CN105572437A - Electronic component test device and applied test equipment thereof - Google Patents
Electronic component test device and applied test equipment thereof Download PDFInfo
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- CN105572437A CN105572437A CN201410547358.6A CN201410547358A CN105572437A CN 105572437 A CN105572437 A CN 105572437A CN 201410547358 A CN201410547358 A CN 201410547358A CN 105572437 A CN105572437 A CN 105572437A
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Abstract
An electronic component test device comprises a temperature control mechanism and a test mechanism. The temperature control mechanism is provided with at least one temperature controller outputting a high temperature or low temperature test temperature. One side of the temperature controller is assembled with a loader. At least one temperature guiding component is arranged in the loader. At least one conduction component is connected between the temperature guiding component and the temperature controller so that the test temperature of the temperature controller is guided to the temperature guiding component. The test mechanism is provided with at least one bearing component bearing an electronic component and is provided with at least one transmission component connecting a circuit board. The transmission component is inserted into the temperature guiding component of the temperature control mechanism so that the temperature guiding component conducts the high temperature or low temperature test temperature via a circumferential side of the transmission component. A distance for the transmission component to conduct the test temperature to the electronic component is shortened. When the transmission component is contacted with an electrical contact point of the electronic component, the electronic component is kept in a preset test temperature scope to execute test working so that a practical benefit of increasing test quality is reached.
Description
Technical field
The invention provides a kind of can by the Transmission Part week side transmission high-temp or low-temperature test temperature of mechanism for testing, and shorten the distance that probe temperature is conducted to electronic package by Transmission Part, when the electrical contact of Transmission Part contact electronic package, and guarantee that electronic package performs test jobs in default Range of measuring temp, and then promote the electronic assembly test device of test mass.
Background technology
Now, electronic package is applied to distinct electronic apparatuses, and the environment residing for electronic equipment may be low temperature environment or hot environment, for guaranteeing the service property (quality) of electronic package, after electronic package completes, cold survey operation or heat survey operation must be carried out to electronic package, for the image sensing electronic package of tool photosensitive-member (as CMOS), refer to Fig. 1, the one side of this image sensing electronic package 11 has the photosensitive-member 111 that can be glass material, another side then has multiple electrical contact that can be tin ball 112, because the photosensitive-member 111 of image sensing electronic package 11 because of process problems own or applied environment temperature, photosensitive exception can occur, such as shiny red is mistaken for pale red, image sensing electronic package 11 therefore must be made to lower the temperature or be warming up to emulation testing processing temperature and carry out cold survey operation or heat survey operation, so current dealer is in time testing the electronic package that can compress for large area, compress electronic package with the device that compresses of tool temperature control assembly there is the large-area one side one side of tin ball (namely do not have), electronic package is heated up or cooling, to perform test jobs in default Range of measuring temp, but because image sensing electronic package 11 does not have an one side of tin ball 112, there is the photosensitive-member 111 that can not compress, dealer also cannot utilize and compresses device and compress photosensitive-member 111 and make bump contact conduction test temperature, so that dealer must utilize the mode of pre-temperature image sensing electronic package 11 to carry out test jobs.
Refer to Fig. 2, Fig. 3, for the testing apparatus schematic diagram of image sensing electronic package 11, this testing apparatus is configured with supply disk 13 on board 12, rewinding dish 14, Material moving device 15, heating plate 16 and mechanism for testing 17, this Material moving device 15 takes out image sensing electronic package 11 to be measured in supply disk 13, and transfer load to heating plate 16, namely this heating plate 16 carries out intensification operation to image sensing electronic package 11 to be measured, image sensing electronic package 11 to be measured is preheated to probe temperature, this Material moving device 15 takes out the image sensing electronic package 11 of preheating again in heating plate 16, and transfer load to the test bench 171 of mechanism for testing 17, make the photosensitive-member 111 of image sensing electronic package 11 upward, and make the probe 172 of tin ball 112 engaged test seat 171 down, mechanism for testing 17 utilizes light source 173 irradiate the photosensitive-member 111 of image sensing electronic package 11 and perform test jobs, after completing test jobs, Material moving device 15 takes out in the test bench 171 of mechanism for testing 17 the image sensing electronic package 11 surveyed, and transfer load to rewinding dish 14 and retract, but though this testing apparatus utilizes heating plate 16 preheating image sensing electronic package 11, but the image sensing electronic package 11 of preheating transfers load in the stroke of test bench 171 of mechanism for testing 17 by Material moving device 15, easy generation image sensing electronic package 11 is lowered the temperature gradually, so that when image sensing electronic package 11 is placed in the test bench 171 of mechanism for testing 17, and default probe temperature cannot be held in and perform test jobs, carry out affecting test mass.
If dealer cannot be heated up by pressurized based on the photosensitive-member 111 of image sensing electronic package 11, and for heating up to the end heat of probe 172, to utilize probe 172, high temperature is conducted to tin ball 112, image sensing electronic package 11 is made to heat up and perform test jobs, but probe 172 length of mechanism for testing 17 is longer, when high temperature being conducted to the other end by one end of probe 172, its heat passes distance and easy heat radiation is lowered the temperature, so that image sensing electronic package 11 cannot be made to be held in default probe temperature and to perform test jobs, carry out affecting test mass.
Summary of the invention
One of order of the present invention, be to provide a kind of electronic assembly test device, comprise temperature control mechanism and mechanism for testing, this temperature control mechanism is provided with the temperature controller of at least one output high temperature or low-temperature test temperature, one side of this temperature controller is equipped with carrier, the inside of this carrier is provided with at least onely leads warm part, this is led warm part and is then connected at least one conducting piece with between temperature controller, warm part is led to be conducted to by the probe temperature of temperature controller, this mechanism for testing is provided with the bearing parts of at least one bearing electronic package, and be provided with the Transmission Part of at least one connecting circuit board, this Transmission Part be inserted in temperature control mechanism lead warm part, make to lead all side transmission high-temp of warm part by Transmission Part or the probe temperature of low temperature, and shorten the distance that probe temperature is conducted to electronic package by Transmission Part, with when the electrical contact of Transmission Part contact electronic package, and guarantee that electronic package performs test jobs in default Range of measuring temp, reach the Practical Benefit promoting test mass.
Order two of the present invention, be to provide a kind of electronic assembly test device, wherein, it is soft cushion body that this temperature control mechanism at least one leads warm part, and offer at least one connection air extractor and for sucker pick and place parts, can utilize and lead warm part and compress and fit in the one side that electronic package has electrical contact, order is led between warm part and electronic package and is kept being sealed, the parts that pick and place of leading warm part are not only made really to draw transfer electronic package, also increase temperature conduction contact area and promote conductive performance, reaching the Practical Benefit promoting ease of use.
Order three of the present invention, a kind of electronic assembly test device is provided, wherein, this temperature control mechanism lead warm part in the stroke of transfer electronic package, namely to the probe temperature of electronic package transmission high-temp or low temperature, be placed in mechanism for testing to shorten electronic package the activity duration heating up or be cooled to default probe temperature, make electronic package perform test jobs rapidly, reach the Practical Benefit promoting tested productivity.
Order four of the present invention, be to provide a kind of testing apparatus of applying electronic component test device, it is configured with feeding device on board, material collecting device, proving installation, conveying device and central control unit, this feeding device is in order to hold at least one electronic package to be measured, this material collecting device is in order to hold at least one electronic package surveyed, this proving installation is provided with mechanism for testing and temperature control mechanism, this mechanism for testing is in order to test electronic package, this temperature control mechanism system makes electronic package be held in default Range of measuring temp and performs test jobs, this conveying device is provided with at least one Material moving device, in order to transfer object, this central control unit is in order to control and to integrate each device start, and perform automated job, reach the Practical Benefit promoting work production usefulness.
For reaching above-mentioned purpose, the present invention proposes a kind of electronic assembly test device, comprises:
Temperature control mechanism: the temperature controller being provided with at least one output high temperature or low-temperature test temperature, and be equipped with in a side of this temperature controller and at least onely lead warm part, this leads warm part for conducting the probe temperature of this temperature controller;
Mechanism for testing: the bearing parts being provided with at least one bearing electronic package, and be provided with the circuit board of at least one Transmission Part of tool, this Transmission Part be inserted in this temperature control mechanism lead warm part, the all side conduction test temperature of warm part by this Transmission Part is led to make this, when this Transmission Part contacts the electrical contact of this electronic package, this electronic package is made to remain on default Range of measuring temp.
According to the electronic assembly test device that the present invention proposes, this temperature control mechanism is equipped with at least one carrier in a side of this temperature controller, and this carrier is equiped with this and at least onely leads warm part, and this is led between warm part with this temperature controller and is then connected at least one conducting piece.
According to the electronic assembly test device that the present invention proposes, the carrier of this temperature control mechanism is provided with the first bearing part and the second bearing part, to connect this temperature controller respectively and this leads warm part, separately offer first and second jack in this first and second bearing part, plant for this conducting piece.
According to the electronic assembly test device that the present invention proposes, this temperature control mechanism is equiped with first in this carrier and leads warm part and second and lead warm part, this first is led warm part and is provided with at least one first through hole for placing this conducting piece, this conducting piece then connects this and second leads warm part, separately lead warm part in this first and second and be provided with first and second perforation at least one, for assembling this mechanism for testing Transmission Part, make this first and second lead all side conduction test temperature of warm part by this Transmission Part.
According to the electronic assembly test device that the present invention proposes, this temperature control mechanism is provided with the 3rd in this second below of leading warm part and leads warm part, 3rd leads warm part is provided with at least one 3rd perforation, for the Transmission Part of this mechanism for testing of assembling, the 3rd is made to lead all side conduction test temperature of warm part by this Transmission Part.
According to the electronic assembly test device that the present invention proposes, the 3rd of this temperature control mechanism lead warm part offer at least one pick and place electronic package pick and place parts.
According to the electronic assembly test device that the present invention proposes, this temperature control mechanism at least one lead warm part be provided with pick and place electronic package pick and place parts.
According to the electronic assembly test device that the present invention proposes, this proving installation is provided with driving mechanism, and this driving mechanism is provided with at least one driver, does at least one party to displacement to drive this temperature control mechanism or this mechanism for testing.
According to the electronic assembly test device that the present invention proposes, this mechanism for testing is provided with the light source of at least one test, with throw light to electronic package.
The present invention also proposes a kind of testing apparatus of applying electronic component test device, comprises:
Board;
Feeding device: be assemblied in this board, and be provided with at least one feeding machanism, in order to accommodating electronic package to be measured;
Material collecting device: be assemblied in this board, and be provided with at least one receiving mechanism, in order to the accommodating electronic package surveyed;
At least one according to the electronic assembly test device described in claim 1;
Conveying device: be assemblied in this board, and be provided with at least one Material moving device, in order to transfer electronic package;
Central control unit: in order to control and to integrate each device start, to perform automated job.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of existing image sensing electronic package.
Fig. 2 is the schematic diagram of existing electronic assembly test equipment.
Fig. 3 is the use schematic diagram of existing mechanism for testing.
Fig. 4 is the parts explosion of proving installation first embodiment of the present invention.
Fig. 5 is the assembling view of proving installation first embodiment of the present invention.
Fig. 6 is the use schematic diagram () of proving installation first embodiment of the present invention.
Fig. 7 is the use schematic diagram (two) of proving installation first embodiment of the present invention.
Fig. 8 is the use schematic diagram (three) of proving installation first embodiment of the present invention.
Fig. 9 is the assembling view of proving installation second embodiment of the present invention.
Figure 10 is the use schematic diagram () of proving installation second embodiment of the present invention.
Figure 11 is the use schematic diagram (two) of proving installation second embodiment of the present invention.
Figure 12 is the use schematic diagram (three) of proving installation second embodiment of the present invention.
Figure 13 is the schematic diagram that proving installation first embodiment of the present invention is applied to testing apparatus.
Description of reference numerals:
Prior art: 11-image sensing electronic package; 111-photosensitive-member; 112-tin ball; 12-board; 13-supply disk; 14-rewinding dish; 15-Material moving device; 16-heating plate; 17-mechanism for testing; 171-test bench; 172-probe; 173-light source.
The present invention: 20-proving installation; 21-temperature control mechanism; 21A-first temperature control mechanism; 21B-second temperature control mechanism; 211-temperature controller; 2111-conducting piece; 212-temperature control assembly; 213-first bearing part; 2131-first jack; 214-second bearing part; 2141-second jack; 215-first leads warm part; 2151-first through hole; 2152-first bores a hole; 216-picks and places parts; 217-second leads warm part; 2171-second bores a hole; 218-the 3rd leads warm part; 2181-the 3rd bores a hole; 2182-picks and places parts; 22-mechanism for testing; 221-bearing; 2211-bearing parts; 2212-holding part; 222-light source; 223-first circuit board; 2231-parts in electrical contact; 224-first Transmission Part; 225-second Transmission Part; 226-second circuit board; 23-driving mechanism; 231-driver; 23A-first driving mechanism; 23B-second driving mechanism; 30-image sensing electronic package; 31-photosensitive-member; 32-tin ball; 40-board; 50-feeding device; 60-material collecting device; 70-conveying device; 71-input end Material moving device; 72-first feed microscope carrier; 73-second feed microscope carrier; 74-first rewinding microscope carrier; 75-second rewinding microscope carrier; 76-output terminal Material moving device.
Embodiment
In order to be further described the present invention, hereby lift a preferred embodiment and coordinating graphic, describing in detail as rear:
Refer to Fig. 4, Fig. 5, for the first embodiment of proving installation 20 of the present invention, this proving installation 20 comprises temperature control mechanism 21 and mechanism for testing 22, this temperature control mechanism 21 is provided with the temperature controller 211 of at least one output high temperature or low-temperature test temperature, further, this temperature controller 211 can in mounted inside temperature control assembly (as cooling chip or well heater etc.), also or connect outside low-temperature receiver/heat source accommodation device, temperature controller 211 is made to export the probe temperature of high temperature or low temperature, in the present embodiment, the inside of this temperature controller 211 is provided with temperature control assembly 212 (as cooling chip), to export low-temperature test temperature, another temperature control mechanism 21 is equipped with in a side of temperature controller 211 and at least onely leads warm part, this leads the probe temperature that warm part conducts this temperature controller 211, further, this temperature controller 211 and lead between warm part and be provided with carrier, in the present embodiment, this carrier has the first bearing part 213 and the second bearing part 214, this is first years old, two bearing parts 213, 214 with non-conductive, the plastic of not leading temperature is made, and offer first respectively, two jacks 2131, 2141, this carrier is with the first bearing part 213 junction temperatures controller 211, and be equiped with non-conductive in the inside of the second bearing part 214, lead temperature first leads warm part 215 (as thermal grease), first to lead warm part 215 be provided with multiple first through hole 2151 and the first perforation 2152, separately leading warm part 215 in first is connected at least one conducting piece with between temperature controller 211, so that the high temperature of temperature controller 211 or Conduction At Low Temperature to the first are led warm part 215, in the present embodiment, multiple conducting piece 2111 is provided with in the bottom surface of temperature controller 211, multiple conducting piece 2111 is inserted in first, two bearing parts 213, 214 first, two jacks 2131, 2141 and first first through holes 2151 of leading warm part 215, warm part 215 is led with the low-temperature test temperature conduction to the first exported by temperature controller 211, again this proving installation 20 can in temperature control mechanism 21 at least one lead warm part be provided with pick and place electronic package pick and place parts, also or configuration one independent Material moving device, to pick and place transfer electronic package, in the present embodiment, what be provided with connection air extractor (scheming not shown) in the first below of leading warm part 215 picks and places parts 216, to pick and place electronic package (as image sensing electronic package), mechanism for testing 22 is provided with the bearing parts of at least one bearing electronic package, further, these bearing parts can be arranged at board or an independent pedestal, in the present embodiment, the bearing parts 2211 of bearing electronic package are provided with in a bearing 221, and the holding part 2212 communicated is offered in the below of bearing parts 2211, the light source 222 of the accommodating test of this holding part 2212, this mechanism for testing 22 another is provided with the circuit board of at least one Transmission Part of tool, in order to test electronic package, in the present embodiment, the first circuit board 223 of electric property contact component 2231 is provided with in bearing 221, this first circuit board 223 is electrically connected a tester (scheming not shown), the first perforation 2152 separately leading warm part 215 in first is plugged with branched the first Transmission Part 224 and the second Transmission Part 225 that can be probe, warm part 215 is led by the first Transmission Part 224 and all sides transmission high-temp of the second Transmission Part 225 or the probe temperature of low temperature to make first, the two ends of each first Transmission Part 224 and the second Transmission Part 225 protrude out first respectively and lead warm part 215, one end of first Transmission Part 224 is in order to contact the electrical contact (as tin ball) of electronic package, the other end is then electrically connected one and is assemblied in second circuit board 226 on the first bearing part 213, one end of second Transmission Part 225 is electrically connected second circuit board 226, the other end is then in order to be electrically connected the parts in electrical contact 2231 of first circuit board 223, this proving installation 20 another is provided with and temperature control mechanism 21 or mechanism for testing 22 can be driven to make the driving mechanism 23 of at least one party to displacement, this driving mechanism 23 is provided with at least one driver, at least one party is done to displacement to drive temperature control mechanism 21 or mechanism for testing 22, in the present embodiment, this driving mechanism 23 is provided with work first, two directions are (as Y, Z-direction) driver 231 of displacement, this driver 231 drives the temperature controller 211 of temperature control mechanism 21 to do first, two direction displacements.
Refer to Fig. 6, proving installation 20 of the present invention can be applied and perform low-temperature test operation to image sensing electronic package 30, and this image sensing electronic package 30 is provided with photosensitive-member 31 in one side, and another side is provided with the electrical contact that can be tin ball 32, this proving installation 20 drives temperature controller 211 with the driver 231 of driving mechanism 23, first leads warm part 215 and picks and places the works first such as parts 216, two directions are moved to pan feeding microscope carrier (the scheming not shown) place that has image sensing electronic package 30 to be measured, the photosensitive-member 31 of this image sensing electronic package 30 to be measured downward, and namely the parts 216 that pick and place of temperature control mechanism 21 are adsorbed in image sensing electronic package 30 to be measured and have the one side of tin ball 32 upward, and make the first Transmission Part 224 of mechanism for testing 22 contact tin ball 32, temperature controller 211 due to temperature control mechanism 21 utilizes temperature control assembly 212 and has the probe temperature of low temperature, namely low-temperature test temperature conduction to the first is led warm part 215 with conducting piece 2111 by this temperature controller 211, because first leads all sides that warm part 215 is coated on the first Transmission Part 224 and the second Transmission Part 225, make first to lead warm part 215 and can conduct low-temperature test temperature by all sides of the first Transmission Part 224 and the second Transmission Part 225, the first Transmission Part 224 and the second Transmission Part 225 is made namely to input low-temperature test temperature in all sides, and then distance and the time that the first Transmission Part 224 and the second Transmission Part 225 conduct low-temperature test temperature can be shortened, effectively to reduce low temperature loss, make the first Transmission Part 224 rapidly by low-temperature test temperature conduction to the tin ball 32 of image sensing electronic package 30, make temperature control mechanism 21 in the stroke of transfer image sensing electronic package 30 to be measured, image sensing electronic package 30 to be measured can be made to be held in low-temperature test temperature, cooling is just started after need not inserting bearing 221 in image sensing electronic package 30 to be measured, and effectively shorten the temperature fall time of image sensing electronic package 30 to be measured, then the driver 231 of this driving mechanism 23 drives temperature controller 211, pick and place parts 216 and do first direction displacement, image sensing electronic package 30 to be measured is transferred load to the top of bearing 221.
Refer to Fig. 7, the driver 231 of this driving mechanism 23 drives temperature controller 211, pick and place parts 216 and second direction displacement done by image sensing electronic package 30 etc. to be measured, image sensing electronic package 30 to be measured is placed on the bearing parts 2211 of bearing 221, and make the second Transmission Part 225 of mechanism for testing 22 contact parts in electrical contact 2231 on first circuit board 223, the photosensitive-member 31 of image sensing electronic package 30 to be measured then corresponds to light source 222, because first of temperature control mechanism 21 leads all sides that low-temperature test temperature have been conducted to the first Transmission Part 224 by warm part 215, low-temperature test temperature is conducted to rapidly the tin ball 32 of image sensing electronic package 30 by the first Transmission Part 224 again by all sides, and then under making image sensing electronic package 30 to be measured be in rapidly default low-temperature test state, when light to be exposed to the photosensitive-member 31 of image sensing electronic package 30 to be measured by the light source 222 of mechanism for testing 22, this image sensing electronic package 30 to be measured can emulate and carry out cold survey operation under low temperature environment, photoreceptor signal is also transferred to the first Transmission Part 224 through tin ball 32 by image sensing electronic package 30 to be measured, photoreceptor signal is transferred to the second Transmission Part 225 via second circuit board 226 by the first Transmission Part 224, photoreceptor signal is transferred to tester via first circuit board 223 and does a differentiation by the second Transmission Part 225 again, test result is then transferred to central control unit (scheming not shown) by tester.
Refer to Fig. 8, after completing test jobs, the driver 231 of driving mechanism 23 drives temperature controller 211, picks and places parts 216 and surveyed image sensing electronic package 30 etc. does second direction displacement, order picks and places the bearing parts 2211 that the image sensing electronic package 30 surveyed is shifted out bearing 221 by parts 216, and make the second Transmission Part 225 depart from first circuit board 223, and then the image sensing electronic package 30 surveyed is transferred load to discharging microscope carrier (scheming not shown) to export.
Refer to Fig. 9, for the second embodiment of proving installation 20 of the present invention, this proving installation 20 comprises temperature control mechanism 21, mechanism for testing 22 and driving mechanism 23, this temperature control mechanism 21 is provided with the temperature controller 211 of at least one output high temperature or low-temperature test temperature, the inside of this temperature controller 211 is provided with temperature control assembly 212, with the probe temperature making temperature controller 211 have high temperature or low temperature, one side's assembling carrier of this temperature controller 211 another, this carrier has the first bearing part 213 and the second bearing part 214, this is first years old, two bearing parts 213, 214 with non-conductive, the plastic of not leading temperature is made, and offer first respectively, two jacks 2131, 2141, this carrier is with the first bearing part 213 junction temperatures controller 211, and be equiped with non-conductive in the second bearing part 214, lead temperature first leads warm part 215 and second and leads warm part 217, first leads warm part 215 can be thermal grease, and be provided with multiple first through hole 2151 and the first perforation 2152, second leads warm part 217 can make by ceramic material, and be assemblied in the below that first leads warm part 215, and offer multiple second perforation 2171 in the corresponding first first perforation 2152 positions of leading warm part 215, this second below of leading warm part 217 is then provided with the 3rd and leads warm part 218 again, 3rd leads warm part 218 with non-conductive, lead temperature and made by soft material, and offer multiple 3rd perforation 2181 in the corresponding second second perforation 2171 positions of leading warm part 217, another offer in the 3rd inside of leading warm part 218 multiple can be sucker pick and place parts 2182, pick and place parts 2182 and connect air extractor (scheming not shown), to pick and place electronic package (as image sensing electronic package), multiple conducting piece 2111 of leading temperature is separately provided with in the bottom surface of temperature controller 211, multiple conducting piece 2111 is inserted in first, two bearing parts 213, 214 first, two jacks 2131, 2141 and first first through holes 2151 of leading warm part 215, and connect second and lead warm part 217, warm part 217 is led so that the low-temperature test temperature conduction to the first of temperature controller 211 is led warm part 215 and second, second leads warm part 217 leads warm part 218 by low-temperature test temperature conduction to the 3rd again, this mechanism for testing 22 is provided with bearing 221, bearing 221 is provided with the bearing parts 2211 of bearing electronic package, and the holding part 2212 communicated is offered in the below of bearing parts 2211, this holding part 2212 is equipped with the light source 222 of test, this mechanism for testing 22 another is provided with the first circuit board 223 of electric property contact component 2231 in bearing 221, this first circuit board 223 is electrically connected a tester (scheming not shown), separately in first of temperature control mechanism 22, two, three lead warm part 215, 217, 218 first, two, three perforation 2152, 2171, 2181 have placed branched first Transmission Part 224 and the second Transmission Part 225, to make first, two, three lead warm part 215, 217, 218 by the first Transmission Part 224 and all sides transmission high-temp of the second Transmission Part 225 or the probe temperature of low temperature, and effectively increases the area of contact transition temperature, so that quicker by the low-temperature test temperature conduction to the first of temperature controller 211, two Transmission Parts 224, 225, the two ends of each first Transmission Part 224 and the second Transmission Part 225 protrude out first and lead warm part 215 and the 3rd and lead warm part 218, one end of first Transmission Part 224 is in order to contact the electrical contact of electronic package, the other end is then electrically connected one and is assemblied in second circuit board 226 on the first bearing part 213, one end of second Transmission Part 225 is electrically connected second circuit board 226, the other end is then in order to be electrically connected the parts in electrical contact 2231 of first circuit board 223, and separately the driving mechanism 23 of this proving installation 20 is provided with work first, two directions are (as Y, Z-direction) driver 231 of displacement, this driver 231 drives the temperature controller 211 of temperature control mechanism 21 to do first, two direction displacements.
Refer to Figure 10, in time performing the cold survey operation of image sensing electronic package 30, the driver 231 of this driving mechanism 23 drives temperature controller 211, first leads warm part 215 and picks and places the works first such as parts 2182, two directions are moved to a pan feeding microscope carrier (scheming not shown) place, and make the 3rd to lead warm part 218 to be pressed against image sensing electronic package 30 and to have in the one side of tin ball 32, and order picks and places the one side that parts 2182 adhere on image sensing electronic package 30, because the 3rd leads warm part 218 for soft cushion body, and can coated tin ball 32, and adhere in the one side of image sensing electronic package 30, not only can increase the area of contact transition temperature, and can vacuum breaker be prevented, make to pick and place parts 2182 and really take out image sensing electronic package 30 to be measured, and make the tin ball 32 of the first Transmission Part 224 contact measured image sensing electronic package 30, temperature controller 211 due to temperature control mechanism 21 utilizes conducting piece 2111 low-temperature test temperature conduction to the first to be led warm part 215 and second and leads warm part 217, second leads warm part 217 leads warm part 218 by low-temperature test temperature conduction to the 3rd again, due to first, two, three lead warm part 215, 217, the 218 all sides being coated on the first Transmission Part 224, and the area of contact transition temperature can be increased, make first, two, three lead warm part 215, 217, 218 conduct rapidly low-temperature test temperature by all sides of the first Transmission Part 224, and more shorten distance and the time that the first Transmission Part 224 conducts low-temperature test temperature, effectively to reduce low temperature loss, make the first Transmission Part 224 rapidly by low-temperature test temperature conduction to the tin ball 32 of image sensing electronic package 30, make temperature control mechanism 21 in the stroke of transfer image sensing electronic package 30 to be measured, namely low-temperature test temperature is inputted to image sensing electronic package 30 to be measured, to shorten the activity duration of image sensing electronic package 30, and then the driver 231 of this driving mechanism 23 drives temperature controller 211, pick and place parts 2182 and do first direction displacement, image sensing electronic package 30 to be measured is transferred load to the top of bearing 221.
Refer to Figure 11, driver 231 drive of this driving mechanism 23 picks and places parts 2182 and second direction displacement done by image sensing electronic package 30 etc. to be measured, image sensing electronic package 30 to be measured is placed on the bearing parts 2211 of bearing 221, and make the second Transmission Part 225 of mechanism for testing 22 contact parts in electrical contact 2231 on first circuit board 223, the photosensitive-member 31 of image sensing electronic package 30 to be measured then corresponds to light source 222, first of temperature control mechanism 21, two, three lead warm part 215, 217, 218 by all sides of low-temperature test temperature conduction to the first Transmission Part 224, low-temperature test temperature is conducted to rapidly the tin ball 32 of image sensing electronic package 30 by the first Transmission Part 224 again by all sides, and then under making image sensing electronic package 30 to be measured be in rapidly default low-temperature test state, when light to be exposed to the photosensitive-member 31 of image sensing electronic package 30 to be measured by the light source 222 of mechanism for testing 22, this image sensing electronic package 30 to be measured can emulate and carry out cold survey operation under low temperature environment, photoreceptor signal is also transferred to the first Transmission Part 224 through tin ball 32 by image sensing electronic package 30 to be measured, photoreceptor signal is transferred to the second Transmission Part 225 via second circuit board 226 by the first Transmission Part 224, photoreceptor signal is transferred to tester via first circuit board 223 and does a differentiation by the second Transmission Part 225 again, test result is then transferred to central control unit (scheming not shown) by tester.
Refer to Figure 12, after completing test jobs, the driver 231 of driving mechanism 23 drives temperature controller 211, picks and places parts 2182 and surveyed image sensing electronic package 30 etc. does second direction displacement, what make the 3rd to lead warm part 218 picks and places the bearing parts 2211 that the image sensing electronic package 30 surveyed is shifted out bearing 221 by parts 2182, and make the second Transmission Part 225 depart from first circuit board 223, and then the image sensing electronic package 30 surveyed is transferred load to discharging microscope carrier (scheming not shown) to export.
Refer to Figure 13, proving installation 20 of the present invention can be applicable to testing apparatus, this testing apparatus is configured with feeding device 50, material collecting device 60, proving installation 20, conveying device 70 and central control unit (scheming not shown) on board 40, this feeding device 50 is assemblied in board 40, and be provided with at least one feeding machanism, in order to hold at least one electronic package to be measured, this material collecting device 60 is assemblied in board 40, and is provided with at least one receiving mechanism, in order to hold at least one electronic package surveyed, this proving installation 20 is assemblied in board 40, and be provided with the first temperature control mechanism 21A, the second temperature control mechanism 21B and mechanism for testing 22 and the first driving mechanism 23A, the second driving mechanism 23B, first and second temperature control mechanism 21A, 21B are identical above-mentioned temperature control mechanisms 21, be held in default Range of measuring temp in order to make electronic package, this mechanism for testing 22 is in order to test electronic package, first and second driving mechanism 23A, 23B are identical above-mentioned driving mechanisms 23, do at least one party to displacement in order to drive first and second temperature control mechanism 21A, 21B, this conveying device 70 is provided with input end Material moving device 71, in order to the electronic package to be measured at feeding device 50 place to be delivered to respectively the first feed microscope carrier 72 and the second feed microscope carrier 73, electronic package to be measured is carried to proving installation 20 by the first feed microscope carrier 72 and the second feed microscope carrier 73 respectively, electronic package to be measured is taken out for the first temperature control mechanism 21A and the second temperature control mechanism 21B, and be carried to mechanism for testing 22 and perform test jobs, this conveying device 70 another is provided with the first rewinding microscope carrier 74 and the second rewinding microscope carrier 75, movable to proving installation 20, to carry the electronic package of survey that the first temperature control mechanism 21A and the second temperature control mechanism 21B inserts respectively, and set out proving installation 20, this conveying device 70 is provided with output terminal Material moving device 76, be used to the first rewinding microscope carrier 74 or the second rewinding microscope carrier 75 take out survey electronic package, and according to test result, material collecting device 60 sorting placement is delivered to by surveying electronic package, this central control unit is in order to control and to integrate each device start, to perform automated job, reach the Practical Benefit promoting operational efficiency.
More than illustrate just illustrative for the purpose of the present invention, and nonrestrictive, and those of ordinary skill in the art understand; when not departing from the spirit and scope that claims of the present invention limit, many amendments can be made, change; or equivalence, but all will fall within the scope of protection of the present invention.
Claims (10)
1. an electronic assembly test device, is characterized in that, comprises:
Temperature control mechanism: the temperature controller being provided with at least one output high temperature or low-temperature test temperature, and be equipped with in a side of this temperature controller and at least onely lead warm part, this leads warm part for conducting the probe temperature of this temperature controller;
Mechanism for testing: the bearing parts being provided with at least one bearing electronic package, and be provided with the circuit board of at least one Transmission Part of tool, this Transmission Part be inserted in this temperature control mechanism lead warm part, the all side conduction test temperature of warm part by this Transmission Part is led to make this, when this Transmission Part contacts the electrical contact of this electronic package, this electronic package is made to remain on default Range of measuring temp.
2. electronic assembly test device according to claim 1, it is characterized in that, this temperature control mechanism is equipped with at least one carrier in a side of this temperature controller, and this carrier is equiped with this and at least onely leads warm part, and this is led between warm part with this temperature controller and is then connected at least one conducting piece.
3. electronic assembly test device according to claim 2, it is characterized in that, the carrier of this temperature control mechanism is provided with the first bearing part and the second bearing part, to connect this temperature controller respectively and this leads warm part, separately offer first and second jack in this first and second bearing part, plant for this conducting piece.
4. electronic assembly test device according to claim 2, it is characterized in that, this temperature control mechanism is equiped with first in this carrier and leads warm part and second and lead warm part, this first is led warm part and is provided with at least one first through hole for placing this conducting piece, this conducting piece then connects this and second leads warm part, another lead warm part in this first and second and be provided with first and second perforation at least one, for the Transmission Part of this mechanism for testing of assembling, make this first and second lead all side conduction test temperature of warm part by this Transmission Part.
5. electronic assembly test device according to claim 4, it is characterized in that, this temperature control mechanism is provided with the 3rd in this second below of leading warm part and leads warm part, 3rd leads warm part is provided with at least one 3rd perforation, for the Transmission Part of this mechanism for testing of assembling, the 3rd is made to lead all side conduction test temperature of warm part by this Transmission Part.
6. electronic assembly test device according to claim 5, is characterized in that, the 3rd of this temperature control mechanism lead warm part offer at least one pick and place electronic package pick and place parts.
7. electronic assembly test device according to claim 1, is characterized in that, this temperature control mechanism at least one lead warm part be provided with pick and place electronic package pick and place parts.
8. electronic assembly test device according to claim 1, is characterized in that, this proving installation is provided with driving mechanism, and this driving mechanism is provided with at least one driver, does at least one party to displacement to drive this temperature control mechanism or this mechanism for testing.
9. electronic assembly test device according to claim 1, is characterized in that, this mechanism for testing is provided with the light source of at least one test, with throw light to electronic package.
10. a testing apparatus for applying electronic component test device, is characterized in that, comprises:
Board;
Feeding device: be assemblied in this board, and be provided with at least one feeding machanism, in order to accommodating electronic package to be measured;
Material collecting device: be assemblied in this board, and be provided with at least one receiving mechanism, in order to the accommodating electronic package surveyed;
At least one according to the electronic assembly test device described in claim 1;
Conveying device: be assemblied in this board, and be provided with at least one Material moving device, in order to transfer electronic package;
Central control unit: in order to control and to integrate each device start, to perform automated job.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410547358.6A CN105572437B (en) | 2014-10-16 | 2014-10-16 | Electronic assembly test device and its test equipment of application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410547358.6A CN105572437B (en) | 2014-10-16 | 2014-10-16 | Electronic assembly test device and its test equipment of application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105572437A true CN105572437A (en) | 2016-05-11 |
| CN105572437B CN105572437B (en) | 2018-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410547358.6A Expired - Fee Related CN105572437B (en) | 2014-10-16 | 2014-10-16 | Electronic assembly test device and its test equipment of application |
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| Country | Link |
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| CN (1) | CN105572437B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113092982A (en) * | 2020-01-09 | 2021-07-09 | 珠海格力电器股份有限公司 | Test seat and test equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1696708A (en) * | 2004-05-14 | 2005-11-16 | 精炼金属股份有限公司 | Electrical test device |
| US20090021238A1 (en) * | 2007-07-19 | 2009-01-22 | Eudyna Devices Inc. | Optical device and method of controlling the same |
| TWI414799B (en) * | 2010-07-16 | 2013-11-11 | Hon Tech Inc | Applied to image sensing IC test classification machine (a) |
| TW201423899A (en) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | Electric component pressing mechanism and testing facility applying the same |
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2014
- 2014-10-16 CN CN201410547358.6A patent/CN105572437B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1696708A (en) * | 2004-05-14 | 2005-11-16 | 精炼金属股份有限公司 | Electrical test device |
| US20090021238A1 (en) * | 2007-07-19 | 2009-01-22 | Eudyna Devices Inc. | Optical device and method of controlling the same |
| TWI414799B (en) * | 2010-07-16 | 2013-11-11 | Hon Tech Inc | Applied to image sensing IC test classification machine (a) |
| TW201423899A (en) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | Electric component pressing mechanism and testing facility applying the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113092982A (en) * | 2020-01-09 | 2021-07-09 | 珠海格力电器股份有限公司 | Test seat and test equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105572437B (en) | 2018-07-20 |
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