JP2009300234A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card compatible with improvement in a number of simultaneous measurement and an electrode density of a semiconductor device while ensuring a space generating no short circuit between connecting pins. <P>SOLUTION: The probe card includes a probe substrate on which a ground probe, a signal probe, a power probe, a first ground electrode, a first signal electrode, and a first power electrode are provided; a card substrate on which a second ground electrode, a second signal electrode, and a second power electrode, which are connected, respectively, to the first ground electrode, the first signal electrode, and the first power electrode, provided on the probe substrate; and a ground connecting cable for connecting the first ground electrode provided on the probe substrate and the second ground electrode provided on the card substrate, a signal connecting pin for connecting the first signal electrode and the second signal electrode, and an electrode connecting pin for connecting the first power electrode and the second power electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a probe card used for testing a chip on a semiconductor wafer.

  In recent years, the number of semiconductor devices and the electrode density have improved, and the number of probes in a probe card used to inspect the semiconductor devices has also increased.

In a conventional probe card, a spring-connected connection pin (for electrical connection with a space transformer, which is a board with internal wiring so that the gap between the main board and the input electrode is increased and the gap between the electrodes is increased on the output side ( For example, the connection pins described in Japanese Patent Application Laid-Open No. 2007-24533 are used, and the power supply, the ground, and the signal are respectively connected by the connection pins. In order to cope with the improvement, the connection pins are also required to be improved in density.
JP 2007-24533 A

However, when the density of the connection pins increases, there arises a problem that the distance between the connection pins approaches and shorts.

  Further, when the density of the connection pins is increased, the space for mounting components such as capacitors on the surface of the probe board is also limited.

  In order to solve such problems, it is desirable to provide a probe card that can cope with the improvement of the same number of semiconductor devices and the electrode density while securing the interval between the connection pins so as not to cause a short circuit. It is an object of the present invention.

The probe card of the present invention is provided with a ground probe, a signal probe, and a power probe, and is further connected to the ground probe, the signal probe, and the power probe. A probe substrate provided with a first signal electrode and a first power supply electrode;
A second ground electrode, a second signal electrode, and a second ground electrode connected to the first ground electrode, the first signal electrode, and the first power supply electrode provided on the probe substrate; A card substrate provided with a second power supply electrode;
A ground connection cable for connecting the first ground electrode and the second ground electrode provided on the probe substrate and the card substrate, and the first signal electrode and the second signal electrode. A signal connection pin to be connected, and a power connection pin for connecting the first power supply electrode and the second power supply electrode are provided.

  Further, the first ground electrode provided on the probe substrate is disposed on the periphery of the probe substrate so as to surround the first signal electrode and the first power supply electrode.

The probe card of the present invention is provided with a ground probe, a signal probe, and a power probe, and is further connected to the ground probe, the signal probe, and the power probe. A probe substrate provided with a first signal electrode and a first power supply electrode;
A second ground electrode, a second signal electrode, and a second ground electrode connected to the first ground electrode, the first signal electrode, and the first power supply electrode, respectively, provided on the probe substrate; A card substrate provided with a second power supply electrode;
A ground connection cable for connecting the first ground electrode and the second ground electrode provided on the probe board and the card board, and the first signal electrode and the second signal electrode. By providing the signal connection pin to be connected and the power supply connection pin for connecting the first power supply electrode and the second power supply electrode, the ground connection pin becomes unnecessary, and the interval between adjacent connection pins is widened. This makes it possible to prevent the connection pins from being short-circuited.

  Further, the first ground electrode provided on the probe substrate is disposed on the periphery of the probe substrate so as to surround the first signal electrode and the first power supply electrode. The ground connection cable acts as a barrier and can prevent intrusion of disturbance.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, the probe card 1 of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic sectional view of a probe card 1 of the present invention.

  The probe card 1 of the present invention reinforces a probe board 2 provided with a ground probe 4, a signal probe 5, and a power supply probe 6, a card board 3 connected to the probe board 2, and the card board 3. It is comprised from the reinforcement board 10 to do.

The probe substrate 2 includes a first ground electrode 14, a first signal electrode 15, and a first power source connected to the ground probe 4, the signal probe 5, and the power source probe 6, respectively. An electrode 16 is provided, and the card substrate 3 is connected to the first ground electrode 14, the first signal electrode 15, and the first power supply electrode 16 provided on the probe substrate 2. A second ground electrode 14 ′, a second signal electrode 15 ′, and a second power supply electrode 16 ′ are provided.

  The probe substrate 2 is a laminated plate, and a wiring layer is formed in the inside thereof, and internal wiring is formed by vias that connect the wiring layer and the wiring layer in the vertical direction. The internal wiring is divided into a ground wiring 7 connected to the ground probe 4, a signal wiring 8 connected to the signal probe 5, and a power wiring 9 connected to the power probe 6.

  The probe board 2 has a ground as described above so that a narrow gap between the input electrodes provided with the ground probe 4, the signal probe 5 and the power probe 6 is enlarged on the output side. It is a transformer in which the wiring 7 for signal, the wiring 8 for signal, and the wiring 9 for power supply are given inside.

  The card board 3 is also a laminated board, like the probe board 2, and is provided with internal wiring formed of wiring layers and vias, and includes ground wiring 7 ', signal wiring 8', power supply It is divided into wiring 9 '. The card board 3 is provided with a connector 12 for connecting the internal wiring and a tester.

  The probe board 2 and the card board 3 are electrically connected by connection pins 17 and 18 and the cable 11. The connection pins 17 and 18 are connection pins having a shape having elasticity which is conventionally used. A signal connection pin 17 is used to connect the first signal electrode 15 of the probe board 2 and the second signal electrode 15 ′ of the card board 3, and the first signal electrode 15 ′ of the probe board 2 is used. A power connection pin 18 is used to connect one power electrode 16 to the second power electrode 16 ′ of the card substrate 3.

  For connection between the first ground electrode 14 of the probe board 2 and the second ground electrode 14 ′ of the card board 3, a ground connection cable 11 is used instead of a conventional connection pin. As the ground connection cable 11, a flexible printed wiring board can be used. The ground connection cable 11 is soldered by using solders 13 and 13 ′, and the first ground electrode 14 and the second ground electrode. 14 '.

In this way, the ground connection cable 11 is used for connection between the ground electrodes, whereby the first ground electrode 14 of the probe board 2 and the second ground electrode 14 of the card board 3 are used. 'Becomes the same potential, and a stable ground configuration can be provided between the probe board 2 and the card board 3.

  By using the ground connection cable 11, no connection pin for connecting the ground electrode is required, and the number of connection pins for connecting the probe board 2 and the card board 3 can be reduced. It becomes possible to widen the space | interval of 17 and 18, and it becomes possible to prevent the short-circuit of the adjacent connection pins 17 and 18. FIG.

  In the present embodiment, as shown in FIG. 2, the first ground electrode 14 is provided in the vicinity of the outer periphery of the probe substrate 2, and the first ground electrode 14 as shown in FIG. The first signal electrode 15 and the first power supply electrode 16 are disposed so as to surround the first signal electrode 15 and the first power supply electrode 16. With the arrangement of the electrodes, the ground connection cable 11 acts as a barrier, and it is possible to prevent intrusion of disturbance.

  Next, a connection procedure using the cable 11 will be described. First, the ground probe 4, the signal probe 5, and the power probe 6 are provided on the probe substrate 2. Next, the signal connection pin 17 and the power supply connection pin 18 are arranged on the first signal electrode 15 and the first power supply electrode 16 provided on the probe substrate 2, respectively. As shown in (connection pins are not shown), the ground connection cable 11, which is a flexible printed wiring board, is joined to the first ground electrode 14 provided on the probe substrate 2 with solder 13. .

  When the connection of the ground connection cable 11 to the probe board 2 is completed, the signal connection pin 17 and the power connection pin 18 are connected to the first signal electrode 15 and the first signal electrode 15 provided on the card board 3. The card substrate 3 is aligned with the probe substrate 2 so as to be connected to one power supply electrode 16, and the ground connection cable 11 is provided with the second ground electrode provided on the card substrate 3. 14 'is joined by solder 13'. In this way, the connection of the probe board 2 and the card board 3 by the ground connection cable 11, the signal connection pins 17 and the power supply connection pins 18 is completed.

It is a schematic sectional drawing of the probe card of this invention. It is a perspective view of a probe board in the state where a ground connection cable is joined to a ground electrode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe card 2 Probe board 3 Card board 4 Ground probe 5 Signal probe 6 Power probe 7, 7 'Ground wiring 8, 8' Signal wiring 9, 9 'Power wiring 10 Reinforcement plate 11 Cable 12 Connector 13 , 13 'Solder 14 First ground electrode 14' Second ground electrode 15 First signal electrode 15 'Second signal electrode 16 First power electrode 16' Second power electrode 17 Signal connection pin 18 Power supply connection pin

Claims (2)

A first ground electrode, a first signal electrode, and a ground probe, a signal probe, and a power probe, each of which is connected to the ground probe, the signal probe, and the power probe; A probe substrate provided with a first power supply electrode;
A second ground electrode, a second signal electrode, and a second ground electrode connected to the first ground electrode, the first signal electrode, and the first power supply electrode, respectively, provided on the probe substrate; A card substrate provided with a second power supply electrode;
A ground connection cable for connecting the first ground electrode and the second ground electrode provided on the probe substrate and the card substrate, and the first signal electrode and the second signal electrode. A probe card comprising: a signal connection pin to be connected; and a power supply connection pin for connecting the first power supply electrode and the second power supply electrode.   The first ground electrode provided on the probe substrate is disposed on the periphery of the probe substrate so as to surround the first signal electrode and the first power supply electrode. The probe card according to claim 1.

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