer unit, sucks and holds the substrate with the handling unit, then moves the second moving work stage to the buffer unit, This is performed in a plurality of steps in which the substrate is transferred from the handling unit to the second movable work stage and transferred to the ball transfer unit. Therefore, since the first moving work stage, the handling unit, and the second moving work stage are sequentially driven in order to carry the substrate, there is a problem that the tact time becomes long.

  In addition, the flux printing unit and the ball transfer unit are arranged linearly on a common chassis, the buffer unit is arranged between the flux printing unit and the ball transfer unit, and handling in the buffer unit Because the unit only moves up and down, add another processing unit (for example, a ball transfer unit that transfers conductive balls with different diameters) to the flux printing unit and the ball transfer unit, and change the board transfer direction. There is a problem that there is no degree of freedom in arrangement of each unit such as changing.

  The first moving work stage and the second moving work stage move on a common X rail. The X rail extends from the material supply side to the material removal side of the substrate, and the position of the movement of the first moving work stage and the second moving work stage is generally managed by a linear encoder. Since the linear encoder is extended from the material supply side to the material removal side of the substrate in the ball mounting apparatus, the total length becomes long, and the amount of expansion / contraction due to temperature change increases, and the position accuracy may decrease.

  Furthermore, the handling unit is to suck and lift the processing side of the substrate with a suction pad, and since the handling unit is fixed to the buffer unit main body, the substrate with a warp, the substrate with unevenness on the suction surface, Some substrates cannot adsorb a substrate having a shape other than a square or a circle.

  Therefore, the present invention has been made to solve such a problem, and it is possible to arrange a plurality of units in an arbitrary order corresponding to the type of workpiece processing, and to the workpiece material and form. In spite of this, it is an object of the present invention to provide a work processing apparatus capable of transferring a work. Furthermore, the present invention provides a ball mounting device that can arbitrarily combine a workpiece conveyance direction and a plurality of types of workpiece processing devices, and can shorten tact time, reduce size, and increase workpiece position accuracy. It is something to be offered.

  [1] A work processing apparatus according to the present invention is a work processing apparatus capable of performing various types of processing on a work and connecting a plurality of units, and is disposed in the center of the upper surface of a base substrate to hold the work. A workpiece processing unit including a workpiece stage, a first workpiece table placed on one side of the workpiece conveyance path across the workpiece stage, and symmetrical with respect to the first workpiece table across the workpiece stage A second workpiece placement table disposed at a position, and a lower surface of the workpiece is adsorbed by a plurality of protrusions, and the workpiece is conveyed from the first workpiece placement table to the work stage, or from the work stage to the first workpiece placement table. A first work transport arm that transports the work to the work surface, and a plurality of protrusions that attract the lower surface of the work to the second work placing table from the work stage. Or a second workpiece transfer arm that transfers the workpiece from the second workpiece mounting table to the workpiece stage, and is spaced apart from the second workpiece mounting table in a direction orthogonal to the workpiece transfer locus. A lower surface of the workpiece is adsorbed by a plurality of protrusions and conveyed to the outside of the base substrate from the second workpiece table, or the workpiece on the outside of the base substrate is conveyed to the second workpiece table. And a three-work transfer arm.

  Here, the workpiece is a plate-like or film-like member for fixing and wiring the electronic component, for example, a printed wiring board, a silicon wafer, etc., and the outer shape is a circle, a rectangle, or the like Including Various types of processing include, for example, printing a flux on a workpiece and workpiece processing in which a conductive ball is mounted on a workpiece printed with flux. The workpiece processing unit is a unit that performs these processes on a workpiece. is there. Further, the lower surface of the workpiece is the back surface with respect to the workpiece processing surface.

  According to the work processing apparatus of the present invention, the work processing apparatus includes a work processing unit corresponding to various work processes, a first work transfer arm that transfers the work between the first work placing table and the work stage, A second workpiece transfer arm that transfers a workpiece between the workpiece stage and the second workpiece mounting table, and a third workpiece transfer that transfers the workpiece to the second workpiece mounting table and the outside (for example, another workpiece processing apparatus connected). Has an arm. The first work transfer arm, the second work transfer arm, and the third work transfer arm suck and transfer the lower surface side of the work with a plurality of protrusions. Therefore, it is possible to connect a plurality of units in an arbitrary order corresponding to the type of workpiece processing, and workpiece transfer is possible regardless of the workpiece material and form.

[2] In the work processing apparatus of the present invention, the first work transfer arm and the second work transfer arm are parallel to the work transfer locus of the work, and are affected and parallel to each other from the work transfer locus of the work. And the first workpiece transfer arm is rotatable about the first workpiece transfer arm axis so as to be orthogonal to the workpiece transfer locus, and the second workpiece transfer arm. Is rotatable about the second workpiece transfer arm axis so as to be orthogonal to the workpiece transfer locus, and the workpiece transfer direction distance (pitch P1) between the first workpiece mounting table and the workpiece stage, The workpiece transfer direction distance (pitch P2) between the workpiece stage and the second workpiece mounting table, and the warp between the first workpiece transfer arm shaft and the second workpiece transfer arm shaft. It is preferred click conveying direction distance (pitch P3) and are the same.

  The first workpiece transfer arm and the second workpiece transfer arm that are arranged in parallel with respect to the workpiece transfer trajectory have a posture in which the workpiece can be sucked by rotating each of them. The distance between the first workpiece placing table and the work stage (pitch P1) and the distance between the work stage and the second workpiece placing table (pitch P2) are the same, and the first work transfer arm axis and the second work transfer arm axis. (Pitch P3) is the same as pitch P1 and pitch P2. If it does in this way, it will become possible to carry out the workpiece conveyance by the 1st work conveyance arm and the 2nd workpiece conveyance arm at the same timing, and the above-mentioned prior art makes the 1st movement work stage and the 2nd movement work via the buffer unit. The tact time related to the conveyance can be shortened as compared with the configuration in which the stage is moved and the workpiece is conveyed. In addition, a control program related to workpiece conveyance can be simplified.

[3] In the workpiece processing apparatus according to the present invention, the third workpiece transfer arm moves in a direction orthogonal to the workpiece transfer locus, adsorbs the workpiece, and then moves the workpiece along the workpiece transfer locus. It is preferably controlled to move and convey the workpiece in synchronization with conveyance of the workpiece by the second workpiece conveyance arm.

  The timing at which the second work transfer arm picks up the work on the work stage and the timing at which the third work transfer arm picks up the work are matched, and the first work transfer arm and the second work transfer arm start to transfer the work. If the workpiece transfer by the third workpiece transfer arm is started at the timing, the loss of the workpiece transfer time in each transfer step can be suppressed, the transfer tact time can be shortened, and the productivity can be increased.

  [4] In the workpiece processing apparatus of the present invention, each of the workpiece stage, the first workpiece mounting table, and the second workpiece mounting table is composed of a plurality of workpieces that can be moved up and down while holding the workpiece when the workpiece is delivered. Each of the workpiece holding pins is lowered when the workpiece is transferred from each of the workpiece holding pins to each of the first workpiece transfer arm, the second workpiece transfer arm, and the third workpiece transfer arm. It is preferable to further have a holding pin up-and-down moving actuator.

  When starting the workpiece transfer, the first workpiece transfer arm, the second workpiece transfer arm, and the third workpiece transfer arm are moved to the lower surface side of the workpiece, and the workpiece is lowered by driving the workpiece holding pin to lower the workpiece. The workpiece is adsorbed after being placed on a plurality of protrusions of each work transfer arm. If it does in this way, it can adsorb | suck, without contacting the process surface of a workpiece | work. Further, since the workpiece is adsorbed by the protruding portion, it can be surely adsorbed even if the workpiece is warped or uneven.

  [5] In the work processing apparatus of the present invention, it is preferable that the first work transfer arm, the second work transfer arm, and the third work transfer arm are detachably fixed to an arm holder by an arm fixing block. .

  It is desirable for the workpiece processing apparatus to be capable of handling workpieces of various materials and forms (including shapes, presence / absence of warpage, presence / absence of additional parts, etc.). In the work processing apparatus of the present invention, each of the first work transfer arm, the second work transfer arm, and the third work transfer arm is detachably fixed to the arm holder. It can be selected and exchanged so as to suit the material and form, and can be exchanged in a short time.

  [6] A ball mounting apparatus according to the present invention is a ball mounting apparatus for mounting a conductive ball on a work, wherein a plurality of work processing apparatuses according to any one of claims 1 to 5 are linearly connected. One of the plurality of workpiece processing devices is a flux printing device having a flux printing unit that prints flux on the workpiece, and the other one is conductive to the workpiece on which the flux is printed. A ball transfer device having a ball transfer unit for transferring a conductive ball, a feed robot device for supplying the workpiece to the flux printing device, and the conductive ball of the workpiece into which the conductive ball is transferred And an inspection unit for inspecting the excess and deficiency of the material, and a material removal transfer robot device for removing material from the inspected workpiece.

  According to the ball mounting apparatus of the present invention, it is possible to configure by standardizing a configuration related to workpiece conveyance and connecting a plurality of workpiece processing devices that can be equipped with various workpiece processing units in an arbitrary order. Yes. Since each of the flux printing apparatus and the ball transfer apparatus includes a first work transport unit and a second work transport unit, the work transport direction is from left to right, and conversely from right to left. It becomes possible to select. For example, it is possible to connect another work processing apparatus between the first work transfer unit and the second work transfer unit, or to connect another work processing apparatus to the preceding stage or the subsequent stage. Compared with the configuration in which the above-described conventional technology moves the first moving work stage and the second moving work stage via the buffer unit to transfer the work, the total length of the apparatus can be shortened in the combination of the work processing functions, and the tact time required for the work transfer is reduced. Time can be shortened. In addition, a control program related to workpiece conveyance can be simplified. Furthermore, since the apparatus has a simple configuration without intermediate processing by the buffer unit, a stable workpiece transfer operation is possible.

  In the above-described conventional technology, the movement of the first moving work stage and the second moving work stage is generally managed by a linear encoder. In the prior art, since the linear encoder is extended from the material supply side to the material removal side of the substrate, the total length becomes long, and the amount of expansion and contraction due to temperature change increases, and the position accuracy may be lowered. In the ball mounting device of the present invention, the position of the workpiece can be managed for each workpiece processing device (flux printing device, ball mounting device), so that the linear encoder can be shortened, the influence of expansion and contraction due to temperature change can be suppressed, and the position accuracy of the workpiece Can be increased.

  Accordingly, it is possible to arbitrarily combine the workpiece conveyance direction and various types of workpiece processing devices, and it is possible to shorten the tact time, reduce the size, and increase the workpiece position accuracy.

  [7] In the ball mounting device of the present invention, the flux printing device and the plurality of ball transfer devices are linearly connected, and each of the plurality of ball transfer devices is a ball into which the conductive balls having different diameters are transferred. A configuration having a transfer unit is preferable.

  For example, by arranging in order of a flux printing device, a ball transfer device for transferring a conductive ball having a large diameter, and a ball transfer device for transferring a conductive ball having a small diameter, the ball mounting device has a plurality of types of conductive materials having different diameters in one system. It becomes possible to transfer the sex balls to the workpiece. In addition, if each ball transfer device synchronously drives the first work transfer arm, the second work transfer arm, and the third work transfer arm, for example, a configuration in which three types of conductive balls are transferred is one type. The cycle time for one cycle of ball mounting does not become longer.

  [8] In the ball mounting device of the present invention, an excess or shortage of the conductive balls transferred to the workpiece is detected between the ball transfer device and the transfer robot device for material removal, It is preferable that the work processing apparatus provided with a repair processing unit for transferring the conductive balls and removing excess conductive balls is further connected.

  This work processing apparatus has the first work transfer arm, the second work transfer arm, and the third work transfer arm described above in addition to the repair unit, and is connected to the ball transfer apparatus and the work transfer robot apparatus for ball transfer work. In addition, a ball mounting device capable of repair work can be realized. If the repair time is long, a plurality of work processing devices equipped with repair units may be connected. For example, if one unit is replenished and one unit is removed, the repair operation is performed. Even if is added, the tact time can be prevented from increasing.

  [9] In the ball mounting apparatus of the present invention, the function of conveying the work to the flux printing apparatus between the flux printing apparatus and the ball transfer apparatus, and the work on which the flux has been printed are made conductive. It is preferable that the transfer robot device having a function of transferring to the ball transfer device and a function of transferring the workpiece into which the conductive ball is transferred is connected.

  The conveyance robot device for feeding can be a conveyance robot device for material removal by a driving program, and vice versa. Accordingly, if both the material supply function and the material removal function are programmed in either the material supply robot apparatus or the material removal robot apparatus, a transfer robot apparatus having both functions can be obtained. If this transfer robot apparatus is arranged between the flux printing apparatus and the ball transfer apparatus, only one transfer robot apparatus is required, and thus further miniaturization is possible.

It is a top view which shows the structure of the workpiece processing apparatus 1 which concerns on embodiment. It is a figure which expands and shows the front view seen from the arrow direction of FIG. It is the side view which looked at FIG. 1 from the right side of illustration. FIG. 3 is a diagram showing a configuration of a first work transfer arm 20. FIG. 6 is an explanatory diagram showing an operation of the work processing apparatus 1. It is explanatory drawing which shows the workpiece conveyance operation | movement by the 2nd workpiece conveyance unit. 3 is a plan view showing a schematic configuration of a ball mounting device 2. FIG. It is a top view which shows an example of the structure of the wafer W as a workpiece | work. It is explanatory drawing which shows operation | movement of the flux printing unit 63 which prints the flux F on the wafer W. FIG. It is explanatory drawing which shows operation | movement of the ball transfer unit 65 which prints the flux F on the wafer W. FIG. FIG. 6 is a process flow diagram showing main processes of a ball mounting method by the ball mounting apparatus 2. It is a top view which shows the structure of the ball mounting apparatus 3 which concerns on 2nd Embodiment. It is a top view which shows the structure of the ball mounting apparatus 5 which concerns on 4th Embodiment.

  Hereinafter, a workpiece processing apparatus 1 and ball mounting apparatuses 2, 3, 4, and 5 according to an embodiment of the present invention will be described with reference to FIGS.

[Configuration of Work Processing Device 1]
FIG. 1 is a plan view showing the configuration of the work processing apparatus 1. 2 is an enlarged view of the front view seen from the direction of the arrow in FIG. 1, and FIG. 3 is a side view of FIG. 1 seen from the right side of the drawing. In FIG. 1, the left and right directions shown in FIG. 1 are described as the X direction, the direction orthogonal to X is the Y direction, and the vertical direction with respect to the XY plane is described as the Z direction or the up and down direction. explain. The workpiece processing apparatus 1 includes a workpiece processing unit 11 disposed at the center of the upper surface 10a of the base substrate 10 and a first workpiece mounting table 12 serving as a relay position for workpiece transfer on the left side of the workpiece processing unit 11 in the drawing. In addition, a second workpiece placing table 13 serving as a relay position during workpiece conveyance is disposed on the right side of the workpiece processing unit 11 in the figure. A straight line represented by an alternate long and short dash line connecting the center of the first workpiece mounting table 12 and the center of the second workpiece mounting table 13 is the conveyance locus L of the workpiece W. A work stage 14 that sucks and holds the workpiece W when processing the workpiece W is disposed at an intermediate position on a straight line connecting the first workpiece mounting table 12 and the second workpiece mounting table 13.

  As shown in FIG. 1, in the work processing apparatus 1, a first work transfer unit 15 is arranged on the lower side of the work processing unit 11 in the figure, and a second work transfer unit 16 is on the upper side of the second work table 13 in the figure. Is arranged.

  The first work table 12 has three work holding pins 17. The workpiece holding pin 17 holds the workpiece W conveyed to the first workpiece mounting table 12 from the lower surface side and can be moved up and down by a holding pin vertical movement actuator 18 (see FIG. 2) with respect to the base substrate upper surface 10a. It is a structure and the height of the workpiece | work W is adjusted. The second workpiece mounting table 13 has the same configuration as the first workpiece mounting table 12, has three workpiece holding pins 17, and is moved up and down by a holding pin vertical movement actuator 18 (see FIG. 3). Adjust the height of W. Note that the work holding pins 17 are not limited to three, and may have four or five. The second workpiece mounting table 13 holds the lower surface side of the workpiece W processed by the workpiece processing unit 11. The work stage 14 is provided with a work holding pin 19 that protrudes or retracts from the upper surface of the work stage 14. The work holding pin 19 raises or lowers the work W by a vertical movement actuator (not shown). When the work holding pin 19 is lowered, the work W is attracted by the work stage 14.

  As shown in FIGS. 1 and 2, the first work transfer unit 15 includes a first work transfer arm 20 and a second work transfer arm 21. The first workpiece transfer arm 20 and the second workpiece transfer arm 21 are parallel to the workpiece transfer locus L and separated in the Y direction. Each of the first workpiece transfer arm 20 and the second workpiece transfer arm 21 is pivotally supported on the first workpiece transfer arm shaft 23 with respect to the holding block 22, and is rotatable on the second workpiece transfer arm shaft 24. It is pivotally supported. The holding block 22 can reciprocate in the X direction on the X-axis slider 26 by an X movement actuator 25 (see FIG. 2). That is, both the first work transfer arm 20 and the second work transfer arm 21 can simultaneously reciprocate in the X direction.

  The first workpiece transfer arm 20 has a substantially U-shaped workpiece holding portion 27 whose tip side holds the lower surface side of the workpiece W with respect to the first workpiece transfer arm shaft 23. The first workpiece transfer arm 20 is rotated by a rotation actuator 31 (see FIG. 2). The first workpiece transfer arm 20 can be reciprocated in the Y direction by the Y moving actuator 28. Three protrusions 29 (see FIG. 4) are formed on the work holding portion 27.

  The second workpiece transfer arm 21 has a substantially horseshoe-shaped workpiece holding portion 30 whose tip side holds the lower surface side of the workpiece W with respect to the second workpiece transfer arm shaft 24. The work holding unit 30 is arranged to face the direction opposite to the work holding unit 27 of the first work transfer arm 2. The second workpiece transfer arm 21 is rotated by a rotation actuator 32 (see FIG. 2). Projection portions 33 are formed at three locations on the work holding portion 30, and are rotated by the rotation actuator 32 to attract the lower surface side of the workpiece W by the projection portions 33. The configuration of the first workpiece transfer arm 20 and the second workpiece transfer arm 21 and the workpiece transfer operation will be described in detail with reference to FIGS.

  Next, the structure of the 2nd workpiece mounting base 13 and the 2nd workpiece conveyance unit is demonstrated with reference to FIG. 1, FIG. Since the second workpiece mounting table 13 has the same configuration as the first workpiece mounting table 12, detailed description thereof is omitted, but the three workpiece holding pins 17 are provided. The workpiece holding pin 17 holds the workpiece W conveyed to the second workpiece mounting table 13 from the lower surface side. The workpiece holding pin 17 is raised or lowered by the holding pin vertical movement actuator 18 (see FIG. 3) to Adjust the height.

  As shown in FIGS. 1 and 3, the second workpiece transfer unit 16 has a third workpiece transfer arm 35. The third work transfer arm 35 has a substantially U-shaped work holding part 36, and is arranged so that the opening side of the work holding part 36 faces the second work placing table 13. Projecting portions 37 are provided at three locations on the upper surface of the work holding portion 36, and the projecting portions 37 attract the lower surface side of the work W. The third work transfer arm 35 may be shared with the first work transfer arm 20. As shown in FIG. 3, the third work transfer arm 35 reciprocates on the X-axis slider 40 in the X direction by the X movement actuator 39 via the holding block 38. In addition, a Y movement actuator 41 is disposed above the holding block 38, and reciprocates the third work transfer arm 35 in the Y direction. That is, the third workpiece transfer arm 35 is moved to the lower side of the workpiece W held on the second workpiece mounting table 13 to attract the workpiece W, and further, the workpiece W is moved to the right in the drawing on the X-axis slider 40. Transport. Although illustration is omitted, when the second work processing device is disposed adjacent to the right side of the work processing device 1, the second work processing device 13 to the first work mounting device (first work device) of the second work processing device. The workpiece W can be transferred to the mounting table 12). The reverse is also possible.

  Since the configuration of the first work transfer unit 15 has been described with reference to FIG. 2, the description thereof will be omitted, but the same reference numerals are given to FIG. 3 so that they can be compared with FIG. 2.

  Next, the positional relationship among the first work placing table 12, the second work placing table 13, and the work stage 14, and the first work transfer arm 20, the second work transfer arm 21, and the third work transfer arm 35 is described with reference to FIG. explain. The first work placing table 12, the work stage 14, and the second work placing table 13 are arranged on the work transport locus L at equal intervals. The distance (pitch P1) between the first workpiece stage 12 and the work stage 14 is the same as the distance (pitch P2) between the work stage 14 and the second workpiece stage 13. A distance (pitch P3) parallel to the workpiece transfer locus L between the first workpiece transfer arm shaft 23 and the second workpiece transfer arm shaft 24 has a relationship of pitch P1 = pitch P2 = pitch P3.

  Accordingly, the holding block 22 is moved to the left side in the figure, and the first work transfer arm 20 and the second work transfer arm 21 are rotated so that each work holding part 27 and work holding part 36 are orthogonal to the work transfer locus L. By moving, the first workpiece transfer arm 20 can suck the workpiece W on the first workpiece mounting table 12, and the second workpiece transfer arm 21 can suck the workpiece W on the workpiece stage 14. Then, if the holding block 22 is moved to the right side of the figure by the pitch P1 (pitch P2) while the workpiece W is attracted, the first workpiece transfer arm 20 transfers the workpiece W to the position of the workpiece stage 14, The second work transfer arm 21 can simultaneously transfer the work W to the position of the second work table 13.

  Conversely, if the work W is attracted by the first work transfer arm 20 and the second work transfer arm 21 at the position of the holding block 22 shown in FIG. 1 and moved to the left side of the figure by the pitch P1 (pitch P2), The first workpiece transfer arm 20 can transfer the workpiece W from the workpiece stage 14 to the first workpiece mounting table 12 position, and the second workpiece transfer arm 21 can transfer the workpiece W from the second workpiece mounting table 13 to the workpiece stage 14. it can.

  On the other hand, the third workpiece transfer arm 35 is disposed on a straight line L2 that passes through the center of the second workpiece mounting table 13 and is orthogonal to the workpiece transfer locus L. The third workpiece transfer arm 35 is located on the straight line L2 in the second direction. It is possible to move toward the work table 13 and suck the work W. After adsorbing the workpiece W, the third workpiece transfer arm 35 once moves upward in the drawing and further moves to the right in the drawing, so that the workpiece W can be transferred (material removal) from the second workpiece mounting table 13. Conversely, for example, the workpiece W can be transported to the second workpiece mounting table 13 from another workpiece processing device connected to the workpiece processing device 1. The workpiece transfer operation will be described with reference to FIG.

  The 1st work conveyance arm 20, the 2nd arm conveyance arm 21, and the 3rd work conveyance arm 35 have the structure which can be attached or detached. This will be described with reference to FIG. The first work transfer arm 20, the second arm transfer arm 21 and the third work transfer arm 35 have the same configuration although the shapes of the respective work holding portions are different, and thus the first work transfer arm 20 will be described as an example. To do.

  4A and 4B are diagrams showing the configuration of the first workpiece transfer arm 20, wherein FIG. 4A is a plan view, and FIG. 4B is a cut surface cut along the AA cutting line of FIG. FIG. The first workpiece transfer arm 20 includes a flange 45 and a workpiece holding portion 27 that is divided into two in a substantially U shape provided at the tip of the flange 45. The work holding portion 27 has projections 29 formed at three locations on the upper surface (surface on the workpiece suction side). In the example shown in FIG. 4, the heights of the three protrusions 29 are the same. A suction hole 46 is formed in the center of the protrusion 29 from the top surface. The suction hole 46 does not penetrate the lower surface side. The first workpiece transfer arm 20 is detachably fixed to the arm holder 47.

  A groove 48 is formed at the end of the arm holder 47 to which the first work transfer arm 20 is attached. The first work transfer arm 20 is fixed to the arm holder 47 by four fixing screws 50 from above through the arm fixing block 49 by inserting the collar portion 45 into the groove 48. The first work transfer arm 20 is attached to the rotation actuator 31 via the arm holder 48. The first workpiece transfer arm 20 is formed with hollow suction paths 51 communicating with the three suction holes 46, and the arm holder 47 is formed with suction paths 52. When the first work transfer arm 20 is attached to the arm holder 47, the suction path 51 and the suction path 52 communicate with each other. The suction path 52 is connected to a vacuum device (not shown). The second work transfer arm 21 has the same configuration as the first work transfer arm 20, but is attached to the rotation actuator 32 via the arm holder 47. The third workpiece transfer arm 35 is different in shape from the arm holder 47, but is attached to the Y-movement actuator 41 via the arm holder 47 having the same configuration (see FIG. 3).

  When exchanging the first workpiece transfer arm 20, first, the fixing screw 50 is loosened to lift the arm fixing block 49, and the first workpiece transfer arm 20 is pulled out from the arm holder 47 to the right in the drawing. Then, a work transfer arm can be attached by inserting a work transfer arm having a work holding portion of another shape into the gap between the groove 48 of the arm holder 47 and the arm fixing block 49 and tightening the fixing screw 50. Also in the 2nd workpiece conveyance arm 21 and the 3rd workpiece conveyance apparatus 35, it can remove and attach by the method similar to the 1st workpiece conveyance arm 20. FIG.

  In the first work transfer arm 20, the second work transfer arm 21 and the third work transfer arm 35 described above, an example in which the work W is vacuum-sucked has been described. However, suction based on the principle of Bernoulli chuck is possible. It is. In this case, compressed air is ejected from the suction hole 46. Therefore, the suction path 51 and the suction path 52 shown in FIG. 4 are compressed air paths, and a compressed air device is connected thereto.

[Work processing device operation]
FIG. 5 is an explanatory diagram showing the operation of the work processing apparatus 1. FIG. 5 illustrates the operations of the first work transfer arm 20 and the second work transfer arm 21 in FIGS. 5A to 5F in a simplified manner. Here, description of the configuration of the work processing apparatus 1 is omitted, but the same reference numerals as those in FIG. Further, in order to make the explanation easy to understand, it is described in a state where a part of the overlapping work W or the like is seen through. FIG. 5A shows one state when the work processing apparatus 1 is in operation, and since it is the same as the state described in FIG. 1, detailed description is omitted, but the first work placing table 12 and the work stage 14 are not described. It is assumed that the workpiece W is being conveyed. First, the holding block 22 is moved to the left in the figure.

  FIG. 5B shows a state where the holding block 22 is moved to the left side in the figure. The holding block 22 is moved to a position where the first workpiece transfer arm shaft 23 is on a straight line perpendicular to the workpiece transfer locus L from the center of the first workpiece mounting table 12. The second workpiece transfer arm shaft 24 moves on a straight line perpendicular to the workpiece transfer locus L from the center of the workpiece stage 14. Next, the first work transfer arm 20 and the second work transfer arm 21 are rotated.

  FIG. 5C shows a state in which the first work transfer arm 20 and the second work transfer arm 21 are rotated. Without moving the holding block 22 from the state shown in FIG. 5B, the first work transfer arm is centered on the first work transfer arm shaft 23 until the opening side of the work holding unit 27 faces the first work placing table 12. 20 is rotated. At this time, the first workpiece transfer arm 20 is at a position separated from the workpiece W. Next, the second workpiece transfer arm 21 is rotated clockwise around the second workpiece transfer arm shaft 24. Since the rotation destination side of the workpiece holding unit 30 is opened, the workpiece holding unit 30 enters between the workpiece W and the workpiece stage 14 (see FIG. 2). The rotation order of the first workpiece transfer arm 20 and the second workpiece transfer arm 21 may be simultaneous or may be rotated from either one. Further, the rotation direction of the first workpiece transfer arm 20 may be clockwise or counterclockwise. Next, the work W is sucked by the first work transfer arm 20 and the second work transfer arm 21.

  FIG. 5D shows a state in which the first work transfer arm 20 and the second work transfer arm 21 suck the work W. First, the first work transfer arm 20 is moved from the position of FIG. 5C toward the first work placing table 12 by the Y moving actuator 28. Since the work holding part 27 is open on the first work placing table 12 side, the work holding part 27 enters the lower surface side of the work W (see FIG. 2). Then, the work holding pins 17 and 19 are lowered to attract the work W to the first work transfer arm 20 and the second work transfer arm 21. After the suction, the work holding pins 17 and 19 are lowered to a position where they do not intersect the first work transfer arm 20 and the second work transfer arm 21 to transfer the work W to the right side in the figure.

  FIG. 5E shows a state in which the workpiece W is transferred by the first workpiece transfer arm 20 and the second workpiece transfer arm 21. First, the holding block 22 is moved on the X slider 26 to the right side in the figure. Specifically, the work holding unit 27 of the first work transfer arm 20 is held at the position of the work stage 14 and the work holding unit 30 of the second work transfer arm 21 is held until the position of the second work placing table 13 is reached. The block 22 is moved. When the workpiece holding parts 27 and 30 are moved to predetermined positions, the suction is released, and the workpiece holding pin 19 of the workpiece stage 14 and the workpiece holding pin 17 on the second workpiece mounting table 13 side are raised to convey the workpiece W to the first workpiece. The arm 20 and the second work transfer arm 21 are separated from each other. The workpiece W is held on the workpiece holding pins 19 of the workpiece stage 14 and the workpiece holding pins 17 on the second workpiece mounting table 13 side. That is, the workpiece W on the first workpiece mounting table 12 is transferred to the workpiece stage 14 and the workpiece W on the workpiece stage 14 is transferred to the second workpiece mounting table 13. After the workpiece W is transferred, the first workpiece transfer arm 20 and the second workpiece transfer arm 21 are returned to the transfer start position.

  FIG. 5F is a diagram showing a state in which the first work transfer arm 20 and the second work transfer arm 21 after transferring the work W are returned to the transfer start position (position shown in FIG. 5A). is there. First, the first workpiece transfer arm 21 is rotated counterclockwise about the second workpiece transfer arm shaft 24. Then, the first work transfer arm 20 is moved downward in the figure, and the first work transfer arm 20 is rotated clockwise or counterclockwise about the first work transfer arm axis to return to the transfer start state. The work stage 14 and the second work table 13 are on standby with the work W being conveyed. The first workpiece placement table 12 is in a state of waiting for material supply of a workpiece W from a workpiece supply device (for example, a transfer robot device) (not shown), and the workpiece W is placed on the first workpiece placement table 12 when continuously operating. Being supplied. After the workpiece W is transferred to the second workpiece mounting table 13, the workpiece W is removed from the workpiece processing apparatus 1 by the second workpiece transfer unit 16 or transferred to another workpiece processing apparatus to be connected.

  FIG. 6 is an explanatory diagram showing a workpiece transfer operation by the second workpiece transfer unit 16. FIG. 6 shows a simplified workpiece transfer operation of the third workpiece transfer arm 35 in the order of operation in FIGS. 6 (a) and 6 (b). Further, in order to make the explanation easy to understand, a part of the overlapping work W or the like is seen through. FIG. 6A shows a state in which the third work transfer arm 35 sucks the work W after the work W is transferred to the second work placing table 13 by the second work transfer arm 21. Accordingly, the third work transfer arm 35 is located at the position of the third work transfer arm 35 shown in FIG. 5E before the start of activation, and the second work transfer arm 35 is separated from the second work placing table 13. In position. As shown in FIG. 6A, the third work transfer arm 35 is moved from the position toward the second work placing table 13 by the Y moving actuator 41 and enters the lower part of the work W (see FIG. 3). Then, the work holding pin 17 is lowered and the work W is sucked by the work holding unit 36. After the suction, the workpiece holding pin 17 is further lowered to a position where it does not cross the workpiece holding portion 36, and the workpiece W can be transferred by the third workpiece transfer arm 35.

  FIG. 6B is a diagram illustrating an example in which the workpiece W is sucked and conveyed to another workpiece processing unit 1 connected to the right side in the drawing. Although the illustration of the other work processing unit 1 is omitted, it is assumed that the elements related to the work conveyance are the same as those shown in FIG. 1 and a work placing table 53 corresponding to the first work placing table 12 is arranged. The work table 53 is arranged on an extension line of the work conveyance locus L. After the workpiece is attracted, the third workpiece transfer arm 35 moves on the X-axis slider 40 to the right side in the figure and transfers the workpiece W to the workpiece table 53. At this time, the work holding pin 17 is lowered to a position where it does not cross the work holding part 36. After the work W is transported above the work placing table 53 by the third work transport arm, the vacuum suction of the work W is released, the work holding pin 17 is raised, and the work W is held by the work holding pin 17. Thereafter, the third work transfer arm 35 is moved upward in the figure by the Y moving actuator 41 to a position away from the work table 53. Then, one cycle of workpiece conveyance by the second workpiece conveyance unit is completed by moving the third workpiece conveyance arm 35 to the position shown in FIG.

  The workpiece processing apparatus 1 described above is a workpiece processing apparatus 1 that can perform various types of processing on the workpiece W and connect a plurality of workpieces. A workpiece processing unit 11 having a workpiece stage 14 to be held, a first workpiece table 12 arranged on one side of the workpiece W on the conveyance path L with the workpiece stage 14 in between, and a first workpiece table with the workpiece stage 14 in between. The second workpiece placing table 13 disposed at a symmetrical position with respect to 12 and the lower surface of the workpiece W are attracted by a plurality of protrusions 29, and the workpiece W is conveyed from the first workpiece placing table 12 to the work stage 14, or the work stage The first workpiece transfer arm 20 for transferring the workpiece W from the workpiece 14 to the first workpiece mounting table 12 and the lower surface of the workpiece are adsorbed by a plurality of projections, and the workpiece stage 14 transfers the second workpiece. Conveying the workpiece W to the table 13, or a second workpiece transfer arm 21 for transporting the workpiece W to workpiece stage 14 from the second work table 13. Further, the workpiece processing apparatus 1 is disposed away from the second workpiece mounting table 13 in a direction orthogonal to the conveyance trajectory L of the workpiece W, and adsorbs the lower surface of the workpiece W with a plurality of protrusions 29, and second A third work transfer arm 35 is provided for transferring the work W on the outside of the base substrate 10 from the work table 13 or transferring the workpiece W on the outside of the base substrate 10 to the second work table 13.

  The workpiece processing apparatus 1 includes a workpiece processing unit 11 corresponding to various workpiece processing, a first workpiece transfer arm 20 that transfers the workpiece W between the workpiece stage 14 and the first workpiece mounting table 12, and the workpiece stage 14. The workpiece W is transferred between the second workpiece transfer arm 21 that transfers the workpiece W between the second workpiece mounting table 13, the second workpiece mounting table 13, and the external device (the other workpiece processing device 1 to be connected). It has the 3rd workpiece conveyance arm 35 which conveys. Further, the first work transfer arm, the second work transfer arm, and the third work transfer arm suck and transfer the lower surface side of the work W by a plurality of protrusions 29, 33, and 37, respectively. Accordingly, it is possible to arrange a plurality of units in an arbitrary order corresponding to the type of processing of the workpiece W, and it is possible to convey the workpiece regardless of the material and form of the workpiece.

  Further, in the work processing apparatus 1, the first work transfer arm 20 and the second work transfer arm 21 are parallel to the work trajectory L of the work W and are separated from each other in parallel with the work trajectory L of the work. It moves in synchronization with the conveyance direction of W at the same time. The first workpiece transfer arm 20 is rotatable about the first workpiece transfer arm shaft 23 so as to be orthogonal to the transfer locus L of the workpiece W, and the second workpiece transfer arm 21 is rotated by the second workpiece transfer arm shaft 24. Can be rotated so as to be orthogonal to the conveyance locus L of the workpiece W. A distance (pitch P1) in which the workpiece W is conveyed between the first workpiece stage 12 and the work stage 14, a distance in the conveyance direction (pitch P2) of the workpiece W between the workpiece stage 14 and the second workpiece stage 13, and the first workpiece conveyance. The transfer direction distance (pitch P3) of the workpiece W between the arm shaft 23 and the second workpiece transfer arm shaft 24 is the same.

  In the workpiece processing apparatus 1, the first workpiece transfer arm and the second workpiece transfer arm arranged in parallel with respect to the workpiece transfer trajectory are in a posture capable of attracting the workpiece by rotating. The distance (pitch P1) between the first workpiece mounting table 12 and the work stage 14 is the same as the distance (pitch P2) between the work stage 14 and the second workpiece mounting table 13, and the first workpiece transfer arm shaft 23 and The distance (pitch P3) from the two-work transfer arm shaft 24 is the same as the pitch P1 and the pitch P2. If it does in this way, it will become possible to perform the workpiece conveyance by the 1st workpiece conveyance arm 20 and the 2nd workpiece conveyance arm 21 at the same timing, and the above-mentioned prior art and the 2nd movement workpiece stage and the 2nd through the buffer unit. It is possible to shorten the tact time related to the transfer, compared to the configuration in which the moving work stage is moved to transfer the work. In addition, a control program related to workpiece conveyance can be simplified.

  In the workpiece processing apparatus 1, the third workpiece transfer arm 35 moves in a direction perpendicular to the workpiece transfer locus L and sucks the workpiece W, and then moves the workpiece W along the workpiece W transfer locus L. The workpiece W is controlled to be conveyed in synchronization with the workpiece conveyance by the first workpiece conveyance arm 20 and the second workpiece conveyance arm 21.

  The timing at which the second workpiece transfer arm 21 attracts the workpiece W on the workpiece stage 14 and the timing at which the third workpiece conveyance arm 35 attracts the workpiece W are matched, and further, the first workpiece conveyance arm 20 and the second workpiece conveyance arm. If the workpiece 21 is started to be transferred by the third workpiece transfer arm 35 at the timing when the workpiece 21 starts transferring the workpiece W, it is possible to suppress the loss of the workpiece transfer time in each transfer step, and the tact time related to transfer is reduced. It is possible to increase productivity.

  In the workpiece processing apparatus 1, each of the workpiece stage 14, the first workpiece mounting table 12, and the second workpiece mounting table 13 has a plurality of workpiece holding pins 17 that can be moved up and down while holding the workpiece W when the workpiece W is delivered. And when the workpiece W is delivered from each workpiece holding pin 17 to each of the first workpiece conveying arm 20, the second workpiece conveying arm 21 or the third workpiece conveying arm 35, the workpiece holding pins 17 are moved up and down. An actuator 18 is further provided.

  When starting the workpiece conveyance, the first workpiece conveyance arm 20, the second workpiece conveyance arm 21 and the third workpiece conveyance arm 35 move to the lower surface side of the workpiece W, and drive the three workpiece holding pins 17. By lowering the workpiece W, the workpiece W is adsorbed after being placed on the plurality of projections 29, 33, 37 of each workpiece transfer arm. In this way, the workpiece W can be adsorbed without contacting the processing surface of the workpiece W, and the workpiece W is adsorbed by the projections 29, 33, 37. Therefore, the workpiece W may be warped or uneven. However, it can be reliably adsorbed. In the present embodiment, there are three protrusions 29, 33, and 37, and the top surface height is the same. However, the number of protrusions 29, 33, and 37 may be further increased. The height of the top surface may be changed according to the form.

  In the work processing apparatus 1, the first work transfer arm 20, the second work transfer arm 21, and the third work transfer arm 35 are detachably fixed to the arm holder 47 by an arm fixing block 49. In this way, the shape of each work transfer arm can be selected and exchanged so as to match the material and form of the work W, and can be exchanged in a short time. The shape of the transfer arm is not limited to a substantially U shape or a substantially horseshoe shape, but also includes a shape in the thickness direction, the number and height of the protrusions 29, 30, and 37.

[Configuration of Ball Mounting Device 2 (First Embodiment)]
Next, the ball mounting apparatus 2 according to the first embodiment will be described with reference to FIGS. The workpiece W described in the following embodiment is a plate-like or film-like member for fixing and wiring an electronic component, for example, a printed wiring board, a silicon wafer, etc. Includes circles, squares, and other shapes. Therefore, the workpiece W described below is referred to as a wafer and is referred to as a wafer W. In addition, the conductive balls described in the following embodiments are conductive balls such as solder balls, metal balls, conductive plastic balls, conductive ceramic balls, and the like having a conductivity of 30 μm to 300 μm. 8 or conductive balls 9 will be described.

  FIG. 7 is a plan view showing a schematic configuration of the ball mounting apparatus 2. In the following description, in FIG. 7, the horizontal direction shown in the figure is the X axis, the direction orthogonal to the X axis is the Y axis, and the vertical direction with respect to the XY plane is the Z axis or the vertical direction. The ball mounting device 2 includes a transfer robot device 55 that is a material supply device for the wafer W, a flux printing device 56 that prints the flux F on the wafer W, and the conductive balls 8 (see FIG. 10) and a transfer robot device 58, which is a material removal device for the wafer W onto which the conductive balls 8 have been transferred. The transfer robot device 55, the flux printing device 56, the ball transfer device 57, and the transfer robot device 58 are linearly connected in the X direction. The flux printing device 56 and the ball transfer device 57 are devices each having a flux printing function or a ball transfer function as the workpiece processing unit 11 of the workpiece processing device 1 described above.

  The transfer robot device 55 supplies the wafer W accommodated in a FOUP (Front-Opening-Unified-Pod) 73 disposed in each of the first load port 59 and the second load port 60 to the flux printing device 56. The robot arm 61 is provided. The robot arm 61 picks up the wafer W from either the first load port 59 or the second load port 60 and transports the wafer W to the pre-aligner 62, corrects the position of the wafer W in the pre-aligner 62, and then is provided in the flux printing device 56. It is transferred to the first work table 12.

  The flux printing device 56 is obtained by mounting the flux printing unit 63 as the workpiece processing unit 11 on the workpiece processing device 1 described above. In FIG. 7, the same reference numerals as those in FIG. 1 are attached to common parts with the work processing apparatus 1 shown in FIG. 1. In the flux printing device 56, the work stage 14 that sucks and holds the wafer W during flux printing, the first work placing table 12 on the left side in the drawing with the work stage 14 interposed therebetween, and the second work placing table 13 on the right side in the drawing. Is arranged. A first work transfer unit 15 is disposed below the work stage 14 in the figure, and the first work transfer unit 15 includes a first work transfer arm 20 and a second work transfer arm 21. A flux printing mask 64 is disposed above the work stage 14 on the Z axis, and the flux F is printed on the wafer W by a printing squeegee 72 (see FIG. 9). Since the method of transporting the wafer W in the flux printing apparatus 56 has been described with reference to FIG. 5, the description thereof is omitted here. The flux printing method will be described with reference to FIG. The wafer W on which the flux F is printed is transferred to the second work placing table 13 and then carried to the first work placing table 12 of the ball transfer device 57 by the third work carrying arm 35 of the second work carrying unit 16.

  The ball transfer device 57 is provided with a ball transfer unit 65 as the work processing unit 11 in the work processing device 1 described above. In FIG. 7, the same reference numerals as those in FIG. 1 are attached to common parts with the work processing apparatus 1 shown in FIG. 1. The ball transfer device 57 includes a work stage 14 that sucks and holds the wafer W during ball transfer, a first work placing table 12 on the left side of the drawing with the work stage 14 interposed therebetween, and a third work placing table 13 on the right side. Has been placed. A first work transfer unit 15 is disposed below the work stage 14 in the figure, and the first work transfer unit 15 includes a first work transfer arm 20 and a second work transfer arm 21. A ball transfer mask 66 is disposed above the work stage 14 along the Z axis, and the conductive balls 8 are transferred onto the wafer W by a brush squeegee 67 (see FIG. 10). Since the transfer method of the wafer W in the ball transfer apparatus 57 has been described with reference to FIGS. 5 and 6, the description thereof is omitted here. The ball transfer method will be described with reference to FIG. The wafer W onto which the conductive ball 8 has been transferred is transferred to the second workpiece mounting table 13 of the ball transfer device 57 and then the inspection unit of the transfer robot device 58 by the third workpiece transfer arm 35 of the second workpiece transfer unit 16. It is conveyed to 68.

  The transfer robot device 58 includes an inspection unit 68 that inspects the excess or deficiency of the conductive balls 8 in the wafer W to which the conductive balls 8 are transferred, and the third load port 69 or the wafer W to which the conductive balls 8 are transferred. And a robot arm 71 for conveying to the fourth ball port 70. In the third load port 69 and the second load port 70, a FOUP 74 for accommodating the wafer W to be removed from the inspection unit 68 by the robot arm 71 is disposed. Although not shown, the inspection unit 68 includes an inspection camera unit that inspects the excess or deficiency of the conductive balls 8 on the wafer W. The inspection unit 68 is disposed at the same position as the first work table 12 in the ball transfer device 57, and inspects the excess or deficiency of the balls on the wafer W while scanning the inspection camera in the X direction and the Y direction. The inspection camera may be fixed and the wafer W may be moved. Note that the robot arm 61 and the robot arm 71 have a common configuration, and are driven and controlled by a program for material supply and material removal. Next, the configuration of the wafer transfer target wafer W will be described with reference to FIG.

  FIG. 8 is a plan view showing an example of the configuration of the wafer W as a workpiece. FIG. 8A is a plan view showing the entire wafer W, and FIG. 8B is an electrode formation region (formation region of the semiconductor integrated circuit 76) 75 surrounded by a dotted line A shown in FIG. It is a figure which expands and shows a part of. The semiconductor integrated circuit 76 becomes a semiconductor integrated circuit chip separated by cutting along a scribe line 81 provided between a group of electrodes 77. The semiconductor integrated circuit 76 is cut after the wafer W on which the conductive balls 8 are mounted is reflowed by a reflow apparatus or at the end of the mounting process. The electrode 77 is a rewired electrode. The pitch of the electrodes 77 is approximately 50 μm to 400 μm. FIG. 8 is for explaining the electrode 77 formed on the wafer W and the arrangement of the electrode forming region 75 where the electrode 77 is formed. The size and distribution of the electrodes and the shape of the electrode forming region 35 are illustrated. Is different from the real thing.

[Flux printing method]
FIG. 9 is an explanatory view showing the operation of the flux printing unit 63 for printing the flux F on the wafer W. FIG. 9A is a cross-sectional view schematically showing the flux printing operation, and FIG. It is a figure which expands and shows the range enclosed by the dotted line A of 9 (a). The flux printing is performed using the flux printing mask 64 and the printing squeegee 72 in a state where the wafer W is vacuum-sucked by the vacuum suction holes 80 on the work stage 14. The printing squeegee 72 is made of a flexible resin so as not to damage the flux printing mask 64. The wafer W is adjusted by a stage vertical drive actuator (not shown) so as to have a predetermined gap with respect to the flux printing mask 64.

  The printing squeegee 72 prints the flux F on the electrode 77 of the wafer W while moving in the direction of the arrow while pressing the flux printing mask 64 to a position in contact with the wafer W. In FIG. 9B, the position of the left mask opening 78 is position (1), the position of the intermediate mask opening 78 is position (2), and the position of the right mask opening 78 is position (3). . On the wafer W, a recess 79 is formed at a position where the conductive ball 8 is transferred, and an electrode 77 is formed on the bottom of the recess 79. The position (1) represents the flux F immediately after the printing squeegee 72 passes through the mask opening 78, and the flux F does not protrude from the surface of the flux printing mask 64. The flux F is accommodated in the recess 79 so as to contact the electrode 77. The position (2) represents the state immediately before the printing squeegee 72 prints the flux F from the mask opening 78 to the wafer W. Position (3) represents the mask opening 78 to be printed next. When the flux printing mask 64 is released after the squeegee operation is finished, the flux F is transferred to the electrode 77 and the flux printing is completed. The wafer W on which the flux is printed is transferred to the ball transfer device 57 by the second work transfer unit 16, and the ball transfer is performed by the ball transfer unit 65.

[Ball transfer method]
10A and 10B are views showing the operation of the ball transfer unit 65 that transfers the conductive ball 8 to the wafer W. FIG. 10A is a cross-sectional view schematically showing the ball transfer operation, and FIG. It is a figure which expands and shows the range enclosed by the dotted line A of 10 (a). In the ball transfer unit 65, the ball transfer is performed using the ball transfer mask 66 and the brush squeegee 67 in a state where the wafer W on which the flux F is printed is vacuum-sucked on the work stage 14. The brush squeegee 67 is composed of a bundled linear member having an end embedded in a brush mounting portion 86 below the ball transfer portion 85. The ball transfer mask 66 is vacuum-sucked by a vacuum suction hole 88 provided in the work stage 14 and provided in the vacuum suction hole 80 and the clamp ring 87, and the ball transfer mask 66 is placed on both upper surfaces of the wafer W and the clamp ring 87. The balls can be transferred even in the vicinity of the outer periphery of the wafer W.

  The brush squeegee 67 moves in the X direction and the Y direction while rotating, and the conductive ball 8 supplied from the ball transfer portion 85 into the rotation locus of the brush squeegee 67 is transferred to the ball transfer hole 89 of the ball transfer mask 66 ( Transfer to FIG. 10 (b)).

  As shown in FIG. 10B, the conductive balls 8 supplied onto the ball transfer mask 66 are transferred one by one into the ball transfer hole 89 by the brush squeegee 67. A flux F is applied on the electrode 77 of the wafer W. The conductive ball 8 is lightly pressed against the flux F by the brush squeegee 67, so that the conductive ball 8 is temporarily fixed by the adhesiveness of the flux F, and is maintained temporarily in the subsequent wafer conveyance. Next, a ball mounting method (a series of steps of wafer supply, flux printing, ball transfer, inspection, and wafer removal) will be described with reference to FIG.

[Ball mounting method]
FIG. 11 is a process flow diagram showing the main processes of the ball mounting method by the ball mounting apparatus 2. This will be described with reference to FIGS. First, the wafer W is transferred from the first load port 59 or the second load port 60 to the pre-aligner 62 by the robot arm 61 (step S1). In the pre-aligner 62, the position of the wafer W is corrected (step S2). Next, the position-corrected wafer W is transferred to the flux printing apparatus 56 by the robot arm 61 (step S3). Specifically, the robot arm 61 transports the wafer W from the pre-aligner 62 to the first work table 12 of the flux printing apparatus 56, and the first work transport arm 20 transfers the wafer W from the first work table 12 to the work stage 14. Transport.

  Next, the flux printing unit 63 is driven to print the flux F on the wafer W (step S4). Specifically, in the flux printing unit 63, the printing squeegee 72 is scanned on the flux printing mask 64 to print the flux F on the electrode 77 of the wafer W. The wafer W on which the flux is printed is transported to the second work placing table 13 on the flux printing device 56 by the second work transport arm 21.

  Next, the wafer W is transferred to the ball transfer device 57 by the third work transfer arm 35 (step S5). Specifically, the wafer W on which the flux F is printed is transferred by the third work transfer arm 35 to the first work placing table 12 arranged in the ball transfer device 57. In the ball transfer device 57, the wafer W is transferred from the first work placing table 12 to the work stage 14 by the first work transfer arm 20, and is supplied onto the ball transfer mask 66 by moving the brush squeegee 67 while rotating. The conductive ball 8 is transferred onto the wafer W (step S6).

  Next, the wafer W onto which the conductive ball 8 has been transferred by the third work transfer arm 35 disposed in the ball transfer device 57 is transferred to the inspection unit 68 of the transfer robot device 58 (step S7). The inspection unit 68 inspects whether or not the conductive balls 8 are transferred onto the wafer W without excess or deficiency (step S8). When the ball excess or ball deficiency is equal to or greater than the specified value, the wafer W is marked, or the address of the defective portion of the target wafer W is stored in a control device (not shown). After the inspection, the robot arm 71 removes the material from the inspection unit 68 to the third load port 69 or the fourth load port 70 (step 9). Note that the wafer W determined to be non-defective by the inspection unit 68 may be removed from the third load port 69 and the wafer W determined to be defective may be removed from the fourth load port 70.

  The ball mounting apparatus 2 described above is a ball mounting apparatus that mounts the conductive balls 8 on the wafer W, which is a workpiece, and a plurality of the work processing apparatuses 1 described above are linearly connected to each other. One of them is a flux printing apparatus 56 having a flux printing unit 63 that prints the flux F on the wafer W, and the other one is a ball transfer for transferring the conductive balls 8 to the wafer W on which the flux F is printed. This is a ball transfer device 57 having a unit 65. The ball mounting device 2 includes a transfer robot device 55 that feeds the wafer W to the flux printing device 56 and an inspection unit 68 that inspects the excess of the conductive balls 8 on the wafer W to which the conductive balls 8 are transferred. And a transfer robot 58 for removing the wafer W.

  The ball mounting device 2 standardizes the configuration related to the transfer of the wafer W, and the flux printing device 56 and the ball transfer device 57 each include a first work transfer unit 15 and a second work transfer unit 16. Accordingly, the transfer direction of the wafer W can be selected and connected from left to right, and conversely from right to left. For example, the first work transfer unit 15 and the second work transfer unit can be connected. It is possible to connect another work processing apparatus between 16, or connect another work processing apparatus to the preceding stage or the subsequent stage. Accordingly, the overall length of the apparatus can be shortened compared to the configuration in which the above-described conventional technology moves the first moving work stage and the second moving work stage via the buffer unit to transfer the work, and the tact time required for work transfer can be reduced. Is possible. In addition, a control program related to workpiece conveyance can be simplified. Furthermore, since the apparatus has a simple configuration without intermediate processing by the buffer unit, a stable workpiece transfer operation is possible.

  In the above-described prior art, the position of the movement of the first moving work stage and the second moving work stage is managed by the linear encoder. Since the linear encoder is extended from the material supply side to the material removal side of the substrate, the total length becomes long, and the amount of expansion and contraction due to temperature change increases, and the position accuracy may decrease. In the ball mounting apparatus 2, the position of the wafer W can be shortened by controlling the position for each work processing apparatus (for each of the flux printing apparatus 56 and the ball transfer apparatus 57), and the influence of expansion and contraction due to temperature change can be suppressed. The accuracy can be increased.

  Accordingly, it is possible to configure the ball mounting apparatus by arbitrarily combining the transfer direction of the wafer W and various types of work processing apparatuses, and it is possible to shorten the tact time, reduce the size, and increase the position accuracy of the work. It becomes possible.

[Configuration of Ball Mounting Device 3 (Second Embodiment)]
FIG. 12 is a plan view showing the configuration of the ball mounting apparatus 3 according to the second embodiment. The ball mounting device 2 described above is configured by connecting one ball transfer device 57, whereas the ball mounting device 3 according to the second embodiment includes two ball transfer devices 57 and 90. It is characterized by connecting. Here, the difference from the ball mounting apparatus 2 will be mainly described. In FIG. 12, the same reference numerals as those in FIG.

  The ball mounting device 3 includes a transfer robot device 55 which is a material supply device for the wafer W, a flux printing device 56 which prints the flux F on the wafer W, and the conductive balls 8 are transferred to the wafer W on which the flux F is printed. For transfer as a ball transfer device 57, a ball transfer device 90 for transferring a conductive ball 9 having a diameter larger than that of the conductive ball 8, and a material removal device for removing the wafer W to which the conductive balls 8 and 9 are transferred. And a robot device 58. The transfer robot device 55, the flux printing device 56, the ball transfer device 57, the ball transfer device 90, and the transfer robot device 58 are linearly connected in the X direction. Since the transfer robot device 55, the flux printing device 56, the ball transfer device 57, and the transfer robot device 58 are the same as those shown in FIG. The ball transfer device 90 has the same configuration as the ball transfer device 57 except that the ball transfer unit 91 corresponds to the large-diameter conductive ball 9.

  Although illustration is omitted, the flux printing mask 66 used in the flux printing is formed with an array pattern of mask openings for large diameters and an array pattern of mask openings for small diameters. Printed in 1 time. The wafer W on which the flux F is printed is transferred to the first work placing table 12 of the ball transfer device 57 by the third work transfer arm 35 and transferred to the work stage 14 of the ball transfer unit 57 by the first work transfer arm 20. . The ball transfer unit 65 transfers the conductive ball 8 onto the wafer W using a small-diameter ball transfer mask 66. The wafer W onto which the small-diameter conductive ball 8 has been transferred is transferred to the second workpiece placing table 13 by the second workpiece transfer arm 21, and further, the third workpiece transfer arm 35 of the ball transfer device 57 is used to transfer the first of the ball transfer device 90. One workpiece is transferred to the table 12.

  In the ball transfer device 90, the wafer W onto which the small-diameter conductive ball 8 has been transferred is transferred to the work stage 14 by the first work transfer arm 20. The ball transfer unit 91 transfers the conductive ball 9 to the wafer W using a large-diameter ball transfer mask 92. The wafer W onto which the large-diameter conductive ball 9 has been transferred is transferred to the second workpiece mounting table 13 by the second workpiece transfer arm 21, and further transferred by the third workpiece transfer arm 35 of the ball transfer device 90. 58 to the inspection unit 68. After the inspection of the ball excess / deficiency by the inspection unit 68 is completed, the wafer W is transferred (removed) by the robot arm 71 to the third load port 69 or the fourth load port.

  As for the order of ball transfer, the small-diameter conductive ball 8 is transferred by the ball transfer device 57, and then the large-diameter conductive ball 9 is transferred by the ball transfer device 90. For example, when three or more types of conductive balls having different diameters are transferred to the wafer W, three or more types of conductive balls having a plurality of types of diameters are supported between the flux printing device 56 and the transfer robot device 58. It is possible to connect a ball transfer device equipped with a ball transfer unit. When three ball transfer devices are connected, they are arranged in the order of a ball transfer unit for small diameter balls, a ball transfer unit for medium diameter balls, and a ball transfer unit for large diameters.

  In the ball mounting device 3 described above, the flux printing device 56 and the ball transfer devices 57 and 90 are linearly connected to each other, and each of the ball transfer devices 57 and 90 transfers the balls 8 and 9 having different diameters. This is a configuration having units 65 and 91. In this way, a plurality of types of conductive balls having different diameters can be transferred to the wafer W in the ball mounting apparatus 1 system. Further, if each ball transfer device includes the first work transfer unit 15 and the second work transfer unit 16 and is synchronously driven, for example, a configuration in which a plurality of types of conductive balls are transferred, compared to a case where there is only one type of conductive balls. The tact time will not increase.

[Ball Mounting Device 4 (Third Embodiment)]
In the ball mounting device 3 described above, an example in which two types of conductive balls 8 and 9 having different diameters can be mounted has been described. However, work processing having work processing functions other than the flux printing unit 63 and the ball transfer units 65 and 91 is possible. It is possible to connect work processing devices equipped with units. For example, a repair device can be connected to the rear stage of the ball transfer device 57 or the ball transfer device 90.

  For example, the structure which connected the repair apparatus to the ball mounting apparatus 2 shown in FIG. 7 is demonstrated. Although illustration is omitted, this example is referred to as a third embodiment, the ball mounting device 4. The repair device is disposed between the ball transfer device 57 and the transfer robot device 58 and connected to both. As an example of the repair device, there are an inspection unit (inspection camera unit) that detects the excess or deficiency of the conductive balls 8 transferred to the wafer W, a repair head that transfers the conductive balls 8 to the positions where the balls are insufficient, and an excess ball. A repair processing unit having an excess ball removing unit to be removed is provided. Further, like the other work processing apparatuses, the first work placing table 12, the second work placing table 13, the first work transport unit 15, and the second work transport unit 16 are configured.

  The repaired wafer W is transferred to the transfer robot device 58 by the second workpiece transfer unit 16 on the repair device side. In addition, in the transfer robot apparatus 58, a relay unit corresponding to the first workpiece mounting table 12 is arranged instead of the conventional inspection unit 58 (see FIGS. 7 and 12). Alternatively, the inspection unit 68 may be disposed at a position as it is, and the ball arrangement state of the repaired wafer W may be re-inspected. Then, the robot arm 71 transports (removes) the wafer W to the third load port 69 or the fourth load port 70. In addition, you may make it equip the repair apparatus with the material removal apparatus for removing the material of the wafer W. FIG.

  As described above, after detecting the excess or deficiency of the conductive balls 8 transferred to the wafer W between the ball transfer device 57 and the material removal robot device 58, the insufficient conductive balls 8 are transferred. It is possible to further connect a repair device having a repair processing unit for removing excess conductive balls 8. By connecting the repair devices in this way, the ball mounting device 4 capable of repair work in addition to ball transfer can be realized. When the repair time is long, a plurality of repair devices may be connected, and it is possible to suppress an increase in tact time even if a repair device is added.

[Configuration of Ball Mounting Device 5 (Fourth Embodiment)]
FIG. 13 is a plan view showing the configuration of the ball mounting device 5. The ball mounting devices 2, 3 and 4 described above have a feeding robot device 55 for feeding materials and a transport robot device 58 for removing materials, whereas the ball mounting device 5 has a feeding function. And a transport robot device 95 having a material removal function. Here, the differences will be mainly described in comparison with the ball mounting device 2. Further, in FIG. 13, the same reference numerals as those in FIG. In the ball mounting device 5, a flux printing device 56, a transfer robot device 95, and a ball transfer device 57 are linearly connected.

  Since the configurations of the ball transfer device 56 and the flux printing device 57 are the same as those of the first embodiment (see FIG. 7), detailed description thereof is omitted. In the transfer robot device 95, a robot arm 61 is arranged on the lower side in the figure, a pre-aligner 62 is arranged on the flux printing device 56 side in the upper part of the figure, and an inspection unit 68 is arranged on the ball transfer unit 57 side in the upper part of the figure. A first load port 59 on the material supply side and a third load port 69 on the material removal side are disposed on the lower side of the robot arm 61 in the figure. The first load port 59 is provided with a FOUP 73 on the material supply side for stocking the wafer W, and the third load port 69 is provided with a FOUP 74 on the material removal side for accommodating the wafer W transferred from the inspection unit 68. . The robot arm 61 itself has the same configuration as the robot arms 61 and 71 described in the first embodiment, but is controlled by a program so as to execute material supply, conveyance, and material removal.

  The operation of the ball mounting device 5 will be described along the transfer path of the wafer W. First, the robot arm 61 picks up the wafer W from the first load port 59 and transfers it to the pre-aligner 62. After correcting the position of the wafer W in the pre-aligner 62, the robot arm 61 transports the wafer W to the first work base 12 of the flux printing device 56. The wafer W transferred to the first work base 12 is transferred to the work stage 14 by the first work transfer arm 20, and the flux printing unit 56 drives the flux printing unit 63 to print the flux F on the wafer W. After the flux printing, the wafer W is transferred from the work stage 14 to the first work table 12 by the first work transfer arm 20.

  In the flux printing device 56, the wafer W transferred to the first workpiece mounting table 12 is transferred to the second workpiece mounting table 13 of the ball transfer device 57 by the robot arm 61. In the ball transfer device 57, the wafer W transferred to the second work table 13 is transferred to the work stage 14 by the second work transfer arm 21. Next, the ball transfer unit 65 is driven to transfer the conductive balls 8 to the wafer W. After the ball transfer, the wafer W is transferred to the second work placing table 13 by the second work transfer arm 21. The wafer W transferred to the second work table 13 is transferred to the inspection unit 68 of the transfer robot device 95 by the third work transfer arm 35 of the second work transfer unit 16 provided in the ball transfer device 57. After inspecting the excess or deficiency of the balls, the robot arm 61 transports (removes) the wafer W to the third load port 69.

  Since the work transfer operations of the first work transfer arm 20, the second work transfer arm 21 and the third work transfer arm 35 in the ball mounting apparatus 5 described above are in accordance with the operation of the work processing apparatus 1 shown in FIG. Detailed description is omitted here. The first work transfer arm 20 and the second work transfer arm 21 are each driven independently. However, either one of them may be swung, but they may be linked. In the ball mounting apparatus 5, some of the work transfer units and work transfer arms that are equipped do not operate, but may be left as they are or may be removed.

  The ball mounting apparatus 5 described above has a function of transporting the wafer W to the flux printing apparatus 56 between the flux printing apparatus 56 and the ball transfer apparatus 57, and the conductive ball transfer apparatus 57 for transferring the wafer W on which the flux F is printed. Are connected to each other, and a transfer robot device 95 having a function of transferring (removing material) the wafer W onto which the conductive balls 8 are transferred is connected.

  The material supply side transfer robot device 55 can be changed to the material removal side transfer robot device 58 by the drive program, and vice versa. Therefore, a program having both a material supply side function (including a pre-aligner function) and a material removal side function (inspection unit function) in either the material supply transfer robot device 55 or the material removal transfer robot device 58. The transfer robot device 95 can be used. If this transfer robot device 95 is arranged between the flux printing device 56 and the ball transfer device 57, the tact time is slightly longer than in the first to third embodiments. Since only one unit is required, the size can be further reduced.

  DESCRIPTION OF SYMBOLS 1 ... Work processing apparatus, 2, 3, 4, 5 ... Ball mounting apparatus, 8, 9 ... Conductive ball, 10 ... Base board | substrate, 11 ... Work processing unit, 12 ... 1st work mounting base, 13 ... 2nd work mounting base , 14 ... Work stage, 17, 19 ... Work holding pin, 18 ... Holding pin vertical movement actuator, 20 ... First work transfer arm, 21 ... Second work transfer arm, 23 ... First work transfer arm axis, 24 ... First 2 work transfer arm shafts, 29, 33, 37 ... projections, 35 ... third work transfer arm, 47 ... arm holder, 49 ... arm fixing block, 55, 58, 95 ... transfer robot device, 56 ... flux printing device 57, 90 ... ball transfer device, 63 ... flux printing unit, 65, 91 ... ball transfer unit, 68 ... inspection part, L ... workpiece trajectory, P1. P2, P3 ... Pitch, W ... Workpiece (wafer)

Claims (9)

A workpiece processing apparatus that performs various types of processing on a workpiece and can connect multiple units,
A workpiece processing unit that is disposed in the center of the upper surface of the base substrate and includes a workpiece stage that holds the workpiece;
A first workpiece placing table arranged on one side of the workpiece trajectory across the workpiece stage;
A second workpiece placement table disposed at a symmetrical position with respect to the first workpiece placement table across the workpiece stage;
A first workpiece transfer arm that sucks the lower surface of the workpiece with a plurality of protrusions, transfers the workpiece from the first workpiece mounting table to the workpiece stage, or transfers the workpiece from the workpiece stage to the first workpiece mounting table. When,
A second workpiece transfer arm that sucks the lower surface of the workpiece with a plurality of protrusions, transfers the workpiece from the workpiece stage to the second workpiece mounting table, or transfers the workpiece from the second workpiece mounting table to the workpiece stage. When,
The workpiece is disposed away from the second workpiece mounting table in a direction orthogonal to the conveyance trajectory of the workpiece, the lower surface of the workpiece is sucked by a plurality of protrusions, and the second workpiece mounting table is placed outside the base substrate. A third work transfer arm for transferring or transferring the work on the outside of the base substrate to the second work table;
have,
A workpiece processing apparatus. The work processing apparatus according to claim 1,
The first work transport arm and the second work transport arm are parallel to the work trajectory of the work and are spaced apart from the work trajectory of the work, and are simultaneously moved in the work transport direction,
The first workpiece transfer arm is rotatable about a first workpiece transfer arm axis so as to be orthogonal to the workpiece transfer locus, and the second workpiece transfer arm is set about the second workpiece transfer arm axis. It can be rotated to be orthogonal to the workpiece trajectory,
The workpiece transfer direction distance (pitch P1) between the first workpiece stage and the work stage, the workpiece transfer direction distance (pitch P2) between the workpiece stage and the second workpiece stage, and the first workpiece. The workpiece transfer direction distance (pitch P3) between the transfer arm axis and the second workpiece transfer arm axis is the same.
A workpiece processing apparatus. In the workpiece processing apparatus according to claim 1 or 2,
The third workpiece transfer arm moves in a direction orthogonal to the workpiece transfer locus and sucks the workpiece, and then moves the workpiece along the workpiece transfer locus,
It is controlled to convey the workpiece in synchronization with the conveyance of the workpiece by the first workpiece conveyance arm and the second workpiece conveyance arm.
A workpiece processing apparatus. In the workpiece processing apparatus according to any one of claims 1 to 3,
Each of the work stage, the first work placing table, and the second work placing table has a plurality of work holding pins that can be moved up and down while holding the work during delivery of the work,
Holding pin vertical movement actuator for lowering each work holding pin when delivering the work from each work holding pin to each of the first work transfer arm, the second work transfer arm and the third work transfer arm In addition,
A workpiece processing apparatus. In the workpiece processing apparatus according to any one of claims 1 to 4,
The first work transfer arm, the second work transfer arm, and the third work transfer arm are detachably fixed to an arm holder by an arm fixing block.
A workpiece processing apparatus. A ball mounting device for mounting a conductive ball on a workpiece,
A plurality of workpiece processing devices according to any one of claims 1 to 5 are connected linearly,
One of the plurality of workpiece processing devices is a flux printing device having a flux printing unit for printing flux on the workpiece, and the other one is a conductive ball on the workpiece on which the flux is printed. A ball transfer device having a ball transfer unit for transferring
A feeding robot device for feeding the workpiece to the flux printing device;
A transporting robot apparatus for removing material that removes the workpiece after the inspection, having an inspection unit that inspects the excess or shortage of the conductive ball of the workpiece into which the conductive ball has been transferred;
have,
A ball mounting device characterized by that. The ball mounting apparatus according to claim 6,
The flux printing device and the plurality of ball transfer devices are linearly connected,
Each of the plurality of ball transfer devices is configured to have a ball transfer unit that transfers the conductive balls having different diameters.
A ball mounting device characterized by that. The ball mounting apparatus according to claim 6,
An excess or shortage of the conductive balls transferred to the workpiece is detected between the ball transfer device and the transfer robot device for material removal, and a shortage of the conductive balls are transferred to cause excess of the conduction. The work processing apparatus having a repair processing unit for removing the ball is further coupled,
A ball mounting device characterized by that. The ball mounting apparatus according to claim 6,
Between the flux printing device and the ball transfer device,
A function of conveying the work to the flux printing apparatus, a function of conveying the work printed with the flux to the conductive ball transfer apparatus, and a function of conveying the work into which the conductive balls have been transferred. The transfer robot device having the combination is connected,
A ball mounting device characterized by that.

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