JP2017092342A - System for loading conductive ball - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ball loading system which further stabilizes the quality of a product and improves efficiency.SOLUTION: A system for loading a conductive ball onto a work is provided. The system comprises: a coating unit 10 for coating an electrode of the work with a flux via a first mask 11; a ball loading unit 20 for loading a conductive ball onto the work via a second mask 21; a repair unit 30 for observing a state of the work and repairing a loading defect; a first moving stage 41 for positioning the first mask and the work; a second moving stage 42 for positioning the second mask and the work; a third moving stage 43 for determining a repair position of the work; a first buffer unit 50 for delivering the work from the first moving stage to the second moving stage while temporarily holding the work; and a second buffer unit 60 for delivering the work from the second moving stage to the third moving stage while temporarily holding the work.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a system for mounting a conductive ball on a workpiece.

  In Patent Document 1, the present invention relates to a solder ball mounting method in which a fine solder ball is mounted on a substrate using a solder ball mounting mask, and it is an object to efficiently and reliably mount the fine solder ball on the substrate. To do. For this reason, the ball mounting method disclosed in Patent Document 1 includes a step of disposing a flux on an electrode of a substrate and a step of mounting a solder ball on a transfer electrode using a ball mounting mask disposed on the substrate. And a process of inspecting the mounting state of the solder balls with the solder ball mounting mask being disposed on the board, and if the number of solder balls not mounted is determined to be larger than the predetermined unmounted number in this inspection process In the first solder ball repair process in which the solder ball is transferred to the unmounted position using the solder ball mounting mask, and in the inspection process, if the number of unmounted is determined to be less than the predetermined unmounted number, And a second solder ball repair process for individually mounting the solder balls.

JP 2008-117859 A

  There is a need for a system that efficiently provides more stable quality products in a system in which conductive balls are mounted on a workpiece having electrodes for connection, such as a wafer (semiconductor substrate), an IC chip, and a substrate on which an IC chip is mounted. ing.

  One embodiment of the present invention is a system in which a conductive ball is mounted on a workpiece. This system includes a coating unit that applies a flux on a workpiece electrode via a first mask including a plurality of openings, and a second mask that includes a plurality of openings on the workpiece coated with the flux. The ball mounting unit for mounting the conductive ball, the repair unit for observing the state of the workpiece on which the conductive ball is mounted and repairing the mounting defect, and the positioning of the first mask and the workpiece with the workpiece mounted A first moving stage for performing positioning, a second moving stage for positioning the second mask and the workpiece coated with flux in a state where the workpiece coated with flux is mounted, and a conductive ball is mounted. The third movement stage for positioning the repair position with the work mounted, and the first movement with the work to which the flux has been applied temporarily held The second buffer stage is transferred from the second moving stage to the third moving stage in a state where the first buffer unit transferred from the cottage to the second moving stage and the work on which the conductive balls are mounted are temporarily held. Buffer unit.

  This system has a coating unit, a ball mounting unit, and a repair unit. When a workpiece is inserted, a series of operations such as flux application, conductive ball mounting, and repair are performed, and the conductive ball is mounted on the workpiece electrode. Output the finished product. Therefore, it is possible to save the labor of stocking and transporting the work for which each process has been completed between the units.

  Further, the system includes respective moving stages for positioning the workpiece with respect to each unit, and the first buffer unit and the second moving unit are provided between the first moving unit and the second moving unit. A second buffer unit is provided between the third mobile unit. For this reason, even if the processing time of each unit differs by temporarily holding the work in each buffer unit, they can be performed in parallel. In addition, there are effects such as optimizing the movement of each moving stage and mitigating the influence of the processing time of the repair process on each upstream process. Therefore, the throughput of the entire system can be improved, and the production efficiency of a product on which conductive balls are mounted can be improved.

  The upstream and downstream moving stages that perform processing of each processing unit independently may be mounted on different rails, but may be mounted on a common rail (track). By mounting the upstream and downstream moving stages on a common rail, the configuration of the buffer unit can be simplified. For example, the buffer unit may be of a type that simply moves up and down while holding the workpiece temporarily.

  Each buffer unit of the system may include a handling unit that temporarily holds a part of the upper surface of the processed workpiece in a sucked state. Since the workpiece whose bottom surface is supported by each moving stage can be accessed from the top surface, the workpiece can be transferred efficiently.

  The system may include a position detection unit that detects the position of the first mask and the workpiece. The position detection unit includes an imaging unit including two upper and lower visual fields for acquiring images of the lower surface of the first mask and the upper surface of the work mounted on the first stage, and the imaging unit along the lower surface of the first mask. A moving unit that moves, and a calibration unit that is disposed at a position retracted from the lower surface of the first mask. The calibration unit is a first reference mark provided on the first reference surface facing downward, and is directed upward with the first reference mark on the upper side captured by the imaging unit at the retracted position. A second reference mark provided on the second reference plane, and a lower second reference mark imaged together with the first reference mark by the imaging unit.

  This system is a position detection unit for detecting the position of the second mask and the workpiece coated with the flux, and is a calibration unit disposed at a position retracted from the lower surface of the second mask, as described above. The position detection unit containing may be included.

  A position detection unit of a type that detects the position of the lower surface of the mask and the upper surface of the workpiece needs to be retracted from the lower surface of the mask when processing is performed with the workpiece in close contact with the mask. The retracted position includes a first reference surface facing downward including the upper first reference mark, and a second reference surface facing upward including the second reference mark on the lower side. By providing the calibration unit, the accuracy of the position detection unit can be maintained by acquiring an image including the upper and lower reference marks by the imaging unit including the upper and lower two visual fields. Therefore, this position detection unit is suitable for the present system in which the workpiece changes the moving stage, and can accurately align the workpiece with respect to each mask.

  In this calibration unit, the first reference mark and the second reference mark may be arranged so as to be positioned on the vertical line. If the marks are set to match when aligning the mask and the workpiece, the actual position is verified by performing a pre-verification of the positional deviation between the upper and lower fields of view of the imaging unit during calibration. It can be corrected when matching. The positional deviation between the upper and lower visual fields confirmed at the time of calibration may be adopted as a value to be corrected at the next alignment. The positional deviation between the upper and lower visual fields confirmed at the time of calibration is a predetermined value. If the value deviates from this value, it may be determined as abnormal and the next process may be stopped.

  Another aspect of the present invention is an apparatus that performs a first process through a mask in which openings are provided at positions corresponding to a plurality of electrodes on a plurality of electrodes of a work on which a plurality of electrodes are arranged. is there. An example of the first process is a process of applying a flux through a mask including a plurality of openings, and another example is a conductive ball applied to a work to which the flux is applied via a mask including a plurality of openings. Is the process of mounting. The apparatus includes an imaging unit having two upper and lower visual fields for acquiring images of the lower surface of the mask and the upper surface of the work, a first moving unit that moves the imaging unit along the lower surface of the mask, and a position retracted from the lower surface of the mask And a calibration unit including an upper first reference mark and a lower second reference mark that are imaged at a position retracted by the imaging unit. The calibration unit is a first reference mark provided on the first reference surface facing downward, and is directed upward with the first reference mark on the upper side captured by the imaging unit at the retracted position. A second reference mark provided on the second reference plane, and a lower second reference mark imaged together with the first reference mark by the imaging unit.

  The calibration unit may include a second reference surface including a second reference mark, and the apparatus may be configured such that the distance between the imaging unit and the upper surface of the workpiece is between the imaging unit and the second reference surface on the lower surface of the mask. And a control unit including a function for aligning the workpiece and the mask by the moving stage based on the images acquired from the lower surface of the mask and the upper surface of the workpiece. Furthermore, you may have. The mask and workpiece can be aligned under conditions that are closer to calibration.

  The function of aligning may include a function of aligning the mask and the workpiece based on the relationship between the first reference mark and the second reference mark confirmed using the calibration unit. By realizing the relationship when the upper and lower two-field imaging units image the upper and lower reference marks of the calibration unit with the mask and the workpiece, it is possible to perform alignment with the same accuracy as that realized in the calibration unit. Become.

Another different aspect of the present invention is a method for aligning an apparatus that performs the first processing. The method includes the following steps.
1. The moving table sets the work under the mask to perform the first processing, and the moving unit moves the imaging unit to the calibration unit, and the imaging unit moves the first reference mark and the second reference mark up and down 2. Imaging in the field of view.
2. As the moving table moves the next workpiece under the mask, the moving unit moves the imaging unit along the lower surface of the mask between the mask and the workpiece so that the imaging unit moves between the lower surface of the mask and the upper surface of the workpiece. Acquire images with two fields of view.
3. The moving unit moves the imaging unit to a position where the imaging unit is retracted from the lower surface of the mask, and the moving table includes the mask and workpiece images acquired from the upper and lower two fields of view of the imaging unit, the first reference mark acquired by the calibration unit, and Aligning the mask and workpiece based on the image of the second fiducial mark;

  According to this method, the imaging unit performs mask alignment while performing alignment between the mask and the workpiece and processing using the mask based on the images of the lower surface of the mask and the upper surface of the workpiece acquired by the imaging unit. The imaging unit can be calibrated at a position retracted from below. This eliminates the need for calibration-only time, and can ensure the accuracy of alignment using the upper and lower two-field imaging units without increasing the tact time.

The top view which shows the whole structure of the system which mounts an electroconductive ball. The front view which shows the whole structure of the system which mounts an electroconductive ball. The perspective view which shows schematic structure of a position detection unit. The side view which shows a mode that the imaging unit of the position detection unit retracted to the home position. The side view which expands and shows a mode that the imaging unit retracted to the home position. The side view which expands and shows a mode that the imaging unit moved from the home position. The time chart which shows the outline | summary of a process of the system which mounts an electroconductive ball. The flowchart which shows the outline | summary in which the system which mounts an electroconductive ball aligns a mask and a workpiece | work.

  FIG. 1 is a plan view showing a schematic overall configuration of a system for mounting conductive balls. FIG. 2 is a front view showing a schematic overall configuration of a system for mounting conductive balls. A system (ball mount system, ball mounting system) 1 for mounting conductive balls is a system for mounting conductive balls on a plurality of electrodes 105 provided on a workpiece 100, and includes a ball mounter and the like. Also called.

  The ball mount system 1 includes a coating unit 10 that applies a flux on an electrode 105 of a work 100 via a first mask 11 including a plurality of openings 19, and a plurality of openings 29 in a work 101 to which the flux is applied. Repair of repairing individual mounting defects of the conductive ball by observing the state of the ball mounting unit 20 mounting the conductive ball via the second mask 21 containing the conductive ball and the work 102 on which the conductive ball is mounted A unit 30, a first buffer unit 50 that temporarily holds a workpiece 101 coated with a flux between the coating unit 10 and the ball mounting unit 20, and a workpiece 102 on which a conductive ball is mounted include a ball mounting unit. 20 and the second buffer unit 60 temporarily held between the repair unit 30. The coating unit 10, the first buffer unit 50, the ball mounting unit 20, the second buffer unit 60, and the repair unit 30 are arranged linearly.

  The system 1 further includes a first moving stage 41 that is mounted by the hand (arm) 4 a of the work supply unit 4 and that transports the work 100 from the work supply unit 4 through the coating unit 10 to the first buffer unit 50. In the workpiece supply unit 4, a workpiece 100 supplied by a transport box or a belt conveyor is mounted on the first moving stage 41 by a supply hand 4a. The system 1 further includes a second moving stage 42 that conveys the first buffer unit 50 through the ball mounting unit 20 to the second buffer unit 60, the second buffer unit 60 through the repair unit 30, and the discharge unit 5. And a third moving stage 43 that conveys the In the discharge unit 5, a work (product) on which conductive balls are mounted is transferred to a shipping box, a belt conveyor, or the like by a discharge arm (hand) 5a.

  The first moving stage 41 includes a function for positioning the first mask 11 and the workpiece 100 in a state where the workpiece 100 is mounted in the coating unit 10. The second moving stage 42 includes a function for positioning the second mask 21 and the workpiece 101 in a state where the workpiece 101 on which the flux is printed is mounted in the ball mounting unit 20. The third moving stage 43 includes a function of positioning the repair position in the repair unit 30 in a state where the work 102 on which conductive balls are mounted is mounted. The system 1 includes a rail (track) 6a used in common by the X unit 48 of the second moving stage 42 and the X unit 48 of the first moving stage 41.

  The ball mount system 1 includes a unit (first cleaning unit) 111 for cleaning the first mask 11 of the coating unit 10 and a unit (second cleaning unit) for cleaning the second mask 21 of the ball mounting unit 20. 112. These cleaning units 111 and 112 are arranged in a direction (Y direction) orthogonal to the linear direction (X direction) in which the coating unit 10 and the ball mounting unit 20 are arranged, so that maintenance can be easily performed from that direction. It has become. The first cleaning unit 111 cleans the lower surface (back surface) 11b of the first mask 11 with a scraper or a cloth soaked with a solvent, and removes the flux remaining on the first mask 11. The second cleaning unit 112 cleans the upper surface (front surface) 21a of the second mask 21 with an adhesive member for adsorbing the conductive balls, such as an adhesive rubber or a suction mechanism, and thereby the second mask The conductive balls remaining on 21 are removed.

  The ball mount system 1 of this example includes a first chassis 2 that supports the coating unit 10 and the ball mounting unit 20, and a second chassis 3 that supports the repair unit 30. It has a connected structure. The entire system may be configured as a single chassis, but the transport conditions for shipping the system 1 to a customer's factory or the like become severe.

  An example of a workpiece that is processed by this apparatus is a workpiece that applies flux on a plurality of electrodes, and an example of a mask in that case is a mask for applying flux on a plurality of electrodes of the workpiece. Another example of the work is a work in which flux is applied on a plurality of electrodes, and an example of the mask in that case is a mask for mounting conductive balls on the work.

  Examples of the workpiece 100 to be processed in this system are a wafer on which a plurality of IC chips are formed, a substrate on which one or a plurality of IC chips are mounted, or a substrate plate for manufacturing these substrates. The workpiece (workpiece) 100 may be a printed wiring board, a semiconductor substrate, a stacked semiconductor device, a glass substrate, or the like. Stacked semiconductor substrates are packaged with a chip (semiconductor integrated circuit device) mounted on an interposer and integrated with an appropriate mold resin such as epoxy resin, or packaged with a chip mounted on a coreless substrate. And WLP and the like. The workpiece 100 described below is a stacked semiconductor device, and a plurality of electrodes 105 are formed in a predetermined pattern on the surface (mounting surface) 101 of the workpiece 100.

  The conductive balls mounted on the plurality of electrodes 105 formed on the surface of the workpiece 100 function as electrodes (bumps) for obtaining electrical connection, and the diameter thereof is, for example, 1 mm or less. It is about 10-500 micrometers. The conductive ball of this example is a solder ball of about 60 μm.

  The first mask 11 and the second mask 21 are thin plates, for example, metal thin plates having a thickness of several μm to 100 μm, and the periphery thereof may be reinforced. The first mask 11 and the second mask 21 may be different in thickness, size of opening (opening pattern, small hole), etc., both of which are for mounting a conductive ball at a predetermined position of the workpiece. The stencil functions as a template having a plurality of openings (opening patterns) 19 and 29 corresponding to the positions of the plurality of electrodes 105 of the workpiece 100.

  The coating unit 10 aligns the workpiece 100 in which the plurality of electrodes 105 are arranged with the first mask 11 in which the openings 19 are provided at positions corresponding to the plurality of electrodes 105, and the plurality of electrodes 105 of the workpiece 100. The process of applying (printing) flux such as rosin resin through the first mask 11 is repeated. The coating unit 10 includes a first mask 11 including a plurality of openings 19, a mask frame 12 for holding the first mask 11, a gantry 13 for fixing the mask frame 12, and the first mask 11. And an application head 14 that applies (prints) flux to the position of the electrode 105 of the workpiece 100 via the first mask 11.

  The gantry 13 is fixed to the base 6 of the ball mount system 1. Therefore, once the first mask 11 is attached to the mask frame 12, the position (X, Y, Z and θ) with respect to the base 6 is fixed, and the moving unit (first moving stage) 41 on which the workpiece 100 is mounted. Performs alignment between the mask 11 and the workpiece 100.

  The ball mounting unit 20 is in a state where the workpiece 101 in which flux is applied on a plurality of electrodes and the second mask 21 provided with openings 29 at positions corresponding to the plurality of electrodes 105 are aligned. The process of mounting (filling) the semiconductor ball on the electrode 105 of the workpiece 101 through the mask 21 is repeated. The ball mounting unit 20 is applied with a second mask 21 including a plurality of openings 29, a mask frame 22 for holding the second mask 21, a frame 23 for fixing the mask frame 22, and a flux of the workpiece 101. And a mounting head 24 for mounting (filling) a conductive ball through the second mask 21 at the position of the electrode 105 formed. The mounting head 24 has a configuration suitable for moving a conductive ball such as a squeegee, and the ball mounting unit 20 of this example includes two rotary mounting heads 24. There may be one mounting head 24 or three or more mounting heads 24. The mounting head 24 may be of a type that rotates on an axis perpendicular to the mask, may be of a type that rotates on a horizontal axis, or may move or vibrate in a horizontal direction with respect to the mask. Good.

  The gantry 23 is fixed to the base 6 of the ball mount system 1. For this reason, once the second mask 21 is attached to the mask frame 22, the position (X, Y, Z, and θ) with respect to the base 6 is fixed, and the moving unit (second moving stage) 42 on which the workpiece 101 is mounted. Performs alignment between the mask 21 and the workpiece 101.

  The repair unit 30 uses the observation camera unit 31 to observe mounting defects such as missing conductive balls mounted on the electrodes 105 of the workpiece 102 and the presence of double balls. Repair (repair) individually. The repair unit 30 has the observation camera unit 31 for observing the state of the conductive ball of the work 102 on which the conductive ball is mounted, and the flux supplied from the flux supply unit 32a. A flux coating head 32 that individually coats the non-electrode 105, and a repair head 33 that individually mounts the conductive balls supplied from the ball supply unit 33a on the electrode 105 coated with the flux by the flux coating head 32; And an excess ball removing head 34 for removing the mounted conductive balls.

  The repair unit 30 further includes a frame 35 to which an observation camera unit 31, a flux application head 32, a repair head 33 and an excess ball removal head 34 are attached and fixed to a gantry 36. In the repair unit 30, the third moving stage 43 individually moves the position of the electrode that needs to be repaired to any one of the flux application head 32, the repair head 33, and the excess ball removing head 34. Perform repair processing. The flux application head 32, the repair head 33, and the excess ball removal head 34 may be relatively movable.

  The first moving stage 41 includes a holding table (holding table, support table, moving table) 44 for mounting a work on the upper surface, and a Z-direction moving unit (Z) for controlling the height position of the holding table 44 with respect to the base 6. Unit) 45, a θ-direction moving unit (θ unit) 46 for controlling the angle (rotation angle) of the holding table 44 with respect to the base 6 in the θ direction (horizontal direction), and the front-rear direction of the holding table 44 with respect to the base 6 (Y direction). ) For controlling the position of the holding table 44 with respect to the base 6 and an X-direction moving unit (X unit) 48 for controlling the position of the holding table 44 in the left-right direction (X direction). Each unit 45-48 includes a suitable actuator and mechanism for driving in the respective direction, for example a drive motor. By these units 45 to 48, the first moving stage 41 can freely control the position of the mounted work 100 in the XYZ and θ directions, and the work 100 is fixed to the fixed first mask 11 for coating. Can be positioned.

  The second moving stage 42 has the same configuration, and includes a holding table 44, a Z unit 45, a θ unit 46, a Y unit 47, and an X unit 48. With these units 45 to 48, the second moving stage 42 can also freely control the position of the mounted workpiece 101 in the XYZ and θ directions, and the workpiece 101 with respect to the fixed second mask 21 for mounting the ball. Can be positioned.

  The third moving stage 43 has the same configuration, and includes a holding table 44, a Z unit 45, a θ unit 46, a Y unit 47, and an X unit 48. With these units 45 to 48, the third moving stage 43 can also freely control the position of the mounted workpiece 102 in the XYZ and θ directions, and the position repaired by the repair unit 30 can be freely set.

  The first buffer unit 50 includes a first handling unit 51 that temporarily holds a part of the upper surface of the workpiece 101 to which the flux is applied in a sucked state. The first handling unit 51 includes a suction pad (suction head, suction pad) 52 for sucking the upper surface of the work 101 while avoiding a position (position, region) where the plurality of electrodes 105 of the work 101 are formed. A suction mechanism (not shown) such as a vacuum pump is connected to the pad 52. When the first moving stage 41 moves the workpiece 101 to the position of the first handling unit 51, the first buffer unit 50 moves down and sucks the workpiece 101 by the suction pad 52. As the first handling unit 51 moves up, the workpiece 101 is temporarily held. When the second moving stage 42 that moves on the common rail 6 a moves to the position of the first handling unit 51, the first handling unit 51 descends and the workpiece 101 is moved to the holding table 44 of the second moving stage 42. Deliver.

  The first buffer unit 50 temporarily holds the workpiece 101 with a simple configuration in which the first handling unit 51 is moved up and down, and moves the moving stations (moving stages) 41 and 42 that move on the common rail 6a. Interference can be prevented. The up and down movement for delivering the workpiece 101 may be performed by the moving stages 41 and 42, and the configuration of the first handling unit 51 can be further simplified. The mechanism in which the first handling unit 51 holds the workpiece 101 may be an adhesive member for adsorbing the workpiece 101 other than the adsorption pad 52, for example, an adhesive pad, a mechanism for chucking the end surface of the workpiece 101, or the like. Good. The same applies to the second handling unit 61.

  Each buffer unit 50 and 60 may include a unit for cleaning the downstream moving stage. For example, the first buffer unit may include a unit for cleaning the second moving stage. If there is an obstacle such as a stray ball on the downstream moving stage that delivers the workpiece, it can be removed, causing problems in downstream (backstream) processing, for example, reducing the accuracy of alignment with the mask Can be suppressed.

  The unit to be cleaned may be arranged on the downstream side. In the first buffer unit, the unit to be cleaned may be arranged on the ball mounting unit side of the first handling unit. The second moving stage can be cleaned immediately before the second moving stage receives the workpiece from the first handling unit.

  Specifically, the first buffer unit 50 further includes a unit (stage cleaning unit) 53 for cleaning the second moving stage 42. The stage cleaning unit 53 includes a cleaning head 54 that removes conductive balls adhering to and adsorbed on the upper surface 44a of the holding table 44 of the second moving stage 42, and a cleaning block 55 that supports the cleaning head 54. It is disposed on the ball mounting unit 20 side downstream of the first handling unit 51. An example of the cleaning head 54 is a vacuum mechanism that sucks the conductive balls, a blower mechanism that blows off the conductive balls, and an adhesive member for adsorbing the conductive balls, such as an adhesive rubber. By cleaning the holding table 44 of the second moving stage 42 that moves from the downstream side in order to receive the workpiece 101, the workpiece 101 is tilted by the second moving stage 42, or the position is changed during the movement. Such troubles can be prevented in advance.

  The second buffer unit 60 includes a second handling unit 61 that holds a part of the upper surface of the work 102 in which conductive balls are mounted on the plurality of electrodes 105 in a sucked state, and a second handling unit 61. And a horizontal movement mechanism 63 that moves to the left and right (X direction). The second handling unit 61 includes a suction pad (suction head, suction pad) 62 that sucks the upper surface of the work 102 while avoiding the region where the plurality of electrodes 105 of the work 102 are formed. A suction mechanism (not shown) such as a pump is connected. When the workpiece 102 is moved below the second handling unit 61 by the second moving stage 42, the second handling unit 61 sucks and suspends the upper surface of the workpiece 102 temporarily. Since the second moving stage 42 and the third moving stage 43 are not on a common rail, the horizontal handling mechanism 63 moves the second handling unit 61 to the third moving stage 43 to release the workpiece 102. And hand it over.

  The second moving stage 42 and the third moving stage 43 may be configured to move along a common track 6a. The process of moving the workpiece 102 up and down for delivery may be performed by the second handling unit 61 or may be performed by the moving stages 42 and 43.

  The system 1 further includes a control unit 90 that controls the operation of each unit of the system 1. The control unit 90 includes a CPU and a memory, and a first moving stage 41, a second moving stage 42, and a third moving stage according to the processing cycle of the coating unit 10, the ball mounting unit 20, and the repair unit 30. 43, in each of the function (process control function) 91 for controlling the operation of the first buffer unit 50 and the second buffer unit 60, and the coating unit 10 and the ball mounting unit 20, the positions of the mask and the workpiece are detected. And a function (alignment function) 92 for aligning them for processing in each unit. The control unit 90 further performs image processing on the information (mounting defect) of the ball mounting state taken in by the observation camera unit 31 of the repair unit 30 and controls the third moving stage 43 to control the flux application head 32 and the repair head 33. And a function 96 for repairing the workpiece 102 by the excess ball removing head 34.

  The coating unit 10 and the ball mounting unit 20 include position detection units 70a and 70b for aligning the mask and the workpiece, respectively. The first position detection unit 70 a detects the positions of the first mask 11 of the coating unit 10 and the workpiece 100 mounted on the first moving stage 41. The second position detection unit 70 b detects the positions of the second mask 21 of the ball mounting unit 20 and the workpiece 101 with flux applied mounted on the second moving stage 42. The first position detection unit 70 a is fixed to the base 6 by a frame 79 that is independent from the mount 13 of the coating unit 10. The second position detection unit 70b is also fixed to the base by a frame 79 independent of the mount 23 of the ball mounting unit 20. The first position detection unit 70a and the second position detection unit 70b have a common configuration, and the second position detection unit 70b of the ball mounting unit 20 will be described below as an example.

  FIG. 3 is a perspective view showing a schematic configuration of the second position detection unit 70b arranged in the ball mounting unit 20. FIG. The second position detection unit 70b includes an upper and lower two-field imaging unit 71 that acquires two upper and lower field-of-view images, a moving unit 78 that moves the imaging unit 71 back and forth, and left and right, and a home position HP of the imaging unit 71. And a calibration unit 80 arranged. The imaging unit 71 may acquire images of two upper and lower visual fields at the same time, or may acquire them individually. In the following, an example of obtaining a pair of upper and lower images at the same time will be described. However, it is only necessary to obtain a pair of upper and lower images even when the imaging timing is not simultaneous, and the imaging unit 71 is a moving unit between You may move at 78.

  The imaging unit 71 includes a position detection target mark 21x provided on the lower surface 21b of the second mask 21 and a position detection target mark 101x (on the upper surface 101a of the workpiece 101 mounted on the second moving stage 42. 4) is acquired simultaneously in two upper and lower visual fields. The imaging unit 71 moves the gap between the second mask 21 and the workpiece 101 back and forth and right and left along the lower surface 21b of the second mask 21 by the moving unit 78, and further on the lower surface 21b of the second mask 21. Images of the provided position detection target mark 21y and the position detection target mark 101y on the upper surface 101a of the workpiece 101 mounted on the second moving stage 42 are simultaneously acquired in two vertical fields of view. From the images acquired at these two locations, the positional relationship (relative positional relationship) between the mask 21 and the workpiece 101 is determined including the XY direction and the θ direction.

  The number of sets of target marks read for alignment may be two, or three or more. The target mark to be read for alignment may be irregularities, holes, printing, etc. specially provided for the mask and workpiece for that purpose, corresponding to the opening at a predetermined position of the mask 21 and the opening. The workpiece 101 may be combined with a predetermined electrode 105.

  As shown in FIG. 4, the imaging unit 71 is further moved by the moving unit 78 to the home position HP retracted from the lower surface 21 b of the second mask 21, in this example, behind the first mask 11 (back side). It moves and is accommodated in the calibration unit 80 arranged at the home position HP. The calibration unit 80 includes a C-shaped (U-shaped, U-shaped) reference block 81 configured to sandwich the imaging unit 71 retracted from the home position HP from above and below, and a stand that supports the reference block 81. 82. The reference block 81 includes a first reference surface 83 located on the upper side of the imaging unit 71 and facing downward, and a second reference surface 84 located on the lower side of the imaging unit 71 and facing upward. The first reference surface 83 is provided with an upper first reference mark 85, and the second reference surface 84 is provided with a lower reference mark 86. These reference marks 85 and 86 are simultaneously imaged by the imaging unit 71 with two fields of upper and lower fields retracted to the home position HP. The reference block 81, the first reference surface 83, and the second reference surface 84 are made of a highly rigid material with little dimensional change due to temperature. The dimensional change due to disturbance of the upper and lower reference marks 85 and 86 over time. Is to be minimal.

  The moving unit 78 is incorporated in a Y stage (Y direction drive unit) 78 a that moves the imaging unit 71 in the front-rear direction (Y direction) with respect to the frame 79, and the Y stage 78 a, and moves the imaging unit 71 relative to the frame 79. And an X stage (X direction drive unit) 78b that moves in the left-right direction (X direction). The imaging unit 71 is fixed to the X stage 78b, and is disposed on the opposite side of the Y stage 78a from the second moving stage 42. The Y stage 78a is thin and does not interfere with the second mask 21 and the workpiece 101 when the imaging unit 71 moves between the second mask 21 and the workpiece 101 (gap) for alignment. It is comprised so that it may become size (thickness).

  The reference block 81 of the calibration unit 80 is supported from the base 6 independently of the second moving stage 42, the second mask 21 and the moving unit 78, and the stand 82 supporting the reference block 81 is moved. It is fixed to the base 6 independently of the frame 79 that supports the unit 78. Therefore, the calibration unit 80 is structurally independent from other units that perform other movements, such as the second moving stage 42 and the moving unit 78, and is affected by movements of these units, changes in position, and the like. It is difficult to ensure the accuracy when the upper and lower two visual fields of the imaging unit 71 are calibrated.

  5 and 6 schematically show the movement of the imaging unit 71 in the second position detection unit 70b. The imaging unit 71 includes two upper and lower visual fields for capturing upper and lower images with one camera 72, and includes a camera 72 housed in a housing 77 and a focusing lens unit 73 disposed in front of the camera 72. The prism 74 provided in front of the lens unit 73 and the upper and lower openings 75 and 76 disposed above and below the prism 74 are included. Light rays (images) from the upper opening 75 and the lower opening 76 respectively disposed on the upper surface 77a and the lower surface 77b of the housing 77 are refracted by the prism 74 toward the camera 72, and the upper and lower images are integrated. The acquired image is acquired by the camera 72.

  The imaging unit 71 further includes illumination units 75a and 76a that illuminate the upper and lower imaging objects from the upper and lower openings 75 and 76, respectively. Alternatively, the image can be picked up by the camera 72 by switching. The imaging unit 71 may divide the upper and lower optical paths and simultaneously capture images with two cameras.

  The distance between the first reference plane and the imaging unit may be equal to the distance between the lower surface of the first mask and the imaging unit. Calibration for acquiring images of two upper and lower visual fields and alignment performed by acquiring upper and lower images of a mask and a workpiece can be performed under closer conditions.

  Specifically, the reference block 81 of the calibration unit 80 is set so that the first reference surface 83 including the first reference mark 85 has the same height (level) as the lower surface 21 b of the second mask 21. Has been placed. Therefore, when the imaging unit 71 captures the first reference mark 85 during calibration and when the imaging unit 71 captures the mark 21y of the mask 21 during alignment, each target and the imaging unit The distance L1 with the upper surface 77a of 71 becomes the same.

  On the other hand, the workpiece 101 is adjusted by the second moving stage 42 so that the upper surface 101a of the workpiece 101 is at the same height (level) as the second reference surface 84 at the time of alignment. Therefore, when the imaging unit 71 captures the second reference mark 86 during calibration and when the imaging unit 71 captures the mark 101y of the workpiece 101 during alignment, each target and the imaging unit The distance L2 with the lower surface 77b of 71 becomes the same. Therefore, the imaging unit 71 can capture the first and second reference marks 85 and 86 for calibration and the marks 11y and 100y for alignment under the same conditions. Therefore, it is not necessary to adjust the focus by moving the lens 73 between calibration and alignment, and the position between the second mask 21 and the workpiece 101 can be accurately determined under the conditions confirmed by the calibration unit 80. Can be combined.

  In this example, the first distance L1 is about 20 mm ± 2 mm, and the second distance L2 is about 15 mm ± 2 mm. The second moving stage 42 may move the workpiece 101 by a distance L2, and may adjust the height of the workpiece 101 during alignment.

  In the reference block 81 of the present example, the first reference mark 85 and the second reference mark 86 have a common perpendicular (vertical line) passing through the first reference surface 83 and the second reference surface 84 as an axis. It is provided as a hole. The reference block 81 is made of the same material and has a vertically symmetric configuration, and conditions are set such that displacement due to thermal expansion is difficult to occur within a predetermined temperature range.

  Therefore, physically, the XY coordinates of the first reference mark 85 and the second reference mark 86 coincide with each other, and the first reference mark 85 and the second reference mark 86 are simultaneously set by the imaging unit 71. Alternatively, by alternately capturing images, it is possible to confirm (calibrate) a shift in coordinates obtained as an image of the upper and lower two visual fields of the imaging unit 71. The deviation of the upper and lower two fields of view of the imaging unit 71 should basically not change, but if there is a variation in the deviation of the upper and lower two fields of view for some reason, the mask 21 and the workpiece 101 are aligned. Affects the accuracy of. Therefore, each time the image pickup unit 71 is retracted, the state of the image pickup unit 71 can be confirmed by setting the image on the calibration unit 80 and acquiring images of two upper and lower visual fields. The first reference mark 85 and / or the second reference mark 86 need only be assured with the reference block 81, and may be formed by protrusions, depressions, engravings, etc. instead of through holes.

  FIG. 7 is a flowchart showing how processing is performed by aligning the mask 11 or 21 and the workpiece 100 or 101 in the coating unit 10 or the ball mounting unit 20. FIG. 7A shows an outline of processing of the coating unit 10 and the ball mounting unit 20, and FIG. 7B shows an outline of processing of the position detection units 70a and 70b. Hereinafter, the outline of the processing in the ball mounting unit 20 will be described, but the processing in the coating unit 10 is basically the same. These processes are provided as software (program) for operating the control unit 90, and are mounted on the control unit 90 as the alignment function 92.

  The alignment function 92 is a function of detecting the relative or absolute position (detection) of the mask 21 and the workpiece 101 based on the two upper and lower visual field images acquired by the imaging unit 71 from the lower surface 21b of the mask 21 and the upper surface 101a of the workpiece 101. Based on the position of the first reference mark 85 and the second reference mark 86 of the image of the two upper and lower visual fields acquired by the imaging unit 71 at the home position HP. The second movement based on the function (calibration function) 94 for checking the state of the two fields of view (positional deviation, for example, calibration information such as a shift in the XYθ direction hereinafter), and the detected position information and calibration information An adjustment function (position) for controlling the movement of the stage 42 to bring the workpiece 101 into close contact with the mask 21 at a predetermined position (state). Function to match) and a 95.

  The calibration information is based on individual differences or tolerances of the imaging unit 71, and has an influence such as assembly to the moving unit 78. The calibration information basically does not change and can always be confirmed by using the calibration unit 80. When a significant difference is seen in the calibration information by the calibration function 94, the calibration information may be updated as a secular change, or the process may be stopped as an abnormality.

  In step 121 of FIG. 7A, the process control function 91 of the control unit 90 moves the workpiece 101 coated with the flux by the second moving stage 42 below the second mask 21. When the position detection unit 70b determines in step 122 that the position of the second mask 21 and the workpiece 101 has been acquired by the imaging unit 71 and has been retracted to the home position HP, the adjustment function 95 of the control unit 90 is determined in step 123. However, in coordination with the process control function 91, the second moving stage 42 is moved to align the workpiece 101 with the second mask 21. Thereby, in step 124, the ball mounting unit 20 mounts the conductive balls on the plurality of electrodes 105 to which the flux is applied by the mounting head 24 via the second mask 21 (first processing is performed). Then, it is handed over to the second buffer unit 60, and the process returns to step 121 to shift to the processing of the next workpiece 101.

  In parallel with these processes 121 to 124 by the process control function 91, the alignment function 92 performs a series of processes shown in FIG. To explain from the calibration, in the above-described steps 123 and 124, when performing the ball mounting process by aligning the mask 21 and the workpiece 101, the imaging unit 71 is disposed between the mask 21 and the workpiece 101. Is impossible. Therefore, the calibration function 94 causes the moving unit 78 to retract the imaging unit 71 from the lower surface 21b of the second mask 21 to the home position HP in step 134. Since the calibration unit 80 is prepared at the home position HP, in step 135, the first reference mark 85 and the second reference mark 86 are simultaneously or in accordance with the two upper and lower visual fields of the imaging unit 71. Thus, both the reference marks 85 and 86 are imaged. The calibration function 94 analyzes the captured images of the upper and lower two fields of view, determines the positions of the reference marks 85 and 86 in the upper and lower two fields of view, and shifts their relative positions and XYθ direction shifts (shifts). Check the calibration information including).

  When the process control function 91 moves the next workpiece 101 below the mask 21 by the second moving stage 42 in step 121, the alignment function 92 causes the mask 21 and the next detection by the position detection unit 70b in step 131. It is determined that alignment with the workpiece 101 is necessary. In step 132, the position acquisition function 93 moves the imaging unit 71 between the mask 21 and the workpiece 101 along the lower surface 21 b of the mask 21 by the moving unit 78, and the target mark 21 x of the mask 21 and the target mark of the workpiece 101 are moved. Move to position 101x. Further, in step 133, the image of the target mark 21 x provided on the lower surface 21 b of the mask 21 and the target mark 101 x provided on the upper surface 101 a of the work 101 is acquired by the imaging unit 71 in two upper and lower visual fields. When acquiring a plurality of target mark images in order to detect the positions of the mask 21 and the workpiece 101, the image pickup unit 71 is moved to each position, and the images of the upper and lower target marks are similarly acquired in two vertical fields of view. To do.

  When the acquisition of the target mark image is completed, the position acquisition function 93 converts the position information between the mask 21 and the workpiece 101 detected in step 133 and the calibration information detected (confirmed) in the previous step 135. Based on this, the relative position between the mask 21 and the workpiece 101 moved this time is calculated (calculated position information). The absolute position of the workpiece 101 in the positional relationship with the mask 21 may be calculated. In any case, after the moving unit 78 retracts the imaging unit 71 to the home position HP in step 134, the position adjustment function 95 and the process control function 91 cooperate with each other. Based on the calculated position information, the workpiece 101 is aligned with the mask 21 in step 123.

  In the ball mount system 1 of the present example, the calibration unit 80 including the first reference mark 85 and the second reference mark 86 is disposed at the home position HP where the imaging unit 71 is retracted from the masks 11 and 21. . Therefore, while the imaging unit 71 is retracted to the home position HP and the coating unit 10 and the ball mounting unit 20 are performing processing (in the gap), both the reference marks 85 and 86 are imaged at that position. Thus, it is possible to confirm (calibrate) the positional deviation between the upper and lower visual fields of the imaging unit 71. Therefore, the upper and lower visual fields can be calibrated using the waiting time of the imaging unit without sacrificing the process time.

  Further, every time the processing unit 10 or 20 processes a workpiece, the imaging unit 71 moves in the front / rear and left / right directions under the mask 11 or 21, so that the imaging unit may be affected by vibrations caused by movement, temperature fluctuations in the system 1, etc. Even if a deviation (displacement) or the like occurs in the upper and lower optical systems 71, the upper and lower visual fields can be calibrated at the home position HP where the imaging unit 71 retracts every time. For this reason, based on the result of calibration, the mask 11 and the workpiece 100 and the mask 21 and the workpiece 101 can be accurately aligned, and a high-quality product can be produced efficiently.

  FIG. 8 schematically shows the overall processing flow of the ball mount system 1 using a time chart. The broken line indicates the flow of the workpiece, and the alternate long and short dash line indicates the movement of each moving stage on which the workpiece is not mounted. In the following time charts, the respective times do not have to be the same, and may be mixed with the processing time of the process, and the time difference is absorbed by the respective buffer units 50 and 60. In the subsequent timings, a virtual condition that the tact time in each unit is the same is shown, and each time may be mixed as long as the time can be absorbed by the buffer units 50 and 60 for each unit. .

  At time t1, the process control function 91 causes the coating unit 10 to be mounted on the workpiece 100 mounted on the moving stage 41, the ball mounting unit 20 to be mounted on the moving stage 42, and the repair unit 30 to the moving stage 43. Each process (first process) is started on the mounted workpiece 102. The processing time in each unit does not have to be the same, and the moving table of the unit that ends earlier acquires the work buffered in the buffer units 50 and 60 at an early timing and starts the next processing. For example, when there are few mounting defects of the conductive balls and the processing by the repair unit 30 is completed early, the coating unit 10 and the ball mounting unit 20 are being processed at time t2, but the position of the workpiece 102 in the repair unit 30 is The third moving stage 43 that controls the movement moves to the fifth position P5 and pays out the work (product) 103 that has been repaired to the hand 5a of the discharge unit 5. The third moving stage 43 moves to the fourth position P4 of the second buffer unit 60, and if there is a buffered work 102, receives the work 102 and starts processing in the repair unit 30. .

  Next, when the processing of the coating unit 10 and the ball mounting unit 20 is completed at time t3, the first moving stage 41 moves to the first buffer unit 50 at the second position P2, and the first handling unit 51 is moved. Temporarily holds the workpiece 101, the second moving stage 42 moves to the second buffer unit 60 waiting at the third position P3, and the second handling unit 61 temporarily holds the workpiece 102. Hold by adsorption. Further, the second handling unit 61 moves to the fourth position P4 where the third moving stage 43 stands by, and transfers the held workpiece 102 to the third moving stage 43. At time t4, the repair unit 30 starts the repair process of the workpiece 102. In parallel with this, the first moving stage 41 moved to the first position P1 receives the supply of the workpiece 100 from the load hand 4a, and the holding table of the second moving stage 42 moved to the second position P2. 44 is cleaned by the stage cleaning unit 53 of the first buffer unit 50 if necessary, and the work 101 coated with the flux temporarily held by the first handling unit 51 is delivered.

  Furthermore, the coating unit 10, the ball mounting unit 20, and the repair unit 30 perform processes at times t5 and t6, and when the processes are completed at time t7, the first moving stage 41, the second moving stage 42, and The third moving stage 43 moves to the second position P2, the third position P3, and the fifth position P5, respectively. When the movement of each moving stage is completed, the first buffer unit 50 sucks and holds the workpiece 101 from the first moving stage 41, and the second buffer unit 60 sucks the workpiece 102 mounted on the second moving stage 42. Then, the unload hand 5a discharges the work 103 mounted on the third moving stage 43.

  Next, at time t8, the first moving stage 41, the second moving stage 42, and the third moving stage 43 move to the first position P1, the second position P2, and the fourth position P4, respectively. When each moving stage arrives at a predetermined position, the work 100 from the hand 4a of the work supply unit 4 is attracted to the first moving stage 41, and the first handling unit 51 is attracted to the second moving stage 42 at time t7. The held workpiece 101 is mounted on the third moving stage 43, and the second handling unit 61 is mounted with the workpiece 102 held by suction at time t7. Subsequently, at time 9, the first moving stage 41, the second moving stage 42, and the third moving stage 43 move to the processing units 10, 20, and 30 and start processing in the same manner as at time t 1. To do.

  In this ball mount system 1, a first moving stage 41, a second moving stage 42 and a third moving position for positioning the workpieces 100 to 102 with respect to the coating unit 10, the ball mounting unit 20 and the repair unit 30, respectively. Of the first buffer unit 50 that delivers the workpiece 101 from the first moving stage 41 to the second moving stage 42 and the workpiece 102 from the second moving stage 42 to the third moving stage 43. A second buffer unit 60 is provided for delivery. Therefore, as described above, each of the coating unit 10, the ball mounting unit 20, and the repair unit 30 can independently process the workpieces 100 to 102 in a pipeline manner (in parallel). Throughput (output) can be improved. For this reason, the total processing time for each product (work) can be shortened, and a product in which ball mounting has been completed can be manufactured efficiently.

  Furthermore, the buffer units 50 and 60 can make the relevance of the processing time of each unit asynchronous within a range that can be absorbed by the buffer units 50 and 60. For this reason, for example, even if the repair process of the repair unit 30 fluctuates due to the number of ball mounting defects, the process of the first buffer unit 50 and the second buffer unit 60 is not affected, and the repair process is performed at a predetermined timing. The process can be advanced, and the possibility of occurrence of a malfunction due to time fluctuations can be prevented. Each process of the coating unit 10, the ball mounting unit 20, and the repair unit 30 may be all synchronously controlled, or only a part, for example, only the repair unit 30 may be asynchronously controlled.

  Further, the mask 11 and the workpiece 100 and the masks 21 and 101 are imaged in two vertical fields, and the mask 11 and the workpiece 100 and the mask 21 and the workpiece 101 are aligned based on the result of calibration. , Increase the accuracy of alignment. Accordingly, it is possible to provide a system 1 that can stably and efficiently produce a ball-mounted quality product. In addition, the ball mount system 1 includes first and second buffer units 50 and 60 that receive processed workpieces 101 and 102 from the moving stages 41 and 42 in order to improve the efficiency of each process. For this reason, in the present system 1 in which the workpieces 100 to 102 are frequently transferred (replacement, transfer), the position detection units 70a and 70b including the calibration unit 80 are very useful, and the mask 11, the workpiece 100, and the mask 21 and the workpiece 101 can be accurately aligned, and more stable quality products can be efficiently provided.

  In the above description, the system 1 includes the coating unit 10, the ball mounting unit 20, and the repair unit 30 as processing units. However, one or more of these processing units are also independent of the above system. Content can be applied.

1 Conductive ball mounting system (ball mounting system)
DESCRIPTION OF SYMBOLS 10 Application | coating unit, 11 1st mask 20 Ball mounting unit, 21 2nd mask 30 Repair unit 41 1st movement stage, 42 2nd movement stage, 43 3rd movement stage 50 1st buffer unit, 51 First handling unit 60 second buffer unit 61 second handling unit 70a first position detection unit 70b second position detection unit 71 imaging unit 78 moving unit 80 calibration unit
85 First fiducial mark, 86 Second fiducial mark 100, 101, 102, 103 Workpiece

Claims (10)

A system for mounting conductive balls on a workpiece,
An application unit for applying a flux on the electrode of the workpiece via a first mask including a plurality of openings;
A ball mounting unit for mounting a conductive ball on the workpiece coated with flux through a second mask including a plurality of openings;
A repair unit that repairs mounting defects by observing the state of the workpiece on which conductive balls are mounted,
A first moving stage for positioning the first mask and the work in a state where the work is mounted;
A second moving stage for positioning the second mask and the workpiece coated with the flux in a state where the workpiece coated with the flux is mounted;
A third moving stage for positioning the repair position in a state in which the work on which the conductive ball is mounted is mounted;
A first buffer unit that delivers from the first moving stage to the second moving stage in a state where the work to which the flux is applied is temporarily held;
And a second buffer unit for transferring from the second moving stage to the third moving stage in a state where the work on which the conductive ball is mounted is temporarily held. In claim 1,
At least one of the first buffer unit and the second buffer unit includes a handling unit that temporarily holds a part of the upper surface of the processed workpiece in a sucked state. In claim 1 or 2,
At least one of the combination of the upstream moving stage and the downstream moving stage among the first moving stage, the second moving stage, and the third moving stage is the upstream moving stage and the downstream moving stage. A system that has a common trajectory with which the stage moves. In any of claims 1 to 3,
A position detection unit for detecting the position of the first mask and the workpiece;
The position detection unit includes an imaging unit including two upper and lower visual fields for acquiring images of a lower surface of the first mask and an upper surface of the work mounted on the first stage;
A moving unit that moves the imaging unit along a lower surface of the first mask;
A calibration unit disposed at a position retracted from the lower surface of the first mask,
The calibration unit includes a first reference mark provided on a first reference surface facing downward, and an upper first reference mark imaged by the imaging unit at the retracted position, and an upper side And a second reference mark provided on a second reference surface facing the lower side, which is imaged together with the first reference mark by the imaging unit. In any of claims 1 to 4,
A position detection unit for detecting the position of the second mask and the workpiece coated with the flux;
The position detection unit includes an imaging unit including two upper and lower visual fields for acquiring images of a lower surface of the second mask and an upper surface of the workpiece coated with the flux mounted on the second stage;
A moving unit that moves the imaging unit along a lower surface of the second mask;
A calibration unit disposed at a position retracted from the lower surface of the second mask,
The calibration unit includes a first reference mark provided on a first reference surface facing downward, and an upper first reference mark imaged by the imaging unit at the retracted position, and an upper side And a second reference mark provided on a second reference surface facing the lower side, which is imaged together with the first reference mark by the imaging unit. In claim 4 or 5,
The system, wherein the first reference mark and the second reference mark are arranged so as to be positioned on a vertical line. An apparatus for performing a first treatment via a mask in which openings are provided at positions corresponding to the plurality of electrodes on the plurality of electrodes of a work on which a plurality of electrodes are arranged,
An imaging unit including two upper and lower visual fields for acquiring images of the lower surface of the mask and the upper surface of the workpiece;
A moving unit that moves the imaging unit along the lower surface of the mask;
A calibration unit disposed at a position retracted from the lower surface of the mask,
The calibration unit includes a first reference mark provided on a first reference surface facing downward, and an upper first reference mark imaged by the imaging unit at the retracted position, and an upper side And a second reference mark provided on a second reference surface facing toward the lower side, which is imaged together with the first reference mark by the imaging unit. In claim 7,
A moving table that moves the workpiece on the lower surface of the mask so that the distance between the imaging unit and the upper surface of the workpiece is the same as the distance between the imaging unit and the second reference surface;
And a control unit having a function of aligning the work and the mask by the moving table based on images of the lower surface of the mask and the upper surface of the work acquired by the imaging unit having two upper and lower visual fields. ,apparatus. In claim 8,
The function of aligning includes a function of aligning the mask and the workpiece based on the relationship between the first reference mark and the second reference mark confirmed using the calibration unit. apparatus. An alignment method of an apparatus for performing a first process through a mask in which openings are provided at positions corresponding to the plurality of electrodes on the plurality of electrodes of a work on which a plurality of electrodes are arranged,
The apparatus that performs the first process is:
An imaging unit including two upper and lower visual fields for acquiring images of the lower surface of the mask and the upper surface of the workpiece;
A moving unit that moves the imaging unit along the lower surface of the mask;
A calibration unit disposed at a position retracted from the lower surface of the mask;
Including a moving table mounted with the workpiece and a control unit for controlling the operation of the moving unit;
The calibration unit includes a first reference mark provided on a first reference surface facing downward, and an upper first reference mark imaged by the imaging unit at the retracted position, and an upper side A second reference mark provided on a second reference surface facing the lower reference mark which is imaged together with the first reference mark by the imaging unit,
The method is
The moving table sets the work under the mask and performs a first process, and the moving unit moves the imaging unit to the calibration unit, and the imaging unit moves the first reference mark and Imaging the second fiducial mark in the two upper and lower visual fields;
The moving table moves the next workpiece under the mask, the moving unit moves the imaging unit along the lower surface of the mask between the mask and the workpiece, and the imaging unit Obtaining images of the lower surface of the mask and the upper surface of the workpiece in the two upper and lower visual fields;
The moving unit moves the imaging unit to a position retracted from the lower surface of the mask, and the moving table includes the image of the mask and the workpiece acquired from the two upper and lower visual fields of the imaging unit, and the calibration unit. Aligning the mask and the workpiece based on the acquired images of the first fiducial mark and the second fiducial mark.

Images