CN111474463A - Circuit board test system, circuit board test host and circuit board test method - Google Patents
Circuit board test system, circuit board test host and circuit board test method Download PDFInfo
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- CN111474463A CN111474463A CN202010346073.1A CN202010346073A CN111474463A CN 111474463 A CN111474463 A CN 111474463A CN 202010346073 A CN202010346073 A CN 202010346073A CN 111474463 A CN111474463 A CN 111474463A
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- circuit board
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- power supply
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
Abstract
The disclosure provides a circuit board test system, a circuit board test host and a circuit board test method. The circuit board testing system comprises a testing clamp, a power supply module, a testing control module and a testing instrument. The test fixture is used for fixing a circuit board to be tested, and when the test fixture successfully fixes the circuit board to be tested, a first signal is output; the power supply module is used for supplying power to the circuit board to be tested; when the test control module acquires the first signal, the power supply module is controlled to supply power to the circuit board to be tested; and the test instrument tests the circuit board to be tested under the control of the test control module. The present disclosure improves the stability of testing a circuit board to be tested.
Description
Technical Field
The present disclosure relates to the field of testing, and in particular, to a circuit board testing system, a circuit board testing host, and a circuit board testing method.
Background
At present, a hardware short-circuit cold plugging mode is used in a process of testing a mainboard of electronic equipment to start a testing process of the mainboard. The testing device comprises a testing clamp, a main board, a pressing pin, a copper pin, a power supply and a testing host, wherein the pressing pin is arranged on the testing clamp, the copper pin is embedded in the corresponding position of the lower die of the testing clamp, the main board is placed between the upper die and the lower die before testing, when the testing clamp is used for pressing the upper die and the lower die, the pressing pin is in contact with the copper pin to generate a short-circuit signal, and the testing host controls the power supply to supply power to the main board according to.
However, the clamp is used as a non-standard component, deformation is inevitable when the clamp is used, and the press-fit pin is easy to shift, deform and the like, which can cause that when the upper die and the lower die are not completely pressed, the press-fit pin touches the copper pin to mistakenly start a test flow, and the power supply supplies power to the mainboard in advance, so that the mainboard performance test is abnormal; or after the upper die and the lower die are completely pressed, the pressing needle still cannot touch the copper pin due to deformation, and the test flow cannot be started. Therefore, the test stability of the current test scheme for the mainboard test is poor.
The above information disclosed in this background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not constitute prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
One object of the present disclosure is to improve the stability of testing a circuit board under test.
In order to solve the technical problem, the following technical scheme is adopted in the disclosure:
according to one aspect of the present disclosure, the present disclosure provides a circuit board testing system, including a testing fixture for fixing a circuit board to be tested, and outputting a first signal when the testing fixture successfully fixes the circuit board to be tested;
the power supply module is used for supplying power to the circuit board to be tested;
the test control module is electrically connected with the test fixture and the power supply module, and controls the power supply module to supply power to the circuit board to be tested when the test control module acquires the first signal;
and the test instrument is electrically connected with the circuit board to be tested so as to test the circuit board to be tested under the control of the test control module.
According to one aspect of the present disclosure, the present disclosure provides a circuit board test host, including:
the test fixture comprises a first interface, a second interface and a third interface, wherein the first interface is used for being connected with the test fixture, and the test fixture is used for fixing a circuit board to be tested; when the test fixture successfully fixes the circuit board to be tested, outputting a first signal;
the second interface is used for being connected with a power supply module so as to control the work of the power supply module; the power supply module is used for supplying power to the circuit board to be tested;
the controller is used for storing a test control program, communicating with the test fixture through the first interface when the controller runs the test control program, and controlling the power supply module to supply power to the circuit board to be tested through the second interface when the controller obtains the first signal;
and the third interface is used for being connected with the test instrument, and when the test control program is in a running state, the controller controls the test instrument to test the circuit board to be tested through the third interface.
According to still another aspect of the present disclosure, there is provided a circuit board testing method including:
acquiring the position state of a test fixture, wherein a circuit board to be tested is placed in the test fixture in advance;
when the test fixture successfully fixes the circuit board to be tested, the power supply module is controlled to supply power to the circuit board to be tested;
testing the circuit board to be tested;
after the circuit board to be tested is tested, controlling the power supply module to stop supplying power to the circuit board to be tested;
in the technical scheme of the disclosure, the test control module is used for acquiring the position state of the test fixture on one hand and controlling the output of the power supply module on the other hand. Therefore, in the test, the test control module determines the working state of the test fixture by receiving the signal output by the test fixture, and controls the power supply module to supply power to the circuit board to be tested after the test fixture successfully fixes the circuit board to be tested, so as to ensure the power supply safety of the circuit board to be tested, and effectively reduce the condition that the power supply module supplies power to the circuit board to be tested before the test fixture unsuccessfully fixes the circuit board to be tested; compared with the condition that the test fixture directly triggers the power supply module to the circuit board to be tested in a cold plugging mode, the technical scheme effectively improves the test stability and reduces the false testing rate caused by the power supply problem.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
FIG. 1 is a block diagram illustrating circuit connections of a circuit board testing system according to one embodiment;
FIG. 2 is a circuit connection block diagram of a circuit board testing system according to another embodiment;
FIG. 3 is a partial flow diagram illustrating operation of a circuit board testing system according to one exemplary embodiment;
FIG. 4 is a functional block diagram of circuitry of a circuit board test host according to one embodiment; a flow chart of a charging control method;
FIG. 5 is a flow chart illustrating a method of testing a circuit board according to another embodiment.
The reference numbers illustrate:
11. a test control module; 12. testing the clamp; 13. a power supply module; 14. testing the instrument; 15. a three-party switching module; 16. a handling device; 20. a circuit board to be tested; 30. a circuit board testing host; 31. a first interface; 32. a second interface; 33. a third interface; 34. a fourth interface; 35. a controller; 351. testing the control program; 352. and (5) a three-party transfer program.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and the like. In other instances, well-known structures, methods, devices, implementations, materials, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.
In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.
Preferred embodiments of the present disclosure are described in further detail below with reference to the accompanying drawings of the present specification.
The present disclosure provides a circuit board testing system for performing a related test on a circuit board to be tested. It will be understood that the circuit board to be tested includes a substrate and a circuit laid on the substrate. The substrate may be a pcb (printedcuit board) board. Thus, the circuit board to be tested according to the present disclosure may be a pcba (printed circuit board assembly).
According to different types of circuit boards to be tested, the test items are correspondingly different. Taking a mobile phone motherboard as an example, the test items may be a radio frequency test, a communication stability test, a leakage current test, and the like. Therefore, the purpose of the test is not limited in this disclosure.
Referring to fig. 1, fig. 1 is a circuit connection block diagram of a circuit board testing system according to an embodiment. In one embodiment, the circuit board testing system comprises a test fixture 12, a power supply module 13, a test control module 11, and a test instrument 14. The testing fixture 12 is used for fixing a circuit board 20 to be tested, when the testing fixture 12 is in a first position state, the testing fixture 12 successfully fixes the circuit board 20 to be tested, and the testing fixture 12 outputs a first signal; the power supply module 13 is used for supplying power to the circuit board 20 to be tested; the test control module 11 is electrically connected with the test fixture 12 and the power supply module 13, and the test control module 11 is used for acquiring the position of the test fixture 12 and controlling the power supply module 13 to supply power to the circuit board 20 to be tested when acquiring the first signal; the test instrument 14 is electrically connected to the circuit board 20 to be tested, so as to test the circuit board 20 to be tested under the control of the test control module 11.
The test fixture 12 is used to fix a circuit board 20 to be tested to maintain the positional stability of the circuit board 20 to be tested during the test. The structure of the test fixture 12 may be various, for example, the test fixture 12 may be in the shape of a clip to clamp the circuit board 20 to be tested from one side of the circuit board 20 to be tested. The test fixture 12 may also be in the form of a bracket, on which a hold-down is provided, and the circuit board 20 to be tested is placed on the bracket and held down by the hold-down.
In one embodiment, the test fixture 12 includes a first mold (not shown) and a second mold (not shown) that are mated together; a cavity for accommodating the circuit board 20 to be tested is formed between the first mold and the second mold. Optionally, the shape and size of the first mold and the second mold correspond to the shape and size of the circuit board 20 to be tested.
Here, the first mold is taken as a lower mold, and the second mold is taken as an upper mold. The first mold is used for supporting the circuit board 20 to be tested, and the second mold moves downwards to cover the first mold. When the second mould is completely covered on the first mould, the first position state is corresponded. At this point, the test fixture 12 has successfully secured the circuit board 20 to be tested and testing can begin.
Accordingly, the second mold is separated from the first mold by moving upward. When the second mold is completely separated from the first mold, the second mold corresponds to a second position state. At this point, the test fixture 12 has successfully secured the circuit board 20 to be tested and testing of the circuit board is stopped.
The test control module 11 can communicate with the test fixture 12 to know the position state of the test fixture 12. It should be noted that the test control module 11 may directly communicate with the test fixture 12, or may indirectly communicate with the test fixture 12.
As before, the second mold moves downward to close with the first mold, and moves upward to separate from the first mold. The test mold is in the first position at this time. Wherein the up and down movement of the second mold may be driven by an air cylinder. Therefore, by detecting the position of the movable end of the air cylinder, the positional state of the test fixture 12 can be determined.
Illustratively, the cylinder driving the second mold is in direct or indirect communication with the test control module 11 through a communication interface and a communication line. Wherein, the communication interface can be a USB interface. The cylinder may be controlled by the test control module 11. When the second mold moves to a position where the second mold completely covers the first mold, the cylinder driving the second mold generates a first signal to be sent to the test control module 11, and thus the test control module 11 determines that the test fixture 12 is in the first position state. When the second mold moves to a position completely separated from the first mold, the air cylinder driving the second mold generates a second signal to the test control module 11, whereby the test control module 11 determines that the test fixture 12 is in the second position state.
Of course, a motor may be used to drive the first mold or the second mold to move so as to adjust the position state of the test fixture 12. Illustratively, the motor drives the second mold to move downwards, and a hall sensor may be disposed on the motor shaft to detect the rotation speed and the number of rotation turns of the motor, so as to determine the downward displacement of the second mold to determine whether the second mold is covered with the first mold.
It will be appreciated that the air cylinder drives the first mould upwardly to close the second mould with the test fixture 12 in the first position. The cylinder drives the first mold to move downwards to leave the second mold, so that the test fixture 12 is in the second position state, and the working purpose of the test fixture 12 can be achieved.
The first mold or the second mold is provided with a test pin (not shown), and when the test fixture 12 is in the first position state, the test pin is electrically connected with the test point on the circuit board 20 to be tested;
after acquiring the position state of the test fixture 12, the test control module 11 further controls the operation of the power supply module 13. Specifically, when the test fixture 12 is in the first position state, the power supply module 13 is controlled to supply power to the circuit board 20 to be tested. Thereby, the situation is avoided that the power supply module 13 supplies power to the circuit to be tested in advance before the test fixture 12 reaches the first position state.
Moreover, the test control module 11 is further configured to control the power supply module 13 to stop supplying power to the circuit board 20 to be tested after the circuit board 20 to be tested is tested; then, the test control module 11 is further configured to control the test fixture 12 to be in the second position state, so as to release the fixation of the circuit board 20 to be tested.
In this embodiment, the power supply module 13 needs to supply power to the circuit board 20 to be tested, and the test instrument 14 needs to input a test signal to the module to be tested. In order to avoid the influence of the connection with the circuit to be tested on the stability of the test fixture 12 for fixing the circuit to be tested, in one embodiment, a test pin is arranged on the first mold or the second mold, and when the test fixture 12 is in the first position state, the test pin is electrically connected with the test point on the circuit board 20 to be tested; the test pins are electrically connected to the test instrument 14, and the test instrument 14 tests the circuit board 20 to be tested through the test pins. The test pins may also be connected to a power circuit through which the test instrument 14 supplies power to the circuit board 20 to be tested.
In one example, the test needle is divided into a needle sleeve and a needle core which are electrically connected, and the needle sleeve is sleeved on the outer side of the needle core. And the needle core can elastically rise in the needle sleeve. The needle sleeve is mounted on the first mold or the second mold, the connecting wires are connected to the needle sleeve, and the needle core is pressed on the test point of the circuit board 20 to be tested when the first mold and the second mold are pressed. The connecting wires include a plurality of wires, for example, an output wire of the power supply module 13 and a signal conducting wire of the testing apparatus 14.
For signals input to the circuit board 20 to be tested, the signals are conducted to the hub and then to the core through the connecting wires. For the signal output by the circuit board 20 to be tested, the signal is transmitted to the needle core, and then transmitted to the needle sleeve by the needle core.
The power supply module 13 may be a power supply with a fixed output voltage, and may be a controllable switching power supply. In order to improve the matching between the circuit board testing system and various circuit boards 20 to be tested, in an embodiment, the power supply module 13 is a power board on which a power circuit is laid, an input end of the power board is connected with a power supply, and the voltage output by the power supply can be regulated and controlled by the power circuit so as to match the voltage required by the testing of the circuit boards 20 to be tested. Illustratively, the power panel has a control chip thereon, which is used for controlling the output voltage of the power supply module 13. The control chip can be a single chip microcomputer, an MCU, or a power management chip.
In one embodiment, in order to improve the testing efficiency, the power supply module 13 is further configured to include a serial interface, and the test control module 11 communicates with the control chip through the serial interface to control the power board to turn on/off, output voltage, and the like.
The supply voltage required for a circuit board to be tested is generally specified. In order to improve the testing efficiency, before or during the testing, the testing control module 11 is arranged for communicating with a production process execution management system, and the production process execution management system stores the testing information of the circuit board 20 to be tested; the test control module 11 is further configured to obtain a test voltage for the circuit board 20 to be tested from the production process execution management system; and controls the output voltage of the power supply module 13 according to the test voltage.
The production process execution management system is a set of production informatization management system facing to a workshop execution layer of a manufacturing enterprise, and is called MES for short. The production management execution relation system may be configured on a server, and the test control module 11 communicates with the server to obtain test information of the circuit board 20 to be tested. The test information at least includes a test voltage required for testing the circuit board 20 to be tested, and may also include information such as a test standard and a test parameter.
Of course, the output voltage of the power panel can be regulated and controlled by a tester, so that the output voltage of the power panel can meet the test requirement.
Further, the test control module 11 is further configured to detect whether the output voltage of the power supply module 13 matches the test voltage after the power supply module 13 outputs the voltage, so as to improve the reliability of the test. Specifically, the test control module 11 obtains data about the output voltage in the control chip in the power supply module 13.
It should be understood that a control chip similar to a single chip microcomputer, an MCU, or the like can monitor the voltage output by the power supply module 13, and can obtain the current output voltage of the power supply module 13 through a feedback circuit. The test control module 11 can obtain from the control chip whether the output voltage of the current power supply module 13 meets the test voltage.
It should be noted that, as long as the difference between the output voltage of the power supply module 13 and the test voltage is within the preset threshold interval, the output voltage and the test voltage can be regarded as the matching test voltage.
Illustratively, prior to testing, the test control module 11 transmits an updated instruction set to the control chip of the power strip via the serial interface. The command set is a corresponding relation between a series of commands and a target voltage. Therefore, the test control module 11 sends a corresponding command to the control chip, the control chip feeds back the character string to the test control module 11 after receiving the command, and the control chip searches for the target voltage corresponding to the command according to the command set, so as to adjust and control the operation of the power panel according to the target voltage.
Referring to table 1, table 1 shows a correspondence table in the instruction set. The instruction set also includes a correspondence between the instructions and the voltage type selection. The voltage types include low voltage, high voltage, specific voltage, etc. The instruction set also comprises a corresponding relation between the instruction and the voltage gear. The voltage steps can be multiple and are set to be 3.8V, 4.0V, 4.2V, 8V, 8.2V and the like, so that a plurality of voltage intervals are formed, namely 3.8V-4.0V, 4.0V-4.2V, 4.2V-8V and 8V-8.2V.
The instruction set also includes a correspondence of instructions to voltage turn-on and turn-off control. For example, a signal instructing VBAT _ ON to correspond to "turn ON voltage out"; the command VBAT _ OFF corresponds to a signal to turn OFF the voltage output.
The instruction set also includes a correspondence of the instructions to the voltage queries. Schematically, the power panel is divided into two paths of outputs, and the first path of voltage is output to the battery of the circuit board to be tested 20 for power supply; the second path of voltage is output to the VSB interface of the circuit board to be tested 20, for supplying power to the communication circuit of the circuit board to be tested 20. For example, the VBATV is instructed to correspond to the value of the first path voltage of the query power board; the command VUSBV corresponds to the value of the voltage of the above-mentioned second path of the query power panel.
TABLE 1 instruction set correspondence table
As before, after acquiring the position state of the test fixture 12, the test control module 11 further controls the operation of the power supply module 13 to supply power to the circuit board 20 to be tested. Then, the test control module 11 can control the test instrument 14 to test the circuit board 20 to be tested.
Depending on the item being tested, a corresponding test instrument 14 may be employed. For example, when performing radio frequency test on a mobile phone motherboard, the test instrument 14 sends a preset channel to the mobile phone motherboard, and then receives an output signal processed by the mobile phone motherboard, and the test instrument 14 can analyze the output signal by itself to obtain a test result; of course, the testing apparatus 14 may also send the channel information sent to the mobile phone motherboard and the received output information of the mobile phone motherboard to the testing control module 11, and the testing control module 11 performs analysis to generate a testing result.
Furthermore, in order to improve the automation program of the circuit board testing system, the testing efficiency is improved. In one embodiment, the circuit board testing system further includes handling equipment 16. The handling apparatus 16 may be used to handle circuit boards 20 to be tested on the production line to the test fixture 12. It may also be used to transport the circuit board 20 to be tested out of the test fixture 12 after testing is complete.
Referring to fig. 2, fig. 2 is a circuit connection block diagram of a circuit board testing system according to another embodiment. The handling apparatus 16 needs to be electrically connected to the test control module 11 to determine the timing for handling the circuit board 20 to be tested to the test fixture 12 and for handling the circuit board 20 to be tested out of the test fixture 12. In order to be compatible with as many carrier devices 16 as possible. In an embodiment, the circuit board testing system further includes a three-way switching module 15, the three-way switching module 15 is in communication with the transporting device 16 and the testing fixture 12, so that after the testing fixture 12 releases the fixing of the circuit board 20 to be tested, the testing control module 11 controls the transporting device 16 to move the circuit board 20 to be tested away from the testing fixture 12 through the three-way switching module 15.
The three-way relay module 15 functions similarly to a server. The three-party switching module 15 may be a server of an entity or may be software installed in a computer device. The communication connection between the three-way relay module 15, the handling device 16, the test fixture 12 and the test control module 11 is realized through a communication interface on the computer system.
Therefore, in the present embodiment, the test control module 11 communicates with the test fixture 12 through the three-way adapter module 15 to obtain the position status of the test fixture 12.
Illustratively, the three-party software first starts to establish a server and waits for the connection of the test control module 11. The three-party software can control or receive the instruction from the test control module 11 to control the pressing of the test fixture 12 (before the circuit board 20 to be tested is located in the test fixture 12). When the three-party software receives the first signal output by the test fixture 12, it is determined that the test fixture 12 is pressed, and the circuit board 20 to be tested is successfully fixed. After the circuit board 20 to be tested is tested, the three-party software can control or receive the instruction of the test control module 11 by itself to control the separation of the test fixture 12. Specifically, when the third software receives the second signal output by the test fixture 12, it is determined that the test fixture 12 is completely separated, and at this time, the third software communicates with the handling device 16 to coordinate the handling device 16 to move the circuit board 20 to be tested out of the test fixture 12.
Referring to fig. 3, fig. 3 is a partial flow chart illustrating operation of a circuit board testing system according to an exemplary embodiment. Schematically, in the whole test process, the test control module 11 is started first, and the test control module 11 establishes communication connection with the power supply module 13 to realize control over the power supply module 13; the test control module 11 is connected to the production process execution management system to obtain the test voltage configuration. Thereafter, the test control module 11 configures the output voltage of the power supply module 13 according to the acquired test voltage. Then, the test control module 11 connects the three-party relay module 15 to acquire the position state of the test fixture 12. When the test fixture 12 is determined to be pressed, the test control module 11 controls the power supply module 13 to start voltage output, and starts to test the circuit board 20 to be tested; during the test, the test control module 11 may monitor the output voltage of the power supply module 13 to determine whether the output voltage matches the test voltage.
In the testing process, the testing instrument 14 inputs a testing signal to the circuit board 20 to be tested through the testing needle on the testing fixture 12 and receives an output signal of the circuit board 20 to be tested, and the testing instrument 14 simultaneously sends the testing signal and the output signal of the circuit board 20 to be tested to the testing control module 11 for analysis by the testing control module 11. And after the analysis of the test control module 11 is completed, displaying the test result.
After the test is completed, the test control module 11 controls the power supply module 13 to turn off the voltage output. And the test control module 11 controls the test fixture 12 to release the control of the circuit board 20 to be tested through the three-party transfer module 15. When the test fixture 12 completely releases the fixation of the circuit board 20 to be tested, a second signal is sent to be received by the test control module 11, and at this time, the test control module 11 coordinates the carrying device 16 through the three-way switching module 15 to carry the circuit board 20 to be tested out of the test fixture 12.
It should be noted that the sequence of connection between the module units in the test flow set forth in this example is only for the understanding of the present disclosure, and is not intended to limit the present disclosure. It should be understood that the order within the above-described test flow may be modified based on the inventive concepts of the present disclosure and the particular operational characteristics of the various modular units employed.
In the technical solution of the present disclosure, the test control module 11 can acquire the position state of the test fixture 12 on the one hand, and can control the output of the power supply module 13 on the other hand. Therefore, in the test, the test control module 11 determines the working state of the test fixture 12 by receiving the signal output by the test fixture 12, and controls the power supply module 13 to supply power to the circuit board 20 to be tested after it is determined that the test fixture 12 successfully fixes the circuit board 20 to be tested, so as to ensure the power supply safety of the circuit board 20 to be tested, and effectively reduce the situation that the power supply module 13 supplies power to the circuit board 20 to be tested before the test fixture 12 unsuccessfully fixes the circuit board 20 to be tested; compared with the situation that the test fixture 12 directly triggers the power supply module 13 to the circuit board 20 to be tested in a cold plugging mode, the technical scheme effectively improves the test stability and reduces the false testing rate caused by the power supply problem.
The test control module 11 and the three-party transit module 15 in the above embodiments are functional entities, and do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor means and/or microcontroller 35 means.
Based on this, according to another aspect of the present disclosure, the present disclosure further provides a circuit board testing host 30, where the test control module 11 and the three-party adapter module 15 are both embodied as programs installed on the circuit board testing host 30.
Referring to fig. 4, fig. 4 is a functional block diagram of a circuit board testing host 30 according to an embodiment. Specifically, in one embodiment, the circuit board testing host 30 includes a first interface 31, a second interface 32, a third interface 33 and a controller 35. The first interface 31 is used for connecting with the test fixture 12, wherein the test fixture 12 is used for fixing the circuit board 20 to be tested; outputting a first signal when the test fixture 12 successfully fixes the circuit board 20 to be tested; the second interface 32 is used for connecting with the power supply module 13 to control the operation of the power supply module 13; the controller 35 stores a test control program 351, when the controller 35 runs the test control program 351, the controller 35 communicates with the test fixture 12 through the first interface 31, and when acquiring the first signal, the controller 35 controls the power supply module 13 to supply power to the circuit board 20 to be tested through the second interface 32; the third interface 33 is used for connecting with the testing apparatus 14, and when the controller 35 runs the testing control program 351, the controller 35 controls the testing apparatus 14 to send the testing signal to the circuit board 20 to be tested through the third interface 33.
It should be understood that the controller 35 includes a storage unit for storing the test control program 351 and a processing unit for running the test control program 351.
The TYPEs of the first interface 31, the second interface 32, and the third interface 33 may be, but not limited to, a USB 2.0 interface, a Micro USB interface, a USB TYPE-C interface, or other interfaces for connecting external devices.
For specific embodiments of the test fixture 12, the power supply module 13, and the test instrument 14, the embodiments described in the above-mentioned circuit board test system are applied. And will not be described in detail herein.
Further, after the test on the circuit board 20 to be tested is completed, when the circuit board testing host 30 runs the testing control program 351, the controller 35 controls the power supply module 13 to stop supplying power to the circuit board 20 to be tested through the second interface 32; thereafter, the controller 35 also controls the test fixture 12 to release the fixing of the circuit board 20 to be tested through the first interface 31.
In one embodiment, the circuit board testing host 30 communicates with a server via a fifth interface, and the server stores therein a production process execution management system. The test control module 11 is used for communicating with a production process execution management system, and the production process execution management system stores test information of the circuit board 20 to be tested; when the test control program 351 runs, it can be obtained that the production process execution management system obtains the test voltage of the circuit board 20 to be tested; and controls the output voltage of the power supply module 13 through the second interface 32 according to the test voltage.
In an embodiment, during the operation of the test control program 351, it can also detect whether the output voltage of the power supply module 13 matches the test voltage through the second interface 32.
In one embodiment, the test fixture 12 includes first and second dies that are closed together; a cavity for accommodating the circuit board 20 to be tested is formed between the first die and the second die; when the first mold and the second mold are closed, the test fixture 12 outputs a first signal;
the first mold or the second mold is provided with a test needle, and when the first mold or the second mold is closed, the test needle is electrically connected with a test point on the circuit board 20 to be tested;
the test pins are electrically connected to the test instrument 14, and the test instrument 14 tests the circuit board 20 to be tested through the test pins.
In one embodiment, the controller 35 further stores a three-way transfer program 352; when the controller 35 runs the three-way transfer program 352, the controller 35 communicates with the test fixture 12 through the first interface 31; when the controller 35 runs the test control program 351 and the first interface 31 acquires the first signal, the controller 35 controls the power supply module 13 to supply power to the circuit board 20 to be tested through the second interface 32,
it should be noted that the three-way transferring program 352 and the testing control program 351 are related, that is, the testing control program 351 can acquire data generated or sampled in the running process of the three-way transferring program 352; the test control program 351 may trigger the operation of the three-way relay program 352, and load control information into the three-way relay program 352, so that the test fixture 12 and the handling apparatus 16 can be controlled according to the control intention embodied by the test control program 351 when the three-way relay program 352 is operated.
In the test, the test control program 351 is allowed to obtain the signal output by the test fixture 12 to determine the working state of the test fixture 12, and after the test fixture 12 is determined to successfully fix the circuit board 20 to be tested, the power supply module 13 is controlled to supply power to the circuit board 20 to be tested, so that the power supply safety of the circuit board 20 to be tested is ensured, and the condition that the power supply module 13 supplies power to the circuit board 20 to be tested before the test fixture 12 does not successfully fix the circuit board 20 to be tested is effectively reduced; compared with the situation that the test fixture 12 directly triggers the power supply module 13 to the circuit board 20 to be tested in a cold plugging mode, the technical scheme disclosed by the disclosure coordinates and controls the work of the test fixture 12 and controls the on and off of the power supply module 13 by using a program control method, so that the reliability is high, the test stability is effectively improved, and the false detection rate caused by the power supply problem is reduced.
In one embodiment, the test host 30 of the circuit board further includes a fourth interface 34; the fourth interface 34 is used for connecting with the handling device 16; when the controller 35 runs the three-way transfer program 352, the controller 35 communicates with the handling apparatus 16 through the fourth interface 34; after the testing of the circuit board 20 to be tested is completed, the circuit board testing host 30 coordinates the operation of the three-party transferring program 352 to control the carrying device 16 to carry the circuit board 20 to be tested away from the testing fixture 12 through the operation of the testing control program 351.
According to an aspect of the present disclosure, a circuit board testing method is also presented. It should be understood that the circuit board testing method is not limited to be applied to the above-described circuit board testing system and the circuit board testing host 30. For details not disclosed in the present method, please refer to the above-mentioned embodiments of the circuit board testing system and the circuit board testing host 30.
Referring to fig. 5, fig. 5 is a flowchart illustrating a circuit board testing method according to another embodiment. Specifically, the circuit board testing method comprises the following steps 41-45.
and step 45, controlling the test fixture 12 to release the fixation of the circuit board 20 to be tested.
For specific embodiments of the test fixture 12, the power supply module 13, and the test instrument 14, the embodiments described in the above-mentioned circuit board test system are applied. And will not be described in detail herein.
In the test, the working state of the test fixture 12 is determined by obtaining the signal output by the test fixture 12, and after the test fixture 12 is determined to successfully fix the circuit board 20 to be tested, the power supply module 13 is controlled to supply power to the circuit board 20 to be tested, so that the power supply safety of the circuit board 20 to be tested is ensured, and the condition that the power supply module 13 supplies power to the circuit board 20 to be tested before the test fixture 12 does not successfully fix the circuit board 20 to be tested is effectively reduced; compared with the situation that the test fixture 12 directly triggers the power supply module 13 to the circuit board 20 to be tested in a cold plugging mode, the technical scheme effectively improves the test stability and reduces the false testing rate caused by the power supply problem.
While the present disclosure has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present disclosure may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.
Claims (12)
1. A circuit board testing system, comprising:
the test fixture is used for fixing a circuit board to be tested, and when the test fixture successfully fixes the circuit board to be tested, a first signal is output;
the power supply module is used for supplying power to the circuit board to be tested;
the test control module is electrically connected with the test fixture and the power supply module, and controls the power supply module to supply power to the circuit board to be tested when the test control module acquires the first signal;
and the test instrument is electrically connected with the circuit board to be tested so as to test the circuit board to be tested under the control of the test control module.
2. The circuit board testing system of claim 1, wherein the testing control module is further configured to control the power supply module to stop supplying power to the circuit board to be tested after the testing of the circuit board to be tested is completed; and then, the test control module is also used for controlling the test fixture to release the fixation of the circuit board to be tested.
3. The circuit board testing system of claim 1, wherein the testing control module is configured to communicate with a production process execution management system, and the production process execution management system stores testing information of the circuit board to be tested;
the test control module is also used for acquiring the test voltage of the circuit board to be tested from the production process execution management system; and controlling the output voltage of the power supply module according to the test voltage.
4. The circuit board testing system of claim 3, wherein the test control module is further configured to detect whether the output voltage of the power supply module matches the test voltage after the output voltage of the power supply module.
5. The circuit board testing system of claim 1, wherein the test fixture includes first and second dies that are mated; a cavity for accommodating the circuit board to be tested is formed between the first die and the second die; the test fixture outputting the first signal when the first mold and the second mold are closed;
the first mould or the second mould is provided with a test needle, and when the first mould or the second mould is closed, the test needle is electrically connected with a test point on the circuit board to be tested;
the test needle is electrically connected with the test instrument, and the test instrument tests the circuit board to be tested through the test needle.
6. The circuit board test system according to claim 1, wherein the power supply module comprises a control chip and a serial interface, the control chip is used for controlling the output voltage of the power supply module;
and the test control module is communicated with the control chip through the serial interface.
7. The circuit board testing system according to any one of claims 1 to 6, further comprising a three-way switch module and handling equipment; the three-party switching module is communicated with the carrying equipment, the test fixture and the three-party switching module;
the test control module is communicated with the test fixture through the three-party switching module to acquire the position state of the test fixture; and after the test fixture releases the fixation of the circuit board to be tested, the test control module controls the carrying equipment to carry the circuit board to be tested away from the test fixture through the three-party switching module.
8. A circuit board testing host, comprising:
the test fixture comprises a first interface, a second interface and a third interface, wherein the first interface is used for being connected with the test fixture, and the test fixture is used for fixing a circuit board to be tested; when the test fixture successfully fixes the circuit board to be tested, outputting a first signal;
the second interface is used for being connected with a power supply module so as to control the work of the power supply module; the power supply module is used for supplying power to the circuit board to be tested;
the controller is used for storing a test control program, communicating with the test fixture through the first interface when the controller runs the test control program, and controlling the power supply module to supply power to the circuit board to be tested through the second interface when the controller obtains the first signal;
and the third interface is used for being connected with the test instrument, and when the test control program is in a running state, the controller controls the test instrument to test the circuit board to be tested through the third interface.
9. The circuit board testing host machine of claim 8, wherein when the testing control program is running, after the testing of the circuit board to be tested is completed, the controller controls the power supply module to stop supplying power to the circuit board to be tested through the second interface; and then, the controller controls the test fixture to release the fixation of the circuit board to be tested through the first interface.
10. The host computer of claim 8, wherein the controller further stores a three-way adapter program;
when the controller runs the three-party switching program, the controller communicates with the test fixture through the first interface; when the controller runs the test control program and acquires the first signal based on the first interface, the controller controls the power supply module to supply power to the circuit board to be tested through the second interface.
11. The circuit board test host of claim 10, further comprising a fourth interface; the fourth interface is used for being connected with the carrying equipment;
when the controller runs the three-party switching program, the controller communicates with the carrying equipment through a fourth interface;
after the circuit board to be tested is tested, the test control program coordinates the three-party switching program in the running state, so that the carrying equipment is controlled through the running of the three-party switching program, and the circuit board to be tested is carried away from the test fixture.
12. A circuit board testing method is characterized by comprising the following steps:
acquiring the position state of a test fixture, wherein a circuit board to be tested is placed in the test fixture in advance;
when the test fixture successfully fixes the circuit board to be tested, the power supply module is controlled to supply power to the circuit board to be tested;
testing the circuit board to be tested;
after the circuit board to be tested is tested, controlling the power supply module to stop supplying power to the circuit board to be tested;
and controlling the test fixture to release the fixation of the circuit board to be tested.
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| CN202010346073.1A CN111474463A (en) | 2020-04-27 | 2020-04-27 | Circuit board test system, circuit board test host and circuit board test method |
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| CN202010346073.1A CN111474463A (en) | 2020-04-27 | 2020-04-27 | Circuit board test system, circuit board test host and circuit board test method |
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