KR200447087Y1 - Inspection equipment for CSP with handler type - Google Patents

Abstract

The present invention relates to an inspection apparatus for CSP, which is formed to perform characteristics and appearance inspection of a CSP (Chip Scale Packaging) by a handler method. It is possible to remarkably improve productivity compared to the past by constructing a plurality of characteristic and inspection inspections that have been made into all automated lines, and to reduce the cost by improving the pickup structure of the CS element, which has been a problem in the conventional method. Economic and precise production efficiency has been greatly improved.

To this end, the present invention provides a stacker 110 formed to arrange (package) a CSP element (10: CSP) formed of a glass (11: Glass) and a ball (12: Ball) in a predetermined arrangement, and the stacker ( A loading unit (100) provided with an input buffer (120: Input Buffer) for seating the CS 10 elements arranged at 110 in a predetermined position and preparing to prepare for a test; The automatic frame 210 formed at one side of the loading direction of the loading part 100 to enter the CS 10 waiting for the input buffer 120 into the test step and proceeding in one direction for the sequential testing of the CS 100: Shuttle and a plurality of pick-up arms 221 for directly picking up the upper glass 11 of the CS 10 positioned in the support 210 by vacuum are branched opposite to the center shaft 222. The contactor 220 rotates in one direction or the other direction with respect to the central shaft 222 and is formed to sequentially test the glass and the ball characteristics of the CSP, and the SPI rotated and transferred by the contactor 220. Characteristic inspection unit 200 is provided with a socket 230 is formed to test the characteristics by sending an electrical signal to the lower ball 12; The first vision unit is configured to transfer the finished CSP 10 to the set position by the frame 210 in one direction by comparing the input image with the input image and determine whether the glass 11 is damaged. (310) and the CSP 10, the inspection is completed in the first vision unit 310 one-way transfer to the set position by the frame 210, compared with the input image to determine whether the damage to the ball 12 The first sorting to divide the second vision unit 320 and the good quality CSP and defective CSP inspected through the first and second vision parts 310 and 320 into a shipping tray or a recovery tray, respectively. (330: Sorting-1) and the second sorting (340: Sorting-2) is provided with an appearance inspection unit 300; Alignment unit 400 is formed so that the inspection is completed through the characteristic inspection unit 200 and the appearance inspection unit 300 is aligned on the set plate 30; It is made up.

Chip scale packaging (CSP), Input Buffer (120: Input Buffer), Shuttle (210: Shuttle), Property Inspection, Appearance Inspection, Sorting

Description

Inspection equipment for CSP with handler type which is formed to perform the characteristic and appearance inspection of CSP in a handler manner

The present invention improves productivity compared to the previous method by constructing a plurality of characteristic and inspection inspections performed in the case of non-defective / non-defective inspection of CS devices as a single automated line, and has been a problem in the conventional method. In order to perform the characteristics and appearance inspection of CSP (Chip scale packaging) by using a handler method, it is possible to improve the pick-up structure (method) of the product and greatly improve the economical efficiency and precision production efficiency through cost reduction. It is related with the inspection apparatus for CSP formed.

BACKGROUND ART In general, an electronic component test apparatus is used to test the performance or function of an electronic component finally manufactured in the manufacturing process of an electronic component such as an IC device.

The conventional electronic component test apparatus includes a test section for testing electronic components, a loader section for transferring the IC device before the test to the test section, and an unloader section for taking out and classifying the finished IC device from the test section. Equipped.

The loader section includes a buffer stage capable of reciprocating between the loader section and the test section, and an adsorption section capable of attracting and holding the IC device, and the loader section movable in the area from the customer tray to the heat plate and the heat plate to the buffer stage. The conveying apparatus is installed.

In addition, the test section is provided with a contact arm capable of attracting and holding the IC device and pushing it into the socket of the test head, and is provided with a test section conveying apparatus which is movable in the test section.

The loader conveying apparatus sucks and holds the IC device stored in the customer tray to the adsorption unit, places the IC device on the heat plate, and then sucks and holds the IC device on the heat plate heated up to a predetermined temperature to the adsorption unit on the buffer stage. Wit

The buffer stage carrying the IC device moves from the loader section to the test section. Next, the test part conveying apparatus adsorbs and holds the IC device on the buffer stage with a contact arm and pushes it to the socket of the test head to bring the external terminal (device terminal) of the IC device into contact with the connection terminal (socket terminal) of the socket. .

In this state, by applying a test signal supplied from the tester main body to the test head through the cable to the IC device, and sending a response signal read from the IC device to the tester main body through the test head and the cable, the electrical characteristics of the IC device are improved. Measure

Here, if the holding position of the IC device in the contact arm is displaced when the contact arm of the test section conveying device pushes the IC device into the socket as described above, the contact between the device terminal and the socket terminal is not performed reliably, so that the test is performed. Cannot run correctly. Therefore, it is necessary to precisely define the position of the IC device in the contact arm.

In particular, IC devices used in mobile communication devices such as Yosai mobile phones are becoming smaller and thinner, and the number of device terminals is rapidly increasing due to the high integration and multifunctionality of integrated circuits. As a result, narrower pitches are being developed.

For example, when the device terminal is a solder ball, the placement interval is narrowed to 0.4 mm. As described above, when the pitch and narrowing of the device terminal proceed, it is difficult to contact the device terminal precisely with the socket terminal.

In order to solve such a problem, an electronic component test apparatus for measuring the position of an IC device using an image processing technique and positioning the socket of a test head has been developed.

In such an electronic component test apparatus, an IC device under test being conveyed to a conveying apparatus is imaged by an optical imaging device such as a CCD (Charge Coupled Device) camera, and the positional displacement amount of the IC device is based on the captured image. To calculate.

The conveying apparatus corrects the posture of the IC device under test based on the calculated positional shift amount and conveys the IC device under test to the socket.

The calculation of the position shift amount of the IC device is performed by detecting, for example, a device terminal in the image using an image processing technique, and measuring the center coordinates and the rotation angle of the entire arrangement of the device terminals.

On the other hand, CSP is a low-power imaging device with a CMOS complementary metal oxide semiconductor structure, compared to CCD charge-coupled devices, which consumes about one-tenth the power of a 33V single power supply peripheral circuit. Used for digital cameras, camera phones, etc. The packaging of these products is called Chip Scale Packaging (CSP).

Unlike Logic or Memory Chip, it also gives light to Top (Glass) of Chip and supplies power to Bottom (Ball).

Accordingly, the CSP Test handler refers to a device that transfers a chip in which a semiconductor chip is packaged so that a good / bad inspection can be carried out.

In other words, the CSP Test Handler refers to the equipment for transferring the CSP (Chip Scale Packaging).

On the other hand, Inspection means to distinguish the defects and goodness of goods rather than the characteristic test of semiconductor chips. In particular, the Inspection System includes AVI (Auto Visual Inspection) or LIS (Lead Inspection System) equipment. Are equipment for inspecting the appearance of good or bad of chip packaging.

However, unlike conventional Logic Device or Memory Device, conventional CSP Device is composed of structure that Top (Glass) should receive light and Bottom (Ball) power is supplied. When moving the ball at the bottom, not the top of the vacuum, it was difficult to achieve a complete vacuum due to the convex contact in the embossed form.

That is, until now, device ball pick-up & place does not match the flatness of device ball, so it is unstable in the formation and destruction of vacuum, causing many device disturbances. A process to clean up was added.

Therefore, the stable mounting state and stable device pick-up & place of the device is emerging.

In addition, the Illuminator for supplying lighting source to Device Glass is located at the bottom, and the tester for testing the device is also at the bottom, so Pogo Pin Type Socket / Blade at the bottom for Power and Signal Control in Device Ball. Pogo Pin / Blade was also formed on the top part, and the test was carried out using Socket / Blade. This led to an increase in material cost and damage to the device due to frequent socket / blade breakage, resulting in deterioration of device quality and an increase in socket / blade part costs.

In addition, in the case of CSP Device, a method of inspecting appearance good or bad was performed by manual inspection. This is because AVI (Auto Visual Inspection) and LIS (Lead Inspection System) could not inspect the appearance of CSP Device due to the device design.

In addition, in case of Handler in case of existing CSP Test, Accuracy is changed by moving Left / Right Contactor to Motor Teaching value in case of Contactor, which causes errors in Device Pickup / Place and Contact, which causes Handler, Socket and Kit to be damaged. As a result of this phenomenon, Handler's operation rate has been lowered and Part purchasing cost has increased.

The present invention is to solve the above-described problems, by building a plurality of characteristic inspection and inspection (Inspection) inspection that was carried out during the inspection of the good or bad of the CS element as a single automated line to significantly improve the productivity compared to the past, Inspection of the characteristics and appearance of the chip scale packaging (CSP), which is characterized by a significant improvement in economy and precise production efficiency through cost reduction by improving the pickup structure of the CS element, which has been a problem in the conventional method. It is an object of the present invention to provide a CSP inspection apparatus is formed to perform a handler (Handler) method.

In order to achieve the above object, the present invention provides a stacker (110) formed to arrange (package) a CSP element (10: CSP) formed of a glass 11 and a ball 12 in a predetermined arrangement. And, the loading unit 100 is provided with an input buffer (120: Input Buffer) for waiting to prepare the test by seating the CS 10 elements arranged on the stacker 110 in a set position; The automatic frame 210 formed at one side of the loading direction of the loading part 100 to enter the CS 10 waiting for the input buffer 120 into the test step and proceeding in one direction for the sequential testing of the CS 100: Shuttle and a plurality of pick-up arms 221 for directly picking up the upper glass 11 of the CS 10 positioned in the support 210 by vacuum are branched opposite to the center shaft 222. The contactor 220 rotates in one direction or the other direction with respect to the central shaft 222 and is formed to sequentially test the glass and the ball characteristics of the CSP, and the SPI rotated and transferred by the contactor 220. Characteristic inspection unit 200 is provided with a socket 230 is formed to test the characteristics by sending an electrical signal to the lower ball 12; The first vision unit is configured to transfer the finished CSP 10 to the set position by the frame 210 in one direction by comparing the input image with the input image and determine whether the glass 11 is damaged. (310) and the CSP 10, the inspection is completed in the first vision unit 310 one-way transfer to the set position by the frame 210, compared with the input image to determine whether the damage to the ball 12 The first sorting to divide the second vision unit 320 and the good quality CSP and defective CSP inspected through the first and second vision parts 310 and 320 into a shipping tray or a recovery tray, respectively. (330: Sorting-1) and the second sorting (340: Sorting-2) is provided with an appearance inspection unit 300; Alignment unit 400 is formed so that the inspection is completed through the characteristic inspection unit 200 and the appearance inspection unit 300 is aligned on the set plate 30; It is made up.

At this time, the contactor 220 of the characteristic inspection unit is coupled to one end of the pick-up arm 221 and connected to the vacuum pump, but the vacuum through-hole 223-1 is formed therein while the vacuum through-hole 223-11 A main body 223-1 on which the bottleneck hole 223-12 opened up and down so as to communicate vertically with the inner side of the main body 223-1, and an upper portion of the bottleneck hole 223-12 of the body 223-1 opened. A filter 223-2 coupled to the filter 223-2, and a light source transmitted from the filter 223-2, and a contact surface with the irradiation hole 223-31 so that the light source transmitted from the filter 223-2 is irradiated to the glass 11 of the CSP. A contact 223 provided with a pad 223-3 having 223-32; It is formed on the bottom of the CSP (10) for the characteristic test of the ball 12 of the CSP attached by the vacuum pad (223-3) of the contact and has a plurality of conductors so as to be energized corresponding to the ball A socket 224 made of a soft rubber; It is made up.

In this case, the pad 223-3 of the contact is preferably formed of a Ultem (Ultem).

As such, the present invention grabs and transports the CSP Device Top (Glass) when picking up and placing the CSP Device, which eliminates the problem of vacuum formation / destruction caused by catching the ball of the device. Up & Place does not damage device and improves quality.

In addition, the ball inspection is carried out while holding the device glass, and the device is placed on the shuttle and the glass is inspected.

In other words, by inspecting device damage and foreign substances, the change time that is converted to the inspection process after the test process is reduced, and the TAT is formed quickly.

In addition, there is no manpower for inspection, as well as inspection and stable device pick-up and place of CSP device, which can be used simultaneously as CSP device test handler and logic test handler.

In addition, by using the rubber type socket as the socket type used in the CSP device test, problems caused during the CSP device test are solved, which is a phenomenon in which the ball is caught when the device ball contacts the pogo pin. Blade breakage is improved, which reduces device quality and reduces the cost of socket / blade parts.

In addition, in the case of CSP Pickup / Place, in the case of Loading / Unloading Picker, the device is picked up using Ultem pad to prevent foreign substances on the device glass.

That is, in the picker of the contactor, the lighting source can be supplied to the device glass when picking up the device glass surface. In this case, the contact surface covers only the device glass image area by the cntactor picker structure named pad, and the rest is lighting. This filter is installed in the contactor picker to effectively cope with the distribution of lighting and contact the device directly to the pickup / place and socket using vacuum.

This can reduce the Index Time of the CSP Test Handler and improve the Device Test Output when the Index Time is reduced.

In addition, like Logic Test Handler and Memory Handler, Pick-up / Place the top of the device and Pick-up the device top to directly contact the socket to test the device.

Also, in case of CSP Test Handler, Accuracy is not changed because it is not a method of moving to Motor Teaching value by Rotator Turn Contactor method, so there is no error in Device Pickup / Place and Contact.

As a result, the phenomenon of Handler Socket and Kit is not broken, which increases the Handler operation rate and the cost of Part purchasing.

Next, the present invention will be described in detail with reference to the accompanying drawings.

First of all, the CSP Inspection & Test Handler, which is the technical subject of the present invention, is a concept of equipment that transfers chips for packaging semiconductor chips for good quality / failure inspection and AVI (Auto Visual Inspection) or LIS ( It is configured to perform the function of equipment of Lead Inspection System) within one equipment.

In other words, the most important parts of CSP Handler are Device Contact, Device Transfer and CSP Device Inspection.

The inspection apparatus of the present invention is largely composed of the loading unit 100, the characteristic inspection unit 200, the appearance inspection unit 300 and the alignment unit 400.

At this time, the loading unit 100 is composed of a stacker and an input buffer, the stacker 110 is a glass (11: Glass) and the ball (12: Ball) formed of a CS (10: CSP) element set arrangement It is formed to align (packaging) the furnace.
CSP is a low-power type image pickup device with a CMOS complementary metal oxide semiconductor structure. Compared to CCD charge-coupled device, it is about 1/10 of the power consumption. Used for camera phones, etc.
The packaging of these products is called Chip Scale Packaging (CSP).
Unlike other memory and logic chips, the CSP has glass on top of the chip for image formation.
Therefore, the glass acquires and transmits images through the glass, and the bottom of the chip is formed in the form of a ball or lead that can transmit electrical characteristics like other memory / logic chips.
In other words, the stacker has a device (csp) in the customer tray (automatically) in the role of the auto handler to hold the device (csp) to securely transport and seating.
Commonly referred to as an elevator stacker, when a worker places a customer tray containing a device (csp) on this elevator stacker, the elevator stacker automatically drives the motor so that the handler picker can hold the device (csp) in the customer tray. Raises vertically until Handler picker holds the customer tray in position to hold the device in a stable position (this is a normal task).

Accordingly, the input buffer 120 is formed to seat the CS 10 elements arranged on the stacker 110 to prepare for the test, while waiting to prepare for the test, it is formed to automatically reciprocate transfer in the direction of the CS element test.

On the other hand, the characteristic inspection unit 200 is largely composed of an automation frame 210, the contactor 220, the socket 230.

In this case, the automatic shuttle 210 is formed at one side of the loading unit 100 in a traveling direction to enter the CS 10 waiting for the input buffer 120 into a test step while performing a sequential test of the CS. To proceed in one direction.

In this case, the contactor 220 has a plurality of pickup arms 221 for directly picking up the upper glass 11 of the CS 10 positioned in the support 210 by vacuum based on the central shaft 222. Opposed and branched, but is rotated in one direction or the other direction with respect to the central shaft 222 and is formed to sequentially test the characteristics of the glass and the ball of the CS.

At this time, the contactor 220 of the characteristic inspection unit is coupled to one end of the pick-up arm 221 and connected to the vacuum pump, but the vacuum through-hole 223-1 is formed therein while the vacuum through-hole 223-11 A main body 223-1 on which the bottleneck hole 223-12 opened up and down so as to communicate vertically with the inner side of the main body 223-1, and an upper portion of the bottleneck hole 223-12 of the body 223-1 opened. A filter 223-2 coupled to the filter 223-2, and a light source transmitted from the filter 223-2, and a contact surface with the irradiation hole 223-31 so that the light source transmitted from the filter 223-2 is irradiated to the glass 11 of the CSP. A contact 223 provided with a pad 223-3 having 223-32; It is formed on the bottom of the CSP (10) for the characteristic test of the ball 12 of the CSP attached by the vacuum pad (223-3) of the contact and has a plurality of conductors so as to be energized corresponding to the ball A socket 224 made of a soft rubber; It is made up.

In this case, the pad 223-3 of the contact is preferably formed of a Ultem (Ultem).

At this time, the socket 230 is provided with a socket 230 is formed to test the characteristics by electrically transmitting a signal to the lower ball 12 of the CSP rotated by the contactor 220.

Thus, the visual inspection unit 230 is largely composed of the first and second vision parts and the first and second sorting parts.

At this time, the first vision unit 310 transfers the CSP 10, which has been inspected by the characteristic inspection unit 200, to the set position by the frame 210 in one direction, but compares the image with the input image and damages the glass 11. It is formed to judge.

In addition, the second vision unit 320 transfers the CSP 10, which has been inspected by the first vision unit 310, to the set position by the servo 210 in one direction, but compares the input image with the ball 12. It is formed to determine whether the damage.

At this time, the first sorting 330 (Sorting-1) and the second sorting 340 (Sorting-2) is the first or second vision unit 310, 320 through the inspection or delivery of the good or CSP CSP It is divided into recovery trays and formed to separate them.

In addition, the alignment part 400 is generally referred to as an unloading part, and the CS 10 having the inspection completed through the characteristic inspection part 200 and the appearance inspection part 300 is formed to align with the set plate 30.
Looking at this in more detail, the contactor 220 is formed to sequentially test the characteristics of the glass and the ball of the CS and the electrical signal to the lower ball 12 of the CSP rotated by the contactor 220 Characteristic inspection unit 200 is provided with a socket 230 is formed to test the characteristics to send; The first vision unit is configured to transfer the finished CSP 10 to the set position by the frame 210 in one direction by comparing the input image with the input image and determine whether the glass 11 is damaged. (310) and the CSP 10, the inspection is completed in the first vision unit 310 one-way transfer to the set position by the frame 210, compared with the input image to determine whether the damage to the ball 12 The first sorting to divide the second vision unit 320 and the good quality CSP and defective CSP inspected through the first and second vision parts 310 and 320 into a shipping tray or a recovery tray, respectively. (330: Sorting-1) and the second sorting (340: Sorting-2) is provided with an appearance inspection unit 300; Alignment unit 400 is formed so that the inspection is completed through the characteristic inspection unit 200 and the appearance inspection unit 300 is aligned on the set plate 30; In consisting of,
The characteristic tester is a tester for testing the DC / AC / Fuction test of the device (csp) and special functions (images) of the device (csp), and there are testers such as ordinary Advantester / Teradyne tester / Yokogawa Tester. In order to send and receive signals, socket (230), which is a concept of a hardware connetor that can transmit and contact the electrical signals of the tester and the device (csp), is required, and this socket is mounted in a tester (characteristic test unit). The socket contacts the electrical signal of the tester (characteristic tester) and transmits it by touching each ball (or lead) of the device (csp).
After the characteristic inspection, the appearance inspection unit 300 is a portion that inspects the appearance of the device (csp) in the appearance of cracks, scratches, distortions, skews, etc., the top and bottom of the device (csp) in the appearance inspection The inspection part is divided into two parts, and the upper inspection part 310 and the lower inspection part 320 are called the appearance inspection part 300.
When the external inspection is finished in the external inspection unit, the good and bad of the device (csp) are distinguished, and there should be a place for storing them separately. The customer tray for storing the good and bad separately is like the stacker 110 above. The part that can play the same role is needed, only the stacker 110 is a part that does not distinguish between good or bad, and has a concept of supply, but unlike the stable (110) can hold the device (csp) of the stacker 110 There is a need for a sorting unit 400 that allows a customer to distinguish between a stable fixing and a customer tray containing a good / bad device and this sorting unit 400 is a device (csp) that has already been finished working with good quality. Do not cause other failures.
Here, if the failure caused by not seating the device of the customer tray well in the alignment unit 400, the device is distorted, the device already inspected has a different appearance defects
In other words, it means that cracks, scratches, dents, and skews are caused in appearance.
In other words, our proposal allows us to inspect these defects precisely through visual inspection.

The present invention is not limited to the above-described specific preferred embodiments, and any person having ordinary skill in the art to which the present invention pertains may make various modifications without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

1 is a schematic system configuration diagram of an inspection apparatus according to the present invention,

2 is a system operation block diagram according to the present invention,

Figure 3 is a side view showing the contact point of the subject innovation,

Figure 4 is a state of use showing that the contactor of the present invention to test the characteristics of the CS element by the socket,

5 is an exemplary embodiment comparing the present invention and the conventional contactor structure.

<Brief description of symbols for the main parts of the drawings>

10 ... CSP 11 ... Glass

12 ... Ball 100 ... Loading part

110 ... stacker 120 ... input buffer (120: Input Buffer)

200 ... Characteristic inspection unit 210 ... Shuttle (210: Shuttle)

220 ... contactor 230 ... socket

300 ... external inspection unit 310, 320 ... first and second vision unit

330, 340 ... first sorting (Sorting-1), second sorting (340: Sorting-2)

400 ... Alignment

Claims (3)

Stacker 110 is formed to arrange (packing) the CSP (10: CSP) element formed of a glass (11: Glass) and a ball (12: Ball) in a predetermined arrangement, and is arranged on the stacker 110 A loading unit (100) having an input buffer (120) configured to seat the CSP 10 in a predetermined position and to prepare for a test; The automatic frame 210 formed at one side of the loading direction of the loading part 100 to enter the CS 10 waiting for the input buffer 120 into the test step and proceeding in one direction for the sequential testing of the CS 100: Shuttle and a plurality of pick-up arms 221 for directly picking up the upper glass 11 of the CS 10 positioned in the support 210 by vacuum are branched opposite to the center shaft 222. The contactor 220 rotates in one direction or the other direction with respect to the central shaft 222 and is formed to sequentially test the glass and the ball characteristics of the CSP, and the SPI rotated and transferred by the contactor 220. Characteristic inspection unit 200 is provided with a socket 230 is formed to test the characteristics by sending an electrical signal to the lower ball 12; The first vision unit is configured to transfer the finished CSP 10 to the set position by the frame 210 in one direction by comparing the input image with the input image and determine whether the glass 11 is damaged. (310) and the CSP 10, the inspection is completed in the first vision unit 310 one-way transfer to the set position by the frame 210, compared with the input image to determine whether the damage to the ball 12 First sorting to divide and separate the second vision unit 320 and the good quality CSP and defective CSP inspected through the first and second vision parts 310 and 320 into a shipping tray or a recovery tray, respectively. (330: Sorting-1) and the second sorting (340: Sorting-2) is provided with an appearance inspection unit 300; Alignment unit 400 is formed so that the inspection is completed through the characteristic inspection unit 200 and the appearance inspection unit 300 is aligned on the set plate 30; CSP inspection apparatus, characterized in that configured to perform the characteristic and appearance inspection of the CSP in a handler method. According to claim 1, wherein the contactor 220 of the characteristic inspection unit Opening up and down to be coupled to one end of the pick-up arm 221 and connected to the vacuum pump, the vacuum through-hole 223-1 is formed on the inside while communicating vertically with the inner side of the vacuum through-hole 223-11 The filter unit 223 is formed to be coupled to the upper portion of the main body 223-1, the bottleneck hole 223-12 is laid, and the light source is transmitted through the opening of the bottleneck hole 223-12 of the main body 223-1. -2 and a pad 223-3 having a contact hole 223-31 and a contact surface 223-32 therein so that the light source transmitted from the filter 223-2 is irradiated onto the glass 11 of the CSP. And contact 223 is provided; It is formed on the bottom of the CSP (10) for the characteristic test of the ball 12 of the CSP attached by the vacuum pad (223-3) of the contact and has a plurality of conductors so as to be energized corresponding to the ball A socket 224 formed of a soft rubber; CSP inspection apparatus, characterized in that configured to perform the characteristic and appearance inspection of the CSP in a handler method. The method of claim 2, wherein the contact pad (223-3) is The inspection apparatus for the CS is formed to perform the characteristic and appearance inspection of the CS in the handler method, characterized in that the material is formed of Ultem (Ultem).

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