KR102037924B1 - Test tray for using test handler - Google Patents

Test tray for using test handler Download PDF

Info

Publication number
KR102037924B1
KR102037924B1 KR1020130051727A KR20130051727A KR102037924B1 KR 102037924 B1 KR102037924 B1 KR 102037924B1 KR 1020130051727 A KR1020130051727 A KR 1020130051727A KR 20130051727 A KR20130051727 A KR 20130051727A KR 102037924 B1 KR102037924 B1 KR 102037924B1
Authority
KR
South Korea
Prior art keywords
test
semiconductor element
connection terminal
electrical connection
connection
Prior art date
Application number
KR1020130051727A
Other languages
Korean (ko)
Other versions
KR20140132856A (en
Inventor
최정태
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020130051727A priority Critical patent/KR102037924B1/en
Publication of KR20140132856A publication Critical patent/KR20140132856A/en
Application granted granted Critical
Publication of KR102037924B1 publication Critical patent/KR102037924B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A test tray for a test handler includes: a test tray for a test handler having a plurality of inserts on which a semiconductor device for testing may be seated, the insert comprising: a main body providing a space in which the semiconductor device may be seated; A printed circuit board provided below the main body so as to face the connection terminal of the semiconductor device when the semiconductor device is seated; When the semiconductor element is seated on the main body, it is electrically connected to the connection terminal of the semiconductor element by contacting the connection terminal of the semiconductor element on one surface of the printed circuit board facing the connection terminal of the semiconductor element. An electrical connection part electrically connected to the wiring of the printed circuit board; And a connection alignment unit arranged to surround a periphery of the electrical connection unit and aligning the connection terminal of the semiconductor element with the electrical connection unit when the connection terminal of the semiconductor element is connected to the electrical connection unit.

Description

Test tray for using test handler}

The present invention relates to a test tray for a test handler, and more particularly, to a test tray for a test handler having a plurality of inserts on which a semiconductor device for a test can be seated.

In the manufacture of electronic components such as integrated circuit devices, a packaged integrated circuit device (hereinafter referred to as a semiconductor device) performs tests such as electrical performance and thermal stress. In particular, a test handler is an example of an apparatus for electrically testing the aforementioned semiconductor device. And the test of the semiconductor device using the test handler can be mainly achieved by electrically connecting the semiconductor devices accommodated in the test tray to the test socket of the test board.

Here, each of the semiconductor devices accommodated in the test tray has a structure seated on each of the inserts provided in the test tray. That is, the test tray has a structure having a plurality of inserts on which a semiconductor device for testing can be seated. In the test of the semiconductor device using the test tray mentioned above, it can be achieved by electrically connecting the connection terminal of the semiconductor device and the connection terminal of the test socket seated on the insert of the test tray.

However, in the electrical connection between the connection terminal of the semiconductor element seated on the insert of the test tray and the connection terminal of the test socket, the connection terminal of the semiconductor element connection terminal and the test socket due to the structure of the insert, the length of the connection terminal of the test socket, etc. Interference occurs in the electrical connection of the device, and as a result, a situation frequently occurs in which electrical connection between the connection terminal of the semiconductor element and the connection terminal of the test socket is not easily performed.

An example for solving interference caused by a connection occurring between a connection terminal of a semiconductor device and a connection terminal of a test socket is disclosed in Korean Patent Application No. 2004-7002474 (hereinafter referred to as a 'cited document'). In particular, the cited reference discloses an insert having a support at the portion facing the test socket. Thus, the use of the insert having the aforementioned supporting portion eliminates interference due to the electrical connection between the connection terminal of the semiconductor element and the connection terminal of the test socket.

However, since the mentioned support part may be provided in the lower part of the insert mainly by fusion using ultrasonic waves, there is a problem in that manufacturing time increases due to fusion, and when the support part is damaged, the insert cannot be reused and the entire insert needs to be replaced. There is a problem that the life of the insert is shortened.

SUMMARY OF THE INVENTION An object of the present invention is to provide a test tray for a test handler which can not only sufficiently eliminate interference due to the connection of the connection terminal of the semiconductor element and the connection terminal of the test socket, but also can be easily assembled and extend the life.

A test tray for a test handler according to an embodiment of the present invention for achieving the above-mentioned object is a test tray for a test handler having a plurality of inserts on which a semiconductor device for testing can be seated, wherein the insert is the A main body providing a space in which the semiconductor device may be seated; A printed circuit board provided below the main body so as to face the connection terminal of the semiconductor device when the semiconductor device is seated; When the semiconductor element is seated on the main body, it is electrically connected to the connection terminal of the semiconductor element by contacting the connection terminal of the semiconductor element on one surface of the printed circuit board facing the connection terminal of the semiconductor element. An electrical connection part electrically connected to the wiring of the printed circuit board; And a connection alignment unit arranged to surround a periphery of the electrical connection unit and aligning the connection terminal of the semiconductor element with the electrical connection unit when the connection terminal of the semiconductor element is connected to the electrical connection unit.

In the test tray for a test handler according to an embodiment of the present invention mentioned above, the printed circuit board may be provided to have a structure coupled to the main body by bolt assembly, the electrical connection may be made of a conductive rubber material The electrical connection part and the connection alignment part may be formed on one surface of the printed circuit board by performing a deposition process.

The test tray for the test handler of the present invention mentioned above has a printed circuit board positioned so as to face the connecting terminal of the semiconductor element when the semiconductor element is seated under the insert body, and the connection terminal of the semiconductor element on one surface of the printed circuit board. By contact with and may be electrically connected to the connection terminal of the semiconductor element and an electrical connection that is electrically connected to the wiring of the printed circuit board.

Therefore, since the interference due to the connection between the connection terminal of the semiconductor device and the connection terminal of the test socket can be sufficiently eliminated by using the insert having the above-mentioned printed circuit board, the reliability according to the test of the semiconductor device is improved. It works.

In addition, in the case of the printed circuit board, it can be provided in the lower portion of the printed circuit board through the bolt coupling can be expected to be easy to assemble, and if the printed circuit board is damaged, only the printed circuit board itself can be replaced. This can be expected to extend the life of the insert as a whole.

1 is a block diagram schematically illustrating a test tray for a test handler according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating an insert provided in a test tray for a test handler of FIG. 1.

As the inventive concept allows for various changes and numerous embodiments, the embodiments will be described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "consist of" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Example

First, although not shown, the test handler of the present invention may include a test tray, a loading member, a soak chamber, a test chamber, a pushing member, a desoak, an unloading member, and the like.

The test tray has a plurality of inserts on which the semiconductor element can be seated as described below, and circulates along a closed path defined by a plurality of transfer members or the like for testing.

The loading member mentioned above loads the semiconductor element to be tested loaded on the customer tray into the test tray in the loading position.

The aforementioned inner chamber is provided for preheating or precooling the semiconductor element loaded in the test tray transferred from the loading position according to the test environmental conditions prior to performing the test.

The test chamber mentioned above is provided for testing a semiconductor device loaded in a test tray which is preheated or precooled in the inner chamber and then transferred to a test position.

The mentioned pushing member is loaded into a test tray in the test chamber and pushes the semiconductor element seated on the insert toward the test socket of the tester device docked in the tester chamber to electrically transfer the semiconductor element to the test socket of the tester device, i.e. the test socket of the test board. Is provided to connect.

In the Di-speed chamber, a heating or cooled semiconductor element loaded in a test tray transferred from the test chamber is provided to return to room temperature.

The unloading member classifies the semiconductor devices loaded on the test trays from the dichroic chamber into the unloading position by test grade and unloads them into empty customer trays.

As mentioned, the semiconductor device has a structure that circulates along a closed path moving from the loading position to the unloading position from the loading position to the unloading position by being loaded on the test tray and seated on the insert.

The test of the semiconductor device using the test handler mentioned above can be achieved by electrically connecting the connection terminal of the semiconductor device and the connection terminal of the test socket seated on the insert of the test tray. That is, by connecting the test tray toward the test apparatus and pushing the test tray toward the test apparatus using the pushing member, the connection terminal of the semiconductor element seated on the insert of the test tray is connected to the test socket on the test apparatus side. It can be achieved by electrical connection to the.

Hereinafter, a test tray having an insert mentioned with reference to the drawings will be described.

1 is a block diagram schematically illustrating a test tray for a test handler according to an embodiment of the present invention, and FIG. 2 is a view illustrating an insert provided in the test tray for the test handler of FIG. 1.

1 and 2, as mentioned above, the test tray 100 is for transporting each of a plurality of semiconductor elements 13 in a state of accommodating each of the plurality of semiconductor elements 13. An insert 11 is provided. In particular, each of the inserts 11 mentioned above may be provided with a member or the like that can fix and release each of the semiconductor elements 13 when the semiconductor elements 13 are seated. It may be provided to be elastically movable relative to the metal frame by having a structure that is coupled.

The insert 11 of the present invention may include a main body 21, a printed circuit board 31, an electrical connection part 33, a connection alignment part 35, and the like.

The body 21 mentioned above may provide a space 23 in which the semiconductor device 13 may be seated.

The printed circuit board 31 mentioned above may be provided under the main body 21 so as to face the connection terminal 15 of the semiconductor element 13 when the semiconductor element 13 is seated. In particular, the printed circuit board 31 of the present invention may be provided to have a structure that is coupled by the assembly of the main body 21 and the bolt (41). That is, the insert 11 of the present invention may be provided to have a structure in which the aforementioned printed circuit board 31 is assembled by assembling the bolt 41 at the lower portion of the main body 21 facing the test board of the test apparatus. . In addition, electrical wirings 37 for electrical transmission may be formed on the printed circuit board 31 according to a design pattern.

The electrical connection part 33 mentioned above has a semiconductor device (or a semiconductor device) disposed on one surface of the printed circuit board 31 facing the connection terminal 15 of the semiconductor device 13 when the semiconductor device 13 is seated on the main body 21. 13 may be provided to be electrically connected to the connection terminal 15 of the semiconductor device 13 and to the wiring 37 of the printed circuit board 31 by contacting the connection terminal 15 of the semiconductor device 13. That is, the electrical connection part 33 may be provided on one surface of the printed circuit board 31 so as to be connected to the electrical wiring 37 of the printed circuit board 31. It may be mainly made of a conductive rubber material so as to mitigate an impact on the connection terminal 15 of the semiconductor element 13 at the time of connection. In particular, when considering the impact applied when the semiconductor element 13 is pushed by the pushing member when the semiconductor element 13 is tested, the electrical connection part 33 mentioned above is preferably formed using a conductive rubber material.

The connection arrangement 35 mentioned may be provided to surround the periphery of the electrical connection 33. As a result, the connection alignment unit 35 is configured to align the connection terminal 15 of the semiconductor element 13 with the electrical connection unit 33 when the connection terminal 15 of the semiconductor element 13 is connected to the electrical connection unit 33. Can be. That is, the connection alignment part 35 is provided so as to surround the electrical connection part 33 so that the connection terminal 15 of the semiconductor element 13 when the connection terminal 15 of the semiconductor element 13 is connected to the electrical connection part 33. Is accommodated in the connection alignment unit 35, so that the connection between the connection terminal 15 and the electrical connection unit 33 of the semiconductor element 13 can be aligned. Here, the above-mentioned connection alignment section 35 is provided only for alignment and needs to be provided as a member that does not conduct electricity. Accordingly, in the present invention, the connection alignment unit 35 may be formed of a rubber material that is not electrically conductive. In addition, the connection alignment unit 35 is formed of a rubber material to mitigate an impact applied to the connection terminal 15 of the semiconductor element 13 during alignment, as in the electrical connection unit 33 mentioned above.

The electrical connection 33 and the connection alignment unit 35 mentioned above may be formed on one surface of the printed circuit board 31 by performing a deposition process.

In addition, the shape of the electrical connection part 33 and the connection alignment part 35 depends on the connection terminal 15 of the semiconductor element 13, and the connection terminal 15 of the semiconductor element 13 has a circular ball structure. The electrical connection 33 may be provided to have a circular shape when it has, and the connection alignment part 35 may be provided to have a cylindrical shape surrounding the electrical connection 33 having a circular shape.

In addition, the space | interval of the electrical connection part 33 may be formed equally to the space | interval of the connection terminal 15 of the semiconductor element 13, and may be formed between the electrical connection 33 and the connection terminal 15 of the semiconductor element 13. If it does not interfere with the electrical connection of the can be formed to have a variable structure.

As described above, the test tray 100 of the present invention includes the insert 11 having the above-mentioned structure, so that the connection of the connection terminal 15 of the semiconductor element 13 and the test socket of the test board is performed. Instead of connecting the connection terminal 15 and the test socket of the test board directly, the connection terminal 15 of the semiconductor element 13 and the connection terminal of the test socket are connected through the electrical connection portion 33 of the printed circuit board 31. Because of the connection, interference due to the connection between the connection terminal 15 of the semiconductor element 13 and the connection terminal of the test socket can be sufficiently eliminated.

In addition, since the printed circuit board 31 can be coupled to the main body 21 of the insert 11 by assembling the bolt 41, ease of assembly can be achieved.

In addition, if the printed circuit board 31 is damaged when the insert 11 is used, only the printed circuit board 31 may be replaced, thereby extending the life of the insert 11.

Since the test tray for the test handler of the present invention mentioned above can sufficiently improve the reliability of the test of the semiconductor device by sufficiently eliminating interference due to the connection of the connection terminal of the semiconductor device and the connection terminal of the test socket, the semiconductor device is manufactured. We can expect to strengthen our product competitiveness by improving the reliability.

In addition, the test tray for the test handler of the present invention mentioned above can be expected to enhance the price competitiveness through the improvement of productivity according to the manufacture of semiconductor devices by the ease of assembly and the extension of the life for the test tray itself.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

11 insert 13 semiconductor device
15: connection terminal 21: main body
23: space 31: printed circuit board
33: electrical connection 35: connection alignment
37: wiring 41: bolt
100: test tray

Claims (3)

A test tray for a test handler having a plurality of inserts on which a semiconductor device for testing can be seated,
The insert is
A main body providing a space in which the semiconductor element may be seated;
A printed circuit board provided below the main body so as to face the connection terminal of the semiconductor device when the semiconductor device is seated;
When the semiconductor element is seated on the main body, it is electrically connected to the connection terminal of the semiconductor element by contacting the connection terminal of the semiconductor element on one surface of the printed circuit board facing the connection terminal of the semiconductor element. An electrical connection part electrically connected to the wiring of the printed circuit board; And
It is provided so as to surround the periphery of the said electrical connection part, When the connection terminal of the said semiconductor element connects with the said electrical connection part, The connection alignment part which arranges between the connection terminal of the said semiconductor element and the said electrical connection part is included,
The electrical connection portion and the connection alignment portion is provided to be formed on one surface of the printed circuit board by performing a deposition process,
When the connection terminal of the semiconductor element is provided to have a circular ball structure, the electrical connection portion is provided to have a circular shape, and the connection alignment portion is provided to have a cylindrical shape surrounding the circular electrical connection portion. Test tray for test handlers. The test tray of claim 1, wherein the printed circuit board is provided to have a structure coupled to the main body by bolt assembly, and the electrical connection part is made of a conductive rubber material. The test tray of claim 1, wherein the connection alignment unit is made of a non-conductive rubber material.
KR1020130051727A 2013-05-08 2013-05-08 Test tray for using test handler KR102037924B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130051727A KR102037924B1 (en) 2013-05-08 2013-05-08 Test tray for using test handler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130051727A KR102037924B1 (en) 2013-05-08 2013-05-08 Test tray for using test handler

Publications (2)

Publication Number Publication Date
KR20140132856A KR20140132856A (en) 2014-11-19
KR102037924B1 true KR102037924B1 (en) 2019-10-29

Family

ID=52453654

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130051727A KR102037924B1 (en) 2013-05-08 2013-05-08 Test tray for using test handler

Country Status (1)

Country Link
KR (1) KR102037924B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102372899B1 (en) * 2016-08-09 2022-03-11 주식회사 아이에스시 Hi-Fix socket board and Hi-Fix board having the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270321A (en) * 2001-03-07 2002-09-20 Advanex Inc Socket for semiconductor package
KR200414883Y1 (en) * 2006-02-10 2006-04-26 주식회사 아이에스시테크놀러지 Carrier unit for semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070062085A (en) * 2005-12-12 2007-06-15 삼성전자주식회사 Insert for semiconductor package
KR101076475B1 (en) * 2009-05-11 2011-10-26 주식회사 아이에스시테크놀러지 Handler for test

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270321A (en) * 2001-03-07 2002-09-20 Advanex Inc Socket for semiconductor package
KR200414883Y1 (en) * 2006-02-10 2006-04-26 주식회사 아이에스시테크놀러지 Carrier unit for semiconductor device

Also Published As

Publication number Publication date
KR20140132856A (en) 2014-11-19

Similar Documents

Publication Publication Date Title
CN106796252B (en) Test socket
TWI549219B (en) Test sorting machine and its propulsion device, test tray and test machine interface board
US8212579B2 (en) Fixing apparatus for a probe card
US20140210504A1 (en) Testing device for electronic device testing
JP6317270B2 (en) Electrical connection device and pogo pin
TWI578001B (en) Semiconductor device alignment socket unit and semiconductor device test apparatus including the same
KR101766265B1 (en) Probe card
US8212350B2 (en) Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
US7830163B2 (en) Testing circuit board for testing devices under test
US9651578B2 (en) Assembly method of direct-docking probing device
KR101957961B1 (en) Socket board assembly
KR102037924B1 (en) Test tray for using test handler
US9739830B2 (en) Test assembly
KR102041182B1 (en) Method for testing semiconductor package
KR102287237B1 (en) Insert assembly for receiving semiconductor device and test tray including the same
US9274140B2 (en) Multi-purpose integrated circuit device contactor
US8487642B2 (en) Burn-in socket and testing fixture using the same
US10295563B2 (en) Test socket for semiconductor device and test device including the same
KR102037925B1 (en) Apparatus for contacting semiconductor device in a test handler
US20190162776A1 (en) Apparatus for testing a signal speed of a semiconductor package and method of manufacturing a semiconductor package
KR102198301B1 (en) Socket board assembly
KR20130134101A (en) Probe card
KR102065602B1 (en) Socket of test board
KR101452113B1 (en) Connection apparatus for testing a semiconductor device
KR20120060299A (en) Test socket

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant