JP2005123655A - Electronic part mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part mounting method for mounting an electronic part in accordance with a size of a substrate with an excellent preparatory plan. <P>SOLUTION: An upstream side first conveyor 5 and a downstream side second conveyor 6 are provided on a mounting area A on which an electric part P is mounted by use of a transfer head 23. When the electric part P is mounted on a large substrate 30A, positioning of the large substrate 30A is carried out using the top of the first conveyor 5 and the top of the second conveyer 6 as a mounting stage, and then the electronic part P is mounted by use of the transfer head 23. When the electric part is mounted on a small substrate, positioning of the small substrate is carried out using the top of the second conveyer 6 as a mounting stage, and then the electronic part P is mounted by use of the transfer head 23. Here, the top of the first conveyor 5 is used as a waiting stage on which a next small substrate is kept waiting. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component on a large substrate or a small substrate.

  In the electronic component mounting apparatus, an electronic component is mounted at a predetermined coordinate position on the substrate while positioning the substrate on the conveyor of the positioning unit and moving the transfer head horizontally by a moving table. There are various sizes of the substrate, and the length of one side is from several cm or less to ten or more cm or more. Therefore, conventionally, the conveyor of the positioning portion has been assembled to be long so that it can accommodate a large substrate.

  In general, when an electronic component is mounted on a substrate positioned on the conveyor of the positioning unit by a transfer head, the next substrate on which the electronic component is mounted next is on a carry-in conveyor provided upstream of the conveyor. Waiting on the standby stage. After the mounting of the electronic components on the substrate on the positioning unit conveyor is completed and this mounted substrate is sent out to the carry-out conveyor, the next board is sent from the carry-in conveyor onto the positioning unit conveyor, where the board is transferred. Positioning and mounting of electronic components by the transfer head was started.

  Therefore, as described above, the positioning unit conveyor is conventionally assembled to be long enough to handle a large substrate, so in the case of a small substrate, a long feed stroke is required for feeding from the standby stage onto the positioning unit conveyor. Therefore, it takes a long time to feed the small substrate onto the conveyor of the positioning part, and there is a problem that the work efficiency is not improved.

  Therefore, an object of the present invention is to provide an electronic component mounting method capable of mounting an electronic component by sending it to a positioning portion with good arrangement according to the size of the substrate.

  The present invention is an electronic component mounting method in which an electronic component is mounted on a substrate by a transfer head that is driven by a moving table and moves horizontally, and a plurality of conveyors are mounted in an electronic component mounting area in which the transfer head can move horizontally. Are arranged independently of each other, the substrate is positioned on the downstream single conveyor as the mounting stage, the electronic parts are mounted by the front and rear transfer head, and the other upstream single upstream conveyor is on standby The next board is kept waiting as a stage, and if any electronic component is out of stock while mounting the electronic component on the board on the mounting stage, the mounting of the electronic component on the board on the mounting stage is interrupted, The mounting of electronic components on the board on the standby stage was started.

  According to the present invention, it is possible to mount an electronic component by positioning the substrate with good arrangement according to the size of the substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 2 to 19 are side views of the electronic component mounting apparatus according to an embodiment of the present invention.

  First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. Reference numerals 1, 2, and 3 denote a pair of left and right frames that are arranged in a straight line in the X direction, and conveyors 4, 5, 6, and 7 are provided inside thereof. The conveyors 4 to 7 are belt conveyors, which are each driven by a motor M to rotate along the small pulley 8 and the large pulley 9 to convey the substrate in the X direction. In the present invention, the substrate transport direction is defined as the X direction, and the direction orthogonal thereto is defined as the Y direction.

  The conveyor 4 attached to the upstream frame 1 is a carry-in conveyor, and the conveyor 7 attached to the downstream frame 3 is a carry-out conveyor. A plurality (two in this embodiment) of conveyors 5 and 6 are disposed on the central frame 2 independently of each other. Hereinafter, the upstream conveyor 5 is referred to as a first conveyor, and the downstream conveyor 6 is referred to as a second conveyor. The central frame 2 and the first conveyor 5 and the second conveyor 6 mounted on the central frame 2 serve as positioning portions for positioning the board in the mounting area of the electronic component.

  1 and 2, a first substrate stopper 11 is provided between the first conveyor 5 and the second conveyor 6, and a second substrate stopper 12 is provided at the center of the second conveyor 6. Is provided. The first substrate stopper 11 and the second substrate stopper 12 are cylinders, and the rods 11a and 12a project from the lower side to the conveyance surface of the substrate conveyed to the first conveyor 5 or the second conveyor 6. Thus, the substrate is stopped at a predetermined position.

  A first sensor S <b> 1 is provided at the downstream end of the carry-in conveyor 4. A second sensor S <b> 2 is provided at the downstream end of the first conveyor 5. A third sensor S3 and a fourth sensor S4 are provided before and after the second stopper 12. A fifth sensor S5 is provided at the downstream end of the second conveyor 6. These sensors S1 to S5 detect the substrate.

  A first substrate receiving means 15 </ b> A is disposed below the downstream side of the first conveyor 5. A second substrate receiving means 15B is disposed below the second conveyor 6 on the upstream side. The first substrate receiving means 15A and the second substrate receiving means 15B have the same structure and are provided independently of each other. The structure will be described below.

  In FIG. 1 and FIG. 2, a substrate receiving pin 17 is erected on a support plate 16. Reference numeral 18 denotes a fall prevention plate for the pin 17 provided on the support plate 16 and into which the pin 17 is inserted. Reference numeral 19 denotes a cylinder as a vertical movement means for supporting the support plate 16 from below and moving the support plate 16 and the pin 17 up and down. is there. When the electronic component is mounted on the board, the pins 17 rise to support the board from below. Further, when the substrate is transported by the first conveyor 5 or the second conveyor 6, it is moved downward so as not to obstruct the transport.

  In FIG. 1, reference numeral 20 denotes a moving table, which consists of an X table 21 and a Y table 22 that are orthogonal to each other. A transfer head 23 is mounted on the Y table 22. The transfer head 23 is driven by the moving table 20 to move horizontally in the X direction and the Y direction, and the electronic component P provided in the parts feeder 25 is picked up by vacuum suction to the lower end portion of the nozzle 24 and positioned in the positioning portion. It is mounted at a predetermined coordinate position on the printed board. In FIG. 2, A is a mounting area in which the transfer head 23 can move in the X direction to mount electronic components. The mounting area A extends over the first conveyor 5 and the second conveyor 6. In this embodiment, two independent conveyors 5 and 6 are disposed in the mounting area A, but three or more conveyors may be disposed. However, since operation control becomes troublesome when three or more are arranged, it is desirable to arrange two as in this embodiment.

This electronic component mounting apparatus has the above-described configuration. Next, the operation method will be described. First, an operation method when the substrate is a large substrate will be described with reference to FIGS. 2 to 7 show the order of operation. Large boards are labeled with reference numerals 30A, 30B, and 30C in the order of mounting.

  FIG. 2 shows a state where electronic components are mounted on the first large substrate 30A. The mounting area A is set across the first conveyor 5 and the second conveyor 6. Further, the rod 11a of the first substrate stopper 11 and the rod 12a of the second substrate stopper 12 are retracted downward. The large substrate 30 </ b> A is positioned across the first conveyor 5 and the second conveyor 6. In this state, the transfer head 23 sequentially mounts the electronic components P of the parts feeder 25 at predetermined coordinate positions on the large substrate 30A while moving horizontally in the X direction and the Y direction. During mounting, the first substrate receiving means 15A and the second substrate receiving means 15B are both raised, and the pins 17 support the large substrate 30A from below. FIG. 3 shows a state in which the mounting of the electronic component P on the first large board 30A is completed.

  When the mounting of the electronic component P on the large board 30A is completed, the cylinders 19 of the first board receiving means 15A and the second board receiving means 15B are driven to lower the pins 17 as shown in FIG. Then, the supporting state of the large substrate 30A is released. Next, as shown in FIG. 5, the large board 30 </ b> A is carried out to the carry-out conveyor 7, and the second large board 30 </ b> B is carried from the carry-in conveyor 4.

  Here, in the state of FIG. 5, carrying out of the first large substrate 30A from the second conveyor 6 is not yet completed. Therefore, in this state, the rod 11a of the first substrate stopper 11 is protruded to the substrate transfer surface to prevent the second large substrate 30B from being carried onto the second conveyor 6. Then, as shown in FIG. 6, when the large board 30A is carried out from the second conveyor 6 to the carry-out conveyor 7, the rod 11a of the first board stopper 11 is pulled in and the second large board 30B is mounted. Carry into area A. At this time, the rod 12A of the second cylinder 12 is projected to stop the large substrate 30B. Therefore, the pins 17 of the first board receiving means 15A and the second board receiving means 15B are raised to support the second large board 30B from below, and mounting of the electronic component P on this is started (see FIG. 7). Thereafter, the same operation as in FIG. In addition, control by control parts (not shown), such as each conveyor 4-7 and the board | substrate stoppers 11 and 12, is performed by the board | substrate detection signal of each sensor S1-S4.

  Next, the mounting of electronic components on a small board will be described with reference to FIGS. The small boards are denoted by reference numerals 31A, 31B, and 31C in the order of mounting. In FIG. 8, the first small substrate 31 </ b> A is on the upstream portion of the second conveyor 6, and the second small substrate 31 </ b> B is on the downstream portion of the first conveyor 5. The two small boards 31A and 31B are both located in the mounting area A. In this state, the transfer head 23 mounts the electronic component P on the first small board 31A, and the second one. The small board 31B is waiting for the mounting of the electronic component P on the first small board 31A to be completed. That is, in the state of FIG. 8, the first conveyor 5 is a standby stage, and the second conveyor 6 is a mounting stage. The third small substrate 31 </ b> C stands by on the carry-in conveyor 4.

  What is important in FIG. 8 is that the pins 17 of the first substrate receiving means 15A and the second substrate receiving means 15B rise together to support the substrates 31A and 31B from below. That is, not only the first small substrate 31A on the mounting stage (single second conveyor 6) but also the second small substrate 31B on the standby stage (single first conveyor 5) is supported by the pins 17. Thus, when the mounting of the electronic component P on the first small board 31A is interrupted for some reason such as out of stock of the electronic component P, the standby stage (the standby stage is also in the mounting area A) immediately. That is, the mounting of the electronic component P on the small board 31B can be started.

FIG. 9 shows a state in which the mounting of the electronic component P on the first small substrate 31A has been completed. Therefore, as shown in FIG. 10, the pins 17 of the substrate receiving means 15A and 15B are lowered to carry out the first small board 31A toward the carry-out conveyor 7, and the second small board 31B is moved to the first. From the conveyor 5 to the second conveyor 6. FIG. 11 shows a state where the carry-out and carry-in have been completed. In this case, the second small substrate 31B hits the rod 12a of the second substrate stopper 12 and stops. Around this time, the loading of the third small substrate 31C is started.

  Next, as shown in FIG. 12, the pins 17 of the second board receiving means 15B are raised to start mounting the electronic component P on the second small board 31B, and the third small board 31C is mounted. It is carried onto the first conveyor 5 which is a standby stage and is stopped by the first substrate stopper 11. Next, as shown in FIG. 13, the mounting of the electronic component P on the second small substrate 31B is completed. Therefore, the pin 17 is lowered to carry out the small substrate 31B to the carry-out conveyor 7, the rod 11a of the first substrate stopper 11 is lowered, and the pin 17 is also lowered to move the third small substrate 31C to the second. The electronic component P is mounted on the third small board 31C.

  Next, with reference to FIGS. 14 to 19, another mounting form of the small board will be described. 14 to 19 show the case where the electronic component P of any of the parts feeders 25 is out of stock while the electronic component P of the parts feeder 25 is picked up by the transfer head 23 and mounted on the small substrate. This is the driving method.

  FIG. 14 shows a state in which the electronic component P is out of stock while the electronic component P is being mounted on the first small substrate 31A on the single second conveyor 6. At this time, the second small substrate 31B stands by on the single first conveyor 5 (standby stage). In this case, the transfer head 23 stops mounting the electronic component P on the first small substrate 31A, and starts mounting the electronic component P on the second small substrate 31B as shown in FIG. Since this standby stage (on the first conveyor 5) is also in the mounting area A, such a change during the mounting operation is possible. During the mounting of the electronic component P on the second small substrate 31B, maintenance such as replacement of the part feeder 25 in which the electronic component P is out of stock or replenishment of the electronic component P to the part feeder 25 is performed.

  FIG. 16 shows a state in which the replacement of the parts feeder 25 or the replenishment of the electronic component P is completed and the mounting of the electronic component P on the first small board 31A is resumed. In this embodiment, as soon as the replacement of the parts feeder 25 and the replenishment of the electronic component P are completed, the transfer head 23 interrupts the mounting of the electronic component P on the second small substrate 31B, and the first small substrate 31A. Although the mounting of the electronic component P is resumed, the mounting of the electronic component P on the first small board 31A may be resumed after all the mounting of the electronic parts on the second small board 31B is completed. .

  FIG. 17 shows a state in which the mounting of the electronic component P on the first small substrate 31A is completed. Therefore, as shown in FIG. 18, the mounting of the electronic component P on the second small board 31B on the standby stage is resumed, and the pins 17 of the second board receiving means 15B are lowered, as shown in FIG. The first small substrate 31A is carried out to the carry-out conveyor 7. At the same time, the mounting of the electronic component P on the second small board 31B is completed, and the second small board 31B is also carried out to the carry-out conveyor 7. Subsequently, the third small substrate 31C and the fourth small substrate (not shown) are carried onto the second conveyor 6 and the first conveyor 5, and the state returns to the state shown in FIG.

  As described above, according to the present invention, an electronic component can be mounted by positioning the substrate with good arrangement according to the size of the substrate and mounting the electronic component on a large substrate or a small substrate. Useful.

The perspective view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention

Explanation of symbols

4 carry-in conveyor 5 first conveyor 6 second conveyor 7 carry-out conveyor 11 first substrate stopper 12 second substrate stopper 15A first substrate receiving means 15B second substrate receiving means 17 pin 19 cylinder 20 movement Table 23 Transfer head 30A, 30B Large substrate 31A-31C Small substrate

Claims (1)

An electronic component mounting method in which an electronic component is mounted on a substrate by a transfer head that is driven by a moving table and moves horizontally, and a plurality of conveyors are independent of each other in an electronic component mounting area in which the transfer head can move horizontally. The board is positioned using a single conveyor on the downstream side as the mounting stage, and the electronic components are mounted by the front and rear transfer heads. The next single conveyor on the upstream side is used as the standby stage for the next time. The board is kept waiting, and if any of the electronic components are out of stock while the electronic parts are mounted on the board on the mounting stage, the mounting of the electronic parts on the board on the mounting stage is interrupted and An electronic component mounting method comprising starting mounting an electronic component on a substrate.

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