KR101766265B1 - Probe card - Google Patents

Probe card Download PDF

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Publication number
KR101766265B1
KR101766265B1 KR1020150161968A KR20150161968A KR101766265B1 KR 101766265 B1 KR101766265 B1 KR 101766265B1 KR 1020150161968 A KR1020150161968 A KR 1020150161968A KR 20150161968 A KR20150161968 A KR 20150161968A KR 101766265 B1 KR101766265 B1 KR 101766265B1
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KR
South Korea
Prior art keywords
circuit board
printed circuit
probe
main printed
hole
Prior art date
Application number
KR1020150161968A
Other languages
Korean (ko)
Other versions
KR20170058138A (en
Inventor
김현구
김은영
장강호
박영근
황규호
Original Assignee
(주)엠투엔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)엠투엔 filed Critical (주)엠투엔
Priority to KR1020150161968A priority Critical patent/KR101766265B1/en
Publication of KR20170058138A publication Critical patent/KR20170058138A/en
Application granted granted Critical
Publication of KR101766265B1 publication Critical patent/KR101766265B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The present invention proposes a probe card. According to an aspect of the present invention, there is provided a probe card including: a probe head having a plurality of probe needles contacted with a wafer; A main printed circuit board which receives an external test signal, outputs an electric signal, and is electrically connected to the probe head; A plurality of coaxial cables connecting the probe head and the main printed circuit board; A first reinforcing part fixed to an upper surface of the main printed circuit board; A second reinforcing portion coupled to an upper portion of the first reinforcing portion; And a flatness adjusting screw for adjusting the flatness of the probe head, wherein the flatness adjusting screw is coupled to the second reinforcing portion; A pin body passing through the first reinforcing portion and the main printed circuit board; And a pin coupling portion coupled to the probe head, wherein the main printed circuit board includes a first through hole through which the pin body of the flatness adjusting screw passes, wherein a diameter of the first through hole is larger than a diameter of the pin body .

Description

Probe card {PROBE CARD}

The present invention relates to a probe card.

Generally, a probe card electrically connects a wafer and a semiconductor device inspection equipment to test performance during or after fabrication of a semiconductor device such as a semiconductor memory or a display, and transmits an electrical signal of the semiconductor device inspection equipment to a chip And transmits the signal returned from the chip to the semiconductor device testing equipment.

A typical probe card consists of a main circuit board (PCB), a space transformer (STF), and a tip fixedly attached to the space deflector. At this time, the space transformer is composed of a multilayer ceramic substrate (MLC: Multi Layer Ceramic).

In this connection, in Korean Provisional Patent No. 1181520 (name: probe card and manufacturing method), a probe card for testing the semiconductor die in contact with a pad formed on a plurality of semiconductor dies on a wafer, ; A block plate attached to the main circuit board and having the same number of grooves as the number of the plurality of semiconductor dies; A plurality of sub-probe units detachably coupled to the grooves and corresponding to the plurality of semiconductor dies; And an interposer for electrically connecting the sub-probe unit to the main circuit board, wherein one of the plurality of sub-probe units includes one of the plurality of semiconductor dies for testing one of the plurality of semiconductor dies A plurality of probe tips in contact with the pad formed; A probe substrate on which the plurality of probe tips are mounted; Disclosed is a space transformer bonded to the probe substrate and coupled to the interposer for converting pitch.

Conventional probe cards are designed and manufactured differently for each wafer memory chip because the chip array is not always the same as the original size and pad arrangement of each product of the memory chip of the wafer, and the position of the probe tip to be in contact with the pad is also different.

In addition, the main PCB, which is a component for electrically connecting the probe tip to the test equipment, and the probe head in which the conductor is wired are different in design each time considering the position of the probe tip, and the connected test equipment channel information also changes there was.

For this reason, the conventional probe card has difficulty in recycling the probe head or the main PCB.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a probe card which can be utilized without changing the main printed circuit board even if the size of the memory chip is changed.

According to a first aspect of the present invention, there is provided a probe card comprising: a probe head having a plurality of probe needles contacting a wafer; A main printed circuit board which receives an external test signal, outputs an electric signal, and is electrically connected to the probe head; A plurality of coaxial cables connecting the probe head and the main printed circuit board; A first reinforcing part fixed to an upper surface of the main printed circuit board; A second reinforcing portion coupled to an upper portion of the first reinforcing portion; And a flatness adjusting screw for adjusting the flatness of the probe head, wherein the flatness adjusting screw is coupled to the second reinforcing portion; A pin body passing through the first reinforcing portion and the main printed circuit board; And a pin coupling portion coupled to the probe head, wherein the main printed circuit board includes a first through hole through which the pin body of the flatness adjusting screw passes, wherein a diameter of the first through hole is larger than a diameter of the pin body .

According to a second aspect of the present invention, there is provided a method of adjusting a pitch of a probe card, including: checking a size of a wafer; Preparing a probe head and a second reinforcement corresponding to the size of the wafer; And connecting the flatness adjusting screw to the second reinforcing portion and penetrating the main printed circuit board and the first reinforcing portion to connect to the probe head.

According to the above-mentioned problem solving means of the present invention, by replacing only the probe head and the second reinforcing portion, it is possible to cope with memory chips of various sizes, and there is an effect that recycle can be performed without changing the main printed circuit board.

1 is an exploded perspective view of a probe card according to an embodiment of the present invention.
2 is a perspective view of a main printed circuit board according to an embodiment of the present invention.
3 is a perspective view of a probe head according to an embodiment of the present invention.
4 is a perspective view of a coaxial cable according to an embodiment of the present invention.
5 is a partial cross-sectional view of a probe card according to an embodiment of the present invention.
6 is an enlarged view of A in Fig.
7 is a flowchart illustrating a method of adjusting a pitch of a probe card according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.

Throughout this specification, when a part is referred to as being "connected" to another part, it is not limited to a case where it is "directly connected" but also includes the case where it is "electrically connected" do.

Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms "about "," substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) "or" step "used to the extent that it is used throughout the specification does not mean" step for.

The present invention relates to a probe card 10, which may be an apparatus for contacting a wafer and inspecting the wafer.

2 is a perspective view of a main printed circuit board according to an embodiment of the present invention. FIG. 3 is a perspective view of a probe card according to an embodiment of the present invention. FIG. 4 is a perspective view of a coaxial cable according to an embodiment of the present invention, FIG. 5 is a partial cross-sectional view of a probe card according to an embodiment of the present invention, FIG. 6 is an enlarged view of FIG. And FIG. 7 is a flowchart illustrating a method of adjusting a pitch of a probe card according to an embodiment of the present invention.

First, a probe card 10 (hereinafter referred to as 'probe card 10') according to an embodiment of the present invention will be described with reference to FIGS. 1 and 5. FIG.

The probe card 10 may be a device that makes one-to-one contact with a plurality of pads on a wafer and transfers an electric signal transmitted from the semiconductor testing device to a semiconductor die on the wafer.

The probe card 10 includes a probe head 200, a main printed circuit board 100, a coaxial cable 300, a first reinforcing part 400, a second reinforcing part 500, .

The probe head 200 has a plurality of probe needles 211 that are in contact with the wafer.

In addition, the probe head 200 may include a probe substrate 210 and an intermediate circuit layer 220.

The probe substrate 210 is mounted with a plurality of probe needles 211 that are electrically connected to the intermediate circuit layer 220 and the probes 211 are in one-to-one contact with the plurality of pads on the wafer, .

In detail, the probe needle 211 receives an electric signal from an external inspection device (not shown) from the intermediate circuit layer 220 and transmits it to the wafer, receives a signal coming back from the wafer, ). Further, the probe needle 211 directly contacts the pad on the wafer to inspect the wafer. For reference, the probe needle 211 may be formed of an elastic body to prevent breakage of the wafer upon contact with the pad on the wafer.

The intermediate circuit layer 220 is electrically connected to the probe substrate 210 and the main printed circuit board 100.

In detail, the intermediate circuit layer 220 receives an electric signal of the external inspection apparatus from the main printed circuit board 100 and transmits it to the probe needles 211. The intermediate circuit layer 220 can receive an electric signal coming back from the wafer through the probe needle 211 and transmit it to the main printed circuit board 100.

For reference, the intermediate circuit layer 220 according to an embodiment of the present invention may be formed by a micro electro mechanical system (MEMS) method.

A plurality of coupling holes 222 for coupling the flatness adjusting screw 600 are formed on the upper surface of the intermediate circuit layer 220.

The main printed circuit board 100 receives an external test signal, outputs an electric signal, and is electrically connected to the probe head 200.

In detail, the main printed circuit board 100 receives the electric signal of the external inspection apparatus and transmits it to the intermediate circuit layer 220. The main printed circuit board 100 receives the electric signal coming back from the wafer through the intermediate circuit layer 220 and transmits it to the external inspection apparatus.

At this time, the intermediate circuit layer 220 transmits or receives electric signals through the main printed circuit board 100 and the coaxial cable 300 to each other. To this end, both ends of the coaxial cable 300 are electrically connected to the intermediate circuit layer 220 and the main printed circuit board 100, respectively. The coaxial cable 300 is connected to the intermediate circuit layer 220 and the main printed circuit board 100 in a socket manner so as to be detachable. A detailed description thereof will be given later.

Hereinafter, the main printed circuit board 100 and the probe head 200 according to an embodiment of the present invention will be described with reference to FIGS. 2 and 3. FIG.

The main printed circuit board 100 may include a plurality of first socket portions 110 to which one end of the coaxial cable 300 is connected.

The probe head 200 may include a plurality of second socket portions 221 to which the other end of the coaxial cable 300 is connected. In other words, a plurality of second socket portions 221 to which the other end of the coaxial cable 300 is connected may be located on the upper surface of the intermediate circuit layer 220.

The main printed circuit board 100 may have a through hole 120 formed at a central portion of the main printed circuit board 100. The coaxial cable 300 passes through the through hole 120, And the second socket portion 221 of the probe head 200, respectively. Accordingly, the length of the coaxial cable 300 can be shortened, noise generation can be minimized, and signal transmission characteristics can be improved.

In addition, the probe head 200 and the main printed circuit board 100 may be connected using a coaxial cable 300 to have spatial autonomy.

The main printed circuit board 100 may further include a plurality of connectors 130 to which an external inspection apparatus is connected. The main printed circuit board 100 may receive an electric signal of the external inspection apparatus through the connector 130, It can be transmitted to the inspection apparatus.

2, a through-hole 120 is formed at a central portion of the main printed circuit board 100, a first socket portion 110 is located at a periphery of the through-hole 120, The first through hole 140 may be located at the periphery of the first socket portion 110 and the connector 130 may be located at the periphery of the first through hole 140. In other words, a through hole 120 is formed in a central portion of the main printed circuit board 100, a connector 130 is disposed on an upper surface of the outermost portion, a first socket 130 is provided between the through hole 120 and the connector 130, The first portion 110 and the first through hole 140 may be positioned. This allows the external inspection apparatus to be connected to the connector 130 without interference of other components and the first socket portion 110 is located at the periphery of the through hole 120 to easily connect the coaxial cable 300 There are advantages to be able to.

The peripheral portion may be a portion located in the circumferential direction with respect to the central portion of the main printed circuit board 100.

As shown in FIG. 3, the intermediate circuit layer 220 may be formed of a single circuit board. However, the intermediate circuit layer 220 may be formed using a plurality of circuit boards, The number of circuit boards can be increased or decreased corresponding to the area of the circuit board.

In addition, the probe substrate 210 may be manufactured to have the same size corresponding to the area of the intermediate circuit layer 220. In other words, the probe substrate 210 can be formed using a plurality of substrates in the same manner as the above-described intermediate circuit layer 220, and the number of the probe substrates 210 Increase or decrease.

The intermediate circuit layer 220 may be one selected from a printed circuit board (PCB), a multilayer organic (MLO), a multilayer ceramic (MLC), and a multilayer ML.

4, a coaxial cable 300 according to an embodiment of the present invention will be described.

The coaxial cable 300 includes a first connecting board 320, a second connecting board 330, and a plurality of cables 310.

The first connecting board 320 is located at one end of the coaxial cable 300 and may be connected to the first socket 110 of the main printed circuit board 100.

The second connecting board 330 may be located at the other end of the coaxial cable 300 and may be connected to the second socket portion 221 of the probe head 200.

The first and second connecting boards 320 and 330 may have components for electrical characteristics such as relays.

The first and second connecting boards 320 and 330 may be electrically connected to each other through a plurality of cables 310.

The coaxial cable 300 has a low dielectric constant and is excellent in electrical signal transmission, so that occurrence of noise occurring when electric signals are transmitted between the main printed circuit board 100 and the probe head 200 can be minimized and signal transmission characteristics can be improved .

The first and second connecting boards 320 and 330 located at both ends of the coaxial cable 300 are connected to the main printed circuit board 100 and the probe head 200 in a socket manner, (100) can be recycled.

The first connecting board 320 and the second connecting board 330 are located at both ends of the coaxial cable 300 and the first connecting board 320 is connected to the first socket 300 of the main printed circuit board 100, And the second connecting board 330 may be connected to the second socket portion 221 of the probe head 200. [ When the size of the wafer to be measured is changed and the contact position and channel information are changed, the probe head 200 to which the second connecting board 330 of the coaxial cable 300 is connected is changed to the main printed circuit board 100) can be recycled without changing the design.

Referring to FIGS. 1 and 5, the probe card 10 includes a first reinforcing part 400 and a second reinforcing part 500.

The first reinforcing part 400 may be fixed to the upper surface of the main printed circuit board 100 and the second reinforcing part 500 may be located at the upper part of the first reinforcing part 400.

The first reinforcing part 400 is fixed to the upper surface of the main printed circuit board 100 to prevent the main printed circuit board 100 from being deformed by an external force.

The above-described external force may include not only physical force but also thermal deformation by temperature.

In addition, the probe card 10 includes a plurality of flatness adjusting screws 600 for adjusting the flatness of the probe head 200.

6, the flatness adjusting screw 600 includes a pin head 610 coupled to the second reinforcing part 500, a first reinforcing part 400, and a pin body 600 passing through the main printed circuit board 100. [ (620), and a pin coupling portion (630) coupled to the probe head (200).

The pin head 610 is inserted and fixed in the coupling hole 510 of the second reinforcing part 500 and the pin body 620 is inserted into the second through hole 410 of the first reinforcing part 400, And penetrates through the first through hole 140 of the printed circuit board 100 and the pin coupling portion 630 can be coupled to the coupling hole 222 of the probe head 200. However, the present invention is not limited thereto. The first reinforcing part 400 includes one through-hole drilled in the central part. The pin body 620 penetrates the through hole of the first reinforcing part 400, Through hole 140 of the base 100.

Accordingly, the probe head 200 and the main printed circuit board 100 may be spaced apart from each other by a predetermined distance, and the other end of the coaxial cable 300 may be connected to a second socket portion (Not shown).

Referring to FIG. 6, the diameter D1 of the first through-hole 140 is larger than the diameter d of the pin body 620.

The first reinforcing part 400 includes a plurality of second through holes 410 through which the pin body 620 passes and the diameter D2 of the second through hole 410 of the first reinforcing part 400 May be the same as the diameter D1 of the first through hole 140. [

Illustratively, even if the size of the wafer is changed to replace the probe head 200 and the second reinforcing portion 500 and the position of the fastening hole 222 of the probe head 200 is changed, the flatness adjusting screw 600 can be fastened to the fastening hole 222 without being interfered with by the first through hole 140 and the second through hole 410.

Hereinafter, a method of adjusting the pitch of the probe card 10 according to an embodiment of the present invention will be described with reference to FIG.

First, in step S110, the size of the wafer is checked. For example, the operator can check the size of the wafer, but the present invention is not limited thereto, and the size of the wafer can be measured through the image of the wafer transferred from the photographing unit.

Next, in step S120, the probe head 200 and the second reinforcing part 500 corresponding to the size of the wafer are prepared.

For example, the operator can prepare the probe head 200 and the second reinforcing part 500 corresponding to the wafer. However, the present invention is not limited to this, and the probe head 200 and the second reinforcing part 500, The transfer section may automatically transfer one probe head 200 and the second reinforcing section 500, which are selected according to the size of the wafer, from the case in which the wafer 500 is loaded.

Next, in step S130, the flatness adjusting screw 600 is coupled to the second reinforcing part 500. The flatness adjusting screw 600 passes through the main printed circuit board 100 and the first reinforcing part 400, ).

For example, the flatness adjusting screw 600 may be directly coupled to the operator, but the present invention is not limited thereto. The second reinforcing portion 500 may be provided at the upper portion of the first reinforcing portion 400, The probe head 200 is positioned below the main printed circuit board 100 and the flatness adjusting screw 600 is coupled to the second reinforcing part 500 and the main printed circuit board 100 and the first Penetrate the reinforcing portion 400 and can be coupled to the probe head 200.

It will be understood by those of ordinary skill in the art that the foregoing description of the embodiments is for illustrative purposes and that those skilled in the art can easily modify the invention without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: Probe card
100: main printed circuit board 110: first socket portion
120: through hole 130: connector
140: first through hole
200: probe head 210: probe needle
220: intermediate circuit layer 222: fastening hole
300: Coaxial cable
400: first reinforcing portion 410: second through hole
500: second reinforcing portion 510: engaging hole
600: Flatness adjusting screw 610: Pin head
620: pin body 630:

Claims (9)

In the probe card,
A probe head having a plurality of probe needles contacting a wafer;
A main printed circuit board receiving an external test signal, outputting an electric signal, and electrically connected to the probe head;
A plurality of coaxial cables connecting the probe head and the main printed circuit board;
A first reinforcing part fixed to an upper surface of the main printed circuit board;
A second reinforcing portion coupled to an upper portion of the first reinforcing portion; And
And a flatness adjusting screw for adjusting the flatness of the probe head,
The flatness adjusting screw
A pin head coupled to the second reinforcing portion;
A pin body passing through the first reinforcing portion and the main printed circuit board; And
And a pin coupling portion coupled to the probe head,
Wherein the main printed circuit board includes a first through hole through which the pin body of the flatness adjusting screw passes,
When the second reinforcing portion and the probe head are replaced according to the size of the wafer,
The diameter of the first through hole is larger than the diameter of the pin body so that even if the position of the fastening hole of the probe head is changed, the flatness adjusting screw is fastened to the fastening hole without interference with the first through hole Features a probe card.
delete The method according to claim 1,
The main printed circuit board
A through-hole formed in a central portion and through which the coaxial cable passes;
A plurality of first socket portions positioned at the periphery of the through-hole;
A plurality of first through holes located in the periphery of the first socket portion; And
And a connector located at a periphery of the first through hole and connected to an external inspection apparatus.
The method according to claim 1,
The probe head
A probe substrate having a plurality of probe needles; And
And an intermediate circuit layer electrically connected to the probe substrate.
The method according to claim 1,
The first reinforcing portion
And a plurality of second through holes through which the pin body passes,
And the diameter of the second through hole is the same as the diameter of the first through hole.
The method according to claim 1,
The coaxial cable
Wherein the probe card is detachably connected to the probe head and the main printed circuit board in a socket manner.
The method according to claim 1,
Wherein the main printed circuit board includes a plurality of first socket portions to which one end of the coaxial cable is connected,
Wherein the probe head includes a plurality of second sockets connected to the other end of the coaxial cable on an upper surface thereof.
The method according to claim 1,
A through hole is formed in a central portion of the main printed circuit board,
Wherein the coaxial cable passes through the through hole and is coupled to the probe head and the main printed circuit board, respectively.
A method of adjusting a pitch of a probe card,
Confirming the size of the wafer;
Preparing a probe head and a second reinforcement corresponding to the size of the wafer; And
Coupling a flatness adjusting screw to the second reinforcing portion and penetrating the main printed circuit board and the first reinforcing portion to connect to the probe head,
The first through hole formed in the main printed circuit board is formed to be larger than the diameter of the pin body so that even if the position of the fastening hole of the probe head is changed, Is fastened to the fastening hole without interference with the first through hole.
KR1020150161968A 2015-11-18 2015-11-18 Probe card KR101766265B1 (en)

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KR101766265B1 true KR101766265B1 (en) 2017-08-09

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
US11137442B2 (en) 2019-02-11 2021-10-05 Samsung Electronics Co., Ltd. Stiffener and probe card including the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101951254B1 (en) * 2017-06-19 2019-02-22 리노공업주식회사 A probe card
CN109900931B (en) * 2017-12-08 2021-03-30 京元电子股份有限公司 Semiconductor assembly test connection interface
KR102037657B1 (en) * 2018-09-05 2019-10-29 주식회사 아이에스시 Probe card for electrical test and probe head for probe card
KR102454947B1 (en) * 2020-11-05 2022-10-17 주식회사 에스디에이 Probe card
KR102456905B1 (en) * 2022-05-31 2022-10-20 주식회사 프로이천 Probe card with adjustable flatness
KR102520860B1 (en) * 2022-11-08 2023-04-12 주식회사 유니밴스 Thermal Deformation Improvement Stiffner Probe Card

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