JP2007134427A - Module package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module package wherein the area of a printed board is reduced, and terminals having a large area is formed on the side face. <P>SOLUTION: The module package 10 comprises: a first substrate 11; a second substrate 13 whereon an IC 17 is mounted and a wiring pattern 16 for connecting the IC 17 and lands 15 is formed; and an insulator composite sheet 12 formed with vias 14 for electrically connecting the two substrates. The vias 14 and the lands 15 are arranged on the boundary lines along which the substrates are cut during a manufacturing process of the package. Accordingly, parts of them are cut together with the substrates and are exposed on the side face of the package 10, resulting in forming the terminals having a large area on the side face of the module package. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a module package in which a module such as LSI (Large Scale Integration) or IC (Integrated Circuit), or MCM (Multi Chip Module) or SIP (System In Package) in which LSI or IC is mixed, and a method for manufacturing the same. It is about.

  In recent years, higher integration of circuits used for digital home appliances such as digital television has been advanced. High integration of circuits has one method of integrating many functions in one system LSI as a system on chip (SOC), but shortening development time and reducing development costs due to shortened product cycles, etc. For this reason, many methods of storing already developed system LSIs, memory devices, and the like in one package using MCM or SIP technology have come to be used.

  However, with such high integration, interface signals from system LSIs and the like increase dramatically, and the number of external input / output terminals also increases at the same time. As the number of external input / output terminals increases, the area of the printed board on which the chip is mounted in order to arrange all the terminals is increased, and further, the area of the printed board on which the package is mounted is also increased. An increase in the area of the printed circuit board directly increases the cost. This problem becomes even more serious in SIP that combines several LSIs.

  As one method for preventing an increase in the area of the printed circuit board due to an increase in the number of external input / output terminals, it is conceivable to arrange the terminals on the side surface rather than on the upper or lower surface of the printed circuit board on which the chip is mounted.

  Patent Document 1 describes a test method in which a pattern provided on an intermediate layer of a printed circuit board is drawn out to the side surface of the board and a test is performed by using the drawn point as a test terminal to easily detect a mistake. ing.

Patent Document 2 describes a method in which testing can be performed even when the ball size and the distance between the balls are reduced by arranging test terminals on the side surface of the BGA package.
JP-A-6-38250 JP 11-17058 A

  However, when trying to test by the method as described in Patent Document 1, the thickness of a pattern such as copper formed on a recent printed circuit board is as thin as several tens of micrometers. The area of the inspection terminal, which is the area where the probe can be touched, becomes very small (about several tens of micrometers × several hundreds of micrometers). In this case, it cannot be easily inspected by a human hand, and a dedicated high-accuracy test device or the like is required.

  Further, when trying to realize the structure as described in Patent Document 2, the wiring pattern must be extended to the side surface of the printed board. However, a new process of extending the wiring pattern to the side surface of the printed circuit board is required, and it is difficult to easily extend the wiring to the side surface using a currently used device, and a dedicated device is required. Therefore, realization is difficult.

  Therefore, in the module package according to the present invention, the via that electrically connects the upper and lower surfaces of the substrate is exposed to the side surface of the substrate. In addition, vias that electrically connect the lands of the substrate disposed above and below the insulating layer are exposed on the side surfaces of the insulating layer.

  Furthermore, the module package manufacturing method according to the present invention is characterized in that the substrate is cut along a boundary line that traverses a via that electrically connects the upper and lower surfaces of the substrate. Further, the present invention is characterized in that a plurality of substrates and an insulating layer sandwiched therebetween are cut along a boundary line that traverses vias that electrically connect lands of the substrates disposed above and below the insulating layer.

  According to the module package of the present invention, since the terminals for electrical connection or inspection can be arranged on the side surface without being arranged on the upper and lower surfaces, the area of the printed circuit board compared with the case where these are arranged only on the upper and lower surfaces. Can be reduced. In addition, this terminal has a via that electrically connects the upper and lower surfaces of the substrate exposed to the side surface. Therefore, the terminal has a larger area than the conventional technology in which the wiring pattern on the substrate is simply extended to the end of the substrate. Can be configured on the side.

  In particular, when a terminal is formed on the side surface with a layer of an insulating sheet for sandwiching a relatively high component such as an IC, a terminal area of about several hundreds of micrometers, which is several tens of times thicker than the conventional one, can be secured. Therefore, it is sufficiently possible to inspect with a human hand, and even when using the apparatus, the inspection can be performed even if the accuracy is not so high.

  In addition, according to the module package manufacturing method of the present invention, it is very easy because it is only necessary to cut a printed board on which vias and through holes are formed using a conventionally used apparatus for processing a printed board. It is. The via serving as the inspection terminal may be formed on the boundary line with the originally discarded portion, and it is not necessary to make a large printed circuit board to form the inspection terminal.

  Furthermore, the present invention also has the effect of reducing costs because it is not necessary to reduce the number of printed circuit boards and use high-precision devices.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(Embodiment 1)
FIG. 1 is a perspective view showing a configuration of a module package according to Embodiment 1 of the present invention.

  In FIG. 1, a module package 10 is partially cut by a first substrate 11, a second substrate 13, an insulating sheet 12, an IC 17 mounted on the upper surface of the second substrate 13, and a substrate cutting step described later. From the land 15 formed on the second substrate 13, the via 14 formed in the insulating sheet 12 that electrically connects the first substrate 11 and the second substrate 13, and the wiring 16 on the second substrate 13. Composed.

  The IC 17 is mounted on the upper surface of the second substrate 13 by a flip chip method, a wire bonding method, or the like. The land 15 is disposed on the upper surface of the second substrate 13 and is connected to the bottom surface of the via 14.

  The IC 17 and the land 15 are connected by the wiring 16 on the upper surface of the second substrate 13.

  Therefore, since the signal input / output terminal of the IC 17 is connected to the wiring 16, the land 15, and the via 14, the via 14 exposed from the side surface of the module package 10 is output from the IC 17 as an input / output terminal to the IC 17. It can be used as a signal inspection terminal.

  2 is a plan view (FIG. 2A) and the module package 10 when the first substrate 11 and the insulating sheet 12 are transmitted when the module package 10 is viewed from the upper surface direction of the first substrate 11. The structure of the side view (FIG. 2B) is shown. In addition, in both figures, the same component shall be represented by the same number.

  The first substrate 11 and the second substrate 13 are laminated with the insulating sheet 12 interposed therebetween. The insulating sheet 12 needs to be thicker than the components mounted on the second substrate 13 in order to prevent the components mounted on the second substrate 13 from coming into contact with the first substrate 11. Thicker than the height.

  The insulating sheet 12 is formed with a via 14 filled with a conductive paste. The via 14 allows the land 15 on the second substrate 13 and the first corresponding to the land 15 to be provided. The lands on the substrate 11 are electrically connected.

  As shown in FIG. 2A, the via 14 and the land 15 are cut in approximately half when viewed from above and below, whereby the via 14 is cut on the side surface of the insulating sheet 12 as shown in FIG. 2B. The surface is exposed. Since the exposed portion of the via 14 is electrically connected to the IC chip 17 via the land 15, it can be used as a terminal for electrical connection or inspection.

  In the first embodiment, as shown in FIGS. 1 and 2, the configuration in which the land 15 and the via 14 are cut in substantially half when viewed in the vertical direction is illustrated. Considering that the via 14 has a generally cylindrical configuration, it is possible to secure the maximum cross-sectional area by cutting in half along the center line.

  In addition, the cross-sectional area of the via 14 can be increased by increasing the diameter of the via 14 or increasing the thickness of the insulating sheet 12. Thereby, a larger terminal for electrical connection or inspection can be secured.

  The thickness of the insulating sheet 12 can be arbitrarily set according to the height of the IC 17 mounted on the second substrate 13, but particularly when the thickness is about 1 mm (that is, the height of the IC 17 is less than 1 mm). In this case, the via 14 having a sufficient area can be secured. Also, the diameter of the via 14 can be arbitrarily set.

  With the configuration of the first embodiment, the terminals for electrical connection or inspection of the IC 17 can be arranged on the side surface of the insulating sheet 12 without being arranged on the upper and lower surfaces of the second substrate 13. As a result, it is possible to reduce the area of the second substrate 13 because it is not necessary to arrange terminals on the upper and lower surfaces of the second substrate 13.

  In addition, the terminals for electrical connection or inspection of the IC 17 disposed on the second substrate 13 do not have to be disposed on the first substrate 11 (no need to be routed to the upper and lower surfaces of the module package 10). The degree of freedom in designing the first substrate 11 is also increased.

  Furthermore, since the terminals exposed on the side surfaces of the insulating sheet 12 are used as the inspection terminals of the IC 17, the inspection terminals that have not been installed so far for reducing the area can be arranged on a substrate having the same area. The internal IC 17 signal can be analyzed in detail.

  In the configuration of the first embodiment, since a terminal for electrical connection or inspection is formed by the layer of the insulating sheet 12 for sandwiching a relatively high component such as the IC 17, a thick layer for the terminal is newly provided. Therefore, it is possible to secure a terminal having a thickness of about 1 mm, which is several tens of times thicker than the conventional one. For this reason, it is sufficiently possible to inspect with a human hand, and even when using the apparatus, the inspection can be performed even if the accuracy is not so high.

  In the first embodiment described above, the installation location of the terminal for electrical connection or inspection is the side surface of the insulating sheet 12, but it may be configured to be provided on the side surface of the substrate 13 or 11. In this case, the through holes and vias of the substrates 13 and 11 are used. Even when the terminals are provided on the side surfaces of the substrates 13 and 11, the through hole can secure a width of several hundred μm. Even if the wiring on the substrate is extended to the side surface, in consideration of the fact that the width of the wiring is only about several tens of μm, it is possible to arrange an inspection terminal having a larger area than this.

  Next, a method for manufacturing the module package 10 will be described with reference to FIGS. 1, 3 </ b> A, 3 </ b> B, 3 </ b> C, and 4.

  FIG. 3 is a plan view showing the configuration of each substrate and insulating sheet before the lamination pressing in the lamination pressing step S12 described later. Here, 21 and 23 are substrates, and 22 is an insulating sheet for physically connecting the substrates 21 and 23. In this example, the substrate 21, the insulating sheet 22, and the substrate 23 are laminated in order from the top. The substrate 21, the insulating sheet 22, and the substrate 23 correspond to the first substrate 11, the insulating sheet 12, and the second substrate 13 in FIG.

  FIG. 4 is a process diagram showing a process for manufacturing a module.

  In FIG. 3A, the substrate 23 includes a land 15 'that is in a state before being cut by the substrate cutting step S13. Reference numeral 13 'denotes a boundary line to be cut in a substrate cutting step S13 described later.

  In FIG.3 (b), the insulating sheet 22 is equipped with the via | veer 14 'which is the state before cut | disconnecting by board | substrate cutting process S13 mentioned later. Reference numeral 12 'denotes a boundary line to be cut in a substrate cutting step S13 described later. The boundary line 12 'passes through the center line of the via 14'. This is to maximize the cut surface of the via 14 '.

  In FIG. 3C, 11 'indicates a boundary line to be cut in a substrate cutting step S15 described later. The boundary lines 13 ′, 12 ′, and 11 ′ are at corresponding positions. In the subsequent substrate cutting step S 13, the substrate 23, the insulating sheet 22, and the substrate are displayed on the lines indicated by the boundary lines 13 ′, 12 ′, and 11 ′. 21 are cut together.

  In FIG. 4, the manufacture of the module package begins with a production step S11 of the substrate 21, the insulating sheet 22, and the substrate 23.

  In creating the substrate 23, a boundary line 13 'is drawn, and a land 15' is formed on the boundary line 13 '. In addition, the IC 17 is mounted on the substrate 23, and the wiring 16 is drawn so that the IC 17 and the land 15 'are electrically connected.

  In the production of the insulating sheet 22, the boundary line 12 'is drawn, and the via 14' is formed on the boundary line 12 '. The via 14 ′ is formed by making a hole in a necessary portion of the insulating sheet 22 and filling the hole with a conductive paste. Further, in the production of the substrate 21, the boundary line 11 'is drawn.

  When the creation of the substrate 21, the insulating sheet 22, and the substrate 23 is completed, the substrate and the insulating sheet are superposed and pressure-bonded, and the process proceeds to a laminating press step S12 to form a single substrate. For convenience of explanation, the step of superposing the substrate 23, the insulating sheet 22, and the substrate 21 is described. However, the via 14 'is provided by etching or the like after the insulating sheet 22 is overlaid on the substrate 23. The step of further bonding the substrate 21 after filling with the conductive paste may be used.

  In the lamination press step S12, the substrate 21, the insulating sheet 22, and the substrate 23 are overlaid so that the boundary lines 11 ', 12', and 13 'coincide with each other when viewed from above.

  When the lamination press is completed, the process proceeds to a substrate cutting step S13 for cutting the laminated substrates.

  In the substrate cutting step S13, the substrate is cut using a router, a dicer, a diamond cutter or the like along the upper boundary line 11 '. When the substrate is cut, the land 15 'and the via 14' arranged on the boundary line are also cut at the same time, so that the conductor portion is exposed on the surface, the land 15 and the via 14 are formed, and the side is electrically connected. A module package with terminals for inspection or inspection is completed.

  In the first embodiment, the dicing boundary line is used as a method for aligning the positions between the substrates. However, this is used as a standard for alignment at the time of stacking in the stacking press step S12. Other means can be used as long as alignment is possible even if there is no actual line on each substrate. For example, in the substrate 23, the insulating sheet 22, and the substrate 21 before cutting, it is possible to match the boundary lines for cutting each substrate by fixing the distance from one end. Moreover, you may align using a wiring pattern, a board | substrate through-hole, etc. FIG.

  As mentioned above, although the structure and manufacturing method of the module package concerning Embodiment 1 of this invention were demonstrated, the said description is only an example of embodiment of this invention, and is not limited to this.

  For example, the first substrate 11 and the substrate 23 may be a single-sided or double-sided printed wiring board, a multilayer printed wiring board, or a build-up printed wiring board, and the wiring 16 is also described as the upper surface of the second substrate 13, but is the upper surface. There is no need, and it may be a lower surface or an intermediate layer. The insulating sheet 22 may have a structure in which one sheet or several sheets are laminated.

  Further, in FIG. 1, the first substrate 11, the insulating sheet 12, and the second substrate 13 have a three-layer structure, but three or more layers may be provided as long as the insulating sheet is sandwiched between the substrates. In the first embodiment, the via 14 is used as an inspection terminal for the IC 17. However, the via 14 is not limited to an output signal from one IC, and may be a terminal for observing a passing signal between components such as between IC and IC. Instead, it may be used as a signal input / output terminal.

(Embodiment 2)
FIGS. 5A and 5B are a perspective view (FIG. 5A) and a side view (FIG. 5B) showing the configuration of the module package according to the second embodiment of the present invention. In FIG. 1 and FIG. 5, the same constituent elements are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 5, a module package 30 includes a first substrate 31, an insulating sheet 32, vias 34 and vias 38 that are exposed on the side surfaces and can be used as terminals for electrical connection or inspection, and lands 39 that are electrically connected to the vias 38. Are different from the module package 10, and other elements have the same configuration as the module package 10 according to the first embodiment.

  When the insulating sheet 32 has a structure formed of several layers, vias are provided up to a layer that can secure a height (several hundreds of micrometers) that does not hinder measurement. By not providing the via, the via 34 having a small exposed area from the side surface can be formed as compared with the case where the via is provided in all layers.

  Further, an insulating sheet layer is further formed on the insulating sheet on which the via 34 is formed, and an insulating sheet on which a via 38 is further formed is laminated on the insulating sheet layer. If the vias 38 formed on the insulating sheet are connected to the lands 39 provided on the first substrate 31, signals coming from the first substrate 31 can be observed. With this structure, when the module package 30 is viewed from the upper surface, a plurality of inspection terminals can be provided at the same position (same row) of the insulating sheet 32. Therefore, a large number of inspection terminals can be formed in the same area, The area can be further reduced.

  In the second embodiment, the terminal for electrical connection or inspection is set on the side surface of the insulating sheet, but may be provided on the side surface of the first substrate 31 or the second substrate 13. When terminals are provided on the side surfaces of these substrates, IVH (Interstitial Via Hole) of the substrate can be used. In a multilayer substrate, by installing IVH only between necessary layers, more inspection terminals can be arranged and the area of the substrate can be reduced.

  Also in this case, as in the case of the first embodiment, the terminal width when the wiring is extended to the end of the substrate is several tens of μm, whereas the width of several hundreds of μm can be secured in IVH. Large terminals can be placed on the sides of the substrate.

  Regarding the second embodiment, the above description is merely an example of the embodiment of the present invention, and the present invention is not limited to this.

  For example, the second substrate 13 and the first substrate 31 may be a single-sided or double-sided printed wiring board, a multilayer printed wiring board, or a build-up printed wiring board, and the wiring 16 is also described as the upper surface of the second substrate 13. It does not have to be the upper surface, and may be the lower surface or the intermediate layer.

  Furthermore, in FIG. 5, the first substrate 31, the insulating sheet 32, and the second substrate 13 have a three-layer structure, but three or more layers may be used as long as the insulating sheet is sandwiched between the substrates. In the second embodiment, the via 34 is used as an inspection terminal for the IC 17 and the via 38 is used as an inspection terminal for an electronic component on the first substrate 31. However, the output signal is not limited to one IC, and the IC-IC It may be a terminal for observing a passing signal between components such as between, or may be used as a signal input / output terminal instead of signal observation.

(Embodiment 3)
FIGS. 6A and 6B are a perspective view (FIG. 6A) and a side view (FIG. 6B) showing the configuration of the module package according to Embodiment 3 of the present invention. In FIG. 1 and FIG. 6, the same components are represented by the same numbers, and description thereof is omitted.

  In FIG. 6, the module package 40 electrically connects a first substrate 41, a second substrate 43, a land 49 formed on the lower surface of the first substrate 41, a land 50 formed on the upper surface, and the land 49 and the land 50. Connecting vias 48, lands 52 formed on the lower surface of the second substrate 43, and vias 51 electrically connecting the lands 15 to the lands 52 are elements different from the module package 10, and other elements are module packages. 10 is the same configuration.

  Vias 48 and vias 51 are arranged on the first substrate 41 and the second substrate 43 so as to be in the same position as the vias 14 arranged on the insulating sheet 12 when viewed from above. By doing so, even if the area that can be touched only by the via 14 is small and the measurement is difficult, a height that does not hinder the measurement is secured and the area as the inspection terminal is expanded. Is possible.

  The vias 48 and 51 may not be vias but may be through holes.

  In FIG. 6, vias are provided in both the first substrate 41 and the second substrate 43. However, if a sufficient area can be obtained, either the first substrate 41 or the substrate 43 is provided. Only vias may be provided and connected to the vias 14 formed in the insulating sheet 12.

  In the first to third embodiments, the IC 17 is mounted on the second board and is built in the module package. However, the IC 17 is not necessarily built in and may be mounted on the first board. Further, the insulating sheets 12 and 32 may be the same substrate as the first substrate 11 or the like as long as it has a thickness that can provide a sufficient area.

  The module package and the method for manufacturing the module package according to the present invention can easily inspect, for example, inspection terminals necessary for maintaining reliability in the field of digital home appliances and the like that are becoming increasingly sophisticated and high performance. This is useful as a package for LSI, MCM, SIP, etc., because it is arranged on the side surface while ensuring a large area, and the manufacturing method can be used with the equipment currently used, and the cost does not increase.

The perspective view which shows the structure of the module package which concerns on the 1st Embodiment of this invention. The top view and side view which show the structure of the module package which concerns on the 1st Embodiment of this invention The top view which shows each structure of the board | substrate before the lamination | stacking press of the module package which concerns on the 1st Embodiment of this invention, and an insulating sheet. The flowchart which shows the manufacturing process of the module package which concerns on the 1st Embodiment of this invention. The perspective view and side view which show the structure of the module package which concerns on the 2nd Embodiment of this invention. The perspective view and side view which show the structure of the module package which concerns on the 3rd Embodiment of this invention.

Explanation of symbols

10, 30, 40 Module package 11, 31, 41 First substrate 12, 32 Insulating sheet 13, 43 Second substrate 14, 34, 38, 48, 51 Via 15, 52, 39, 49, 50 Land 16 Wiring Pattern 17 IC
11 ', 12', 13 'boundary line 14' via before cutting 15 'land before cutting 21, 23 substrate 22 insulating sheet

Claims (5)

A module package having a substrate for mounting electrical and electronic components,
A module package, wherein vias for electrically connecting upper and lower surfaces of the substrate are exposed on a side surface of the substrate. A module package having an insulating layer that insulates the boards from each other between a plurality of boards on which electrical / electronic components are mounted,
A module package, wherein vias for electrically connecting lands of substrates disposed above and below the insulating layer are exposed on a side surface of the insulating layer. The via is cut in substantially half when viewed from the upper surface side of the module package;
The module package according to claim 1, wherein the cut surface is exposed on a side surface of the substrate or the insulating layer. A method of manufacturing a module package including a substrate on which electrical / electronic components are mounted,
Providing a via on a predetermined boundary on the substrate;
A module package manufacturing method comprising: cutting the substrate along the boundary line. A method of manufacturing a module package including a substrate on which electrical / electronic components are mounted,
Providing a land on a predetermined boundary line on the substrate;
Providing a via at a position corresponding to the land on the insulating layer;
A module package manufacturing method comprising: cutting the substrate and the insulating layer along the boundary line.

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