TW201331591A - Crimping device for electronic component inspection apparatus - Google Patents

Abstract

A crimping device for an electronic component inspection apparatus is disposed on a machine with a testing device and provided with at least one pressing head driven to perform at least Z-axis displacement by a driving mechanism. The pressing head is provided with a support base with a plurality of support holes, and each support hole of the support base is provided with a crimping member for pressing an electronic component. In addition, a connection member connectable with the driving mechanism is disposed on top of the support base, and the connection member is provided with a plurality of sleeving member for being sleeved with each crimping member. An elastic member is disposed between each sleeving member and each crimping member such that the crimping member can be moved in an elastic and floating manner. As such, when the pressing head presses a plurality of electronic components at the same time, each crimping member can perform Z-axis floating displacement to adjust the crimping operation height, such that the plurality of electronic components under test can bear the force evenly during testing so as to enhance the testing quality.

Description

Crimp device for electronic component testing equipment

The invention provides a crimping device which can make the crimping members of the lower pressing head be pressed and displaced against the electronic components, so that the plurality of electronic components are evenly stressed to perform the testing operation, thereby improving the testing quality.

Nowadays, electronic components must go through multiple production processes. In order to ensure the quality of electronic components, the industry will conduct various testing operations before electronic components are shipped to the client to detect whether the electronic components are damaged and eliminate them. Good example; please refer to Figures 1 and 2 for a schematic diagram of an electronic component testing device. The machine 10 is provided with a plurality of testing devices 20, each of which is provided with a test circuit of a plurality of test sockets 22. The board 21 is configured to test the electronic components, and the guiding jig 23 is disposed above each of the test circuit boards 21, and the guiding jig 23 is provided with an introduction hole 231 at a position corresponding to each of the testing blocks 22 for guiding The electronic component to be tested is accurately placed in the test socket 22, and in order to make the pins of the electronic component actually contact the probe of the test socket 22, a crimping device 30 is respectively disposed behind each test device 20, and each crimping device is provided. The device 30 is provided with a pressing rod 32 driven by the lifting drive source 31 for Z-axis displacement, and a lower pressing head 33 is assembled at the end of the lower pressing rod 32. The bottom surface of the lower pressing head 33 is corresponding to each test. The position of the seat 22 is respectively fixed with pressure The connector 331 is pressed with the electronic component to be tested. When the electronic component 40 to be tested is placed in the test socket 22 of the testing device 20, the crimping device 30 can control the lifting drive source 31 to drive the lower pressing rod 32 downward. The lower pressing bar 32 drives the lower pressing head 33 to be displaced downward in the Z direction, so as to control the lower pressing head 33 to press down the plurality of electronic components 40 at a time, and the lower pressing head 33 is pressed by the respective crimping members 331 Corresponding to the electronic component 40 to be tested, the pins of the electronic components 40 to be tested are indeed in contact with the probes of the test socket 22, and the test operations of the plurality of electronic components 40 are performed at one time; however, due to the pressing The head 33 is directly fixed to the bottom surface of the plurality of crimping members 331 for pressing the plurality of electronic components 40 at a time, so that the lower pressing head 33 performs not only the plurality of crimping operations when performing the pressing of the plurality of electronic components 40. The flatness of the 331 pieces is relatively high, and the flatness of the plurality of electronic components 40 is also required to be high. If the electronic components 40 are different in thickness due to the thickness of the external colloid or the size of the solder balls, the flatness is not good, and the lower pressing head is used. 33 of the plurality of crimping members 331 are pressed against the plurality of electronic components 40 at a time Because the crimping members 331 cannot adjust the pressing height to the working height according to the height of each electronic component 40, so that the electronic components 40 can withstand different downward pressures, so that the electronic components 40 with less force can not be tested and tested. The probes of the seat 22 are in contact with each other to affect the test quality. If the flatness between the crimping members 331 of the lower pressing head 33 is not good, the plurality of crimping members 331 of the lower pressing head 33 are pressed against the plurality of electronic components 40 at a time. When the crimping members 331 are unable to adjust the pressing height, the electronic components 40 are subjected to different downward pressures, so that the electronic components 40 with less force can not be surely contacted with the probes of the test socket 22, resulting in The quality of the test is not the same.

Therefore, how to design a crimping device that can force a plurality of electronic components to be evenly stressed and improve the pressure to test the quality is designed by the manufacturer.

A first object of the present invention is to provide a crimping device for an electronic component detecting device. The crimping device is disposed on a machine having a testing device and is provided with at least one drive mechanism for driving at least Z-axis displacement. a lower pressing head, wherein the lower pressing head is provided with a plurality of sockets for receiving holes, and a pressing member capable of pressing against the electronic component is placed in each receiving hole of the socket, and is disposed above the socket The connecting member is connected with the connecting member, and the connecting member is provided with a plurality of sleeves which can be respectively sleeved with the crimping members, and elastic members are arranged between the sleeves and the crimping members to make the crimping The piece can be elastically floated; thereby, when the lower pressing head is pressed against the plurality of electronic components to be tested at a time, the crimping members can be subjected to the Z-axis floating displacement to adjust the pressing height, thereby making the plurality of pieces to be tested. The electronic components can be equally stressed to perform test operations, achieving practical benefits of improving test quality.

A second object of the present invention is to provide a crimping device for an electronic component detecting device, wherein the connecting member of the lower pressing head can be made of copper and equipped with a heater, and the crimping member and the connecting member are sleeved. The thermal paste is placed between the bodies, and the heat conductive paste can be used to remove the air in the crimping member and assist the lubrication. After the heater is activated, the connecting member can conduct the high temperature to the crimping member and utilize the thermal conductive paste as the heat conducting medium. It can assist rapid thermal conduction to ensure that the crimping parts are heated up to the preset high temperature, so that the electronic components to be tested can perform test operations in a preset simulated high temperature working environment, thereby achieving the practical benefit of improving the test quality.

In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing will be described in detail as follows: Please refer to Figures 3, 4 and 5, the crimping device of the present invention can be applied to different types. In the embodiment, the crimping device is applied to an electronic component testing machine capable of performing a thermal testing operation, and the electronic component testing machine is configured with at least one testing device 60 on the machine 50. In this embodiment, the machine 50 is provided with a plurality of test devices 60. Each test device 60 is provided with a test circuit board 61 electrically connected to the tester 62. The test circuit board 61 is provided with a plurality of test boards 61. The test stand 63 with the probe is used for testing the electronic component. Further, each test device 60 is provided with a guiding fixture 64 for guiding the electronic component to be placed on the machine 50. In this embodiment, The guiding fixtures 64 are respectively disposed on the upper surface of the corresponding testing circuit board 61 on the machine base 50. The guiding fixtures 64 are respectively provided with guiding holes 641 at positions corresponding to the testing bases 63 for guiding The electronic component is placed on the test stand 63 and is disposed on the machine 50 There is at least one crimping device 70, and the crimping device 70 is provided with at least one indenter driven by the driving mechanism for at least Z-axis displacement, and the lower pressing head is provided with a plurality of sockets for receiving holes. And a crimping member capable of pressing against the electronic component is disposed in each of the receiving holes of the socket, and a connecting member is disposed above the socket, and the connecting member is provided with a plurality of joints respectively splicable with the crimping members The crimping device 70 is disposed on the machine base 50, and the elastic member is disposed between the sleeve body and the crimping member, so that the crimping device 70 is disposed on the machine base 50, and the crimping device 70 is disposed on the machine base 50. The driving mechanism of the crimping device 70 is disposed on the machine table 50 with at least one first driving source for driving at least one frame for Z-axis displacement, and the carrier is equipped with a lower pressing head, and the first driving source can be pressed In the present embodiment, a cylinder or a pulley group driven by a motor is disposed on each side of the machine 50, and a first driving source which is the first pressure cylinder 71 and a piston rod of the first pressure cylinder 71 are respectively disposed. The driving drive frame 72 is coupled to the Z-axis displacement. Further, the crimping device 70 is disposed on the machine base 50 and configured with at least one second driving source. For driving the at least one first driving source for the Y-axis displacement, the second driving source may be a pressure cylinder or a pulley group driven by the motor, etc., in this embodiment, respectively disposed on both sides of the machine 50 There may be a second driving source of the second cylinder 73, and the piston rods of the second cylinders 73 are respectively coupled to drive the first cylinder 71 for Y-axis displacement, so that the carrier 72 can utilize the first cylinder 71 and The second cylinder 73 is axially displaced by ZY. Further, a sliding structure is disposed between the first cylinder 71 and the machine 50 for assisting the smooth displacement of the first cylinder 71. The sliding structure is attached to the machine. The sliding portion is disposed at least in the Y-axis direction, and the first pressure cylinder 71 is provided with a sliding portion that can cooperate with the sliding portion and is disposed in the Y-axis direction. In this embodiment, the sliding portion is provided. The moving structure is provided on the bottom surface of the machine table 50 with a panel 51 for assembling at least one sliding portion of the sliding rail 741, and at least one sliding portion for the sliding seat 742 is provided on the first pressure cylinder 71, the sliding seat The 742 system is slidably placed on the slide rail 741 to assist in the smooth displacement of the first pressure cylinder 71. Further, the crimping device 70 is attached to the carrier 72 of the drive mechanism to assemble at least one of the following pressures. In the embodiment, the lower head 75 is disposed on the bottom surface of the rack 72 corresponding to each test device 60, so that the rack 72 can drive a plurality of lower heads 75 simultaneously. ZY axial displacement, and each lower pressing head 75 is provided with a plurality of sockets 751 having a plurality of receiving holes 7511, and a crimping member 752 for pressing the electronic components is built in each of the receiving holes 7511, and each crimping is performed. The inner portion of the member 752 is provided with a receiving hole 7521. In this embodiment, each receiving hole 7511 of the bearing base 751 is a class hole and has at least one blocking surface 7512. Each crimping member 752 can be a class rod. And a blocking portion 7522 is disposed on the outer ring surface for being placed on the blocking surface 7512 of the receiving hole 7511 to prevent downward disengagement. A connecting member 753 assembled on the bearing base 751 includes the first panel. The 7531 and the second panel 7532 are connected to the bracket 72 by the second panel 7532, and the first panel 7531 and the crimping members 752 have a retreating space for the Z-axis to be displaced upwardly and retracted. In this embodiment, a recessed space 7513 is recessed on the top surface of the socket 751, so that the crimping members 752 can be displaced upward in the Z-axis direction. The bottom surface of the first panel 7531 of the connecting member 753 is provided with a plurality of sleeves that can be respectively sleeved with the crimping members 752, and the sleeve body can be a separate sleeve or integrally formed in the first The sleeve of the bottom surface of the panel 7531 is provided with a recess 7533 at a position corresponding to each of the crimping members 752 on the bottom surface of the first panel 7531 of the connecting member 753, and a cover is built in the recess 7533. The sleeve of the 7534 is configured such that the sleeve 7534 can be assembled with the crimping member 752, and the elastic member is disposed between the sleeve 7534 and the receiving hole 7521 of the crimping member 752. In this embodiment, The elastic member may be a spring 754, and one end of the spring 754 abuts against the receiving hole 7521, and the other end abuts against the cover 7534, so that the crimping member 752 can be elastically displaced in the Z-axis, and further, the lower portion The first head panel 7531 of the connecting member 753 is made of a material having a good thermal conductivity. The first panel 7531 of the connecting member 753 is made of copper and serves as a heat conducting material. a plate, and a heater 76 is disposed between the first panel 7531 and the second panel 7532 of the connecting member 753. The first panel 7531 of the connecting member 753 can be used to quickly conduct high temperature to the crimping member 752, and the crimping member 752 is heated to a preset high temperature, so that the electronic component can be tested in a simulated high temperature working environment, and further, the A thermal conductive paste 755 can be disposed between the receiving hole 7521 of the crimping member 752 and the cover 7534. The thermal conductive paste 755 can not only exclude the air in the receiving hole 7521, but also serves as a heat conducting medium to improve heat conduction performance and can be lubricated. The crimping member 752 and the sleeve cover 7534 are arranged to smoothly displace the crimping member 752 along the sleeve cover 7534.

Referring to FIG. 6 , when the electronic component 80 to be tested is transferred to the guiding fixture 64 of the testing device 60 by a manual or mechanical arm, the lead-in holes 641 of the guiding fixture 64 can be used to guide the test to be tested. The electronic component 80 is placed on each test stand 63 of the test circuit board 61, so that the pins of the electronic component 80 to be tested are located on the probes of the test stand 63 to perform the test operation; please refer to FIG. After the electronic component 80 to be tested is placed in each test stand 63 of the testing device 60, the second pressure cylinder 73 of the control crimping device 70 can drive the first pressure cylinder 71 to be displaced in the Y-axis to drive the first pressure cylinder 71. The carrier 72 and the lower pressing heads 75 thereon are synchronously displaced in the Y direction to the upper of the guiding fixture 64 of the testing device 60, and the crimping members 752 of the lower pressing head 75 correspond to the respective testing devices 60. The electronic component 80 to be tested; referring to Figures 8 and 9, the first pressure cylinder 71 of the crimping device 70 can drive the carrier 72 and the lower pressing heads 75 thereon to be synchronously displaced in the Z-axis direction, so that each The lower pressing head 75 presses the plurality of electronic components 80 to be tested on the testing device 60 at a time by a plurality of crimping members 752, if the plurality of crimping members 752 or a plurality of electronic components The flatness between the components 80 is not good. When the crimping member 752 is pushed by the reaction force of the electronic component 80 to be tested, the built-in spring 754 can be compressed for the Z-axis upward floating displacement and sliding along the cover 7534. And retreat to the retreat space 7513 to adjust the working height under the crimping member 752, so that the plurality of electronic components 80 to be tested can be subjected to an average force to perform a test operation, after which the heater 76 can be activated, the heater 76 The first panel 7531 made of copper can be used to conduct the high temperature to the crimping member 752 via the cover 7534, so that the crimping member 752 is heated to a preset high temperature, and can be placed between the receiving hole 7521 and the sleeve 7534 of the crimping member 752. Into the thermal paste 755, and assist in the rapid transfer of high temperature to the crimping member 752 to improve the heat transfer performance, so that the electronic component 80 to be tested performs the test operation in the simulated high temperature working environment; please refer to Figures 10 and 11 for testing After the operation is completed, the crimping device 70 can control the first cylinder 71 to drive the bracket 72 to be displaced upward in the Z-axis direction, and the bracket 72, that is, the lower pressing heads 75 are synchronously moved up, so that the plurality of lower pressing heads 75 are pressed. The connector 752 is separated from the tested electronic component 80 due to the crimping 752 has no external force to press, the crimping member 752 can be pushed up by the return elastic force of the spring 754 for Z-axis downward displacement, and can slide along the cover 7534; please refer to Fig. 12, the crimping The device 70 further drives the first cylinder 71 to the Y-axis reverse displacement reset by the second cylinder 73. The first cylinder 71 drives the carrier 72 and the lower pressing heads 75 away from the testing device 60 for manual or The robot arm takes the finished electronic component 80 on each test stand 63.

Accordingly, the present invention is a practical and progressive design, but it has not been disclosed that the same products and publications are disclosed, thereby permitting the invention patent application requirements, and applying in accordance with the law.

[知知]

10. . . Machine

20. . . Test device

twenty one. . . Test board

twenty two. . . Test stand

twenty three. . . Guide jig

231. . . Import hole

30. . . Crimp device

31. . . Lift drive source

32. . . Lower pressing rod

33. . . Lower pressing head

331. . . Crimp piece

40. . . Electronic component

[this invention]

50. . . Machine

51. . . panel

60. . . Test device

61. . . Test board

62. . . Tester

63. . . Test stand

64. . . Guide jig

641. . . Import hole

70. . . Crimp device

71. . . First pressure cylinder

72. . . Shelf

73. . . Second cylinder

741. . . Slide rail

742. . . Slide

75. . . Lower pressing head

751. . . Seat

7511. . . Bearing hole

7512. . . Face

7513. . . Withdrawal space

752. . . Crimp piece

7521. . . Socket hole

7522. . . Stop

753. . . Link

7531. . . First panel

7532. . . Second panel

7533. . . Groove

7534. . . Cover

754. . . spring

755. . . Thermal paste

76. . . Heater

80. . . Electronic component

Figure 1: Schematic diagram of a conventional crimping device and test device.

Figure 2: Schematic diagram of the use of a conventional test device.

Fig. 3 is a schematic view showing the application of the crimping device of the present invention to an electronic component device.

Figure 4 is a cross-sectional view showing the assembly of the lower pressing head of the crimping device of the present invention.

Fig. 5 is a partially enlarged schematic view of Fig. 4.

Figure 6: Schematic diagram of the use of the present invention (I).

Figure 7: Schematic diagram of the use of the present invention (2).

Figure 8: Schematic diagram of the use of the invention (3).

Figure 9: Schematic diagram of the use of the present invention (4).

Figure 10: Schematic diagram of the use of the present invention (5).

Figure 11: Schematic diagram of the use of the invention (vi).

Figure 12: Schematic diagram of the use of the invention (7).

72. . . Shelf

75. . . Lower pressing head

751. . . Seat

7511. . . Bearing hole

7512. . . Face

7513. . . Withdrawal space

752. . . Crimp piece

7521. . . Socket hole

7522. . . Stop

753. . . Link

7531. . . First panel

7532. . . Second panel

7533. . . Groove

7534. . . Cover

754. . . spring

755. . . Thermal paste

76. . . Heater

Claims (10)

A crimping device for an electronic component detecting device, the crimping device is disposed on a machine having a testing device, and is provided with at least one indenter driven by a driving mechanism for at least Z-axis displacement, wherein the lowering The indenter is provided with a plurality of sockets for receiving holes, and a crimping member capable of pressing against the electronic component is placed in each of the receiving holes, and a connecting member capable of connecting the driving mechanism is disposed above the socket. The connecting member is provided with a plurality of sleeves which can be respectively sleeved with the crimping members, and elastic members are arranged between the sleeves and the crimping members, so that the crimping members can be elastically floated and displaced. The crimping device of the electronic component detecting device according to the first aspect of the invention, wherein the driving mechanism of the crimping device is configured on the machine table with at least one first driving source for driving at least one carrier for Z Axial displacement, the carrier is equipped with a lower head. The crimping device for an electronic component detecting device according to claim 2, wherein the first driving source is a first pressure cylinder. The crimping device of the electronic component detecting device according to the second aspect of the invention, wherein the driving mechanism of the crimping device is configured on the machine table with at least one second driving source for driving at least one first driving source Make Y axial displacement. The crimping device of the electronic component detecting device according to the fourth aspect of the invention, wherein the second driving source is a second pressure cylinder, and the first driving source and the machine table are provided with a sliding structure for The first driving source is arranged to be smoothly displaced. The sliding structure is provided with at least one sliding portion disposed in the Y-axis direction, and is disposed on the first driving source to cooperate with the sliding portion and is in the Y-axis direction. Configure the slip. A crimping device for an electronic component detecting device according to claim 5, wherein the sliding structure is provided with a panel on a bottom surface of the machine for assembling at least one sliding portion of the sliding rail, and At least one sliding portion of the sliding seat is disposed on a driving source, and the sliding seat is slid on the sliding rail. The crimping device of the electronic component testing device according to the first aspect of the invention, wherein the crimping member of the lower pressing head is provided with a receiving hole therein, and the sleeve of the connecting member can be a separate sleeve. A cover or a collar integrally formed on the bottom surface. The crimping device for an electronic component detecting device according to the seventh aspect of the invention, wherein the connecting member comprises a first panel and a second panel, and the second panel is coupled to the driving mechanism, and the first panel is assembled on the bearing a plurality of sleeves respectively sleeved with the crimping members, wherein the receiving holes of the socket are class holes and have at least one blocking surface, and the lower pressing head The outer surface of the crimping member is provided with a blocking portion for placing on the blocking surface of the receiving hole. The crimping device of the electronic component detecting device according to the seventh aspect of the invention, wherein the heat receiving paste is disposed between the receiving hole of the crimping member and the sleeve of the connecting member, and the connecting member is assembled Heater. A crimping device for an electronic component detecting device according to claim 1, wherein the elastic component is a spring.