TWI684012B - Substrate temperature control unit of test device and test classification equipment applied - Google Patents

Abstract

A substrate temperature control unit of a testing device. The testing device is a test seat equipped with at least one test electronic component in the accommodating portion of the substrate. The test seat is electrically connected to at least one circuit board at the bottom of the substrate, and is further provided above the test seat A crimping mechanism with a depressor and a temperature operating device, the depressor presses against an electronic component, and the substrate temperature control unit is provided with at least one temperature control component at at least one part of the substrate different from the accommodating portion, the The temperature control component is to control the temperature of the substrate to keep the substrate at a preset temperature, so as to avoid the damage of the high temperature of the lower pressure device through the substrate to the circuit board, so that the circuit board can accurately perform the test operation, and achieve the practical benefit of improving the test quality .

Description

Substrate temperature control unit of test device and test classification equipment applied

The invention provides a substrate temperature control unit of a testing device which can prevent the high temperature of the lower pressure device from being transmitted to the circuit board through the substrate and being damaged, so that the circuit board can accurately perform the test operation, so as to improve the test quality and save cost.

Nowadays, electronic components may be in a high-temperature environment when they are actually used. To ensure the quality of electronic components, after the electronic components are manufactured, they use a test device to perform thermal testing on the electronic components to eliminate defective products; please refer to section 1, the electronic component testing device is equipped with a metal substrate 12 with a plurality of accommodating portions 121 under the machine 11, the bottom of the substrate 12 is equipped with a circuit board 13, the bottom surface of the circuit board 13 is electrically A testing machine 14 is connected, and a plurality of test sockets 15 with probes are electrically connected to the top surface, and the plurality of test sockets 15 are placed in the plurality of accommodating portions 121 of the substrate 12 for receiving and testing electronic components The test device is additionally provided with a crimping mechanism above the test base 15, the crimping mechanism is driven by the movable arm 16 to drive the heater 17 and the lower pressure device 18 with a pressing jig 181 for Z-direction displacement, the heater The 17 series heating lower pressure device 18, the lower pressure device 18 presses the jig 181 against the electronic components in the test seat 15, and makes the bonding surface 182 of the lower pressure jig 181 side be placed on the top of the substrate 12 In order to enable electronic components to perform thermal testing in a simulated high-temperature test environment; however, the heater 17 is heated at a temperature of 85°C and the lower pressure device 18 not only makes the pressure jig 181 under the lower pressure device 18 have a high temperature of 85°C In addition, the bonding surface 182 of the lower pressure device 18 has a high temperature of 85°C. When the bonding surface 182 of the lower pressure device 18 is placed on the substrate 12, the high temperature of 85° C. will be conducted down to the circuit board 13 through the substrate 12 , Resulting in damage to the circuit board 13 due to high temperature, so that the electronic components in the test base 15 cannot be correctly tested, so the electronic component is wrongly judged as a defective product. Not only must the circuit board 13 be replaced, which increases the cost, but also cannot ensure the electronic component Test quality.

The first object of the present invention is to provide a substrate temperature control unit of a test device. The test device is a test seat equipped with at least one test electronic component in a receiving portion of the substrate, and the test seat is electrically connected to at least one circuit board at the bottom of the substrate A pressure contact mechanism with a lower pressure device and a temperature working device is provided above the test base. The lower pressure device presses against the electronic component. The substrate temperature control unit is located on at least one part of the substrate different from the accommodating part At least one temperature control component is provided. The temperature control component temperature-controls the temperature of the substrate to keep the substrate at a preset temperature to prevent the high temperature of the lower pressure device from being transmitted to the circuit board through the substrate and being damaged, so that the circuit board can accurately perform the test operation , To achieve practical benefits of cost savings and improved test quality.

The second objective of the present invention is to provide a substrate temperature control unit of a testing device, wherein the substrate temperature control unit is provided with at least one heat insulation component at the bottom of the substrate to prevent the high temperature from being transmitted to the circuit board and achieve improved use efficiency Practical benefits.

The third object of the present invention is to provide a substrate temperature control unit of a testing device, wherein at least one stop member is provided between the temperature control component of the substrate temperature control unit and the accommodating portion of the substrate to avoid the temperature control component The fluid flows to the test seat, thereby ensuring that the electronic component performs the test operation smoothly in the test seat.

The fourth object of the present invention is to provide a substrate temperature control unit of a testing device, wherein the substrate temperature control unit is provided with at least one sensor on the substrate to sense the temperature of the substrate, which is beneficial to adjust the temperature control components to achieve Practical benefits to improve usage efficiency.

The fifth object of the present invention is to provide a test classification device for a substrate temperature control unit using a test device, which includes a machine, a feeding device, a receiving device, a test device with a substrate temperature control unit, a conveying device and a central control device , The feeding device is configured on the machine, and is provided with at least one feeding holder to hold the electronic components to be tested; the feeding device is configured on the machine, and is provided with at least one feeding holder To support the tested electronic components; the test device of the present invention is configured on the machine, and is provided with a substrate, a circuit board, a test base, a crimping mechanism and a substrate temperature control unit to test the electronic components and the temperature control substrate ; The conveying device is configured on the machine, and is equipped with at least one feeder to transfer electronic components; the central control device is used to control and integrate the movement of each device to perform automated operations, to achieve the practical improvement of operational efficiency benefit.

In order to make your reviewer understand the present invention further, here is a preferred embodiment, with drawings, detailed as follows:

Please refer to figures 2, 3, and 4, the test device 20 of the present invention includes a substrate 21, a circuit board 22, a test base 23 and a substrate temperature control unit, and further includes a crimping mechanism 24 and a testing machine 25; the substrate 21 is assembled on A bottom of the machine 30 with a port 31, the base plate 21 is made of metal, and is provided with at least one accommodating part 211, the accommodating part 211 is a port 31 communicating with the machine 30, the base plate 21 can be directly locked On the machine 30, or may be movably assembled on the machine 30 connecting plate, in this embodiment, the machine 30 is equipped with a hollow frame connecting plate 32 at the port 31, the connecting plate 32 is provided with At least one gas supply channel 321, the first end of the gas supply channel 321 communicates with a gas supply device (not shown), the base plate 21 is assembled and connected to the connecting plate 32 of the machine 30, and a part of the top surface is accommodated The part 211 is exposed with respect to the port 31.

The circuit board 22 is assembled under the substrate 21, and is equipped with an electrically connected test socket 23 at a position corresponding to the receiving portion 211 of the substrate 21, the test socket 23 has at least one probe and is embedded in the substrate The accommodating part 21 of 21 is exposed to the opening 31 of the machine 30 for moving electronic components to perform test operations. The test machine 25 is electrically connected to the bottom of the circuit board 22 to input or output test signals To the circuit board 22, and test electronic components.

The crimping mechanism 24 is located above the test base 23, and the movable arm 241 is used to drive the lower pressure device 242 and the temperature working device 243 to move in at least one direction. The lower pressure device 242 is used to press against the electronic components in the test base 23 To perform the test operation, in this embodiment, the moving arm 241 drives the lower pressure device 242 to displace in the Z direction. The lower pressure device 242 is provided with at least a lower pressure jig 2421 to press against the electronic component. The lower pressure device 242 At the bottom and on the peripheral side of the lower pressure fixture 2421, a bonding surface 2422 is formed to be placed on the top surface of the substrate 21, the temperature working device 243 is a temperature-controlled lower pressure device 242 to a preset test temperature, and further, The temperature working device 243 can be a heating element, a cooling chip or a carrier with a fluid. The temperature working device 243 can be installed above or inside the lower pressure device 242 or inside the lower pressure jig 2421. The device 243 can also be used as a pressing fixture 2421 under the lower pressure device 242, and the bottom surface of the temperature working device 243 is used as a pressure contact surface to crimp electronic components, for example, the temperature working device 243 is a heating element, and the heating element The bottom surface is used as a crimping surface. In addition, a floater (not shown) can be installed above the lower pressure device 242. The floating device is used to float the lower pressure device 242 to prevent pressure damage to electronic components.

The substrate temperature control unit is provided with at least one temperature control component on at least one part of the substrate 21 different from the accommodating portion 211, the temperature control component temperature-controls the temperature of the substrate 21 to avoid the high temperature of the lower pressure device 242 passing through the substrate 21 is transmitted to the circuit board 22 and is damaged. Furthermore, the aforementioned at least one part different from the accommodating part 211 may be the inner or top or bottom surface of the board thickness of the substrate 21, and the temperature control component may be a temperature control with fluid The flow channel or the cooling chip or the heat dissipation material is provided with at least one heat insulation component on the bottom surface of the substrate 21 to further prevent the high temperature from being transmitted to the circuit board 22. For example, the temperature control component is a temperature control flow channel with a fluid. The flow control channel may be provided with at least one first-level channel section on the base plate 21, or a plurality of flow channel sections communicating with the base plate 21 and the heat insulating member, or at least one first-level channel section between the base plate 21 and the connecting plate 32, regardless Either of the foregoing methods can reduce the temperature conduction of the substrate 21 to the circuit board 22. Furthermore, if the temperature control component is a temperature control flow channel, at least one between the temperature control flow channel and the accommodating portion 211 of the substrate 21 can be provided A blocking member, which can be a thickness portion between the temperature-controlled flow path and the accommodating portion 211 or an independent element to prevent the fluid of the temperature-controlled flow path from flowing to the accommodating portion 211; the first in this application In the embodiment, the temperature control component of the substrate temperature control unit is a temperature-controlled flow channel with fluid. The temperature-controlled flow channel is provided with a first flow channel section 261 on both sides of the accommodating portion 211 of the substrate 21, the first flow channel The section 261 is connected to the gas supply channel 321 of the connecting plate 32 for the gas to flow into the first flow channel section 261, and a heat insulation component 262 made of glass fiber reinforced plastic is provided on the bottom surface of the base plate 21, the heat insulation component 262 There is a large-sized perforation 2621 for a plurality of test seats 23, the temperature-controlled flow channel is located on the top surface of the heat-insulating component 262 and the part different from the perforation 2621 is recessed with a larger area The second runner section 2622, the second runner section 2622 covers the side section A, the front section B and the rear section C. Since the heat insulating member 262 is attached to the bottom surface of the substrate 21, the bottom cover of the substrate 21 can be used Close the top surface of the second runner section 2622, and make the second runner section 2622 communicate with the first runner section 261 for the inflow of gas, and the temperature control runner is attached to the front section B and the rear section C of the top surface of the substrate 21 Each is provided with a third flow path section 263 which communicates with the second flow path section 2622 of the heat insulation member 262 for exhausting gas, wherein the third flow path section 263 is provided on the substrate 21 The first flow path hole 2631 communicating with the second flow path section 2622, the first flow path hole 2631 communicates with a flow path groove 2632 horizontally arranged on the top surface of the substrate 21, and the flow path groove 2632 communicates with at least one second flow path hole 2633, the first The second flow path hole 2633 is used for exhausting gas. In addition, since the second flow path section 2622 does not communicate with the accommodating portion 211, a blocking part 2623 is formed in the thickness portion between the second flow path section 2622 and the accommodating portion 211, to Avoid gas flow to the test base 23 to ensure that electronic components are The test operation is successfully performed in the test seat 23, and then a plurality of connected first flow path sections 261, second flow path sections 2622, and third flow path sections 263 are used to form a temperature-controlled flow path for gas flow, so that the gas flows on the substrate 21 The side section A, the front section B and the rear section C flow, thereby reducing the temperature of the substrate 21; furthermore, the substrate temperature control unit is provided with at least one sensor 264 on the substrate 21 to sense the temperature of the substrate 21 , And transmit the sensing data to the central control device (not shown in the figure), so as to regulate the temperature of the substrate 21.

Please refer to Figures 5 and 6, when performing thermal testing of electronic components, the test base 23 of the test device 20 is used to move the electronic component 41 to be tested, and the electronic component 41 is electrically connected through the probe of the test base 23 The circuit board 22 and the testing machine 25; then the crimping mechanism 24 uses the moving arm 241 to drive the lower pressure device 242 and the temperature working device 243 to move downward in the Z direction, so that the pressing jig 2421 under the lower pressure device 242 is pressed against the test The electronic component 41 in the seat 23 performs the test operation, and the temperature operating device 243 is used to increase the temperature of the lower pressure device 242 to 85 ℃ to test the operating temperature, so that the electronic component 41 performs the test operation in the simulated high temperature test environment, because the lower pressure device 242 is attached The closing surface 2422 will conduct high temperature to the substrate 21. In order to prevent the circuit board 22 under the substrate 21 from being affected by the high temperature, the substrate temperature control unit uses the air supply path 321 of the connection plate 32 to input low-temperature gas to the first flow path section of the substrate 21 261, the gas flows from the first flow path section 261 to the second flow path section 2622 of the heat insulating member 262. Since the second flow path section 2622 covers a large area of the side section portion A, the front section portion B and the rear section portion C of the substrate 21, It can make the gas flow to the side section A, the front section B and the rear section C of the substrate 21 for cold and heat exchange, thereby effectively reducing the temperature of the substrate 21 to 65 ℃, the gas in the second flow channel section 2622 The first flow channel hole 2631 flowing into the third flow channel section 263 of the substrate 21, the gas of the first flow channel hole 2631 flows to the flow channel groove 2632, and then flows into the second flow channel hole 2633 to discharge the gas, so that the substrate temperature control unit The substrate 21 can be controlled to maintain a preset temperature of 65°C to effectively prevent the substrate 21 from transmitting the high temperature of the lower pressure device 242 to the circuit board 22; moreover, the heat insulating member 262 is made of glass fiber reinforced plastic, which can also help prevent The substrate 21 conducts high temperature to the circuit board 22 and is designed with a temperature-controlled flow path to prevent the high temperature from accumulating in the substrate 21 and affecting the test seat 23 in the accommodating portion 211; moreover, the substrate temperature control unit uses sensing The device 264 monitors the temperature of the substrate 21 in real time, and transmits the sensing data to the central control device (not shown), so as to quickly adjust the temperature of the substrate 21; therefore, the substrate temperature control unit uses temperature control channels and heat insulation The component 262 double reduces the heat conduction of the substrate 21, so that the circuit board 22 can normally perform the test operation, so as to achieve the practical benefits of improving the test quality and saving costs.

Please refer to FIG. 7, which is the second embodiment of the present application. The difference from the first embodiment is that the substrate temperature control unit is provided at a position of the substrate 21 that is different from the accommodating portion 211. At least one is a cooling chip In the temperature control component of 265, if the temperature of the substrate 21 is too high, the cooling wafer 265 is used to cool the substrate 21, thereby preventing the high temperature of the substrate 21 from being transmitted to the circuit board 22.

Please refer to FIG. 8, which is the third embodiment of the present application. The difference from the first embodiment is that the substrate temperature control unit is coated on a portion (such as the top surface) of the substrate 21 that is different from the accommodating portion 211 There is a temperature control component that can be a heat dissipation material. The heat dissipation material is heat dissipation paint 266. The heat dissipation paint 266 is used to form a heat dissipation layer on the top surface of the substrate 21 to cool the substrate 21, thereby preventing the substrate 21 from transmitting high temperature to the circuit board 22.

Please refer to Figures 2, 3, 4, and 9, the substrate temperature control unit of the test device 20 of the present invention is applied to the test classification equipment, which includes the machine 30, the feeding device 50, the receiving device 60, and the substrate temperature of the present invention. The test device 20 of the control unit, the conveying device 70 and the central control device (not shown in the figure); the feeding device 50 is arranged on the machine 30, and is provided with at least one feeding receiver 51 to bear the test The electronic device; the receiving device 60 is configured on the machine 30, and is provided with at least one receiving device 61 to receive the electronic components tested; the test device 20 of the present invention is configured on the machine 30, It is also provided with a substrate 21, a circuit board 22, a test base 23, a crimping mechanism 24 and a substrate temperature control unit to test electronic components and temperature control substrate 21; the conveying device 70 is arranged on the machine 30 and is provided with at least one The material transfer device is used to transfer electronic components. In this embodiment, a first material transfer device 71 for X-Y-Z direction displacement is provided to take out the material supply holder 51 of the material supply device 50 for waiting The electronic components under test are transferred to the first transfer table 72 and the second transfer table 73. The first transfer table 72 and the second transfer table 73 transfer the electronic components to be tested to the refueling position for the second transfer. The device 74 and the third material transfer device 75 take the material, the second material transfer device 74 and the third material transfer device 75 respectively transfer the electronic components to be tested to the test seat 23 of the test device 20, and the pressure of the test device 20 The connecting mechanism 24 is used to press the electronic device in the test base 23 by the lower pressure device 242 to perform the test operation, and the substrate temperature is controlled by the substrate temperature control unit to prevent the high temperature of the lower pressure device 242 from being transmitted to the circuit board 22 through the substrate 21, To facilitate the circuit board 22 to accurately perform the test operation, upon completion of the test operation, the second transferer 74 and the third transferer 75 transfer the electronic components measured by the test device 20 to the first transfer station 72 and the second transfer station 73. The first feeder 71 takes out the measured electronic components from the first transfer table 72 and the second transfer table 73, and according to the test results, transfers the measured electronic components to the receiving device 60 of the receiving device. The device 61 is sorted and stored; the central control device is used to control and integrate the actions of each device to perform automated operations to achieve the practical benefits of improving operating efficiency.

[Xizhi]

11‧‧‧machine

12‧‧‧ substrate

121‧‧‧Accommodation Department

13. Circuit board

14‧‧‧ Testing machine

15‧‧‧Test Block

16‧‧‧Mobile arm

17. Heater

18‧‧‧Lower

181‧‧‧Pressing fixture

182‧‧‧Fit surface

[this invention]

20‧‧‧Test device

21‧‧‧ substrate

211‧‧‧Accommodation Department

22 circuit board

23 ‧‧‧ Test Block

24‧‧‧Crimping mechanism

241‧‧‧Moving arm

242‧‧‧Lower pressure device

2421‧‧‧down pressure jig

2422‧‧‧Fit surface

243‧‧‧Temperature working device

25‧‧‧Test machine

261‧‧‧The first runner section

262‧‧‧Insulation parts

2621‧‧‧ Wear

2622‧‧‧Second runner section

2623‧‧‧stop parts

263‧‧‧The third runner section

2631‧‧‧First runner hole

2632‧‧‧Runner

2633‧‧‧Second runner hole

264‧‧‧Sensor

265‧‧‧cooling chip

266‧‧‧ Thermal paint

30‧‧‧machine

31‧‧‧port

32 connecting plate

321‧‧‧ Air supply

41‧‧‧Electronic components

50‧‧‧Feeding device

51‧‧‧ Feeding support

60‧‧‧Receiving device

61.‧‧‧receiving receiver

70‧‧‧Conveying device

7.1‧‧‧First material shifter

7.2 The first transfer station

73‧‧‧Second transfer station

74 second feeder

75‧‧‧ Third material shifter

A‧‧‧Side section

B‧‧‧The front part

C‧‧‧The rear part

Figure 1: Schematic diagram of the use of conventional test equipment. Figure 2: Schematic diagram of the test device and substrate temperature control unit of the present invention. Figure 3: The top view of the first embodiment of the substrate temperature control unit of the present invention. Figure 4: Partial cross-sectional view of the first embodiment of the substrate temperature control unit of the present invention. Figure 5: Schematic diagram of the use of the substrate temperature control unit of the present invention. Figure 6: Partial schematic view of the use of the substrate temperature control unit of the present invention. Figure 7: A schematic diagram of the second embodiment of the substrate temperature control unit of the present invention. Figure 8: A schematic diagram of a third embodiment of the substrate temperature control unit of the present invention. Figure 9: Schematic diagram of the test device of the present invention applied to test classification equipment.

20‧‧‧Test device

21‧‧‧ substrate

211‧‧‧Accommodation Department

22‧‧‧ circuit board

23‧‧‧Test Block

24‧‧‧crimping mechanism

241‧‧‧Mobile arm

242‧‧‧Lower

2421‧‧‧Press down fixture

2422‧‧‧Fit surface

243‧‧‧temperature operating device

25‧‧‧Test machine

261‧‧‧The first runner section

262‧‧‧Insulation parts

2622‧‧‧Second runner section

264‧‧‧Sensor

32‧‧‧Connecting board

321‧‧‧ Air supply

41‧‧‧Electronic components

Claims (8)

A substrate temperature control unit of a test device, the test device is a test seat equipped with at least one test electronic component in the accommodating part of the substrate, the test seat is electrically connected to at least one circuit board located under the substrate, the substrate temperature control unit At least one temperature control component is provided on at least one part of the substrate different from the accommodating portion, and the temperature control component is a temperature control flow channel with a fluid to temperature control the temperature of the substrate to make the substrate and the circuit The plate maintains a preset temperature, and at least one blocking member is provided between the temperature control flow channel and the accommodating portion of the substrate. The substrate temperature control unit of the test device according to item 1 of the patent application scope, wherein the substrate temperature control unit is provided with at least one heat insulation member at the bottom of the substrate. The substrate temperature control unit of the test device according to item 2 of the patent application scope, wherein the temperature control flow channel is provided with a first flow channel section for fluid to flow in the substrate, and at least one A second flow channel segment communicating with the first flow channel segment, the second flow channel segment communicating with at least a third flow channel segment provided on the substrate to discharge fluid. A substrate temperature control unit of a test device, the test device is a test seat equipped with at least one test electronic component in the accommodating part of the substrate, the test seat is electrically connected to at least one circuit board located under the substrate, the substrate temperature control unit At least one temperature control component is arranged on at least one part of the substrate different from the accommodating part, and the temperature control component is a cooling chip to temperature-control the temperature of the substrate to keep the substrate and the circuit board in preset temperature. A substrate temperature control unit of a test device, the test device is a test seat equipped with at least one test electronic component in the accommodating part of the substrate, the test seat is electrically connected to at least one circuit board located under the substrate, the substrate temperature control unit At least one temperature control component is provided on at least one part of the substrate different from the accommodating portion, the temperature control component is a heat dissipation material to temperature-control the temperature of the substrate, so that the substrate and the circuit board maintain a preset temperature . The substrate temperature control unit of the test device according to item 4 or 5 of the patent application scope, wherein the substrate temperature control unit is provided with at least one heat insulation member at the bottom of the substrate. The substrate temperature control unit of the test device according to item 1, 4 or 5 of the patent application scope, wherein the substrate temperature control unit is provided with at least one sensor on the substrate to sense the temperature of the substrate. A test classification device for a substrate temperature control unit using a test device, including: a machine; a feeding device: is assembled on the machine and is provided with at least one feeding holder to accommodate electronic components to be tested; Material device: It is assembled on the machine and equipped with at least one receiving receiver to accommodate the measured electronic components; at least one substrate temperature of the test device according to item 1, 4 or 5 of the patent application Control unit: It is assembled on the machine; Conveyor: It is assembled on the machine and equipped with at least one feeder to transfer electronic components; Central control device: It is used to control and integrate the actions of each device, and Perform automated operations.

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