KR20150019262A

KR20150019262A - Method for testing semiconductor package

Info

Publication number: KR20150019262A
Application number: KR20130095893A
Authority: KR
Inventors: 김운식; 이재동
Original assignee: 세메스 주식회사
Priority date: 2013-08-13
Filing date: 2013-08-13
Publication date: 2015-02-25
Also published as: KR102041182B1

Abstract

A method of inspecting a semiconductor package using a test handler, the method comprising: transferring the semiconductor package housed in a customer tray to a loading waiting area using a first loading picker; Transferring the semiconductor packages transferred to the loading standby unit to a loading moving unit using a second loading picker, and aligning the semiconductor packages using a vision; Transferring the semiconductor package transferred to the loading and moving unit to an inspection chamber to perform inspection; Transferring the semiconductor package subjected to the inspection to an unloading moving part; Transferring the semiconductor package transferred to the unloading moving part to an unloading standby part using a first unloading picker; And transferring the semiconductor package, which is transported to the unloading standby portion and classified according to the inspection result, to the customer tray using the second unloading picker.

Description

[0001] The present invention relates to a method for testing semiconductor packages,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package inspection method, and more particularly, to a semiconductor package inspection method using a test handler.

Generally, in the manufacture of a semiconductor package, electrical characteristics are inspected during the manufacturing process to determine whether or not the semiconductor package is defective. At this time, the electrical characteristics of the semiconductor package mainly use a test device called a test handler.

In the inspection of the semiconductor package using the test handler, the semiconductor package is transferred from the customer tray to the test tray. At this time, the transfer from the customer tray to the test tray is performed by using the first loading picker and the second loading picker, respectively, to the loading base and the test tray. A soak chamber, a test chamber, and an exit chamber in the order of accommodating the semiconductor package in the test tray. In addition, the inspected semiconductor package is transferred from the test tray to the customer tray. At this time, the transfer from the test tray to the customer tray is performed to the unloading standby portion and the customer tray using the first unloading picker and the second unloading picker, respectively.

Since the semiconductor package is accommodated in the test tray in the order of the fast chamber, the inspection chamber, and the seat chamber, the seat time is further generated at the fast time, and as a result, There is an extended problem.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor package inspecting method capable of shortening the time required for inspection of a semiconductor package and facilitating alignment.

According to another aspect of the present invention, there is provided a method of inspecting a semiconductor package using a test handler, the method comprising: ; Transferring the semiconductor packages transferred to the loading standby unit to a loading moving unit using a second loading picker, and aligning the semiconductor packages using a vision; Transferring the semiconductor package transferred to the loading and moving unit to an inspection chamber to perform inspection; Transferring the semiconductor package subjected to the inspection to an unloading moving part; Transferring the semiconductor package transferred to the unloading moving part to an unloading standby part using a first unloading picker; And transferring the semiconductor package, which is transported to the unloading standby portion and classified according to the inspection result, to the customer tray using the second unloading picker.

In the inspection method of a semiconductor package according to an embodiment of the present invention, inspection of the semiconductor package using the inspection chamber may be performed by using a chuck to pick up the semiconductor package transferred to the loading and moving unit, Positioning the portion outside the inspection chamber; Aligning the connection terminals of the semiconductor package adsorbed on the chuck by using a vision, and connecting the connection terminals to a test board to perform inspection; The semiconductor package subjected to the inspection is lifted from the test board by using the chuck, the unloading moving part is placed under the chuck, and the loading moving part mounting another semiconductor package is placed on the test board step; And the semiconductor package adsorbed on the chuck is transferred to the unloading moving part and is positioned outside the inspection chamber using the unloading moving part, and the other semiconductor package mounted on the loading moving part is moved to the chuck Can be repeatedly carried out.

According to the present invention mentioned above, the transfer of the semiconductor package using the loading moving part and the unloading moving part can be accomplished, and the alignment of the semiconductor package can be accomplished using the vision, And as a result, the time for transferring the semiconductor package can be shortened sufficiently.

1 is a view for explaining a method of inspecting a semiconductor package according to an embodiment of the present invention.
FIG. 2 is a view for explaining a method of inspecting a semiconductor package in the inspection chamber of FIG. 1;

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Example

FIG. 1 is a view for explaining an inspection method of a semiconductor package according to an embodiment of the present invention, and FIG. 2 is a view for explaining a method of inspecting a semiconductor package in the inspection chamber of FIG.

Referring to FIGS. 1 and 2, a test handler can be used in the semiconductor package inspection method of the present invention. Particularly, in the inspection method of the semiconductor package of the present invention, the loading and unloading part 21 and the unloading and moving part 25 can be used without using the test tray, and in the inspection chamber 23, the semiconductor packages 41 and 47 A chuck 45 capable of vacuum adsorption can be used. The first loading picker 13, the second loading picker 17, the first unloading picker 27, the second unloading picker 31, The base 15 and the unloading standby portion 29 can be used. That is, in the inspection of the semiconductor package of the present invention, the first loading picker 13, the second loading picker 17, the first unloading picker 27, and the second loading picker, which are members capable of transporting the semiconductor packages 41 and 47, 2 loading unloading picker 31, a loading standby portion 15 and an unloading standby portion 27 and a loading movable portion 21 which is a member capable of transporting the semiconductor package to the inspection chamber 23, It is possible to use an inspection apparatus having a loading and moving unit 25. The inspection apparatus usable in the inspection method of the semiconductor package of the present invention may include the vision members 19 and 24 capable of aligning the semiconductor packages 41 and 47, The semiconductor package 41 and 47 may be provided with a member capable of heating and cooling the semiconductor package 41 and 47 to the unloading and moving part 21 and the unloading and moving part 25, respectively.

Hereinafter, a method of inspecting a semiconductor package using the inspection apparatus will be described.

First, the first loading picker 13 is used to transfer the semiconductor package 41 accommodated in the customer trays 10a and 10b to the loading standby portion 15. [ Then, the semiconductor package 41 transferred to the loading standby portion 15 is transferred to the loading / moving portion 21 by using the second loading picker 17. Particularly, in the present invention, when the semiconductor package 41 is transferred to the loading / moving part 21 using the second loading picker 17, it is conveyed to the loading / The semiconductor package 41 can be aligned.

Then, the semiconductor package 41 transferred to the loading and moving unit 21 is transferred to the inspection chamber 23 for inspection. The inspection using the inspection chamber 23 will be described later.

The semiconductor package 41 thus inspected is transferred to the unloading moving part 25 and then transferred to the unloading moving part 25 by using the first unloading picker 27. Then, Is transferred to the unloading standby portion 29 and then transferred to the unloading standby portion 29 and the semiconductor package 41 classified according to the inspection result is used for the second unloading picker 31 And transported to the customer trays 10c and 10d, thereby achieving inspection of the semiconductor package 41. [

As described above, in the present invention, since the semiconductor package 41 can be transferred to the inspection chamber 23 by using the loading and unloading part 21 and the unloading and moving part 25, It is possible to omit the elapsed time and the sheet time at the time of use, and as a result, the time required for the inspection can be sufficiently shortened. Further, since the second loading picker 17 can be aligned using the vision member 19 when the semiconductor package 41 is transferred to the loading and moving part 21, more accurate inspection can be performed .

Particularly, in the inspection of the semiconductor packages 41 and 47 using the inspection chamber 23, the semiconductor package 41 transferred to the loading / And the loading and moving part 21 is positioned outside the inspection chamber 23 together with the adsorption.

Then, a connection terminal of the semiconductor package 41, which is attracted to the chuck 45, is electrically connected to the test board 43 to perform inspection. When the connection terminal of the semiconductor package 41 and the socket of the test board 43 are not aligned with each other, the connection terminals of the semiconductor package 41 and the test board 43 are not aligned, Since the socket of the semiconductor package 41 is not accurately connected and thus the semiconductor package 41 can not be accurately inspected, And a process of aligning the adsorbed semiconductor package (41) using the vision member (24).

The unloading moving part 25 is moved to a position below the chuck 45 by lifting the semiconductor package 41 subjected to the inspection from the test board 43 by using the chuck 45, And the loading moving part 21 on which the other semiconductor package 47 is mounted is placed on the test board 43.

Subsequently, the semiconductor package 41 sucked by the chuck 45 is transferred to the unloading / moving part 25, and the unloading / moving part 25 is used to transfer the semiconductor package 41 to the outside of the inspection chamber 23 And the other semiconductor package 47 mounted on the loading moving part 21 is sucked by using the chuck 45 repeatedly.

As described above, in the semiconductor package inspection method of the present invention, since the semiconductor packages 41 and 47 are connected to the test board 43 by using the chuck 45, inspection can be accomplished in a shorter time, By adding a heating function to the moving part 25, it is possible to perform an easier inspection.

Therefore, the inspection method of the semiconductor package of the present invention can sufficiently shorten the time required for the inspection of the semiconductor package, so that it is expected that productivity of the semiconductor package can be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

10a, 10b, 10c and 10d: semiconductor packages
13: first loading picker 15: loading loading base
17: second loading picker 19, 24: vision member
21: loading moving part 23: inspection chamber
25: unloading moving part 27: first unloading picker
29: unloading standby 31: second unloading picker
41, 47: semiconductor package 43: test board
45: Chuck

Claims

A method of inspecting a semiconductor package using a test handler,
Transferring the semiconductor package housed in a customer tray to a loading waiting area using a first loading picker;
Transferring the semiconductor packages transferred to the loading standby unit to a loading moving unit using a second loading picker, and aligning the semiconductor packages using a vision;
Transferring the semiconductor package transferred to the loading and moving unit to an inspection chamber to perform inspection;
Transferring the semiconductor package subjected to the inspection to an unloading moving part;
Transferring the semiconductor package transferred to the unloading moving part to an unloading standby part using a first unloading picker; And
And transferring the semiconductor package to the customer tray using the second unloading picker, wherein the semiconductor package is transferred to the unloading standby portion and classified according to the inspection result.

The method according to claim 1, wherein the inspection of the semiconductor package using the inspection chamber comprises:
A step of sucking the semiconductor package transferred to the loading moving part by using a chuck and positioning the loading moving part outside the inspection chamber;
Aligning the connection terminals of the semiconductor package adsorbed on the chuck by using a vision, and connecting the connection terminals to a test board to perform inspection;
The semiconductor package subjected to the inspection is lifted from the test board by using the chuck, the unloading moving part is placed under the chuck, and the loading moving part mounting another semiconductor package is placed on the test board step; And
The semiconductor package sucked by the chuck is transferred to the unloading moving part and is positioned outside the inspection chamber using the unloading moving part, and the other semiconductor package mounted on the loading moving part is used with the chuck And the step of adsorbing the semiconductor package is repeatedly performed.