TWI641835B - Electronic component operating device and its application test classification equipment - Google Patents

Electronic component operating device and its application test classification equipment Download PDF

Info

Publication number
TWI641835B
TWI641835B TW106113517A TW106113517A TWI641835B TW I641835 B TWI641835 B TW I641835B TW 106113517 A TW106113517 A TW 106113517A TW 106113517 A TW106113517 A TW 106113517A TW I641835 B TWI641835 B TW I641835B
Authority
TW
Taiwan
Prior art keywords
electronic component
carrier
test
transmission member
test carrier
Prior art date
Application number
TW106113517A
Other languages
Chinese (zh)
Other versions
TW201839402A (en
Inventor
蔡志欣
Original Assignee
鴻勁精密股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鴻勁精密股份有限公司 filed Critical 鴻勁精密股份有限公司
Priority to TW106113517A priority Critical patent/TWI641835B/en
Publication of TW201839402A publication Critical patent/TW201839402A/en
Application granted granted Critical
Publication of TWI641835B publication Critical patent/TWI641835B/en

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

一種電子元件作業裝置,其係設有具至少一測試載台之載送機構,該測試載台係承載至少一電子元件,並由動力源驅動作至少一方向位移,另於測試載台設置至少一第一傳輸件,該第一傳輸件之第一端可電性連接電子元件,而第二端則穿伸出測試載台之底面,一具有測試器之測試機構,係於測試器上設有至少一可電性連接第一傳輸件之第二傳輸件;藉此,利用載送機構之測試載台的第一傳輸件電性連接電子元件及測試機構之第二傳輸件,使測試機構之測試器經由第一、二傳輸件而直接對測試載台上之電子元件執行測試作業,進而減少移載電子元件之作動時序及路徑,達到縮減作業時間及提高生產效能之實用效益。 An electronic component working device is provided with a carrier mechanism having at least one test carrier, wherein the test carrier carries at least one electronic component and is driven by the power source to be displaced in at least one direction, and at least the test carrier is disposed at least a first transmission member, the first end of the first transmission member is electrically connected to the electronic component, and the second end is extended beyond the bottom surface of the test carrier, and a test mechanism having a tester is disposed on the tester Having at least one second transmission member electrically connected to the first transmission member; thereby, the first transmission member of the test carrier of the carrier mechanism is electrically connected to the electronic component and the second transmission member of the testing mechanism to enable the testing mechanism The tester directly performs the test operation on the electronic components on the test stage via the first and second transmission members, thereby reducing the timing and path of the movement of the transferred electronic components, thereby achieving the practical benefit of reducing the working time and improving the production efficiency.

Description

電子元件作業裝置及其應用之測試分類設備 Electronic component operating device and its application test classification equipment

本發明係提供一種利用載送機構之測試載台的第一傳輸件電性連接電子元件及測試機構之第二傳輸件,使測試機構之測試器經由第一、二傳輸件而直接對測試載台上之電子元件執行測試作業,以有效減少移載電子元件之作動時序及路徑,進而縮減作業時間及提高生產效能之電子元件作業裝置。 The invention provides a first transmission member using a test carrier of a carrier mechanism to electrically connect the electronic component and the second transmission component of the testing mechanism, so that the tester of the testing mechanism directly tests the test device via the first and second transmission members. The electronic components on the stage perform test operations to effectively reduce the timing and path of the transfer of electronic components, thereby reducing the operating time and improving the production efficiency of the electronic component operating device.

在現今,電子元件於製作完成後,必須以測試設備對電子元件進行測試作業,以淘汰出不良品;請參閱第1、2、3圖,該電子元件測試設備係於機台11上配置測試裝置12及輸送裝置13,該測試裝置12係設有電性連接之電路板121及測試座122,用以測試電子元件,該輸送裝置13係於測試裝置12之第一側設有二作第一方向(如X方向)位移之第一入料載台131及第一出料載台132,以分別載送待測電子元件及已測電子元件,於測試裝置12之第二側則設有二作X方向位移之第二入料載台133及第二出料載台134,以分別載送待測電子元件及已測電子元件,另於測試裝置12處設有二作第二、三方向(如Y、Z方向)位移之第一壓移器135及第二壓移器136,其中,該第一壓移器135係由第一Y方向驅動元件1371及第一Z方向驅動元件1372驅動作Y-Z方向位移,該第二壓移器136則由第二Y方向驅動元件1381及第二Z方向驅動元件1382驅動作Y-Z方向位移,使得第一壓移器135可於測試座122及第一入、出料載台131、132間移載待測電子元件及已測電子元件,第二壓移器136則於 測試座122及第二入、出料載台133、134間移載待測電子元件及已測電子元件;於使用時,該輸送裝置13之第一入料載台131係承載待測之電子元件14,並作X方向位移將待測之電子元件14載送至第一壓移器135之下方,第一Z方向驅動元件1372即驅動第一壓移器135作Z方向位移於第一入料載台131取出待測電子元件14,第一Y方向驅動元件1371及第一Z方向驅動元件1372再驅動第一壓移器135作Y-Z方向位移將待測電子元件14移入測試裝置12之測試座122而執行測試作業,於測試完畢後,第一Z方向驅動元件1372即驅動第一壓移器135作Z方向位移於測試座122取出已測之電子元件14,第一Y方向驅動元件1371及第一Z方向驅動元件1372再驅動第一壓移器135作Y-Z方向位移將已測之電子元件14移入第一出料載台132,由第一出料載台132作X方向位移輸出已測之電子元件14;惟,由於測試裝置12之測試座122係配置於第一入料載台131之一側,因而測試座122與第一入料載台131間具有Y方向移載路徑,當第一壓移器135於第一入料載台131取出待測電子元件14後,必須作Y方向位移將待測之電子元件14移載至測試座122,方可執行測試作業,換言之,第一壓移器135於測試座122取出已測之電子元件14後,亦必須作Y方向位移將已測電子元件14移載至第一出料載台132,方可執行出料作業,致使第一壓移器135於測試座122及第一入、出料載台131、132間反覆作Y方向位移移載電子元件14,不僅增加多道移載作動時序及移載時間而無法提高生產效能,該輸送裝置13亦必須配置可驅動第一壓移器135作Y方向位移之第一Y方向驅動元件1371,以致增加設備成本。 Nowadays, after the electronic components are manufactured, the electronic components must be tested with the test equipment to eliminate the defective products; please refer to Figures 1, 2 and 3, the electronic component test equipment is configured on the machine 11 for testing. The device 12 and the transport device 13 are provided with an electrically connected circuit board 121 and a test socket 122 for testing electronic components. The transport device 13 is provided on the first side of the test device 12. The first loading stage 131 and the first discharging stage 132 are displaced in one direction (such as the X direction) to respectively carry the electronic component to be tested and the tested electronic component, and are disposed on the second side of the testing device 12 The second loading stage 133 and the second discharging stage 134 for shifting in the X direction respectively carry the electronic component to be tested and the electronic component to be tested, and two second and third are provided at the testing device 12 a first pressure shifter 135 and a second pressure shifter 136 that are displaced in a direction (eg, Y, Z direction), wherein the first pressure shifter 135 is a first Y-direction driving element 1371 and a first Z-direction driving element 1372 The drive is displaced in the YZ direction, and the second pressure shifter 136 is driven by the second Y-direction element 1381 The second Z-direction driving component 1382 is driven to be displaced in the YZ direction, so that the first pressure shifter 135 can transfer the electronic component to be tested and the tested electronic component between the test socket 122 and the first inlet and outlet loading stations 131 and 132. The second pressure shifter 136 is then The test piece 122 and the second inlet and discharge stage 133, 134 transfer the electronic component to be tested and the tested electronic component; in use, the first loading stage 131 of the conveying device 13 carries the electron to be tested The element 14 is displaced in the X direction to carry the electronic component 14 to be tested under the first pressure shifter 135, and the first Z direction driving component 1372 drives the first pressure shifter 135 to be displaced in the Z direction by the first input. The loading stage 131 takes out the electronic component 14 to be tested, and the first Y-direction driving component 1371 and the first Z-direction driving component 1372 drive the first pressure shifter 135 to shift in the YZ direction to move the electronic component 14 to be tested into the testing device 12 The test operation is performed by the seat 122. After the test is completed, the first Z-direction driving component 1372 drives the first pressure shifter 135 to be displaced in the Z direction to the test socket 122 to take out the measured electronic component 14, the first Y-direction driving component 1371. And the first Z-direction driving component 1372 drives the first pressure shifter 135 to shift in the YZ direction to move the measured electronic component 14 into the first discharging stage 132, and the X-direction displacement output is output by the first discharging stage 132. Measured electronic component 14; however, due to test stand 1 of test device 12 The 22 series is disposed on one side of the first loading stage 131, so that the test block 122 and the first loading stage 131 have a Y-direction transfer path, and when the first pressure shifter 135 is on the first loading stage 131 After the electronic component 14 to be tested is taken out, the electronic component 14 to be tested must be transferred to the test socket 122 in the Y direction to perform the test operation. In other words, the first pressure shifter 135 takes out the measured electronic component at the test socket 122. After the component 14, the Y-direction displacement must also be transferred to the first discharge stage 132 to perform the discharging operation, so that the first pressure shifter 135 is in the test socket 122 and the first inlet. The discharge stage 131 and 132 are repeatedly used to shift the electronic component 14 in the Y direction, which not only increases the multi-channel transfer timing and the transfer time, but also cannot improve the production efficiency. The conveying device 13 must also be configured to drive the first pressure shift. The 135 is the first Y-direction driving element 1371 displaced in the Y direction, so as to increase the equipment cost.

本發明之目的一,係提供一種電子元件作業裝置,其係設有具至少一測試載台之載送機構,該測試載台係承載至少 一電子元件,並由動力源驅動作至少一方向位移,另於測試載台設置至少一第一傳輸件,該第一傳輸件之第一端可電性連接電子元件,而第二端則穿伸出測試載台之底面,一具有測試器之測試機構,係於測試器上設有至少一可電性連接第一傳輸件之第二傳輸件;藉此,利用載送機構之測試載台的第一傳輸件電性連接電子元件及測試機構之第二傳輸件,使測試機構之測試器經由第一、二傳輸件而直接對測試載台上之電子元件執行測試作業,進而減少移載電子元件之作動時序及路徑,達到縮減作業時間及提高生產效能之實用效益。 A first object of the present invention is to provide an electronic component operating device that is provided with a carrier mechanism having at least one test carrier, the test carrier carrying at least An electronic component is driven by the power source to be displaced in at least one direction, and the test carrier is provided with at least one first transmission member, the first end of the first transmission member is electrically connected to the electronic component, and the second end is worn Extending from the bottom surface of the test stage, a test mechanism having a tester, wherein the test device is provided with at least one second transmission member electrically connected to the first transmission member; thereby, the test carrier using the carrier mechanism The first transmission member is electrically connected to the electronic component and the second transmission component of the testing mechanism, so that the tester of the testing mechanism directly performs the testing operation on the electronic components on the test carrier via the first and second transmission members, thereby reducing the transfer The timing and path of the operation of electronic components can achieve practical benefits of reducing operating time and improving production efficiency.

本發明之目的二,係提供一種電子元件作業裝置,其中,該作業裝置係於測試載台之移載路徑上設有至少一可作Z方向位移且取放電子元件之取放器,於測試載台將電子元件載送至取放器之下方時,取放器僅需作Z方向位移壓抵電子元件確實接觸測試載台之第一傳輸件而執行測試作業,並於測試完畢,利用取放器作Z方向位移於測試載台取出已測電子元件,並移入另一出料載台,作業裝置毋須另外配置可驅動取放器作Y方向位移之驅動用元件,達到節省成本及利於空間配置之實用效益。 A second object of the present invention is to provide an electronic component working device, wherein the working device is provided with at least one pick-and-place device for displacing the electronic component in the Z direction on the transfer path of the test stage for testing When the stage carries the electronic component under the pick-and-place device, the pick-up device only needs to perform the Z-direction displacement pressure to the electronic component to actually contact the first transmission component of the test carrier to perform the test operation, and after the test is completed, the take-up is performed. The device is displaced in the Z direction to the test stage to take out the tested electronic components, and is moved into another discharging stage. The operating device does not need to be separately configured to drive the pick and place device for the Y-direction displacement driving component, thereby achieving cost saving and space saving. Practical benefits of configuration.

本發明之目的三,係提供一種應用電子元件作業裝置之測試分類設備,其包含機台、供料裝置、收料裝置、作業裝置、移料裝置及中央控制裝置,該供料裝置係配置於機台上,並設有至少一容納待測電子元件之供料承置器,該收料裝置係配置於機台上,並設有至少一容納已測電子元件之收料承置器,本發明作業裝置係配置於機台上,並設有載送機構及測試機構,使測試機構之測試器直接對載送機構之測試載台上的電子元件執行測試作業,該移料裝置係配置於機台上,並設有至少一移載電子元件之移料器,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 A third object of the present invention is to provide a test classification device for applying an electronic component working device, which comprises a machine table, a feeding device, a receiving device, a working device, a material moving device and a central control device, wherein the feeding device is configured And a feeding device for accommodating the electronic component to be tested, the receiving device is disposed on the machine table, and is provided with at least one receiving device for accommodating the tested electronic component, The working device of the invention is arranged on the machine table, and is provided with a carrying mechanism and a testing mechanism, so that the testing device of the testing mechanism directly performs the testing operation on the electronic components on the test platform of the carrying mechanism, and the moving device is configured The machine is provided with at least one shifting device for transferring electronic components, and the central control device is used for controlling and integrating the operations of the devices to perform automated operations, thereby achieving practical benefits of improving work efficiency.

〔習知〕 [study]

11‧‧‧機台 11‧‧‧ machine

12‧‧‧測試裝置 12‧‧‧Testing device

121‧‧‧電路板 121‧‧‧Circuit board

122‧‧‧測試座 122‧‧‧ test seat

13‧‧‧輸送裝置 13‧‧‧Conveyor

131‧‧‧第一入料載台 131‧‧‧First feeding platform

132‧‧‧第一出料載台 132‧‧‧First discharge stage

133‧‧‧第二入料載台 133‧‧‧Second feed stage

134‧‧‧第二出料載台 134‧‧‧Second discharge platform

135‧‧‧第一壓移器 135‧‧‧First pressure shifter

136‧‧‧第二壓移器 136‧‧‧Second pressure shifter

1371‧‧‧第一Y方向驅動元件 1371‧‧‧First Y-direction drive element

1372‧‧‧第一Z方向驅動元件 1372‧‧‧First Z-direction drive element

1381‧‧‧第二Y方向驅動元件 1381‧‧‧Second Y-direction drive element

1382‧‧‧第二Z方向驅動元件 1382‧‧‧Second Z-direction drive element

14‧‧‧電子元件 14‧‧‧Electronic components

〔本發明〕 〔this invention〕

20‧‧‧作業裝置 20‧‧‧Working device

21‧‧‧載送機構 21‧‧‧ Carriers

211‧‧‧動力源 211‧‧‧Power source

212‧‧‧入料測試載台 212‧‧‧Incoming test stage

2121‧‧‧入料承置部 2121‧‧‧Incoming Material Undertaking

2122‧‧‧第一傳輸件 2122‧‧‧First transmission

2123‧‧‧定位器 2123‧‧‧Locator

213‧‧‧出料載台 213‧‧‧Output loading platform

2131‧‧‧出料承置部 2131‧‧‧Disburring Department

214‧‧‧入料測試載台 214‧‧‧Injection test stage

2141‧‧‧容置空間 2141‧‧‧ accommodating space

2142‧‧‧承座 2142‧‧ ‧ socket

2143‧‧‧入料承置部 2143‧‧‧Feeding Department

2144‧‧‧第一傳輸件 2144‧‧‧First transmission

2145‧‧‧彈簧 2145‧‧ spring

2146‧‧‧定位器 2146‧‧‧ Positioner

215‧‧‧出料載台 215‧‧‧ discharging platform

2151‧‧‧出料承置部 2151‧‧‧Disburring Department

22‧‧‧測試機構 22‧‧‧Test institutions

221‧‧‧測試器 221‧‧‧Tester

222‧‧‧第二傳輸件 222‧‧‧second transmission

223‧‧‧電路板 223‧‧‧circuit board

224‧‧‧連接器 224‧‧‧Connector

2241‧‧‧第一連接件 2241‧‧‧First connector

2242‧‧‧連接線 2242‧‧‧Connecting line

2243‧‧‧第二連接件 2243‧‧‧Second connection

23‧‧‧取放器 23‧‧‧ picker

30‧‧‧機台 30‧‧‧ machine

31‧‧‧通口 31‧‧‧ mouth

32、33‧‧‧電子元件 32, 33‧‧‧ Electronic components

40‧‧‧移料裝置 40‧‧‧Transfer device

41‧‧‧第一移料器 41‧‧‧First mover

42‧‧‧第二移料器 42‧‧‧Second shifter

50‧‧‧供料裝置 50‧‧‧Feeding device

51‧‧‧供料承置器 51‧‧‧Feeder

60‧‧‧收料裝置 60‧‧‧ receiving device

61‧‧‧收料承置器 61‧‧‧Receipt receiver

第1圖:習知電子元件測試裝置及輸送裝置之示意圖。 Figure 1: Schematic diagram of a conventional electronic component test device and transport device.

第2圖:習知測試裝置及輸送裝置之使用示意圖(一)。 Figure 2: Schematic diagram of the use of the conventional test device and transport device (1).

第3圖:習知測試裝置及輸送裝置之使用示意圖(二)。 Figure 3: Schematic diagram of the use of conventional test devices and transport devices (2).

第4圖:本發明電子元件作業裝置第一實施例之配置圖。 Fig. 4 is a layout view showing a first embodiment of the electronic component working device of the present invention.

第5圖:本發明作業裝置第一實施例之前視圖。 Figure 5 is a front elevational view of a first embodiment of the working device of the present invention.

第6圖:本發明作業裝置第一實施例之使用示意圖(一)。 Figure 6 is a schematic view showing the use of the first embodiment of the working device of the present invention (I).

第7圖:本發明作業裝置第一實施例之使用示意圖(二)。 Figure 7 is a schematic view showing the use of the first embodiment of the working device of the present invention (2).

第8圖:本發明作業裝置第一實施例之使用示意圖(三)。 Figure 8 is a schematic view showing the use of the first embodiment of the working device of the present invention (3).

第9圖:本發明作業裝置第一實施例之使用示意圖(四)。 Figure 9 is a schematic view showing the use of the first embodiment of the working device of the present invention (4).

第10圖:本發明作業裝置第一實施例之另一應用配置圖。 Fig. 10 is a view showing another application configuration of the first embodiment of the working device of the present invention.

第11圖:本發明電子元件作業裝置第二實施例之配置圖。 Figure 11 is a layout view showing a second embodiment of the electronic component working device of the present invention.

第12圖:本發明作業裝置第二實施例之前視圖。 Figure 12 is a front elevational view of a second embodiment of the working device of the present invention.

第13圖:本發明作業裝置第二實施例之使用示意圖(一)。 Figure 13 is a schematic view showing the use of the second embodiment of the working device of the present invention (I).

第14圖:本發明作業裝置第二實施例之使用示意圖(二)。 Figure 14 is a schematic view showing the use of the second embodiment of the working device of the present invention (2).

第15圖:本發明作業裝置第二實施例之使用示意圖(三)。 Figure 15 is a schematic view showing the use of the second embodiment of the working device of the present invention (3).

第16圖:本發明作業裝置第二實施例之使用示意圖(四)。 Figure 16 is a schematic view showing the use of the second embodiment of the working device of the present invention (4).

第17圖:本發明作業裝置應用於測試分類設備之示意圖。 Figure 17 is a schematic view showing the application of the working device of the present invention to a test sorting device.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第4、5圖,係為本發明電子元件作業裝置20之第一實施例,其包含載送機構21及測試機構22,該載送機構21係設有至少一承載電子元件之測試載台,該測試載台係作至少一方向位移,並設有至少一可電性接觸電子元件之第一傳輸件,更進一步,該載送機構21係設有至少一動力源,以驅動該測試載台位移,該測試載台係設有至少一或複數個承置電子元件之承置部,該承置部係設有至少一該第一傳輸件,又該測試載台係設有至少一固定式且具有第一傳輸件之承置部,亦或設置至少一可活動位移且具有至少一該承置部之承座,並於承置部設 有至少一第一傳輸件,更進一步,該測試載台係設有至少一容置空間,以供容置一具有至少一該承置部且可活動位移之承座,該承置部之第一傳輸件係穿置該承座及該測試載台,另該載送機構21可設有至少一非具有第一傳輸件之載台,以載送電子元件,例如一可載送已測電子元件出料之出料載台,於本實施例中,該載送機構21係於機台30上設有一呈第一方向(如X方向)配置之動力源211,以驅動入料測試載台212及出料載台213作X方向位移,該入料測試載台212係設有固定式之入料承置部2121,並於入料承置部2121之內底面設有複數支為探針之第一傳輸件2122,第一傳輸件2122之第一端可電性連接電子元件,而第二端則穿置於入料測試載台212之底面,由於入料承置部2121之尺寸略大於電子元件之尺寸,該載送機構21係於入料測試載台212上設有至少一可校正定位電子元件之定位器,於本實施例中,係於入料測試載台212之頂面設有定位器2123,定位器2123係以壓缸驅動一呈L型之頂推件位移,令頂推件推抵電子元件位移,以校正定位電子元件,該出料載台213係設有固定式之出料承置部2131,出料承置部2131非具有第一傳輸件,並承載已測電子元件出料;該測試機構22係設有至少一具第二傳輸件222之測試器221,並以第二傳輸件222電性連接該測試載台之第一傳輸件2122,而可直接對該測試載台上之電子元件進行測試作業,更進一步,該第二傳輸件222可為固定式,並以至少一連接器電性連接第一傳輸件2122,亦或配合活動式設計之第一傳輸件2122作電性連接,又該第二傳輸件222可為活動式,以配合固定式之第一傳輸件2122,令第二傳輸件222相對第一傳輸件2122位移而作電性連接,更進一步,該測試器221可具有電性連接之第二傳輸件222及電路板,亦或具有電性連接之第二傳輸件222及電路板,該電路板並電性連接測試機,於本實施例中,機台30係於入料測試載台212之移 載路徑開設有通口31,並於通口31之下方裝配測試器221,該測試器221係具有電性連接之第二傳輸件222及電路板223,該電路板223並電性連接測試機,另於第二傳輸件222與第一傳輸件2122之間設有至少一連接器224,使第二傳輸件222電性連接第一傳輸件2122,於本實施例中,該連接器224係以第一連接件2241電性連接入料測試載台212之第一傳輸件2122,第一連接件2241並以連接線2242連接第二連接件2243,第二連接件2243則電性連接測試器221之第二傳輸件222,使入料測試載台212之第一傳輸件2122與測試器221之第二傳輸件222利用連接器224傳輸電能或測試訊號而執行測試作業;該作業裝置20更包含至少一取放器23,以對電子元件執行預設作業,更進一步,該取放器23係設置於測試載台之移載路徑,該取放器23可執行單純取放電子元件之取放料作業,例如於入料測試載台212及出料載台213間移載電子元件,該取放器23亦或執行壓接及取放電子元件之壓取作業,例如壓抵入料測試載台212之電子元件確實接觸第一傳輸件2122,以及於入料測試載台212及出料載台213間移載電子元件,於本實施例中,該取放器23係配置於入料測試載台212及出料載台213之移載路徑上方,並可作Z方向位移,而執行壓接及取放電子元件之壓取作業,作業裝置20毋須另外配置Y方向驅動用元件,達到節省成本之實用效益。 In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Please refer to Figures 4 and 5, which is the first of the electronic component working device 20 of the present invention. The embodiment includes a carrier mechanism 21 and a testing mechanism 22, wherein the carrier mechanism 21 is provided with at least one test carrier carrying electronic components, the test carrier being displaced in at least one direction and provided with at least one electrical The first transmission member of the electronic component is contacted, and further, the carrier mechanism 21 is provided with at least one power source for driving the test carrier displacement, and the test carrier is provided with at least one or a plurality of mounting electronic components. The receiving portion is provided with at least one first transmitting member, and the test carrier is provided with at least one fixed mounting portion having a first transmitting member, or at least one movable Displacement and having at least one socket of the bearing portion, and is disposed at the bearing portion There is at least one first transmission member. Further, the test carrier is provided with at least one accommodating space for accommodating a seat having at least one of the receiving portions and being movable and displaceable. A transmission member is disposed through the socket and the test carrier, and the carrier mechanism 21 can be provided with at least one carrier having no first transmission member for carrying electronic components, such as a carrier capable of carrying the detected electronic In the present embodiment, the carrier mechanism 21 is provided with a power source 211 disposed in the first direction (such as the X direction) on the machine table 30 to drive the feeding test stage. 212 and the discharge loading platform 213 are arranged to be displaced in the X direction. The feeding test carrier 212 is provided with a fixed feeding receiving portion 2121, and a plurality of probes are disposed on the inner bottom surface of the feeding receiving portion 2121. The first transmission member 2122, the first end of the first transmission member 2122 can be electrically connected to the electronic component, and the second end is placed on the bottom surface of the feeding test carrier 212, because the size of the feeding receiving portion 2121 is slightly More than the size of the electronic component, the carrier mechanism 21 is provided with at least one correctable positioning electron element on the feeding test carrier 212. The positioner, in the embodiment, is provided with a positioner 2123 on the top surface of the feeding test stage 212, and the positioner 2123 is driven by a pressure cylinder to drive an L-shaped pusher displacement, so that the pusher pushes The electronic component is displaced to correct the positioning electronic component. The discharging carrier 213 is provided with a fixed discharging receiving portion 2131. The discharging receiving portion 2131 does not have the first transmitting member and carries the measured electronic component. The testing device 22 is provided with at least one tester 221 having a second transmission member 222, and is electrically connected to the first transmission member 2122 of the test carrier by a second transmission member 222, and can directly be connected to the test carrier. The electronic component on the stage performs a test operation. Further, the second transmission component 222 can be fixed and electrically connected to the first transmission component 2122 by at least one connector, or can cooperate with the first transmission component 2122 of the movable design. For the electrical connection, the second transmission member 222 can be movable to cooperate with the fixed first transmission member 2122 to electrically connect the second transmission member 222 with respect to the first transmission member 2122. Further, The tester 221 can have a second transmission member 222 that is electrically connected The circuit board is also connected to the second transmission member 222 and the circuit board. The circuit board is electrically connected to the testing machine. In this embodiment, the machine 30 is attached to the loading test stage 212. A test port 221 is disposed under the port 31, and the tester 221 is electrically connected to the second transmission member 222 and the circuit board 223. The circuit board 223 is electrically connected to the test machine. And at least one connector 224 is disposed between the second transmission member 222 and the first transmission member 2122, so that the second transmission member 222 is electrically connected to the first transmission member 2122. In this embodiment, the connector 224 is The first connecting member 2122 is electrically connected to the first connecting member 2122 of the feeding test stage 212. The first connecting member 2241 is connected to the second connecting member 2243 by a connecting wire 2242, and the second connecting member 2243 is electrically connected to the tester. The second transmission member 222 of 221 causes the first transmission member 2122 of the infeed test carrier 212 and the second transmission member 222 of the tester 221 to transmit power or test signals by using the connector 224 to perform a test operation; the operation device 20 further At least one pick-and-placer 23 is included to perform a preset operation on the electronic component. Further, the pick-and-placer 23 is disposed on the transfer path of the test stage, and the pick-and-placer 23 can perform the simple access to the electronic component. Discharge operation, for example, on the feed test stage 212 and discharge The electronic components are transferred between the 213, and the pick-up device 23 also performs the pressing operation of the crimping and pick-and-place electronic components. For example, the electronic components pressed against the feeding test carrier 212 do contact the first transmitting member 2122, and In the present embodiment, the pick-and-place device 23 is disposed above the transfer path of the feed test stage 212 and the discharge stage 213, and the transfer device 23 is disposed between the feed test stage 212 and the discharge stage 213. The Z-direction displacement can be performed, and the pressing operation of the crimping and pick-and-place electronic components is performed, and the working device 20 does not need to separately configure the Y-direction driving components, thereby achieving practical benefits of cost saving.

請參閱第6、7圖,該載送機構21之入料測試載台212可供一移料裝置之第一移料器41將待測電子元件32移入該入料承置部2121,載送機構21並利用定位器2123頂推校正待測電子元件32定位,使待測電子元件32之接點(如錫球)正確接觸第一傳輸件2122之第一端,由於第一傳輸件2122之第二端係電性連接該連接器224之第一連接件2241,使得第一傳輸件2122可利用連接器224之第一 連接件2241、連接線2242及第二連接件2243而保持電性連接測試器221之第二傳輸件222;接著於入料測試載台212承載待測之電子元件32後,該載送機構21之動力源211即驅動入料測試載台212及出料載台213同步作X方向位移,令入料測試載台212位移至取放器23之下方,該連接器224之連接線2242並隨入料測試載台212移動,該取放器23即作Z方向向下位移而壓抵入料測試載台212之待測電子元件32,使待測電子元件32之接點確實接觸第一傳輸件2122,由於測試機構22之測試器221係經由電路板223、第二傳輸件222及連接器224而電性連接第一傳輸件2122,使得測試器221可對入料測試載台212上之電子元件32執行測試作業,取放器23毋須作Y方向位移移載電子元件,進而減少移載電子元件之作動時序及路徑,達到縮減作業時間及提高生產效能之實用效益。 Referring to Figures 6 and 7, the feeding test stage 212 of the carrying mechanism 21 is adapted to be used by the first feeder 41 of a moving device to move the electronic component 32 to be tested into the feeding receiving portion 2121. The mechanism 21 uses the locator 2123 to push the calibration to correct the positioning of the electronic component 32 to be tested, so that the contact of the electronic component 32 to be tested (such as a solder ball) correctly contacts the first end of the first transmission member 2122, because the first transmission member 2122 The second end is electrically connected to the first connecting member 2241 of the connector 224, so that the first transmitting member 2122 can utilize the first connector 224 The connecting member 2241, the connecting wire 2242 and the second connecting member 2243 are electrically connected to the second transmitting member 222 of the tester 221; and after the loading test carrier 212 carries the electronic component 32 to be tested, the carrying mechanism 21 The power source 211 drives the feed test stage 212 and the discharge stage 213 to synchronously shift in the X direction, so that the feed test stage 212 is displaced below the pick-up unit 23, and the connection line 2242 of the connector 224 is followed by The feeding test stage 212 moves, and the pick-up device 23 is displaced downward in the Z direction to press against the electronic component 32 to be tested of the feeding test stage 212, so that the contact of the electronic component 32 to be tested does contact the first transmission. The component 2122 is electrically connected to the first transmission member 2122 via the circuit board 223, the second transmission member 222 and the connector 224, so that the tester 221 can be on the feeding test carrier 212. The electronic component 32 performs the test operation, and the pick-and-placer 23 does not need to shift the electronic component in the Y direction, thereby reducing the timing and path of the moving electronic component, thereby achieving the practical benefit of reducing the working time and improving the production efficiency.

請參閱第7、8、9圖,於完成電子元件32之測試作業後,入料測試載台212之定位器2123係釋放已測之電子元件32,該取放器23係作Z方向向上位移,並於入料測試載台212取出已測之電子元件32,該載送機構21之動力源211即驅動入料測試載台212及出料載台213同步作X方向反向位移,令出料載台213位移至取放器23之下方,該取放器23係作Z方向向下位移,將已測之電子元件32移入該出料載台213之出料承置部2131,取放器23再作Z方向向上位移復位,此時,該入料測試載台212則供移料裝置之第一移料器41將下一待測電子元件33移入該入料承置部2121;接著於出料載台213承載已測之電子元件32後,該載送機構21之動力源211即驅動入料測試載台212及出料載台213同步作X方向位移,令具有下一待測電子元件33之入料測試載台212位移至取放器23之下方而接續執行測試作業,該出料載台213則載出已測之電子元件32;因此,測試機構22之測試器221可直接對入料測試載台212上之電子元件執行測試作業,以減少移載電子元件之作動時序及路徑,而取放器23係於入料測試載台212及出料載台213間移載電子元件,毋須作Y方向位移於載送機構21與測試機構22間移載電子元件,達到縮減作業時間及提高生產效能之實用效益。 Referring to Figures 7, 8, and 9, after the test operation of the electronic component 32 is completed, the positioner 2123 of the feed test stage 212 releases the measured electronic component 32, and the pick and place 23 is displaced upward in the Z direction. And taking the measured electronic component 32 on the feeding test carrier 212, the power source 211 of the carrier mechanism 21, that is, driving the feeding test carrier 212 and the discharging carrier 213, synchronously shifting in the X direction, and issuing The material loading table 213 is displaced to the lower side of the pick-up unit 23, and the pick-up unit 23 is displaced downward in the Z direction, and the measured electronic component 32 is moved into the discharging receiving portion 2131 of the discharging stage 213, and is taken and placed. The device 23 is further reset in the Z direction, and at this time, the feeding test carrier 212 is used by the first feeder 41 of the loading device to move the next electronic component 33 to be tested into the feeding receiving portion 2121. After the discharge stage 213 carries the measured electronic component 32, the power source 211 of the carrier mechanism 21, that is, the drive feed test stage 212 and the discharge stage 213 are synchronously displaced in the X direction, so that the next test is performed. The feeding test stage 212 of the electronic component 33 is displaced below the pick-and-placer 23 to continue the test operation, and the discharging stage 213 The tested electronic component 32 is carried out; therefore, the tester 221 of the testing mechanism 22 can directly perform the testing operation on the electronic components on the feeding test carrier 212 to reduce the timing and path of the moving electronic components. The device 23 transfers the electronic components between the feeding test stage 212 and the discharging stage 213, and does not need to shift the Y-direction to transfer the electronic components between the carrying mechanism 21 and the testing mechanism 22, thereby reducing the working time and improving the production efficiency. Practical benefits.

請參閱第5、10圖,係為本發明電子元件作業裝置20之第一實施例的另一應用配置圖,係於機台30上配置有複數個載送機構21、複數個測試機構22及複數個取放器23,各載送機構21之具第一傳輸件2122的入料測試載台212及出料載台213可分別載送待測電子元件及已測電子元件,至少一測試機構22可設置一測試器221,該測試器可具有複數個第二傳輸件222,以對複數個載送機構21之入料測試載台212上的電子元件執行測試作業,亦或該測試機構22可設置複數個具第二傳輸件222之測試器221,以對複數個載送機構21之入料測試載台212上的電子元件執行測試作業,於本實施例中,該測試機構22係設置複數個具第二傳輸件222之測試器221,可直接對複數個入料測試載台212上之電子元件執行測試作業,複數個取放器23係分別位於複數個載送機構21之入料測試載台212及出料載台213的載送路徑,以壓抵入料測試載台212上之電子元件,並於入料測試載台212及出料載台213移載電子元件,達到提高生產效能之實用效益。 Please refer to FIGS. 5 and 10 , which are another application configuration diagram of the first embodiment of the electronic component working device 20 of the present invention. The machine 30 is provided with a plurality of carrier mechanisms 21 , a plurality of testing mechanisms 22 , and a plurality of pick-and-place devices 23, the feeding test carrier 212 and the discharging carrier 213 of the first transporting member 21 of each carrying mechanism 21 respectively carrying the electronic component to be tested and the tested electronic component, at least one testing mechanism A tester 221 can be provided. The tester can have a plurality of second transmission members 222 for performing test operations on electronic components on the load test stage 212 of the plurality of carrier mechanisms 21, or the test mechanism 22 A plurality of testers 221 having a second transport member 222 may be disposed to perform a test operation on the electronic components on the load test carrier 212 of the plurality of carrier mechanisms 21. In the present embodiment, the test mechanism 22 is configured. A plurality of testers 221 having the second transport member 222 can directly perform test operations on the electronic components on the plurality of feed test carriers 212, and the plurality of pick and placers 23 are respectively placed in the feed of the plurality of transport mechanisms 21. Load of test stage 212 and discharge stage 213 Paths to test carrier is pressed against the feeding table of the electronic component 212, and tested in the feeding stage 212 and the discharge stage practical benefits transferring electronic device 213, to improve the production efficiency.

請參閱第11、12圖,係為本發明電子元件作業裝置20之第二實施例,其包含載送機構21及測試機構22,該載送機構21係於機台30上設置呈X方向配置之動力源211,以驅動入料測試載台214及出料載台215作X方向位移,該入料測試載台214係設有至少一容置空間2141,以供容置一具有至少一入料承置部且可活動位移之承座2142,更進一步,該承座2142可由驅動器(如壓缸,圖未示出)驅 動而作主動位移,亦或於容置空間2141與承座2142間設置至少一彈性件,而於承座2142受壓後作被動彈性位移,於本實施例中,該承座2142係設有具複數支第一傳輸件2144之入料承置部2143,該第一傳輸件2144之第一端可電性連接電子元件,而第二端則穿伸出於承座2142及入料測試載台214之底面,另於入料測試載台214之容置空間2141與承座2142間設置複數個為彈簧2145之彈性件,承座2142於受壓後,可壓縮彈簧2145而作Z方向彈性位移,並使第一傳輸件2144之第二端更加凸伸出入料測試載台214之底面,又該承座2142之頂面設有定位器2146,以頂抵校正定位電子元件,該出料載台215係設有出料承置部2151,以載送已測電子元件出料;該測試機構22係設有至少一具第二傳輸件222之測試器221,該第二傳輸件222可電性連接入料測試載台214之第一傳輸件2144,而測試該入料測試載台214上之電子元件,另該機台30係於入料測試載台214之移載路徑開設有通口31,並於通口31之下方固設裝配測試器221,該測試器221係設有電性連接之第二傳輸件222及電路板223,該電路板223並電性連接測試機,又該作業裝置20係於入料測試載台214及出料載台215之移載路徑設有可作Z方向位移之取放器23,而執行壓接及取放電子元件之壓取作業,作業裝置20毋須另外配置Y方向驅動用元件,達到節省成本之實用效益。 Referring to FIGS. 11 and 12, a second embodiment of the electronic component working device 20 of the present invention includes a carrier mechanism 21 and a testing mechanism 22, which is disposed on the machine 30 in an X direction. The power source 211 is configured to drive the loading test carrier 214 and the discharge carrier 215 for X-direction displacement. The feeding test carrier 214 is provided with at least one accommodating space 2141 for accommodating one having at least one input. The bearing portion and the movable displacement seat 2142, further, the socket 2142 can be driven by a drive (such as a pressure cylinder, not shown) Actively displacement, or at least one elastic member is disposed between the accommodating space 2141 and the socket 2142, and is passively displaced after the bearing 2142 is pressed. In this embodiment, the socket 2142 is provided. The first receiving end 2144 has a first end of the first transmitting member 2144 electrically connected to the electronic component, and the second end extends through the socket 2142 and the feeding test load. A plurality of elastic members which are springs 2145 are disposed between the receiving space 2141 of the feeding test carrier 214 and the bearing 2142. After the bearing 2142 is pressed, the spring 2145 can be compressed to make the Z-direction elastic. Displacement, and the second end of the first transmission member 2144 is more convexly protruded from the bottom surface of the feeding test carrier 214, and the top surface of the socket 2142 is provided with a locator 2146 for aligning and correcting the positioning electronic component. The loading platform 215 is provided with a discharge receiving portion 2151 for carrying the output of the tested electronic component; the testing mechanism 22 is provided with at least one tester 221 having a second transmitting member 222, and the second transmitting member 222 can be Electrically connecting the first transfer member 2144 of the feed test station 214, and testing the feed test carrier 214 The electronic component is further provided with a through port 31 in the transfer path of the feeding test carrier 214, and an assembly tester 221 is fixed under the port 31, and the tester 221 is electrically connected. The second transmission member 222 and the circuit board 223 are electrically connected to the testing machine, and the working device 20 is disposed on the loading path of the feeding test carrier 214 and the discharging carrier 215. The direction shifting picker 23 performs the pressing operation of the crimping and pick-and-place electronic components, and the working device 20 does not need to separately arrange the Y-direction driving components, thereby achieving the practical benefit of cost saving.

請參閱第13、14圖,該載送機構21之入料測試載台214可供移料裝置之第一移料器41將待測電子元件32移入該承座2142之入料承置部2143,載送機構21並利用定位器2146頂推校正待測電子元件32定位,使待測電子元件32之接點正確接觸第一傳輸件2144之第一端;接著於入料測試載台214承載待測之電子元件32後,該載送機構21之動力源211即驅動入料測試載台214及出料載台21 5同步作X方向位移,令入料測試載台214位移至取放器23之下方,該取放器23即作Z方向向下位移壓抵入料測試載台214之待測電子元件32,該待測電子元件32於受壓後,即帶動承座2142作Z方向向下位移,且壓縮彈簧2145,令承座2142帶動第一傳輸件2144相對測試機構22之第二傳輸件222作位移,使第一傳輸件2144與第二傳輸件222作電性連接,使得測試器221對入料測試載台214上之電子元件32執行測試作業。 Referring to Figures 13 and 14, the loading test carrier 214 of the carrier mechanism 21 is adapted to move the electronic component 32 to be tested into the material receiving portion 2143 of the socket 2142 by the first feeder 41 of the loading device. The carrier mechanism 21 is calibrated by the locator 2146 to correct the positioning of the electronic component 32 to be tested, so that the contact of the electronic component 32 to be tested correctly contacts the first end of the first transmission member 2144; and then carried on the loading test carrier 214. After the electronic component 32 to be tested, the power source 211 of the carrier mechanism 21 drives the feed test carrier 214 and the discharge carrier 21 5 synchronously shifting in the X direction, so that the feeding test carrier 214 is displaced below the pick-up device 23, and the pick-up device 23 is displaced downward in the Z direction to press the electronic component 32 to be tested of the feeding test carrier 214. After the electronic component 32 to be tested is pressed, the bearing 2142 is driven to be displaced downward in the Z direction, and the spring 2145 is compressed, so that the bearing 2142 drives the first transmission member 2144 to be displaced relative to the second transmission member 222 of the testing mechanism 22. The first transmission member 2144 is electrically connected to the second transmission member 222, so that the tester 221 performs a test operation on the electronic component 32 on the feeding test carrier 214.

請參閱第15、16圖,於完成電子元件32之測試作業後,入料測試載台214之定位器2146係釋放已測之電子元件32,該取放器23係作Z方向向上位移,並於入料測試載台214取出已測之電子元件32,該載送機構21之動力源211即驅動入料測試載台214及出料載台215同步作X方向反向位移,令出料載台215位移至取放器23之下方,該取放器23再作Z方向向下位移,將已測之電子元件32置入於出料載台215之出料承置部2151,取放器23再作Z方向向上位移復位,此時,該入料測試載台214則供移料裝置之第一移料器41將下一待測電子元件33移入該入料承置部2143;接著於出料載台215承載已測之電子元件32後,該載送機構21之動力源211即驅動入料測試載台214及出料載台215同步作X方向位移,令具下一待測電子元件33之入料測試載台214位移至取放器23之下方,而接續執行測試作業,出料載台215則載出已測之電子元件32。 Referring to FIGS. 15 and 16, after the test operation of the electronic component 32 is completed, the positioner 2146 of the feed test stage 214 releases the measured electronic component 32, and the pick and place 23 is displaced upward in the Z direction, and The measured electronic component 32 is taken out at the feeding test carrier 214, and the power source 211 of the carrier mechanism 21, that is, the driving feeding test carrier 214 and the discharging carrier 215 are synchronously displaced in the X direction, so that the discharging is carried out. The table 215 is displaced to the lower side of the pick-up device 23, and the pick-up device 23 is further displaced downward in the Z direction, and the measured electronic component 32 is placed in the discharge receiving portion 2151 of the discharge loading platform 215, and the pick-and-place device 23 is further reset in the Z direction, and at this time, the feeding test carrier 214 is used by the first feeder 41 of the loading device to move the next electronic component 33 to be tested into the feeding receiving portion 2143; After the discharge stage 215 carries the measured electronic component 32, the power source 211 of the carrier mechanism 21, that is, the drive feed test carrier 214 and the discharge carrier 215 are synchronously displaced in the X direction, so as to have the next electronic device to be tested. The feed test carrier 214 of the component 33 is displaced below the pick-and-placer 23, and the test operation is continued, and the discharge carrier 215 is loaded. The electronic device 32 has been measured.

請參閱第4、5、17圖,係本發明之作業裝置20應用於電子元件測試分類設備之示意圖,該測試分類設備係於機台30上配置有供料裝置50、收料裝置60、至少一本發明作業裝置20、移料裝置40及中央控制裝置(圖未示出),該供料裝置50係裝配於機台30,並設有至少一為供料盤之供料承置器51,用以容納至少一待測之電子元件;該收料裝置60係 裝配於機台30,並設有至少一為收料盤之收料承置器61,用以容納至少一已測之電子元件;本發明作業裝置20係裝配於機台30上,並設有載送機構21及測試機構22,以載送及測試電子元件,於本實施例中,載送機構21係設有具第一傳輸件2122之入料測試載台212及出料載台213,該測試機構22係設有具第二傳輸件222之測試器221,該第二傳輸件222係與第一傳輸件2122作電性連接,一取放器23係配置於入料測試載台212及出料載台213的載送路徑,以壓抵入料測試載台212上之電子元件,並於入料測試載台212及出料載台213移載電子元件,該移料裝置40係設有至少一移載電子元件之移料器,於本實施例中,係第一移料器41及第二移料器42,第一移料器41係於供料裝置50之供料承置器51取出待測之電子元件,並移載至入料測試載台212,於入料測試載台212承載電子元件時,可令入料測試載台212之第一傳輸件2122電性連接電子元件及測試機構22之第二傳輸件222,使測試機構22之測試器221經由第一、二傳輸件2122、222而直接對入料測試載台212上之電子元件執行測試作業,於測試完畢後,取放器23係於入料測試載台212取出已測電子元件,並移入出料載台213,該出料載台213則載出已測電子元件,該移料裝置40之第二移料器42係於出料載台213取出已測電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置60之收料承置器61處而分類收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to FIG. 4, FIG. 5 and FIG. 17, which are schematic diagrams of the working device 20 of the present invention applied to an electronic component testing and sorting device. The test sorting device is provided on the machine table 30 with a feeding device 50, a receiving device 60, and at least An operating device 20, a transferring device 40 and a central control device (not shown) are mounted on the machine table 30 and provided with at least one feeding device 51 for feeding trays. For accommodating at least one electronic component to be tested; the receiving device 60 is Mounted on the machine table 30, and provided with at least one receiving receptacle 61 for receiving trays for accommodating at least one tested electronic component; the working device 20 of the present invention is mounted on the machine 30 and provided The carrier mechanism 21 and the testing mechanism 22 are configured to carry and test electronic components. In the present embodiment, the carrier mechanism 21 is provided with a feeding test carrier 212 and a discharging carrier 213 having a first transmission member 2122. The test mechanism 22 is provided with a tester 221 having a second transport member 222. The second transport member 222 is electrically connected to the first transport member 2122, and a pick-and-place device 23 is disposed on the feed test carrier 212. And a carrying path of the discharging stage 213 for pressing against the electronic components on the feeding test stage 212, and transferring the electronic components on the feeding test stage 212 and the discharging stage 213, the moving device 40 The at least one shifting device for transferring electronic components is provided. In this embodiment, the first shifter 41 and the second shifter 42 are connected to the feeding device of the feeding device 50. The device 51 takes out the electronic component to be tested and transfers it to the feeding test carrier 212. When the feeding test carrier 212 carries the electronic component, the material can be loaded. The first transmission member 2122 of the test station 212 is electrically connected to the electronic component and the second transmission member 222 of the testing mechanism 22, so that the tester 221 of the testing mechanism 22 directly tests the incoming material via the first and second transmission members 2122, 222. The electronic component on the stage 212 performs a test operation. After the test is completed, the pick-and-placer 23 is taken out of the feeding test stage 212 to take out the tested electronic component, and is moved into the discharging stage 213, and the discharging stage 213 is loaded. After the electronic component is tested, the second shifter 42 of the loading device 40 takes out the tested electronic component from the discharging platform 213, and according to the test result, the measured electronic component is sent to the receiving device 60. The material receiver 61 is used for sorting and arranging; the central control device is used for controlling and integrating the operation of each device to perform an automatic operation, thereby achieving the practical benefit of improving the performance of the operation.

Claims (7)

一種電子元件作業裝置,包含:載送機構:係設有至少一動力源、至少一入料測試載台及至少一出料載台,該入料測試載台與該出料載台分別供承載一電子元件,該入料測試載台及該出料載台係由該動力源驅動作至少一方向位移,該入料測試載台設有至少一用於承置電子元件之承置部,該承置部並設有至少一第一傳輸件,該第一傳輸件供該入料測試載台承載之電子元件電性接觸;測試機構:係設有具至少一第二傳輸件之測試器,該第二傳輸件能電性連接該第一傳輸件而能用以測試該入料測試載台上之電子元件;至少一取放器:係設置於該入料測試載台及該出料載台之移載路徑,而能用以對電子元件執行預設作業。 An electronic component working device comprises: a carrying mechanism: at least one power source, at least one feeding test carrier and at least one discharging platform, wherein the feeding test carrier and the discharging carrier are respectively carried An electronic component, the feeding test carrier and the discharging carrier are driven by the power source to be displaced in at least one direction, and the feeding test carrier is provided with at least one receiving portion for receiving electronic components, The receiving portion is provided with at least one first transmitting member, wherein the first transmitting member is electrically connected to the electronic component carried by the feeding test carrier; and the testing mechanism is provided with a tester having at least one second transmitting member. The second transmission member can be electrically connected to the first transmission member and can be used for testing the electronic components on the feeding test carrier; at least one pick-and-place device is disposed on the feeding test carrier and the discharging load The transfer path of the station can be used to perform preset operations on electronic components. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該載送機構之入料測試載台設有至少一固定式之該承置部,或設有至少一可活動位移且具有至少一該承置部之承座。 The electronic component working device according to claim 1, wherein the feeding test carrier of the carrying mechanism is provided with at least one fixed type of receiving portion, or at least one movable displacement and at least A seat for the mounting portion. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該載送機構之入料測試載台係設有至少一容置空間與至少一可活動位移且具有至少一該承置部之承座,該承座容置於該容置空間,該第一傳輸件係穿置該承座及該入料測試載台。 The electronic component working device according to claim 1, wherein the feeding test carrier of the carrying mechanism is provided with at least one accommodating space and at least one movable displacement and has at least one of the receiving portions. The socket is placed in the accommodating space, and the first transmission member passes through the socket and the feeding test carrier. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該載送機構係於該入料測試載台設有至少一可校正定位電子元件之定位器。 The electronic component working device according to claim 1, wherein the carrying mechanism is provided with at least one positioner for correcting positioning electronic components on the feeding test carrier. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該測試機構之第二傳輸件係以至少一連接器電性連接該入料測試載台之第一傳輸件。 The electronic component working device according to claim 1, wherein the second transmitting member of the testing device is electrically connected to the first transmitting member of the feeding test carrier by at least one connector. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該測試機構之第二傳輸件係相對該載送機構之第一傳輸件位移而作電性連接 ,亦或該載送機構之第一傳輸件相對該測試機構之第二傳輸件位移而作電性連接。 The electronic component working device according to claim 1, wherein the second transmission member of the testing mechanism is electrically connected to the displacement of the first transmission member of the carrier mechanism Or the first transmission member of the carrier mechanism is electrically connected to the second transmission member of the testing mechanism. 一種應用電子元件作業裝置之測試分類設備,包含:機台;供料裝置:係配置於該機台上,並設有至少一供料承置器,用以容納至少一待測之電子元件;收料裝置:係配置於該機台上,並設有至少一收料承置器,用以容納至少一已測之電子元件;至少一依申請專利範圍第1項所述之電子元件作業裝置:係配置於該機台上,用以移載及測試該電子元件;移料裝置:係配置於該機台上,並設有至少一移料器,以移載電子元件;中央控制裝置:係用以控制及整合各裝置作動,以執行自動化作業。 A test classification device for applying an electronic component working device, comprising: a machine table; a feeding device: disposed on the machine table, and provided with at least one feeding device for accommodating at least one electronic component to be tested; Receiving device: disposed on the machine, and provided with at least one receiving device for accommodating at least one tested electronic component; at least one electronic component working device according to claim 1 The system is disposed on the machine for transferring and testing the electronic component; the transferring device is disposed on the machine, and is provided with at least one shifter for transferring electronic components; and the central control device: It is used to control and integrate the various devices to perform automated operations.
TW106113517A 2017-04-21 2017-04-21 Electronic component operating device and its application test classification equipment TWI641835B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106113517A TWI641835B (en) 2017-04-21 2017-04-21 Electronic component operating device and its application test classification equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106113517A TWI641835B (en) 2017-04-21 2017-04-21 Electronic component operating device and its application test classification equipment

Publications (2)

Publication Number Publication Date
TW201839402A TW201839402A (en) 2018-11-01
TWI641835B true TWI641835B (en) 2018-11-21

Family

ID=65033773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106113517A TWI641835B (en) 2017-04-21 2017-04-21 Electronic component operating device and its application test classification equipment

Country Status (1)

Country Link
TW (1) TWI641835B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111240794B (en) * 2018-11-28 2023-06-13 阿里巴巴集团控股有限公司 Container mirror image extraction method and device and container mirror image test method and device
TWI758092B (en) * 2021-02-08 2022-03-11 鴻勁精密股份有限公司 Connecting mechanism and handler using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004005948A1 (en) * 2002-07-04 2004-01-15 Advantest Corporation Electronic component contact device
TWI300846B (en) * 2006-03-29 2008-09-11 Jet Technology Co Ltd
US20120074977A1 (en) * 2009-06-03 2012-03-29 Semics Inc. Wafer probe station capable of actively controlling tilt of chuck and controlling method thereof
TWI385396B (en) * 2009-02-20 2013-02-11 Hon Tech Inc Test machine used to test the flash drive
CN102233334B (en) * 2010-04-21 2015-03-18 鸿劲科技股份有限公司 Test device for electronic component test classifier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004005948A1 (en) * 2002-07-04 2004-01-15 Advantest Corporation Electronic component contact device
TWI300846B (en) * 2006-03-29 2008-09-11 Jet Technology Co Ltd
TWI385396B (en) * 2009-02-20 2013-02-11 Hon Tech Inc Test machine used to test the flash drive
US20120074977A1 (en) * 2009-06-03 2012-03-29 Semics Inc. Wafer probe station capable of actively controlling tilt of chuck and controlling method thereof
CN102233334B (en) * 2010-04-21 2015-03-18 鸿劲科技股份有限公司 Test device for electronic component test classifier

Also Published As

Publication number Publication date
TW201839402A (en) 2018-11-01

Similar Documents

Publication Publication Date Title
US7609052B2 (en) Contact pusher, contact arm, and electronic device handling apparatus
TWI597504B (en) Electronic components conveying device and its application test classification equipment
TWI582874B (en) A test system for testing semiconductor packaged stacked wafers, and a semiconductor automated test machine
KR100671397B1 (en) Apparatus for contacting devices to test sockets in semiconductor test handler
TWI607223B (en) Press-measuring mechanism for stacked package electronic components and test classification equipment for application thereof
TW201946857A (en) Crimping mechanism for electronic component and applied for test classification equipment in which the crimper can minutely adjust to control the downward pressure of the pressing member so that the crimping member will accurately press down the electronic component
TW201430356A (en) Electronic component operation unit, operation method and operation apparatus applied thereof
TW202014708A (en) Electronic component test apparatus which comprises a feeding device, a testing device, and a transporting device
KR100639149B1 (en) Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
TWI641835B (en) Electronic component operating device and its application test classification equipment
TWI623754B (en) Electronic component testing device and test classification device
CN115825484A (en) Electronic component testing device and testing method thereof
KR101969214B1 (en) Semiconductor device pick-up module and apparatus testing semiconductor devices having the same
KR20110022719A (en) Socket guide, socket, pusher and electronic part testing device
KR101973687B1 (en) Device inspection apparatus
TW201917809A (en) Conveying device with a receiving unit and testing and categorizing device using the same comprising a bearing platform
TWI638160B (en) Gland module, test device with gland module and test classification device
TWI580979B (en) Electronic components crimping device and its application test classification equipment
KR102496532B1 (en) Test apparatus for semiconductor package
KR20150019262A (en) Method for testing semiconductor package
TW202007993A (en) Electronic component testing apparatus and test sorting equipment applied to the same transmitting a signal to the testing machine after receiving the rays to distinguish the light emitting quality of the electronic component
TWI758091B (en) Testing mechanism, connecting mechanism and handler using the same
TWI762186B (en) Connecting mechanism and handler using the same
TWI534439B (en) Electronic components testing and classification equipment
KR100660456B1 (en) Handler for testing semiconductor device