TWI414799B - Applied to image sensing IC test classification machine (a) - Google Patents

Abstract

The present invention provides a testing and sorting machine for image sensing IC, which is configured on the machine table with a feeder device, a receiving device, a test device and a conveying device. The feeder device is used for holding the image sensing ICs to be tested. The receiving device is used for holding the image sensing ICs after testing. The test device is configured with at least a testing base, and a lamp case with a light source is configured below the testing base, and with at least one pressing arm having a probe module and a suction head, and the probe module is connected with the tester. The conveying device is configured with a first and a second conveying arm, a charge platform and a discharge platform. The image sensing ICs to be tested are picked up from the feeder device having the transparent layer facing downward. Then, the suction head of the testing device may pick up the image sensing IC to be tested and transfer to the testing base for testing operation. After completion of testing, the suction head of the testing device will transfer the tested image sensing ICs to the conveying device. The conveying device may transfer the tested image sensing ICs to the receiving device to be sorted and stored. Thus, the present invention may prevent contamination of transparent layer of image sensing IC to ensure the transparency, and may integratedly execute the testing and sorting operation, so as to realize the practical benefits of improving the test quality and the test productivity.

Description

Test classification machine applied to image sensing IC (1)

The present invention provides a test sorting machine that can ensure the light transmittance of an image sensing IC, and consistently perform test and classification operations, thereby improving test quality and test throughput.

Nowadays, the photographic devices of electronic cameras such as digital cameras and mobile phones are equipped with image sensing ICs for sensing captured images. Referring to FIG. 1, the image sensing IC 1 is connected to a plurality of contacts 111. A photosensitive wafer 12 is fixed on the substrate 11 , and a light transmissive layer 13 which is glass is fixed on the photosensitive wafer 12 . When the image light passes through the transparent layer 13 and is projected onto the photosensitive wafer 12 , the photosensitive wafer 12 is irradiated. The image light can be captured and converted into a signal signal for image signal processing; however, to ensure that the image sensing IC can accurately sense the image after the package is completed, the test operation must be performed. To eliminate the defective product, please refer to the second and third figures, which is a test device 20 of the current image sensing IC. The test device 20 is provided with a through hole 211 on the machine table 21, and is mounted above the through hole 211. The test block 22 of the bottom mask perforation 221 is further disposed below the machine table 21 and opposite to the test seat 22, and has a probe module 24 driven by the lifting mechanism 23, and the probe module 24 is provided with a plurality of probes. Pin 241 and circuit board 242, and connecting circuit board 242 The device 25 is further provided with a pick-up unit 26 for sucking the head 261 for transferring the image sensing IC 30 to be tested/finished, and a light source 271 pressing device 27 for projecting the test light. When the test operation is performed, the pick-and-place device 26 sucks the light-transmitting layer 31 of the image sensing IC 30 to be tested with the suction head 261, and transfers it to the test seat 22, and the pick-up device 26 leaves the test seat 22, and then the lower portion The pressure device 27 is displaced above the test socket 22 and pressed against the light transmissive layer 31 of the image sensing IC 30. At the same time, the lifting mechanism 23 drives the probe module 24 to rise, so that the probes of the probe module 24 are probed. The 241 contacts the contact 32 of the image sensing IC 30. When the light source 271 projects the light downward to the light transmitting layer 31 of the image sensing IC 30, the photosensitive chip 33 in the image sensing IC 30 can convert the received optical signal into a telecommunication. No., and the probe 241 is used to transmit the signal to the tester 25, and the tester 25 makes a comparison to eliminate the defective product; however, the light source 271 of the test device 20 is located above the test seat 22, resulting in pick and place. The tip 261 of the device 26 must be adsorbed to the light transmitting layer 31 of the image sensing IC 30, so that the image sensing IC 30 can be placed in the test. At 2 o'clock, the light-transmitting layer 31 is directed upward, so that the light from the light source 271 is projected into the image sensing IC 30. However, when the tip 261 of the pick-and-placer 26 is attracted to the light-transmitting layer 31 of the image sensing IC 30, it is easy to make The light transmissive layer 31 generates the impression of the tip and the dirt, thereby affecting the light transmittance, so that the photosensitive wafer 33 of the image sensing IC 30 cannot correctly capture the test light, resulting in the lack of test quality, and the suction of the test device 20 The head 261 is mounted on the pick-and-placer 26, and the probe module 24 is mounted on the lifting mechanism 23, which makes the mechanism design quite complicated and occupies the space of the machine, resulting in increased cost and disadvantages of the space configuration of the machine; The lower pressure device 27 of the light source 271 is lifted and displaced by another lifting mechanism (not shown), which also causes an increase in cost and a lack of space configuration of the machine.

A first object of the present invention is to provide a test sorting machine (1) for use in an image sensing IC, which is provided with a feeding device, a receiving device, a testing device and a conveying device, and the feeding device is used. To receive an image sensing IC to be tested, the receiving device is configured to receive a completed image sensing IC, the testing device is provided with at least one test seat, and has a light source under the test seat The light box is further provided with at least one crimping arm of the probe module and the suction head, and the probe module is connected to the tester, and the conveying device is provided with the first and second moving arms and the loading and unloading stage The image sensing IC to be tested with the light-transmitting layer facing downward is taken out at the feeding device, and the image sensing IC to be tested is taken out by the suction head of the testing device, and transferred to the test seat to perform the testing operation. After the test is completed, the nozzle of the test device transfers the measured image sensing IC to the transport device, and the transport device transfers the completed image sensing IC to the receiving device for classification and collection; thereby, It can prevent the light-transmitting layer of the image sensing IC from being dirty, so as to ensure the light transmittance and improve the test quality. Benefits.

A second object of the present invention is to provide a test sorting machine (1) for an image sensing IC, which is configured by assembling a probe module and a suction head on the same crimping arm, so that the crimping arm can drive the probe. The needle module and the tip perform signal transmission and transfer operations, and the probe module and the tip are not separately disposed on different moving arms, which not only reduces the IC, but also facilitates space configuration, thereby achieving cost-effective practical benefits.

A third object of the present invention is to provide a test sorting machine (1) for use in an image sensing IC, which is provided with a feeding device, a receiving device, a testing device and a conveying device, which are available for supply The image sensing IC of the image to be tested with the light transmission layer facing downward is taken out at the material device for the test device to take out the image sensing IC to be tested, and transferred to the test seat to perform the test operation. After the test is completed, the test device will be The completed image sensing IC is transferred to the conveying device, and the conveying device transfers the completed image sensing IC to the receiving device for sorting and storage, thereby consistently performing the receiving, testing and sorting operations. Achieve practical benefits of increasing test capacity.

In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment will be described in conjunction with the drawings, and the following is a detailed description: Referring to Figures 4 and 5, the test sorting machine of the present invention is configured on the machine 40. There are a feeding device 50, a receiving device 60, an empty device 70, a testing device 80 and a conveying device 90. The feeding device 50 is provided with at least one tray 51 for receiving a plurality of image sensing to be tested. The receiving device 60 is provided with at least one tray 61 for receiving a plurality of image sensing ICs. In this embodiment, a plurality of trays 61 are provided for receiving different The level-finished image sensing IC, such as a good image sensing IC, a secondary image sensing IC, and a defective image sensing IC, is used to house the empty tray 51 of the feeding device 50. And the empty tray 51 is placed at the receiving device 60 for receiving the measured image sensing IC. The testing device 80 is mounted on the machine 40 with at least one test stand 81 having a through hole 811. For the image sensing IC to be tested, in the embodiment, four test sockets 81 are provided on the machine 40, and the machine 40 is opposite. A through hole 41 is defined in the through hole 811 of each test socket 81, and a light box 82 with a light source 821 is fixed under the through hole 41, so that the test light of the light source 821 can be projected to the test seat via the through hole 41 and the through hole 811. In the image sensing IC of the 81, the testing device 80 is provided with at least one crimping arm. In this embodiment, a first crimping arm 83 and a second crimping arm 84 are provided, and the first crimping is performed. The arm 83 is provided with a presser 831 for axial displacement of the YZ, and a suction head 832 and a pressing block 833 are disposed on the bottom surface of the presser 831, and a probe module is disposed inside the probe module. The first probe 835 and the second probe 836 are connected to the circuit board 834. In this embodiment, a plurality of first probes 835 and a second probe 836 are disposed to respectively connect the circuits. The plurality of first probes 835 are protruded from the bottom surface of the presser 831 for contacting the contacts of the image sensing IC, and the second probes 836 are protruded from the presser 831. The test unit 100 is connected to the tester 100 for transmitting the test signal to the tester 100. In this embodiment, the machine 40 is attached to the side of the test stand 81 and corresponds to the second probe. A third probe 837 is disposed at a position of the 836. The third probe 837 can be coupled to the tester 100. When the second probe 836 is in contact with the third probe 837, the test can be performed via the third probe 837. The signal is transmitted to the tester 100. After the comparison is determined, the tester 100 transmits the test result to a central control unit (not shown), and the central control unit controls the operation of each device. The second crimp arm 84 is connected. A pressure extractor 841 for axial displacement of the YZ is provided, and a suction head 842 and a pressing block 843 are disposed on the bottom surface of the presser 841, and a probe module is disposed inside, and the probe module is provided At least one first probe 845 and at least one second probe 846 can be connected to a circuit board 844. In this embodiment, a plurality of first probes 845 and a second probe 846 are provided. The first probe 845 protrudes from the bottom surface of the presser 841 for contacting the contact of the image sensing IC, and the second probe 846 protrudes from the side of the presser 841 to be connected. The tester 100 is configured to transmit the test signal to the tester 100. In this embodiment, the machine 40 is attached to the side of the test stand 81 and corresponds to the second probe 846. A third probe 847 is disposed, and the third probe 847 can be connected to the tester 100. When the second probe 846 is in contact with the third probe 847, the test signal can be transmitted via the third probe 847. To the tester 100, the transport device 90 is provided with at least one transfer arm, and at least one stage is provided before and after the test device 80. In this embodiment, the device is provided in front of the machine 40. A transfer arm 91 and a second transfer arm 92 are disposed in front of the test device 80 with a loading stage 93 for X-axis displacement, so as to provide an X-axis displacement behind the test device 80. The discharge stage 94, wherein the first transfer arm 91 is provided with a pick-and-placer 911 capable of XYZ axial displacement, between the feeding device 50, the open device 70 and the loading platform 93. The image sensing IC to be tested is transferred, and the second moving arm 92 is provided with a pick-and-placer 921 capable of XYZ axial displacement for transferring between the discharging stage 94 and the receiving device 60. The image sensing IC, the loading stage 93 can be X-axis displacement, for carrying the image sensing IC to be tested between the first moving arm 91 and the first crimping arm 83, the discharging Loading platform 94 can be X-axis displacement for carrying the image sensing IC between the second crimping arm 84 and the second moving arm 92.

Referring to Figures 6, 7, and 8, in use, the picker 911 of the first transfer arm 91 is displaced to the feeding device 50, and is taken out from the tray 51 of the feeding device 50. The image sensing IC 110 is configured such that the light-transmitting layer 111 of the image sensing IC 110 faces downward, so that the pick-and-place 911 of the first moving arm 91 can be attached to the surface of the image sensing IC 110 with the contact 112 to prevent pick-and-place. The 911 is in contact with the light-transmitting layer 111 of the image sensing IC 110 to ensure good light transmittance of the light-transmitting layer 111, and the test quality is improved, and then the pick-and-place 911 of the first transfer arm 91 is to be tested. The image sensing IC 110 is placed on the loading stage 93. Referring to FIG. 9, the loading stage 93 carries the X-axis displacement after carrying the image sensing IC 110 to be tested, and will be tested. The image sensing IC 110 is carried under the presser 831 of the first crimping arm 83 for reclaiming; see Figures 10 and 11, the first crimping arm 83 drives the presser 831 for YZ axial direction. The displacement of the image sensing IC 110 to be tested is placed in the test socket 81, and the first probes 835 of the probe module are respectively contacted with the contacts of the image sensing IC 110. 112, and the pressure block 833 is pressed against the image sensing IC 110 to be tested, and the second probe 836 is in contact with the third probe 837, so that the second probe 836 can be connected to the tester 100 when the test is to be performed. After the image sensing IC 110 is placed in the test socket 81, the light source 821 in the light box 82 can project the test light upward, and the test light is projected through the through hole 41 of the machine 40 and the through hole 811 of the test socket 81 to be tested. The light-transmitting layer 111 of the image sensing IC 110 can ensure good light transmittance because the light-transmitting layer 111 is not dirty, so that the photosensitive wafer 113 of the image sensing IC 110 to be tested can surely sense light and light The signal is converted into a signal, and the signals are transmitted to the circuit board 834 by using the first probes 835, and then transmitted to the second probe 836 by the circuit board 834, so that the second probe 836 transmits the signal through the third probe 837. Transfer to the tester 100, the tester 100 makes an analysis and discriminate to eliminate the defective product; please refer to FIG. 12, and the loading stage of the transport device 90 is performed while the image sensing IC 110 to be tested performs the test operation. 93 has carried the next image sensing IC 120 to be tested to the second crimp arm 84. The second crimping arm 84 drives the presser 841 to perform Z-axis displacement, so that the nozzle 842 on the bottom surface of the presser 841 takes out the image sensing IC 120 to be tested on the loading stage 93; 13 and 14, since the discharge stage 94 is located on the side of the first crimping arm 83, after the image sensing IC 110 is tested, the suction head 832 of the first crimping arm 83 can be taken out on the test socket 81. The image sensing IC 110 is completed, and the YZ axial displacement is used to transfer the completed image sensing IC 110 to the discharge carrier 94. At this time, the suction head 842 of the second crimping arm 84 will be next. The image sensing IC 120 to be tested is transferred to the test socket 81 for successive execution of the test operation; please refer to FIGS. 15 and 16, the discharge carrier 94 carries the measured image sensing IC 110, and the second transfer arm The pick-and-place device 921 of 92 picks up the image sensing IC 110 on the discharging platform 94, and according to the test result, transfers the image sensing IC 110 to the receiving device 60, and puts it into the receiving device. In the tray 61 of the material device 60, the utility of the classification and storage is achieved.

Accordingly, the present invention can increase the light transmittance of the image sensing IC, and consistently perform testing and classification operations, thereby improving test quality and testing productivity, and is actually a practical and progressive design, but there is no The same products and publications are made public, so that the requirements for invention patent applications are allowed, and the application is filed according to law.

[Literature]

1. . . Image sensing IC

11. . . Substrate

111. . . contact

12. . . Photosensitive wafer

13. . . Light transmission layer

20. . . Test device

twenty one. . . Machine

211. . . Through hole

twenty two. . . Test stand

221. . . perforation

twenty three. . . Lifting mechanism

twenty four. . . Probe module

25. . . Tester

26. . . Pick and place

261. . . Tip

27. . . Presser

271. . . light source

30. . . Image sensing IC

31. . . Light transmission layer

32. . . contact

33. . . Photosensitive wafer

[this invention]

40. . . Machine

41. . . Through hole

50. . . Feeding device

51. . . Trays

60. . . Receiving device

61. . . Trays

70. . . Open device

80. . . Test device

81. . . Test stand

811. . . perforation

82. . . Light box

821. . . light source

83. . . First crimp arm

831. . . Pressure extractor

832. . . Tip

833. . . Briquetting block

834. . . Circuit board

835. . . First probe

836. . . Second probe

837. . . Third probe

84. . . Second crimp arm

841. . . Pressure extractor

842. . . Tip

843. . . Briquetting block

844. . . Circuit board

845. . . First probe

846. . . Second probe

847. . . Third probe

90. . . Conveyor

91. . . First transfer arm

911. . . Pick and place

92. . . Second transfer arm

921. . . Pick and place

93. . . Feeding platform

94. . . Discharge platform

100. . . Tester

110, 120. . . Image sensing IC

111. . . Light transmission layer

112. . . contact

113. . . Photosensitive wafer

Figure 1: Schematic diagram of a conventional image sensing IC.

Figure 2: Schematic diagram of the use of the test device for the conventional image sensing IC (1).

Figure 3: Schematic diagram of the use of the test device for the conventional image sensing IC (2).

Fig. 4 is a schematic view showing the configuration of each device of the test sorting machine of the present invention.

Figure 5: Schematic diagram of the test device of the present invention.

Figure 6: Schematic diagram of the use of the present invention (I).

Figure 7: Schematic diagram of the use of the present invention (2).

Figure 8: Schematic diagram of the use of the invention (3).

Figure 9: Schematic diagram of the use of the present invention (4).

Figure 10: Schematic diagram of the use of the present invention (5).

Figure 11: Schematic diagram of the use of the invention (vi).

Figure 12: Schematic diagram of the use of the invention (7).

Figure 13: Schematic diagram of the use of the present invention (VIII).

Figure 14: Schematic diagram of the use of the invention (9).

Figure 15: Schematic diagram of the use of the present invention (10).

Figure 16: Schematic diagram of the use of the invention (XI).

40. . . Machine

50. . . Feeding device

51. . . Trays

60. . . Receiving device

61. . . Trays

70. . . Open device

80. . . Test device

81. . . Test stand

82. . . Light box

83. . . First crimp arm

831. . . Pressure extractor

84. . . Second crimp arm

841. . . Pressure extractor

90. . . Conveyor

91. . . First transfer arm

911. . . Pick and place

92. . . Second transfer arm

921. . . Pick and place

93. . . Feeding platform

94. . . Discharge platform

Claims (10)

A test sorting machine (1) applied to an image sensing IC, comprising: a machine table; a feeding device: configured on the machine platform for receiving a plurality of image sensing ICs to be tested; and a receiving device: The device is disposed on the machine for receiving a plurality of image sensing ICs for testing; the testing device is disposed on the machine and has at least one test socket for receiving the image sensing IC to be tested. A light source for projecting test light is disposed under the test stand, and at least one probe module and a crimping arm of the suction head are provided, and the suction head of the crimping arm can move the image sensing IC into or out of the test. The probe module of the crimping arm is provided with a circuit board and a plurality of first probes for connecting the image sensing IC contacts, and the testing device is provided with a circuit board and a tester. a second probe; a conveying device: disposed on the machine table and provided with at least one moving arm, transferring the image sensing IC between the feeding device, the receiving device and the testing device, and before and after the testing device There are at least one loading stage and a discharging stage for respectively moving the image sensing IC into and out Testing means; the central control unit: system for controlling the actuation and integration of each apparatus to perform automated operations. The test sorting machine (1) for image sensing IC according to claim 1, wherein the feeding device is provided with at least one tray for receiving a plurality of image sensing to be tested. IC. According to the test classification machine (1) for image sensing IC according to claim 1, wherein the receiving device is provided with a plurality of trays for bearing the image sense of different test results. Test IC. According to the test classification machine (1) of the image sensing IC according to claim 1, wherein the second probe of the testing device is disposed on the probe module, and the second probe is The protrusion protrudes from the side of the presser to connect the tester. The test sorting machine (1) applied to the image sensing IC according to the fourth aspect of the patent application, wherein the test device is disposed on the side of the test seat and has a third probe corresponding to the position of the second probe The third probe is coupled to the tester. The test sorting machine (1) applied to the image sensing IC according to the first aspect of the patent application, wherein the machine is provided with a through hole under the test seat of the test device, and the bottom surface of the test seat of the test device is A perforation is provided, and a light box with a light source is fixed under the through hole of the machine and corresponding to the position of the test seat. The test sorting machine (1) for image sensing IC according to claim 1, wherein the test device is provided with a first crimping arm and a second crimping arm for transferring image sense Test IC. According to the test classification machine (1) for image sensing IC according to claim 7, wherein the first crimping arm is provided with a presser capable of YZ axial displacement, and is pressed The bottom surface of the device is provided with a suction head and a pressure block, and a probe module is arranged inside. The test sorting machine (1) applied to the image sensing IC according to the seventh aspect of the patent application, wherein the second crimping arm of the testing device is provided with a presser capable of YZ axial displacement, and A suction head and a pressing block are arranged on the bottom surface of the presser, and a probe module is arranged inside. According to the test classification machine (1) for image sensing IC according to claim 1, wherein the conveying device is provided with a first moving arm, a second moving arm and a feeding stage and a loading stage, the first moving arm is provided with a pick-up device capable of XYZ axial displacement, and is used for transferring the image sensing IC to be tested between the feeding device and the loading stage, the second shifting The material arm is provided with a pick-and-place device capable of XYZ axial displacement, and is used for transferring the image sensing IC between the discharging stage and the receiving device, and at least one feeding material is provided in front of the testing device. The stage is configured to carry the image sensing IC to be tested, and at least one discharging stage is disposed behind the testing device for carrying the measured image sensing IC.