CN114076835A - Jointing mechanism and working equipment using same - Google Patents
Jointing mechanism and working equipment using same Download PDFInfo
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- CN114076835A CN114076835A CN202010849064.4A CN202010849064A CN114076835A CN 114076835 A CN114076835 A CN 114076835A CN 202010849064 A CN202010849064 A CN 202010849064A CN 114076835 A CN114076835 A CN 114076835A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 55
- 238000006073 displacement reaction Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 54
- 235000012431 wafers Nutrition 0.000 description 15
- 239000000523 sample Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 7
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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Abstract
The invention provides a joint mechanism and operation equipment applied by the joint mechanism, wherein the joint mechanism comprises a base, a plurality of joint tools and a displacement unit, the plurality of joint tools are assembled on the base and are used for being pressed with a plurality of pressure-bearing components of an electronic element, and the displacement unit is provided with at least one adjusting piece between the base and at least one joint tool and is used for adjusting the operation position of the joint tool; when the plurality of pressure-bearing members of the electronic component have different heights, the jointing tool shifts and adjusts the operation position by using the adjusting piece of the displacement unit so as to be really attached to the corresponding pressure-bearing member, so that the plurality of jointing tools are really pressed on the plurality of pressure-bearing members of the electronic component with different heights to execute preset operation, and further the operation quality is improved.
Description
Technical Field
The present invention relates to a jointing mechanism which can ensure that a plurality of jointing tools are firmly jointed with a plurality of pressure-bearing members with different heights of electronic components so as to improve the operation quality.
Background
At present, a plurality of pressure-bearing members are disposed and packaged on a substrate with a large size and a thin shape according to design functions of some electronic devices, the pressure-bearing members may be chips or other ICs, and the arrangement positions, height dimensions and areas of the plurality of chips or ICs are different according to design requirements. Referring to fig. 1, in the electronic device 11, a first chip 112 with a larger height and a larger area is disposed in a middle region of a top surface of a thin substrate 111, and a second chip 113 and a third chip 114 with a smaller height and a smaller area are disposed on two sides of the first chip 112, respectively, and a plurality of contacts 115 are disposed on a bottom surface of the substrate 111 of the electronic device 11.
Referring to fig. 2, after the electronic device 11 is manufactured, an electrical test operation and a cold test (or hot test) operation must be performed to eliminate defective products; the testing device is provided with a circuit board 13 and a testing seat 14 which are electrically connected on a machine table 12, and the testing seat 14 is provided with a plurality of probes 141 for bearing and testing the electronic element 11; in order to make the contact 115 of the electronic component 11 contact the probe 141 of the test socket 14, the testing apparatus is configured with a bonding mechanism above the test socket 14, the bonding mechanism is provided with a pressing fixture 152 on the bottom surface of a body 151, the pressing fixture 152 is pressed against the electronic component 11 with a preset pressing force, so that the contact 115 of the electronic component 11 contacts the probe 141 of the test socket 14 to perform an electrical testing operation, the body 151 is provided with a flow channel 153, one end of the flow channel 153 is connected to a water inlet pipe 154, and the other end is connected to a water outlet pipe 155, so that a fluid (such as a cryogenic fluid) with a preset temperature is input and output from the flow channel 153, and when the pressing fixture 152 is pressed against the electronic component 11, the electronic component 11 can perform a cold testing operation in a testing environment simulating a temperature of an application place at a later date.
Because the first chip 112, the second chip 113 and the third chip 114 have a high-low level difference, when the body 151 drives the press-down fixture 152 to press down the electronic device 11, the press-down fixture 152 can only adhere to the first chip 112 with a higher height and cannot be pressed to the second chip 113 and the third chip 114 with a lower height, so that the press-down fixture 152 has a distance a with the second chip 113 and the third chip 114, and the electronic device 11 is easily broken due to uneven stress.
Moreover, since the pressing force of the pressing tool 152 only presses the first wafer 112 of the electronic device 11, the second wafer 113 and the third wafer 114 of the electronic device 11 are subject to uneven stress, and the lower portion of the contact 115 cannot reliably contact the probe 141 of the test socket 14, which affects the test quality.
Furthermore, the pressing fixture 152 is only pressed against the first chip 112 of the electronic device 11 and has a distance a with the second chip 113 and the third chip 114, so that the temperature of the fluid in the flow channel 153 is easily unable to be effectively conducted to the second chip 113 and the third chip 114 due to the distance a, and the second chip 113 and the third chip 114 cannot perform cold testing operation in a testing environment simulating the temperature of a future application place, thereby affecting the testing quality.
Disclosure of Invention
The invention aims to: the utility model provides a coupling mechanism and applied operation equipment thereof solves the above-mentioned technical problem that exists among the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
an engagement mechanism, comprising:
a base;
a plurality of bonding tools: the plurality of jointing tools are respectively provided with a jointing surface for jointing a plurality of pressure-bearing parts of the electronic element;
a displacement unit: at least one adjusting piece is arranged between the base and at least one jointing tool, so that the position of the jointing tool can be adjusted to be attached to the corresponding pressure-bearing member.
The engagement mechanism, wherein: the base has a first surface for disposing the plurality of bonding tools and a second surface for assembling the carrier.
The engagement mechanism, wherein: at least another one of the plurality of jointing tools is fixedly arranged on the base.
The engagement mechanism, wherein: at least one of the joints has at least one connecting part, and the adjusting part is arranged between the connecting part and the base.
The engagement mechanism, wherein: the adjusting member is an elastic element, a high performance transmission member or a pressure cylinder.
The engagement mechanism, wherein: the initial operation positions of the plurality of bonding tools are the same or different.
The engagement mechanism, wherein: the temperature control unit is provided with a first temperature controller on the base.
The engagement mechanism, wherein: the temperature control unit is provided with a second temperature controller on the plurality of jointing tools.
The engagement mechanism, wherein: also comprises a temperature control unit, wherein the temperature control unit is provided with a first temperature controller on the plurality of jointing tools.
An operation device, comprising:
a machine platform;
a feeding device: at least one feeding and bearing device arranged on the machine platform and used for accommodating the electronic element to be operated;
the material receiving device comprises: at least one material receiving and placing device arranged on the machine platform and used for accommodating the operated electronic elements;
an operation device: at least one operator and at least one jointing mechanism are arranged on the machine table, the operator is used for executing preset operation on the electronic element, and the jointing mechanism is used for pressing the electronic element;
a conveying device: at least one conveyer for conveying electronic elements;
the central control device: so as to control and integrate the operation of each device to execute the automation operation.
The present invention provides a bonding mechanism, which comprises a base, a plurality of bonding tools and a displacement unit, wherein the bonding tools are assembled on the base for pressing a plurality of pressure-bearing members (such as wafers) of electronic components, and the displacement unit is provided with at least one adjusting member between the base and at least one bonding tool for adjusting the operation position of the bonding tool; when the plurality of pressure-bearing members of the electronic component have different heights, the jointing tool shifts and adjusts the operation position by using the adjusting piece of the displacement unit so as to be really attached to the corresponding pressure-bearing member, so that the plurality of jointing tools are really pressed against the plurality of pressure-bearing members of the electronic component with different heights to execute preset operation, and further the operation quality is improved.
The second advantage of the present invention is to provide a joint mechanism, wherein the joint device utilizes the adjusting member of the displacement unit to displace and adjust the operation position, so as to be really attached to the corresponding pressure-bearing member of the electronic component, and the plurality of joint devices are pressed and attached to the plurality of pressure-bearing members, so that the electronic component is evenly stressed, thereby preventing the electronic component from being cracked, and achieving the advantages of prolonging the service life and saving the cost.
The third advantage of the present invention is to provide a bonding mechanism, further comprising a temperature control unit, wherein the temperature control unit is provided with a first temperature controller on the base, so that when the plurality of bonding tools are pressed against the plurality of pressure-bearing members attached to the electronic element, a preset temperature of the first temperature controller is effectively conducted to the plurality of pressure-bearing members through the plurality of bonding tools, so that the plurality of pressure-bearing members perform cold testing (or hot testing) in a testing environment simulating a temperature of a future application place, thereby improving testing quality.
The fourth advantage of the present invention is to provide a bonding mechanism, wherein the temperature control unit is provided with second temperature controllers respectively disposed on the plurality of bonding tools, and each of the second temperature controllers can control the temperature of the pressure-bearing member (e.g., the wafer) through the bonding tool according to the testing temperature required by the pressure-bearing member (e.g., the wafer) with different sizes, thereby improving the testing performance.
The invention has the fifth advantage of providing an operation device, which comprises a machine table, a feeding device, a material receiving device, an operation device with the joint mechanism, a conveying device and a central control device; the feeding device is arranged on the machine table and is provided with at least one feeding bearing device for accommodating the electronic element to be operated; the receiving device is arranged on the machine table and is provided with at least one receiving and bearing device for accommodating the operated electronic element; the operation device is arranged on the machine table and is provided with at least one operation device and the joint mechanism, the operation device is used for executing preset operation on the electronic element, and the joint mechanism is used for connecting the electronic element in a pressing mode; the conveying device is arranged on the machine table and is provided with at least one conveyor for conveying the electronic elements; the central control device is used for controlling and integrating the actions of all the devices to execute automatic operation, thereby achieving the practical benefit of improving the operation efficiency.
Drawings
Fig. 1 is a schematic view of a conventional electronic component.
Fig. 2 is a schematic diagram of a conventional testing apparatus.
Fig. 3 is a schematic view of a first embodiment of the engagement mechanism of the present invention.
FIG. 4 is a schematic representation (one) of the use of the first embodiment of the engagement mechanism of the present invention.
Fig. 5 is a schematic (two) view of the use of the first embodiment of the engagement mechanism of the present invention.
Fig. 6 is a schematic view of a second embodiment of the engagement mechanism of the present invention.
Fig. 7 is a schematic view of a third embodiment of the engagement mechanism of the present invention.
Fig. 8 is a schematic view of the engagement mechanism of the present invention applied to a working machine.
Description of reference numerals: [ Prior Art ] an electronic component 11; a substrate 111; a first wafer 112; a second wafer 113; a third wafer 114; a contact 115; a machine 12; a circuit board 13; a test socket 14; a probe 141; a body 151; a pressing jig 152; a flow passage 153; a water inlet pipe 154; a water outlet pipe 155; a spacing A; [ invention ] a base 21; a first face 211; a second face 212; a moving arm 22; a first bonding tool 231; a first bonding surface 2311; a second bonding tool 232; a second abutment surface 2321; a first connection 2322, 2322A; a third bonding tool 233; a third attachment surface 2331; second connecting portions 2332, 2332A; a first adjuster 241; a second trim 242; a flow passage 251; an input tube 252; an output pipe 253; second temperature controllers 254, 255, 256; a first adjuster 261; a second adjustment member 262; a first temperature controller 271, 272, 273; a first initial operating position L1; a second initial operating position L2; a crimping work position L3; a spacing B; a machine table 30; a testing device 40; a circuit board 41; a test socket 42; a probe 421; an electronic component 43; a contact 431; a first bearing member 432; the second bearing member 433; the third bearing member 434; a feeding device 50; a supply receiver 51; a material receiving device 60; a material receiving and holding device 61; a conveying device 70; a first conveyor 71; a second conveyor 72; and a third conveyor 73.
Detailed Description
To further understand the present invention, a preferred embodiment is shown in the drawings, and the following detailed description is given:
referring to fig. 3, the first embodiment of the bonding mechanism of the present invention includes a base 21, a plurality of bonding tools and a position changing unit, and further can be configured with a temperature control unit and a carrier according to the operation requirement.
The base 21 has a first surface 211 and a second surface 212, in this embodiment, the base 21 has a bottom surface as the first surface 211 and a top surface as the second surface 212, further, the base 21 is assembled to a carrier, and can be configured fixedly or movably, the carrier can be a frame or a moving arm, for example, the carrier can be a frame, the base 21 is configured fixedly, so that the electronic component can move relatively toward the base 21, for example, the carrier can be a moving arm, and the base 21 can be configured movably, so that the base 21 can move relatively toward the electronic component, of course, both the base 21 and the electronic component can move relatively; in the embodiment, the carrier is a moving arm 22, and the moving arm 22 is assembled and connected to the second surface 212 of the base 21, so that the moving arm 22 drives the base 21 to move in the Z direction.
The plurality of bonding tools are arranged on the first surface 211 of the base 21 and respectively have a bonding surface for bonding a plurality of pressure-bearing members (such as wafers or ICs) of the electronic components; at least one of the plurality of bonding tools is movably disposed on the base, and at least another one of the plurality of bonding tools is fixedly disposed on the base, in other words, the bonding tools can be formed on the base 21, or can be assembled on the base 21 as an independent element; when the jointing tool is movably arranged on the base 21, the jointing tool is provided with at least one connecting part; the number, the arrangement position and the size of the joint surface of the jointing tool can be configured as industrial requirements; for example, two or three bonding tools are disposed on the first surface 211 of the base 21, for example, a larger bonding tool is disposed on one side of the first surface 211 of the base 21 and a row of a plurality of smaller bonding tools is disposed on the other side, for example, a fixed bonding tool is formed on the first surface 211 of the base 21 and two movable bonding tools are disposed.
In this embodiment, the joint mechanism has a first joint 231, a second joint 232 and a third joint 233 on the first surface 211 of the base 21, the first joint 231 is formed on the first surface 211 of the base 21 and is disposed in the middle of the first surface 211 and is a block with a large area, and the bottom of the first joint 231 has a first attaching surface 2311 for attaching to the first pressure-bearing member at the corresponding position of the electronic component. The second bonding tool 232 is an independent element, and is movably connected to the first surface 211 of the base 21 and located on one side of the first bonding tool 231, the second bonding tool 232 is a block with a smaller area size, and the bottom thereof is used as a second attachment surface 2321 for attaching to a second pressure-bearing member at a corresponding position of the electronic component, the second bonding tool 232 is further provided with at least one first connection 2322, the first connection 2322 can be a surface, a groove, or a bump, for example, the second bonding tool 232 uses the top surface or a side surface as the first connection 2322, for example, the second bonding tool 232 has a groove on the top surface as the first connection 2322; in the present embodiment, the second bonding tool 232 has a recess on the top surface thereof as the first connection portion 2322. The third engaging device 233 is a separate component and is movably connected to the first surface 211 of the base 21 and located at the other side of the first engaging device 231, the third engaging device 233 is a block with a smaller area size, and the bottom of the third engaging device 233 is used as a third attaching surface 2331 for attaching to a third pressure-bearing member at a corresponding position of the electronic component; the third bonding tool 233 has a recess on the top surface thereof to serve as a second connecting portion 2332.
The displacement unit is provided with at least one adjusting piece between the base 21 and at least one jointing tool so as to adjust the position of the jointing tool and attach the jointing tool to the corresponding pressure-bearing member; furthermore, the adjusting element is located between the base 21 and the adapter and is located between the first surface 211 of the base 21 and the connection portion (such as the top surface, the recess, or the side surface) of the adapter, and the adjusting element may be an elastic element, a high performance conductive element (such as an indium sheet), or a pressure cylinder, for example, the adjusting element is an elastic element, and is located between the first surface 211 of the base 21 and the first connection portion 2322 (i.e., the recess) of the second adapter 232, so that the elastic element is used for compressing the second adapter 232, so that the second adapter 232 performs passive displacement adjustment; for example, the adjusting member is a pressure cylinder, and is located between the first surface 211 of the base 21 and the first connecting portion (e.g., side surface) of the second engaging member 232, so that the piston rod of the pressure cylinder drives the second engaging member 232 to actively displace and adjust the position.
In this embodiment, the displacement unit configures a first adjusting element 241, which is an elastic element, between the base 21 and the second engaging element 232, one end of the first adjusting element 241 is connected to the first surface 211 of the base 21, and the other end is inserted into and connected to the first connecting portion 2322 of the second engaging element 232, so that the second engaging element 232 can compress the first adjusting element 241 to adjust the position; the displacement unit is provided with a second adjusting element 242 which is an elastic element between the base 21 and the third connecting element 233, one end of the second adjusting element 242 is connected to the first surface 211 of the base 21, and the other end is inserted into and connected to the second connecting part 2332 of the third connecting element 233, so that the third connecting element 233 can compress the second adjusting element 242 to adjust the position; since the second adapter 232 and the third adapter 233 are adjusted by the first adjusting element 241 and the second adjusting element 242, respectively, the initial operating positions of the second adapter 232 and the third adapter 233 may be the same as or different from the initial operating position of the first adapter 231; in the present embodiment, the second initial operating position L2 of the second bonding tool 232 and the third bonding tool 233 is lower than the first initial operating position L1 of the first bonding tool 231, a distance B is formed between the second bonding tool 232 and the third bonding tool 233 and the first surface 211 of the base 21, and the second bonding tool 232 and the third bonding tool 233 can be displaced along the force-receiving direction (e.g., the Z direction).
The joining mechanism further comprises a temperature control unit, the temperature control unit is provided with a first temperature controller on the base 21 or the joining tool, for example, the temperature control unit is provided with the first temperature controller on the joining tool, so that when the joining tool is attached to the pressure-bearing member of the electronic element, the preset temperature of the first temperature controller is effectively conducted to the pressure-bearing member, and the pressure-bearing member executes cold testing (or hot testing) operation in a testing environment simulating the temperature of a future application place; in addition, the temperature control unit can meet the operation requirement, when the base 21 of the temperature control unit is provided with a first temperature controller, the joint tool can be provided with a second temperature controller, the second temperature controller can meet the test temperature required by pressure-bearing members (such as wafers) with different sizes, and the temperature control pressure-bearing members (such as wafers) can be finely adjusted through the joint tool, so that the test efficiency is improved; the first temperature controller and the second temperature controller can be a refrigerating chip, a heating element or a base body with a pre-heating fluid.
In this embodiment, the temperature control unit has a first temperature controller disposed on the base 21, the first temperature controller uses the base 21 as a base body, a flow channel 251 is disposed in the base 21, one end of the flow channel 251 is connected to the input tube 252 for inputting a fluid with a preset low temperature, and the other end of the flow channel 251 is connected to the output tube 253 for outputting the fluid; in addition, the first jointing tool 231, the second jointing tool 232 and the third jointing tool 233 are respectively internally provided with second temperature controllers 254, 255 and 256 which are heating elements, and the first temperature controllers and the second temperature controllers 254, 255 and 256 can be matched with each other to regulate and control the operation temperature of the first jointing tool 231, the second jointing tool 232 and the third jointing tool 233 so as to enable the electronic elements to be positioned in the simulated low-temperature test environment to execute cold test operation.
Referring to fig. 4, the joint mechanism of the present invention is applied to a testing device 40, the testing device 40 is configured with a circuit board 41 and a testing seat 42 electrically connected to a machine 30, the testing seat 42 has a plurality of probes 421 for supporting and testing an electronic component 43; the bottom surface of the electronic component 43 is provided with a plurality of contacts 431, and a first pressure-bearing member 432 with a larger area and a wafer is packaged and configured at the middle part of the top surface, the position of the first pressure-bearing member 432 is opposite to the first jointing tool 231, a second pressure-bearing member 433 with a smaller area and a wafer is arranged at one side of the first pressure-bearing member 432, the position of the second pressure-bearing member 433 is opposite to the second jointing tool 232, a third pressure-bearing member 434 with a smaller area and a wafer is arranged at the other side of the first pressure-bearing member 432, the position of the third pressure-bearing member 434 is opposite to the third jointing tool 233, and the heights of the second pressure-bearing member 433 and the third pressure-bearing member 434 are lower than that of the first pressure-bearing member 432.
Referring to fig. 3 and 5, in order to make the contact 431 of the electronic device 43 contact the probe 421 of the testing seat 42, a predetermined pressing force must be applied to the electronic device 43; during testing, the moving arm 22 drives the base 21, the first engaging tool 231, the second engaging tool 232 and the third engaging tool 233 to synchronously move downward in the Z direction, since the second initial operating position L2 of the second engaging tool 232 and the third engaging tool 233 is lower than the first initial operating position L1 of the first engaging tool 231, the second engaging tool 232 and the third engaging tool 233 will be attached to the second pressure-bearing member 433 and the third pressure-bearing member 434 of the electronic component 43 first, the second pressure-bearing member 433 and the third pressure-bearing member 434 will respectively push the second engaging tool 232 and the third engaging tool 233 to move upward in the Z direction, the second engaging tool 232 and the third engaging tool 233 will respectively compress the first adjusting member 241 and the second adjusting member 242, and will be adjusted and displaced from the second initial operating position L2 to the pressure-contacting operating position L3, the first engaging tool 231 will also be attached to the first pressure-bearing member 432 of the electronic component 43, and therefore, the first engaging tool 231 of the engaging mechanism will be attached to the first engaging tool 231, The second jointing tool 232 and the third jointing tool 233 are pressed against the first pressure-bearing member 432, the second pressure-bearing member 433 and the third pressure-bearing member 434 of the electronic component 43 with a predetermined downward pressure, so that the electronic component 43 is stressed uniformly and prevented from being cracked. When the second bonding tool 232 and the third bonding tool 233 press-contact the second pressure receiving member 433 and the third pressure receiving member 434 of the electronic component 43, the plurality of contacts 431 of the electronic component 43 located under the second pressure receiving member 433 and the third pressure receiving member 434 can be reliably brought into contact with the probes 421 of the test socket 42, thereby improving the test quality. Furthermore, when the first bonding tool 231, the second bonding tool 232 and the third bonding tool 233 are respectively attached to the first pressure-bearing member 432, the second pressure-bearing member 433 and the third pressure-bearing member 434 of the electronic device 43, the fluid in the flow channel 251 of the temperature control unit can be used to conduct the low temperature to the first bonding tool 231, the second bonding tool 232 and the third bonding tool 233 through the base 21, and then the first bonding tool 231, the second bonding tool 232 and the third bonding tool 233 can respectively and effectively conduct the low temperature to the second pressure-bearing member 432, the second pressure-bearing member 433 and the third pressure-bearing member 434 of the electronic device 43, and the temperature control unit can respectively and finely adjust the operating temperatures of the first bonding tool 231, the second bonding tool 232 and the third bonding tool 233 through the second temperature controllers 254, 255 and 256, so that the second pressure-bearing member 432, the second pressure-bearing member 433 and the third pressure-bearing member 434 can perform the cold measurement operation in the test environment simulating the temperature of the application site at the future, thereby improving the testing quality.
Referring to fig. 6, a difference between the second embodiment of the coupling mechanism of the present invention and the first embodiment is that the adjusting element is a compressible high performance conductive element (e.g., an indium sheet), in the present embodiment, the second coupling device 232 has a top surface as a first connecting portion 2322A, and a first adjusting element 261 which is a high performance conductive element (e.g., an indium sheet) is disposed between the first connecting portion 2322A and the first surface 211 of the base 21; the third bonding tool 233 has a top surface as a second connecting portion 2332A, and a second adjusting member 262, which is a high performance conductive member (e.g., an indium sheet), is disposed between the second connecting portion 2332A and the first surface 211 of the base 21, and the first adjusting member 261 and the second adjusting member 262 can be compressed by the second bonding tool 232 and the third bonding tool 233, respectively, so that the second bonding tool 232 and the third bonding tool 233 can adjust the operation positions.
Referring to fig. 7, a third embodiment of the bonding mechanism of the present invention is different from the first embodiment in that the temperature control unit is only configured with first temperature controllers 271, 272, 273, which can be cooling chips, respectively, on the first bonding tool 231, the second bonding tool 232, and the third bonding tool 233, and the first temperature controllers 271, 272, 273 respectively regulate and control the operating temperatures of the first bonding tool 231, the second bonding tool 232, and the third bonding tool 233.
Referring to fig. 3 and 8, the joint mechanism of the present invention is applied to a working apparatus, which includes a machine table 30, a working device, a feeding device 50, a receiving device 60, a conveying device 70 and a central control device (not shown); in this embodiment, the operation device is a test device; the feeding device 50 is disposed on the machine 30 and has at least one feeding holder 51 for accommodating the electronic component to be operated; the material receiving device 60 is disposed on the machine 30 and has at least one receiving device 61 for receiving the operated electronic components; the working device is disposed on the machine 30, and comprises at least one working device and the bonding mechanism of the present invention, the working device performs a predetermined operation on the electronic component, the bonding mechanism of the present invention is used for connecting the electronic component in a pressing manner, in the present embodiment, the first side and the second side of the machine 30 are respectively disposed with the working device, the working device is a testing device 40, the working device is a tester, the tester comprises a circuit board 41 and a testing seat 42 which are electrically connected, and is used for testing the electronic component, the bonding mechanism of the present invention comprises a base 21, a plurality of bonding tools and a displacement unit; the conveying device 70 is disposed on the machine 30 and has at least one conveyor for conveying electronic components, in this embodiment, the conveying device 70 has a first conveyor 71 for moving in the X-Y-Z direction, the first conveyor 71 takes out the electronic components to be tested from the feeding device 50, the joint mechanism of the invention uses the moving arm 22 to drive the base 21, the first jointing tool 231, the second jointing tool 232 and the third jointing tool 233 to synchronously make Z-direction downward displacement, so that the first jointing tool 231, the second jointing tool 232 and the third jointing tool 233 are uniformly jointed and press the electronic element on the test base 42 to execute the test operation; the first conveyor 71 takes out the tested electronic components from the second conveyor 72, and transfers the tested electronic components to the receiving container 61 of the receiving device 60 according to the test result for classified receiving; the central control device is used for controlling and integrating the actions of all devices so as to execute automatic operation and achieve the practical benefit of improving the operation efficiency.
Claims (10)
1. An engagement mechanism, comprising:
a base;
a plurality of bonding tools: the plurality of jointing tools are respectively provided with a jointing surface for jointing a plurality of pressure-bearing parts of the electronic element;
a displacement unit: at least one adjusting piece is arranged between the base and at least one jointing tool, so that the position of the jointing tool can be adjusted to be attached to the corresponding pressure-bearing member.
2. The engagement mechanism of claim 1, wherein: the base has a first surface for disposing the plurality of bonding tools and a second surface for assembling the carrier.
3. The engagement mechanism of claim 1, wherein: at least another one of the plurality of jointing tools is fixedly arranged on the base.
4. The engagement mechanism of claim 1, wherein: at least one of the joints has at least one connecting part, and the adjusting part is arranged between the connecting part and the base.
5. The engagement mechanism of any one of claims 1 to 4, wherein: the adjusting member is an elastic element, a high performance transmission member or a pressure cylinder.
6. The engagement mechanism of any one of claims 1 to 4, wherein: the initial operation positions of the plurality of bonding tools are the same or different.
7. The engagement mechanism of any one of claims 1 to 4, wherein: the temperature control unit is provided with a first temperature controller on the base.
8. The engagement mechanism of claim 7, wherein: the temperature control unit is provided with a second temperature controller on the plurality of jointing tools.
9. The engagement mechanism of any one of claims 1 to 4, wherein: also comprises a temperature control unit, wherein the temperature control unit is provided with a first temperature controller on the plurality of jointing tools.
10. A work apparatus, comprising:
a machine platform;
a feeding device: at least one feeding and bearing device arranged on the machine platform and used for accommodating the electronic element to be operated;
the material receiving device comprises: at least one material receiving and placing device arranged on the machine platform and used for accommodating the operated electronic elements;
an operation device: at least one manipulator configured on the machine for performing a predetermined operation on the electronic component and at least one bonding mechanism according to claim 1 for crimping the electronic component;
a conveying device: at least one conveyer for conveying electronic elements;
the central control device: so as to control and integrate the operation of each device to execute the automation operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010849064.4A CN114076835A (en) | 2020-08-21 | 2020-08-21 | Jointing mechanism and working equipment using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010849064.4A CN114076835A (en) | 2020-08-21 | 2020-08-21 | Jointing mechanism and working equipment using same |
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| CN114076835A true CN114076835A (en) | 2022-02-22 |
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| CN202010849064.4A Pending CN114076835A (en) | 2020-08-21 | 2020-08-21 | Jointing mechanism and working equipment using same |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI223711B (en) * | 2003-08-22 | 2004-11-11 | Advanced Semiconductor Eng | Test apparatus for semiconductor package |
| CN1805216A (en) * | 2005-01-11 | 2006-07-19 | 吴景淞 | Non-alloy fusion spliced electrical connection construction and test metallurgical appliance utilizing the same |
| TWM320172U (en) * | 2007-05-10 | 2007-10-01 | Optimum Care Int Tech Inc | Testing tool |
| TW201331591A (en) * | 2012-01-19 | 2013-08-01 | Prov Technology Corp | Crimping device for electronic component inspection apparatus |
| CN104108602A (en) * | 2013-04-18 | 2014-10-22 | 鸿劲科技股份有限公司 | Pressing device and test equipment applied by same |
| TWI639546B (en) * | 2018-05-04 | 2018-11-01 | 鴻勁精密股份有限公司 | Electronic component crimping mechanism and test classification device |
| TW201917372A (en) * | 2017-10-27 | 2019-05-01 | 鴻勁精密股份有限公司 | Supercharged crimping device and test classification device thereof allowing an actuating member to obtain a downward pressure larger than a preset pressure to press an electronic component downwards |
| CN110879304A (en) * | 2018-09-06 | 2020-03-13 | 致茂电子股份有限公司 | Sliding electronic component testing device |
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2020
- 2020-08-21 CN CN202010849064.4A patent/CN114076835A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI223711B (en) * | 2003-08-22 | 2004-11-11 | Advanced Semiconductor Eng | Test apparatus for semiconductor package |
| CN1805216A (en) * | 2005-01-11 | 2006-07-19 | 吴景淞 | Non-alloy fusion spliced electrical connection construction and test metallurgical appliance utilizing the same |
| TWM320172U (en) * | 2007-05-10 | 2007-10-01 | Optimum Care Int Tech Inc | Testing tool |
| TW201331591A (en) * | 2012-01-19 | 2013-08-01 | Prov Technology Corp | Crimping device for electronic component inspection apparatus |
| CN104108602A (en) * | 2013-04-18 | 2014-10-22 | 鸿劲科技股份有限公司 | Pressing device and test equipment applied by same |
| TW201917372A (en) * | 2017-10-27 | 2019-05-01 | 鴻勁精密股份有限公司 | Supercharged crimping device and test classification device thereof allowing an actuating member to obtain a downward pressure larger than a preset pressure to press an electronic component downwards |
| TWI639546B (en) * | 2018-05-04 | 2018-11-01 | 鴻勁精密股份有限公司 | Electronic component crimping mechanism and test classification device |
| CN110879304A (en) * | 2018-09-06 | 2020-03-13 | 致茂电子股份有限公司 | Sliding electronic component testing device |
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