TW201346293A - Electric component press bonding device, testing equipment applying the same and press bonding control method - Google Patents

Abstract

The present invention provides an electronic component press bonding device, which comprises a pressing mechanism and a temperature control mechanism. The pressing mechanism is configured with a transmission rod and a pressing device. The transmission rod is driven by a driving source for a displacement in at least one direction. The pressing device is configured at one end of the transmission rod and with at least one abutting portion for pressing against the thermal source of the electronic component, and with at least one warping resistant portion for limiting the warpage on the periphery of the electronic component. The temperature control mechanism is configured between the transmission rod of the pressing mechanism and the pressing device for precisely controlling the temperature of the electronic component within a predetermined testing temperature range. Thus, the present invention employs the pressing device of the pressing mechanism to respectively press against different portions of electronic component using the abutting portion and the warping resistant portion, such that each contact of the electronic component is evenly forced and firmly contacted with the probes of the testing base, so as to achieve the practical benefits of test quality enhancement.

Description

Electronic component crimping device, testing device for applying crimping device and crimping control method

The invention provides a crimping device which can improve the test quality by using the pressure device of the pressing mechanism to make the contacts of the electronic component receive the force evenly and actually contact the probe of the test seat.

Nowadays, electronic components (such as ICs with solder balls) will be tested on the test sorter after the production is completed to eliminate defective products. Take the IC test sorter as an example. The test sorter is attached to the test device. The upper part is equipped with a crimping device, and the following test IC is used to make the IC ball of the IC contact the probe of the test stand to perform the test operation to ensure the test quality of the IC; please refer to FIG. 1 for the test device 11 and the pressure A schematic diagram of the device 12 is provided with at least one circuit board 111 having a test socket 112. The test socket 112 is provided with a plurality of probes 113 electrically connected to the solder balls of the IC. The crimping device 12 The test device 11 is located above the test device 11 and is provided with a drive rod 121 that can be moved up and down. The drive rod 121 is used to drive the pressurization tool 122 under the pressure IC; during the test, the test seat 112 of the test device 11 can be The IC 13 is mounted on the top surface of the substrate 131, and the IC 132 is fixed on the bottom surface of the substrate 131. A plurality of solder balls 133 are disposed on the bottom surface of the substrate 131. The crimping device 12 controls the transmission rod 121 to drive the lower pressing fixture. 122 drops the displacement and presses against the IC13 to be tested, so that the test is to be tested The solder ball 133 of the IC 13 is in contact with the probes 113 of the test socket 112 to perform the test operation; however, since the top surface of the substrate 131 of the IC 13 has a high level difference with the wafer 132, when the driving rod 121 drives the lower pressing fixture 122 to press down At the time of IC13, the lower pressing fixture 121 is only pressed against the wafer 132 of the IC 13, and is not pressed against the top surface of the substrate 131 around the wafer 132. Although the solder ball 133 in the middle portion of the IC 13 can be forced to contact the test socket 112. The probe 113, however, causes the solder ball 133 around the IC 13 to be incapable of being in contact with the probe 113 of the test socket 112 due to uneven force, thereby affecting the test quality and needs to be improved.

Therefore, how to design an average force on each contact of an electronic component Contact with the probe of the test stand to improve the quality of the test crimping device, which is the subject of research and development by the manufacturer.

An object of the present invention is to provide an electronic component crimping device which is provided with a press-fit electronic component lower pressing mechanism, wherein the lower pressing mechanism is provided with a transmission rod and a pressure roller, and the transmission rod is driven by a driving source. Displacement in at least one direction, the pressure device is disposed at one end of the transmission rod, and is provided with at least one abutting portion for pressing against a heat source of the electronic component, and at least one anti-warping portion for limiting the electron The peripheral side of the component is warped; thereby, the abutting portion and the anti-warping portion can be pressed down to the different parts of the electronic component by the pressing device of the pressing mechanism, so that the contacts of the electronic component are subjected to the average force and the contact test is performed. The probe of the seat achieves the practical benefit of improving the quality of the test.

A second object of the present invention is to provide an electronic component crimping device, wherein the crimping device is provided with a temperature control mechanism between the driving rod and the pressing device of the pressing mechanism for accurately controlling the electronic component to the pre-control Set the test temperature range to achieve the practical benefits of improving test quality.

The third object of the present invention is to provide an electronic component crimping device, wherein the temperature control mechanism comprises a heat exchange body having a water inlet and a water outlet, and a heat conducting member having a silicon plate, and is provided with a temperature control device capable of heating the pressure roller. For adjusting the cooling performance, the fins of the heat conducting member are accommodated inside the heat exchange body, and the water inlet of the other heat exchange body is connected to the fluid supply machine, and the fluid supply machine comprises a water cooler and a water heater, and is provided with The switch control device for the output fluid of the water cooler or the warm water machine can be switched, so that the temperature of the electronic component can be controlled, and the water output of the water cooler or the warm water machine can be controlled to assist the temperature control to adjust the cooling performance and reduce the consumption of the temperature control. Electricity, to achieve more practical benefits of energy and cost savings.

A fourth object of the present invention is to provide an electronic component crimping apparatus, wherein the temperature control mechanism is provided with at least one conductive member capable of controlling temperature conduction performance for assisting in controlling the temperature of the electronic component to a preset test temperature. Scope, to achieve practical benefits of improved performance.

A fifth aspect of the present invention provides an electronic component crimping apparatus, wherein the crimping apparatus is provided with at least one abutting portion or a pressure gauge under the anti-warping portion. The shifting mechanism is provided with a pressure control member with a chamber above the lower pressing fixture, and the chamber of the pressure regulating member communicates with at least one fluid passage through which the fluid can flow, which can not only displace the lower pressing fixture And using the fluid pressure in the control chamber, and the amount of downward pressure of the abutting portion or the anti-warping portion under the pressure regulating member can be adjusted steplessly, so that the abutting portion driven by the transmission rod and the displacement mechanism respectively The anti-warping part has a pressure difference, and then, depending on the crimping operation, presses the electronic component with different pressing amounts to achieve the purpose of improving the use efficiency.

A sixth object of the present invention is to provide a testing device for applying an electronic component crimping device, which is provided with a feeding device, a receiving device, a testing device, a crimping device, a conveying device and a central control device. The material device is for accommodating at least one electronic component to be tested, the receiving device is for accommodating at least one electronic component to be tested, and the testing device is provided with a test circuit board with a test socket for testing electronic components, crimping The device is used for crimping electronic components, so that the contacts of the electronic components are evenly stressed and actually contact the probes of the test socket, and the conveying device is provided with at least one shifting mechanism of the shifting device for transferring the electronic components. The central control device is used to control and integrate the operation of each device to perform automated operations, to achieve automated testing and to improve the practical benefits of testing production efficiency.

A seventh object of the present invention is to provide a crimping control method, wherein the crimping device presses the electronic component at a low speed, and the sensing unit senses the pressing force of the crimping device, and transmits the sensing data to the central control. When the pressing force of the crimping device reaches the set value, the position detecting unit detects the current position of the crimping device and transmits the data to the central control device, and the central control device establishes the data transmitted according to the position detecting unit. When the crimping device is pressed against the reference position, when the next electronic component test operation is performed, the central control device can control the pressure device to be decelerated before being displaced to the reference position, and is displaced to the pressed reference position to perform pressing against the electronic component. The test operation; thereby, when performing the batch electronic component test operation, the pressure device can be controlled to be displaced to the preset pressure contact position, and the set pressure is pressed against the electronic component to improve the stability of the crimping operation. And the practical benefits of quality.

In order to make the reviewer further understand the present invention, it is better to The embodiment and the drawings are detailed as follows: Referring to Figures 2, 3 and 4, the electronic component crimping device 20 of the present invention is provided with a pressing mechanism for pressing down the electronic component to be tested, and the pressing mechanism is The transmission rod 21 and the pressure roller 22 are provided. The transmission rod 21 is driven by the driving source (not shown) to be displaced in at least one direction, and is used to drive the pressure device 22 to press down the electronic component. Further, the transmission rod 21 is driven. An actuator is provided at one end for connecting the driving presser 22. In the embodiment, the connecting device includes a transmission member 211 and a plurality of connecting members 212. The upper portion of the transmission member 211 is coupled to the transmission rod 21, and is fixed below. A plurality of connecting members 212 are disposed; the pressing device 22 is disposed at one end of the driving rod 21, and is provided with at least one abutting portion for pressing against a heat source of the electronic component, and at least one anti-warping portion is provided. In order to limit the warpage of the electronic component on the circumference side, further, the presser 22 includes at least a lower pressure fixture, and abutting portion and a warpage preventing portion having a high and low difference are fixed on the bottom of the lower pressing fixture to abut When the part is pressed against the heat source of the electronic component, the anti-warpage portion can be used to limit the peripheral side warpage of the electronic component The presser 22 can also include a plurality of pressing tools, and at least a lower pressing device is provided with an abutting portion, and at least a lower pressing device is provided with an anti-warping portion, and each pressing device can be visually used. The fixed and movable designs are respectively required, or both are movable designs, and the crimping device 20 is provided with a transfer mechanism that can displace at least the lower pressure fixture, and the transfer mechanism can be used to press the fixture. The elastic member is provided with a spring, and a spring with a suitable elastic force is selected according to the use to control the pressing force of the pressing fixture, or the fluid pressure is applied above the pressing fixture. Pushing the pressure-control member as a linear displacement, and by controlling the fluid pressure, the amount of depression of the abutting portion or the anti-warping portion under the pressure-control member can be adjusted steplessly, so that the two are driven by the transmission rod and the displacement mechanism respectively. The abutting portion and the anti-warping portion have a pressure difference, and are pressed against the electronic component by different pressing amounts as required for the crimping operation. In the embodiment, the pressing device 22 includes the first pressing device 221 and The second pressing fixture 222, the first pressing fixture 221 is fixed to the connection of the transmission rod 21 The connecting member 212 is synchronously displaced with the transmission rod 21 with respect to the peripheral side of the electronic component. The first pressing fixture 221 is provided with a receiving hole 2211 at the middle portion and the bottom portion as the anti-warping portion 2212. To limit the warpage of the electronic component on the circumference side, the second lower pressing fixture 222 is located in the receiving hole 2211 of the first pressing fixture 221, and is opposite to the electric The heat source of the sub-element is provided with an abutting portion 2221 for pressing against the heat source of the electronic component, and a transfer mechanism is disposed above the second lower press fixture 222, and the transfer mechanism is applied to the second pressing A pressure control member 23 having a chamber 231 is disposed between the fixture 222 and the transmission rod 21, and the chamber 231 of the pressure control member 23 communicates with at least one fluid passage for circulating a fluid which can be a gas or a liquid, and further, A panel having a fluid passage is separately assembled above the pressure control member 23, or a fluid passage is directly formed in the transmission member 211 of the transmission rod 21, which is directly in the transmission member 211 of the transmission rod 21 in this embodiment. The fluid passage 213 is opened for injecting gas into the chamber 231 of the pressure control member 23, so as to have a displacement space between the pressure control member 23 and the transmission member 211, and the pressure control member 23 is provided with a plurality of sleeves that can be sleeved. The sleeve hole 232 of the 212 allows the pressure control member 23 to be moved up and down along the coupling member 212, thereby adjusting the pressure of the gas in the chamber 231 of the pressure control member 23 to control the second depression of the abutting portion 2221. The amount of depression of the jig 222 can not only make the second pressing fixture 222 and the first pressing fixture 2 21 has a high and low level difference. Since the first pressing fixture 221 having the anti-warping portion 2212 controls the amount of depression by the transmission rod 21, the migration mechanism can also control the fluid pressure to make the abutting portion 2221 and the anti-warping portion 2212. It has a pressure difference and is pressed against the electronic component with different pressing force as required by the crimping operation, and the crimping device 20 is provided with a temperature control mechanism between the transmission rod 21 and the pressing device 22 for accurately The electronic component is controlled by a predetermined test temperature range. In this embodiment, the temperature control mechanism includes a heat exchange body 24, a heat conduction member 25, a temperature control, and the like, wherein the bottom surface of the heat exchange body 24 is concavely provided with a hollow cavity. In the chamber 241, a top surface of the chamber 241 is provided with a water inlet 242 for flowing a cooling fluid. In the embodiment, the water inlet 242 is disposed at an intermediate position of the top surface of the chamber 241, and the water inlet 242 is connected to the heat exchange body. 24 side and can input a fluid input pipe 243 for cooling a liquid such as water, gas, etc., and the fluid input pipe 243 is connected to a fluid supply machine (not shown). The fluid supply machine includes a water cooler and a water heater, and is provided with switchable water cooling. Switching control of machine or warm water output fluid In the embodiment, the fluid input tube 243 of the crimping device 20 is connected to the water cooler and the warm water machine, and is provided with a switching control device that can switch the output fluid of the water cooler or the warm water machine, thereby visually testing the operating temperature. In the heat exchange body 24 Input cold water or warm water to adjust the cooling performance. For example, when the temperature of the cold water originally input is too low, and the temperature of the electronic component is lower than the preset test temperature, the input warm water can be changed into the heat exchange body 24 to make the heat The switching body 24 is appropriately warmed up to adjust the cooling performance to reduce the power consumption of the temperature control, thereby accurately controlling the electronic components to a preset test temperature range, thereby achieving the practical benefit of reducing power loss, and further including temperature. The control mechanism is provided with a flow device for controlling the flow rate of the cooling fluid to assist in controlling the cooling performance, and also reduces the power consumption of the temperature control, thereby reducing the power loss, and is further disposed around the chamber 241 of the heat exchange body 24. A plurality of water outlets 244, each of which can communicate with a fluid outlet tube 245 located at a side of the heat exchange body 24. In the present embodiment, each water outlet 244 communicates with a flow guiding groove 246 located at a top surface of the heat exchange body 24. The flow cell 246 is connected to the fluid output pipe 245 of the heat exchange body 24 for outputting the cooling fluid after the heat exchange, and then assembling the top surface of the heat exchange body 24 to prevent the fluid from leaking. In the present embodiment, the pressure-control member 23 is directly used as a cover, and the heat exchange body 24 is provided with a plurality of through holes 247 which can be placed on the connecting member 212 so that the heat exchange body 24 can be along the connecting member 212. For the lifting displacement, the heat conducting member 25 is located below the heat exchange body 24, and the array of fins 251 is disposed on the top surface, and the fins 251 are placed in the chamber 241 of the heat exchange body 24, and the temperature is controlled. The mechanism is further included between the heat conducting member 25 and the second lower pressing fixture 222, or the bottom of the second pressing fixture 222 and the electronic component are equipped with a temperature control which can be a cooling wafer, a heating member, etc., in this embodiment. The temperature control is a heating element 26, and a graphite sheet with thermal conductivity is disposed above and below the heating element 26. The temperature control mechanism further comprises a heating element capable of preventing dew condensation on the surface of the element, and further, The surface of the heat exchange body 24, the pressure regulating member 23 or the heat conducting member 25 is covered with a temperature increasing member. In the embodiment, the surface of the heat exchange body 24 is covered with a temperature rising member which can be a heating wire 248. The surface of the heat exchange body 24 is appropriately heated to a normal temperature to prevent condensation, and The crimping device 20 is provided with a temperature sensing unit for sensing the temperature change of the electronic component, and the temperature sensing unit may be a temperature sensor for sensing the surface temperature of the electronic component or sensing the second pressing fixture, or the electronic component itself The built-in temperature sensor, or other temperature sensing circuit for sensing the actual temperature inside the electronic component, etc., in this embodiment, the second pressing fixture 222 The bottom surface is provided with a temperature sensor 27 for sensing the surface temperature of the electronic component, and connecting the temperature signal to the central control unit (not shown) by a line.

Referring to FIG. 5, a crimping device 20 is applied to a schematic diagram of an electronic component 40 to be tested in a test device 30. The test device 30 is provided with a test circuit board 31 having a test socket 32. The plurality of probes 33 are mounted on the top surface of the substrate 41 after the electronic component 40 to be tested is mounted on the top surface of the substrate 41, and the heat source of the wafer 42 is fixed on the substrate 41. The bottom surface is disposed with a plurality of contacts which can be solder balls 43. The transmission rod 21 of the crimping device 20 can drive the first lower pressing fixture 221 downward by the transmission member 211 and the connecting member 212, because the second lower pressing is performed. The 222 series is connected to the heat conducting member 25, and the heat conducting member 25 is coupled to the heat exchange body 24, and the transmission rod 21 can use the heat exchange body 24 to drive the second lower pressing fixture 222 to synchronously descend the displacement, because the second pressing fixture The abutting portion 2221 of the second pressing fixture 222 has a high and low level difference, so that the abutting portion 2221 of the second pressing fixture 222 is first pressed against the wafer 42 of the electronic component 40, and further The solder ball 43 in the middle position of the bottom surface of the electronic component 40 to be tested is pressed to actually contact the test socket 32. The probe 33, the temperature sensor 27 is pushed by the reaction force of the wafer 42 to move inwardly, and senses the surface temperature of the electronic component 40 to be tested, and transmits the temperature signal to the central control device (not shown); Referring to FIG. 6, the transmission rod 21 of the crimping device 20 continues to drive the first and second pressing fixtures 221 and 222 and the temperature control mechanism to move down synchronously, so that the anti-warpage portion 2212 of the first lower pressing fixture 221 is pressed down. The periphery of the top surface of the substrate 41 of the electronic component 40 to be tested is such that the solder balls 43 around the bottom surface of the electronic component 40 to be tested are pressed to actually contact the probe 33 of the test socket 32. At this time, the second lower pressing fixture 222 is subjected to The reaction force of the electronic component 40 to be tested is pushed up and displaced upward, and the heat conduction member 25, the heat exchange body 24 and the pressure control member 23 are moved upward. Because of the displacement space between the pressure control member 23 and the transmission member 211, the pressure control member 23 The gas in the chamber 231 can be compressed, so that the second pressing fixture 222 is upwardly buffered, and then the abutting portion 2212 of the first pressing fixture 221 and the abutting portion 2221 of the second pressing fixture 222 are respectively When the substrate 41 of the electronic component 40 is pressed against the wafer 41 and the wafer 42 is high, the height difference is generated due to the first and second pressing. The fixtures 221 and 222 are respectively pressed against the peripheral position and the intermediate position of the electronic component 40 to be tested, and the crimping device 20 can fully press the electronic component 40 to be tested, so that the solder balls 43 of the electronic component 40 to be tested are averaged. It is forced to contact the probe 33 of the test socket 32 to improve the quality of the test work. Furthermore, since the electronic component 40 performs the test operation, it will quickly generate self-heating, so that the electronic component 40 can be accurately controlled. The preset test temperature range can be used to conduct the high temperature of the electronic component 40 to the heat conduction member 25 and the fin 251 by using the second pressing fixture 222. At this time, the fluid input tube 243 of the temperature control mechanism can cool the output of the water cooler. The fluid is delivered into the heat exchange body 24, and the cooling fluid is injected into the chamber 241 from the water inlet 242 at the intermediate position. Since the water inlet 242 is at the intermediate position, the cooling fluid and the heat conducting member 25 correspond to the electron to be tested. The fin 251 of the intermediate heat source of the component 40 first performs a cold heat exchange, and can greatly reduce the high temperature of the electronic component 40, and the temperature control mechanism prevents the temperature of the electronic component 40 from falling below a preset test temperature range, and the temperature control machine The heating element 26 can be controlled to raise the temperature of the second pressing fixture 222 to adjust the cooling performance, so that the electronic component 40 performs the testing operation within a preset test temperature range, and the water outlet 244 can be dispersed around the chamber 241. The cooling fluid is radially flowed from the intermediate position to the periphery, and a large-area and uniform heat exchange with the fins 251 around the heat conducting member 25 is performed to comprehensively reduce the high temperature of the peripheral portion of the electronic component 40, thereby making the electronic component 40 uniform. After the temperature is lowered, the cooled cooling fluid flows from each of the water outlets 244 into the flow guiding groove 246 on the top surface of the heat exchange body 24, and is again discharged into the fluid output pipe 245, and the fluid output pipe 245 outputs the water liquid.

Please refer to FIG. 7 , which is an electronic component test sorting machine applying the above-mentioned crimping device 20 , which comprises an organic table 50 , a feeding device 60 , a receiving device 70 , a testing device 30 , a crimping device 20 , and a conveying device . The device 80 and the central control device are disposed on the machine 50 for accommodating at least one electronic component to be tested. In this embodiment, the feeding device 60 is configured with at least one electronic component to be tested. The receiving device 70 is disposed on the machine 50 for accommodating at least one electronic component that is inspected. In this embodiment, a plurality of trays for loading electronic components of different levels are provided. 71; the test device 30 A test circuit board 31 having test sockets 32 is provided, each of which has a probe 33 therein, and transmits a test result to a central control device (not shown) by a tester (not shown). The central control device controls the operation of each device; at least one crimping device 20 is the same as the above-mentioned crimping device (please refer to Figures 2, 3 and 4), and is disposed on the machine table 50 for pressing against the test seat 32. The electronic component is such that the solder balls of the electronic component actually contact the probe 33 of the test socket 32 to improve the test quality; the transport device 80 is disposed on the machine 50 and is provided with at least one shifting mechanism of the shifter. In the present embodiment, the transport device 80 includes a first transfer mechanism 81, a transport mechanism 82, and a second transfer mechanism 83. The first transfer mechanism 81 is provided with at least one A shifter 811 is configured to transfer the electronic components to be tested/tested between the feeding device 60, the receiving device 70 and the carrying mechanism 82. The carrying mechanism 82 is provided with at least one loading platform 821 for The electronic component to be tested/completed is carried between the first transfer mechanism 81 and the second transfer mechanism 83, and the second transfer mechanism 83 is At least a second hopper 831 move to the respective test apparatus 30 and the loading mechanism 82 transfer the test / measurement of the finished electronic device.

Referring to FIG. 8, the first shifter 811 of the first transfer mechanism 81 is displaced to the feeding device 60, and the electronic component 40 to be tested is taken out in the tray 61, and then the first transfer mechanism 81 The first shifter 811 is configured to transfer the electronic component 40 to be tested to the carrier 821 of the carrier mechanism 82. Referring to FIG. 9, the carrier 821 is placed on the electronic component 40 to be tested. Y axial displacement, carrying the electronic component 40 to be tested to the side of the second transfer mechanism 83, the second shifter 831 of the second transfer mechanism 83 is displaced to the stage 821, and on the stage The electronic component 40 to be tested is taken out at 821; please refer to FIG. 10 (please refer to FIGS. 5 and 6), and the second shifter 831 of the second transfer mechanism 83 moves the electronic component 40 to be tested. In the test socket 32 of the testing device 30, the transmission rod 21 of the crimping device 20 can drive the first and second pressing fixtures 221 and 222 to be synchronously displaced downward by using the transmission member 211 and the connecting member 212, and firstly The abutting portion 2221 of the pressing fixture 222 is pressed against the wafer 42 of the electronic component 40 to be tested, so that the solder ball 43 in the middle position of the bottom surface of the electronic component 40 to be tested is pressed. Contacting the probe 33 of the test socket 32, the temperature sensor 27 on the second lower pressing fixture 222 can sense the surface temperature of the electronic component 40 to be tested, and then press the anti-warpage portion 2212 of the first pressing fixture 22. Abutting the top surface of the substrate 41 of the electronic component 40, the solder balls 43 around the electronic component 40 to be tested are pressed to actually contact the probe 33 of the test socket 32. At this time, the second pressing fixture 222 can be upward. The cushioning displacement, and the abutting portion 2221 of the first pressing device 221 and the second pressing device 222 can be pressed against the substrate 41 and the wafer 42 of the electronic component 40 at different working heights, respectively. The connecting device 20 is fully pressed against the electronic component 40 to be tested, so that the solder balls 43 of the electronic component 40 to be tested are evenly stressed and actually contact the probe 33 of the test socket 32 to improve the quality of the test work, and further, crimping The device 20 can use the fluid input pipe 243 to deliver the cooling fluid into the heat exchange body 24, and inject the cooling fluid into the chamber 241 from the water inlet 242 at the intermediate position, so that the cooling fluid and the fin 251 of the heat conducting member 25 are made one. Cold and hot exchange, which can greatly reduce the high temperature of the electronic component 40, and then has cooled The fluid flows from the water outlets 244 into the flow guiding grooves 246 of the heat exchange body 24, and then flows into the fluid output pipe 245, and the liquid output pipe 245 outputs the water liquid, thereby controlling the electronic component 40 to be preset. Test temperature range; please refer to Figures 4, 11, and 12, after the test device 30 is tested for the electronic component 40, the crimping device 20 controls the first and second pressing fixtures 221, 222 to be reset, and the second transfer mechanism 83 The second shifter 831 is displaced to the test stand 32 to take out the tested electronic component 40 and transferred to the carrier 821 of the carrier mechanism 82. The carrier 821 carries the completed electronic component 40 to the first On the side of the material transfer mechanism 81, the first loader 811 of the first material transfer mechanism 81 takes out the measured electronic component 40 on the stage 821, and transfers the completed electronic component 40 to the test result. The receiving device 70 is placed in the tray 71 of the receiving device 70 to achieve the practical benefit of sorting and collecting.

Referring to FIG. 13 , it is another embodiment of the crimping device of the present invention. The pressing mechanism of the crimping device 20A includes a transmission rod 21A and a presser 22A. The transmission rod 21A is provided with a coupling at one end. For connecting and driving at least one presser 22A, in the embodiment, the linker includes a transmission member 211A and a plurality of branches The connecting member 212A, the top surface of the transmission member 211A is coupled to the transmission rod 21A, and the plurality of connecting members 212A are fixed on the inner top surface; the pressing device 22A includes a first lower pressing fixture 221A and a second lower pressing fixture 222A. The second pressing fixture 222A is fixedly coupled to one end of the transmission member 211A of the transmission rod 21A, and is opposite to the heat source of the electronic component, and has a bottom portion as the abutting portion 2221A for pressing against the heat source of the electronic component. The driving rod 21A is synchronously displaced, and the receiving hole 2222A is disposed around the bottom surface of the second pressing fixture 222A for assembling the first pressing fixture 221A with the elastic member, and the elastic member can be the spring 2213A. The first lower pressing fixture 221A can be elastically moved up and down in the receiving hole 2222A, and the bottom of the first lower pressing fixture 221A can be used as the anti-warping portion 2212A for limiting the peripheral side warpage of the electronic component, and further, crimping The device 20A is provided with a temperature control mechanism between the transmission rod 21A and the pressure roller 22A for accurately controlling the electronic component to a preset test temperature range. In this embodiment, the temperature control mechanism includes a heat exchange body 24A, Heat conduction member 25A and heating member 26A, wherein the heat exchange body 24A The surface recess is provided with a hollow chamber 241A. The chamber 241A is provided with a water inlet 242A through which the cooling fluid can flow, and the water inlet 242A is connected to a fluid input pipe 243A for inputting a fluid such as cooling water, gas or the like. The fluid inlet pipe 243A can be connected to the fluid supply device, and a plurality of water outlets 244A are disposed around the chamber 241A of the heat exchange body 24A. The water outlets 244A can communicate with the flow guiding grooves 246A on the top surface of the heat exchange body 24A. The flow cell 246A is connected to the fluid output pipe 245A of the heat exchange body 24A for outputting the cooling fluid after the heat exchange, and then the top surface of the heat exchange body 24A is equipped with a cover 249A for preventing fluid leakage, and The driving member 211A of the pressing mechanism is internally provided with a driving source for driving the heat exchange body 24A for lifting and lowering. In this embodiment, the driving source is provided with a motor 214A inside the transmission member 211A, and the motor 214A is driven by a lead screw. The 215A is connected to the cover 249A of the heat exchange body 24A by the lead screw 215A for driving the heat exchange body 24A for lifting displacement, and the heat exchange body 24A is provided with a plurality of sleeves that can be placed on the joint The perforation 247A on the 212A enables the heat exchange body 24A to be stable along the joint 212A. The heat conducting member 25A is disposed below the heat exchange body 24A, and is provided with an array of fins 251A on the top surface, and the fins 251A are placed in the chamber 241A of the heat exchange body 24A, and in the second A temperature control member for the heating member 26A is fixed on the pressing fixture 222A, and a graphite sheet having thermal conductivity is disposed above and below the heating member 26A, and the crimping device 20A is provided with a temperature change of the sensing electronic component. a temperature sensing unit, which may be a temperature sensor for sensing the surface temperature of the electronic component or sensing the second pressing fixture, or a temperature sensor built in the electronic component itself, or other sensing electronic component In the present embodiment, the bottom surface of the second lower pressing fixture 222A is provided with a temperature sensor 27A for sensing the surface temperature of the electronic component and connecting the temperature signal to the center by the line. The control unit (not shown), further, the crimping device 20A is provided with a conductive member 28A for controlling the temperature conduction performance, the conductive member 28A can be a flexible conductive sheet, and the conductive member 28A can be disposed at the second pressing Between fixture 222A and heating element 26A, or in heating element 26A and heat conduction Between 25A, the amount of elastic deformation of the conductive member 28A can be controlled to adjust the distance between the heating member 26A and the second lower pressing fixture 222A (or the heat conducting member 25A) to control the efficiency of temperature conduction. In this embodiment, An elastic conductive member 28A is disposed between the heating member 26A and the heat conducting member 25A. When the temperature of the electronic component is maintained at a preset test temperature, the conductive member 28A can be used to make the heating member 26A and the heat conducting member 25A larger. The distance between the heat exchange body 24A is delayed, so as to prevent the temperature of the electronic component from being lower than the preset test temperature, and reducing the electrical energy loss of the heating element 26A. When the temperature of the electronic component is higher than the preset test temperature, Then, the motor 214A can be controlled to drive the heat exchange body 24A to be displaced downward by the lead screw 215A, so that the heat exchange body 24A compresses and deforms the lower conductive member 28A via the heat conducting member 25A, and shortens the distance between the heating member 26A and the heat conducting member 25A. The low temperature conduction of the heat exchange body 24A is improved to accurately control the temperature of the electronic component to a preset test temperature range, thereby improving the cooling performance.

Please refer to Figures 14 and 15 for the crimping control method of the present invention, which is used for constructing the pressing force according to the test batch electronic component, and can finely adjust the pressing force, thereby optimizing the pressure. Power against electronic components to perform test operations, batches The electronic component means that the electronic component of the whole batch is the same type of electronic component, and the crimping control method comprises the following steps: Step 91: The crimping device 20 is driven to be pressed against the electronic component. In the embodiment, the crimping device 20 At a low speed displacement, for example, a low speed displacement of 0.1 to 0.5 mm/sec, the abutting portion and the anti-warpage portion of the pressure roller are respectively pressed against the heat source of the electronic component and the peripheral side of the substrate, so that the portions of the bottom surface of the electronic component are tin. The ball can be contacted with the probe of the test stand on average, and achieve the benefit of stable electrical conduction; Step 92: The sensing unit 100 senses the pressing force of the crimping device 20 and transmits the sensing data to the central control device 110, further, the sensing unit 100 can be provided with a sensor (not shown) on the crimping device 20 or the test socket, and the sensor can be a force sensor for sensing the crimping device 20 In the present embodiment, the sensing unit 100 is provided with a force sensor on the crimping device 20, and the force sensor can sense the abutting portion and the anti-warping portion of the crimping device 20. The power on the electronic components, and then transmit the sensing data to the central control unit Step 93: When the pressing force of the crimping device 20 reaches the set value, the position detecting unit 120 stores the current position data of the crimping device 20 in the central control device 110, and further, the central control device 110 A database for storing data required for the test operation is provided, and the pressing force data required for pressing the electronic component can be set in the database, and the position detecting unit 120 can be configured with the position on the crimping device 20 or the machine. A sensor (not shown) is used to sense the position of the presser of the crimping device 20, and the central control device 110 is connected by a line. In this embodiment, the position detecting unit 120 can be used in the crimping device 20 A position sensor is disposed on the central control device 110. When the central control device 110 is informed by the sensing data transmitted by the sensing unit 100 that the pressing force of the crimping device 20 has reached a preset value in the database, the central control device 110 is configured. The control position detecting unit 120 detects the current position of the crimping device 20, and the position detecting unit 120 transmits the current position of the crimping device 20 to the database of the central control device 110; Step 94: The central control device 110 checks the position according to the position The data transmitted by the unit 120 establishes the pressing position of the crimping device 20, and in the embodiment, the central control device 110 can detect that the crimping device 20 is pressed according to the position detecting unit 120. The position of the initial electronic component, and the pressure of the subsequent electronic component as the crimping device 20 Step 95: When performing the next electronic component test operation, the central control device 110 controls the pressure device 20 to be pressed against the reference position to press the electronic component to perform the test operation according to the data. In this embodiment, When performing the test operation of each electronic component in the same batch, the central control device 110 can control the pressure-bonding device 20 to decelerate the displacement before the pressure is pressed against the reference position according to the data established by the database, and the position where the crimping device 20 starts to decelerate can be visualized. The electronic component tolerance of the batch is set. For example, when the pressure device of the crimping device 20 is displaced to 0.2 to 0.5 mm from the electronic component to be tested, the deceleration is started, and the pressure roller is displaced to the reference position to press the electron. The component performs a test operation. Further, when the crimping device 20 is pressed against the electronic components, the force sensor of the sensing unit 100 can feed back the pressing force of each sensing crimping device 20 to the central control device 110. The central control device 110 performs an analysis and determination. If the pressing force of the crimping device 20 is different from the set value, the central control device 110 can issue a warning by using the warning unit 130. 130 can siren alarm, or will display an error message appears on the screen.

[study]

11‧‧‧Testing device

112‧‧‧ test seat

111‧‧‧Circuit board

113‧‧‧Probe

12‧‧‧Crimping device

121‧‧‧Transmission rod

122‧‧‧Under pressure fixture

13‧‧‧IC

131‧‧‧Substrate

132‧‧‧ wafer

133‧‧‧ solder balls

〔this invention〕

20, 20A‧‧‧ crimping device

21, 21A‧‧‧ drive rod

211, 211A‧‧‧ transmission parts

212, 212A‧‧‧Links

213‧‧‧ fluid passage

214A‧‧‧Motor

215A‧‧‧ lead screw

22‧‧‧Bender

221, 221A‧‧‧First pressing fixture

2211‧‧‧ accommodating holes

2212, 2212A‧‧ ‧ anti-warming department

2213A‧‧ Spring

222, 222A‧‧‧Second pressing fixture

2221, 2221A‧‧‧Apartment

2222A‧‧‧Holding holes

23‧‧‧Control parts

231‧‧ ‧ room

232‧‧‧Close hole

24, 24A‧‧‧ heat exchange body

241, 241A‧‧ ‧ chamber

242, 242A‧‧ ‧ water inlet

243, 243A‧‧‧ fluid input tube

244, 244A‧‧ ‧ water outlet

245, 245A‧‧‧ fluid output tube

246, 246A‧‧ ‧ diversion trough

247, 247A‧‧‧ perforation

248, 248A‧‧‧ heating wire

249A‧‧‧ Cover

25, 25A‧‧‧ heat conduction parts

251, 251A‧‧‧ fins

26, 26A‧‧‧heating parts

27, 27A‧‧ ‧ temperature sensor

28A‧‧‧Transmission parts

30‧‧‧Testing device

31‧‧‧Test circuit board

32‧‧‧ test seat

33‧‧‧Probe

40‧‧‧Electronic components

41‧‧‧Substrate

42‧‧‧ wafer

43‧‧‧ solder balls

50‧‧‧ machine

60‧‧‧Feeding device

61‧‧‧Tray

70‧‧‧Receiving device

71‧‧‧Tray

80‧‧‧Conveyor

81‧‧‧First Transfer Mechanism

811‧‧‧First mover

82‧‧‧ Carriers

821‧‧‧ stage

83‧‧‧Second transfer mechanism

831‧‧‧Second shifter

91~95‧‧‧Steps

100‧‧‧Sensor unit

110‧‧‧Central control unit

120‧‧‧Location detection unit

130‧‧‧Warning unit

Figure 1: Schematic diagram of the use of conventional crimping devices and test devices.

Fig. 2 is an external view of the crimping device of the present invention.

Figure 3 is an exploded view of the crimping device of the present invention.

Figure 4 is a cross-sectional view of the crimping device of the present invention.

Figure 5: Schematic diagram of the use of the crimping device of the present invention (1).

Figure 6: Schematic diagram of the use of the crimping device of the present invention (2).

Figure 7 is a schematic view of an electronic component test sorter using the crimping device of the present invention.

Figure 8: Schematic diagram (1) of the electronic component test sorting machine of the present invention.

Figure 9: Schematic diagram of the electronic component test sorter of the present invention (2).

Figure 10: Schematic diagram of the electronic component test sorter of the present invention (3).

Figure 11: Schematic diagram of the electronic component test sorter of the present invention (4).

Figure 12: Schematic diagram of the electronic component test sorter of the present invention (5).

Figure 13 is a view showing another embodiment of the crimping apparatus of the present invention.

Figure 14 is a schematic view showing the crimping control method of the present invention.

Figure 15: Block diagram of the application of the crimp control method.

20‧‧‧Crimping device

21‧‧‧ Transmission rod

211‧‧‧ transmission parts

212‧‧‧Links

213‧‧‧ fluid passage

22‧‧‧Bender

221‧‧‧First pressing fixture

2211‧‧‧ accommodating holes

2212‧‧‧Anti-warming department

222‧‧‧Second pressing fixture

2221‧‧‧Apartment

23‧‧‧Control parts

231‧‧ ‧ room

24‧‧‧Heat Exchange Ontology

241‧‧‧ chamber

242‧‧‧ water inlet

243‧‧‧ Fluid input tube

244‧‧‧Water outlet

245‧‧‧ fluid output tube

246‧‧‧Guide trough

248‧‧‧heating line

25‧‧‧Heat conductive parts

251‧‧‧Fins

26‧‧‧heating parts

27‧‧‧temperature sensor

Claims (10)

An electronic component crimping device is provided with a pressing mechanism for pressing down an electronic component in a test socket, the pressing mechanism comprising: a transmission rod: driven by a driving source for at least one direction displacement; a pressing device: The utility model is disposed at one end of the transmission rod, and is provided with at least one abutting portion for pressing against the heat source of the electronic component, and at least one anti-warping portion for limiting the warping of the electronic component on the circumferential side. The electronic component crimping device according to claim 1, wherein the pressor comprises a plurality of pressing fixtures, and at least a lower pressing fixture is provided with an abutting portion, and at least a lower pressing fixture With anti-warping department. The electronic component crimping device according to claim 2, wherein the pressing mechanism is configured to enable at least one abutting portion to be pressed under the pressing device or to have a displacement of the pressing member under the anti-warping portion Transfer mechanism. The electronic component crimping device according to claim 3, wherein the shifting mechanism is provided with a pressure regulating member having a chamber above the lower pressing fixture, and the chamber of the pressure regulating member is connected to at least one The fluid passage of the fluid can be circulated, and the pressure of the fluid can be controlled so that the abutment portion and the anti-warpage portion have a pressure difference to adjust the amount of depression. The electronic component crimping device according to claim 1 or 2, wherein the crimping device is provided with a temperature control mechanism between the driving rod and the pressure roller of the pressing mechanism or between the pressure roller and the electronic component. The temperature of the electronic component is controlled to a preset test temperature range, and the temperature control mechanism is provided with a temperature control capable of heating the pressure roller. The electronic component crimping device according to claim 5, wherein the water inlet of the temperature control mechanism is connected to a fluid supply device or a flow device. The electronic component crimping device according to claim 5, further comprising the temperature control mechanism is provided with at least one conductive member capable of controlling temperature conduction performance. A testing device for applying an electronic component crimping device, comprising: a machine; a feeding device: configured on the machine to accommodate at least one electronic component to be tested; and a receiving device: configured on the machine to accommodate At least one electronic component tested; test device: configured on the machine and equipped with at least one test socket a circuit board for testing electronic components; at least one of the electronic component crimping devices according to claim 1 of the patent application scope, the following electronic components; and a conveying device: a loading mechanism for at least one shifter; Used to transfer electronic components; central control device: used to control and integrate the operation of each device to perform automated operations. A crimping control method according to item 8 of the patent application scope, wherein the crimping control method is: a. The crimping device is pressed against the electronic component; b. The sensing unit senses the pressing force of the crimping device and transmits the sensing data to the central control device; c. When the pressing force of the crimping device reaches the set value, the position detecting unit transmits the current position data of the crimping device to the central control device; d. The central control device establishes the pressing reference position of the crimping device according to the data transmitted by the position detecting unit; e. When performing the next electronic component test operation, the central control device can control the pressure device to be displaced to the reference position to perform the press-fitting electronic component test operation. According to the crimping control method of claim 9, wherein the central control device can analyze and discriminate the data fed back by the sensing unit, and if the pressing force of the crimping device is different from the set value, the central control device can Use the warning unit to issue a warning.