JP5234013B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component on a substrate.

  A component mounting apparatus that manufactures a mounting board by mounting components on a board is provided with a board transfer mechanism for transferring the board from the upstream side to the downstream side, and is transferred to the board holding unit by the board transfer mechanism. A component mounting operation for transferring and mounting a component taken out from the component supply unit is executed on the held substrate. For the purpose of improving the efficiency of this component mounting work, component mounting with two independent substrate transfer lanes in the substrate transfer mechanism and a component supply unit and mounting head corresponding to each substrate transfer lane An apparatus is known (see, for example, Patent Document 1).

  In this patent document example, an example is shown in which mounting heads and component supply units that can be individually operated are arranged on both sides of two substrate transfer devices (substrate transfer lanes) that transfer substrates in parallel. . According to this configuration, even when an outage of the device occurs, such as when a component outage occurs in any of the component supply units, the work operation on the component supply unit side where the component outage occurs is only stopped. It is not necessary to stop the operation of the entire apparatus. Therefore, even if the apparatus stops on one side, there is an advantage that a decrease in the apparatus operating rate can be suppressed as much as possible by continuing the work operation on the other side.

JP 2008-186992 A

  However, the above-described prior art does not take into account the time loss that inevitably occurs due to various factors in the process of board transfer operation and component mounting operation, and cannot sufficiently meet the demand for further productivity improvement. For this reason, in order to reduce such time loss as much as possible, a configuration in which four rows of substrate transfer lanes and two mounting heads are provided, and one mounting head performs a component mounting operation for two substrate transfer lanes. A component mounting apparatus has been proposed. Thereby, when each mounting head is performing a component mounting operation for one board transport lane, a new board can be carried in another board transport lane, and the transport standby time can be reduced.

  However, in the configuration including the four rows of board transfer lanes and the two mounting heads as described above, when two types of boards having different component mounting work amounts are to be mounted simultaneously in parallel, the operation of the mounting head The problem arises that overall production efficiency is reduced due to load imbalance. For example, if the same device is to be mounted on the front and back surfaces of the same board with different mounting points on the front and back sides, the board is carried into a pair of board conveyors with the different mounting surfaces facing upward, The mounting operation is alternately performed on the two mounting surfaces by one mounting head.

  At this time, since the board | substrate of a different component mounting work amount is carried in to each board | substrate conveyance conveyor, the work load by a mounting head differs for every board | substrate conveyance conveyor. For this reason, the production tact of the whole apparatus is rate-limited by the tact time in the board | substrate conveyance conveyor which targets the mounting surface with a larger work load. That is, when considering the production efficiency of the entire mounting work per sheet including the mounting work on both the front and back surfaces, it cannot be said that the loss time is reduced and a sufficient productivity improvement effect is not necessarily obtained. As described above, in the component mounting apparatus having the configuration including the conventional four substrate transfer conveyors and the two mounting heads, when two types of substrates having different component mounting work amounts are to be mounted simultaneously in parallel. There was a problem that productivity improvement was difficult and loss time occurred.

  Therefore, the present invention provides productivity in the case where two types of substrates having different component mounting work amounts are simultaneously mounted in a component mounting apparatus having a configuration including four substrate transfer conveyors and two mounting heads. An object is to provide a component mounting apparatus and a component mounting method that can be improved.

The component mounting apparatus according to claim 1 is a component mounting apparatus that mounts components on a first substrate and a second substrate having different component mounting work amounts simultaneously, wherein the first substrate and the second substrate are mounted. Substrate transport constructed by arranging two conveyor rows, each of which is arranged in parallel with two substrate transport conveyors each provided with a substrate holding portion for positioning and holding the substrate A mechanism for detecting the presence or absence of the first substrate and the second substrate in the substrate holding section of the substrate transport conveyor, and each side of the two conveyor rows. Two component supply units for supplying components mounted on the first substrate and the second substrate, and components corresponding to each of the two component supply units. Two mounting heads to be taken out, a head moving mechanism for individually moving the two mounting heads between the corresponding component supply unit and the substrate holding unit of the corresponding conveyor row, and the component mounting work amount are small A storage unit for storing single component mounting information created by combining the first component mounting information and the second component mounting information for each of the first substrate and the second substrate having a large component mounting work amount; A control processing unit that controls a mounting head and a head moving mechanism based on single component mounting information, and executes a component mounting operation for transferring and mounting components to the first substrate and the second substrate held by the substrate holding unit. with the door, the control processing unit includes a first loading step of loading the first substrate on the inner side of the substrate conveyor close to the device center line, is carried by the first loading step A first mounting step of executing the component mounting operation only the first substrate held by the substrate holding portion of the serial inner substrate conveyor as the object, between the first mounting step, an outer away from the device center line A second carrying-in step of carrying the second substrate into the substrate carrying conveyor; and the substrate detection that the second substrate is carried in the second carrying-in step and held by the substrate holding portion of the outer substrate carrying conveyor. If detected by the means, the mounting of the component on the first substrate held by the substrate holding unit of the inner substrate transfer conveyor is completed and the mounting head moves to the component supply unit. a second mounting step of executing the component mounting operation in the second substrate held by the substrate holding portion of the outside of the substrate conveyor, after the component mounting operation intended for the first substrate is completed, the outer Board A third implementation performing a component mounting operation only the second substrate held by the substrate holding portion of the conveyor as the object, between the third mounting step, the first substrate to the inside of the substrate conveyor And a third carrying-in process for carrying in.

The component mounting method according to claim 2 is a component mounting method in which components are mounted on a first substrate and a second substrate having different component mounting work amounts in parallel by a component mounting apparatus. The mounting apparatus has two conveyor rows each including two substrate transfer conveyors each provided with a substrate holding portion that conveys the first substrate and the second substrate and positions and holds the substrates. A substrate transport mechanism configured to be arranged with a wire in between, and a substrate detection means provided on each of the substrate transport conveyors for detecting the presence or absence of the first substrate and the second substrate in the substrate holding portion of the substrate transport conveyor; Corresponding to each of the two component supply units, two component supply units that are arranged on the respective sides of the two conveyor rows and supply components mounted on the first substrate and the second substrate. Two mounting heads that are provided and take out components from the corresponding component supply units, and the two mounting heads are individually moved between the corresponding component supply units and the substrate holding units of the corresponding conveyor rows. A single component created by combining the first component mounting information and the second component mounting information for each of the head moving mechanism and the first substrate having a small component mounting work amount and the second substrate having a large component mounting work amount. A storage unit that stores single component mounting information, and a component is transferred to the first substrate and the second substrate held by the substrate holding unit by controlling a mounting head and a head moving mechanism based on the single component mounting information. and a control processing unit for executing the component mounting operation for transferring and mounting a first loading step of loading the first substrate on the inner side of the substrate conveyor close to the device center line A first mounting step of executing the component mounting operation only the first substrate held by the substrate holding portion of the first inner substrate conveyor is carried by loading step as the target, between the first mounting step A second carry-in step of carrying the second substrate into an outer substrate transfer conveyer away from the center line of the apparatus, and the second substrate carried into the substrate holding portion of the outer substrate transfer conveyer carried in the second carry-in step. When the holding is detected by the board detection means, the mounting of the component on the first board held by the board holding part of the inner board transfer conveyor is completed, and the mounting head supplies the part a second mounting step of executing a part article mounting operation on the second substrate held by the substrate holding portion of said outer board conveyor until moving to parts directed to the first substrate Component mounting operation After completion, a third component mounting process for executing the component mounting operation only the second substrate held by the substrate holding portion of the outside of the substrate conveyor as the object, between the third mounting step, said inner And a third carry-in step of carrying the first substrate into the substrate carrying conveyor .

  According to the present invention, in a component mounting apparatus having a configuration including four substrate transfer conveyors and two mounting heads, a first substrate and a second substrate having different component mounting work amounts are simultaneously mounted in parallel. The component mounting process for the first board and the second board as a pair is performed by performing a component mounting operation only on the first board having a small component mounting work amount carried into the inner board transfer conveyor. 2nd mounting which performs component mounting operation for both the 1st mounting process and the 2nd board with the large amount of component mounting work carried in to the outside board conveyance conveyor, and the 1st board carried into the inside board conveyance conveyor The component mounting work efficiency can be further improved by configuring the process and the third component mounting step of performing the component mounting operation only on the second substrate after the component mounting operation on the first substrate is completed. Two types of boards with different component mounting work amounts can be mounted on a second substrate carrying conveyor with a large component mounting work amount on the outer substrate transfer conveyor, and the waiting time of the mounting head accompanying the board transfer operation can be reduced. Can be improved in the case where the target is mounted in parallel.

The top view of the component mounting apparatus of one embodiment of this invention The top view which shows the structure of the board | substrate conveyance mechanism of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the structure and function of the mounting head in the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Configuration explanatory diagram of component mounting information in the component mounting method of one embodiment of the present invention Operation explanatory diagram of component mounting operation in component mounting method of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration and function of the component mounting apparatus 1 will be described with reference to FIGS. 1, 2, and 3. The component mounting apparatus 1 is used in a component mounting line for manufacturing a mounting substrate by mounting electronic components on a substrate, and has a function of mounting components on a substrate supplied with solder by screen printing on the upstream side. Have.

  In FIG. 1, a component mounting apparatus 1 is configured by combining a board distribution unit 3 having a function of distributing boards on the upstream side of a component mounting mechanism unit 2 as a main body unit. On the base 3a of the substrate distribution unit 3, a first substrate distribution conveyor 4A and a second substrate distribution conveyor 4B made of a pair of transfer rails are arranged side by side with the transfer direction as the X direction. A printed board is carried into the board distribution unit 3 from the upstream device (arrow a), and is transferred to the component mounting mechanism unit 2 by the first board distribution conveyor 4A and the second board distribution conveyor 4B.

  The configuration of the component mounting mechanism unit 2 will be described. On the upper surface of the base 2a, a first conveyor row 6A composed of a first substrate transfer conveyor 5A and a second substrate transfer conveyor 5B (hereinafter abbreviated as “first conveyor 5A” and “second conveyor 5B”), And a second conveyor row 6B comprising a third substrate transfer conveyor 5C and a fourth substrate transfer conveyor 5D (hereinafter abbreviated as “third conveyor 5C” and “fourth conveyor 5D”) sandwich the apparatus center line CL. In the X direction. That is, the component mounting apparatus 1 includes a first conveyor row 6A and a second conveyor row 6B that are formed by arranging a plurality of substrate carrying conveyors that carry the substrate 7 in parallel, and two rows arranged with the device center line CL interposed therebetween. The first conveyor row 6A and the second conveyor row 6B constitute a substrate transport mechanism 8.

  Each of the first conveyor 5A, the second conveyor 5B, the third conveyor 5C, and the fourth conveyor 5D is configured by combining a pair of conveyance rails, and the substrate is distributed by a conveyor belt provided on each conveyance rail. The substrate 7 supplied from the unit 3 is transported in the X direction. Recognition marks 7 a and 7 b for position recognition are formed on the substrate 7. As will be described later, the recognition marks 7 a and 7 b are imaged by a substrate recognition camera 18 for position detection of the substrate 7.

  In this embodiment, as the substrate 7, two types of substrates (first substrate 7A, second substrate 7B (FIG. 5, FIG. 5) that are always combined in pairs, such as two mounting surfaces of a double-sided mounting substrate. 6))). Here, the smaller component mounting work amount defined by the number of components mounted on the board is defined as the first substrate 7A, and the larger component mounting work amount is defined as the second substrate 7B. In the following description, when these two types of substrates need to be distinguished from each other, they are referred to as a first substrate 7A and a second substrate 7B, and when they need not be distinguished from each other, they are simply referred to as a substrate 7 collectively.

  The first conveyer 5A, the second conveyer 5B, the third conveyer 5C, and the fourth conveyer 5D respectively include a first convey lane L1, a second convey lane L2, and a second convey lane L2 that convey the substrate 7 to be mounted in the component mounting mechanism unit 2. 3 conveyance lane L3 and 4th conveyance lane L4 are comprised, and these conveyance lanes are board | substrates from the 1st board | substrate distribution conveyor 4A arrange | positioned on the base 3a of the board | substrate distribution part 3 and the 2nd board | substrate distribution conveyor 4B. 7 is carried in.

  That is, as shown in FIG. 2, the first substrate distribution conveyor 4A and the second substrate distribution conveyor 4B can be integrally moved in the Y direction (arrow b) by a drive mechanism (not shown) on the base 3a. Thus, the first substrate distribution conveyor 4A and the second substrate distribution conveyor 4B can be connected to one of the two conveyor rows 6A and 6B provided in the component mounting mechanism section 2. That is, the substrate distribution unit 3 combines the movement of the first substrate distribution conveyor 4A and the second substrate distribution conveyor 4B in the Y direction with the substrate transfer operation by the first substrate distribution conveyor 4A and the second substrate distribution conveyor 4B. The board 7 delivered from the upstream device is distributed to a plurality of transport lanes of the component mounting mechanism unit 2.

  In FIG. 2, a substrate holder 9 is provided at a substantially intermediate position in the X direction of the first transfer lane L1, the second transfer lane L2, the third transfer lane L3, and the fourth transfer lane L4. 9 positions and holds the board | substrate 7 conveyed by each board | substrate conveyance conveyor. Each substrate holding part 9 is provided with a first detection sensor S1, a second detection sensor S2, a third detection sensor S3, and a fourth detection sensor S4 for detecting the substrate, and these detection sensors are the first conveyor. The presence or absence of the substrate 7 in each substrate holding part 9 of 5A to 4th conveyor 5D is detected.

  On each side of the first conveyor row 6A and the second conveyor row 6B, a first component supply unit 10A and a second component supply unit 10B are arranged for each conveyor row, and the first component supply unit 10A, In the two-component supply unit 10B, a plurality of parts feeders 11 storing components to be mounted on the substrate 7 are arranged in parallel. The parts feeder 11 supplies a component P (see FIG. 3) to be mounted on the substrate 7 to a component take-out position by a mounting head described below.

  A Y-axis table mechanism 12 is disposed in the Y direction at the downstream end of the base 2a in the X direction. A first X-axis table mechanism 13A and a second X-axis table mechanism 13B are provided to extend in the X direction from the Y-axis table mechanism 12, and the first X-axis table mechanism 13A and the second X-axis table mechanism 13B are provided as the Y-axis table mechanism. 12 are individually moved horizontally in the Y direction by a linear motor drive mechanism built in the motor 12. A first mounting head 15A and a second mounting head 15B each including a plurality of unit mounting heads 16 are mounted on the first X-axis table mechanism 13A and the second X-axis table mechanism 13B.

  As shown in FIG. 3A, the unit mounting head 16 is provided with a suction nozzle 16a that sucks and holds the component P at the lower end, and the plurality of unit mounting heads 16 are connected to the first X-axis table mechanism via the moving plate 15a. It is attached to 13A. The moving plate 15a is movable in the X direction with respect to the X-axis table mechanism 13A by a slide mechanism including a guide rail 13a and a slider 13b, and the mover 13d fixed to the moving plate 15a is moved with respect to the stator 13c. By the relative movement, the first mounting head 15A moves horizontally in the X direction. A substrate recognition camera 18 is mounted on the lower end of the moving plate 15a with the imaging surface facing downward, located on the lower surface side of the first X-axis table mechanism 13A. In FIG. 3A, only the first conveyor row 6A side of the two conveyor rows is shown, but the configuration is the same on the second conveyor row 6B side that is symmetric with respect to the apparatus center line CL.

  The first mounting head 15A and the second mounting head 15B are provided corresponding to the first component supply unit 10A and the second component supply unit 10B, respectively. The first mounting head 15A is provided from the first component supply unit 10A. The components are taken out by the unit mounting heads 16 and mounted on the board 7 held by the board holding unit 9 in the first transfer lane L1 or the second transfer lane L2, as shown in FIGS. d). Similarly, the second mounting head 15B takes out components from the second component supply unit 10B and mounts them on the substrate 7 held by the substrate holding units 9 in the third transfer lane L3 and the fourth transfer lane L4.

  That is, the Y-axis table mechanism 12 and the X-axis table mechanism 13A, and the Y-axis table mechanism 12 and the X-axis table mechanism 13B are configured so that the first mounting head 15A and the second mounting head 15B are respectively associated with the corresponding component supply units and the respective transport lanes. The first head moving mechanism 14 </ b> A and the second head moving mechanism 14 </ b> B are configured to move individually with the substrate holding unit 9. Further, the first head moving mechanism 14A and the first mounting head 15A, the second head moving mechanism 14B and the second mounting head 15B take out components from the first component supply unit 10A and the second component supply unit 10B, respectively, and A component mounting mechanism for mounting on the substrate 7 positioned and held by the holding unit 9 is configured.

  In the component mounting operation by these component mounting mechanisms, the first conveyor 5A is closer to the first component supply unit 10A than the second conveyor 5B, and the fourth conveyor 5D supplies the second component more than the third conveyor 5C. Since it is close to the part 10B, the movement path of the first mounting head 15A and the second mounting head 15B in the component mounting work differs depending on the target transport lane. Therefore, in the component mounting work for the first conveyor row 6A, the target for the board 7 located in the first transport lane L1 is more than the target for the board 7 located in the second transport lane L2. Higher component mounting work efficiency can be realized. Similarly, in the component mounting work for the second conveyor row 6B, the target for the board 7 located in the fourth transport lane L4 is the target for the board 7 located in the third transport lane L3. Higher component mounting work efficiency can be realized.

  In the present embodiment, the first board 7A having a small component mounting work amount is carried into the inner second transport lane L2 or the third transport lane L3, and the second board 7B having a large component mounting work amount is placed on the outer side. It carries in to the 1st conveyance lane L1 or the 4th conveyance lane L4. In other words, by always allocating the board with the larger component mounting work amount to the transport lane where higher component mounting work efficiency can be realized, the time required for mounting is reduced and the productivity of the entire mounting work is improved. It is possible.

  Component recognition cameras 17 are arranged between the first component supply unit 10A and the first conveyor 5A, and between the second component supply unit 10B and the fourth conveyor 5D. When the first mounting head 15A and the second mounting head 15B that have taken out components from the first component supply unit 10A and the second component supply unit 10B move to the substrate 7 held by the substrate holding unit 9 of each transfer lane. When the first mounting head 15A and the second mounting head 15B move above the component recognition camera 17, the component recognition camera 17 images the components held by the first mounting head 15A and the second mounting head 15B. The recognition processing unit 24 (see FIG. 4) performs recognition processing on the image acquired by the imaging, so that the difference and position of the component types of the components P held by the first mounting head 15A and the second mounting head 15B are detected. A shift state is detected.

  Further, by moving the first mounting head 15A and the second mounting head 15B above the substrate 7 held by the substrate holding part 9 of each conveyance lane, as shown in FIGS. The recognition marks 7a and 7b formed in (1) are imaged by the substrate recognition camera 18 (arrow e). That is, these two substrate recognition cameras 18 are moved integrally with the first mounting head 15A and the second mounting head 15B by the first head moving mechanism 14A and the second head moving mechanism 14B, respectively, and are held by the substrate holding unit 9. The recognition marks 7a and 7b of the substrate 7 thus formed are imaged. The recognition processing unit 24 performs a recognition process on the image acquired by the imaging, thereby detecting the position of the substrate 7 held in the substrate holding unit 9. In the component mounting operation on the board 7 by the first mounting head 15A and the second mounting head 15B, the first head moving mechanism 14A and the second head moving mechanism 14A are controlled based on the position deviation detection result of the component P and the position detection result of the board 7. The positioning operation by the head moving mechanism 14B is corrected.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, the control processing unit 20 has a CPU function, and controls the following units based on control programs and work data stored in the operation mode storage unit 21 and the data storage unit 22. The mechanism driving unit 23 is controlled by the control processing unit 20, and the substrate transport mechanism 8, the substrate sorting unit 3, the first component supply unit 10A, the second component supply unit 10B, the first mounting head 15A, and the second mounting head 15B. Then, the first head moving mechanism 14A and the second head moving mechanism 14B are driven to execute the respective work operations. The recognition processing unit 24 performs recognition processing on images captured by the board recognition camera 18 and the component recognition camera 17. As a result, the recognition marks 7a and 7b formed on the substrate 7 are recognized, and the positions of the components P held by the first mounting head 15A and the second mounting head 15B are detected.

  The substrate detector 25 detects the presence or absence of the substrate 7 in the substrate holder 9 in the first transport lane L1 to the fourth transport lane L4 based on the detection signals of the first detection sensor S1 to the fourth detection sensor S4. The first detection sensor S1 to the fourth detection sensor S4 and the substrate detection unit 25 are provided in each of the substrate transfer conveyors, and serve as substrate detection means for detecting the presence or absence of the substrate 7 in the substrate holding unit 9 of the substrate transfer conveyor. Yes. The operation / input unit 26 is an input device such as a touch panel or a keyboard, and performs input operations such as operation commands and data input. The display unit 27 is a display panel, and displays a guidance screen and various notification screens when an operation is input by the operation / input unit 26. The operation mode storage unit 21 stores various operation modes such as the substrate combination processing mode 21a.

  Here, the operation mode is a necessary control program for operating each unit in accordance with a work operation pattern defined in advance when the component mounting work on the board 7 is continuously executed by the component mounting apparatus 1. In the present embodiment, the boards 7 to be mounted are two types of boards (first board 7A and second board 7B) that have different mounting work contents and are defined by the number of parts, etc., with different mounting work contents. Thus, when component mounting work is performed by always combining the first board 7A and the second board 7B in combination, the dead time such as the waiting time for board transportation is reduced as much as possible, and the work operation load of the mounting head is reduced. Is leveled in time. Here, the first substrate 7A and the second substrate 7B may be two types of individual substrates incorporated in the same device, or two mounting surfaces of a single substrate on which components are mounted on both the front and back surfaces. May be regarded as the first substrate 7A and the second substrate 7B.

  The data storage unit 22 stores data necessary for a component mounting operation performed on the board 7 such as the board information 22 a and the component mounting information 22 b for each type of the board 7. The board information 22a is information regarding work data about the board 7, that is, the size of the board, the mounting coordinate reference point on the board 7, the presence or absence of the recognition marks 7a and 7b, and the position thereof. The component mounting information 22b is information related to the type of component mounted on the substrate 7 and the mounting position coordinates of each component on the substrate 7. In the present embodiment, as component mounting information 22b, board-specific component mounting information 22b1 (first component mounting information, second component mounting) indicating the component mounting information for each of the first board 7A and the second board 7B described above. Information), and a virtual board 70 (see FIG. 5) in which the mounting range of both the first board 7A and the second board 7B is virtually regarded as a single board mounting surface. Single component mounting information 22b2 indicating component mounting information is included.

  The contents of such component mounting information 22b will be described with reference to FIG. FIG. 5A shows a state in which the second substrate 7B and the first substrate 7A are loaded into the first transfer lane L1 and the second transfer lane L2 of the first conveyor row 6A, respectively, and are positioned and held by the substrate holding unit 9. Show. In this state, the chain line frame 70 that encloses the combined range of the second substrate 7B and the first substrate 7A virtually sets the mounting range combining the mounting surfaces of both the first substrate 7A and the second substrate 7B. This corresponds to the virtual board 70 regarded as a mounting surface of one board. In the component mounting operation after board loading, the component mounting position by the first mounting head 15A is controlled based on the recognition results of the recognition marks 7a and 7b formed on the first substrate 7A and the second substrate 7B, respectively.

  FIG. 5B shows a data configuration example of board-specific component mounting information 22b1 and single component mounting information 22b2. The board-specific component mounting information 22b1 includes first component mounting information for the first board 7A and second component mounting information for the second board 7B, and “NO.” ( Mounting number), “code” indicating the component type, “mounting coordinates” indicating the position of the mounting point relative to the mounting coordinate reference point given by the board information 22a, and the like. As shown in the board-specific component mounting information 22b1, the smaller component mounting work amount corresponds to the first substrate 7A, and the larger component mounting work amount corresponds to the second substrate 7B.

  The single component mounting information 22b2 is component mounting information for the temporary substrate 70 shown in FIG. 5A, and the component mounting information for the individual board given by the board-specific component mounting information 22b1 is one piece of component mounting information. It is a data form created as a whole. Each mounting number shown in the single component mounting information 22b2 is assigned with a “classification” indicating which board the mounting point actually belongs to, corresponding to the first board 7A and the second board 7B, respectively. . Thus, when the component mounting operation is executed based on the single component mounting information 22b2, by identifying whether the “classification” is A or B, the actual mounting target is the first board 7A, the first mounting target. It can be limited to either of the two substrates 7B. The data storage unit 22 having the above configuration includes the first component mounting information and the second component mounting information 22b1 for each of the first substrate 7A having a small component mounting work amount and the second substrate 7B having a large component mounting work amount. This is a storage unit for storing single component mounting information 22b2 created by combining component mounting information into one.

  Next, a component mounting operation realized by executing the board combination processing mode 21a will be described with reference to FIG. In this component mounting operation, the control processing unit 20 always controls the substrate transport mechanism 8, the first mounting head 15A, the second mounting head 15B, the first head moving mechanism 14A, and the second head moving mechanism 14B. Components taken out from the respective component supply units are transported and mounted on the two types of first substrate 7A and second substrate 7B combined together. In FIG. 6, only the first conveyor row 6A side of the substrate transport mechanism 8 is shown and the second conveyor row 6B is not shown, but the same component mounting is also performed on the second conveyor row 6B side. The action is executed. In these component mounting operations, the first board 7A is always carried into either the second transfer lane L2 or the third transfer lane L3 inside the apparatus center line CL, and the second board 7B is always loaded into the apparatus center line. It is carried into either the first transport lane L1 or the fourth transport lane L4 outside the CL.

  First, as shown in FIG. 6A, the first substrate 7A is loaded into the second transfer lane L2 (arrow f) in a state where the second substrate 7B is not yet loaded into the first transfer lane L1, and the substrate is held. It is positioned and held by the part 9. Next, a component mounting operation (arrow g) for mounting the component taken out from the first component supply unit 10A by the first mounting head 15A on the first substrate 7A is started for the first substrate 7A. At this time, with reference to the single component mounting information 22b2 stored in the data storage unit 22, only the mounting numbers belonging to “classification” A are targeted, and the mounting numbers belonging to “classification” B are skipped. That is, here, only the first substrate 7A loaded into the substrate transfer conveyor corresponding to the inner second transfer lane L2 close to the apparatus center line CL and held by the substrate holding portion 9 of this substrate transfer conveyor is targeted. A component mounting operation is executed (first mounting step).

  In the process of executing the first mounting step described above, as shown in FIG. 6B, the second substrate 7B is carried into the first transfer lane L1 (arrow i), and is positioned and held by the substrate holder 9. At the same time, the second substrate 7B is detected by the first detection sensor S1. In response to the board detection result, the component mounting operation shown in FIG. 6C is started with reference to the single component mounting information 22b2. Here, the first mounting head 15A further supplies the first component by a mounting path (arrows j, k) for directly transferring the component taken out from the first component supply unit 10A to the first substrate 7A or the second substrate 7B. After a part of the plurality of parts taken out from the part 10A is mounted on one of the first board 7A or the second board 7B, the parts are transferred by a mounting path (arrow l) for transferring the remaining parts to the other board. Installed.

  That is, here, the second substrate 7A and the second inner substrate 7A that are carried into the substrate transfer conveyor corresponding to the outer first transfer lane L1 that is separated from the apparatus center line CL and held by the substrate holder 9 of the substrate transfer conveyor. A component mounting operation is performed on both the first substrates 7A that are carried into the substrate transfer conveyor corresponding to the transfer lane L2 and held by the substrate holding unit 9 of the substrate transfer conveyor (second mounting step).

  When the component mounting operation for the first board 7A in the second mounting step is completed, the first board 7A is moved downstream from the board holding unit 9 in the second transport lane L2, as shown in FIG. Along with carrying out to the side (arrow m), a new first substrate 7A is carried from the upstream side (arrow n). In parallel with this board transfer operation, the component mounting operation for the second board 7B in the first transfer lane L1 is executed until the mounting operation is completed (arrow o). That is, here, only after the component mounting operation for the first board 7A is completed, only the second board 7B held by the board holding section 9 of the board transfer conveyor corresponding to the outer first transfer lane L1 is used. Then, the component mounting operation is executed (third component mounting step). Thus, one cycle of the board combination mounting process in which the pair of first board 7A and second board 7B is combined is completed.

  As described above, in the case where the first substrate 7A and the second substrate 7B having different component mounting work amounts are to be simultaneously mounted by the component mounting apparatus 1 having the above-described configuration, the pair of first substrates 7A, By configuring the component mounting process for the second substrate 7B by the first mounting process, the second mounting process, and the third mounting process described above, the following effects can be obtained. That is, the time required for mounting is shortened by bringing the second board B having a large amount of component mounting work into the outer board transfer lane close to the component supply unit and having higher component mounting work efficiency to be mounted. be able to.

  Further, in the above-described process configuration, when the substrate is transported in the transport lane on one side in the two rows of transport lanes, the component mounting operation is performed in the other transport lane. Thus, the waiting time of the mounting head accompanying the substrate transfer operation can be reduced. Further, the distribution of the component mounting work amount of the first board 7A to the first mounting process and the second component mounting process, and the distribution of the component mounting work amount of the second board 7B to the second mounting process and the third component mounting process. It is possible to level the work operation load of the mounting head in the component mounting process in terms of time.

  The component mounting apparatus and the component mounting method according to the present invention simultaneously mount two types of boards having different component mounting work amounts in a component mounting apparatus having a configuration including four substrate transfer conveyors and two mounting heads. This is advantageous in that the productivity can be improved and is useful in the field of manufacturing a mounting substrate by mounting electronic components on the substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Component mounting mechanism part 3 Board | substrate distribution part 5A 1st conveyor 5B 2nd conveyor 5C 3rd conveyor 5D 4th conveyor 6A 1st conveyor row 6B 2nd conveyor row 7 Board | substrate 7A 1st board | substrate 7B 2nd board | substrate 7a 7b Recognition mark 8 Substrate transport mechanism 9 Substrate holder 14A First head moving mechanism 14B Second head moving mechanism 15A First mounting head 15B Second mounting head 18 Substrate recognition camera L1 First transport lane L2 Second transport lane L3 Second 3 transport lane L4 4th transport lane

Claims (2)

A component mounting apparatus for mounting components on a first substrate and a second substrate having different component mounting work amounts in parallel,
Two conveyor rows each including two substrate transfer conveyors each provided with a substrate holding portion for transferring the first substrate and the second substrate and positioning and holding the substrates are arranged with the apparatus center line interposed therebetween. A substrate transport mechanism arranged and configured, and a substrate detection means provided on each of the substrate transport conveyors for detecting the presence or absence of the first substrate and the second substrate in the substrate holding portion of the substrate transport conveyor,
Two component supply units that are arranged on the sides of each of the two conveyor rows and supply components mounted on the first substrate and the second substrate, and corresponding to each of the two component supply units Two mounting heads that are provided and take out components from the corresponding component supply units, and the two mounting heads are individually moved between the corresponding component supply units and the substrate holding units of the corresponding conveyor rows. A head moving mechanism;
Single component mounting information created by combining the first component mounting information and the second component mounting information for each of the first substrate having a small component mounting work amount and the second substrate having a large component mounting work amount. Component storage for transferring and mounting components to the first substrate and the second substrate held by the substrate holding unit by controlling a mounting head and a head moving mechanism based on the single component mounting information A control processing unit for executing the operation,
The control processing unit carries a first carry-in step of carrying the first substrate into an inner substrate transfer conveyor close to the apparatus center line ;
A first mounting step of executing the component mounting operation only the first substrate held by the substrate holding portion of the first inner substrate conveyor is carried by loading step as a target,
A second carry-in step of carrying the second substrate into an outer substrate transfer conveyor away from the center line of the apparatus during the first mounting step;
When the substrate detecting means detects that the second substrate is held in the substrate holding portion of the outer substrate transfer conveyor that has been loaded in the second loading step, the substrate holding portion of the inner substrate transfer conveyor component mounting of the first substrate is completed, which is held on the mounting head the substrate holding unit and the second held in the outside of the substrate conveyor until moved to the component supply unit a second mounting step of executing the component mounting operation on the substrate,
After the component mounting operation intended for the first substrate is completed, a third implementation performing a component mounting operation only the second substrate held by the substrate holding portion of the outside of the substrate conveyor as the object,
A component mounting apparatus that performs a third loading step of loading the first substrate onto the inner substrate transfer conveyor during the third mounting step . A component mounting method for mounting components simultaneously and in parallel by a component mounting apparatus on a first substrate and a second substrate having different component mounting work amounts,
The component mounting apparatus includes two conveyor rows each including two board transfer conveyors each provided with a board holding unit that transfers the first board and the second board and positions and holds the boards. Substrate detection for detecting the presence or absence of the first substrate and the second substrate in the substrate holding section of the substrate transfer conveyor, which is provided in each of the substrate transfer mechanism and the substrate transfer conveyor arranged with the apparatus center line in between Means, two component supply units disposed on the respective sides of each of the two conveyor rows and supplying components mounted on the first substrate and the second substrate, and for each of the two component supply units Correspondingly provided two mounting heads for picking up components from the corresponding component supply sections, and the substrate mounting of the conveyor row corresponding to the two mounting heads and the corresponding component supply sections, respectively. First component mounting information and second component mounting information for each of the head moving mechanism that individually moves between the first substrate and the second substrate that has a small component mounting work amount and a second substrate that has a large component mounting work amount. A storage unit that stores single component mounting information created as a whole, and a mounting head and a head moving mechanism that are controlled by the single component mounting information based on the single component mounting information. A control processing unit for executing a component mounting operation for transferring and mounting the component to the first substrate and the second substrate,
A first carry-in step of carrying the first substrate into an inner substrate transfer conveyor close to the apparatus center line ;
A first mounting step of executing the component mounting operation only the first substrate held by the substrate holding portion of the first inner substrate conveyor is carried by loading step as a target,
A second carry-in step of carrying the second substrate into an outer substrate transfer conveyor away from the center line of the apparatus during the first mounting step;
When the substrate detecting means detects that the second substrate is held in the substrate holding portion of the outer substrate transfer conveyor that has been loaded in the second loading step, the substrate holding portion of the inner substrate transfer conveyor the first and the mounting of components on the substrate is completed, which is held in, the said mounting head is held by the substrate holding portion of said outer board conveyor until moved to the component supply unit first a second mounting step of executing a part article mounting operation on the second substrate,
A third component mounting step of performing the component mounting operation only on the second substrate held by the substrate holding portion of the outer substrate transfer conveyor after the component mounting operation targeting the first substrate is completed ;
A third loading step of loading the first substrate onto the inner substrate transfer conveyor during the third mounting step;
A component mounting method comprising:

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