JP2011009481A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card that flexibly changes wiring according to customer needs.SOLUTION: A disk-shaped wiring substrate 11 having an opening in its central region is mounted and held on a substrate holding member 12 having a projection 12a, and a probe head 13 is firmly held by the opening. Tester lands 14 on the upper surface of the wiring substrate 11, tester land connection lands 15 electrically connecting thereto, that are on the lower surface of the wiring substrate 11, connectors 16 on the upper surface of the wiring substrate 11, and probe connection lands 17 electrically connecting thereto, that are on the lower surface of the wiring substrate 11 are built. Further, a jumper wire 18 for connecting the tester land connection lands 15 and the probe connection lands 17 are arranged at the gap 12c between the wiring substrate 11 and the substrate holding member 12. Two or more probes 20 of a probe fixing part 19 of the probe head 13 electrically connect to the connectors 16 through FPC21.

Description

  The present invention relates to a probe card that is used in an electrical test of an object to be inspected such as a semiconductor device and electrically connects a terminal of the object to be inspected and a terminal of a tester.

  An electrical test (inspection) is performed when a large number of semiconductor devices such as semiconductor integrated circuits (ICs) are formed on a wafer as IC chips. Then, the defective IC chip is removed before the assembly process. In recent years, an inspection at the stage of assembling an IC module has been performed. For example, as a wafer level CSP (Chip Size Package), an IC module in which a wiring layer is further formed on a wafer on which an IC chip is formed, and solder balls, solder bumps, and the like are formed on the wiring layer is in a wafer state. Inspection is performed. Further, for example, an inspection regarding malfunction or electrical characteristics of an IC module mounted in a package such as a TCP (Tape Carrier Package) is performed.

  In the above-described inspection, a probe card in which a plurality of contacts (probes) pressed against the terminals of an IC to be inspected are attached to the lower surface of, for example, a disk-shaped wiring board is effectively used. In this probe card, a plurality of tester lands (pogo seats) that receive electrical signals for inspection from terminals (for example, pogo pins) of a tester of an electrical inspection device are provided on the upper surface of the wiring board. The pogo seats and the probes are electrically connected to each other by the wiring pattern formed on the wiring board. Here, the wiring board has a multilayer wiring structure.

  Usually, the electrical signal transmitted from the tester terminal is fixed. A wiring board having a unique multilayer wiring structure corresponding to the object to be inspected and the type of inspection is attached to the probe card. In such a probe card, when the terminal arrangement is changed or the electric signal assigned to the terminal is changed depending on the specification of the object to be inspected, it is necessary to newly produce a wiring board having a different multilayer wiring structure in accordance with the change. become. For this reason, it is difficult for the probe card to quickly respond to the customer needs and reduce the cost.

  Therefore, a probe card has been presented that uses a conductive wire (jumper wire) coated with an insulator independent from the wiring board, and can easily connect the jumper wire in accordance with the specification change of the object to be inspected (for example, , See Patent Document 1). According to such a probe card, it is possible to easily cope with the above-mentioned specification change by changing the jumper wire connection, and the same wiring board can be used. Becomes easier.

  In addition, when the operation of an object to be inspected is accelerated, for example, in a semiconductor device that operates with a high-frequency signal, it is difficult to accurately inspect electric characteristics with a probe card having a wiring board having a conventional multilayer wiring structure. Therefore, also in this case, a probe card having a structure using a jumper wire independent from the wiring board is often used. Here, as the jumper line, a coaxial cable or a multi-core line composed of a signal line-ground line pair is disposed (for example, see Patent Document 2).

JP 2004-125548 A JP 2008-32533 A

  The probe card using the jumper wire of the prior art has a structure in which a required number of jumper wires are arranged on the upper surface side of the wiring board. And the pogo seat corresponding to each other of the probe card and the probe are electrically connected via this jumper wire. However, in such a probe card using jumper wires, as the number of terminals of the object to be inspected increases and the number of pins of the probe advances, a large number of jumper wires are arranged on the upper surface side of the wiring board. Will be installed. Then, on the upper surface of the wiring board, there arises a problem that it becomes impossible to surface-mount required electronic components composed of active elements such as ICs or passive elements such as resistors and capacitors.

  Further, when the number of tester terminals from the electrical inspection apparatus increases with the increase in the number of pins, the total contact pressure of the tester terminals to the pogo seat of the wiring board increases. For example, the total contact pressure by 2000 to 4000 tester terminals is 20 kg or more. In order to obtain a strength that can withstand such a contact load, the thickness of the wiring board needs to increase with the increase in the number of pins of the probe and tester terminal described above. However, the increase in the thickness of the wiring board increases the parasitic capacitance of the wiring by deepening the via hole for connecting the wiring layers or the through hole formed penetrating from the upper surface to the lower surface of the substrate. In addition, accurate inspection is hindered in a test object such as a semiconductor device that operates at high speed.

  Further, since the jumper wire is arranged and exposed on the upper surface side of the wiring board of the probe card, it can be exposed from a tester arranged above the probe card in the electrical inspection apparatus or an object to be inspected generated at the time of inspection. Easy to receive electromagnetic noise. In addition, due to these disturbances, accurate inspection may be hindered in an object to be inspected such as a semiconductor device that operates at high speed.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a probe card that can freely change wiring corresponding to customer needs. An object of the probe card is to facilitate the increase in the number of pins of the probe and to accurately inspect the object to be inspected.

  In order to achieve the above object, a probe card according to the present invention includes a plurality of probes that are in contact with a terminal of an object to be inspected, a probe head to which the probe is attached, and a terminal of a tester that generates an electrical signal for inspection. A plate-like wiring board provided with a plurality of tester terminal connection portions in contact with the first main surface and a plurality of probe terminal connection portions with which the probe terminals are electrically connected to the second main surface or the first main surface; A substrate holding member that holds the wiring board from the second main surface side and forms a predetermined gap between the wiring board, the plurality of tester terminal connection portions, and the plurality of tester terminal connection portions arranged in the gap. And a plurality of conductive wires coated with an insulator for electrically connecting the probe terminal connecting portions.

  According to the configuration of the present invention, it is possible to provide a probe card that can meet customer needs and can be manufactured quickly and at low cost. Further, in this probe card, it is easy to increase the number of pins of the probe, and an accurate inspection thereof is possible.

It is typical sectional drawing which shows the probe card concerning the 1st Embodiment of this invention. It is a top view which shows an example of the wiring board which comprises the probe card concerning the 1st Embodiment of this invention. It is a bottom view which shows an example of the wiring board which comprises the probe card concerning the 1st Embodiment of this invention. It is a top view which shows an example of the board | substrate holding member which comprises the probe card concerning the 1st Embodiment of this invention. It is a typical partial sectional view showing the modification of the probe card concerning a 1st embodiment of the present invention. It is typical sectional drawing which shows the probe card concerning the 2nd Embodiment of this invention. It is a top view which shows an example of the wiring board which comprises the probe card concerning the 2nd Embodiment of this invention. It is a bottom view which shows an example of the wiring board which comprises the probe card concerning the 2nd Embodiment of this invention. It is a typical partial sectional view showing the modification of the probe card concerning a 2nd embodiment of the present invention.

  Several preferred embodiments of the present invention will be described below with reference to the drawings. Here, parts that are the same or similar to each other are denoted by common reference numerals, and a duplicate description is partially omitted. However, the drawings are schematic and ratios of dimensions and the like are different from actual ones.

(First embodiment)
A probe card according to a first embodiment of the present invention will be described with reference to FIG. 1, FIG. 2, FIG. 3, and FIG. Here, FIG. 1 is a schematic cross-sectional view showing the probe card according to the present embodiment. 2 and 3 are a top view and a bottom view, respectively, showing an example of a wiring board constituting the probe card. FIG. 4 is a plan view showing an example of a substrate holding member constituting the probe card.

  As shown in FIG. 1, a probe card 10 includes a disk-shaped wiring board 11 formed of a plate-like board such as a printed circuit board (PCB) and a central region cut out, and a metal board holding member. 12. The probe head 13 is held in the central region of the substrate holding member 12. Further, the substrate holding member 12 is provided with a protruding portion 12a at, for example, the peripheral edge or a predetermined location, and the wiring substrate 11 is mounted on the substrate holding member 12 and supported from below by these protruding portions 12a. .

  In the wiring board 11, a pogo seat 14 as a required number of tester terminal connecting portions is formed on the outer peripheral portion of the upper surface (first main surface), and the pogo seat connection land electrically connected to each of these pogo seats 14. 15 is attached to the lower surface (second main surface) of the wiring board 11 so as to face each of the pogo seats 14, for example. Further, the required number of connectors 16 are provided on the inner peripheral portion of the upper surface of the wiring board 11, and the probe connection lands 17 of the probe terminal connection portions electrically connected to the connectors 16 are disposed on the lower surface thereof so as to face the respective connectors 16. Is shaped.

  A required number of jumper wires for connecting the pogo seat connection lands 15 and the probe connection lands 17 in the gaps 12 c formed between the lower surface of the wiring board 11 and the one main surface 12 b of the substrate holding member 12. 18 is arranged. Here, the size of the space of the gap 12c in which the jumper wire 18 is disposed is set by the height of the protruding portion 12a from the one main surface 12b of the substrate holding member 12 in consideration of the number of the jumper wires 18. . The jumper wire 18 may be a single core wire including only a signal wire, a coaxial cable, a multi-core wire including a signal wire-ground wire pair, a flexible printed circuit (FPC), a flexible flat cable (FFC). It consists of a flexible cable.

  As shown in FIG. 1, the plurality of probes 20 attached to the probe fixing portion 19 in the probe head 13 are electrically connected to the connector 16 through, for example, an FPC 21 at a probe terminal at the base end thereof. The tip of the probe 20 is in elastic contact with the terminal of the object to be inspected. In the probe head 13, these probes 20 are formed by fine metal processing using a photolithography technique, and are attached to the probe fixing portion 19 at a predetermined inclination angle. The FPC 21 is connected to a connection land of a predetermined wiring pattern, for example, via an anisotropic conductive film (ACF) at the upper end of the connector 16 constituting the probe terminal connection portion. Then, the connection land is taken out as a probe connection land 17 on the lower surface of the wiring board 11.

  As described above, the probe card 10 according to the present embodiment can freely connect the wiring board 11 via the jumper wire 18 arranged in the gap 12c between the lower surface of the wiring board 11 and the one main surface 12b of the board holding member 12. The pogo seat 14 and the probe 20 can be electrically connected. Here, the jumper wire 18 is connected to the pogo seat connection land 15 or the probe connection land 17 described above using solder joints, connection pins, ACFs, or the like. When the jumper wire 18 is made of a flexible cable, the height of the flexible cable can be lowered by connecting with the ACF, so that the number of flexible cables that can be arranged in the gap 12c can be increased. Become. When using connection pins, the connection pins are inserted into through holes provided in the wiring board 11 and connected to the pogo seat 14 or the connector 16. In this case, the pogo seat connection land 15 or the probe connection land 17 may be omitted.

  In the electrical test of the object to be inspected using the probe card 10, the pogo pin that is a tester terminal of the electrical inspection apparatus is pressed against the pogo seat 14 on the upper surface of the wiring board 11. Then, an electrical signal from the tester is transmitted from the pogo seat 14 through the jumper wire 18, the connector 16, and the FPC 21 to the probe 20 that is in elastic contact with the terminal of the object to be inspected.

  Next, the wiring board 11 and the board holding member 12 will be described with reference to FIGS. As shown in FIGS. 2 and 3, the wiring board 11 is a single disc-shaped printed board, and has a structure in which a first opening 22 is provided in the central region. A required number of pogo seats 14 are provided on the outer periphery of the upper surface of the wiring board 11. FIG. 2 shows an example in which the pogo seats 14 are arranged along five concentric circles. A required number (20 in FIG. 2) of connectors 16 are arranged and attached to the inner peripheral portion of the upper surface of the wiring board 11.

  Further, for example, a passive element 23 such as a resistor and a capacitor and an active element 24 such as an IC are appropriately surface mounted between the pogo seat 14 and the connector 16. Here, the passive element 23 such as a bypass capacitor is inserted between a power supply wiring provided on the wiring substrate 11 and a ground wiring (not shown) to remove power supply noise. Further, the active element 24 is appropriately attached when, for example, a new electric signal specific to the object to be inspected is newly generated. Alternatively, an IC such as a response waveform correction circuit is attached.

  The required number of first through holes 25 are formed at a plurality of predetermined locations on the outer peripheral portion of the wiring board 11. Similarly, second through holes 26 are formed at predetermined locations (four locations in FIG. 2) in the inner peripheral portion of the wiring board 11. The wiring board 11 is mounted and held on the board holding member 12 as will be described later by screws or bolts inserted through the first through hole 25 and the second through hole 26.

  On the other hand, pogo seat connection lands 15 are formed on the lower surface of the wiring board 11 corresponding to the pogo seats 14 arranged on the upper surface. The pogo seat connection lands 15 are electrically connected to the corresponding pogo seats 14 through through holes (not shown) penetrating the wiring board 11. A probe connection land 17 drawn from the connector 16 is formed on the inner periphery of the wiring board 11.

  Although not shown in FIG. 3, the required jumper wire 18 described in FIG. 1 on the lower surface side of the wiring board 11 has one end connected to the pogo seat connection land 15 and the other end connected to the probe connection. It is arranged so as to be connected to the land 17. The jumper wire 18 can be appropriately attached according to customer needs.

  A grounding first ground layer 27, which is a conductive layer, is formed where the first through hole 25 is formed. These first ground layers 27 are arranged along the periphery of the wiring board 11 and are connected to each other. Similarly, a second ground layer 28 is formed where the second through hole 26 is formed.

  In the wiring board 11 described above, for example, a pad-shaped pogo seat 14 made of a metal foil such as copper is formed on the upper surface of a resin laminate, and a pogo seat connection land 15 made of the same metal foil is formed on the lower surface. , And the probe connection land 17 are formed. Then, for example, a power supply wiring and a ground wiring are formed in the inner layer of the wiring board 11. Alternatively, a ground wiring or a ground layer is formed in the two inner layers. Thus, the wiring board 11 has the wiring layer in which the pogo seat 14 is formed as described above, the wiring layer in the inner layer, the pogo seat connection land 15, and the wiring layer in which the probe connection land 17 is formed 3. A multilayer wiring board having a wiring structure of 5 to 5 layers is obtained. Here, for example, the thickness of the four-layer and five-layer wiring board 11 is about 2 mm.

  In addition, a multilayer wiring structure in which electrical signal wiring is disposed in the inner layer of the wiring board 11 may be employed. Further, the power supply wiring or the ground wiring may be disposed on the upper surface or the lower surface of the wiring substrate 11 to form a two-layer wiring structure.

  On the other hand, as shown in FIG. 4, the substrate holding member 12 is made of a metal plate such as an aluminum plate having a thickness of about 1 mm, and has a planar shape that matches the wiring substrate 11. The opening 29 is provided. A peripheral protrusion 122 that protrudes from the one main surface 121 to a predetermined height is provided along the peripheral edge of the substrate holding member 12. Furthermore, the outer periphery protrusion part 123 is formed in the predetermined | prescribed location (4 places in FIG. 4) of the outer peripheral part of the board | substrate holding member 11, and the inner periphery protrusion part 124 is formed in the predetermined location of the inner peripheral part. These outer peripheral protrusions 123 and inner peripheral protrusions 124 are formed so as to protrude from one main surface 121 such that their upper end faces are at the same height as that of the peripheral protrusions 122. Here, these protrusions are preferably formed integrally with the substrate holding member 12, but may be formed on one main surface 121 of a conductor different from the substrate holding member 12.

  A plurality of first screw holes 30 are provided in the outer peripheral protruding portion 123, and a second screw hole 31 is provided in the inner peripheral protruding portion 124. Then, the wiring substrate 11 is fastened to the substrate holding member 12 by screws or bolts that are inserted through the first through holes 25 and screwed into the first screw holes 30 provided in the outer peripheral protruding portion 123. Similarly, it is fastened to the substrate holding member 12 by screws or bolts that are inserted through the second through holes 26 and screwed into the second screw holes 31 provided in the inner peripheral protruding portion 124. In this way, the wiring board 11 is mounted and held in contact with the outer peripheral protrusion 123, the inner peripheral protrusion 124, or the peripheral protrusion 122 of the substrate holding member 12.

  The peripheral protrusion 122, the outer peripheral protrusion 123, and the inner peripheral protrusion 124 described with reference to FIG. 4 correspond to the protrusion 12a described with reference to FIG. And the height from the 1st main surface 121 of the peripheral protrusion part 122, the outer periphery protrusion part 123, and the inner periphery protrusion part 124 is set suitably so that the space | gap 12c required for arrangement | positioning of the jumper wire 18 may be formed. .

  Further, the substrate holding member 12 has a structure in which the probe head 13 is fixed to the center region, and the probe 20 protrudes from the second opening 29 to the bottom surface side of the substrate holding member 12. The FPC 21 connected to the probe 20 passes through the gap between the second opening 29 and the probe fixing portion 19 and is electrically connected from the first opening 22 of the wiring board 11 to the connector 16 on the upper surface of the wiring board 11 shown in FIG. Become so.

  In the substrate holding member 12 described above, the peripheral protrusion 122 and the peripheral protrusion 123 are connected to the first ground layer 27 of the wiring substrate 11. Similarly, the inner peripheral protruding portion 124 is connected to the second ground layer 28 of the wiring board 11. In this way, the substrate holding member 12 is fixed at a stable ground potential. For example, this ground potential is supplied from the tester terminal to the first ground layer 27 and the second ground layer 28 through a ground line or ground layer formed on the wiring board 11 via a predetermined pogo seat.

  In addition, the protrusion part 12a provided in the board | substrate holding member 12 is not limited to the peripheral protrusion part 122, the outer periphery protrusion part 123, and the inner periphery protrusion part 124 as shown in FIG. In addition, for example, the peripheral protrusion 122 may not be formed at all or may be partially formed. Alternatively, a structure in which the outer peripheral protruding portion 123 is provided at a location different from four locations at equal intervals in the circumferential direction of the substrate holding member 12 may be used. Moreover, the structure where the inner peripheral protrusion part 124 is not formed at all may be sufficient. In any case, it is only necessary that the protruding portion 12a is formed so as to be able to stably hold the wiring substrate 11 and to secure the gap 12c in which the jumper wire 18 is disposed.

  Next, a modified example of the probe card 10 will be described with reference to FIG. FIG. 5 is a schematic partial sectional view showing a modification of the probe card according to the first embodiment. The probe card 10a of this modification is a case where the probe is an arm type probe or a cantilever type probe, and is shown as a partial sectional structure thereof.

  As shown in FIG. 5, the probe card 10 a includes a wiring board 11 made of, for example, a disk-shaped printed board and a metal board holding member 12. A plurality of probe fixing terminals 32, which are probe terminals, are attached in the central region of the lower surface of the wiring board 11, and a cantilever type probe 20 is implanted in each of them. Further, similarly to the case described with reference to FIG. 1, a protrusion 12a is provided at the periphery or a predetermined position of the substrate holding member 12, and the wiring substrate 11 is mounted on the substrate holding member 12 and supported from below by the protrusion 12a. It is like that. In the wiring board 11, the first opening 22 may not be formed in the central region.

  A required number of pogo seats 14 are formed on the outer periphery of the upper surface of the wiring board 11, and pogo seat connection lands 15 that are electrically connected to the pogo seats 14 are provided on the lower surface of the wiring board 11. A probe connection land 17 is provided on the lower surface of the wiring board 11. In the same manner as in the first embodiment, each Pogo seat connection land 15 and probe connection are formed in the gap 12c formed between the lower surface of the wiring board 11 and the one main surface 12b of the substrate holding member 12. A required number of jumper wires 18 for connecting the lands 17 are provided.

  As shown in FIG. 5, the cantilever type probe 20 is electrically connected to the probe connection land 17 through the inner layer wiring 33 disposed in the inner layer of the wiring board 11. Also in the probe card 10a, the pogo seat 14 of the wiring board 11 and the probe can be freely connected via a jumper wire 18 disposed in the gap 12c between the lower surface of the wiring board 11 and one main surface 12b of the board holding member 12. 20 becomes a structure which can be electrically connected.

  In addition, as a modification of the probe card 10 (not shown), there is a structure in which a plurality of pin type probes 20 in the probe head 13 as illustrated in FIG. Can be mentioned.

  In the probe card according to the first embodiment, the pogo seat 14 is formed on the upper surface of the wiring board 11 so as to contact the tester terminal of the electrical inspection device, and the wiring board 11 is attached to and supported by the metal board holding member 12. It has come to be. Then, a required jumper wire 18 is arranged in the gap 12c formed between the wiring board 11 and the board holding member 12. With such a jumper wire 18, the pogo seat 14 of the wiring board 11 and the probe 20 can be electrically connected freely. However, in the connection using the jumper wire 18, the wiring board 11 is detached from the board holding member 12.

  And if it is such a probe card, even if the change of the arrangement of the terminal etc. arises according to the specification of the object to be inspected, it is not necessary to change the wiring board 11, and the probe card is quick and low cost in response to customer needs. Can be provided.

  Even when the number of terminals of the device to be inspected is increased and the number of pins of the probe is increased and a large number of jumper wires 18 are arranged, active elements such as ICs or resistors, Surface mounting of required electronic components made of passive elements such as capacitors can be facilitated. This is because the jumper wire 18 is arranged on the lower surface side of the wiring board 11. Here, the size of the space of the gap 12c between the wiring board 11 on which the jumper wires 18 are arranged and the substrate holding member 12 is set according to the number of the jumper wires 18 and sufficiently secured.

  The jumper wire 18 can electrically connect the pogo seat 14 to the connector 16 or the probe connection land 17 in the shortest distance. This is reliably maintained even if the specifications of the object to be inspected are changed according to customer needs and the positions of the pogo seat connection lands 15 and the probe connection lands 17 to which the jumper wires 18 are connected vary.

  Moreover, since the strength of the wiring board 11 can be maintained by the board holding member 12, it is easy to reduce the thickness of the wiring board 11. For this reason, a via hole or a through hole for connecting the wiring layers provided on the wiring substrate 11 can be shallow, and the parasitic capacitance of the wiring layer is reduced.

  In this way, a required electrical signal can be easily transmitted between the tester and the object to be inspected via the probe card. In addition, it is possible to reduce the impedance and reactance of the transmission path in the probe card, and it becomes easy to accurately inspect the electrical characteristics of the object to be inspected. For example, an accurate inspection can be performed on an inspection object such as a semiconductor device that operates at high speed.

  Moreover, since the probe card according to the present embodiment has a structure in which the number of wiring layers disposed on the wiring board 11 can be easily suppressed unlike the case of the prior art, the multilayer of the wiring board 11 can be achieved even when the number of pins is increased. There is no need to make it. This also makes it possible to further reduce the cost of the probe card of the present embodiment.

  Further, the jumper wire 18 of the present embodiment is disposed and confined between the wiring board 11 of the probe card and the board holding member 12. For this reason, electromagnetic noise from the tester arranged above the probe card in the electrical inspection apparatus to the jumper wire 18 is shielded by the wiring board 11 having a ground layer, for example. And the electromagnetic noise to the jumper wire 18 from the to-be-inspected object generated at the time of inspection is effectively shielded by the substrate holding member 12. In this way, accurate inspection can be easily performed on an object to be inspected such as a semiconductor device that is effectively shielded from electromagnetic noise and operates at high speed.

  In the probe card according to the present embodiment, the jumper wire 18 is protected by the substrate holding member 12, so that damage due to hooking or the like during transport of the probe card or handling during inspection use is prevented. And the handling operation as described above of the probe card is made efficient.

(Second Embodiment)
Next, a probe card according to a second embodiment of the present invention will be described with reference to FIG. 6, FIG. 7, and FIG. Here, FIG. 6 is a schematic cross-sectional view showing the probe card according to the present embodiment. 7 and 8 are a top view and a bottom view showing an example of a wiring board constituting the probe card, respectively.

  As shown in FIG. 6, the probe card 40 includes a disk-shaped first wiring board 41 and a second wiring board 42 made of, for example, a printed board, and a metal board holding member 12. As described in the first embodiment, the probe head 13 is held in the central region of the substrate holding member 12. Here, the substrate holding member 12 is provided with two kinds of first protrusions 12d and second protrusions 12e having different heights, and the upper end surface of the second protrusion 12e is the first protrusion. It is shaped to be higher than that of 12d. The first wiring substrate 41 and the second wiring substrate 42 are mounted on the substrate holding member 12 and supported from below by the first projecting portion 12d and the second projecting portion 12e, respectively.

  The first wiring board 41 corresponds to the outer peripheral portion of the wiring board 11 described in the first embodiment, and a required number of pogo seats 14 are formed on the upper surface thereof. A pogo seat connection land 15 that is electrically connected to each of these pogo seats 14 is attached to the lower surface of the first wiring board 41. The second wiring board 42 corresponds to the inner peripheral portion of the wiring board 11 described in the first embodiment, and a required number of connectors 16 are provided on the upper surface thereof, and the lower surface thereof is pulled out from the connector 16. A probe connection land 17 is formed.

  A gap 12c is formed between the lower surface of the first wiring board 41 and the one main surface 12b of the substrate holding member 12, and further between the lower surface of the second wiring substrate 42 and the one main surface 12b of the substrate holding member 12. It has come to be. Here, the height of the gap 12c between the lower surface of the second wiring board 42 and the one main surface 12b of the substrate holding member 12 is the same as that of the lower surface of the first wiring substrate 41 and the one main surface 12b of the substrate holding member 12. It becomes larger than that of the gap 12c. This corresponds to the second protrusion 12e being shaped so as to be higher than the first protrusion 12d.

  In the gap 12c as described above, the necessary number of jumper wires 18 for connecting the pogo seat connection lands 15 and the probe connection lands 17 are arranged in the same manner as described in the first embodiment. Yes. Also in this case, the gap 12c in which the jumper wire 18 is disposed is determined by the heights of the upper end surfaces of the first protrusion 12d and the second protrusion 12e, respectively. As shown in FIG. 6, a plurality of probes 20 attached to the probe fixing portion 19 in the same probe head 13 as described in the first embodiment are electrically connected to the connector 16 through, for example, an FPC 21.

  As described above, in the probe card 40 of the present embodiment, the lower surface of the second wiring substrate 42 and the substrate rather than the gap 12c between the lower surface of the first wiring substrate 41 and the one main surface 12b of the substrate holding member 12. The gap 12c between the main surfaces 12b of the holding member 12 has a large spread in the height direction. The pogo seat 14 of the wiring board 11 and the probe 20 can be freely electrically connected to each other through the jumper wires 18 arranged in these gaps 12c as in the case of the first embodiment.

  The jumper wire 18 disposed in the gap 12c formed between the wiring substrate 11 and the substrate holding member 12 of the first embodiment is closer to the probe connection land 17 on the inner periphery of the wiring substrate 11 than the outer periphery. It is arranged at a higher spatial density than the connecting land 15 for Pogo seat. This is because the gap 12c in this case is inevitably narrower in the inner periphery than in the outer periphery. On the other hand, in the second embodiment, the height of the gap 12c between the lower surface of the second wiring board 42 corresponding to the inner peripheral portion and the one main surface 12b of the substrate holding member 12 is the outer peripheral portion. It is set to be larger than that of the gap 12c between the corresponding lower surface of the first wiring board 41 and one main surface 12b of the substrate holding member 12. In addition, in the arrangement of the jumper wire 18, high spatial density near the probe connection land 17 is prevented.

  The jumper wire 18 similar to that described in the first embodiment is connected to the pogo seat connection land 15 or the probe connection land 17 using solder joints, connection pins, ACF, or the like. Then, the pogo seat 14 and the connector 16 are electrically connected. Here, as in the case of the first embodiment, when the jumper wire 18 is formed of a flexible cable, the number of flexible cables that can be arranged in the gap 12c can be reduced because the height of the flexible cable mounting can be reduced by the connection using the ACF. Since it can be increased, it is effective for dealing with the increase in the number of pins. When using connection pins, the connection pins are inserted into through holes provided in the wiring board 11 and connected to the pogo seat 14 or the connector 16.

  In the electrical test of the object to be inspected using the probe card 40, the pogo pin which is the tester terminal of the electrical inspection apparatus is connected to the pogo seat on the upper surface of the first wiring board 41 in the same manner as described in the first embodiment. 14. Then, an electrical signal from the tester is transmitted from the pogo seat 14 through the jumper wire 18, the connector 16, and the FPC 21 to the probe 20 that is in elastic contact with the terminal of the device under test.

  Next, the first wiring board 41 and the second wiring board 42 will be described with reference to FIGS. As shown in FIGS. 7 and 8, the first wiring board 41 and the second wiring board 42 have a structure obtained by dividing the wiring board 11 as described in the first embodiment into two parts, for example. It has become. Here, it is preferable that the wiring board 11 is, for example, router-cut along a concentric circumference 43 between the outer periphery where the pogo seats 14 are arranged and the inner periphery where the probe connection lands 17 are disposed. is there. However, it is preferable that the wiring in the inner layer of the wiring board 11 is arranged in advance so as not to be cut by such two divisions. The power supply wiring and the ground wiring arranged in the inner layer of the second wiring board 42 are supplied with a power supply potential and a ground potential through a predetermined jumper line 18 connected to the pogo seat connection land 15 of the first wiring board 41. It will be fixed to.

  In the router cut method, the mechanical stress when the wiring board 11 is divided is small, and the wiring board is hardly damaged. Further, the cut surface is steep and no deburring is required, and the workability in manufacturing the first wiring board 41 and the second wiring board 42 by dividing the wiring board 11 is extremely good.

  The first wiring board 41 shown in FIGS. 7 and 8 is the same as the outer peripheral part of the wiring board 11 described in FIGS. 2 and 3, and the second wiring board 42 is the same as the inner peripheral part of the wiring board 11. It is. Here, for example, if the outer diameter of the first wiring board 41 is Φ300 mm, the outer diameter of the second wiring board 42 is about Φ200 mm. Other structures are the same as those described in the first embodiment, and detailed description thereof is omitted.

  Further, the substrate holding member 12 in the second embodiment is made of a metal plate such as an aluminum plate, for example, and has a planar shape in which the first wiring substrate 41 and the second wiring substrate 42 are combined. In this case, the substrate holding member 12 has substantially the same structure except for a part thereof as described with reference to FIG. In the following, differences from the case of the first embodiment will be mainly described.

  In FIG. 4, the peripheral protrusion 122 provided along the peripheral edge of the substrate holding member 12 and the peripheral protrusion 123 provided at predetermined locations (four locations in FIG. 4) of the outer periphery of the substrate holding member 12 The height positions from the one principal surface 121 of the upper end surface of each of the upper and lower surfaces are substantially the same. The inner peripheral projections 124 provided at predetermined locations (four locations in FIG. 4) of the inner peripheral portion of the substrate holding member 12 are such that the height positions of the upper end surfaces thereof are those of the peripheral projections 122 and the outer peripheral projections 123. It is formed so that it may become above. For example, if the height from the one main surface 121 of the upper end surface of the peripheral protrusion 122 and the outer peripheral protrusion 123 is about 2 mm to 4 mm, that of the inner peripheral protrusion 124 is, for example, about 5 mm to 10 mm.

  In this way, the first projecting portion 12d described with reference to FIG. 6 includes the peripheral projecting portion 122, the outer peripheral projecting portion 123, and the like. Similarly, the second protrusion 12e is constituted by the inner peripheral protrusion 124. Here, it is preferable that the substrate holding member 12 is integrally formed. However, these protrusions may be formed on one main surface 121 of a conductor different from the substrate holding member 12. Absent.

  In the substrate holding member 12, the peripheral protrusion 122 shown in FIG. 4 may not be formed at all or may be partially formed. Alternatively, a structure in which the outer peripheral protruding portion 123 is provided at a location different from four locations at equal intervals in the circumferential direction of the substrate holding member 12 may be used. Moreover, the structure provided in the location where the inner peripheral protrusion part 124 differs from four places may be sufficient. In any case, the first projecting portion 12d is formed so as to stably hold the first wiring board 41, and the second projecting portion 12e is formed so as to stably hold the second wiring board 42. Just do it.

  Next, a modification of the probe card 40 will be described with reference to FIG. FIG. 9 is a schematic partial sectional view showing a modification of the probe card according to the second embodiment. The probe card 40a of this modification is a case where the probe is an arm type probe or a cantilever type probe, and is shown as a partial sectional view thereof.

  As shown in FIG. 9, the probe card 40a includes, for example, a first wiring board 41 made of a disc-shaped printed board with an inner peripheral portion cut out, a second wiring board 42 arranged on the inner peripheral portion, And a metal substrate holding member 12. A plurality of probe fixing terminals 32 are attached in the central region of the lower surface of the second wiring board 42, and the cantilever type probe 20 is implanted in each of them. Similarly to the case described with reference to FIG. 6, the first protrusion 12 d is provided at the periphery or a predetermined position of the substrate holding member 12, and the first wiring substrate 41 is connected to the substrate holding member at the first protrusion 12 d. 12 and is supported from below.

  Further, although not shown, the second wiring board 42 is mounted on the board holding member 12 and supported from below, for example, at the inner peripheral protrusion 124 shown in FIG. Here, the inner peripheral protruding portion 124 is shaped as the second protruding portion 12e so that the upper end surface thereof is higher than that of the first protruding portion 12d. In the second wiring board 42, the first opening 22 may not be formed in the central region.

  The first wiring board 41 has the required number of pogo seats 14 formed on the upper surface thereof in the same manner as described with reference to FIG. 6, and the pogo seat connection lands 15 that are electrically connected to the pogo seats 14 are first connected. It is attached to the lower surface of one wiring board 41. In addition, the probe connection land 17 of the second wiring board 42 is formed. A gap 12c is formed between the lower surface of the first wiring board 41 and the one main surface 12b of the substrate holding member 12, and further between the lower surface of the second wiring substrate 42 and the one main surface 12b of the substrate holding member 12. Is done. In these gaps 12 c, a required number of jumper wires 18 for connecting the pogo seat connection lands 15 and the probe connection lands 17 are arranged.

  As shown in FIG. 9, the cantilever type probe 20 is electrically connected to the probe connection land 17 through an inner layer wiring 33 disposed in the inner layer of the second wiring board 42. The probe card 40a also has a structure in which the pogo seat 14 and the probe 20 are freely electrically connected via the jumper wire 18 disposed in the gap 12c as described above.

  In addition, as a modification of the probe card 40 (not shown), there is a structure in which a plurality of pin type probes 20 in the probe head 13 described in FIG. Can be mentioned.

  In the second embodiment, the same operational effects as described in the first embodiment can be obtained. Further, in this embodiment, compared to the case of the first embodiment, it is easy to make the spatial density of the arrangement of the jumper wires 18 in the gap 12c from the outer peripheral portion to the inner peripheral portion of the wiring board. become.

  Although the preferred embodiments of the present invention have been described above, the above-described embodiments do not limit the present invention. Those skilled in the art can make various modifications and changes in specific embodiments without departing from the technical idea and technical scope of the present invention.

  For example, the object to be inspected may be a liquid crystal panel, a circuit board formed in a multilayer wiring structure, or the like in addition to the semiconductor device.

  Further, the planar shape of the wiring board and the substrate holding board may be, for example, an ellipse, a rectangle, a polygon, etc. other than a circle.

  In addition, the pogo seat that becomes the tester terminal connection portion on the upper surface of the wiring board is not limited to the outer peripheral portion of the wiring board, and a part thereof may be arranged on the inner peripheral portion.

  Further, the substrate holding member has a structure provided with an engaging means such as a clamp that can be attached and detached between the substrate holding member and the wiring board, for example, in addition to the above-described fastening by screws / bolts. Also good. It is preferable that the substrate holding member has a structure in which the wiring substrate is detachable.

  Further, the substrate holding member is not limited to metal, but may be made of a semiconductor material or an insulator material. Here, in the case of being made of a material such as an insulating resin, it is preferable that a shield layer is formed on the inner layer.

  Finally, it should be noted that the probe card according to the present invention is also useful for IC burn-in test in a wafer state, for example. In this burn-in test, the wafer is heated to a predetermined temperature that is not lower than room temperature.

  DESCRIPTION OF SYMBOLS 10, 10a, 40, 40a ... Probe card, 11 ... Wiring board, 12 ... Board holding member, 12a ... Projection part, 12b, 121 ... One main surface, 12c ... Air gap, 12d ... First projection part, 12e ... First 2 projections, 122 ... peripheral projections, 123 outer projections, 124 inner projections, 13 probe heads, 14 pogo seats, 15 connection lands for pogo seats, 16 connectors, 17 for probes Connection land, 18 ... Jumper wire, 19 ... Probe fixing part, 20 ... Probe, 21 ... FPC, 22 ... First opening, 23 ... Passive element, 24 ... Active element, 25 ... First through hole, 26 ... Second penetration Hole: 27 ... first ground layer, 28 ... second ground layer, 29 ... second opening, 30 ... first screw hole, 31 ... second screw hole, 32 ... probe fixing terminal, 33 ... inner layer wiring, 41 ... First wiring board 42... 2 of the wiring board, 43 ... concentric circle

Claims (9)

A plurality of probes in contact with the terminals of the device under test;
A probe head to which the probe is attached;
A plurality of tester terminal connection portions that contact tester terminals that generate electrical signals for inspection are in contact with the first main surface, and a plurality of probe terminal connection portions to which the probe terminals are electrically connected are the second main surface or the first main surface. A plate-like wiring board provided on the surface;
A board holding member that holds the wiring board from the second main surface side and forms a predetermined gap with the wiring board;
A plurality of conductor-covered conductor wires disposed in the gap and electrically connecting the plurality of tester terminal connection portions and the plurality of probe terminal connection portions;
A probe card comprising: The wiring board includes a first wiring board on which the plurality of tester terminal connection portions are formed, and a second wiring board on which the plurality of probe terminal connection portions are formed,
The height of the gap formed between the second wiring board and the board holding member is larger than the height of the gap between the first wiring board and the board holding member. The probe card according to claim 1.   The probe card according to claim 1, wherein the substrate holding member detachably holds the wiring substrate.   The substrate holding member has a protruding portion formed at a predetermined position thereof, and an upper end surface of the protruding portion is in contact with a second main surface of the wiring substrate to hold the wiring substrate. The probe card according to any one of claims 1 to 3.   5. The probe card according to claim 4, wherein the protruding portion that holds the second wiring board is higher than the protruding portion that holds the first wiring board. 6.   The probe card according to claim 4, wherein the wiring board is fastened to an upper end surface of the protruding portion.   The substrate holding member is made of metal, and an upper end surface of the projecting portion is connected to a conductive layer formed on a second main surface of the wiring substrate that abuts on the substrate holding member, and is fixed to a ground potential. The probe card according to claim 6.   The probe card according to claim 1, wherein the substrate holding member holds the probe head.   9. The probe according to claim 1, wherein the probe is attached to the probe head through metal processing using a photolithography technique and is electrically connected to the probe terminal connection portion via a flexible printed board. The probe card according to one item.

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