JP2012114467A - Substrate production method and electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate production method for switching production to an other producible lane when production in a priority lane cannot be continued due to component shortage and restoring the production in the priority lane when the production on the priority lane becomes possible and to provide an electronic component mounting apparatus.SOLUTION: A substrate conveyance lane to which a substrate 16 is supplied first is set as the priority lane between a plurality of substrate conveyance lanes 17 and 18. The electronic component is mounted on the substrate on the priority lane. When the production of the substrate on the priority lane cannot be continued, the lane for production is switched to mount the electronic component on the substrate on the other producible substrate conveyance lane. Production is restored to mount the electronic component on the substrate on the priority lane in a stage where the production of the substrate on the priority lane can be continued.

Description

  The present invention relates to a substrate production method and an electronic component mounting apparatus in which a substrate is made to flow through a plurality of substrate transfer lanes and electronic components are mounted on substrates in a priority lane.

  For example, Patent Document 1 discloses an electronic component mounting apparatus that can maintain a board transportation order in a production lot according to a first-in first-out principle so that product history can be tracked correctly. .

  The device described in Patent Document 1 assigns an additional number N indicating a transfer order in a production lot to a substrate to be mounted, and two rows of standby stages depending on whether the additional number N is an even number or an odd number. I carry it in either. That is, when the substrate is alternately supplied to the two transport paths, and the substrate is moved from the standby stage waiting for the unmounted substrate to the mounting stage, and from the mounting stage to the standby stage waiting for the mounted substrate, the two transports are performed. The sequence number of the substrates on the road is compared, and the movement order of the substrates is determined so that the substrate with the smaller sequence number is moved in advance. As a result, the principle of first-in and first-out is maintained according to the order of loading from the upstream side. As a result, according to the device described in Patent Document 1, there is an advantage that it is possible to easily track the product history when a problem occurs.

Japanese Patent Laying-Open No. 2003-204192 (paragraphs 0030 to 0035, FIG. 4)

  However, in the case of the one described in Patent Document 1, there is no description about what to do when an electronic component cannot be mounted on the substrate on one of the conveyance paths due to a component cutout of the cassette feeder or the like. When a situation such as part shortage occurs on the substrate on the road, there is a problem that the throughput is reduced because the operation must be stopped even if the production on the other transport path is possible.

  The present invention has been made to solve the above-described conventional problems. When production in the priority lane cannot be continued due to a component shortage or the like, the production is switched to another production-capable lane, and then priority is given. It is an object of the present invention to provide a substrate production method and an electronic component mounting apparatus that return production to a priority lane when production in the lane becomes possible.

In order to solve the above-described problem, the invention according to claim 1 is characterized in that a plurality of substrate transport lanes for transporting a substrate are provided, and electronic components are sequentially mounted on the substrate transported on the plurality of substrate transport lanes. A board production method for an electronic component mounting apparatus , wherein different types of boards to be mounted are loaded into each of the plurality of board transfer lanes, and the board is loaded first among the plurality of board transfer lanes. If the board transportation lane is set as the priority lane, and electronic components are mounted on the board on the priority lane, and the production of the board on the priority lane cannot be continued, the board transportation lane that can be produced The lanes to be produced are switched so that the electronic components are mounted on the board of the same, and then the electronic parts are mounted on the boards on the priority lanes when the production of the boards on the priority lanes can be continued. A board production methods so as to urchin production restored.

A feature of the invention according to claim 2 is that a plurality of board transfer lanes each carrying different types of boards having different electronic components to be mounted, and picking up electronic parts from a component supply device and mounting them on the board on the board transfer lane Mounting means, a priority lane setting means for setting a substrate transport lane in which a substrate is first inserted among the plurality of substrate transport lanes as a priority lane, and the electronic component to be mounted on a board on the priority lane. In addition to controlling the mounting means, if the production of the board on the board transportation lane set as the priority lane cannot be continued, the production is performed so that the electronic component is mounted on the board on the other board transportation lane that can be produced. Lane switching means for switching lanes, and when the production of the board on the priority lane can be continued, electronic components are mounted on the board on the priority lane. An electronic component mounting apparatus and a production returning means for producing return to.

According to the invention according to claims 1 and 2 configured as described above, since different types of substrates with different electronic components to be mounted are put into each of the plurality of substrate transfer lanes, the different types of substrates are provided. Will be paid out in the order of loading to multiple board transfer lanes, which will reduce the balance of throughput balance caused by the board being paid out continuously from the same lane. Can achieve high throughput.

1 is a schematic plan view of an electronic component mounting apparatus showing an embodiment of the present invention. It is the schematic which shows the control system of an electronic component mounting apparatus. It is a figure which shows the board | substrate production method when the same kind of board | substrate is thrown into the board | substrate conveyance lane of 2 rows. It is a figure which shows the board | substrate production method in case a different kind | species board | substrate is thrown into the board | substrate conveyance lane of 2 rows. It is a figure which shows another board | substrate production method in case a different kind | species board | substrate is thrown into 2 rows of board | substrate conveyance lanes. It is a figure which shows the board | substrate production method in the production line provided with the several production module.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 schematically shows an overall configuration of an electronic component mounting apparatus 10. The electronic component mounting apparatus 10 mainly includes a component supply device 11, a substrate holding device 13, a component transfer device 14, and a substrate transfer device 15. It is constituted by. In the following description, the horizontal direction in FIG. 1 is the X axis, and the vertical direction is the Y axis.

  The substrate transport device 15 transports the substrate 16 in the left-right direction (X-axis direction) in FIG. 1, and the substrate transport device 15 has two rows of substrate transport lanes 17 and 18 arranged along the X-axis direction. And a belt conveyor (not shown) for transporting the substrate 16 along the substrate transport lanes 17 and 18. The two rows of substrate transfer lanes 17 and 18 include a pair of mounting stages 17 a and 18 a disposed in the center of the base 20.

  The substrate 16 carried into each substrate conveyance lane 17, 18 is carried into the mounting stages 17 a, 18 a by a belt conveyor (not shown), and the substrate 16 conveyed to these mounting stages 17 a, 18 a is provided in the substrate holding device 13. The clamped device (not shown) is positioned and clamped, and in this state, an electronic component is mounted on the substrate 16. When the electronic component is mounted on the substrate 16, the substrate 16 is delivered from the mounting stages 17a and 18a by a belt conveyor (not shown).

  The mounting stages 17a and 18a are provided with substrate detection sensors S1 and S2 for detecting the substrate 16 conveyed to the mounting stages 17a and 18a, respectively. The signals of the substrate detection sensors S1 and S2 are sent to a control device which will be described later. By this control device, the substrate 16 to be transported to the mounting stages 17a and 18a exists on the substrate transport lanes 17 and 18, and the mounting stages 17a and 18a. When the substrate 16 does not exist and is empty, the substrate transfer device 15 is instructed to transfer the substrate 16.

  The component transfer device 14 is supported by a Y-axis slide 21 that can move in the vertical direction (Y-axis direction) in FIG. 1 and the Y-axis slide 21 so as to be movable in the left-right direction (X-axis direction) in FIG. An X-axis slide 22 is provided. The Y-axis slide 21 is moved in the Y-axis direction by a Y-axis servo motor via a ball screw mechanism (not shown), and the X-axis slide 22 is moved via a ball screw mechanism (not shown). It is moved in the X-axis direction. A mounting head 23 having a suction nozzle for sucking and holding electronic components is attached to the X-axis slide 22. The mounting head 23 mounts an electronic component sucked and held by the suction nozzle on the substrate 16.

  Further, a CCD camera 24 that captures the holding state of the electronic component held by the mounting head 23 is mounted on the base 20. Based on the data captured by the CCD camera 24, the presence / absence of electronic components is confirmed and suctioned. It is possible to determine whether the holding is good or bad.

  The component supply device 11 includes a plurality of cassette-type feeders 25, and these cassette-type feeders 25 are arranged in parallel in the X-axis direction so as to be exchanged outside the substrate transport lanes 17 and 18. Electronic tapes are stored and held on the tapes of the cassette type feeders 25 at a constant pitch interval, and the electronic parts are supplied to predetermined positions by pitch-feeding the tapes by a motor or the like.

  In FIG. 2, reference numeral 30 denotes a control device that controls the electronic component mounting apparatus 10. The control device 30 includes a central processing unit (CPU), a memory that stores various control data and control programs, and an input / output The control device 30 controls the conveyance of the board 16 and the mounting of electronic components on the board 16. The control device 30 includes priority lane setting means 31, production lane switching means 32, and production lane return means 33.

  The priority lane setting means 31 sets the substrate transport lane in which the substrate 16 is first input to the mounting stages 17a and 18a among the plurality of substrate transport lanes 17 and 18, and is set as the priority lane. An electronic component mounting operation is performed on the board 16 on the board transfer lane.

  The production lane switching means 32 is provided on the other board transfer lane (non-priority lane) when the mounting operation of the board 16 on the board transfer lane set as the priority lane cannot be continued due to a component shortage or the like. The electronic component mounting operation is switched to the non-priority lane on the condition that there is a board 16 that can perform the electronic component mounting operation. As a result, even if the production in the priority lane cannot be continued, the mounting operation can be continued without interruption.

  The production lane return means 33, for example, interrupts the mounting operation of the board 16 on the non-priority lane when the cassette feeder 25 that has run out of parts is set (supplemented) and production in the priority lane becomes possible. Then, the mounting operation of the board 16 on the priority lane is resumed. As a result, the substrates 16 can be dispensed in the order in which they are loaded.

  The control device 30 detects that the substrate transport device 15 that transports the substrate 16, the slide drive device 35 that drives the X-axis and Y-axis slides 22 and 21 to which the mounting head 23 is attached, and the cassette-type feeder 25 being out of components. The component-out detection device 36 to be connected to the board detection sensors S1 and S2. Note that the component-out detection device 36 can be configured by the CCD camera 24 that detects that the electronic component is no longer attracted to the suction nozzle of the mounting head 23. Alternatively, by managing the remaining amount of electronic components stored and held in the cassette-type feeder 25, it is possible to detect a component breakage.

  Next, the mounting control of the substrate 16 will be described with reference to FIG. In the following description, the same type of substrate 16 is placed in the two rows of substrate transfer lanes 17 and 18, and electronic components are sequentially mounted on the substrate 16 on each of the substrate transfer lanes 17 and 18 by one mounting head 23. Examples will be described.

  As shown in FIG. 3A, in the state where the substrates 16 are not present in the two rows of substrate transport lanes 17 and 18, one of the two rows of substrate transport lanes 17 and 18, for example, the first substrate transport lane 17 Then, a substrate 16 (two-dot chain line in FIG. 3A) on which an electronic component is to be mounted is carried.

  When the substrate 16 is loaded into the first substrate transfer lane 17 and the empty state of the substrate is detected on the mounting stage 17a based on the signal of the substrate detection sensor S1, the substrate loaded into the first substrate transfer lane 17 As shown by a solid line in FIG. 3A, 16 is carried into the mounting stage 17a by a belt conveyor (not shown) and is clamped by a clamping device (not shown). Then, by the priority lane setting means 31 of the control device 30, the substrate transport lane 17 in which the substrate 16 has been transported first to the mounting stage 17a is set as the priority lane.

  When the substrate 16 is conveyed to the mounting stage 17a, the XY-axis slide drive device 35 is operated, and the electronic components are sucked and held from the cassette type feeder 25 by the suction nozzle of the mounting head 23, as shown in FIG. In addition, an electronic component mounting operation is performed on the substrate 16 on the mounting stage 17a of the substrate transport lane 17 set as the priority lane. When the substrate 16 is simultaneously loaded into the mounting stages 17a and 18a of the two rows of substrate transport lanes 17 and 18, a predetermined specific substrate transport lane (for example, the first substrate transport lane 17) is provided. Priority lane is defined.

  By the way, in the mounting stage 17a, when the electronic component is being mounted, as shown in FIG. 3C, when a component breakage occurs in a certain cassette type feeder 25, this is detected by the component breakage detection device 36, A component-out signal is sent to the control device 30. As a result, it is recognized that the production cannot be continued in the priority lane, and the mounting operation of the electronic component on the board 16 in the mounting stage 17a is interrupted. In FIG. 3C, the cassette type feeder 25 in which the component has been cut out and the substrate 16 in which the mounting operation has been interrupted are shown shaded.

  When it is detected that production cannot be continued in the priority lane due to out of parts, the mounting stage 18a of the other board transfer lane 18 (hereinafter referred to as a non-priority lane) that is not the priority lane is detected. Then, it is confirmed whether or not there is a substrate 16 that can be produced. As shown in FIG. 3C, when there is a production capable board 16 on the non-priority lane mounting stage 18a, the production lane switching means 32 of the control device 30 commands the production lane switching. The mounting head 23 switches the lane on which the electronic component is mounted to the substrate transport lane 18 side and starts production.

  That is, by controlling the slide driving device 35, the mounting head 23 is operated between the non-priority lane mounting stage 18a and the cassette feeder 25, and as shown in FIG. Electronic components are mounted on the substrate 16 that is positioned and clamped on the stage 18a. In this case, since an out-of-component has occurred in a certain electronic component, the mounting operation is performed without the electronic component, and the mounting operation is not completed in the non-priority lane. During this time, the operator replaces the cassette-type feeder 25 that has run out of parts.

  During the mounting operation of the electronic component on the board 16 in the non-priority lane, the replacement of the cassette type feeder 25 in which the component has run out is completed, and as shown in FIG. Then, the production lane return means 33 of the control device 30 instructs the return of the production lane. Based on this command, the mounting operation in the non-priority lane is interrupted, and the production in the priority lane (substrate transport lane 17) is resumed. Resume.

  In this way, when the predetermined mounting operation of the electronic components on the board 16 in the priority lane is completed, the board 16 on which the predetermined mounting work is completed is illustrated in FIG. While being unloaded from the mounting stage 17a, the mounting operation on the substrate 16 in the non-priority lane where the mounting operation has been suspended is resumed. Thereafter, when the predetermined mounting operation of the electronic components on the board 16 in the non-priority lane is completed, the board 16 is unloaded from the mounting stage 18a by a belt conveyor (not shown).

  As a result, the substrates 16 can be dispensed in the order in which they are loaded into the substrate transport lanes 17 and 18, thereby enabling simple traceability management, that is, product history management even when a defect occurs on the substrate, for example. It becomes easy to track.

  Moreover, according to the above-described embodiment, even when electronic components cannot be supplied to the board 16 on the priority lane, the production can be continued without stopping, so that the operating rate for producing the board 16 is improved. In addition, since the substrates 16 can be dispensed in the order in which they are put into the substrate transport lanes 17 and 18, it is possible to reduce the balance of the throughput balance and suppress a decrease in the throughput.

  In the above-described mounting control, the example in which the same type of substrate 16 is loaded into the two rows of substrate transport lanes 17 and 18 has been described. However, different types of substrates 16, that is, should be mounted on the two rows of substrate transport lanes 17 and 18. A substrate 16 with different electronic components can be introduced, and this embodiment will be described with reference to FIG. In the following, the substrate put into the first substrate transport lane 17 is represented as 16A, and the substrate put into the second substrate transport lane 18 is represented as 16B.

  4A to 4D are similar to those described with reference to FIGS. 3A to 3D, while electronic components are being mounted in the priority lane (first substrate transfer lane 17). In addition, when a part of the cassette type feeder 25 is cut out and production cannot be continued in the priority lane, the mounting stage 18a in the non-priority lane (second substrate transport lane 18) is not placed. The mounting operation is switched from the priority lane to the non-priority lane on condition that there is a board 16 that can be produced.

  However, since different types of boards 16A and 16B flow in the priority lane and the non-priority lane, depending on the type of electronic component that has run out of parts, it may not be used for mounting the board 16B in the non-priority lane. As a result, depending on the mounting operation time of the board 16B in the non-priority lane, the mounting operation of the electronic component on the board 16B in the non-priority lane may be completed before the missing component electronic component is replenished. .

  Accordingly, as shown in FIG. 4E, when the mounting operation of the electronic components on the board 16B in the non-priority lane is completed before the conditions for restarting the production in the priority lane are established as in this embodiment. In addition, the mounted board 16B on the non-priority lane is controlled to be carried out of the mounting stage 18a by a belt conveyor (not shown).

  Then, as shown in FIG. 4F, when the cassette type feeder 25 that has run out of parts is replenished and the conditions for continuing the production in the priority lane are established, the production lane return means 33 of the control device 30 restores the production lane. Is commanded, and production in the priority lane is resumed based on this command. When the predetermined mounting operation of the board 16A in the priority lane is completed, the board 16A is unloaded from the mounting stage 17a.

  As described above, when different types of substrates 16A and 16B are loaded into the first and second substrate transport lanes 17 and 18, the time required for replacing the cassette-type feeder 25 and the mounting of the substrate 16B on the non-priority lanes. In rare cases, there is a possibility that the substrates 16 cannot be discharged in the order of loading into the substrate transfer lanes 17 and 18 due to the time, but basically the order of loading into the substrate transfer lanes 17 and 18 may occur. Thus, the substrate 16 is paid out. As a result, the balance of throughput can be reduced, and a decrease in throughput can be suppressed.

  FIG. 5 shows a modification of the embodiment described with reference to FIG. 4. Even when different types of boards 16A and 16B are produced, it is necessary to ensure that the non-priority lane boards are not discharged first. In this order, the substrates 16 are discharged in the order of loading into the substrate transport lanes 17 and 18.

  That is, as in the embodiment described with reference to FIG. 4, the substrate 16 on which electronic components are to be mounted is mounted on either one of the first and second substrate transfer lanes 17 and 18 (for example, the first substrate transfer). When loaded into the mounting stage 17a) of the lane 17 (see FIG. 5A), the first substrate transport lane 17 is set as the priority lane by the priority lane setting means 31.

  When the substrate 16A is transported to the mounting stage 17a, as shown in FIG. 5B, electronic components are mounted on the substrate 16A on the mounting stage 17a. Then, as shown in FIG. 5C, when a component breakage occurs in a certain cassette-type feeder 25 while the electronic component is being mounted, the mounting stage 17a is based on the detection signal of the component breakage detection device 36. The mounting operation of the electronic component on the board 16A is interrupted, and the production lane switching means 32 instructs to switch the production lane. As a result, as shown in FIG. 5D, the electronic component is mounted on the substrate 16B positioned and clamped on the mounting stage 18a of the non-priority lane.

  In this case, since the different types of boards 16A and 16B flow through the priority lane and the non-priority lane, the electronic components are mounted on the board 16B in the non-priority lane before the cassette type feeder 25 that has run out of parts is supplied. It happens that all work is completed. However, by setting in advance the board 16A in the priority lane to be paid out first, the board 16B for which the electronic component mounting work has been completed in the non-priority lane waits in that state without being paid out. The substrate 16B at this time is indicated by hatching in FIG.

  In this state, when the cassette-type feeder 25 is replenished and the conditions for continuing the production in the priority lane are satisfied, as shown in FIG. 5 (F), the production is returned to the production in the priority lane again. Thus, when the mounting operation of the electronic components on the board 16A in the priority lane is completed, the board 16A on the priority lane is unloaded from the mounting stage 17a by the belt conveyor (not shown) as shown in FIG. Is done.

  When the board 16B is present on the non-priority lane mounting stage 18a after the payout of the board 16A on the priority lane is completed, the second board transport lane 18 that was the non-priority lane is now displayed. Is switched to the priority lane. At this time, since the mounted substrate 16B to be dispensed exists on the priority lane (second substrate transfer lane 18), the substrate 16B is carried out of the mounting stage 18a by a belt conveyor (not shown). .

  As a result, the different types of substrates 16A and 16B are discharged in the order in which they are put into the two rows of substrate transport lanes 17 and 18, whereby the substrates are continuously connected from the same lane under any circumstances. It becomes possible to prevent the balance of the throughput balance caused by paying out, and to realize a balanced and ideal throughput. At the same time, it is possible to track the product history when a problem occurs.

  In FIG. 6, a plurality of mounting stages 41a, 42a to 41d, and 42d are arranged on the two rows of substrate transport lanes 17 and 18, respectively, and different mounting boards 16A, 42a to 41d, and 42d are provided on the mounting stages 41a, 42a to 41d, and 42d, respectively. An example in which 16B is sequentially produced is shown, and the effect when the production method of the above-described embodiment is applied will be described in detail based on this.

  In such a line configuration, the production times in the plurality of mounting stages 41a, 42a to 41d, 42d in the substrate transfer lanes 17, 18 do not necessarily match. Here, if the substrates are alternately put into the first and second substrate transport lanes 17 and 18 and are produced in order, the throughput in the production line is as follows. 18 production hours are added. Since the throughput of the production line is determined by the mounting stage that takes the longest time in the production line, the production time in each mounting stage is set to be approximately equal to the sum of the production times of the two lanes 17 and 18 in advance. Is balanced. For this reason, by assigning the production time in each of the mounting stages 41a, 42a to 41d, 42d as shown in FIG. 6, for example, the throughput of the production line becomes 35 seconds determined by the third mounting stage.

  By the way, for example, in the second mounting stage 41b of the first board transfer lane 17, when it is impossible to continue production due to parts being cut off, the production lane is set as described in the example of FIGS. Switching to the second substrate transport lane 18 side, the production is continued by the second mounting stage 42b.

  In this case, if the production of the substrate on the second mounting stage 42b of the second substrate transport lane 18 is continued until the predetermined mounting operation is completed even if the parts that have run out are supplied, the second mounting stage starts. The substrate flows continuously from the same lane to the third mounting stage. Such a phenomenon can be particularly noticeable when, for example, the production time in the mounting stage with the lanes switched is short and the substrate is dispensed to the subsequent process in a short time. For this reason, the production time at the third mounting stage changes (increases), resulting in a momentary deterioration in line throughput. In other words, in the third mounting stage, two boards were produced in 35 seconds, but in lane production only on one side, it takes 50 seconds (25 seconds × 2) to produce two boards. It will be.

  However, as described in the present embodiment, when an electronic component can be supplied to the board 16A on the priority lane (first board transfer lane 17), the non-priority lane (second board transfer lane). From 18), by returning the production so that electronic components are mounted on the board on the priority lane, the possibility that the board on the same lane continuously flows can be reduced. As a result, a change in throughput per line can be minimized, and an improvement in line throughput can be expected.

  The example shown in FIG. 6 is an example for explaining the effect when the production method according to the embodiment is applied. For example, when the same kind of substrates are produced in the two rows of substrate transport lanes 17 and 18, FIG. 6, even when the production times in the mounting stages 41a, 42a to 41d, and 42d are the same, it is possible to reduce the balance of the throughput balance and suppress the decrease in the throughput. Explaining this point, in a normal balanced state, during the production in one substrate transport lane, the substrate in the other substrate transport lane can be loaded and unloaded, so the production loss time due to substrate transport is Although it appears to be zero, if the board loading / unloading sequence changes, the board in the other board transfer lane must be loaded / unloaded during production in one board transfer lane at the upstream or downstream mounting stage. In such a case, the substrate transfer time becomes a loss time. However, as in the above-described embodiment, if the substrates 16 can be basically dispensed in the order in which they are put into the substrate transport lanes 17 and 18, the normal balanced state will not be greatly lost, and therefore the substrate transport is not performed. Production loss time is less likely to occur.

  In the above-described embodiment, the electronic component mounting apparatus 10 provided with the two rows of substrate transport lanes 17 and 18 has been described. However, the substrate transport lane is not necessarily limited to two rows. The present invention can also be applied to those provided in rows or more.

  Further, in the above-described embodiment, the substrate transport lane into which the substrate has been first input is set as the priority lane. However, the substrate that has been input first is set as the priority substrate, and this priority substrate is paid out first. It is also possible to pay out the boards in other lanes after paying out the priority board. In this case, too, it is clear that the expression is different and is substantially the same as setting the priority lane, so it should be construed as synonymous with setting the priority lane, and in that category Of course included.

  Further, in the above-described embodiment, the production lane is switched when the electronic component to be mounted on the board 16 is cut out. However, the production lane is switched when the component is cut out. In addition, when it becomes difficult to continue production in the priority lane for some reason, for example, when the cassette feeder 25 fails, an error occurs in image processing, or production is temporarily performed This can be applied when the production of the substrate cannot be continued due to reasons such as stopping.

  In addition, when the production is temporarily stopped temporarily, for example, when there is an empty slot in the parts supply device 11, it is detected by the remaining amount management that the parts of the cassette type feeder 25 are likely to disappear. Then, a warning is issued in advance, and the operator sets the spare cassette type feeder in the empty slot in advance based on the warning. That is, when there are no parts in the cassette-type feeder 25, the electronic parts are taken out from the spare cassette-type feeder, so that it is possible to eliminate the interruption of production due to out-of-parts without switching the production lane. However, since the efficiency of the mounting operation is optimized at the regular component removal position, the spare cassette type feeder 25 may be reset to the regular component removal position that has been removed due to the absence of electronic components. It is. As described above, when the time for stopping the production of the substrate on the priority lane is short, there is almost no loss in the balance of throughput, and the effect is increased.

  Further, in the above-described embodiment, the example in which the substrate detection sensors S1 and S2 for detecting the substrate 16 are provided on the mounting stages of the two rows of substrate transport lanes 17 and 18 has been described, but these substrate detection sensors are abolished. The position of the substrate 16 on each lane can be stored by the control device 30 that controls the substrate transfer device 15.

  Thus, the specific configuration described in the above-described embodiment is merely an example of the present invention, and the present invention is not limited to such a specific configuration. Various embodiments can be adopted without departing from the scope.

  DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 11 ... Component supply apparatus, 13 ... Board holding apparatus, 14 ... Component transfer apparatus, 15 ... Board transfer apparatus, 16 (16A, 16B) ... Board, 17, 18 ... Board transfer lane, 17a 18a ... mounting stage, 21 ... Y-axis slide, 22 ... X-axis slide, 23 ... mounting head, 24 ... CCD camera, 25 ... cassette feeder, 30 ... control device, 31 ... priority lane setting means, 32 ... production lane Switching means, 33... Production lane return means, 35... Slide drive device, 36.

Claims (2)

A substrate production method in an electronic component mounting apparatus that has a plurality of substrate conveyance lanes for conveying a substrate and sequentially mounts electronic components on a substrate conveyed on the plurality of substrate conveyance lanes,
Putting different types of substrates with different electronic components into each of the plurality of substrate transfer lanes,
A substrate transport lane in which a substrate is first inserted among the plurality of substrate transport lanes is set as a priority lane,
Mount electronic components on the board on the priority lane,
When the production of the board on the priority lane cannot be continued, the production lane is switched so that the electronic component is mounted on the board on the other production board transportation lane,
After that, at the stage where the production of the board on the priority lane can be continued, the production is returned to mount the electronic component on the board on the priority lane.
A substrate production method characterized by the above. A plurality of substrate transport lanes for transporting different types of substrates with different electronic components to be mounted;
A mounting means for picking up an electronic component from a component supply device and mounting the electronic component on a substrate on the substrate transport lane;
Priority lane setting means for setting a substrate transport lane into which a substrate has been previously inserted among the plurality of substrate transport lanes as a priority lane;
When the mounting means is controlled to mount the electronic component on the substrate on the priority lane, and the production of the substrate on the substrate transport lane set as the priority lane cannot be continued, another substrate that can be produced Lane switching means for switching the lane to be produced so that electronic components are mounted on the substrate on the transfer lane,
When the production of the board on the priority lane can be continued, the production return means for returning the production so as to mount the electronic component on the board on the priority lane;
An electronic component mounting apparatus comprising:

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