JP2006344847A - Substrate with built-in component, module equipped with built-in component using same, and method of manufacturing same - Google Patents

Substrate with built-in component, module equipped with built-in component using same, and method of manufacturing same Download PDF

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JP2006344847A
JP2006344847A JP2005170343A JP2005170343A JP2006344847A JP 2006344847 A JP2006344847 A JP 2006344847A JP 2005170343 A JP2005170343 A JP 2005170343A JP 2005170343 A JP2005170343 A JP 2005170343A JP 2006344847 A JP2006344847 A JP 2006344847A
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component
insulating layer
component built
inspection
built
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JP4848676B2 (en
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Hiroki Kawabata
宏樹 河端
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate equipped with a built-in component which enables an inspection terminal to be arranged on it without increasing its area, can be improved in yield and reduced in size. <P>SOLUTION: The substrate A with a built-in component comprises a first insulating layer 1 where conductive interconnect lines 3 and 4 are provided on its front and rear main surface, a circuit component 6 mounted on the conductive interconnect line 3 located on the front main surface of the first insulating layer 1, and a second insulating layer 10 which is laminated on the first insulating layer 1 to bury the circuit component 6. Two or more inspection terminals 7 connected to the conductive interconnect lines 3 and 4 are provided on the side face of the first insulating layer 1, and a mounting inspection and a characteristic inspection are carried out for the substrate A equipped with the built-in component using the inspection terminals 7. As the inspection terminals 7 are arranged on the external side faces of the substrate A; the inspection terminals 7 are restrained from impeding the mounting of the circuit component 6, and the substrate A can be improved in area efficiency. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、高周波回路モジュールのような部品内蔵モジュールおよびその構成要素である部品内蔵基板に関するものである。 The present invention relates to a component built-in module such as a high-frequency circuit module and a component built-in substrate that is a component of the module.

従来、無線通信用モジュールなどの高周波回路モジュールとして、部品内蔵基板を備えた部品内蔵モジュールが提案されている。部品内蔵基板は、配線が形成された層（導電配線層）の上に回路部品を接続し、その後で回路部品の周囲を樹脂で固めることで、樹脂層の中に回路部品を埋設したものである。この部品内蔵基板単体、あるいはそれを厚み方向に複数個積層したり、平面方向に複数個組み合わせることで、部品内蔵モジュールが構成されている。 2. Description of the Related Art Conventionally, a component built-in module including a component built-in substrate has been proposed as a high-frequency circuit module such as a wireless communication module. The component-embedded board is a circuit component embedded in the resin layer by connecting the circuit component on the wiring layer (conductive wiring layer) and then hardening the periphery of the circuit component with resin. is there. A component built-in module is configured by laminating a single component built-in substrate, or by stacking a plurality of these in the thickness direction, or by combining a plurality of them in the plane direction.

部品内蔵基板には、内蔵される回路部品に高価な部品が含まれることがあるため、コスト低減の面からみて歩留り向上が非常に重要である。特に、複数の部品内蔵基板を組み合わせて構成する部品内蔵モジュールを構成する場合、その中の１つの部品内蔵基板に不良があれば、部品内蔵モジュール全体が不良品になってしまう。 In the component-embedded substrate, an expensive component may be included in the built-in circuit component, and therefore, yield improvement is very important from the viewpoint of cost reduction. In particular, when configuring a component built-in module configured by combining a plurality of component built-in substrates, if there is a defect in one of the component built-in substrates, the entire component built-in module becomes a defective product.

特許文献１には、検査用端子を備えた部品内蔵モジュールが開示されている。この部品内蔵モジュールは、図８，図９に示すように、周辺部に検査用端子４１が設けられた配線板４０を備えており、その上に回路部品４２が搭載されている。配線板４０の上に絶縁層４３が積層され、この絶縁層４３の中に回路部品４２が埋め込まれている。絶縁層４３の周縁部には、検査用端子４１と導通するビアホール４４が規則的に設けられている。この部品内蔵モジュールでは、配線板４０に回路部品４２を搭載した状態で検査用端子４１を利用して検査を実施できるとともに、モジュールを完成した後でもビアホール４４を利用して検査を実施できるので、歩留り向上を達成できる。 Patent Document 1 discloses a component built-in module provided with an inspection terminal. As shown in FIGS. 8 and 9, the component built-in module includes a wiring board 40 having an inspection terminal 41 provided in the peripheral portion, and a circuit component 42 is mounted thereon. An insulating layer 43 is laminated on the wiring board 40, and circuit components 42 are embedded in the insulating layer 43. Via holes 44 that are electrically connected to the inspection terminals 41 are regularly provided in the peripheral portion of the insulating layer 43. In this component built-in module, inspection can be performed using the inspection terminal 41 with the circuit component 42 mounted on the wiring board 40, and inspection can be performed using the via hole 44 even after the module is completed. Yield improvement can be achieved.

しかし、上記構造の部品内蔵モジュールでは、配線板４０の周辺部に検査用端子４１が設けられ、これら検査用端子４１にビアホール４４が接続されるため、配線板４０の周辺部領域には回路部品４２を配置することができない。そのため、配線板４０の周辺部に検査用端子４１を配置するための領域が別に必要となり、結果的に部品内蔵モジュールの面積が拡大してしまうという欠点がある。
特開２００５−５６９２号公報 However, in the component built-in module having the above structure, the inspection terminals 41 are provided in the peripheral portion of the wiring board 40, and the via holes 44 are connected to the inspection terminals 41. 42 cannot be arranged. For this reason, a separate area for arranging the inspection terminals 41 in the peripheral portion of the wiring board 40 is required, resulting in an increase in the area of the component built-in module.
JP 2005-5692 A

そこで、本発明の目的は、基板の面積を増大させずに検査用端子を配置でき、歩留り向上と小型化とを実現できる部品内蔵基板を提供することにある。
他の目的は、部品内蔵基板を無駄に廃棄せずにすむ部品内蔵基板の製造方法を提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a component-embedded substrate that can arrange inspection terminals without increasing the area of the substrate, and that can improve yield and size.
Another object is to provide a method for manufacturing a component-embedded substrate that does not waste the component-embedded substrate.

上記目的は請求項１に係る部品内蔵基板および請求項８に記載の部品内蔵基板の製造方法により達成される。
請求項１に係る発明は、少なくとも表裏主面に導電配線が設けられた第１の絶縁層と、第１の絶縁層の表主面の導電配線に搭載された回路部品と、第１の絶縁層の上に積層され、上記回路部品を埋設する第２の絶縁層とを含み、少なくとも上記第１の絶縁層の側面に上記導電配線と接続された複数の検査用端子が設けられていることを特徴とする部品内蔵基板である。 The object is achieved by the component-embedded substrate according to claim 1 and the method for manufacturing the component-embedded substrate according to claim 8.
According to a first aspect of the present invention, there is provided a first insulating layer provided with conductive wiring on at least the front and back main surfaces, a circuit component mounted on the conductive wiring on the front main surface of the first insulating layer, and a first insulating layer. A plurality of test terminals connected to the conductive wiring on at least a side surface of the first insulating layer, the second insulating layer being embedded on the layer and embedding the circuit component. A component-embedded board characterized by

請求項８に係る発明は、少なくとも表裏主面に導電配線が設けられ、側面に上記導電配線と接続された複数の検査用端子が設けられた第１の絶縁層を準備する工程と、上記第１の絶縁層の表主面の導電配線に回路部品を搭載する工程と、回路部品が搭載された上記第１の絶縁層の検査用端子に検査用プローブを接触させ、上記回路部品を含む電気的特性を測定する工程と、上記第１の絶縁層の上に第２の絶縁層を積層し、第２の絶縁層の中に上記回路部品を埋設する工程と、を含む部品内蔵基板の製造方法である。 According to an eighth aspect of the present invention, there is provided a step of preparing a first insulating layer in which conductive wiring is provided at least on the front and back main surfaces, and a plurality of inspection terminals connected to the conductive wiring are provided on the side surfaces; A circuit component is mounted on the conductive wiring on the front main surface of the first insulating layer, and an inspection probe is brought into contact with the inspection terminal of the first insulating layer on which the circuit component is mounted. Manufacturing a component-embedded board comprising: measuring a physical characteristic; and laminating a second insulating layer on the first insulating layer, and embedding the circuit component in the second insulating layer. Is the method.

本発明では、検査用端子が部品内蔵基板の側面に形成されているので、回路部品を基板の周辺部に配置でき、部品内蔵基板を小型化できる。
また、請求項８のように、第２の絶縁層を積層する前の段階の第１の絶縁層の側面に検査用端子を設けてある場合には、第１の絶縁層の上に回路部品を搭載した時点で検査を実施できる。つまり、回路部品自体の不良や接続不良などを第２の絶縁層を積層する前に発見でき、部品内蔵基板の歩留りの向上を実現できる。一方、第２の絶縁層を積層した後で第１の絶縁層の側面に検査用端子を形成することも可能である。その場合には部品内蔵基板を完成して初めて検査を実施できるが、部品内蔵基板を複数個組み合わせて部品内蔵モジュールを作製する際、不良の部品内蔵基板を検査で除外できるので、部品内蔵モジュールの歩留り向上を実現できる。 In the present invention, since the inspection terminal is formed on the side surface of the component built-in substrate, the circuit component can be arranged in the peripheral portion of the substrate, and the component built-in substrate can be downsized.
Further, in the case where the inspection terminal is provided on the side surface of the first insulating layer before the second insulating layer is laminated as in the eighth aspect, the circuit component is provided on the first insulating layer. Inspection can be performed at the time of mounting. That is, it is possible to find defects in the circuit components themselves, connection failures, and the like before the second insulating layer is stacked, and it is possible to improve the yield of the component-embedded substrate. On the other hand, an inspection terminal can be formed on the side surface of the first insulating layer after the second insulating layer is stacked. In such a case, inspection can be performed only after the component-embedded board is completed, but when a component-embedded module is produced by combining multiple component-embedded boards, defective component-embedded boards can be excluded by inspection. Yield improvement can be realized.

検査用端子としては、例えば部品内蔵基板の側面に取り付けられた金属箔、側面に形成された薄膜あるいは厚膜電極、さらには部品内蔵基板の側面に埋め込まれた金属端子でもよい。検査用端子は、少なくとも第１の絶縁層の側面の一部に形成されておればよく、第２の絶縁層の側面まで延びていても良い。
本発明の部品内蔵基板は、それ単体で部品内蔵モジュールを構成してもよいし、複数の部品内蔵基板で部品内蔵モジュールを構成してもよい。 The inspection terminal may be, for example, a metal foil attached to the side surface of the component built-in substrate, a thin film or thick film electrode formed on the side surface, or a metal terminal embedded in the side surface of the component built-in substrate. The inspection terminal only needs to be formed on at least part of the side surface of the first insulating layer, and may extend to the side surface of the second insulating layer.
The component built-in substrate of the present invention may constitute a component built-in module by itself, or a plurality of component built-in substrates may constitute a component built-in module.

望ましい実施形態によれば、検査用端子は、第１の絶縁層の側面に一定間隔で規則的に形成されているものがよい。
この場合には、基板のサイズに関係なく検査器具を共用することができ、製造コストを低減できる。 According to a preferred embodiment, the inspection terminals are preferably formed regularly at regular intervals on the side surface of the first insulating layer.
In this case, the inspection instrument can be shared regardless of the size of the substrate, and the manufacturing cost can be reduced.

他の望ましい実施形態によれば、検査用端子は第１の絶縁層の側面の厚み方向の全域に亘って形成されているのがよい。
すなわち、第１の絶縁層の表裏面だけでなく内層にも導電配線が形成されている場合、検査用端子を第１の絶縁層の側面の厚み方向の全域に亘って形成することで、これら全ての導電配線と検査用端子とを接続することが可能になる。したがって、全ての導電配線の検査を実施できる。 According to another preferred embodiment, the inspection terminal may be formed over the entire region in the thickness direction of the side surface of the first insulating layer.
That is, when conductive wiring is formed not only on the front and back surfaces of the first insulating layer but also on the inner layer, the inspection terminals are formed over the entire thickness direction of the side surface of the first insulating layer. It is possible to connect all the conductive wirings and the inspection terminals. Therefore, all the conductive wirings can be inspected.

望ましい実施形態によれば、複数の部品内蔵基板を厚み方向に積層して形成した部品内蔵モジュールであって、複数の部品内蔵基板の中の少なくとも１つが上記検査用端子が設けられた部品内蔵基板であるものがよい。
複数の部品内蔵基板を厚み方向に積層して部品内蔵モジュールを形成することがあるが、その場合に、少なくとも１つの部品内蔵基板を本発明にかかる検査用端子付きの部品内蔵基板とすれば、検査用端子を利用して、部品内蔵基板単体での検査のほかに、積層途中の中間段階の部品内蔵基板に対しても検査を実施できる。
なお、積層される全ての部品内蔵基板が本発明にかかる検査用端子付きの部品内蔵基板であってもよいことは勿論である。 According to a preferred embodiment, a component built-in module formed by laminating a plurality of component built-in substrates in the thickness direction, wherein at least one of the plurality of component built-in substrates is provided with the inspection terminal. Is good.
A component built-in module may be formed by laminating a plurality of component built-in substrates in the thickness direction. In this case, if at least one component built-in substrate is a component built-in substrate with an inspection terminal according to the present invention, In addition to the inspection of the component built-in board alone, the inspection terminal can be used to inspect the component built-in board at an intermediate stage during the stacking.
Of course, all the component-embedded substrates to be stacked may be component-embedded substrates with inspection terminals according to the present invention.

上記のように複数の部品内蔵基板を厚み方向に積層した部品内蔵モジュールの場合、検査用端子が設けられた部品内蔵基板を最下層以外の層に設けるのがよい。すなわち、最下層の部品内蔵基板には実装用電極が形成されるので、これら電極と検出用端子とが近接すると、ショートなどの不良が発生する恐れが生じるからである。 In the case of a component built-in module in which a plurality of component built-in substrates are stacked in the thickness direction as described above, the component built-in substrate provided with the inspection terminals is preferably provided in a layer other than the lowest layer. That is, since the mounting electrodes are formed on the lowermost component-embedded substrate, if these electrodes and the detection terminals are close to each other, a defect such as a short circuit may occur.

他の望ましい実施形態によれば、複数の部品内蔵基板を面方向に接続して形成した部品内蔵モジュールであって、複数の部品内蔵基板の中の少なくとも１つが上記検査用端子が設けられた部品内蔵基板であってもよい。
部品内蔵基板を面方向に連結して部品内蔵モジュールを構成する場合があるが、この場合にも本発明の検査用端子付きの部品内蔵基板を用いることができる。この場合も、部品内蔵基板単体だけでなく、接続途中の段階で検査を実施できるので、歩留り向上に寄与できる。 According to another preferred embodiment, a component built-in module formed by connecting a plurality of component built-in substrates in a plane direction, wherein at least one of the plurality of component built-in substrates is provided with the inspection terminal It may be a built-in substrate.
In some cases, the component-embedded module is configured by connecting the component-embedded substrates in the surface direction. In this case, the component-embedded substrate with the inspection terminals of the present invention can also be used. Also in this case, the inspection can be performed not only on the component-embedded substrate alone but also in the middle of the connection, which can contribute to an improvement in yield.

複数の部品内蔵基板を面方向に接続して部品内蔵モジュールを構成する場合に、検査用端子が部品内蔵基板同士の接続面に設けられているのがよい。
この場合には、検査用端子を部品内蔵基板同士の接続端子として利用できる。 When a component-embedded module is configured by connecting a plurality of component-embedded substrates in the surface direction, inspection terminals are preferably provided on the connection surfaces between the component-embedded substrates.
In this case, the inspection terminal can be used as a connection terminal between the component-embedded substrates.

以上のように、本発明にかかる部品内蔵基板によれば、検査用端子が部品内蔵基板を構成する第１の絶縁層の側面に形成されているので、回路部品が配置されている領域以外に検査用端子を配置する領域が必要なく、部品内蔵基板の面積効率が向上し、部品内蔵基板の小型化を実現できる。
また、検査用端子を利用して製造途中の部品内蔵基板あるいは完成品の部品内蔵基板の不良を検出でき、部品内蔵モジュールを作製する場合に歩留り向上を実現できる。 As described above, according to the component-embedded substrate according to the present invention, the inspection terminals are formed on the side surfaces of the first insulating layer constituting the component-embedded substrate. There is no need for a region for placing the inspection terminals, the area efficiency of the component built-in substrate is improved, and the component built-in substrate can be downsized.
Further, it is possible to detect a defect in the component built-in substrate being manufactured or the component built-in substrate in the finished product by using the inspection terminals, and it is possible to improve the yield when producing the component built-in module.

以下に、本発明の実施の形態を、実施例を参照して説明する。 Embodiments of the present invention will be described below with reference to examples.

図１，図２は本発明にかかる部品内蔵基板の第１実施例を示す。
部品内蔵基板Ａは、それ単体で部品内蔵モジュールを構成するものであり、エポキシ樹脂等の絶縁性樹脂よりなる第１絶縁層１と第２絶縁層１０とを積層したものである。この実施例の第１絶縁層１は、複数の樹脂層を導電配線２を間にして積層したものであり、その表裏主面にも導電配線３，４がパターン形成されている。なお、第１絶縁層１は複数の樹脂層で構成されたものに限らず、単一の樹脂層で構成されたものでもよい。導電配線２〜４はビアホール５を介して相互に接続されている。第１絶縁層１の表主面の導電配線３には複数の回路部品６が搭載され、電気的に接続されている。 1 and 2 show a first embodiment of a component built-in substrate according to the present invention.
The component-embedded substrate A alone constitutes a component-embedded module, and is formed by laminating a first insulating layer 1 and a second insulating layer 10 made of an insulating resin such as an epoxy resin. The first insulating layer 1 of this embodiment is formed by laminating a plurality of resin layers with the conductive wiring 2 therebetween, and conductive wirings 3 and 4 are also patterned on the front and back main surfaces. In addition, the 1st insulating layer 1 is not restricted to what was comprised by the some resin layer, The thing comprised by the single resin layer may be sufficient. Conductive wirings 2 to 4 are connected to each other through via holes 5. A plurality of circuit components 6 are mounted and electrically connected to the conductive wiring 3 on the front main surface of the first insulating layer 1.

第１絶縁層１の外側面には、実装検査や特性検査などの検査を行うための複数の検査用端子７が一定間隔で規則的に設けられている。本実施例の検査用端子７は第１絶縁層１の厚み方向の全域に亘って延びており、検査用端子７は導電配線２〜４と必要に応じて個別に接続されている。すなわち、導電配線２〜４の端部は必要に応じて絶縁層１の側面まで延びており、検査用端子７と電気的に接続されている。本実施例では、検査用端子７が第１絶縁層１の４辺全周に設けられているが、いずれか１辺、２辺あるいは３辺のみでもよい。検査用端子７としては、金属箔やメッキ、蒸着電極、厚膜電極でもよいし、金属端子を埋め込んだものでもよい。
また、検査用端子７は、第１絶縁層１の厚み方向の全域に亘って延びている必要はなく、第１絶縁層１の厚み方向の一部のみでもよいし、さらには第１絶縁層１から第２絶縁層１０の側面に亘って連続的に形成されていてもよい。 On the outer surface of the first insulating layer 1, a plurality of inspection terminals 7 for performing inspections such as mounting inspection and characteristic inspection are regularly provided at regular intervals. The inspection terminal 7 of the present embodiment extends over the entire region in the thickness direction of the first insulating layer 1, and the inspection terminal 7 is individually connected to the conductive wirings 2 to 4 as necessary. That is, the end portions of the conductive wirings 2 to 4 extend to the side surface of the insulating layer 1 as necessary, and are electrically connected to the inspection terminal 7. In this embodiment, the inspection terminals 7 are provided on the entire circumference of the four sides of the first insulating layer 1, but only one side, two sides, or three sides may be provided. The inspection terminal 7 may be a metal foil, plating, vapor deposition electrode, thick film electrode, or a metal terminal embedded therein.
Further, the inspection terminal 7 does not need to extend over the entire area of the first insulating layer 1 in the thickness direction, and may be only a part of the first insulating layer 1 in the thickness direction, or further, the first insulating layer. The first insulating layer 10 may be continuously formed over the side surface of the second insulating layer 10.

第２絶縁層１０は、回路部品６を埋設するように第１絶縁層１の上に圧着・積層されたものである。第２絶縁層１０の表主面に導電配線１１がパターン形成され、この導電配線１１と第１絶縁層１の表主面の導電配線３とが、第２絶縁層１０に形成されたビアホール１２を介して相互に接続されている。
なお、第２絶縁層１０の導電配線１１の上に別の回路部品を接続してもよいことは勿論である。 The second insulating layer 10 is pressure-bonded and laminated on the first insulating layer 1 so as to embed the circuit component 6. Conductive wiring 11 is patterned on the front main surface of the second insulating layer 10, and the conductive wiring 11 and the conductive wiring 3 on the front main surface of the first insulating layer 1 are formed in via holes 12 formed in the second insulating layer 10. Are connected to each other.
Of course, another circuit component may be connected on the conductive wiring 11 of the second insulating layer 10.

次に、上記構成の部品内蔵モジュールＡの製造方法を図３に従って説明する。
まず工程（ａ）では、側面に検査用端子７を設けた第１絶縁層１を準備する。この絶縁層（配線基板）１は、公知の配線パターン形成技術および樹脂の積層技術を用いて容易に製造できる。
工程（ｂ）では、第１絶縁層１の表主面の導電配線３の上に回路部品６を半田付けや導電性接着剤を用いて電気的に接続する。
工程（ｃ）では、工程（ｂ）で回路部品６を搭載した第１絶縁層１の検査用端子７に検査用プローブ８を接触させて実装検査および特性検査などを実施する。検査の結果、不良が判明すれば、不良のある第１絶縁層１（回路部品付き）を除外する。なお、プローブ８は複数の検査用端子７に同時に接触させることが可能なように、複数本設けられているのがよい。
検査の結果、不良がないと判明すれば、工程（ｄ）のように第２絶縁層１０を積層し、回路部品６を絶縁層１０内に埋設する。この場合、プリプレグを第１絶縁層１に対して圧着し、回路部品６を埋設した後、プリプレグを硬化させれば、第２絶縁層１０を容易に形成できる。
最後に、工程（ｅ）では第２絶縁層１０に厚み方向に貫通するビアホール１２を形成するとともに、表主面に導電配線１１を形成する。以上のようにして部品内蔵基板Ａが完成する。
なお、完成された部品内蔵基板Ａの側面に検査用端子７が露出しているので、この検査用端子７に検査用プローブ８を接触させて検査を実施できる。そのため、第２絶縁層１０を積層することによって発生する不良を発見できる。 Next, a method of manufacturing the component built-in module A having the above configuration will be described with reference to FIG.
First, in the step (a), the first insulating layer 1 having the inspection terminals 7 provided on the side surfaces is prepared. The insulating layer (wiring substrate) 1 can be easily manufactured using a known wiring pattern forming technique and resin lamination technique.
In the step (b), the circuit component 6 is electrically connected to the conductive wiring 3 on the front main surface of the first insulating layer 1 by soldering or using a conductive adhesive.
In the step (c), the inspection probe 8 is brought into contact with the inspection terminal 7 of the first insulating layer 1 on which the circuit component 6 is mounted in the step (b), and mounting inspection and characteristic inspection are performed. If a defect is found as a result of the inspection, the defective first insulating layer 1 (with circuit components) is excluded. A plurality of probes 8 are preferably provided so that a plurality of probes 8 can be brought into contact with a plurality of inspection terminals 7 simultaneously.
As a result of the inspection, if it is found that there is no defect, the second insulating layer 10 is laminated and the circuit component 6 is embedded in the insulating layer 10 as in step (d). In this case, the second insulating layer 10 can be easily formed by pressing the prepreg against the first insulating layer 1 and embedding the circuit component 6 and then curing the prepreg.
Finally, in the step (e), the via hole 12 penetrating in the thickness direction is formed in the second insulating layer 10 and the conductive wiring 11 is formed on the front main surface. The component built-in substrate A is completed as described above.
Since the inspection terminal 7 is exposed on the side surface of the completed component-embedded substrate A, the inspection probe 8 can be brought into contact with the inspection terminal 7 to perform the inspection. Therefore, it is possible to find a defect that occurs when the second insulating layer 10 is stacked.

図４，図５は本発明にかかる部品内蔵モジュールの第２実施例を示す。
この実施例の部品内蔵モジュールＢは、第１実施例と同様な構造の部品内蔵基板を厚み方向に積層したものである。
図４のように、下層の部品内蔵基板２０Ａと、上層の部品内蔵基板２０Ｂと、中間層２１とを準備する。
部品内蔵基板２０Ａ，２０Ｂは、第１実施例と同様な構成よりなるため、第１実施例の部品内蔵基板Ａと同一符号を付して重複説明を省略する。
中間層２１は未硬化状態の樹脂すなわちプリプレグよりなり、中間層２１には適数のビアホール２２が形成されている。 4 and 5 show a second embodiment of the component built-in module according to the present invention.
The component built-in module B of this embodiment is obtained by stacking component built-in substrates having the same structure as in the first embodiment in the thickness direction.
As shown in FIG. 4, a lower component-embedded substrate 20A, an upper component-embedded substrate 20B, and an intermediate layer 21 are prepared.
Since the component-embedded boards 20A and 20B have the same configuration as that of the first embodiment, the same reference numerals as those of the component-embedded substrate A of the first embodiment are attached and the duplicate description is omitted.
The intermediate layer 21 is made of an uncured resin, that is, a prepreg, and an appropriate number of via holes 22 are formed in the intermediate layer 21.

次に、図５のように中間層２１を間にして部品内蔵基板２０Ａと２０Ｂとを積層し、その後、中間層２１を硬化させる。そのため、下層の部品内蔵基板２０Ａの上面の導電配線１１と上層の部品内蔵基板２０Ｂの下面の導電配線４とがビアホール２２を介して導通接続される。 Next, as shown in FIG. 5, the component built-in substrates 20A and 20B are stacked with the intermediate layer 21 therebetween, and then the intermediate layer 21 is cured. Therefore, the conductive wiring 11 on the upper surface of the lower component-embedded substrate 20A and the conductive wiring 4 on the lower surface of the upper component-embedded substrate 20B are conductively connected via the via hole 22.

本実施例の部品内蔵モジュールＢの場合、検査用端子７を利用して各部品内蔵基板２０Ａ，２０Ｂの特性を検査することができるので、積層前の段階で不良を発見することができる。したがって、不良のある部品内蔵基板を誤って積層することがなく、部品内蔵モジュールＢの歩留りを向上させることができる。
なお、図４では２個の部品内蔵基板２０Ａ，２０Ｂを積層した部品内蔵モジュールＢを示したが、３個以上の部品内蔵基板を積層してもよいことは勿論である。また、積層する全ての部品内蔵基板が検査用端子を備えている必要はない。 In the case of the component built-in module B of the present embodiment, since the characteristics of the component built-in substrates 20A and 20B can be inspected using the inspection terminal 7, a defect can be found at the stage before stacking. Therefore, the yield of the component built-in module B can be improved without erroneously stacking defective component built-in substrates.
4 shows the component built-in module B in which the two component built-in substrates 20A and 20B are stacked, it is needless to say that three or more component built-in substrates may be stacked. Moreover, it is not necessary that all the component-embedded boards to be laminated have inspection terminals.

図６，図７は本発明にかかる部品内蔵モジュールの第３実施例を示す。
この実施例の部品内蔵モジュールＣは、第１実施例と同様な構造の複数の部品内蔵基板を面方向に接続して形成したものである。
本実施例では、全ての部品内蔵基板３０Ａ〜３０Ｄの側面に検査用端子７が形成されている。部品内蔵基板３０Ａ〜３０Ｄは、第１実施例と同様な構成よりなるため、第１実施例の部品内蔵基板Ａと同一符号を付して重複説明を省略する。 6 and 7 show a third embodiment of the component built-in module according to the present invention.
The component built-in module C of this embodiment is formed by connecting a plurality of component built-in substrates having the same structure as in the first embodiment in the surface direction.
In the present embodiment, the inspection terminals 7 are formed on the side surfaces of all the component-embedded substrates 30A to 30D. Since the component-embedded boards 30A to 30D have the same configuration as that of the first embodiment, the same reference numerals as those of the component-embedded board A of the first embodiment are used, and redundant description is omitted.

図６に示す各部品内蔵基板３０Ａ〜３０Ｄは、第１絶縁層１の上に回路部品６を搭載した状態（第２絶縁層を積層する前）であり、これら部品内蔵基板３０Ａ〜３０Ｄを図７のように検査用端子７が互いに導通するように平面方向に並べ、その上方あるいは下方から部品内蔵基板３０Ａ〜３０Ｄを全てカバーするようにプリプレグ状態の第２絶縁層（図示せず）を圧着積層することで、一体構造の部品内蔵モジュールＣを完成することができる。
なお、部品内蔵基板３０Ａ〜３０Ｄを面方向に接続した際、検査用端子７同士が絶縁されるように間に絶縁層（接着剤など）を介在させてもよい。 Each component-embedded substrate 30A-30D shown in FIG. 6 is a state in which the circuit component 6 is mounted on the first insulating layer 1 (before the second insulating layer is laminated). The second insulating layer (not shown) in a prepreg state is pressure-bonded so as to cover all the component-embedded boards 30A to 30D from above or below so that the inspection terminals 7 are electrically connected to each other as in FIG. By laminating, the component built-in module C having an integral structure can be completed.
In addition, when the component built-in boards 30A to 30D are connected in the surface direction, an insulating layer (adhesive or the like) may be interposed between the inspection terminals 7 so as to be insulated from each other.

図６では、全ての部品内蔵基板３０Ａ〜３０Ｄが全周に検査用端子７を備えた例を示したが、例えば接続状態（図７参照）で外側に露出する側面にのみ検査用端子７を備えたものでもよいし、接続状態（図７参照）で部品内蔵基板同士が接する内側面にのみ検査用端子７を備えたものでもよい。その他、４個の部品内蔵基板３０Ａ〜３０Ｄのうち、いずれか１個ないし３個が検査用端子７を備えていてもよい。 FIG. 6 shows an example in which all the component-embedded boards 30A to 30D are provided with the inspection terminals 7 on the entire circumference. It may be provided, or may be provided with the inspection terminal 7 only on the inner surface where the component-embedded substrates are in contact with each other in the connected state (see FIG. 7). In addition, any one to three of the four component-embedded substrates 30 </ b> A to 30 </ b> D may include the inspection terminal 7.

本発明は上記実施例に限定されるものではない。
上記実施例では、第１絶縁層１の側面にのみ検査用端子７を設け、第２絶縁層１０の側面には検査用端子が設けられていない例を示したが、第２絶縁層１０の側面にも第１絶縁層１の側面と連続した検査用端子が設けられていてもよい。この場合、検査用端子７は第１絶縁層１の上に第２絶縁層１０を積層した後で形成することができる。
すなわち、マザー状態の第１絶縁層１を準備し、その上に回路部品６を搭載し、その上にマザー状態の第２絶縁層１０を積層した後、絶縁層１，１０を部品内蔵基板単位にカットし、その側面に検査用端子７を厚み方向に連続的に形成すればよい。この場合には、部品内蔵基板を量産性よく製造できる。但し、検査を実施できるのは部品内蔵基板を完成した後である。 The present invention is not limited to the above embodiments.
In the above embodiment, the example in which the inspection terminal 7 is provided only on the side surface of the first insulating layer 1 and the inspection terminal is not provided on the side surface of the second insulating layer 10 is shown. Inspection terminals that are continuous with the side surfaces of the first insulating layer 1 may also be provided on the side surfaces. In this case, the inspection terminal 7 can be formed after the second insulating layer 10 is laminated on the first insulating layer 1.
That is, the first insulating layer 1 in the mother state is prepared, the circuit component 6 is mounted thereon, the second insulating layer 10 in the mother state is laminated thereon, and then the insulating layers 1 and 10 are formed as a component-embedded board unit. The inspection terminals 7 may be continuously formed in the thickness direction on the side surfaces. In this case, the component built-in substrate can be manufactured with high productivity. However, the inspection can be performed after the component-embedded substrate is completed.

本発明にかかる部品内蔵基板（モジュール）の第１実施例の断面図である。It is sectional drawing of 1st Example of the component built-in board | substrate (module) concerning this invention. 図１のII−II線断面図である。It is the II-II sectional view taken on the line of FIG. 図１に示す部品内蔵基板の製造工程図である。FIG. 2 is a manufacturing process diagram of the component built-in substrate shown in FIG. 1. 本発明にかかる部品内蔵モジュールの第２実施例の接続前の断面図である。It is sectional drawing before the connection of 2nd Example of the component built-in module concerning this invention. 図４に示す部品内蔵モジュールの接続後の断面図である。It is sectional drawing after the connection of the component built-in module shown in FIG. 本発明にかかる部品内蔵モジュールの第３実施例の接続前の平面図である。It is a top view before the connection of 3rd Example of the component built-in module concerning this invention. 図６に示す部品内蔵モジュールの接続後の断面図である。It is sectional drawing after the connection of the component built-in module shown in FIG. 従来の部品内蔵モジュールの断面図である。It is sectional drawing of the conventional component built-in module. 図８のIX−IX線断面図である。It is the IX-IX sectional view taken on the line of FIG.

符号の説明Explanation of symbols

Ａ，Ｂ，Ｃ 部品内蔵モジュール（部品内蔵基板）
１ 第１絶縁層
２〜４ 導電配線
５ ビアホール
６ 回路部品
７ 検査用端子
１０ 第２絶縁層
１１ 導電配線
１２ ビアホール A, B, C Component built-in module (component built-in board)
DESCRIPTION OF SYMBOLS 1 1st insulating layer 2-4 Conductive wiring 5 Via hole 6 Circuit component 7 Inspection terminal 10 2nd insulating layer 11 Conductive wiring 12 Via hole

Claims (8)

少なくとも表裏主面に導電配線が設けられた第１の絶縁層と、第１の絶縁層の表主面の導電配線に搭載された回路部品と、第１の絶縁層の上に積層され、上記回路部品を埋設する第２の絶縁層とを含み、
少なくとも上記第１の絶縁層の側面に上記導電配線と接続された複数の検査用端子が設けられていることを特徴とする部品内蔵基板。 A first insulating layer provided with conductive wiring on at least the front and back main surfaces; a circuit component mounted on the conductive wiring on the front main surface of the first insulating layer; and laminated on the first insulating layer, A second insulating layer that embeds circuit components;
A component-embedded substrate, wherein a plurality of inspection terminals connected to the conductive wiring are provided on at least a side surface of the first insulating layer. 上記検査用端子は第１の絶縁層の側面に一定間隔で規則的に配置されていることを特徴とする請求項１に記載の部品内蔵基板。 The component built-in board according to claim 1, wherein the inspection terminals are regularly arranged on the side surface of the first insulating layer at regular intervals. 上記検査用端子は第１の絶縁層の側面の厚み方向の全域に亘って形成されていることを特徴とする請求項１または２に記載の部品内蔵基板。 The component built-in board according to claim 1, wherein the inspection terminal is formed over the entire region in the thickness direction of the side surface of the first insulating layer. 複数の部品内蔵基板を厚み方向に積層して形成した部品内蔵モジュールであって、
複数の部品内蔵基板の中の少なくとも１つが請求項１ないし３のいずれかに記載の部品内蔵基板であることを特徴とする部品内蔵モジュール。 A component built-in module formed by laminating a plurality of component built-in substrates in the thickness direction,
The component built-in module according to claim 1, wherein at least one of the plurality of component built-in substrates is the component built-in substrate according to claim 1. 上記検査用端子が設けられた部品内蔵基板は、最下層以外の層に設けられていることを特徴とする請求項４に記載の部品内蔵モジュール。 The component built-in module according to claim 4, wherein the component built-in substrate provided with the inspection terminal is provided in a layer other than the lowest layer. 複数の部品内蔵基板を面方向に接続して形成した部品内蔵モジュールであって、
複数の部品内蔵基板の中の少なくとも１つが請求項１ないし３のいずれかに記載の部品内蔵基板であることを特徴とする部品内蔵モジュール。 A component built-in module formed by connecting a plurality of component built-in substrates in a plane direction,
The component built-in module according to claim 1, wherein at least one of the plurality of component built-in substrates is the component built-in substrate according to claim 1. 上記検査用端子が部品内蔵基板同士の接続面に設けられていることを特徴とする請求項６に記載の部品内蔵モジュール。 The component built-in module according to claim 6, wherein the inspection terminal is provided on a connection surface between the component built-in substrates. 少なくとも表裏主面に導電配線が設けられ、側面に上記導電配線と接続された複数の検査用端子が設けられた第１の絶縁層を準備する工程と、
上記第１の絶縁層の表主面の導電配線に回路部品を搭載する工程と、
回路部品が搭載された上記第１の絶縁層の検査用端子に検査用プローブを接触させ、上記回路部品を含む電気的特性を測定する工程と、
上記第１の絶縁層の上に第２の絶縁層を積層し、第２の絶縁層の中に上記回路部品を埋設する工程と、を含む部品内蔵基板の製造方法。 Preparing a first insulating layer provided with conductive wiring on at least the front and back main surfaces, and provided with a plurality of inspection terminals connected to the conductive wiring on the side surfaces;
Mounting circuit components on the conductive wiring on the front main surface of the first insulating layer;
A step of bringing an inspection probe into contact with the inspection terminal of the first insulating layer on which the circuit component is mounted, and measuring electrical characteristics including the circuit component;
Laminating a second insulating layer on the first insulating layer, and embedding the circuit component in the second insulating layer.
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JP2007305674A (en) * 2006-05-09 2007-11-22 Denso Corp Part built-in substrate, and method of inspecting failure of its wiring
JP2010177583A (en) * 2009-01-30 2010-08-12 Tdk Corp Electronic component built-in substrate, manufacturing method therefor, and inspection method thereof
JP2014096533A (en) * 2012-11-12 2014-05-22 Denso Corp Method of manufacturing component built-in substrate
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JP2010177583A (en) * 2009-01-30 2010-08-12 Tdk Corp Electronic component built-in substrate, manufacturing method therefor, and inspection method thereof
JP2014096533A (en) * 2012-11-12 2014-05-22 Denso Corp Method of manufacturing component built-in substrate
JP2016076514A (en) * 2014-10-02 2016-05-12 大日本印刷株式会社 Wiring board and electronic module

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