JP2005005692A - Module with built-in circuit parts and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module with built-in circuit parts capable of being used together with another module with built-in parts with respect to an inspection tool to be used for at least one kind of inspection selected from a group composed of a mount inspection or a characteristic inspection, and the productivity of which has been improved. <P>SOLUTION: The module with built-in circuit parts comprises an electrical insulation layer 101, a pair of wiring layers 18b and 102 arranged on both main surfaces of the electrical insulation layer, a plurality of via conductors 103 electrically connecting the pair of wiring layers and penetrating the electrical insulation layer in the direction of thickness of the electrical insulation layer, and circuit parts 109 buried in the electrical insulation layer, and the plurality of via conductors 103 are arranged at the periphery of the electrical insulation layer 101 in accordance with a predetermined rule. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a circuit component built-in module in which circuit components are built in an electrical insulating layer and a method for manufacturing the same.

In recent years, in response to demands for higher performance and miniaturization of electronic devices, it has been demanded that a module with a built-in circuit component on which a plurality of circuit components are mounted be compatible with higher density, higher functionality, and smaller size. As a method of increasing the density, development of a connection using an inner via is underway. If the inner via is used, for example, the wiring connecting the LSI and another circuit component can be minimized. The plurality of inner vias are arranged at arbitrary positions in the electrical insulating layer (circuit component built-in layer) (see, for example, Patent Document 1).

By the way, the circuit component built-in module is at least one selected from mounting inspection and characteristic inspection for the circuit component and the like after the circuit component is joined to the wiring layer and before the circuit component is embedded in the electrical insulating layer in the manufacturing process. A seed inspection is performed. In these inspections, the probe of the inspection instrument is brought into contact with a land portion (a bonding conductor portion constituting the wiring layer) to be bonded to the inner via. Next, a voltage is applied to the inspection target to determine whether or not an electrical connection that satisfies a predetermined condition is obtained.
JP-A-11-220262 (page 7-8, FIG. 1)

  However, in a conventional circuit component built-in module, a plurality of inner vias and land portions joined to the inner vias are arranged at arbitrary positions. Therefore, in order to perform an inspection, a dedicated inspection instrument including a plurality of probes arranged so as to correspond to the plurality of land portions is necessary. This inspection instrument could not be used for other circuit component built-in modules.

  The circuit component built-in module according to the present invention electrically connects the electrical insulating layer, the pair of wiring layers provided on both main surfaces of the electrical insulating layer, and the pair of wiring layers, A plurality of via conductors penetrating through the electrical insulating layer in a thickness direction, and circuit components embedded in the electrical insulating layer, wherein the plurality of via conductors are at least a peripheral portion of the electrical insulating layer. It is characterized in that it is arranged in part according to a predetermined rule.

  Another circuit component built-in module according to the present invention electrically connects the electrical insulating layer, the pair of wiring layers disposed on both principal surfaces of the electrical insulating layer, and the pair of wiring layers, and the electrical insulation. A plurality of via conductors penetrating the electrical insulation layer in the thickness direction of the layer, and a circuit component embedded in the electrical insulation layer, wherein the electrical insulation layer has the principal surface of the electrical insulation layer A first region in which the circuit component is disposed and a second region in which the plurality of via conductors are disposed, when the cut surface cut in a direction parallel to the plurality of via conductors is included. Are arranged in the second region so as to draw a substantially lattice with a space therebetween.

  The method for manufacturing a circuit component built-in module according to the present invention includes: (a) a first sheet-like product in which a wiring layer including a plurality of land portions is formed on one main surface of a release film or one main surface of an insulating substrate; Two, and a step of mounting circuit components on at least one of the first sheets, (b) a step of performing at least one type of inspection selected from mounting inspection and characteristic inspection, and (c) electricity Processing the insulating material into a second sheet-like material having a plurality of through-holes formed at predetermined positions, filling the through-hole with a conductive material, and the circuit component of the first sheet-like material After placing the second sheet-like material filled with the conductive material between the first sheet-like materials so that the surface on which the is mounted faces the second sheet-like material side, Pressurizing and heating in the thickness direction to place the circuit component in the second sheet. Embedding in a shape, and in the step (a), the plurality of land portions are arranged on the peripheral portion of one main surface of the release film or the peripheral portion of one main surface of the insulating substrate. Using an inspection instrument that is formed according to a predetermined rule and includes, in the step (b), a plurality of probes arranged corresponding to the plurality of land portions, and a support that supports the plurality of probes, Perform an inspection.

  According to another method of manufacturing a circuit component built-in module of the present invention, (a) a first sheet in which a wiring layer including a plurality of land portions is formed on one main surface of a release film or one main surface of an insulating substrate. Two steps, and mounting a circuit component on at least one of the first sheets, (b) performing at least one type of inspection selected from mounting inspection and characteristic inspection, and (c) ) Processing the electrically insulating material into a second sheet-like material having a plurality of through-holes formed at predetermined positions, filling the through-hole with a conductive material, and After disposing the second sheet-like material filled with the conductive material between the first sheet-like materials such that the surface on which the circuit component is mounted faces the second sheet-like material side, These are pressurized and heated in the thickness direction, and the circuit component is Embedded in a sheet-like material, and in the step (a), the plurality of land portions are spaced from each other on one main surface of the release film or one main surface of the insulating substrate. An inspection instrument including a plurality of probes formed so as to substantially draw a lattice and arranged in correspondence with the plurality of land portions in the step (b), and a support that supports the plurality of probes. And perform the inspection.

  In the present invention, at least one type of inspection instrument selected from the group consisting of mounting inspection or characteristic inspection used in the manufacturing process of the circuit component built-in module can be shared with other circuit component built-in modules. Lower costs and improve productivity.

  In the present invention, “arranged according to a predetermined rule” means that, for example, a plurality of via conductors are arranged so as to draw one or more straight lines with a space between each other, or among four sides of a rectangle A plurality of via conductors are regularly arranged such that they are arranged to draw three sides, arranged to draw a square, staggered, or arranged at almost equal intervals. Means.

  In this invention, a land part means the conductor part for joining joined to a via conductor. The wiring layer includes a plurality of the land portions. The wiring layer may further include at least one of a conductive wire part electrically connected to each land part and the like and a pad electrode joined to an electrode of a circuit component.

  The mounting inspection is an inspection for confirming continuity between the mounted circuit component and the wiring layer. Characteristic inspection is to check the electrical operation of the component parts of the circuit component built-in module and check the characteristics of the component parts, or to check the electrical operation of the temporary module including the component parts. This is an inspection to confirm the characteristics.

  In the circuit component built-in module according to the present invention, when a cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed, a plurality of via conductors draw one or more straight lines at intervals. It is preferable that these are arranged.

  In the circuit component built-in module of the present invention, the planar shape of the electrical insulating layer is rectangular, and when a cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed, a plurality of via conductors are spaced from each other. It is preferable that it is arranged along three sides of the four sides of the rectangle, or arranged so as to draw a square along the four sides of the rectangle.

  In the circuit component built-in module of the present invention, it is preferable that the plurality of via conductors are arranged in a staggered pattern when the cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed.

  In the circuit component built-in module according to the present embodiment, when the cut surface obtained by including a plurality of circuit components and cutting the electric insulating layer in a direction parallel to the main surface is viewed, the electric insulating layer includes a plurality of circuit components. It is preferable to include a first region that is disposed and a second region in which a plurality of via conductors are disposed.

  The circuit component built-in module of the present embodiment includes at least one wiring board, and at least one wiring layer of the pair of wiring layers arranged on both main surfaces of the electrical insulating layer is the wiring board. It may be a wiring layer on one side. The wiring board may have a multilayer wiring structure in which at least one wiring layer is provided in an insulating substrate.

  The circuit component built-in module of the present embodiment includes a pair of wiring boards arranged so as to sandwich the electrical insulating layer, and the linear expansion coefficient in the direction perpendicular to the thickness direction of the wiring board is that of the electrical insulating layer. It is smaller than the linear expansion coefficient in the direction orthogonal to the thickness direction. Further, the Young's modulus of the wiring board is larger than the Young's modulus of the electrical insulating layer. In this circuit component built-in module, one wiring layer of a pair of wiring layers provided on both main surfaces of the electrical insulating layer is a wiring layer of one wiring board, and the other wiring layer is the other wiring layer. It is a wiring layer of a wiring board. When the distance from the center of the surface seen when the cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface to the outline of the surface is L, the distance from the center is 0.7 L. It is preferable that a plurality of via conductors are arranged in the region beyond the above. In the present specification, the Young's modulus is a tensile elastic modulus in a direction orthogonal to the thickness direction.

  In another circuit component built-in module of the present embodiment, at least one wiring board is included, and at least one wiring layer of the pair of wiring layers arranged on both main surfaces of the electrical insulating layer is It may be a wiring layer on one side of the wiring board. The wiring board may have a multilayer wiring structure in which at least one wiring layer is provided in an insulating substrate.

  In the method for manufacturing a circuit component built-in module according to the present embodiment, a first sheet-like material in which a wiring layer including a plurality of land portions is formed on one main surface of a release film or one main surface of an insulating substrate is used. In the step of preparing two and mounting circuit components on at least one of the first sheet-like objects, preferably, a plurality of land portions are formed so as to draw at least one straight line at intervals. To do.

  In the above step, the planar shape of the release film or the insulating substrate is a rectangle, and preferably, a plurality of land portions are formed along three sides of the four sides of the rectangle at intervals. Alternatively, it is formed so as to draw a square along four sides. In the above step, preferably, the plurality of land portions are formed so as to draw a staggered pattern.

  In the method for manufacturing a circuit component built-in module according to the present embodiment, an inspection instrument used in a process of performing at least one type of inspection selected from mounting inspection and characteristic inspection includes a plurality of probes and a support body that supports the probes. The plurality of probes are preferably arranged at substantially equal intervals. The probe is preferably needle-shaped. The probe is preferably elastic. The support that supports the probe preferably has elasticity.

  In the method for manufacturing a circuit component built-in module according to the present embodiment, a first sheet-like material in which a wiring layer including a plurality of land portions is formed on one main surface of a release film or one main surface of an insulating substrate is used. In the step of preparing two and mounting circuit components on at least one of the first sheet-like objects, the first sheet-like object may be a wiring board. Alternatively, it may be a multilayer wiring board in which a wiring layer is provided in an insulating substrate.

  In another method for manufacturing a circuit component built-in module according to the present embodiment, a first sheet shape in which a wiring layer including a plurality of land portions is formed on one main surface of a release film or one main surface of an insulating substrate. In the step of preparing two objects and mounting circuit components on at least one of the first sheet-like objects, the first sheet-like object may be a wiring board. Alternatively, it may be a multilayer wiring board in which a wiring layer is provided in an insulating substrate.

  Hereinafter, an example of a circuit component built-in module of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of the circuit component built-in module of the present embodiment, and FIG. 2 is a cross-sectional view of the circuit component built-in module shown in FIG.

  As shown in FIGS. 1 and 2, the circuit component built-in module 1 according to the present embodiment includes a rectangular electric insulating layer 101 in plan view and a pair of wirings provided on both main surfaces of the electric insulating layer 101. Layers 18 b and 102, a plurality of via conductors 103 electrically connecting the wiring layers 18 b and 102, and a plurality of circuit components 109 embedded in the electrical insulating layer 101 are included. Each via conductor 103 passes through the electrical insulating layer 101 in the thickness direction of the electrical insulating layer 101. In the circuit component built-in module 1, the pair of wiring layers 18 b and 102 are embedded in the electrical insulating layer 101.

  As shown in FIG. 2, the plurality of via conductors 103 have a peripheral portion of the electrical insulating layer 101 when the cut surface obtained by cutting the electrical insulating layer 101 in a direction parallel to the main surface 101 a (see FIG. 1) is viewed. In FIG. 2, the electric insulating layers 101 are arranged along the four sides. The plurality of via conductors 103 are arranged at substantially equal intervals. The wiring layer 18 b shown in FIG. 1 has a plurality of land portions 18 b ′ as shown in FIG. 2, and all the land portions 18 b ′ are joined to the via conductor 103. The wiring layer 102 (see FIG. 1) also has a plurality of land portions at positions corresponding to the plurality of land portions 18b ′.

  The circuit component built-in module 1 includes a wiring board 108 bonded to one main surface of the electrical insulating layer 101. The wiring layer 18 b embedded in the electrical insulating layer 101 is a wiring layer of the wiring board 108. The plurality of circuit components 109 are mounted and integrated on the wiring board 108 before being embedded in the electrical insulating layer 101.

  In the circuit component built-in module 1, in the manufacturing process, after the circuit component 109 is mounted on the wiring board 108 and before the circuit component 109 is embedded in the electrical insulating layer 101, at least one selected from mounting inspection and characteristic inspection is performed. Inspection is performed.

  For example, an inspection instrument 6 as shown in FIG. 3 is used for the mounting inspection. As shown in FIG. 3, the inspection instrument 6 includes a plurality of probes 4 made of conductors, wiring (not shown) for connecting each probe 4 to a power source, and a flat support that supports the plurality of probes 4. It consists of a body 5. The plurality of probes 4 are arranged at substantially equal intervals so as to draw a square when the inspection instrument 6 is viewed in plan, that is, to draw four straight lines. The probe 4 penetrates the support body 5, and an end portion of the probe 4 protrudes from one surface of the support body 5.

  In addition to the circuit component built-in module 1 of the present embodiment, the inspection instrument 6 shown in FIG. 3 includes, for example, a plurality of via conductors 103 and a plurality of land portions 18b ′ (see FIG. 2) of the electrical insulating layer 101. In the peripheral portion, it can also be used to inspect other circuit component built-in modules provided along one side of the four sides, and another circuit component built-in module provided along two sides. Also for the above-described inspection of various circuit component built-in modules having a plurality of via conductors (and land portions) arbitrarily selected from the plurality of via conductors 103 (and land portions 18b ′) shown in FIG. Can be used.

  Thus, the inspection instrument 6 including the regularly arranged probes 4 can be used for the above-described inspection of various circuit component built-in modules. Therefore, the circuit component built-in module 1 can share the various circuit component built-in modules and the inspection instrument 6, thereby realizing cost reduction and productivity improvement.

  Generally, according to the design rule of the circuit component built-in module, the distance between the circuit component and the via conductor is larger than the distance between the circuit component and the circuit component. The distance between the circuit component and the via conductor is, for example, 500 μm, whereas the distance between the circuit component and the circuit component is, for example, 150 μm. Therefore, for example, if the via conductor 103 is disposed between the circuit components 109, the density is hindered and the design is complicated.

  As shown in FIG. 2, in the circuit component built-in module 1, when the cut surface obtained by cutting the electrical insulating layer 101 in a direction parallel to the main surface is viewed, the electrical insulating layer 101 is arranged with a plurality of circuit components 109. Since the first region D is divided into the second region E in which the plurality of via conductors 103 are arranged, the density can be increased. In addition, the difficulty in designing for higher density is reduced. In the present embodiment, the via conductor 103 is not disposed in the first region D, and the via conductor 103 is not disposed between the adjacent circuit components 109. In the second region E, the circuit component 109 is not arranged. The first region D is in the central portion of the electrical insulating layer 101, and the second region E is in the peripheral portion of the electrical insulating layer 101 and surrounds the first region D.

  The electrical insulating layer 101 can be formed from an insulating material such as an insulating resin or a mixture containing a filler and an insulating resin. A reinforcing material such as glass cloth may be further included. As the insulating resin, for example, a thermosetting resin, a thermoplastic resin, a photocurable resin, or the like can be used. If an epoxy resin, a phenol resin, an isocyanate resin, or the like is used, the heat resistance of the electrical insulating layer 101 is increased. Can be increased. Electrical insulation can be achieved by using a fluororesin such as polytetrafluoroethylene (PTFE) with low dielectric loss tangent, polyphenylene oxide (PPO), polyphenylene ether (PPE), a material containing a liquid crystal polymer, or a resin obtained by modifying these resins. The high frequency characteristics of the layer 101 are improved.

When the electrical insulating layer 101 is formed from a mixture containing a filler and an insulating resin, the linear expansion coefficient, thermal conductivity, dielectric constant, etc. of the electrical insulating layer 101 can be adjusted by appropriately selecting the type of filler and insulating resin. Easy to control. As the filler, for example, Al ₂ O ₃ , MgO, SiO ₂ , BN, AlN, Si ₃ N ₄ , “Teflon” (registered trademark) or the like can be used. When Al ₂ O ₃ , BN, or AlN is used, an electrical insulating layer with high thermal conductivity can be manufactured, and the heat dissipation of the electrical insulating layer can be improved. Al ₂ O ₃ has the advantage of low cost. When SiO ₂ , Si ₃ N ₄ , “Teflon” (registered trademark) is used, an electrical insulating layer having a low dielectric constant can be produced. In particular, SiO ₂ having a small specific gravity is suitable for applications such as cellular phones. When BN is used, the linear expansion coefficient can be lowered.

  A dispersant, a colorant, a coupling agent, a release agent, or the like may be further added to the mixture containing the filler and the insulating resin. When the dispersant is added, the dispersibility of the filler in the insulating resin can be improved. If the electrical insulating layer is colored with a colorant, the automatic recognition device can be easily used. When the coupling agent is added, the adhesive strength between the insulating resin and the filler is improved, and the insulating property of the electrical insulating layer 101 can be improved. When a mold release agent is added, the mold release property is improved, so that productivity can be improved.

  The wiring layer 102 is made of a material having electrical conductivity, such as a metal foil or a conductive resin composition. As the metal foil, for example, a copper foil having a thickness of about 3 μm to 35 μm manufactured by an electrolytic plating method can be used. In order to improve the adhesion of the copper foil to the electrical insulating layer 101, it is desirable to roughen the surface in contact with the electrical insulating layer 101. In order to improve adhesion and oxidation resistance, a copper foil surface that has been subjected to a coupling treatment or a copper foil surface that has been plated with tin, zinc, or nickel may be used. The wiring layer 102 may be a metal plate lead frame formed by etching or punching. The wiring layer 102 formed on the release film may be transferred to the electrical insulating layer 101. Couplers, filters, and the like may be formed by using the wiring layer 102 as a predetermined wiring pattern.

  As the material of the via conductor 103, a conductive material, for example, a conductive resin composition in which metal particles and a thermosetting resin are mixed is used. As the metal particles, for example, gold, silver, copper, palladium, nickel, or the like can be used. Gold, silver, copper, nickel, or the like is preferable because of its high conductivity. Copper is particularly preferred because of its high conductivity and low migration. When metal particles in which copper is coated with silver are used, the characteristics of both low migration and high conductivity can be satisfied. As the thermosetting resin, for example, an epoxy resin, a phenol resin, or an isocyanate resin can be used. Epoxy resins are particularly preferred because of their high heat resistance. The via conductor 103 can also be formed by forming a via hole in the electrical insulating layer 101 and then plating.

  The number of via conductors 103 is not particularly limited and is appropriately determined depending on the components mounted on the wiring layer, the circuit configuration, and the like. For example, when a memory is mounted on the wiring layer 102, the number of via conductors 103 is required to be about 8 to 1024, for example, corresponding to the number of pins of the memory.

  The material of the wiring layers 18b and 18c constituting the wiring board 108 is the same as the material of the wiring 102 and the material of the via conductor 18d constituting the wiring board 108, and the formation method is also the same. It is.

  The insulating substrate 18a constituting the wiring board 108 is made of, for example, an insulating resin, a mixture of filler and insulating resin, ceramic, or the like. The insulating substrate 18a may further include a reinforcing material such as a glass cloth. The insulating substrate 18a may be made of the same material as that of the electrical insulating layer 101. When the same material as that of the electrical insulating layer 101 is used as the material of the insulating substrate 18a, characteristics such as the linear expansion coefficient of the insulating substrate 18a are similar to those of the electrical insulating layer 101, and the reliability of electrical connection is improved.

  Examples of the circuit component 109 include passive components 104a to 104c or an active component 106. Examples of the passive components 104a to 104c include a chip capacitor, a chip inductor, a chip resistor, a diode, a thermistor, and a switch. As the active component 106, for example, a semiconductor element such as a transistor, IC, or LSI is used.

  The passive components 104a to 104c are bonded to the wiring layer 18b by the conductive material 105, for example, as shown in FIG. As the conductive material 105, a metal such as gold, copper, or solder, or a conductive adhesive can be used. As the conductive adhesive, for example, gold, silver, copper, silver-palladium alloy or the like kneaded with a thermosetting resin can be used. If high temperature solder is used as the conductive material 105, remelting of the solder during reflow can be prevented. In addition, the use of lead-free solder or the above conductive adhesive can reduce the environmental load.

  The active component 106 may be a package such as a CSP (chip scale package) or a bare chip. For example, as shown in FIG. 1, the active component 106 is bonded to the wiring layer 18 b via the bump 107. After mounting the active component 106, a sealing resin may be injected between the active component 106 and the wiring layer 18b. By injecting the sealing resin, it is possible to suppress a gap from being formed between the active component 106 embedded in the electrical insulating layer 101 and the wiring board 108. As the sealing resin, an underfill resin or the like used for normal flip chip bonding can be used. Examples of the underfill resin include an anisotropic conductive film (ACF) and a nonconductive film (NCF).

  In the example shown in FIGS. 1 and 2, the plurality of via conductors 103 or the second region E exist around the four sides of the electrical insulating layer 101, but the present invention is not limited to this. The plurality of via conductors 103 or the second region E may exist only at least part of the peripheral edge of the electrical insulating layer 101, for example, around one side of the electrical insulating layer 101.

  Further, in the example shown in FIGS. 1 and 2, when the cut surface obtained by cutting the electrical insulating layer 101 in a direction parallel to the main surface is viewed, the plurality of via conductors 103 are squared by four straight lines. As illustrated, the electrodes are arranged at almost equal intervals, but the present invention is not limited to this. For example, as shown in FIGS. 4 and 5, the plurality of via conductors 103 (and land portions 18b ′) may be arranged so as to draw two or more parallel lines spaced apart from each other. For example, as shown in FIG. 6, the plurality of via conductors 103 (and the land portions 18 b ′) may be arranged along three sides of the four sides of the rectangle at intervals. As shown in FIG. 7, they may be arranged in a staggered manner. When the land portions 18b 'are arranged in a staggered manner, it is easy to provide a conductive wire portion that is electrically connected directly to the land portion on the surface of the insulating substrate 18a on which the wiring 18b layer (see FIG. 1) is provided. Further, the plurality of via conductors 103 are not necessarily arranged at equal intervals.

  Further, when the inspection instrument used in the manufacturing process of the circuit component built-in module according to the present embodiment is viewed in plan, the plurality of probes correspond to the plurality of land portions 18b ′ shown in FIGS. They may be arranged so as to draw two or more parallel lines spaced apart from each other. Further, for example, it may be arranged so as to draw three sides of the four sides of the rectangle at intervals from each other so as to correspond to the plurality of land portions 18b ′ shown in FIG. Moreover, it may be staggered so as to correspond to the plurality of land portions 18b ′ shown in FIG.

  In the example shown in FIGS. 4 and 7, the second region E exists along one side of the electrical insulating layer that is rectangular in plan view. In the example shown in FIG. 5, the second region E is rectangular. It exists along two opposite sides of the four sides. In the example illustrated in FIG. 6, the second region E exists along three sides of the four sides of the rectangle. In the example shown in FIGS. 4 to 7, the via conductor 103 is not disposed in the first region D, and the via conductor 103 is not disposed between the adjacent circuit components 109. In the second region E, the circuit component 109 is not arranged.

  In the example shown in FIGS. 2 and 4 to 7, the plurality of land portions 18 b ′ arranged on the peripheral edge portion of the electrical insulating layer 101 are all joined to the via conductor 103, but are not limited thereto. As shown in FIG. 8, it may include at least one non-bonded land portion 182 b ′ that is not bonded to any via conductor of the plurality of via conductors 103 but is used for inspection. A plurality of land portions 18b ′ including a joint land portion 181b ′ joined to each via conductor 103 and the non-joint land portion 182b ′ portion may be arranged to draw at least one straight line, They may be arranged at equal intervals.

  2, FIG. 4 to FIG. 8 show only the plurality of land portions 18b ′ arranged on the peripheral edge portion of the electrical insulating layer 101 for the wiring layer 18b (see FIG. 1), and constitute the wiring layer 18b. The lead wire portion, the pad electrode joined to the electrode of the circuit component, other land portions, etc. are omitted. The other land portion is a land portion joined to the via conductor 18d (see FIG. 1).

  Moreover, there is no restriction | limiting in particular about the number of the circuit components embedded in the electrical insulation layer, and one may be sufficient.

(Embodiment 2)
In the second embodiment, an example of a method for manufacturing the circuit component built-in module according to the first embodiment will be described. The material used in Embodiment 2 is the same as the material described in Embodiment 1. The same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  First, as shown to FIG. 9A, the sheet-like material 30 is shape | molded with the following method from the mixture containing a thermosetting resin and an inorganic filler.

  A mixture slurry containing an inorganic filler, a thermosetting resin, and a solvent for reducing the viscosity is prepared, and this mixture slurry is used to form a film on a releasable film. The film forming method is not particularly limited, and examples thereof include a doctor blade method, a coater method, and an extrusion method. Next, a part of the solvent is removed from the formed mixture slurry.

  Next, a plurality of through holes 31 are formed at predetermined locations of the sheet-like object 30. The through hole 31 can be formed by a method such as a laser processing method using a carbon dioxide laser or an excimer laser, a drill processing method, a punching processing method, or the like. In particular, the laser processing method is preferable because it is simple and has high accuracy. As the laser, a carbon dioxide laser, a YAG laser, an excimer laser, or the like can be used. Next, the conductive resin composition 32 is filled in the through holes 31.

  Next, for example, a copper foil having a thickness of 9 μm is laminated on both surfaces of the sheet-like material 30 at 100 ° C. Subsequently, these are heated and pressurized using a hot press or the like to cure the thermosetting resin contained in the sheet-like material 30 and the conductive resin composition 32. The cured sheet 30 becomes the insulating substrate 18a, and the cured conductive resin composition 32 becomes the via conductor 18d. Thereafter, unnecessary portions are removed from the copper foil to form the wiring layer 18b and the wiring layer 18c. In this way, the first sheet-like material (wiring board 108) in which the wiring layer 18b is formed on the insulating substrate 18a is formed. (See FIG. 9B).

  FIG. 10 is a schematic view of the first sheet (wiring board 108) viewed from the wiring layer 18b side. The wiring 18b includes a plurality of land portions 18b ′, a plurality of pad electrodes 183 joined to the electrodes of the circuit components, a conductor portion (not shown), another land portion (not shown), and the like. ing. The plurality of land portions 18b ′ are formed so as to draw a square at intervals from each other at the peripheral edge portion of one main surface of the insulating substrate 18a. In order to facilitate understanding, the conductor portion and other land portions are omitted in FIG.

  Next, as shown in FIG. 9C, a plurality of circuit components 109 are mounted on the first sheet-like material (wiring board 108). Next, a mounting inspection is performed on the plurality of mounted circuit components 109.

  FIG. 3 shows how the mounting inspection is performed. A wiring board 108 on which a plurality of circuit components (not shown) are mounted is disposed on the support base 7. Next, alignment is performed so that the tips of the probes 4 of the inspection instrument 6 are in contact with the land portions 18b ′. If the end surface of the support 5 of the inspection instrument 6 and the end surface of the support base 7 are aligned, the inspection instrument 6 can be brought close to the support base 7 to easily align the tip of the probe 4 and the land portion 18b ′. it can. Next, a voltage is applied to the wiring board 108 on which a plurality of circuit components are mounted to determine whether or not an electrical connection that satisfies a predetermined condition is made. In FIG. 3, the circuit component 109 (see FIG. 9C) mounted on the wiring board 108 is omitted. Further, in FIG. 3, only the land portion 18b ′ joined to the via conductor in the electrical insulating layer is drawn for the wiring layer 18b (see FIG. 9B).

  The shape of the probe 4 is not particularly limited. For example, as shown in FIG. 11A, a needle shape is preferable. This is because the needle shape is easy to align with the land portion. Further, as shown in FIG. 11B, the probe 4 includes a coiled portion 41a and may have spring-like elasticity. Moreover, the support body 5 shown in FIG. 3 may be formed from the material which has rubber-like elasticity. As described above, if at least one selected from the probe 4 and the support 5 has elasticity, the adjustment of the height direction of the inspection instrument in the inspection can be facilitated, and the productivity can be increased.

  If the length of the end of the probe 4 protruding from the support 5 is made longer than the height of the circuit component 109 (see FIG. 9C) mounted on the wiring board 108, the circuit component 109 is not damaged. It can be performed.

  Next, as shown in FIG. 9D, a second sheet-like object 40 having a plurality of through holes 41 at a predetermined position is formed. The through hole 41 is provided at a position corresponding to the land portion 18b ′ (see FIG. 10). Next, the conductive resin composition 42 is filled into the through holes 41. The 2nd sheet-like object 40 can be formed with the material and method similar to the sheet-like object 30 (refer FIG. 9A), for example. The second sheet 40 can be produced by a method different from the method for forming the sheet 30 (see FIG. 9A). For example, a method in which an insulating material is processed into a pellet and then melted and injected into a mold having a predetermined shape, or a method in which an insulating material is filled in a mold and then melted and molded. Etc., the second sheet-like material 40 can be formed. A transfer mold or an injection mold can be used for the mold. For filling the conductive resin composition 42, a method by printing or injection may be employed.

  On the other hand, as shown to FIG. 9D, the other 1st sheet-like material in which the wiring layer 102 was formed in the peeling film 310 is formed. The land portion that constitutes the wiring layer 102 and is to be joined to the via conductor 103 (see FIG. 9E) is formed at a position corresponding to the land portion 18b ′ (see FIG. 10) of the wiring layer 18b. The wiring layer 102 can be formed by laminating a copper foil on one surface of the release film 310 and then etching an unnecessary portion from the copper foil. The wiring layer 102 may be formed using a method such as printing. In particular, if formed by etching, a fine wiring pattern can be formed. A release layer may be disposed between the wiring layer 102 and the release film 310 to facilitate peeling of the wiring layer 102 from the release film 310. As the release film 310, a resin film such as polyethylene terephthalate (PET) or polyphenylene sulfite (PPS), a metal foil such as a copper foil or an aluminum foil, or the like can be used.

  Next, as shown in FIG. 9D, the wiring board 108 (another first sheet-like material) on which the circuit component 109 is mounted and the release film 310 (the first sheet-like material) on which the wiring layer 102 is formed. Between, the 2nd sheet-like material 40 with which the conductive resin composition 42 was filled is arrange | positioned. Next, these are heated while being pressed in the thickness direction, and the circuit component 109 is embedded in the second sheet-like material 40.

Heating is performed in a temperature atmosphere equal to or higher than the temperature at which the thermosetting resin contained in the second sheet-like material 40 and the conductive resin composition 42 is completely cured. The pressure is preferably performed in the range of ^{50g / mm 2 ~2kg / mm 2} (0.5MPa~20MPa). If pressure is applied within the above range, the second sheet-like material 40, the circuit component 109, and the wiring board 108 can be firmly bonded, and the mechanical strength of the circuit component built-in module can be increased.

  Next, the release film 310 is released from the wiring layer 102. The cured second sheet-like material 40 becomes the electrical insulating layer 101, and the conductive resin composition 42 becomes the via conductor 103 (see FIG. 9E).

(Embodiment 3)
FIG. 12 shows a cross-sectional view of the circuit component built-in module of the present embodiment, and FIG. 13 shows a cross-sectional view of the circuit component built-in module shown in FIG.

  As shown in FIG. 12 and FIG. 13, the circuit component built-in module 2 of the present embodiment includes an electrical insulating layer 201 having a rectangular shape in plan view and a pair of wirings provided on both main surfaces of the electrical insulating layer 201. Layers 28b and 38b, a plurality of via conductors 203 that electrically connect the wiring layers 28b and 38b, and a plurality of circuit components 209 (204a to 204d), 306a, and 304a embedded in the electrical insulating layer 201. It is out. The via conductor 203 penetrates the electrical insulating layer 201 in the thickness direction of the electrical insulating layer 201. In the circuit component built-in module 2, the pair of wiring layers 28 b and 38 b are embedded in the electrical insulating layer 201.

  As shown in FIG. 13, in the circuit component built-in module 2 of the present embodiment, as in the first embodiment, when the cut surface obtained by cutting the electrical insulating layer 201 in a direction parallel to the main surface is viewed, The electrical insulating layer 201 is divided into a first region D in which a plurality of circuit components 209 are arranged and a second region E in which a plurality of via conductors 203 are arranged. The second region E is in the central portion of the electrical insulating layer 201, and the first region D is in the peripheral portion of the electrical insulating layer 101 and surrounds the second region E. The plurality of via conductors 203 penetrating the electrical insulating layer 201 are arranged in the second region E so as to draw a substantially lattice at intervals. The circuit component 209 is not disposed between the adjacent via conductors 203.

  The wiring layer 28 b shown in FIG. 12 has a plurality of land portions 28 b ′ as shown in FIG. 13, and all the land portions 28 b ′ are joined to the via conductor 203.

  In FIG. 13, only the plurality of land portions 28b ′ arranged at the central portion of the electrical insulating layer 201 are shown for the wiring layer 28b (see FIG. 12), and the conductor portion and the circuit constituting the wiring layer 28b are shown. The pad electrode joined to the component electrode, other land portions, and the like are omitted. The other land portion is a land portion joined to the via conductor 28d (see FIG. 12).

  As shown in FIG. 12, the circuit component built-in module 2 includes wiring boards 208 and 308 bonded to the electrical insulating layer 201. The wiring layers 28 b and 38 b embedded in the electrical insulating layer 201 are wiring layers of the wiring boards 208 and 308. The circuit components 209, 306 a, and 304 a are mounted and integrated on the wiring boards 208 and 308 before being embedded in the electrical insulating layer 201. In the circuit component built-in module 2, circuit components 304b to 304d and 306b are also mounted on the surface opposite to the surface of the wiring board 308 on the electric insulating layer 201 side. In FIG. 12, 28a and 38a are insulating substrates, 28d and 38d are via conductors, and 28c and 38c are wiring layers, which constitute wiring boards 208 and 308, respectively.

  In the circuit component built-in module 2, in the manufacturing process, after the circuit components 209, 306a, and 304a are mounted on the wiring boards 208 and 308, respectively, and before the circuit components 209, 306a, and 304a are embedded in the electrical insulating layer 201, At least one type of inspection selected from mounting inspection and characteristic inspection is performed.

  For example, an inspection instrument 6 as shown in FIG. 14 is used for mounting inspection performed on the circuit component 209 mounted on the wiring board 208 and the 306a and 304a mounted on the wiring board 308. The inspection instrument 6 includes a plurality of probes 4 and a flat support 5 that supports the plurality of probes 4. Each probe 4 penetrates the support 5 and its end protrudes from one surface of the support 5. The plurality of probes 4 are arranged at substantially equal intervals so as to draw a substantially lattice when the inspection instrument 6 is viewed in plan.

  In addition to the circuit component built-in module 2 of the present embodiment, the inspection instrument 6 shown in FIG. 14 includes a plurality of via conductors 203 (and land portions 28b ′, see FIG. 13) arranged in 5 rows and 5 columns, for example. It can also be used for testing other circuit component built-in modules including only two of them. In addition, various circuit component built-in modules having via conductors 203 (and land portions 28b ′) arbitrarily selected from the plurality of via conductors 203 (and land portions 28b ′) shown in FIG. 13 are also used. Can be used.

  Thus, the inspection instrument 6 including the regularly arranged probes 4 can be used for inspection of various circuit component built-in modules. Therefore, in the circuit component built-in module 2 of the present embodiment, the various circuit component built-in modules and the inspection instrument 6 can be shared, and cost reduction and productivity improvement can be realized.

  Also, as shown in FIG. 13, the circuit component built-in module 2 of the present embodiment also has an electrical insulating layer 201 and a first region D in which a plurality of circuit components 209 are arranged, as in the first embodiment. The second region E in which the plurality of via conductors 203 are arranged is divided into a high density. In addition, the difficulty in designing for higher density is reduced. In the present embodiment, the circuit component 209 is not disposed in the second region E, and the circuit component 209 is not disposed between the via conductors 203 adjacent to each other. Further, the via conductor 209 is not arranged in the first region D.

  In the example shown in FIG. 12, the wiring boards 208 and 308 have a multilayer wiring structure in which one wiring layer is provided in the insulating substrates 28a and 38a and has three wiring layers. There is no limitation on the number of wiring layers. Increasing the number of wiring layers makes it easy to adapt to complex circuits and route wires.

  Also in the present embodiment, as in the first embodiment, the plurality of via conductors 203 do not necessarily have to be arranged at equal intervals. Each of the pair of wiring layers 28b and 38b may include a non-bonded land portion that is used for inspection although it is not bonded to any via conductor of the plurality of via conductors 203. A plurality of land portions including a bonded land portion bonded to the via conductor 203 and a non-bonded land portion may be arranged in a substantially lattice shape.

(Embodiment 4)
In the fourth embodiment, an example of a method for manufacturing the circuit component built-in module according to the third embodiment will be described. The material used in the fourth embodiment is the same as the material described in the first embodiment. The same members as those in the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  First, the wiring board 208 (first sheet-like material) is produced as follows (see FIG. 15A). The wiring board 208 can be manufactured by a conventionally known method. For example, a sheet-like material having two through holes is formed from a mixture containing a thermosetting resin and an inorganic filler, and the conductive resin composition is filled in each through hole. Next, the sheet-like material filled with the conductive resin composition is laminated so that the wiring layer is disposed between the sheet-like materials to form a laminate. A wiring layer 28b is provided on one surface of the laminate, and a wiring layer 28c is provided on the opposite surface. The two sheet-like materials in which the thermosetting resin is cured by heating become the insulating substrate 28a, and the cured conductive resin composition becomes the via conductor 28d. The wiring board 308 is also produced in the same manner as the wiring board 208.

  FIG. 16 is a schematic view of the wiring board 208 (first sheet-like material) viewed from the wiring layer 28b side. The wiring layer 28b includes a plurality of land portions 28b ′, a plurality of pad electrodes 283 joined to the electrodes of the circuit components, a lead wire portion (not shown), another land portion (not shown), and the like. Has been. The plurality of land portions 28b 'are formed so as to draw a substantially lattice at a distance from each other in the central portion of the insulating substrate 28a. In addition, in order to make an understanding easy, the said conducting wire part, said other land part, etc. are abbreviate | omitted in FIG. As for the wiring layer 38b of the wiring board 308, a land portion is formed at a position corresponding to the land portion 28b ′ (see FIG. 15A).

  Next, as shown in FIG. 15A, the circuit component 209 is mounted on the wiring board 208, and the circuit components 306a and 304a are mounted on the wiring board 308, respectively.

  In parallel with the above, a second sheet-like material 50 in which a plurality of through holes 51 are provided at predetermined positions is formed, and the conductive resin composition 52 is filled into the through holes 51. The through hole 51 is provided at a position corresponding to the land portion 28b ′ (see FIG. 16). The second sheet-like material 50 can be produced by the same material and the same method as the sheet-like material 30 (see FIG. 9A).

  Next, for example, the mounting inspection is performed on the circuit component 209 mounted on the wiring board 208 and the circuit components 306a and 304a mounted on the wiring board 308.

  Next, as shown in FIG. 15A, between the wiring board 208 on which the circuit component 209 is mounted and the wiring board 308 on which the circuit components 304a and 306a are mounted, the conductive resin composition 52 is placed in the through hole 51. The second sheet-like material 50 filled in is disposed. Subsequently, these are heated while being pressurized in the thickness direction, and the circuit components 209, 304 a, and 306 a are embedded in the second sheet material 50, and the second sheet material 50 and the conductive resin composition 52 are embedded in the second sheet material 50. The contained thermosetting resin is cured. The heating and pressure conditions are the same as in the second embodiment. The second sheet-like material 50 cured by heating becomes the electrical insulating layer 201, and the conductive resin composition 52 becomes the via conductor 203 (see FIG. 15B).

  Next, as shown in FIG. 15C, if circuit components 304b to 304d, 306b are mounted on the wiring board 308, the circuit component built-in module 3 is obtained.

  Next, the inspection process will be described. As shown in FIG. 14, a wiring board 208 on which a plurality of circuit components (not shown) are mounted is disposed on the support base 7. Next, alignment is performed so that the tips of the probes 4 of the inspection instrument 6 are in contact with the land portions 28b ′. If the end face of the support 5 of the inspection instrument 6 and the end face of the support base 7 are aligned, the end of the probe 4 and the land portion 28b 'can be easily aligned by bringing the inspection instrument 6 close to the support base 7. . Next, a voltage is applied to the wiring board 208 on which the plurality of circuit components are mounted, and the mounting inspection of the plurality of circuit components is performed. The circuit components 306a and 304a (see FIG. 15A) mounted on the wiring board 308 are similarly inspected for mounting. In FIG. 14, the circuit component 209 (see FIG. 15A) mounted on the wiring board 208 is omitted. Further, in FIG. 14, only the land portion bonded to the via conductor in the electrical insulating layer is drawn for the wiring layer 28b (see FIG. 15A).

  The mounting inspection can be performed using, for example, an inspection instrument 6 as shown in FIG. The inspection instrument 6 shown in FIG. 17 includes a support 5 having rubber-like elasticity and a plurality of probes 4. The probe 4 penetrates the support body 5, and both end portions 4 a and 4 b protrude from the support body 5. In the inspection instrument 6 shown in FIG. 17, since the interval between the adjacent probes 4 is narrow, the alignment with the inspection object is easy. Although FIG. 17 is a cross-sectional view of the inspection instrument 6, hatching is omitted for convenience of illustration.

  The surface on which the circuit component 209 of the wiring board 208 is mounted and the surface on which the circuit components 304a and 306a of the wiring board 308 are mounted are opposed to each other between the wiring board 208 and the wiring board 308 (see FIG. 15A). The inspection instrument 6 shown in FIG. The tips of the end portions 4a and 4b of the probe 4 are brought into contact with the land portions constituting the wiring layers 28b and 38b, respectively. Next, a voltage is applied to the mounting body in which the circuit component 209 is mounted on the wiring board 208 and the mounting body in which the circuit components 304a and 306a are mounted on the wiring board 308, and the mounting inspection of the circuit components 209, 304a and 306a is performed. I do.

  Further, a characteristic inspection can be performed using an inspection instrument as shown in FIG. As shown in FIG. 18, the inspection instrument 6 includes a structure 5 in which circuit components 304 a to 304 d, 306 a, and 306 b are mounted on a wiring board 308, and a plurality of probes joined so as to be electrically connected to the structure 5. 4 is included. The inspection instrument 6 is brought into contact with the land portion 28b ′ (see FIG. 14) and a voltage is applied to check the electrical operation of the temporary module. By checking the electrical operation of the temporary module, the characteristics of the mounting body in which the circuit components are mounted on the wiring board 208 can be inspected.

  That is, as shown in FIGS. 12 and 13, a first circuit system including a first wiring layer 28b and a first circuit component 209 electrically connected to the first wiring layer 28b, and a second wiring A second circuit system including second circuit components 304a to 304d, 306a, and 306b electrically connected to the layer 38b and the second wiring layer 38b; and between the first circuit system and the second circuit system And the plurality of via conductors 203 disposed in the electrical insulation layer 201 and electrically connecting the first circuit system and the second circuit system. In the method for manufacturing the circuit component built-in module including the first wiring layer 28b including the plurality of land portions 28b ′ on the one main surface of the insulating substrate 28a, the first wiring layer is formed. The first circuit component 209 is placed on the insulating substrate 28a. A first step of mounting and a second step of inspecting the characteristics of the first circuit system are included. In the first step, a plurality of land portions 28b ′ are formed in the central portion of one main surface of the insulating substrate 28a according to a predetermined rule. In the second step, an inspection instrument including a structure 5 having the same structure as the second circuit system and a plurality of probes 4 electrically connected to the structure 5 and arranged corresponding to the land portion 28b ′ is used. Perform the above inspection. In the second step, the electrical operation of the temporary module in which the first circuit system and the inspection instrument are electrically connected is checked to inspect the characteristics of the first circuit system. This method for manufacturing a circuit component built-in module can also be applied to a method for manufacturing a circuit component built-in module in which a plurality of via conductors are arranged according to a predetermined rule at the peripheral edge of the electrical insulating layer.

(Embodiment 5)
FIG. 19 is a cross-sectional view of the circuit component built-in module of the present embodiment, and FIG. 20 is a cross-sectional view of the circuit component built-in module shown in FIG.

  As shown in FIGS. 19 and 20, in the circuit component built-in module 3 of the present embodiment, the electrical insulating layer 301 having a rectangular shape in plan view and a pair of wirings provided on both main surfaces of the electrical insulating layer 301 Layers 48b, 58b, a plurality of via conductors 303 electrically connecting the wiring layers 48b, 58b, and a plurality of circuit components 409 (404, 406), 509 (506, 504) embedded in the electrical insulating layer 301 Including. The via conductor 303 penetrates the electrical insulating layer 301 in the thickness direction of the electrical insulating layer 301. In the circuit component built-in module 3, the pair of wiring layers 48 b and 58 b are embedded in the electrical insulating layer 101.

  As shown in FIG. 20, the plurality of via conductors 303 are arranged at the peripheral edge of the electrical insulating layer 301, and a cut surface obtained by cutting the electrical insulating layer 301 in a direction parallel to the main surface 301 a (see FIG. 19). , They are arranged so as to draw a square along the four sides of the electrical insulating layer 301 with a space therebetween. The plurality of via conductors 303 are arranged at substantially equal intervals.

  The wiring layer 48b shown in FIG. 19 has a plurality of land portions 48b ′ as shown in FIG. 20, and each of the land portions 48b ′ is joined to the via conductor 303.

  In FIG. 20, only a plurality of land portions 48b ′ arranged on the peripheral edge portion of the electrical insulating layer 301 are shown for the wiring layer 48b (see FIG. 19), and the conductor portion and circuit components constituting the wiring layer 48b are shown. The pad electrode joined to this electrode and other land portions are omitted. The other land portion is a land portion joined to the via conductor 48d (see FIG. 19) constituting the wiring board 408. The wiring layer 58b (see FIG. 19) also has a plurality of land portions at positions corresponding to the land portions 48b ′.

  As shown in FIG. 19, the circuit component built-in module 3 includes a pair of wiring boards 408 and 508 arranged so as to sandwich the electrical insulating layer 301. The wiring layers 48 b and 58 b embedded in the main surface of the electrical insulating layer 301 are wiring layers of the wiring boards 408 and 508. The circuit components 409 and 509 are mounted and integrated on the wiring boards 408 and 508 before being embedded in the electrical insulating layer 301. In FIG. 19, 48a and 58a are insulating substrates, 48d and 58d are via conductors, 48c and 58c are wiring layers, and constitute wiring boards 408 and 508, respectively.

  Also in the circuit component built-in module 3, as in the first and third embodiments, the inspection instrument used for at least one type of inspection selected from mounting inspection and characteristic inspection can be shared with various circuit component built-in modules. Cost reduction and productivity improvement can be realized.

  As shown in FIG. 20, also in the circuit component built-in module 3, as in the first and third embodiments, the electrical insulating layer 301 is cut in a direction parallel to the main surface 301a (see FIG. 19). When the surface is viewed, the electrical insulating layer 301 is divided into a first region D in which a plurality of circuit components 409 are arranged and a second region E in which a plurality of via conductors 303 are arranged. Higher density is possible, and the difficulty of designing for higher density is also reduced. In the present embodiment, the via conductor 303 is not disposed in the first region D, and the via conductor 303 is not disposed between the adjacent circuit components 409. Further, the circuit component 409 is not disposed in the second region E. The first region D is in the central portion of the electrical insulating layer 301, and the second region E is in the peripheral portion of the electrical insulating layer 301 and surrounds the first region D.

  As shown in FIG. 19, for example, when Young's modulus and linear expansion coefficient of the electrical insulating layer 301 that does not include the reinforcing material and the wiring boards 408 and 508 including the reinforcing material such as glass cloth and aramid nonwoven fabric are compared, the Young's modulus As for the wiring boards 408 and 508, the electrical insulating layer 301 is larger. That is, the wiring boards 408 and 508 have a larger ratio between the stress applied to the cross section and the elongation per unit length than the electrical insulating layer 301. Regarding the linear expansion coefficient in the direction 13 orthogonal to the thickness direction, the electrical insulating layer 301 is larger than the wiring boards 408 and 508. As shown in FIG. 19, in the circuit component built-in module 3 including the pair of wiring boards 408 and 508 arranged so as to sandwich the electrical insulating layer 301, the expansion of the electrical insulating layer 301 in the direction 13 is relatively It is suppressed by the wiring boards 408 and 508 having a large Young's modulus. Therefore, the degree of expansion of the electrical insulating layer 301 in the thickness direction (z-axis direction) 14 is increased. Since the connection between the via conductor 303 and the land portion is weak against the force in the thickness direction 14, the reliability of the electrical connection by the via conductor 303 deteriorates when the degree of expansion in the thickness direction (z-axis direction) 14 increases. This phenomenon is more noticeable in the central portion than in the peripheral portion of the electrical insulating layer 301. The reason is that the side surface of the circuit component built-in module is open. In the circuit component built-in module 3 of the present embodiment, since the plurality of via conductors 303 are arranged at the peripheral edge of the electrical insulating layer 301, the reliability of electrical connection between the wiring layers by the via conductor 303 after reflowing or the like. Is expensive.

  As shown in FIG. 21, the distance from the center O of the surface seen when the cut surface obtained by cutting the electrical insulating layer 301 in a direction parallel to the main surface to the outline of the surface is defined as L. In the circuit component built-in module of the present embodiment, a plurality of via conductors 303 are arranged in a region G where the distance from the center O exceeds 0.7L. Therefore, as shown in the results of Examples described later, the reliability of electrical connection by the via conductor 303 is high. In FIG. 21, circuit components embedded in the electrical insulating layer 301 are omitted.

(Embodiment 6)
In the sixth embodiment, an example of a method for manufacturing the circuit component built-in module 3 of the fifth embodiment will be described with reference to FIGS. 22A-22C to 24A-22B. 22A-22C and FIG. 23, the same members as those in the fifth embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  First, as shown in FIG. 22A, a pair of third sheet-like materials 10 and 11 in which a plurality of wiring layers 48b and 58b are formed on an insulating base material including a plurality of insulating substrates 48a and 58a are produced. To do. The method for producing the third sheet-like materials 10 and 11 is the same as the method for producing the wiring boards 208 and 308 described with reference to FIG. 15A. However, in the present embodiment, the plurality of insulating substrates 48b and 58b are in an integrated state. The material used for manufacturing the third sheet-like materials 10 and 11 is also the same as the material of the wiring boards 208 and 308 described with reference to FIG. 15A.

  FIG. 23 is a reduced plan view of the third sheet 10 viewed from the wiring layer 48b side. 48b is composed of a plurality of land portions 48b ', a pad electrode 483 joined to an electrode of a circuit component, a conductor portion (not shown), another land portion (not shown), and the like. The plurality of land portions 48b 'are formed so as to draw a square at intervals from each other at the peripheral edge portion of one main surface of the insulating substrate 48a. Also on the wiring layer 58b of the third sheet-like material 11, a plurality of land portions are formed at positions corresponding to the land portions 48b ′.

  Next, as shown in FIG. 22A, a plurality of sets of circuit components 409 and 509 are mounted on the third sheet-like material 10 and 11, respectively. Next, a mounting inspection is performed on the plurality of sets of mounted circuit components 409 and 509.

  FIG. 24A and FIG. 24B show how the characteristic inspection is performed. As shown in FIGS. 24A and 24B, the inspection instrument 6 used for the inspection includes a support body 5 having a plurality of openings and a plurality of probes 4 arranged so as to surround each opening. The plurality of probes 4 pass through the support 5 and both end portions 4 a and 4 b protrude from the support 5. The tips of both end portions 4a and 4b are thin.

  After fixing the third sheet-like objects 10 and 11 on which circuit parts (not shown) were mounted to the support bases 71a and 71b, respectively, the third sheet-like objects 10 and 11 were mounted on each other. It arrange | positions so that a surface may be opposed. The inspection instrument 6 is arranged between the third sheet-like materials 10 and 11, and the tip of the end 4a of the probe 4 is placed on the land portion (see FIG. 23) of the wiring layer 48b (see FIG. 22A). The tip of the end portion 4b of the probe 4 is brought into contact with the land portion of FIG. 22A) to form a temporary module. Next, a voltage is applied to the third sheet-like materials 10 and 11 on which the circuit components are mounted, the electrical operation of the temporary module is checked, and the characteristics of the components of the circuit component built-in module 3 are inspected. In FIG. 24A, for convenience of illustration, circuit components and wiring layers mounted on the third sheet-like materials 10 and 11 are omitted.

  In addition, since the thickness of the inspection instrument 6 is thicker than the thickness in which the circuit component 409 and the circuit component 509 are overlapped, damage to the circuit components 409 and 509 due to a collision or the like is suppressed during inspection (FIG. 22A, (See FIG. 24).

  On the other hand, as shown to FIG. 22B, the 4th sheet-like object 60 in which the several through-hole 61 was provided in the predetermined location is formed. The through hole 61 is provided at a position corresponding to the land portion 48b ′ (see FIG. 23). Next, the through hole 61 is filled with the conductive resin composition 62. The fourth sheet-like material 60 is the same as the manufacturing method of the sheet-like material 30 (see FIG. 9A), and the same material is used.

  Next, the 4th sheet-like object 60 with which the conductive resin composition 62 was filled is arrange | positioned between the 3rd sheet-like objects 10 and 11 with which multiple sets of circuit components 409 and 509 were mounted. Next, they are pressurized and heated in the thickness direction. The circuit components 409 and 509 are embedded in the fourth sheet-like material 60, and the thermosetting resin contained in the fourth sheet-like material 60 and the conductive resin composition 62 is cured. In this way, the fifth sheet-like material 12 in which the circuit components 409 and 509 are arranged between the third sheet-like materials 10 and 11 is formed. The heating and pressure conditions are the same as in Embodiment 2 (see FIG. 22C).

  Next, the fifth sheet-like material 12 is cut at a predetermined location (a location where a one-dot chain line is drawn) to separate a plurality of sets of circuit components 409 and 509 for each set. The fifth sheet 12 is cut using a dicer or the like. The cured and cut fourth sheet-like material 60 becomes the electrical insulating layer 301, and the conductive resin composition 62 becomes the via conductor 303 (see FIG. 22C).

  Thus, according to the manufacturing method of the circuit component built-in module of the present embodiment, the circuit component built-in module can be efficiently manufactured.

  Note that each of the circuit component built-in modules according to the first to sixth embodiments includes a wiring board, and the circuit components mounted on the wiring board are inspected, but the present invention is not limited to this. The circuit component built-in module of the present invention does not include a wiring board. In the manufacturing process, a plurality of circuit components are mounted on a release film on which a wiring layer is formed, and after inspection, the circuit components are electrically insulated layers. It may be embedded inside.

  Next, the relationship between the position where the via conductor is formed in the electrical insulating layer and the stability of the electrical connection by the via conductor was examined.

  14 modules each having a planar shape of 10 mm × 10 mm, 30 mm × 30 mm, and 50 mm × 50 mm were produced. The thickness of each module was 1.6 mm.

As the material for the electrical insulating layer, a mixture of 20% by weight of epoxy resin, 80% by weight of SiO ₂ (average particle size of 7 μm or less) and methyl ethyl ketone (MEK) (solvent) is formed into a sheet (thickness: 1.0 mm, epoxy 5 parts by weight of MEK with respect to 100 parts by weight of a mixture of resin and SiO ₂ is contained in the sheet immediately after molding.) As the wiring board, a glass epoxy substrate (FR4) (manufactured by Hitachi Chemical Co., Ltd., MCL-E-67) was used.

  A plurality of through holes having a diameter of 150 μm were formed in the uncured (B stage) electrical insulating layer using a puncher. The through holes were formed at intervals of 0.5 mm from the center O of the electrical insulating layer (see FIG. 21). Next, the conductive paste was filled in the through holes. As the conductive paste, a mixture of 85% by weight of silver-coated copper powder (average particle size 5 μm) and 15% by weight of epoxy resin was used.

  An electric insulating layer filled with a conductive paste was placed between two wiring boards, and these were aligned and overlapped, and heated at a temperature of 180 ° C. for 1 hour while being pressurized at a pressure of 3 MPa. The module was obtained by curing the electrically insulating layer and the conductive paste by heating.

  In addition, the Young's modulus of the electrically insulating layer constituting the obtained module was about 3 GPa. On the other hand, since the wiring board has a structure in which a glass nonwoven fabric is impregnated with an epoxy resin, it is easily understood that the Young's modulus of the wiring board is larger than that of the electrically insulating layer. The Young's modulus of the electrical insulating layer was measured according to JIS K 7162.

  Moreover, since the wiring board has a structure in which a glass nonwoven fabric is impregnated with an epoxy resin, the coefficient of linear expansion in the direction orthogonal to the thickness direction of the wiring board is easily smaller than that of the electrical insulating layer. Understood.

  The obtained three types of modules were subjected to a thermal durability test according to the following method. The resistance value of the via conductor before and after the thermal durability test was measured. The resistance value was measured according to the 4-terminal method. Moreover, one was selected from 14 modules, and the linear expansion coefficient of the direction orthogonal to the thickness was measured about the module according to the following method. These results are shown in FIGS. FIG. 25 shows the results for a 10 mm × 10 mm module, FIG. 26 shows the results for a 30 mm × 30 mm module, and FIG. 27 shows the results for a 50 mm × 50 mm module.

  [Thermal durability test] One cycle operation in which the module is left in an atmosphere of 260 ° C for 10 seconds or longer using a belt-type reflow tester and then left until the surface temperature of the module reaches 25 ° C (room temperature). Was performed 10 times.

  [Linear expansion coefficient] The linear expansion coefficient in the thickness direction of the module was measured using a laser displacement meter (manufactured by FRT, CHR 150N). In order to increase the measurement sensitivity, a copper foil was provided at the measurement location. While increasing the ambient temperature from 25 ° C. to 260 ° C., the amount of change in thickness was measured in increments of 10 ° C. A graph was drawn with the horizontal axis representing the temperature and the vertical axis representing the amount of change, and the linear expansion coefficient was determined from the gradient of the graph at a temperature of 260 ° C.

  In FIG. 25 to FIG. 27, the change rate (%) of the resistance value is based on the resistance value of the via conductor before performing the thermal durability test. For example, the resistance value after performing the thermal durability test is If it is twice the resistance value before the test, the rate of change is 100%. If the rate of change was 100% or less, it was judged that the reliability of electrical connection was good.

  As shown in FIG. 25, in the region where the distance from the center O (see FIG. 21) of the electrical insulating layer exceeded 0.35 cm, the rate of change in the resistance value of the via conductor was 100% or less. That is, when the distance from the center O of the surface seen when the cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface to the outline of the surface is L, the distance from the center O is 0. In the region exceeding .7L, the change rate of the resistance value of the via conductor was 100% or less.

  Similarly, in FIGS. 26 and 27, a region where the distance from the center O exceeds 0.7L (in FIG. 26, a region where the distance from the center O exceeds 1.05 cm, in FIG. 27, a distance from the center O). In the region where the distance exceeds 1.75 cm), the rate of change in the resistance value of the via conductor was 100% or less.

  In the present invention, an inspection instrument used for at least one type of inspection selected from the group consisting of mounting inspection or characteristic inspection can be shared with other circuit component built-in modules, and the circuit can be reduced in cost and productivity. Since the component built-in module can be realized, the circuit component built-in module and the manufacturing method thereof of the present invention are useful.

FIG. 1 is a sectional view showing an example of a circuit component built-in module according to the present invention. AA 'sectional view of the circuit component built-in module shown in FIG. The perspective view explaining the mode of the test | inspection performed in the manufacture process of the circuit component built-in module shown in FIG. Sectional drawing which shows the other example of the circuit component built-in module of this invention Sectional drawing which shows the other example of the circuit component built-in module of this invention Sectional drawing which shows the other example of the circuit component built-in module of this invention Sectional drawing which shows the other example of the circuit component built-in module of this invention Sectional drawing which shows the other example of the circuit component built-in module of this invention Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Schematic of the first sheet-like material shown in FIG. 9B Front view showing an example of a probe Front view showing another example of probe Sectional drawing which shows the other example of the circuit component built-in module of this invention BB 'sectional view of the circuit component built-in module shown in FIG. The perspective view explaining the mode of the test | inspection performed in the manufacture process of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Schematic diagram of the wiring board shown in FIG. 15A Sectional drawing which shows an example of the test | inspection instrument used for an example of the manufacturing method of the circuit component built-in module of this invention Sectional drawing which shows the other example of the test | inspection instrument used for an example of the manufacturing method of the circuit component built-in module of this invention. Sectional drawing which shows the other example of the circuit component built-in module of this invention CC 'sectional drawing of the circuit component built-in module shown in FIG. Sectional drawing which shows the cut surface which cut | disconnected the electric insulation layer which comprises the circuit component built-in module shown in FIG. 19 in the direction parallel to the main surface Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Sectional drawing according to process which shows an example of the manufacturing method of the circuit component built-in module shown in FIG. Reduced plan view of the third sheet-like material shown in FIG. 22A The perspective view explaining the mode of the test | inspection performed in the manufacture process of the circuit component built-in module shown in FIG. Enlarged view of F shown in FIG. 24A A graph showing the relationship between the distance from the center of the electrical insulation layer of the via conductor and the rate of change of linear expansion coefficient and via conductor resistance A graph showing the relationship between the distance from the center of the electrical insulation layer of the via conductor and the rate of change of linear expansion coefficient and via conductor resistance A graph showing the relationship between the distance from the center of the electrical insulation layer of the via conductor and the rate of change of linear expansion coefficient and via conductor resistance

Explanation of symbols

101, 201, 301 Electrical insulation layer 18b, 28b, 38b, 48b, 58b Wiring layer 109, 104a-104c, 106, 209, 204a-204d, 409, 404, 406, 304a-304d, 306a, 306b, 509, 504 , 506 Circuit component 103, 203, 303 Via conductor 6 Inspection jig 4 Probe 5 Support body D First region E Second region

Claims (26)

An electrical insulation layer;
A pair of wiring layers provided on both main surfaces of the electrical insulating layer;
A plurality of via conductors that electrically connect the pair of wiring layers and penetrate the electrical insulation layer in a thickness direction of the electrical insulation layer;
Circuit components embedded inside the electrical insulating layer,
The circuit component built-in module, wherein the plurality of via conductors are arranged in accordance with a predetermined rule on at least a part of a peripheral portion of the electrical insulating layer.   The plurality of via conductors are arranged so as to draw one or more straight lines spaced apart from each other when a cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed. Item 2. The circuit component built-in module according to Item 1.   The planar shape of the electrical insulating layer is rectangular, and when the cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed, the plurality of via conductors are spaced apart from each other, and the rectangular shape The circuit component built-in module according to claim 1, which is arranged along three of the four sides.   The planar shape of the electrical insulating layer is rectangular, and when the cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed, the plurality of via conductors are spaced apart from each other, and the rectangular shape The module with a built-in circuit component according to claim 1, wherein the module is arranged so as to draw a square along the four sides.   2. The circuit component built-in module according to claim 1, wherein the plurality of via conductors are arranged in a staggered pattern when a cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed.   The electrical insulation layer includes a plurality of the circuit components, and the electrical insulation layer is a first region in which the plurality of circuit components are disposed when a cut surface obtained by cutting the electrical insulation layer in a direction parallel to the main surface is viewed. The circuit component built-in module according to claim 1, further comprising: a second region in which the plurality of via conductors are arranged.   7. The wiring board according to claim 1, wherein at least one wiring layer of the pair of wiring layers including at least one wiring board and provided on both main surfaces of the electrical insulating layer is a wiring layer of the wiring board. The circuit component built-in module according to any one of the items.   The circuit component built-in module according to claim 7, wherein the wiring board has a multilayer wiring structure in which at least one wiring layer is provided in an insulating substrate. Including a pair of wiring boards arranged to sandwich the electrical insulating layer;
The linear expansion coefficient in the direction orthogonal to the thickness direction of the wiring board is smaller than the linear expansion coefficient in the direction orthogonal to the thickness direction of the electrical insulating layer,
The Young's modulus of the wiring board is larger than the Young's modulus of the electrical insulating layer,
One wiring layer of the pair of wiring layers provided on both main surfaces of the electrical insulating layer is a wiring layer of one wiring board, and the other wiring layer is a wiring layer of the other wiring board. And
When the distance from the center of the surface seen when the cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface to the outline of the surface is L, the distance from the center is 0.7L. The circuit component built-in module according to any one of claims 1 to 8, wherein the plurality of via conductors are disposed in a region beyond the distance. An electrical insulation layer;
A pair of wiring layers provided on both main surfaces of the electrical insulating layer;
A plurality of via conductors that electrically connect the pair of wiring layers and penetrate the electrical insulation layer in a thickness direction of the electrical insulation layer;
Circuit components embedded inside the electrical insulating layer,
The electrical insulating layer includes a first region where the circuit components are disposed and the plurality of via conductors when the cut surface obtained by cutting the electrical insulating layer in a direction parallel to the main surface is viewed. A second region,
The module with a built-in circuit component, wherein the plurality of via conductors are arranged in the second region so as to draw a substantially lattice with a space between each other.   11. The wiring layer according to claim 10, comprising at least one wiring board, wherein at least one wiring layer of the pair of wiring layers disposed on both main surfaces of the electrical insulating layer is a wiring layer of the wiring board. Module with built-in circuit components.   The circuit component built-in module according to claim 11, wherein the wiring board has a multilayer wiring structure in which at least one wiring layer is provided in an insulating substrate. (A) Two first sheet-like materials having a wiring layer including a plurality of land portions formed on one main surface of a release film or one main surface of an insulating substrate are prepared, and at least one of the first Mounting circuit components on one sheet-like material;
(B) a step of performing at least one type of inspection selected from mounting inspection and characteristic inspection;
(C) Processing the electrically insulating material into a second sheet-like material in which a plurality of through holes are formed at predetermined positions, filling the through-holes with a conductive material, and the first sheet-like material. The second sheet-like material filled with the conductive material is disposed between the first sheet-like materials so that the surface on which the circuit component is mounted faces the second sheet-like material side. And pressurizing and heating them in the thickness direction, and embedding the circuit component in the second sheet-like material,
In the step (a), the plurality of land portions are formed on a peripheral portion of one main surface of the release film or a peripheral portion of one main surface of the insulating substrate according to a predetermined rule.
In the step (b), a circuit component built-in module that performs the inspection using an inspection instrument that includes a plurality of probes arranged corresponding to the plurality of land portions and a support that supports the plurality of probes. Manufacturing method.   The method for manufacturing a circuit component built-in module according to claim 13, wherein in the step (a), the plurality of land portions are formed so as to draw at least one straight line at intervals.   In the step (a), the planar shape of the release film or the insulating substrate is a rectangle, and the plurality of land portions are formed along three sides of the four sides of the rectangle at intervals. Item 14. A method for manufacturing a circuit component built-in module according to Item 13.   In the step (a), the planar shape of the release film or the insulating substrate is a rectangle, and the plurality of land portions are formed so as to draw a square along the four sides of the rectangle at intervals. Item 14. A method for manufacturing a circuit component built-in module according to Item 13.   The method for manufacturing a circuit component built-in module according to claim 13, wherein in the step (a), the plurality of land portions are alternately formed so as to draw a staggered pattern.   The method for manufacturing a circuit component built-in module according to claim 13, wherein the plurality of probes are arranged at substantially equal intervals.   The method for manufacturing a circuit component built-in module according to claim 13, wherein the probe has a needle shape.   The method for manufacturing a circuit component built-in module according to any one of claims 13 to 19, wherein the probe has elasticity.   The method for manufacturing a circuit component built-in module according to any one of claims 13 to 20, wherein the support has elasticity.   The method for manufacturing a circuit component built-in module according to any one of claims 13 to 21, wherein the first sheet-like material is a wiring board.   The method of manufacturing a circuit component built-in module according to any one of claims 13 to 21, wherein the first sheet-like material is a multilayer wiring board in which a wiring layer is provided in the insulating substrate. (A) Two first sheet-like materials having a wiring layer including a plurality of land portions formed on one main surface of a release film or one main surface of an insulating substrate are prepared, and at least one of the first Mounting circuit components on one sheet-like material;
(B) a step of performing at least one type of inspection selected from mounting inspection and characteristic inspection;
(C) Processing the electrically insulating material into a second sheet-like material in which a plurality of through holes are formed at predetermined positions, filling the through-holes with a conductive material, and the first sheet-like material. The second sheet-like material filled with the conductive material is disposed between the first sheet-like materials so that the surface on which the circuit component is mounted faces the second sheet-like material side. And pressurizing and heating them in the thickness direction, and embedding the circuit component in the second sheet-like material,
In the step (a), the plurality of land portions are formed on one main surface of the release film or one main surface of the insulating substrate so as to draw a substantially lattice with a space between each other,
In the step (b), a circuit component built-in module that performs the inspection using an inspection instrument that includes a plurality of probes arranged corresponding to the plurality of land portions and a support that supports the plurality of probes. Manufacturing method.   The method for manufacturing a module with a built-in circuit component according to claim 24, wherein the first sheet-like material is a wiring board. 25. The method for manufacturing a circuit component built-in module according to claim 24, wherein the first sheet-like material is a multilayer wiring board in which a wiring layer is provided in the insulating substrate.

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