KR101754991B1 - Probe card - Google Patents

Probe card Download PDF

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Publication number
KR101754991B1
KR101754991B1 KR1020150138650A KR20150138650A KR101754991B1 KR 101754991 B1 KR101754991 B1 KR 101754991B1 KR 1020150138650 A KR1020150138650 A KR 1020150138650A KR 20150138650 A KR20150138650 A KR 20150138650A KR 101754991 B1 KR101754991 B1 KR 101754991B1
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KR
South Korea
Prior art keywords
circuit board
circuit layer
printed circuit
intermediate circuit
probe
Prior art date
Application number
KR1020150138650A
Other languages
Korean (ko)
Other versions
KR20170020185A (en
Inventor
김현구
김은영
장강호
박영근
황규호
Original Assignee
(주)엠투엔
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Publication date
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Publication of KR20170020185A publication Critical patent/KR20170020185A/en
Application granted granted Critical
Publication of KR101754991B1 publication Critical patent/KR101754991B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The present invention proposes a probe card. According to an aspect of the present invention, there is provided a probe card including: a probe substrate having a plurality of probe needles; An intermediate circuit layer electrically connected to the probe substrate; A main printed circuit board that receives an external test signal, outputs an electrical signal, and is electrically connected to the intermediate circuit layer; And a plurality of coaxial cables each of which is electrically connected to the intermediate circuit layer and the main circuit board, wherein the coaxial cable is connected to the intermediate circuit layer and the main printed circuit board in a socket manner so as to be removable.

Description

Probe card {PROBE CARD}

The present invention relates to a probe card.

Generally, a probe card electrically connects a wafer and a semiconductor device inspection equipment to test performance during or after fabrication of a semiconductor device such as a semiconductor memory or a display, and transmits an electrical signal of the semiconductor device inspection equipment to a chip And transmits the signal returned from the chip to the semiconductor device testing equipment.

A typical probe card consists of a main circuit board (PCB), a space transformer (STF), and a tip fixedly attached to the space deflector. At this time, the space transformer is composed of a multilayer ceramic substrate (MLC: Multi Layer Ceramic).

In this connection, in Korean Provisional Patent No. 1181520 (name: probe card and manufacturing method), a probe card for testing a semiconductor die in contact with a pad formed on a plurality of semiconductor dies on a wafer, comprising: a main circuit board; A block plate attached to the main circuit board and having a number of grooves equal to the number of the plurality of semiconductor dies; A plurality of sub-probe units detachably coupled to the grooves and corresponding to the plurality of semiconductor dies; And an interposer electrically connecting the sub-probe unit to the main circuit board, wherein one of the plurality of sub-probe units is in contact with a pad formed on one of the plurality of semiconductor dies for testing one of the plurality of semiconductor dies A plurality of probe tips; A probe substrate on which a plurality of probe tips are mounted; To convert the pitch, a spatial transformer is disclosed that is bonded to the probe substrate and connected to the interposer.

Conventional probe cards are designed and manufactured differently for each wafer memory chip because the chip array is not always the same as the original size and pad arrangement of each product of the memory chip of the wafer, and the position of the probe tip to be in contact with the pad is also different.

In addition, the main PCB, which is a component for electrically connecting the probe tip to the test equipment, and the probe head in which the conductor is wired are different in design each time considering the position of the probe tip, and the connected test equipment channel information also changes there was.

For this reason, the conventional probe card has difficulty in recycling the probe head or the main PCB.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a probe card which can be utilized without changing the main printed circuit board even if the size of the memory chip is changed.

According to an aspect of the present invention, there is provided a probe card comprising: a probe substrate having a plurality of probe needles; An intermediate circuit layer electrically connected to the probe substrate; A main printed circuit board that receives an external test signal, outputs an electrical signal, and is electrically connected to the intermediate circuit layer; And a plurality of coaxial cables each of which is electrically connected to the intermediate circuit layer and the main circuit board, wherein the coaxial cable is connected to the intermediate circuit layer and the main printed circuit board in a socket manner so as to be removable.

According to the above-mentioned problem solving means of the present invention, by connecting the intermediate circuit layer and the main printed circuit board by using the coaxial cable, the position where the coaxial cable is connected to the intermediate circuit layer is changed even if the size of the memory chip is changed, The effect of recycling without changing the substrate can be greatly improved.

1 is an exploded perspective view of a probe card according to an embodiment of the present invention.
2 is a perspective view of a main printed circuit board according to an embodiment of the present invention.
3 is a plan view of a main printed circuit board according to an embodiment of the present invention.
4 is a perspective view of an intermediate circuit layer according to one embodiment of the present invention.
5 is a perspective view of a probe substrate according to an embodiment of the present invention.
6 is a perspective view of a coaxial cable according to an embodiment of the present invention.
7 is a partial cross-sectional view of a probe card according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.

Throughout this specification, when a part is referred to as being "connected" to another part, it is not limited to a case where it is "directly connected" but also includes the case where it is "electrically connected" do.

Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms "about "," substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) "or" step "used to the extent that it is used throughout the specification does not mean" step for.

The present invention relates to a probe card 10, and may be an apparatus for contacting a wafer to inspect the wafer.

2 is a perspective view of a main printed circuit board according to an embodiment of the present invention, and FIG. 3 is a perspective view of a main printed circuit board according to an embodiment of the present invention. FIG. 5 is a perspective view of a probe substrate according to an embodiment of the present invention. FIG. 6 is a cross-sectional view of an embodiment of the present invention FIG. 7 is a partial cross-sectional view of a probe card according to an embodiment of the present invention. FIG.

First, a probe card 10 (hereinafter referred to as "probe card 10") according to an embodiment of the present invention will be described with reference to FIG.

The probe card 10 may be a device that makes one-to-one contact with a plurality of pads on the wafer and transmits the electric signal transmitted from the semiconductor testing device to a pad on the wafer.

The probe card 10 includes a probe substrate 300, an intermediate circuit layer 200, a main printed circuit board 100, and a coaxial cable 400.

The probe substrate 300 is mounted with a plurality of probe needles 310 electrically connected to the intermediate circuit layer 200 and the probes 310 contact the plurality of pads on the wafer one to one to perform wafer inspection.

In detail, the probe needle 310 receives an electric signal of an external inspection apparatus (not shown) from the intermediate circuit layer 200 and transmits it to the wafer, receives a signal coming back from the wafer, ). In addition, the probe needle 310 directly contacts the pad on the wafer to inspect the wafer. For reference, the probe needle 310 may be composed of an elastic body to prevent breakage of the wafer upon contact with the pad on the wafer.

The intermediate circuit layer 200 is electrically connected to the probe substrate 300 and the main printed circuit board 100.

In detail, the intermediate circuit layer 200 receives an electric signal of the external inspection apparatus from the main printed circuit board 100 and transmits it to the probe needle 310. The intermediate circuit layer 200 receives an electric signal coming back from the wafer through the probe needle 310 and transfers it to the main printed circuit board 100. In addition, a plurality of coupling grooves 220 for coupling the level bolts 700 are formed in the intermediate circuit layer 200. For reference, the intermediate circuit layer 200 according to an embodiment of the present invention may be configured by a micro electro mechanical system (MEMS) method.

The main printed circuit board 100 receives an external test signal, outputs an electrical signal, and is electrically connected to the intermediate circuit layer 200.

In detail, the main printed circuit board 100 receives the electric signal of the external inspection apparatus and transmits it to the intermediate circuit layer 200. The main printed circuit board 100 receives the electric signal coming back from the wafer through the intermediate circuit layer 200 and transmits it to the external inspection apparatus.

At this time, the intermediate circuit layer 200 and the main circuit board transmit or receive electric signals through the coaxial cable 400, respectively. To this end, both ends of the coaxial cable 400 are electrically connected to the intermediate circuit layer 200 and the main printed circuit board 100, respectively. In addition, the coaxial cable 400 is connected to the intermediate circuit layer 200 and the main printed circuit board 100 in a socket manner so as to be attachable and detachable. A detailed description thereof will be given later.

Hereinafter, the main printed circuit board 100 and the intermediate circuit layer 200 according to an embodiment of the present invention will be described with reference to FIGS. 2 to 4. FIG.

The main printed circuit board 100 may include a plurality of first socket portions 110 to which one end of the coaxial cable 400 is connected.

The intermediate circuit layer 200 may include a plurality of second sockets 210 to which the other end of the coaxial cable 400 is connected.

The main printed circuit board 100 may have a through hole 120 formed at a central portion of the main printed circuit board 100. The coaxial cable 400 passes through the through hole 120, And the second sockets 210 of the intermediate circuit layer 200, respectively. Accordingly, the length of the coaxial cable 400 can be shortened, noise generation can be minimized, and signal transmission characteristics can be improved.

In addition, the intermediate circuit layer 200 and the main printed circuit board 100 may be connected using a coaxial cable 400 to have spatial autonomy.

The main printed circuit board 100 may further include a plurality of connectors 130 to which an external inspection apparatus is connected. The main printed circuit board 100 may receive an electric signal of the external inspection apparatus through the connector 130, It can be transmitted to the inspection apparatus.

2, a through-hole 120 is formed at a central portion of the main printed circuit board 100, a first socket portion 110 is located at a periphery of the through-hole 120, The connector 130 may be positioned at the periphery of the first socket portion 110. [ In other words, a through hole 120 is formed in a central portion of the main printed circuit board 100, a connector 130 is disposed on an upper surface of the outermost portion, a first socket 130 is provided between the through hole 120 and the connector 130, The portion 110 can be located. Accordingly, the external inspection apparatus can be connected to the connector 130 without interfering with other components. The first socket unit 110 is located at the periphery of the through-hole 120, and the coaxial cable 400 is connected to the first So that it can be easily connected to the socket unit 110.

The peripheral portion may be a portion located in the circumferential direction with respect to the central portion of the main printed circuit board 100.

As shown in FIG. 3, the intermediate circuit layer 200 may be formed of a single circuit board. However, the intermediate circuit layer 200 may be formed using a plurality of circuit boards, The number of circuit boards can be increased or decreased corresponding to the area of the circuit board.

In addition, the probe substrate 300 may be manufactured to have the same size corresponding to the area of the intermediate circuit layer 200. In other words, the probe substrate 300 can be constructed using a plurality of substrates in the same manner as the above-described intermediate circuit layer 200, and the number of the probe substrates 300 corresponding to the area of the intermediate circuit layer 200 Increase or decrease.

The intermediate circuit layer 200 may be one selected from PCB (Printed Circuit Board), MLO (Multilayer Organic), MLC (Multilayer Ceramic), and ML (Multilayer).

A probe substrate 300 according to an embodiment of the present invention will be described with reference to FIG.

The probe substrate 300 may include a plurality of probe needles 310, a flexible printed circuit board (not shown), and a guide socket 320.

The probe needle 310 is connected to the intermediate circuit layer 200 through a flexible printed circuit board (not shown), and the connection method may be a socket method or a shoulder method. In addition, the flexible printed circuit board can match the characteristics of the electrical signals between the probe needles 310 and the intermediate circuit layer 200.

Illustratively, the intermediate circuit layer 200 and the flexible printed circuit board may be connected to the intermediate circuit layer 200 by a solder operation by forming a guide socket 320.

The probe needle 310 may be connected to both sides of the flexible printed circuit board by a predetermined force in the guide socket 320 so that the flexible printed circuit board is not separated from the needle. In other words, the probe needle 310 includes a fixing portion formed in a U-shape at the upper portion, and the lower portion of the flexible printed circuit board can be inserted and fixed to the fixing portion.

In addition, the instability of the contact due to the thermal deformation due to the difference in thermal expansion coefficient between the intermediate circuit layer 200 and the probe needle 310 can be solved by the range of thermal deformation of the flexible printed circuit board.

A coaxial cable 400 according to an embodiment of the present invention will be described with reference to FIG.

The coaxial cable 400 includes a first connecting board 420, a second connecting board 430, and a plurality of cables 410.

The first connecting board 420 is located at one end of the coaxial cable 400 and may be connected to the first socket unit 110 of the main printed circuit board 100.

The second connecting board 430 may be located at the other end of the coaxial cable 400 and may be connected to the second socket 210 of the intermediate circuit layer 200.

The first and second connecting boards 420 and 430 may be mounted with components for electrical characteristics such as relays.

The first and second connecting boards 420 and 430 may be electrically connected to each other through a plurality of cables 410.

The coaxial cable 400 has a low dielectric constant and is excellent in electrical signal transmission so as to minimize noise generated when electric signals are transmitted between the main printed circuit board 100 and the intermediate circuit layer 200, have.

The first and second connecting boards 420 and 430 located at both ends of the coaxial cable 400 are connected to the main printed circuit board 100 and the intermediate circuit layer 200 in a socket manner, The substrate 100 can be recycled.

The first connecting board 420 and the second connecting board 430 are located at both ends of the coaxial cable 400 and the first connecting board 420 is connected to the first socket 500 of the main printed circuit board 100, And the second connecting board 430 may be connected to the second socket portion 210 of the intermediate circuit board. At this time, when the size of the wafer to be measured is changed and the contact position and channel information are changed, the second socket part 210 of the intermediate circuit layer 200 to which the second connecting board 430 of the coaxial cable 400 is connected So that it can be recycled without changing the design of the main printed circuit board 100. To this end, the intermediate circuit layer 200 and the probe substrate 300 can be fabricated in large areas for use in wafers having various sizes and channels.

Referring to FIGS. 1 and 7, the probe card 10 may further include a first reinforcing part 500 and a second reinforcing part 600.

The first reinforcing part 500 may be fixed to the upper surface of the main printed circuit board 100 and the second reinforcing part 600 may be located at the upper part of the first reinforcing part 500.

The first reinforcing part 500 is fixed to the upper surface of the main printed circuit board 100 to prevent the main printed circuit board from being deformed by an external force.

The above-described external force may include not only physical force but also thermal deformation by temperature.

The probe card 10 is fixed to the second reinforcing part 600 and has a through hole 140 formed in the second reinforcing part 600, the first reinforcing part 500, and the main printed circuit board 100, And a plurality of level bolts 700 that are coupled to the coupling holes 220 of the intermediate circuit layer 200 through the through holes 510, 610.

7, the main printed circuit board 100, the first reinforcing portion 500, and the second reinforcing portion 600 have through holes 140, 510, 610 for inserting the level bolts 700 ) Can be drilled. The level bolts 700 are connected to the coupling holes 220 formed in the intermediate circuit layer 200 through the through holes 140 and 510 and 610 so that the intermediate circuit layer 200 and the main printed circuit board 200, (100) may be supported at a predetermined distance.

As the intermediate circuit layer 200 and the main printed circuit board 100 are spaced apart from each other by a predetermined distance, the other end of the coaxial cable 400 is connected to the second socket portion 210 located on the upper surface of the intermediate circuit layer 200 ).

It will be understood by those of ordinary skill in the art that the foregoing description of the embodiments is for illustrative purposes and that those skilled in the art can easily modify the invention without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: Probe card
100: main printed circuit board 110: first socket portion
120: through hole 130: connector
140: Through hole
200: intermediate circuit layer 210: second socket portion
220: Coupling hole
300: probe substrate 310: probe needle
320: Guide Socket
400: Coaxial cable 410: Cable
420: first connecting board 430: second connecting board
500: first reinforcing member 510: through hole
600: second reinforcing member 610: through hole
700: level bolt

Claims (9)

In the probe card,
A probe substrate on which a plurality of probe needles are mounted;
An intermediate circuit layer electrically connected to the probe substrate;
A main printed circuit board which receives an external test signal, outputs an electric signal, and is electrically connected to the intermediate circuit layer; And
And a plurality of coaxial cables having opposite ends electrically connected to the intermediate circuit layer and the main printed circuit board, respectively,
The main printed circuit board
A through hole formed in the central portion;
A plurality of first sockets positioned at the periphery of the upper surface and the through holes and connected to one end of the coaxial cable; And
And a connector located at a periphery of the first socket portion and connected to an external inspection apparatus,
Wherein the intermediate circuit layer includes a plurality of second socket portions connected to the other end of the coaxial cable on an upper surface thereof,
The coaxial cable passes through the through-hole and is connected to the first socket portion and the second socket portion by a socket method so as to be detachable,
Wherein the intermediate circuit layer and the probe substrate are fabricated in a large area for use in wafers having various sizes and channels.
delete delete delete The method according to claim 1,
The coaxial cable
A first connecting board located at one end and connected to a first socket of the main printed circuit board;
A second connecting board located at the other end and connected to a second socket of the intermediate circuit layer; And
And at least one cable electrically connecting the first connecting board and the second connecting board.
The method according to claim 1,
The probe substrate
A plurality of probe needles;
A plurality of flexible printed circuit boards electrically connecting the probe needles and the intermediate circuit layer; And
And a plurality of guide sockets into which the respective probe needles and the flexible printed circuit board are inserted.
The method according to claim 1,
A first reinforcing part fixed to an upper surface of the main printed circuit board; And
And a second reinforcing portion located on an upper portion of the first reinforcing portion.
8. The method of claim 7,
And a plurality of level bolts fixed to the second reinforcing portion and penetrating through the through holes formed in the second reinforcing portion, the first reinforcing portion, and the main circuit board to be coupled to the intermediate circuit layer.
delete
KR1020150138650A 2015-08-13 2015-10-01 Probe card KR101754991B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150114729 2015-08-13
KR20150114729 2015-08-13

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KR20170020185A KR20170020185A (en) 2017-02-22
KR101754991B1 true KR101754991B1 (en) 2017-07-06

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108107243B (en) * 2017-12-26 2020-10-13 深圳市道格特科技有限公司 Quick-dismounting probe card

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200322664Y1 (en) 2003-05-06 2003-08-14 오병석 Lamp on/off test device for a distributing board
JP2011009481A (en) * 2009-06-26 2011-01-13 Yamaichi Electronics Co Ltd Probe card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200322664Y1 (en) 2003-05-06 2003-08-14 오병석 Lamp on/off test device for a distributing board
JP2011009481A (en) * 2009-06-26 2011-01-13 Yamaichi Electronics Co Ltd Probe card

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