JP4692687B2 - Mounting board manufacturing method - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting a component such as an electronic component on a circuit board or the like, a method for manufacturing the mounted product, and a conveyor device typically used in the component mounting apparatus.

  2. Description of the Related Art Conventionally, a mounting machine for mounting an electronic component on a substrate includes a head that holds the electronic component and moves horizontally. For example, a nozzle that vacuum-sucks the electronic component is attached to the head, and the nozzle moves up and down, so that the nozzle comes in contact with the substrate and mounts the electronic component on the substrate (see, for example, Patent Document 1).

  The mounting machine disclosed in Patent Literature 1 includes, for example, four electronic component supply units F1 to F4. Between the electronic component supply units F1 and F2, the substrate can be moved in the direction in which the electronic component supply units F1 and F2 are arranged (y direction in FIG. 3 of Patent Document 1) by two substrate conveyors. Similarly, the substrate can be moved in the y direction by two substrate conveyors between the electronic component supply units F3 and F4. The substrate conveyor itself does not move in the x direction.

  As shown in FIGS. 5 to 7, these four substrate conveyors move the substrates P <b> 1 to P <b> 7 in the x direction in the center row of the mounting machine. For example, a substrate is moved in the x direction from one substrate conveyor to another substrate conveyor.

JP 2007-227617 A (paragraph [0047], FIG. 5, FIG. 6 and FIG. 7)

  In the mounting machine disclosed in Patent Document 1, for example, as shown in FIG. 5A, after the electronic component is mounted on the substrate P1 in the first mounting region corresponding to the supply unit F1, the substrate P1 is temporarily placed in the center. In the middle row, it is moved from one substrate conveyor to the other substrate conveyor in the x direction. Then, the board | substrate P1 is moved to the 3rd mounting area | region corresponding to the supply part F3 by the movement of the said other board | substrate conveyor, and an electronic component is mounted in this 3rd mounting area | region. At this time, as shown in FIG. 5D, the electronic component is mounted on the substrate P3 in the first mounting region. As described above, since the board is moved in the x direction in the central row and then moved in the y direction in order to be carried into each mounting area, the loss of the replacement time of the board in each mounting area is large.

  In view of the circumstances as described above, an object of the present invention is to provide a component mounting apparatus, a method for manufacturing a mounted product, and a conveyor device used in the component mounting apparatus that can shorten the time for replacing a substrate in a mounting area. There is to do.

A method for manufacturing a mounting substrate according to an aspect of the present invention includes:
A load area for loading the substrate, and
An unload area to unload the board;
A first mounting area including a first conveyor and a second conveyor that can be arranged along a first direction, wherein the first component is an area where the first component is mounted on the substrate;
Including a third conveyor and a fourth conveyor that can be arranged along the first direction, and provided apart from the first mounting area in a second direction orthogonal to the first direction; A second mounting area in which the second component is mounted on the substrate;
A load conveyor disposed in the load area;
A mounting board manufacturing method by a component mounting apparatus comprising an unloading conveyor disposed in the unloading area,
Arranging the load conveyor, the first conveyor and the second conveyor in this order along the first direction;
Mounting the first component on a substrate on the first conveyor;
Causing the load conveyor to wait for the substrate,
Moving the board on which the first component is mounted to the second conveyor, and moving the board waiting on the load conveyor to the first conveyor;
Arranging the third conveyor, the fourth conveyor and the unload conveyor in this order along the first direction;
While the first component is mounted on the substrate on the first conveyor, the substrate moved to the second conveyor is moved to the third conveyor through the third region. Wait,
Mounting the second component on the fourth conveyor on the substrate on which the first component is mounted;
The substrate on which the second component is mounted is moved to the unload conveyor, and the substrate on which the first component, which has been waiting on the third conveyor, is moved to the fourth conveyor.

A manufacturing method of a mounting board according to another embodiment of the present invention,
A load area for loading the substrate, and
An unload area to unload the board;
A first mounting area including a first conveyor and a second conveyor that can be arranged along a first direction, wherein the first component is an area where the first component is mounted on the substrate;
Including a third conveyor and a fourth conveyor that can be arranged along the first direction, and provided apart from the first mounting area in a second direction orthogonal to the first direction; A second mounting area in which the second component is mounted on the substrate;
A load conveyor disposed in the load area;
A mounting board manufacturing method by a component mounting apparatus comprising an unloading conveyor disposed in the unloading area,
Continuously arranging the load conveyor and the first conveyor along the first direction;
Moving the substrate placed on the load conveyor to the first conveyor and loading the substrate onto the load conveyor;
The first conveyor is moved so as to be continuous with the second conveyor arranged in the first mounting area, and the third conveyor is arranged so as to be continuous with the third conveyor arranged in the second mounting area. Move the load conveyor,
Moving the substrate disposed on the first conveyor to the second conveyor and moving the substrate disposed on the load conveyor to the third conveyor;
A method for manufacturing a mounting substrate, wherein the first component is mounted on a substrate on the second conveyor, and the second component is mounted on the substrate on the third conveyor.

  In such a form, a board | substrate is conveyed between the 1st and 2nd conveyor arrange | positioned in a 1st area | region, and a board | substrate is conveyed between the 3rd and 4th conveyor arrange | positioned in a 2nd area | region. Is done. For example, when the substrate is transferred from the first conveyor to the second conveyor, and at least the area where the second conveyor is arranged is the first mounting area, the replacement of the board in the first mounting area is performed. Time is shortened. That is, the component mounting apparatus according to the present invention can shorten the board replacement time, unlike the mechanism in which the board between the conveyors is transported by only the central row as in the mounting machine of Patent Document 1.

  According to the present invention, it is possible to shorten the substrate replacement time in the mounting area.

It is a front view which shows the component mounting apparatus which concerns on one embodiment of this invention. It is the top view which fractured | ruptured a part of the component mounting apparatus. It is a side view which shows the component mounting apparatus. It is a top view corresponding to the component mounting apparatus shown in FIG. 2, Comprising: It is a figure for demonstrating each area | region of a component mounting apparatus. (A) is a figure which shows the range which each conveyor moves in Z type | mold flow, (B) is a figure which shows the direction through which one board | substrate flows in Z type | mold flow. It is a figure for demonstrating the detail of Z type | mold flow. (A) is a figure which shows the range which each conveyor moves in a parallel type | mold flow, (B) is a figure which shows the direction where two board | substrates flow in a parallel type | mold flow. It is a figure for demonstrating the detail of a parallel type | mold flow. (A) is a figure which shows the range which each conveyor moves in a X-type flow, (B) is a figure which shows the direction through which two board | substrates flow in a X-type flow. It is a figure for demonstrating the detail of a X-type flow. It is a schematic diagram which shows the mounting apparatus of "2 head 1 board | substrate process" as a comparative example of the component mounting apparatus which concerns on this embodiment. In the said component mounting apparatus, it is a schematic diagram which shows the width adjustment mechanism which adjusts the width | variety of a conveyor. It is a schematic diagram which shows the width adjustment mechanism of the conveyor apparatus based on one embodiment of this invention. It is a figure for demonstrating operation | movement of the conveyor apparatus shown in FIG. It is a figure for demonstrating operation | movement of the conveyor apparatus shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a front view showing a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view in which a part of the component mounting apparatus 1 is broken. FIG. 3 is a side view showing the component mounting apparatus 1. FIG. 4 is a plan view corresponding to the component mounting apparatus 1 shown in FIG. 2, for explaining each region of the component mounting apparatus 1.

  As shown in FIG. 4, the component mounting apparatus 1 includes a load area 21, a main area 22, and an unload area 23 along a direction in which a circuit board (hereinafter simply referred to as a board) 9 flows, in FIG. It has.

  A load conveyor 65 is disposed in the load area 21, and the board 9 is loaded from the outside of the component mounting apparatus 1 by the load conveyor 65, and the loaded board 9 is transferred to the main area 22. In the main region 22, a conveyor group including a first conveyor 61, a second conveyor 62, a third conveyor 63, and a fourth conveyor 64 is arranged. The substrate 9 is moved in the main region 22 by the conveyor group, and the substrate 9 is arranged at each position in the main region 22 as described later. An unload conveyor 66 is arranged in the unload area 23. The board 9 is transferred from the main area 22 by the unload conveyor 66, and the board 9 is unloaded to the outside of the component mounting apparatus 1. FIG. 2 illustrates a state where the substrate 9 is placed on the first and fourth conveyors 61 and 64.

  The load conveyor 65, the unload conveyor 66, and the first to fourth conveyors 61 to 64 typically only need to have the same configuration. Therefore, in the following description, particularly when the load conveyor 65, the unload conveyor 66, and the first to fourth conveyors 61 to 64 are described without being distinguished, the load conveyor 65, the unload conveyor 66, the first to the first conveyors. Focusing on one of the four conveyors 61 to 64, it is simply referred to as "conveyor 60".

  The conveyor 60 has, for example, a support portion (conveyor portion) 69 that supports the substrate 9 from below and moves the support portion 69 in the X-axis direction, thereby transporting the substrate 9 in the X-axis direction. The configuration for moving the support portion 69 is typically a known configuration such as a drive mechanism using a belt or a chain, but may be another known configuration. Moreover, the conveyor is provided with a pair of side plates 71 and 72 as shown in FIG.2 and FIG.4. A pair of side plates 71 and 72 are provided on the conveyor portion using the belt or chain mechanism or the like so that the substrate 9 is disposed between the side plates 71 and 72.

  Further, as will be described later, the conveyor 60 itself moves in the Y-axis direction by the conveyor drive unit (drive mechanism).

  The component mounting apparatus 1 may be connected to an external device (not shown) in the factory. The external device is, for example, another component mounting device, a cream solder printing device, an inspection device, a reflow device, or the like. There are cases where a plurality of component mounting apparatuses 1 are prepared and the plurality of component mounting apparatuses 1 are connected to each other. This is a case where the number of types of electronic components mounted on one board 9 is large.

  The component mounting apparatus 1 includes a base portion 2 and a frame structure 20 supported by the base portion 2. The frame structure 20 includes a plurality of support columns 4 erected on the base portion 2 and, for example, a beam 5 bridged between the two support columns 4. For example, four columns 4 are provided, and two beams 5 are provided, for example.

  The frame structure 20 is provided with two mounting units 70 and 80 for mounting the electronic component 13 on the substrate 9. The two mounting units 70 and 80 have the same configuration. Therefore, hereinafter, in the description of the mounting units 70 and 80, one mounting unit 70 will be described unless there is a description paying attention to both of the two mounting units 70 and 80.

  The mounting unit 70 includes a head 35 that holds the electronic component 13 and a head drive mechanism 30 that moves the head 35.

  The head driving mechanism 30 typically includes a moving member 6 that extends in the Y-axis direction and is movable in the X-axis direction, a guided body 12 that is fixed to the upper surfaces of both ends of the moving member 6, and the beam 5. And a rail 11 that extends in the X-axis direction and guides the movement of the guided body 12. The rail 11 is common to the two heads 35 (and the two moving members 6). However, the rail 11 may be provided for each head 35 (and the two moving members 6).

  With such a configuration of the head driving mechanism 30, the moving member 6 can move in the X-axis direction along the beam 5. Thereby, the head 35 connected to the moving member 6 can move in the X-axis direction. As a driving method for moving the moving member 6, for example, a ball screw, a belt (or chain), a linear motor, or other driving mechanism may be used as described later.

  The head 35 typically includes a plurality of suction nozzles 8, a nozzle holding part 7 that holds these suction nozzles 8, and a support part 18 that supports the nozzle holding part 7. The support portion 18 is connected to the moving member 6, whereby the head 35 can be moved in the Y-axis direction by driving a ball screw provided inside the moving member 6. In this case as well, the belt screw (or chain), linear motor, or other drive mechanism is not limited to the ball screw.

  With the configuration as described above, the head 35 is movable in the XY plane.

  The nozzle holding part 7 is provided so as to be suspended from the support part 18. The nozzle holding part 7 can be rotated forward and backward by a built-in motor (not shown). As shown in FIG. 1, the rotation main shaft a <b> 1 of the nozzle holding unit 7 is provided in a state inclined with respect to the Z-axis direction.

  For example, twelve suction nozzles 8 are arranged at equal intervals in the circumferential direction at a portion near the outer periphery of the nozzle holding unit 7. The suction nozzle 8 is mounted on the nozzle holding portion 7 so that the respective axes of the suction nozzle 8 are inclined with respect to the rotation main axis a <b> 1 of the nozzle holding portion 7. The inclination is such that the upper end of the suction nozzle 8 approaches the rotation main axis a <b> 1 of the nozzle holding unit 7. That is, as a whole, the twelve suction nozzles 8 are arranged so as to expand toward the nozzle holding portion 7.

  The suction nozzle 8 is supported so as to be movable in the axial direction with respect to the nozzle holding portion 7, and when the suction nozzle 8 is positioned at an operation position to be described later, the suction nozzle 8 is pressed from above and lowered. This pressing mechanism may be anything such as a cam mechanism, a ball screw mechanism, a solenoid, or an air pressure generating mechanism.

  In FIG. 1, the axis of the suction nozzle 8 located at the right end of the head 35 of the mounting unit 80 is directed in the Z-axis direction, and the suction nozzle located at the right end corresponds to the operation position. The electronic component 13 is sucked or removed by the suction nozzle 8 positioned at the operation position and facing the vertical direction.

  There are a plurality of types of electronic components 13 mounted on one substrate 9. Thus, the different electronic components 13 cannot be picked up and mounted by the single kind of suction nozzle 8. Therefore, a plurality of types of suction nozzles 8 are provided, and each corresponding electronic component 13 is sucked and mounted by an optimal suction nozzle. Examples of the electronic component 13 include an IC chip, a resistor, a capacitor, and a coil.

  The suction nozzle 8 is connected to, for example, an air compressor (not shown), and the tip of the suction nozzle 8 positioned at the operation position is switched to negative pressure or positive pressure at a predetermined timing. As a result, the electronic component 13 is attracted or separated at the tip.

  As shown in FIG. 4, the main area 22 includes a first area 31 including a first mounting area, a second area 32 including a second mounting area, and the first and second areas 31 and 32. It has a buffer area 33 (third area) provided therebetween. The first region 31, the second region 32, and the buffer region 33 are provided so as to be aligned along the Y-axis direction.

  As shown in FIG. 2, the component mounting apparatus 1 includes arrangement units 16 and 26 that are provided on both sides of the main region 22 in the Y-axis direction and in which the component supply device 14 is arranged. The placement unit 16 is disposed adjacent to the first region 31, and the placement unit 26 is disposed adjacent to the second region 32. In the placement unit 16, a plurality of component supply devices 14 are arranged in the X-axis direction and are detachably placed at predetermined sites in the placement unit 16. Similarly, a plurality of component supply devices 14 are also arranged in the X-axis direction in the arrangement unit 26 and are detachably arranged at predetermined sites in the arrangement unit 26. Each component supply device 14 is typically a tape feeder including a carrier tape in which a large number of electronic components 13 of the same type are accommodated, but may be another type of component supply device.

  In the example of FIGS. 2 and 4, for convenience of explanation, the initial state of the component mounting apparatus 1 is shown such that the first and second conveyors 61 and 62 are arranged in the first region 31. The third and fourth conveyors 63 and 64 are shown disposed in the second region 32. That is, in the initial state shown in these drawings, the first to fourth conveyors 61 to 64 are arranged in a matrix with the buffer region 33 interposed therebetween. In this initial state, the area occupied by the substrate 9 placed on the first conveyor 61 is mainly the first mounting area M1. In the initial state shown in FIGS. 2 and 4, the area occupied by the substrate 9 placed on the fourth conveyor 64 is mainly the second mounting area M2.

  However, as will be described later, depending on the order of conveyance of the substrates 9 by the conveyor group, the substrates 9 placed on the first and second conveyors 61 and 62 respectively occupy in the initial state shown in FIGS. Both of the areas can be the first mounting area M1. Similarly, both of the areas occupied by the substrates 9 mounted on the third and fourth conveyors 63 and 64 can be the second mounting area M2.

  Further, the position of each conveyor 60 in the initial state of the component mounting apparatus 1 is not limited to the example shown in FIGS. 2 and 4 and can be changed as appropriate.

  In the component supply device 14, different types of electronic components 13 are stored for each component supply device 14. Then, the suction nozzle 8 and the component supply device 14 are selected depending on which position on the substrate 9 the electronic component 13 is mounted on, and the electronic component 13 is sucked.

  The group of electronic components 13 supplied as a whole of the placement unit 16 and the group of electronic components 13 supplied as a whole of the placement unit 26 may be the same or different.

  A component supply port 15 is provided at one end of the component supply device 14. Each component supply device 14 is attached to the placement portions 16 and 26 so that one end portion provided with the component supply port 15 faces the first and second mounting regions M1 and M2 respectively. The suction nozzle 8 takes out the electronic component 13 through the component supply port 15. In this manner, the suction nozzle 8 when the electronic component 13 is taken out, or the area of each head 35 at that time (the area including the operation position) is set as the component supply areas S1 and S2. With respect to the head 35 of the mounting unit 70, the suction nozzle 8 that has come to the operation position moves within the range of the component supply region S1, the first mounting region M1, and the region connecting these regions S1 and M1. Similarly, with respect to the head 35 of the mounting unit 80, the suction nozzle 8 that has come to the operating position moves within the range of the component supply region S2, the second mounting region M2, and the region connecting these regions S2 and M2. .

  The head 35 first moves onto the component supply region S1 and sequentially sucks predetermined electronic components 13 by using twelve suction nozzles 8 provided in the nozzle holding unit 7. Then, the head 70 moves to the component mounting area M1, and the components sucked by the suction nozzle 8 are sequentially mounted at predetermined positions on the substrate 9 while adjusting the movement in the X-axis direction and the Y-axis direction. The movement of the head 70 in the X-axis direction and the Y-axis direction is performed by the moving member 6 and the support portion 18 described above. By repeating this operation, the electronic component 13 is mounted on the substrate 9.

  As shown in FIGS. 2 to 4, a plurality of linear guide rails 29 for moving each conveyor 60 in the Y-axis direction are laid on the base portion 2. The component mounting apparatus 1 includes a control unit (not shown) and a conveyor drive unit (not shown) that moves the conveyors 61 to 66 in response to a control signal from the control unit. The conveyor drive unit individually drives the first to fourth conveyors 61 to 64, the load conveyor 65, and the unload conveyor 66. As the conveyor drive unit, a rack-and-pinion drive unit (not shown), a ball screw drive unit, a belt (or chain) drive unit, a linear motor drive unit, or the like is used. These conveyor drive units are provided for each conveyor 60.

  By such a conveyor drive unit and linear guide rail 29, for example, the load conveyor 65 and the unload conveyor 66 move over the entire load area 21 and the entire unload area 23. In the main area 22, the first and second conveyors 61 and 62 move to the buffer area 33, and the third and fourth conveyors 63 and 64 move to the buffer area 33.

  In the buffer area 33, an area where the first conveyor 61 or the third conveyor 63 is arranged is referred to as a first buffer area 33a. An area where the second conveyor 62 or the fourth conveyor 64 is disposed is referred to as a second buffer area 33b.

  The control unit has a configuration for realizing information processing such as a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). A predetermined program is stored in the ROM or other storage device. The predetermined program is, for example, a program related to an operation sequence of each conveyor 60. Instead of software, hardware or firmware may be used as a configuration for realizing a function related to the operation sequence of each conveyor 60. For example, a DSP (Digital Signal Processor), an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), or the like may be used instead of the CPU.

  With such a configuration, the control unit controls the start and stop of the movement of each conveyor 60 by the conveyor drive unit and the timing thereof. In addition, the control unit controls the operation sequence of the conveyor 60, the transfer of the substrate 9 of the conveyor itself and the stop thereof, and the timing thereof.

  Next, the operation of the component mounting apparatus 1 configured as described above will be described. As an exemplary embodiment of the flow: "Z-type flow", 2. “Parallel flow”; Three types of “X-type flow” will be described.

1. Description of Z-type Flow FIG. 5A is a diagram showing a range of movement of each conveyor 60 in the Z-type flow, and FIG. 5B is a diagram showing a direction in which one substrate 9 flows in the Z-type flow. It is.

  In FIG. 5 (A), the arrow shown with a broken line is the range which each conveyor 60 moves, and shows that the 1st and 4th conveyor 64 without a broken line arrow does not move. In this case, the first conveyor 61 passes the substrate 9 to the second conveyor 62, and the fourth conveyor 64 receives the substrate 9 from the third conveyor 63. Each conveyor 60 and its moving range will be described as row numbers 1 to 3 and column numbers A to D using a matrix. In FIG. 5A, for example, the position where the load conveyor 65 is arranged is row 2 and column A, and this is represented as (2, A).

  A solid line arrow indicates a direction of conveyance performed by each conveyor 60 itself. In this example, the second conveyor 62 and the third conveyor 63 convey the substrate 9 in both positive and negative directions in the Y-axis direction.

  As shown in FIG. 5B, the flow path of the substrate 9 is similar to the letter Z, so this flow is called a Z-type flow for convenience.

  FIG. 6 is a diagram for explaining the details of the Z-type flow. In FIG. 6, the time interval for each of the sequences (1) to (15) is not necessarily constant.

Sequence (1)
First, the first substrate 9 (hereinafter referred to as substrate a) is loaded into the load region 21 by being passed to the load conveyor 65. The position of the load conveyor 65 at this time is typically (2, A). This is for ease of connection between the external apparatus and the component mounting apparatus 1. The unload conveyor 66 is positioned at (2, D) as shown in the sequence (15) for the same purpose. However, the position where the load conveyor 65 receives the substrate 9 from the external device and the position where the unload conveyor 66 passes the substrate 9 to the external device are other positions such as (1, A), (3, D). May be.

Sequence (2)
When the load conveyor 65 receives the substrate a, the load conveyor 65 moves to (1, A). The substrate a is transferred from the load conveyor 65 to the first conveyor 61. The distance between the load conveyor 65 and the first conveyor 61 at this time is designed to be about a gap that does not affect the transfer operation of the substrate a. The distance between the other two conveyors 60, for example, the first and second conveyors 61 and 62, is also designed with the same concept.

Sequence (3)
When the first conveyor 61 receives the substrate a, the first conveyor 61 stops its own transport operation. Thus, the range of the mounting surface of the substrate a placed on the first conveyor 61 arranged at (1, B) becomes the above-described first mounting region M1, and the electronic unit 13 is mounted by the mounting unit 70, for example. It is mounted on the substrate a. In order to indicate that the electronic component 13 is mounted, a star mark is shown in the first mounting area M1 (and the second mounting area M2).

Sequence (4) and (5)
During the mounting of the electronic component 13, the second board b is moved by the load conveyor 65 in the same manner as the board a. When the load conveyor 65 on which the substrate b is placed is positioned at (1, A), if the mounting process of the first mounting region M1 of the substrate a is in progress, the load conveyor 65 stops its own conveyance. Then, the substrate b stands by at (1, A).

Sequence (6)
When the mounting process of the first mounting region M1 of the substrate a is completed, the substrate a is transferred from the first conveyor 61 to the second conveyor 62, and the substrate b is transferred from the load conveyor 65 to the first conveyor 61. .

Sequence (7)-(9)
The mounting process on the substrate b in the first mounting area M1 is started. The second conveyor 62 on which the substrate a is placed moves to the second buffer area 33b (2, C), and the third conveyor 63 moves to the first buffer area 33a (2, B). To do. Then, the substrate a is transferred from the second conveyor 62 to the third conveyor 63, and the third conveyor 63 moves to (3, B). Further, the third substrate c is similarly loaded into the load region 21 during the mounting on the substrate b in the first mounting region M1.

Sequence (10)
The substrate a is transferred from the third conveyor 63 to the fourth conveyor 64. When the mounting process on the board b in the first mounting area M1 is completed, the boards b and c are transferred to the second conveyor 62 and the first conveyor 61, respectively.

Sequence (11)-(13)
When the fourth conveyor 64 receives the substrate a, the fourth conveyor 64 stops its own transport operation. Thus, the range of the mounting surface of the substrate a placed on the fourth conveyor 64 arranged at (3, C) becomes the above-described second mounting region M2, and the electronic component 13 is mounted by the mounting unit 80, for example. It is mounted on the substrate a. Further, the mounting process of the substrate c placed on the first conveyor 61 is started in the first mounting region M1. That is, in the sequences (11) to (13), the time zones of the mounting processes overlap in both the first and second mounting areas M1 and M2. For both of the mounting processes, the start and end timings may be set substantially the same. In the sequence (12), the fourth substrate d is loaded into the load area 21.

Sequence (14)
When the mounting process of the second mounting region M2 of the substrate a is completed, the substrate a is transferred from the fourth conveyor 64 to the unload conveyor 66, and the substrate b is transferred from the third conveyor 63 to the fourth conveyor 64. The Further, the substrate c is transferred from the first conveyor 61 to the second conveyor 62, and the substrate d is transferred from the load conveyor 65 to the first conveyor 61.

Sequence (15)
The unload conveyor 66 moves from (3, D) to (2, D), and the substrate a is unloaded to the external device. In the second mounting area M2 and the first mounting area M1, the electronic component 13 is mounted on the board b and the board d, respectively. In the sequence (15), the fifth substrate e is loaded into the load area 21.

  As described above, in the Z-type flow, the substrate 9 is transferred from the first conveyor 61 to the second conveyor 62 in the first region 31, and from the third conveyor 63 in the second region 32. The substrate 9 is conveyed to the fourth conveyor 64. For example, as shown in the sequence (13), the substrate 9 stands by in front of the mounting regions M1 and M2. That is, in the sequence (13), the load conveyor 65 is arranged on the first conveyor 61 and the third conveyor 63 is arranged on the fourth conveyor 64, so that the replacement time of the substrate 9 in each mounting region M1 and M2 is shortened. can do. That is, the component mounting apparatus 1 is different from the mechanism in which the substrate 9 between the conveyors is conveyed only in the center row as in the mounting machine of Patent Document 1, in the first and second mounting regions M1 and M2, The replacement time of the substrate 9 can be shortened.

2. Description of Parallel Type Flow FIG. 7A is a diagram showing a range of movement of each conveyor 60 in the parallel type flow, and FIG. 7B is a diagram showing a direction in which two substrates 9 flow in the parallel type flow. It is.

  7A is different from the case of the Z-type flow of FIG. 5A in that the second and third conveyors 62 and 63 convey the substrate 9 in one direction in the Y-axis direction. . As shown in FIG. 7B, in the parallel flow, one substrate 9 passes through the first region 31 and another one substrate 9 passes through the second region 32.

  FIG. 8 is a diagram for explaining the details of the parallel flow. In FIG. 8, the time interval for each of the sequences (1) to (15) is not necessarily constant.

Sequence (1)
As in the case of FIG. 6, when the load conveyor 65 receives the substrate a at (2, A), the first substrate a is loaded into the load region 21. The third conveyor 63 moves to the first buffer area 33a (2, B).

Sequence (2)
The substrate a is transferred from the load conveyor 65 to the third conveyor 63, and the load conveyor 65 receives the second substrate b, whereby the substrate b is loaded into the load region 21.

Sequence (3)
The third conveyor 63 on which the substrate a is placed moves to (3, B), and the load conveyor 65 on which the substrate b is placed moves to (1, A).

Sequence (4) and (5)
The substrate a is transferred from the third conveyor 63 to the fourth conveyor 64, and the substrate b is transferred from the load conveyor 65 to the first conveyor 61. And the range of the mounting surface of the board | substrate a mounted in the 4th conveyor 64 becomes the 2nd mounting area | region M2, and the mounting process is started by the mounting unit 80. FIG. Further, the range of the mounting surface of the substrate b placed on the first conveyor 61 becomes the first mounting area M1, and the mounting unit 70 starts the mounting process. In sequence (5), the third substrate c is loaded into the load area 21.

Sequence (6) and (7)
During the mounting process in each of the mounting regions M1 and M2, the third substrate c and the fourth substrate d are loaded and transported in the same manner as in the sequences (1) and (2). In the sequence (7), the substrate c and the substrate d stand by at (3, B) and (1, A), respectively.

Sequence (8)
When the mounting process in each of the mounting areas M1 and M2 is completed, the substrate a is transferred from the fourth conveyor 64 to the unload conveyor 66, and the substrate b is transferred from the first conveyor 61 to the second conveyor 62. Similarly to the sequences (3) and (4), the substrate c and the substrate d are transported to the fourth conveyor 64 and the first conveyor 61, respectively.

Sequence (9)
The unload conveyor 66 moves from (3, D) to (2, D), and the third conveyor 63 moves from (3, B) to (2, B). Further, the load conveyor 65 moves from (1, A) to (2, A), and the second conveyor 62 moves from (1, C) to (2, C). As a result, four conveyors are arranged in the middle row 2. In addition, the mounting of the electronic component 13 onto the board c and the board d is started in each of the mounting areas M2 and M1. A fifth substrate e is loaded into the load area 21.

Sequence (10)
During the mounting process in each of the mounting regions M1 and M2, the substrate a is unloaded to the external device, the substrate b is transferred from the second conveyor 62 to the unload conveyor 66, and the substrate e is transferred from the load conveyor 65 to the third The sixth substrate f is loaded onto the load region 21 by being conveyed to the conveyor 63.

Sequence (11)
During the mounting process in each of the mounting areas M1 and M2, the substrate b is unloaded from the unload conveyor 66 to the external device. The unload conveyor 66, the second conveyor 62, the third conveyor 63, and the load conveyor 65 move so as to retreat from the central row 2.

Sequence (12)-(15)
This is a flow similar to sequences (8) to (11).

  As described above, in the parallel type flow, as in the case of the Z type flow, as shown in the sequences (7) and (15), the substrate 9 stands by in front of the mounting regions M1 and M2, respectively. The replacement time of the substrate 9 in the mounting areas M1 and M2 can be shortened.

  In the example of FIG. 8, an example is shown in which the odd-numbered substrates 9 pass through the second region 32 and the even-numbered substrates 9 pass through the first region 31. The even-numbered substrates 9 may pass through the second region 32 through the second region 31.

3. Description of X-type Flow FIG. 9A is a diagram showing a range of movement of each conveyor 60 in the X-type flow, and FIG. 9B is a diagram showing a direction in which two substrates 9 flow in the X-type flow. It is.

  9A is different from the Z-type flow in FIG. 5A in that the load conveyor 65 and the unload conveyor 66 do not move from the positions (2, A) and (2, D), respectively. Is a point. As shown in FIG. 9B, in the X-type flow, one substrate 9 and another substrate 9 move so as to cross each other.

  FIG. 10 is a diagram for explaining the details of the X-type flow. In FIG. 10, the time interval for each of the sequences (1) to (18) is not necessarily constant.

Sequence (1) and (2)
The first substrate “a” is loaded into the load area 21, and the substrate “a” is transferred from the load conveyor 65 to the first conveyor 61 arranged at (2, B).

Sequence (3) and (4)
The first conveyor 61 on which the substrate a is placed moves to (1, B), and the electronic component 13 is mounted on the substrate a by the mounting unit 70 at (1, B). The second substrate b is loaded, and the loaded substrate b is transported to the third conveyor 63 moved to (2, B).

Sequence (5)
The mounting process on the substrate a is completed, and the first and third conveyors 61 and 63 move to (2, B) and (3, B), respectively. The electronic component 13 is mounted by the mounting unit 80 on the substrate b placed on the third conveyor 63 moved to (3, B). A third substrate c is loaded into the load area 21.

Sequence (6)
During the mounting process on the substrate b, the substrate a is transferred from the first conveyor 61 to the fourth conveyor 64 moved to (2, C), and the substrate c is transferred from the load conveyor 65 to the first conveyor 61. Is done.

Sequence (7)
The fourth conveyor 64 on which the substrate a is placed moves to (3, C), the third conveyor 63 on which the substrate b is placed moves to (2, B), and the substrate c is placed. The first conveyor 61 moves to (1, B). At (3, C), the electronic component 13 is mounted on the substrate a by the mounting unit 80, and at (1, B), the electronic component 13 is mounted on the substrate c by the mounting unit 70.

Sequence (8) and (9)
During the mounting process on the substrates a and c, the substrate b moves to (1, C), and the fourth substrate d moves to (3, B).

Sequence (10)-(12)
The mounting unit 70 that has been mounted in (1, B) so far moves to (3, B), and the mounting unit 80 that has been mounted in (3, C) moves to (1, C). And the mounting process to the board | substrate b and the board | substrate d is performed. During the mounting process on the substrate b and the substrate d, the substrate a is unloaded to the external device, and the substrate c and the fifth substrate e are conveyed to (3, C) and (1, B), respectively.

Sequence (13)-(18)
A flow similar to sequences (7) to (12) is executed.

  As described above, in the X-type flow, as in the case of the Z-type flow and the parallel-type flow, as shown in the sequences (9), (12), (15), and (18), the mounting regions M1 and M2 Each of the substrates 9 stands by in front of each other. Thereby, the replacement time of the board | substrate 9 in each mounting area | region M1 and M2 can be shortened.

  In the X-type flow, the first mounting area M1 in the first area 31 is both (1, B) and (1, C), and the second mounting area in the second area 32 M2 is both (3, B) and (3, C). Thereby, the throughput is further improved as compared with the Z-type and parallel-type flows.

  By the way, as a conventional mounting apparatus, two heads are provided, one substrate 9 is a target of mounting processing, and an electronic component is mounted on the one substrate 9. Hereinafter, the processing of this mounting apparatus is referred to as “2-head single-substrate processing”. FIG. 11 is a schematic diagram showing a mounting apparatus for the “2-head single-sheet processing”.

  The mounting apparatus 100 for “two-head one-substrate processing” includes a front head 101 that takes out electronic components from the front side (lower side in FIG. 11), a rear head 102 that takes out electronic components from the rear side, and a substrate 9 in one row. And a conveyor 105 for flowing. The conveyor 105 has two side plates 106 and 107 extending in the direction in which the substrate 9 flows, and the substrate 9 is conveyed in the two side plates 106 and 107. In FIG. 11, the substrate 9 is transferred from the right side to the left side.

  A region 110 surrounded by a broken line is a region where the front head 101 and the rear head 102 can move. The position of the front end of the movable region 110 is a front side component extraction position 111, and the position of the rear end of the movable region 110 is a rear side component extraction position 112.

  Such “2-head single-substrate processing” has the following problems.

[Problem 1]
Since the two heads 101 and 102 cannot enter the component mounting area 108 on which the single board 9 is mounted, when one head 101 or 102 is performing the mounting process, the other head 102 or 101 waits. In addition, since the time taken for one head 101 or 102 to mount an electronic component on the substrate 9 is longer than the time taken out from the component supply device 14 (see FIG. 1 and the like), a large loss occurs during this time. For example, in the case of a “1 head 1 substrate processing” mounting apparatus that includes one head and targets one substrate 9 for mounting processing, there is no loss such as “2 head 1 substrate processing”. The capacity per head increases.

[Problem 2]
For example, when the front head 101 is at the front-side component extraction position 111, the rear head 102 must be able to mount electronic components over the entire mounting surface of the substrate 9. Therefore, the front head 101 cannot be located in an area where the rear head 102 moves by mounting processing. In other words, a large distance (about 200 mm in the case of a “two-head / single-substrate processing” mounting device manufactured by Sony) is required between the front-side component take-out position 111 and the substrate 9, and the capability is reduced by this distance. To do.

[Problem 3]
The “2-head single-substrate processing” mounting apparatus that can adjust the width of the conveyor 105 in accordance with the width of the substrate 9 has the following problems. In such a mounting device, for example, the width of the conveyor 105 is adjusted by the rear side plate 107 of the conveyor 105 being separated from the fixed front side plate 106. In the case of the small substrate 9, the rear side plate 107 approaches the front side plate 106 and moves away from the rear side component extraction position 112. Accordingly, the capability of the rear head 102 is reduced. In addition, as in Problem 1, since the two heads 101 and 102 alternately enter the mounting region and mount the electronic component on the substrate 9, the front head 101 has the same capability as the rear head 102.

[Problem 4]
In the case of a mounting apparatus (not shown) for “one head and one board processing”, the replacement of the board 9 is started after the mounting of the parts on the board 9 is completed, and at the same time, one head picks up the parts. Begin. For example, when one head has 12 suction nozzles as described above, a time obtained by subtracting the time until the head picks up 12 electronic components and returns from the time required for replacing the substrate 9. Becomes the loss time due to the replacement of the substrate 9. The time required for the head to pick up 12 electronic components and return to the mounting area is about 1 second, but it may take about 2 seconds when a pattern that takes the longest component removal time is selected.

  However, in the case of the mounting apparatus 100 of “two-head / one-board processing”, one of the heads 101 or 102 has already finished taking out the components and is waiting until the mounting processing of the other head 102 or 101 is completed. Therefore, the substrate replacement time = the loss time due to the substrate replacement. In the production of a short cycle time of about 20 seconds, which is increasing recently, the difference of 2 seconds in the loss time means that the capacity is reduced by 10%.

[Problem 5]
The time for replacing the substrate 9 described in Problem 4 is the time for replacing the substrate 9 itself. As the entire time required for replacing the substrate 9, the time for measuring the position of the substrate 9 with a camera, that is, the time required to recognize the fiducial mark added to the substrate 9, is added to the replacement time. Time. The time required for recognizing the two fiducial marks is generally about 0.4 seconds, and in this case, it is not a big problem. However, with the recent increase in required mounting accuracy of electronic components, the number of fiducial marks on a single substrate 9 is increasing. This may be a multi-chip substrate that is cut into a large number of substrates later from one substrate 9 or a mark dedicated to a certain high-precision component. In this case, for example, when there are 10 pairs of fiducial marks, the recognition takes about 4 seconds, and for a short cycle time of about 20 seconds, the capacity is reduced by about 20%. .

  As a countermeasure against the five problems as described above, a system (not shown) called a dual conveyor has been proposed. In the dual conveyor, two long conveyors are arranged in parallel on the front side and the rear side. However, each of the two conveyors is provided with one receiving portion for the substrate 9 on the upstream side and one discharging portion for the substrate 9 on the downstream side. In a mounting apparatus employing such a system, it is necessary to provide two interfaces for each of the receiving unit and the discharging unit even for the external device connected to the mounting apparatus, and the versatility is poor.

  The component mounting apparatus 1 according to the above embodiment can solve the above five problems. In addition, since the load area 21 and the unload area 23 are provided with the load conveyor 65 and the unload conveyor 66 that move in the Y-axis direction, respectively, the versatility of connection with an external device can be ensured.

  Hereinafter, it will be described that each of the problems 1 to 5 is solved by the component mounting apparatus 1.

[For problem 1]
Analyzing the performance of Sony's “2-head 1-substrate processing” mounting apparatus 100, the ratio of the mounting time of the electronic component to the substrate 9 and the component removal time is 55:45. Even if one head finishes taking out the parts, the other head has not finished the mounting operation, so a waiting time is generated, and the part taking-out time of 45 is 55 including the waiting time. That is, 55 + 45 = 100 becomes 55 + 55 = 110, which is a 9% reduction in effective capacity. In the component mounting apparatus 1 according to the present embodiment, this 9% reduction in effective capacity is eliminated. Similarly, the catalog capacity is reduced by 4%.

Z-type flow: catalog capacity improved by 4% and effective capacity improved by 9% Parallel type flow: catalog capacity improved by 4% and effective capacity increased by 9% X-type flow: catalog capacity improved by 4% and effective capacity increased by 9%
[For problem 2]
In the case of the “two-head / one-board processing” mounting apparatus 100 manufactured by Sony Corporation, it is necessary to move the 200 mm head from the component mounting area 108 to the front-side component extraction position 111. In the component mounting apparatus 1 according to the present embodiment, since the movement is 100 mm, the reciprocation is shortened by 100 ms (50 ms when moving in one direction). Since twelve electronic components are processed in one round trip, the catalog tact is shortened to 100/12 = 8 ms. Since the catalog tact is 160 ms, 160 / (160−8) = 1.06, so the catalog capacity is improved by 6%.

Z-type flow: catalog capability improved by 6% Parallel type flow: catalog capability improved by 6% X-type flow: catalog capability improved by 6%
[For problem 3]
Considering the board 9 having a width of 160 mm, in the case of the “2-head single board processing” mounting apparatus 100 manufactured by Sony, a board 9 having a width of 460 mm can be handled. The distance up to 9 is 300mm farther. Since the round-trip time increase for this is 400 ms, the speed is 400/12 = 33 ms per part. Assuming that the effective tact is 230 ms, in the component mounting apparatus 1 according to the present embodiment, 230 / (230−33) = 1.17, that is, an effective capacity improvement of 17%.

Z-type flow: effective capacity 17% improvement Parallel type flow: effective capacity 17% improvement X-type flow: effective capacity 17% improvement
[For problem 4]
In the case of the Z-type flow in the component mounting apparatus 1, it is assumed that the loss of the replacement time of the board 9 is reduced from 3 seconds to 1.5 seconds. In this case, considering an average production of a 30-second cycle, (30-1.5) / (30-3) = 1.06, that is, an effective capacity improvement of 6%.

  In the case of a parallel flow, since the cycle time is doubled, (60-1.5) / ((30-3) * 2) = 1.08, that is, an effective capacity improvement of 8%. “*” Means multiplication, and so on.

  In the case of the X-type flow, since the loss of the replacement time of the substrate 9 becomes zero, (30-0) / (30-3) = 1.11, that is, an effective capacity improvement of 11%.

Z-type flow: 6% improvement in effective capacity Parallel type flow: 8% improvement in effective capacity X-type flow: 11% improvement in effective capacity
[For problem 5]
There is an effect in the parallel type flow in the component mounting apparatus 1. Usually, since the image capture time of two fiducial marks is about 0.4 seconds, (60−0.4) / ((30−0.4) * 2) = 1.01, that is, 1% effective capacity It becomes an improvement. However, in a special case with 20 fiducial marks, it takes 4 seconds, so (60-4) / ((30-4) * 2) = 1.08, which is an 8% improvement in effective capacity.

Z-type flow: 0% improvement in effective capacity Parallel type flow: 1% (~ 8%) improvement in effective capacity X-type flow: 0% improvement in effective capacity
[Total solution effect for problems 1-5]
Z-type flow: catalog capacity improved by 10% Parallel type flow: catalog capacity improved by 10% X-type flow: catalog capacity improved by 10% Z-type flow: effective capacity 35% * 1.10 (catalog capacity improvement rate) = 39% Improvement Parallel type flow: effective capacity 39% * 1.10 = 43% improvement X type flow: effective capacity 42% * 1.10 = 46% improvement Next, in the component mounting apparatus 1, the width of the conveyor 60 is adjusted. An embodiment relating to a width adjusting mechanism to be performed will be described.

  FIG. 12 is a schematic diagram showing an example thereof. For example, from the state shown in FIG. 2, the side plates 71 and 72 on the first region 31 side (see FIG. 4) and the buffer region 33 side of each conveyor 60 are arranged in the Y-axis direction according to the width of the substrate 9. Is configured to move. Of course, instead of the first conveyor 61 and the second conveyor 62, the third conveyor 63 and the fourth conveyor 64 may move.

  As a mechanism for realizing the width adjustment shown in FIG. 12, a general conveyor width adjustment mechanism may be used, but a mechanism as described below may be used.

  FIG. 13 is a schematic diagram showing a width adjusting mechanism of the conveyor device 160 according to an embodiment of the present invention.

  The conveyor device 160 connects a conveyor unit 169 that supports and transports the substrate 9, a pair of side plates 171 and 172 provided on both sides of the conveyor unit 169, and a pair of side plates 171 and 172 (side members). And a connecting rod (connecting member) 178 to be used. The pair of side plates 171 and 172 includes a first side plate 171 disposed on the front side and a second side plate 172 disposed on the rear side.

  As described above, the conveyor unit 169 may have a known configuration by driving a belt or a chain.

  In addition, the conveyor device 160 includes a first lock mechanism 156 that locks and unlocks the second side plate 172 and the connecting rod 178, a first side plate 171, and a base portion 2 (FIG. 1 to FIG. 1). 3) (or a member (not shown) fixed to the base portion 2) and a second locking mechanism 157 for locking and unlocking. The first lock mechanism 156 is attached to the second side plate 172. The second lock mechanism 157 is attached to the base portion 2 (see FIGS. 1 to 3) or a member (not shown) fixed to the base portion 2.

  One end of the connecting rod 178 on the first side plate 171 side is fixed to the first side plate 171. The other end of the connecting rod 178 is a free end with respect to the second side plate 172. When the first locking mechanism 156 is in the locked state, the connecting rod 178 and the second side plate 172 are not connected. Fixed. For example, in order to enable movement of the connecting rod 178 with respect to the second side plate 172, the second side plate 172 has a through hole for guiding the connecting rod 178, or a guide portion by another mechanism.

  Further, the conveyor device 160 includes a conveyor drive unit 145. The conveyor drive unit 145 can move the conveyor unit 169, the pair of side plates, the connecting rod 178, and the first lock mechanism 156 integrally in the Y-axis direction. Hereinafter, the conveyor unit 169, the pair of side plates, the connecting rod 178, and the first lock mechanism 156 are referred to as a “conveyor unit”. The conveyor drive unit 145 includes a rack 146 and a pinion 147, for example. A servo motor (not shown) is connected to the pinion 147. The conveyor drive unit 145 may not be the rack 146 and pinion 147, and various mechanisms described above may be used.

  The first lock mechanism 156 has a member that engages with the connection rod 178 and the second side plate 172, respectively, or a member that holds the connection rod 178 and the second side plate 172, respectively. Good. For example, the first and second lock mechanisms 156 and 157 may be of a type in which engagement is started or released by an electromagnetic action or by an operator's hand. Examples of the manual type by the operator include a ratchet type and a screw type, but other types may also be used. The second lock mechanism 157 may be of the same type as the first lock mechanism 156.

  Note that the shape of the connecting rod 178 is not limited to a rod shape. The shape of the pair of side plates 171 and 172 is not limited to a plate shape.

  The operation of the conveyor device 160 configured as described above will be described. 14 and 15 are diagrams for explaining the operation.

  As shown in FIG. 14A, the first side plate 171 and the base portion 2 are locked by the second lock mechanism 157, and the second side plate 172 and the connecting rod 178 are locked by the first lock mechanism 156. Is locked. In this state, the substrate 9 is transported in the X-axis direction.

  As shown in FIG. 14B, when the second lock mechanism 157 is unlocked and the first lock mechanism 156 is locked, the conveyor unit 145 is driven to move the conveyor unit in the Y-axis direction. Moving.

  As shown in FIG. 15A, when the second lock mechanism 157 is in the locked state and the first lock mechanism 156 is in the unlocked state, the second side plate 172 is moved by the drive of the conveyor drive unit 145. 1 side plate 171 approaches or moves away. As a result, the width, which is the distance between the pair of side plates, can be adjusted. Further, as shown in FIG. 15B, after the width adjustment, when the first lock mechanism 156 is in the locked state and the second lock mechanism 157 is in the unlocked state, the conveyor drive unit 145 drives, The conveyor unit after the width adjustment moves in the Y-axis direction.

  According to such a conveyor device 160, the width can be easily adjusted according to the width of the substrate 9 without requiring a complicated mechanism.

  Further, the conveyor drive unit 145 can generate not only power for moving the conveyor unit but also power for adjusting the width of the pair of side plates 171 and 172. Therefore, a separate driving mechanism for adjusting the width is not required, and the conveyor device 160 can be reduced in size and simplified.

  Embodiments according to the present invention are not limited to the embodiments described above, and other various embodiments are conceivable.

  In the component mounting apparatus 1 according to the above embodiment, the load area 21, the main area 22, and the unload area 23 are arranged in the X-axis direction from the load area 21 to the unload area 23, and are orthogonal to the X-axis direction. An example in which the first region 31, the buffer region 33, and the second region 32 are arranged in the Y-axis direction is given as an example. However, the direction in which the load area 21, the main area 22, and the unload area 23 are arranged and the first, buffer, and second areas 32 may not be orthogonal to each other, and may be oblique.

  In the Z flow and the parallel flow, the load conveyor 65 moves between (2, A) and (1, A), and the unload conveyor 66 moves between (3, D) and (2, D). Moving. In the X-type flow, the load conveyor 65 and the unload conveyor 66 are maintained at the positions (2, A) and (2, D), respectively. Therefore, in the conveyor drive unit that drives the load conveyor 65 and the unload conveyor 66, for example, the linear guide rails 29 may not be provided in all of the load region 21 and the unload region 23 in the Y-axis direction.

  In the above embodiment, three types of flows have been described: a Z-type flow, a parallel type flow, and an X-type flow. However, the present invention is not limited to these flows, and various flows can be applied to the component mounting apparatus 1.

  In the above embodiment, for example, as shown in FIGS. 2 and 4, the Y-axis direction is between the beam 5 on the first region 31 side (front side) and the beam 5 on the second region 32 side (rear side). Both heads 35 are movable in the Y-axis direction along the moving member 6 spanned between the two. That is, the configuration in which both heads 35 can move to the front side and also to the rear side is shown. However, the present invention is not limited to this configuration, and one head 35 may move in the XY axis direction only on the front side, and the other head 35 may move in the XY axis direction only on the rear side. Good.

M1 ... 1st mounting area M2 ... 2nd mounting area 1 ... Component mounting apparatus 2 ... Base part 13 ... Electronic component 21 ... Load area 22 ... Main area 23 ... Unload area 31 ... 1st area 32 ... 2nd Area 33 ... buffer area 33a ... first buffer area 33b ... second buffer area 45, 145 ... conveyor drive unit 60 ... conveyor 61-64 ... first to fourth conveyor 65 ... load conveyor 66 ... unload conveyor 70, 80: Mounting unit 71, 72: Side plate 147: And pinion 156: First locking mechanism 157: Second locking mechanism 160 ... Conveyor device 169 ... Conveyor unit 171 ... First side plate 172 ... Second Side plate 178 ... Connecting rod

Claims (2)

A load area for loading the substrate, and
An unload area to unload the board;
A first mounting area including a first conveyor and a second conveyor that can be arranged along a first direction, wherein the first component is an area where the first component is mounted on the substrate;
Including a third conveyor and a fourth conveyor that can be arranged along the first direction, and provided apart from the first mounting area in a second direction orthogonal to the first direction; A second mounting area in which the second component is mounted on the substrate;
A buffer area provided between the first mounting area and the second mounting area;
A load conveyor disposed in the load area;
A mounting board manufacturing method by a component mounting apparatus comprising an unloading conveyor disposed in the unloading area,
Arranging the load conveyor, the first conveyor and the second conveyor in this order along the first direction;
Mounting the first component on a substrate on the first conveyor;
Causing the load conveyor to wait for the substrate,
Moving the board on which the first component is mounted to the second conveyor, and moving the board waiting on the load conveyor to the first conveyor;
Arranging the third conveyor, the fourth conveyor and the unload conveyor in this order along the first direction;
While the first component is mounted on the substrate on the first conveyor, the substrate moved to the second conveyor is moved to the third conveyor via the buffer area and is put on standby. ,
Mounting the second component on the fourth conveyor on the substrate on which the first component is mounted;
The substrate on which the second component is mounted is moved to the unload conveyor, and the substrate on which the first component that has been waiting on the third conveyor is moved to the fourth conveyor. A method for manufacturing a substrate. A load area for loading the substrate, and
An unload area to unload the board;
A first mounting area including a first conveyor and a second conveyor that can be arranged along a first direction, wherein the first component is an area where the first component is mounted on the substrate;
Including a third conveyor and a fourth conveyor that can be arranged along the first direction, and provided apart from the first mounting area in a second direction orthogonal to the first direction; A second mounting area in which the second component is mounted on the substrate;
A buffer area provided between the first mounting area and the second mounting area;
A load conveyor disposed in the load area;
A mounting board manufacturing method by a component mounting apparatus comprising an unloading conveyor disposed in the unloading area,
(A) The load conveyor and the first conveyor are continuously arranged along the first direction so that the first conveyor is arranged in the buffer area ,
(B) moving the substrate placed on the load conveyor to the first conveyor and loading the substrate onto the load conveyor;
(C) The first conveyor is moved so as to be continuous with the second conveyor arranged in the first mounting area, and is continuous with the third conveyor arranged in the second mounting area. Move the load conveyor so that
(D) moving the substrate disposed on the first conveyor to the second conveyor and moving the substrate disposed on the load conveyor to the third conveyor;
(E) the said first component mounted on the substrate in the second conveyor, and mounting the second component on the substrate at the third conveyor,
(F) performing the steps (a) and (b) in this order during the step (e);
(G) During the step (e),
The load conveyor in which the first conveyor, the second conveyor, and the unload conveyor are arranged in this order along the first direction, and the substrate loaded in the step (f) is arranged, Arranging the third conveyor and the fourth conveyor in this order along the first direction;
(H) After the steps (e) and (g) are completed,
The substrates disposed on the second conveyor and the first conveyor are moved to the unload conveyor and the second conveyor, respectively, and the substrates disposed on the third conveyor and the load conveyor are moved to the first conveyor. 4 and a method of manufacturing a mounting board to be moved to the third conveyor, respectively .

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