JP2007019085A - Carrier system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier system for a semiconductor wafer or the like capable of improving a carrying efficiency and a working efficiency, shortening a carrying time and reducing an equipment cost. <P>SOLUTION: The carrier system 10 conducts carriages among working devices for wafer carriers WC to a plurality of various working devices A to H and R. The carrier system 10 has a plurality of basic carrier modules M constituted so as to conduct the carriages among the working devices to the working devices in a specified base number and a relay platform TP relaying the carriages of wafers among mutually adjacent basic carrier modules. In the system, each basic carrier module has a single carrying path 14 arranged along the corresponding working devices and a single carrier 16 being guided by the carrying path and being capable of being moved in both forward and reverse directions. According to the constitution, a skip forward-movement/reverse-movement carriage can be conducted without fitting a loop and a bypass carrying path and without the danger of stagnations and collisions among the carriers. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a system for conveying a workpiece in a complicated machining process, and more particularly to a conveyance system for conveying a semiconductor wafer as a workpiece in a machining process of a semiconductor device between processing apparatuses. The term “processing” in the present specification and the appended claims includes not only physical processing but also processing such as film formation, heating, and cleaning processing, assembling, and various other operations. A word that means a concept.

  Conventionally, when a series of individual processing is performed on a workpiece using a plurality of processing devices, a conveyance path is formed along the arrangement of the processing devices, and the workpiece is unidirectionally according to the processing order (that is, in the forward direction). A method is generally used in which transport is performed sequentially between processing devices and processing is performed by each processing device.

For example, Patent Document 1 below discloses an arrangement example in which various types of processing are performed on a semiconductor wafer (hereinafter referred to as “wafer”) as a workpiece for manufacturing a semiconductor device. In the example described in Patent Document 1, a plurality of processing device groups are arranged in a line along a transfer path, an automatic transfer vehicle with a transfer box placed on the transfer path is run, and a wafer placed in the transfer box is moved in one direction. It is a transport system that transports.
Japanese Patent No. 2974409

  In the conveyance system as described above, the workpiece is conveyed only in one direction. Therefore, depending on the workpiece, it is not possible to flexibly cope with the case where the type and order of the processing are different.

  For example, depending on the configuration of the semiconductor device, there is a case where a specific processing is not required among a set of processing steps that have been set, and in that case, the unnecessary processing steps (that is, the processing steps) between a plurality of processing steps. It is necessary to skip (jump over) the device. It is necessary to perform so-called skip conveyance. In addition, there may be a case where a plurality of specific processing devices are arranged adjacent to each other in relation to the capability of the processing device. At that time, one of the plurality of similar processing devices is selected and processed, and other similar types are processed. It is desirable to perform skip conveyance to skip the processing apparatus.

  In addition, depending on the configuration of the semiconductor device, after a series of processing is performed by a plurality of processing apparatuses, the same processing as that performed by a certain specific processing apparatus may be performed again. In such a case, a processing device for the same processing is not additionally installed according to the processing order, and instead, the processing device that has already performed the same processing is covered during a series of processing. It is desirable for the efficient use of the processing apparatus that the wafer which is the workpiece is returned by some means, that is, in the form of so-called return transfer, the processing apparatus is repeatedly used. For re-use of this processing device, it is preferable to plan the processing device with a margin in advance for the processing capability of the processing device that performs the processing, and by performing the processing further repeatedly by giving a margin, It is also possible to improve the use efficiency and reduce the initial investment of the processing apparatus.

  When trying to perform such skip conveyance and return conveyance, in the conveyance system that conveys the workpiece only in one direction, the entire conveyance path is made into a loop shape, or as described in Patent Document 1, Means for branching the conveyance path to form a bypass conveyance path have been conventionally proposed.

  However, the means for looping the entire conveyance path may move the workpiece one or more times, and requires a large conveyance time. In addition, the means for forming the entire conveyance path in a loop and the means for forming the bypass conveyance path require a large installation area or installation distance (that is, conveyance distance) of the conveyance system, which reduces the cost of the conveyance system, and thus the entire processing facility. This increases the conveyance time. In addition, since the conventional transport system transports multiple workpieces on the same and common transport path, it is necessary to avoid traffic jams and collisions between the workpieces. It was also impossible to reversely send back.

  Therefore, in order to improve the operating efficiency of the processing equipment when selecting the processing steps according to the processing requirements specific to each workpiece in a series of processing steps for processing the workpiece, such processing requirements It is possible to easily execute skip forward transfer and skip reverse transfer (return transfer) between processing devices in accordance with the above without using loop transfer, bypass transfer, etc., thereby reducing the transfer time between processing steps, There is a need for a transport method that reduces the construction cost of the transport system.

  The present invention has been made in view of such circumstances, and its purpose is to improve the conveyance efficiency, the improvement of the processing efficiency, the reduction of the conveyance time, and the reduction of the equipment cost in accordance with the above processing requirements. An object of the present invention is to provide a workpiece-to-machine transfer system for a workpiece that can easily perform skip forward transfer and skip reverse transfer.

  In order to achieve the above object, the present invention provides a predetermined radix selected and arranged in parallel in each of a plurality of processing devices in a transport system for transporting a workpiece between processing devices to a plurality of various processing devices. A plurality of basic conveyance modules each configured to convey a workpiece to and from a plurality of machining apparatus groups consisting of a plurality of machining apparatuses, and between the basic conveyance modules adjacent to each other, And a relay means for relaying the conveyance. Further, in the transport system according to the present invention, each basic transport module has a single transport path arranged along a processing device group consisting of the corresponding predetermined number of processing devices, and a forward direction guided by the transport path. (Forward direction) and reverse direction, that is, both forward and reverse directions, and a single transfer machine capable of transferring the workpiece between the processing apparatuses. Further, the transfer machine has a workpiece in which only the range from one relay means of a pair of relay means adjacent to both ends of the basic transfer module to the other relay means through the basic transfer module is the transfer range. Can be transported.

  Further, in the transfer system according to the present invention, a loading means arranged adjacent to the upstream end of the basic transfer module located on the most upstream side of the transfer system and capable of loading a workpiece into the transfer system; And an unloading means arranged adjacent to the downstream end of the basic transfer module located on the most downstream side of the transfer system and enabling unloading of the workpiece from the transfer system.

  In such a configuration, the transport system is composed of a plurality of basic transport modules, and the processing devices that each basic transport module is responsible for transport are limited to a processing device group consisting of processing devices of a predetermined radix. The movement range for this is also set to the above-mentioned conveyance range specified for each basic conveyance module. In each transfer range, only a single transfer machine that constitutes the basic transfer module can be moved in both forward and reverse directions within the given transfer range along the single transfer path that also forms the basic transfer module. Transport the workpiece.

  Therefore, since there is only a single transfer device within this predetermined transfer range, transfer is performed, so that a plurality of transfer devices travel along a common transfer path as in the conventional transfer system to transfer the workpiece. Unlike the case of carrying out, there is no possibility of traffic jams, collisions, etc. between adjacent transport machines in the case of transport in either forward or reverse direction. From this, as a transport form by the transport machine, a transport form in which forward transport is sequentially performed in units of transport in a normal (forward) direction from a certain processing apparatus to an adjacent processing apparatus (referred to as unit forward transport). And skip forward transfer that skips one or more processing devices, and various transport forms of unit reverse transfer and skip reverse transfer that are also unit transfers in the reverse direction, according to the transfer requirements in a single transfer path, It can be taken optimally including the transport speed.

  That is, since the forward / reverse operation is performed using a single conveyance path, skip conveyance and return conveyance are possible without requiring a loop or bypass conveyance path. In this case, in the conventional transfer system, there is a risk of interference with other transfer machines on the common transfer path, and thus a loop or a bypass transfer path must be used.

  In the transport system of the present invention, in addition to the transport modes such as skip and return in one basic transport module as described above, two or more adjacent ones with one or more relay means interposed therebetween It is possible to perform transport in a transport mode such as unit forward transport, skip forward, unit reverse transport, skip reverse transport and the like across the basic transport module via the relay means. When transporting workpieces over such a wide transport path, the transport speed during forward and reverse skip transport, including transport within the same basic transport module, is faster than during unit transport. It is desirable to set the time to be long. By setting in this way, the time loss during long distance conveyance can be reduced.

  In addition, each transporter determines a position facing the relay means adjacent to the upstream end of the transport range of the corresponding basic transport module (in the case of the basic transport module on the most upstream side of the transport system, the transport means). At this fixed position, after receiving the transfer program instructions that meet the transfer requirements from the control system, which is the host control system in the semiconductor device manufacturing facility, carry out the transfer work, and after the given transfer program ends From the viewpoint of control, it is preferable to return to this fixed position. Instead, it is also possible to set so that an instruction is received by wireless means or the like during the conveyance stage.

  In addition, while one or more workpieces are being processed by the processing device within a specific basic transfer module, the transfer machine receives another workpiece from its upstream relay means or carry-in means, and the forward direction It is also possible to transport in the (downstream direction) or receive from the downstream relay means and transport in the reverse direction (upstream direction) by appropriately setting the transport program.

  The relay means can be a relay platform arranged between the basic transport modules adjacent to each other. The relay platform includes delivery means for receiving and delivering the workpiece to and from the conveyor in the adjacent basic conveyance module, and storage means for storing the workpiece received by the delivery means. In addition to performing the function of relaying workpiece transfer between the upstream basic transfer module adjacent to the relay platform and the downstream basic transfer module adjacent to the relay platform, the timing of processing and transfer should be adjusted. Can do.

  The carry-in means may be a carry-in unit that is arranged at the most upstream end of the present conveyance system according to the present invention and has a function of relaying the workpieces from the outside to the present conveyance system. The carry-in unit includes delivery means for receiving a workpiece carried in from the outside and delivering the received workpiece to a transfer machine in a basic transfer module adjacent to the downstream side of the carry-in unit. The carry-out means can be a carry-out unit that is arranged at the most downstream end of the present conveyance system according to the present invention and has a function of relaying the unloading of the workpiece from the present conveyance system to the outside. The carry-out unit includes delivery means for receiving a workpiece conveyed from a conveyance machine in a basic conveyance module adjacent to the upstream side of the carry-out unit and carrying out the delivered workpiece to the outside.

  In addition, it is effective that the transfer system according to the present invention is used in a semiconductor device manufacturing facility, in which case the workpiece is a semiconductor wafer. In addition, it is preferable that the semiconductor wafer is transferred between the processing apparatuses in a state of being stored in a commercially available single wafer storage container. This is because the contamination of the semiconductor wafer can be prevented by storing it in a single wafer storage container, and it can be adapted to the recent single wafer processing. In the conventional sealed wafer storage container for storing a plurality of wafers, the waiting time before and after the processing is large and the wafer production efficiency is poor. In addition, a single wafer transfer system has been proposed in which a wafer is transferred in a clean tunnel without placing it in a container. However, in one aspect of the transfer system of the present invention, a single wafer is not installed. Since the wafer is housed and transported in a dedicated sealed container, the equipment cost of the clean tunnel is not required, which is advantageous in terms of equipment.

  As described above, according to the transport system of the present invention, since a single transport machine travels on a single transport path and performs transport, on the same transport path as in the conventional transport system. Skip forward transport and skip reverse transport (return transport) are possible without risk of interference with other transport machines, and transport efficiency, operating rate of processing apparatus, and efficiency are improved. In addition, since skip conveyance and return conveyance are possible on a single conveyance path, there is no need to provide a bypass conveyance path or a loop-shaped conveyance path as in the past, and unnecessary processing devices can be used for the same machining. Therefore, it is possible to reduce the cost of the transport system and thus the entire equipment. Transport time can also be shortened.

  Hereinafter, preferred embodiments of a transport system according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 schematically shows a transport system 10 according to the invention. This transfer system 10 is used in a semiconductor device manufacturing facility, and for a plurality of various processing apparatuses A, R, B1, B2, C, D, E, F, G, and H arranged in a series of processing steps. Wafers (not shown) as workpieces are conveyed one by one, that is, in a single wafer mode. In the present embodiment, the wafer is stored in a single wafer storage container that can store only one wafer, and is transferred. Since such a wafer carrier is a sealed container, the wafer can be protected from particles. As such a single wafer storage container, for example, there is a wafer carrier (trademark “FOUP for One” series) manufactured by Incam Solutions, but is not limited to this. A single wafer storage container may be used.

  As shown in FIG. 1, in this embodiment, a transfer system 10 according to the present invention transfers a wafer as a workpiece to a plurality of processing apparatuses A, R, B1, B2, C, D, E, F, G, and To H. The plurality of processing devices A, R, B1, B2, C, D, E, F, G, and H correspond to a plurality of basic transport modules as described below that constitute the transport system 10, and each has a predetermined radix. Are divided into a processing device group G as a plurality of processing device groups. In the illustrated embodiment, it is divided into three groups G1, G2 and G3. The group G1 includes processing devices A, R, B1, and B2, the group G2 includes processing devices C, D, and E, and the group G3 includes processing devices F, G, and H. Yes. The processing devices in each group are arranged in a straight line.

  The transfer system 10 according to the present invention includes a plurality of basic transfer modules M, and each basic transfer module M transfers wafers between processing apparatuses to the processing apparatuses of the corresponding processing apparatus group G. Here, the basic transport modules M1, M2, and M3 perform transport corresponding to the processing devices of the processing device groups G1, G2, and G3, respectively. The base number of the processing apparatus in which each basic transfer module M transfers the wafer (that is, the base number of the processing apparatus in each group) is, for example, a maximum of 10 units, preferably 3 to 6 units, which are the production flow and the takt time, It is appropriately determined in consideration of the length of the conveyance range, the conveyance speed, etc. in each basic conveyance module.

  Further, between the basic transfer modules M1 and M2 adjacent to each other and between the M2 and M3, relay platforms TP (TP1 and TP2) are provided as relay means for relaying wafers between the basic transfer modules M. Has been placed. It should be noted that the entrance portion and the exit portion in the transport system 10 are not the relay platform TP, but a carry-in unit LI as a carry-in means for receiving a wafer from the outside into the carry system 10 and a carry-out means as a carry-out means for carrying out the wafer to the outside. Unit LO is installed. The carry-in unit LI and the carry-out unit LO also function as relay means for relaying the wafer from the outside of the transfer system to the basic transfer module M1 and from M3 to the outside of the transfer system.

  Each basic transport module M (M1, M2, M3) has a single track 14 (14-1, 14-2, 14-3) as a single transport path, and forward and reverse directions along the single track 14 It is comprised from the single conveyance machine 16 (16-1, 16-2, 16-3) which can move.

  The single track 14 is a rail having an I-shaped cross section, and extends along the direction in which the processing devices constituting the processing device group G corresponding to the basic transport module M are arranged. One end of the single track 14 is disposed in the vicinity of the relay platform TP (for the modules M1 and M3, the carry-in unit LI and the carry-out unit LO, respectively) adjacent to one end of the basic transfer module M. The end is disposed in the vicinity of the relay platform 12 adjacent to the other end of the basic transport module M. As used herein, the vicinity refers to the end of the single track track when the relay platform TP as a relay means configured to be able to travel in parallel with the single track of the basic transport module travels. Means a positional relationship in which the wafer can be delivered between the transfer device and the relay platform.

  As shown in FIGS. 2 and 3, the transporter 16 includes a main body 18, a traveling unit 20 that travels as a movement on the single track 14, and a wafer that holds and delivers a wafer, that is, a wafer carrier WC. And a handler unit 22.

  The main body 18 is a substantially rectangular parallelepiped box, and a control unit (not shown) for controlling the traveling unit 20 and the wafer handler unit 22 is disposed therein. The control unit preferably enables transmission / reception of control signals to / from a host control system (not shown) in a semiconductor device manufacturing facility.

  The traveling unit 20 includes a driving wheel unit 24 and a driven wheel unit 26 provided at the lower part of the main body 18. As is understood from FIG. 3, the driving wheel unit 24 includes a central wheel 28 that rolls around the horizontal axis on the upper surface of the upper horizontal flange portion of the single track 14 having an I-shaped cross section, and the upper portion of the single track 14. A pair of left and right guide wheels 30 and 31 that engage with the left and right edge portions of the horizontal flange portion and sandwich the horizontal flange portion in the horizontal direction are provided. The central wheel 28 is driven in both forward and reverse directions by a drive motor (not shown), so that the conveyor 16 can travel in both forward and reverse directions along the single track 14. Further, the drive wheel unit 24 is in contact with the conductive wires 32 and 33 attached to the central web portion of the single track 14 along the longitudinal direction of the single track 14, and from there for taking necessary power for the conveyor 16. Contacts 34 and 35 are provided. Although not shown in the drawing, the driven wheel unit 26 has a central wheel and a pair of left and right guide wheels like the driving wheel unit 24. However, no driving force is applied to the central wheel, and the driven wheel unit 26 is rotatable.

  The wafer handler unit 22 is installed on the upper surface of the main body unit 18. The wafer handler unit 22 includes a rotating shaft 38 rotatably supported at both ends by a bearing block 36 on the main body 18, and a pair of swing rails 40 having one end fixed to the rotating shaft 38 and parallel to each other. The slider 42 is slidably attached to the swing rails 40, and the gripper 44 is provided on the slider 42 so as to detachably hold the wafer carrier WC. The rotary shaft 38 is rotationally driven by a drive motor 46. The drive motor 46 is controlled by a signal from a control unit in the main body 18. The slider 42 is movable along the swing rail 40 by a drive motor (not shown) built in the slider 42. This drive motor is also controlled by the control unit.

  When the rotation shaft 38 is rotated by controlling the drive motor 46, the swing rail 40 swings between a horizontal position and a vertical position. In the horizontal position (the position indicated by the solid line in FIG. 3), the wafer carrier WC held by the gripper 44 is placed on the opener deck OD having the function of a wafer transfer section provided in each processing apparatus. Can do. At that position, the opening of the wafer carrier WC is coupled with the delivery port (not shown) of the opener deck OD and then opened from the gripper 44 and opened, and the wafer transfer machine (not shown) on the processing apparatus side is opened. Can be carried into the processing apparatus or returned from the processing apparatus to the wafer carrier. At this time, even if the position from the single track 14 to the opener deck OD of each processing device is slightly different, the slider 42 is moved back and forth along the swing rail 40 with respect to the opener deck OD. The position shift can be absorbed and the wafer carrier WC can be properly placed on the opener deck OD. Note that the dimensions of the opener deck OD of each processing apparatus are fixed according to the standard. Although FIG. 1 shows a case where each processing apparatus has one opener deck OD, the transfer apparatus of the present invention can be applied even when there are a plurality of opener decks OD. In the state where the swing rail 40 is in the horizontal position, as will be described in detail below, the wafer carrier WC can be delivered to and from the relay platform TP.

  When the swing rail 40 is set to the vertical position, the wafer handler portion 22 and the wafer carrier WC are within the width of the main body portion 18 as indicated by a two-dot chain line in FIG. In the present embodiment, the transporter 16 is caused to travel along the single track 14 in such a state that the entire width is narrowed in this way. As a result, the distance between the single track 14 and the processing apparatus can be reduced, and the installation area of the processing apparatus and the transport system 10 can be reduced.

  For example, a barcode system or an RFID (Radio-Frequency IDentification) system is preferably used as the means for identifying the wafer carrier WC. For example, if an RFID tag is attached to the surface of the wafer carrier WC, and an RFID reader that receives an identification signal from the RFID tag is attached to the slider 42 of the wafer handler unit 22 or the like, the wafer handler unit 22 holds the RFID tag. It is possible to recognize the information of the wafer carrier WC and the information of the wafers therein. Then, the RFID reader signal is sent to the control unit in the main body 18 and further to the control control system of the semiconductor device manufacturing facility, so that the wafer delivery position, the wafer processing time, the waiting time of the transfer device 16, the waiting position, etc. Can be managed centrally. Other than this, it is of course possible to adopt a method having an equivalent identification and communication function. Similarly, the use of these or other appropriate information communication means is also effective when a transfer program is instructed to the transfer device 16 that transfers the wafer carrier WC.

  FIG. 4 is a front view schematically showing the relay platform TP. The relay platform TP has a function of delivering the wafer carrier WC to and from the transfer machine 16 in the adjacent basic transfer module M and a function of storing the wafer carrier WC. The relay platform TP in the present embodiment has four storage shelves 48 as storage means so that a maximum of four wafer carriers WC can be stored one by one in two rows on the left and right. . Note that the number of storage shelves is not limited to four, and may be configured to have other storage shelves as needed. As will be further described below, in order to receive the wafer carrier WC, it is necessary to secure at least one empty storage shelf for operation.

  To describe in more detail, the relay platform TP is vertically aligned with the storage unit 50 that is configured by the storage rack 48 and delivers and stores the wafer carrier WC, and the gripper 44 of the transfer device 16 that holds the wafer carrier WC. Therefore, the basic transport module M with respect to the floor of the semiconductor device manufacturing facility is aligned with the lifting / lowering unit 52 that moves the storage unit 50 up and down and the end position of the single track of the two adjacent basic transport systems. The single track 14 and a traveling portion 54 that enables traveling in a parallel direction are provided.

  In the storage unit 50, storage shelves 48 are arranged in two rows on the left and right and two on the top and bottom. Each storage shelf 48 includes a pair of side plates 56 and 57, and an upper plate 58 and a lower plate 59 arranged above and below, and at least the front portion (the front end in FIG. 4) is open. Further, slide rails 60 as delivery means that can be expanded and contracted in the horizontal direction are attached to the inner surfaces of the side plates 56 and 57 (see FIG. 5). A support plate 62 on which the wafer carrier WC is placed and supported is attached between the inner rails 60in of these slide rails 60 (movable rails having the largest moving distance with respect to the fixed rail 60out). When the storage shelf 48 on the right side of the relay platform TP (TP1), for example, in FIG. 4 is in the position facing the gripper 44 of the transporter 16-1 of the corresponding basic transport module M1, the slide rail 60 is in the most extended state. The support plate 62 can be aligned with the gripper 44 (the state in which the swing rail 40 is in the horizontal position and the slider 42 is moved to the outermost side) of the transporter 16-1. As a result, the wafer carrier WC can be delivered between the transfer device 16-1 and the support plate 62. When the slide rail 60 is contracted, the support plate 62 is disposed in a space surrounded by the side plates 56 and 57, the upper plate 58, and the lower plate 59, and the wafer carrier WC on the support plate 62 is protected from the outside. It will be stored in a state. The slide rail 60 may be expanded and contracted by an appropriate expansion / contraction drive mechanism 64 such as a screw drive unit or a pneumatic cylinder fixed on the lower plate 59. The extension drive mechanism 64 is controlled by a signal from the control system. As the slide rail 60 as the delivery means, for example, there is a slide rail manufactured by Nippon Accuride Co., Ltd., but it is also possible to use a slide rail of another company, and it is also possible to employ an appropriate drive system other than screws or air pressure.

  The storage unit 50 is fixed to the lifting plate 66 of the lifting unit 52. A through hole 68 is formed in the central portion of the elevating plate 66, and a nut unit 70 is fixed thereto. A ball screw 72 is screwed into the nut unit 70 and extends vertically. A lower part of the ball screw 72 is rotatably supported by a bearing unit 74 provided on a support base 73 of the elevating part 52. A driving motor 76 is attached to the support base 73, and its rotating shaft is connected to the lower end of the ball screw 72 through an appropriate transmission mechanism. Therefore, by controlling the drive of the drive motor 76 by a signal from the control control system, the ball screw 72 can be rotated and the lifting plate 66 to which the nut unit 70 is fixed can be moved up and down. As a result, the height position of the upper and lower storage shelves 48 can be matched with the gripper 44 of the swing rail 40 of the transporting machine 16 in the horizontal position. In this case, as a function of height alignment, switching between two upper and lower storage shelves and fine adjustment of the height in the same storage shelves are possible.

  Further, the elevating part 52 of this embodiment includes a drive motor 80 for rotating the support base 73 and the bearing unit 74 around the axis of the nut unit 70 in a horizontal plane with respect to the base 78. By driving the drive motor 80 with a signal from the control system, the support base 73, the bearing unit 74, the ball screw 72, and the lifting plate 66 can be rotated together. Therefore, the direction of the storage unit 50 can be changed 360 degrees in the horizontal plane. Accordingly, the positional relationship between the single track tracks of the basic transport modules adjacent to each other with the relay platform interposed therebetween is different from the case where they are on the same extension line as in the transport system of FIG. 1, and the rear side of the relay platform. In the case of wrapping around, the direction of the storage unit 50 can be rotated in accordance with this so that it can face the conveyor. An application example of this storage unit rotation function will be described next.

  FIG. 7 shows a transport system 100 which is another embodiment of the transport system of the present invention. In the transfer system 100, the rows of the processing apparatuses and the rows of the basic transfer modules are arranged to be folded back halfway. From the upstream side, the processing devices are the processing device group G101 (processing devices A, B, C, C), the same group G102 (the same D, E, F), and the group G105 (the same L, M, N, P). ) And the group G107 (Q, S, T) in this order and reach the downstream end. Further, a processing device group G103 (processing devices G, H, J, K) that performs a series of processing different from the processing in other processing device groups is behind the group G102 (same G, H, J, K). Is arranged. The basic transfer modules M101, M102, M103, M105, and M107 correspond to the processing device groups G101, 102, 103, 105, and 107, and each transfer device 116-1, 116-2, 116-3, 116-5, and 116-7 carry the wafer carrier WC on each single track 114-1, 114-2, 114-3, 114-5, 114-7. As for the relay platform, for example, in the relay platform TP1, the wafer carrier WC is relayed between the basic transfer modules M101, M102, and M103. And, between the end of the single track 114-3 of the basic transport module M103 on the relay platform TP1 side and the end of the basic track M101 or M102 of the single track 114-1 or 114-2 on the relay platform TP1 side, Two single track 114 (namely, 114-1 and 114-3 and 114-2 and 114-3) are arranged on both sides of the relay platform TP1. By adopting the rotation function, the wafer carrier WC can be delivered.

  Returning to FIG. 4 again, the relay platform TP of FIG. 4 includes a traveling unit 54 that travels on a single track 82 installed on the floor of the semiconductor device manufacturing facility. The single track 82 overlaps (overlaps) in the longitudinal direction in parallel with the ends of the single track 14 (14-1, 14-2) of a pair of basic transport modules M (for example, M1, M2) adjacent to each other. (See FIG. 1), and the relay platform TP travels on the single track 82, so that the desired storage rack 48 of the left and right storage racks is transferred to the transporter 16 of the basic transport module M. It becomes possible to make it face up. The traveling unit 54 includes two drive wheel units 84 that are pivotally supported by the base 78 of the elevating unit 52. The configuration of the drive wheel unit 84 is substantially the same as that of the drive wheel unit 24 in the transporter 16, and a central wheel 86 that rolls on the upper horizontal flange portion of the single-wire track 82 whose cross section is I-shaped, And a guide wheel 88 for holding the upper horizontal flange portion in the horizontal direction.

  Here, the carry-in unit LI and the carry-out unit LO will be described with reference to FIG. The carry-in unit LI includes delivery means for receiving a wafer carried from the outside of the transfer system 10 and delivering the received wafer to the transfer device 16-1 of the adjacent basic transfer module M1. Assume that a wafer to be processed is loaded from the outside in a single wafer storage container used in the transfer system 10, for example. In this case, the carry-in unit LI may have a storage unit such as the storage unit 50 of the relay platform described above. Processing in which a storage shelf (not shown) of the carry-in unit LI arranged adjacent to the upstream end of the single track 14-1 of the basic transfer module M1 is transferred from an external transfer means (not shown). A wafer carrier WC (not shown) containing a wafer to be received is received and delivered to the transfer device 16-1 facing the carry-in unit LI on the single track 14-1.

  The unloading unit LO includes a transfer unit that receives a wafer transferred from the basic transfer module M3 adjacent to the upstream side and performs transfer to the outside. The carry-out unit LO may have the same configuration as the carry-in unit LI. A storage shelf (not shown) of the carry-out unit LO receives a wafer carrier WC (not shown) containing processed wafers from the transfer device 16-3 of the adjacent basic transfer module M3 and receives external transfer means (not shown). Hand over to not shown).

  The wafers to be processed are transferred from the outside and the processed wafers are transferred to the outside. A sealed storage container (generally called FOUP) that stores a large number of wafers (for example, 25 sheets) widely used in the industry. In the case of loading and unloading, the replacement means (not shown) for replacing the wafer between the FOUP container and the single wafer storage container (wafer carrier WC) is separately provided and replaced. It is possible to always carry in / out the wafer in the carry-in unit LI and the carry-out unit LO in the form of the wafer carrier WC. Such replacement means can be easily thought of by those skilled in the art from the loading / unloading port technology used for wafer loading / unloading in a normal wafer processing apparatus. Furthermore, the function of such a replacement means may be introduced into the carry-in unit LI and the carry-out unit LO itself.

  Next, a transport procedure using the transport system 10 having the above configuration will be described. In the transfer apparatus 10 of the present invention, as described above, as the transfer mode, unit forward transfer, skip forward transfer, unit reverse transfer, skip reverse transfer, and mixed transfer modes in which these are mixed are possible. . Further, skip forward transfer or skip reverse transfer is not limited to one processing device group in charge of a specific basic transfer module but is performed across a plurality of adjacent basic transfer modules, that is, a plurality of adjacent processing device groups. You can also

  Here, a case will be described in which the conveyance system 10 in FIG. 1 performs conveyance including all of the above-described conveyance modes. The transport system of FIG. 1 includes a carry-in unit LI, a first basic transport module M1 adjacent thereto, a first relay platform TP1, a second basic module M2 and a second relay platform TP2 which are sequentially adjacent thereto. The third basic module M3 and the carry-out unit LO. Further, there are four processing devices of the processing device group G1 to be transported by the first basic transport module M1, and the processing device A, the processing device R, and the two processing devices B (B1, B2) in order from the upstream side. Are arranged side by side. Regarding the second basic transport module M2, a processing device C, a processing device D, and a processing device E constituting the processing device group G2 are arranged in order from the upstream side. Similarly, the processing device group G3 corresponding to the third basic transport module M3 is configured in the order of the processing device F, the processing device G, and the processing device H. Further, the processing time of the processing apparatus (including the time required for delivery of the wafer carrier to and from the transfer machine 16) is about 4 minutes in the processing apparatuses A, B1, B2, C, E, F and H, for example. The apparatuses D and G are about 5 minutes, and the processing time of the processing apparatus R is about 2 minutes. It is assumed that the processing apparatus R has a high capacity and a short processing time, and is repeatedly used by return conveyance using skip reverse conveyance. The processing devices B1 and B2 have the same specifications.

  Also, the wafer to be processed is generally transferred to a stage waiting for transfer for processing by a certain processing apparatus, a stage being processed by the processing apparatus, and transferred to the next stage (processing apparatus, etc.) after finishing processing by the processing apparatus. There are a plurality of wafers in a stage such as a stage of waiting for the following, and the movement of the subsequent wafers from the time when one of the wafers is loaded into the carrier system will be considered. The wafers at each stage are sequentially transferred and processed by a transfer program based on the production program by the basic transfer module giving a transfer command to the available transfer machines.

The transfer processing sequence for the wafer in this embodiment of FIG. 1 is configured by the following steps. The outline of the flow of this conveyance is shown in the conveyance route diagram of FIG. A series of numbers in FIG. 6 corresponds to the following step numbers. The solid line with an arrow in FIG. 6 shows the path | route which a conveyance machine conveys the wafer carrier WC containing a wafer. Similarly, the dotted line with an arrow indicates that the upstream side is in a fixed position without having the wafer carrier WC after the transfer of the wafer carrier WC containing the wafer to the downstream relay platform TP (the unloading unit LO in the case of the most downstream side). The route back to the relay platform TP (in the case of the most upstream, the carry-in unit LI) is shown.
1) In the carry-in unit LI, the transfer device 16-1 of the basic transfer module M1 receives a wafer carrier WC containing a wafer to be processed and forwards the unit forward to the processing apparatus A of the processing apparatus group G1;
2) Unit forward conveyance to the processing device R of the processing device group G1;
3) Unit forward transport to the processing device B1 of the processing device group G1;
4) The processing device B2 of the processing device group G1 is skipped (skip) and skipped forward to the relay platform TP1, and the wafer carrier WC containing the wafer is delivered to the transfer device 16-1 on the relay platform TP1;
5) In the relay platform TP1, the transporter 16-2 of the basic transport module M2 receives the wafer carrier WC containing the wafer delivered from the transporter 16-1 of the basic transport module M1, and transfers the unit to the processing device C of the processing device group G2. Transport forward;
6) Unit forward transport to the processing device D of the processing device group G2;
7) In order to return and transfer from the processing device D of the processing device group G2 to the processing device R of the processing device group G1, first, skip reverse transfer to the relay platform TP1;
8) Skip reverse transport to the processing device R of the processing device group G1 by the transfer device 16-1 of the basic transfer module M1 via the relay platform TP1 upstream (repetitive processing by the processing device R);
9) Skip forward transport to the relay platform TP1;
10) Skip forward transport from the relay platform TP1 to the processing device E of the processing device group G2 by the transport device 16-2 of the basic transport module M2;
11) Unit forward transport to relay platform TP2;
12) Unit forward transport from the relay platform TP2 to the downstream of the processing device group G3 by the transport machine 16-3 of the basic transport module M3, and sequentially to G, H, and the unloading unit LO;
13) In the unloading unit LO, the wafer carrier WC containing the wafer that has undergone a series of processing is received and unloaded from the transfer system 10.

  Under the above premise, first, as Step 1, the transporter 16-1 of the first basic transport module M1 is directly opposed to the carry-in unit LI that is the fixed position, and the transport program command is sent to the upper level via the carry-in unit. Received from the control system by laser, RFID, wireless or appropriate information communication means (not shown). Based on the received transfer program, the swing rail 40 is swung to the horizontal position, the wafer carrier WC containing the wafer to be processed is received from the carry-in unit LI, and held by the gripper 44. Next, the swing rail 40 is raised to a vertical position, and the transporter 16-1 travels along the single track 14-1 in the forward (downstream) direction to the processing apparatus A adjacent to the carry-in unit LI (unit forward transport). Directly face the processing apparatus A. Then, the swing rail 40 is again tilted to the horizontal position, the wafer carrier WC is placed on the opener deck OD of the processing apparatus A, and the opening of the wafer carrier WC is coupled to the delivery port (not shown) of the opener deck OD. Thereafter, the gripper 44 is opened and opened, and a wafer transfer machine (not shown) on the processing apparatus side carries the target wafer in the wafer carrier WC into the processing apparatus A. Thereafter, the target wafer is subjected to predetermined processing in the processing apparatus A.

  On the other hand, in Step 2, the transfer device 16-1 keeps the empty wafer carrier WC in a coupled state with the delivery port of the opener deck of the processing apparatus A based on the transfer program, and is now transferred to the processing apparatus A1 and started processing. It waits for a wafer which has been loaded into the processing apparatus A before processing and finished processing to be unloaded by a wafer transfer machine (not shown) on the processing apparatus side. In response to unloading of the processed wafer and storage in the wafer carrier WC, the coupling with the delivery port of the opener deck is released, and the transfer device 16-1 transfers the wafer carrier WC to the processing apparatus R (unit forward transfer). Next, as step 3, in the same manner as in the processing apparatus A, another processing-completed wafer is received from the processing apparatus R and transferred to the processing apparatus B1 by a program. Here, the processed wafer is received in the same manner as step 4, but here, the processing device B2 having the same specifications as the processing device B1 is skipped by the program and the process proceeds to the relay platform TP1 (skip forward transfer).

  The movement on the relay platform TP1 will be specifically described. The transporter 16-1 of the first basic transport module M1 is moved to a position adjacent to the relay platform TP1 at the downstream end of the single track 14-1. Thereafter, the swing rail 40 is set to the horizontal position. At the same time, the relay platform TP1 between the basic transport modules M1 and M2 is run along the single track 82, and the horizontal position of the open storage shelf 48 is aligned with the swing rail 40 of the transporter 16-1. Further, the storage unit 50 is moved up and down so that the swing rail 40 and the storage shelf 48 have the same height. Thereafter, the slide rail 60 of the storage shelf 48 is extended to receive the wafer carrier WC held by the transfer device 16-1, and the slide rail 60 is contracted and stored in the storage shelf 48. Subsequently, the relay platform TP1 is moved to the second basic transport module M2 side, and the transport machine 16- stands by with the upstream end of the single track 14-2 of the second basic transport module M2 as a fixed position. 2, the wafer carrier WC is transferred in the reverse procedure.

  Next, as a fifth step, the wafer is transferred to the processing apparatus C by the transfer machine 16-2 in the same manner as in the case of the processing apparatuses A, R, and B1 handled by the transfer machine 16-1 of the first basic transfer module M1. . Thereafter, in the same manner, according to the program, another wafer-containing wafer carrier WC, which has been processed by the processing apparatus C as step 6, is transported forward by a unit by the transfer device 16-2 to the adjacent processing apparatus D, and a wafer is loaded.

  Next, as step 7, the wafer that has been processed by the processing apparatus D is returned and transferred for processing again by the processing apparatus R of the processing apparatus group 1 based on the program. That is, as step 7, skip reverse transport is performed by the transport device 16-2 to the relay platform TP 1, and as step 8, skip reverse transport is performed by the transport device 16-1 to the processing device R and is processed again by the processing device R. The The wafer processed again in the processing apparatus R is relayed for processing in the processing apparatus E of the processing apparatus group G2 in charge of the second basic transfer module M2 programmed to perform the next processing in step 9. Transported between platforms TP1. Thereafter, the sheet is skipped forward and conveyed to the processing apparatus E across the two basic conveyance modules M1 and M2 via the relay platform TP1 (step 10). The wafer that has been processed by the processing apparatus E is advanced in units as a step 11 to the relay platform TP2.

  Next, via the relay platform TP2, as a step 12, the unit is sequentially transported forward and processed to the processing devices F, G, H of the processing device group G3 in charge of the downstream third basic transport module M3. . When all the processing based on the program in the processing apparatus in charge of the transport system 10 is completed, the wafer is transported to the unloading unit LO in a form accommodated in the wafer carrier WC, where it is unloaded to the outside.

  Depending on the contents of the program, for example, the processing apparatus A in the processing apparatus group G1 (see step 2) (or the processing apparatus C in the processing apparatus group G2 (see step 6)) does not wait for another wafer to be processed, and opens the opening. An empty wafer carrier WC that is closed from the opener deck OD is held by the gripper 44, and the swing rail 40 is swung to a vertical position, and then the transfer device 16-1 is positioned upstream along the single track 14-1. Return to the position carry-in unit LI (in the case of the transfer machine 16-2, to the relay platform TP1 at the upstream fixed position along the single track 14-2). Or when the wafer carrier WC containing the next wafer is received by exchanging it with an empty wafer carrier WC on hand, or the next program command is issued Other than the processing device or the fixed position other than the fixed processing unit in the same basic transfer module charge range for the next transfer without returning to the fixed position carry-in unit LI (or the relay platform TP1) based on the given program command. May go directly to the relay platform.

  As described above, in any case, in the transfer system of the present invention, only a single transfer device 16 exists on a single single track 14 of one basic transfer module. The interference problem cannot occur, and the conveyance operation including the conveyance direction and the conveyance speed of the conveyance machine 16 can be set freely and optimally by the program. For example, it is desirable that the speed of the transfer machine during forward and reverse skip transfer can be set higher than that during unit transfer.

  Therefore, when the processing steps are selected according to the processing requirements specific to individual wafers in a series of processing steps for processing the wafer that is the workpiece, skip advance between the processing devices in accordance with the processing requirements. Transfer and skip reverse transfer (return transfer) can be easily executed without using loop transfer, bypass transfer, etc. This shortens the transfer time between processing steps, and compared with the time when loop and bypass transfer are set. It is possible to reduce the construction cost of the transfer system and thus the cost of the entire equipment, and the operating efficiency of the processing apparatus can be improved.

  In the above procedure, when the wafer carrier WC leaves the processing apparatus for the next travel, the wafer carrier WC is basically used when the wafer carrier WC is in the wafer or empty, regardless of whether the wafer carrier WC is in the wafer or not. Is left on the opener deck OD of the processing apparatus, and the transfer device is set to leave the processing apparatus while holding the wafer carrier WC. However, the transfer system of the present invention is not limited to this wafer carrier WC handling method. For example, an empty wafer carrier WC is left on the opener deck OD of the processing apparatus A while being processed by the processing apparatus. It is also applicable to a method in which the machine moves to the next traveling operation. When the transfer device returns from the downstream relay platform (or carry-out unit LO) to the upstream relay platform (or carry-in unit LI), in principle, the wafer carrier WC is returned without being held. Although it is set, another procedure can be set for this.

  When it is necessary to transport and process many wafers, the transport and processing timings can be adjusted by storing them in the storage shelf 48 of the relay platform TP and keeping them in standby.

  As mentioned above, although preferred embodiment of this invention was described in detail, it cannot be overemphasized that this invention is not restricted to the said embodiment.

  For example, in the above-described embodiment, the single conveyance path is a monorail type single track, but the single track may be composed of two rails, and the conveyance machine may be run on these two rails.

  In the above embodiment, a single track is individually provided for each basic transport module. However, one single track is continuously laid as common to all the basic transport modules to support the range of movement of the transport machine. It is also possible to limit using a means (including but not limited to mechanical or electrical means) suitable for a predetermined transport range of the basic transport module.

  Further, for example, in the above embodiment, the wafer handler unit of the transfer machine is configured to swing the swing rail in the vertical plane between the horizontal position and the vertical position, but the swing rail is maintained at the horizontal position 2 instead. Alternatively, it may be swung in a horizontal plane between a direction along the single track and a direction perpendicular to the track and facing the processing apparatus.

  Furthermore, in the above embodiment, the relay platform is delivered and has a multi-functional configuration such as storage, raising / lowering, rotation, traveling, etc., and the number of storage shelves in the storage unit is four. For example, the number of storage shelves is at least one, and rotation It is possible to simplify functions such as omitting the functions and adopting a simple slide rail system for traveling. Conversely, it is also possible to increase the number of storage shelves to provide a buffer function and to provide flexibility in transportation and processing.

  Further, in the above-described embodiment, single-wafer transfer is used, but a plurality of wafers may be transferred while being stored in a wafer cassette.

  The transport system of the present invention can also be applied to a so-called batch type processing facility in which processing devices are randomly arranged instead of the order of processing steps.

  Furthermore, the workpiece is not limited to a semiconductor wafer, and may be a glass substrate for a flat display.

  In addition, if the method of performing skip conveyance and forward / reverse direction transfer is also advantageous in production in general workpiece processing lines other than semiconductor wafers, glass substrates for flat displays, etc., the present invention is used. It is possible to apply.

It is a schematic block diagram which shows one Embodiment of the conveyance system by this invention. It is a front view which shows the structure of the conveying machine used for the conveying system by this invention. It is a side view of the conveying machine shown in FIG. It is a front view which shows partially the structure of the relay platform in the conveyance system by this invention in a cross section. It is sectional drawing along the VV line of FIG. 4 which shows the structure of the storage shelf of a relay platform. It is a conveyance route figure which shows the procedure of conveyance of a wafer, and a process. It is a schematic block diagram which shows another embodiment of the conveyance system by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Transfer system, 12 ... Relay platform (relay means), 14 ... Single track (single transfer path), 16 ... Transfer machine, 20 ... Running part, 22 ... Wafer handler part, 40 ... Swing rail, 44 ... Gripper, 48 ... storage shelf (storage means), 50 ... storage section, 52 ... elevating section, 54 ... traveling section, 60 ... slide rail (delivery means), M (M1 to M3) ... basic transfer module, LI ... carry-in unit (Loading means), LO ... unloading unit (unloading means), A to H, R ... processing apparatus. G (G1-G3) ... Processing device group (processing device group)

Claims (5)

In a transport system that transports workpieces between processing devices to various processing devices,
A plurality of basic units each configured to transfer a workpiece between processing devices to a plurality of processing device groups each of which is selected from the various processing devices and arranged in parallel with a predetermined number of processing devices. A transport module; and
Relay means for relaying conveyance of a workpiece between the basic conveyance modules adjacent to each other;
Each of the plurality of basic transport modules is
A single transport path disposed along the group of processing devices comprising the corresponding predetermined number of processing devices;
A single transporter guided by the transport path and movable in both forward and reverse directions and capable of transporting a workpiece between processing devices; and the transporter of the basic transport module It is possible to transport a workpiece in which only a range from one relay unit of a pair of relay units adjacent to both ends to the other relay unit through the basic transport module is a transport range. A conveyance system characterized by that. The relay means is a relay platform disposed between the basic transport modules adjacent to each other;
Delivery means for the relay platform to receive and deliver the workpiece to and from the transporter in the adjacent basic transport module; and storage means for storing the workpiece received by the delivery means; The transport system according to claim 1, further comprising: The transport system further comprises:
A carry-in means arranged adjacent to an upstream end of the basic transfer module located on the most upstream side of the transfer system and enabling a workpiece to be transferred to the transfer system;
An unloading means disposed adjacent to the downstream end of the basic transfer module located on the most downstream side of the transfer system and enabling unloading of the workpiece from the transfer system;
The conveyance system according to claim 1, further comprising: The carry-in unit is a carry-in unit arranged so as to be adjacent to an upstream end of the basic transfer module located on the most upstream side of the transfer system,
The carry-out unit is a carry-out unit arranged so as to be adjacent to an end portion on the downstream side of the basic transfer module located on the most downstream side of the transfer system,
The carry-in unit includes delivery means for receiving a workpiece to be carried in from the outside and delivering the received workpiece to the carrier in the adjacent basic conveyance module, and the carry-out unit includes: 4. The apparatus according to claim 1, further comprising a delivery unit configured to receive a workpiece from the transporter in the adjacent basic transport module and to carry the received workpiece to the outside. The transport system according to item 1. The workpiece is a semiconductor wafer,
The transfer system according to any one of claims 1 to 4, wherein the transfer of the workpiece between the processing apparatuses is performed in a transfer form in which one wafer is stored in a single wafer storage container. .

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