JP2001119147A - Multilayer board incorporating electronic device and production method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To further increase the mounting area of electronic device three- dimensionally by contriving a method for making thin a multilayer board and to mount electronic devices at high density. SOLUTION: The multilayer board incorporating electronic devices comprises electronic devices 3A, 3B, boards 1A, 1B mounting the electronic devices 3A, 3B, prepregs 4, 5 laminated on the mounting boards 1A, 1B while sealing the electronic devices 3A, 3B, and an inner layer wiring board 2 laminated on the prepregs 4, 5 while being connected electrically with the mounting boards 1A, 1B. Under state of an inter-board insulating member, the prepregs 4, 5 are provided with containing regions 4A, 5A of substantially the same size as the electronic devices 3A, 3B. Under a state where the electronic devices 3A, 3B are inserted into the containing regions 4A, 5A, the mounting boards 1A, 1B and the wiring circuit board 2 are hot pressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device (LSI), a multi-layer substrate with built-in electronic components suitable for application to a portable terminal device in which resistors, capacitors and the like are mounted at high density, and a method of manufacturing the same. For details,
A circuit board on which electronic components such as resistors and capacitors are mounted;
In the step of applying heat and pressure to the wiring circuit board for the inner layer, the electronic component is sealed so that the insulating member for the board is wrapped around every corner of these electronic components, and the mounting area of the electronic component is further laminated. In addition to being able to increase three-dimensionally in the direction, electronic components can be mounted at a high density.

[0002]

2. Description of the Related Art In recent years, a portable terminal device such as a portable telephone or a portable personal computer has been used in a bare chip semiconductor integrated circuit device (hereinafter simply referred to as an LSI chip).
Has come to be used. On this type of mounting board, a plurality of LSI chips are arranged in a plane on one side of the mounting board without molding individual LSI chips, and electronic components such as resistors and capacitors are mounted on the other side. Has been implemented.

[0003]

According to the conventional electronic component mounting board, electronic components are arranged side by side in a plane. It has reached its limits. Therefore, it has become impossible to satisfy the recent demand for miniaturization of printed wiring boards, that is, miniaturization of electronic devices.

In order to solve this kind of problem, Japanese Patent Laid-Open Publication No. 2-164096 discloses a "multilayer electronic circuit board and a method for manufacturing the same", in which circuit elements constituting an electronic circuit are placed between layers of a printed wiring board. It describes that the electronic circuit is built-in to achieve high-density mounting of electronic circuits. Also, Japanese Patent Application Laid-Open No. 5-343
Japanese Patent Publication No. 856 discloses "Multilayer Printed Wiring Board and Manufacturing Method Thereof", in which a hybrid module constituting an electronic circuit or the like is sandwiched between printed wiring boards to mount electronic circuits or the like at high density.

[0005] Further, in the "multilayer high-density mounting module" disclosed in JP-A-3-14293, when a printed wiring board having an electronic circuit or the like embedded in an intermediate layer is laminated, platinum or palladium is applied to a surface in contact with a solder bump. It is described that plating is performed. Each of the technical documents adopts a structure in which an electronic component is sealed with an insulating member between substrates, flattened and laminated. Sealing and flattening with an insulating member increases the number of steps and hinders further high-density mounting of electronic components.

In view of the above, the present invention has solved such a conventional problem. By devising a method for reducing the thickness of the multilayer circuit board, the mounting area of a further electronic component is three-dimensionally increased in the stacking direction. It is an object of the present invention to provide a multilayer board with a built-in electronic component and a method for manufacturing the same, in which the electronic component can be mounted at a high density.

[0007]

An object of the present invention is to provide an electronic component, an electronic component mounting substrate on which the electronic component is mounted, and an inter-substrate insulation that is laminated on the electronic component mounting substrate and encapsulates the electronic component. And a wiring circuit board laminated on the inter-substrate insulating layer and electrically connected to the electronic component mounting board, and the inter-substrate insulating layer is previously provided on the inter-substrate insulating member by the size of the electronic component. The electronic component mounting substrate and the printed circuit board are heat-pressed in a state where the electronic component is inserted into the storage region. You.

According to the electronic component built-in multilayer board of the present invention, in the step of applying heat to the electronic component mounting board and the wiring circuit board, the insulating material for the board is spread around every corner of the electronic component. Electronic components can be encapsulated. Therefore, it is possible to three-dimensionally increase the mounting area of the electronic component in the stacking direction and to perform the high-density mounting of the electronic component.

A method of manufacturing a multilayer board with built-in electronic components according to the present invention has a process of mounting an electronic component on a circuit board to form an electronic component mounting board, and a storage area substantially equal to the size of the electronic component. A step of forming an insulating member for inter-substrate, a step of aligning the storage area with the electronic component, and a step of laminating the insulating member for inter-substrate on the electronic component mounting board; The method includes a step of laminating a printed circuit board thereon, and a step of applying heat and pressure to the electronic component mounting board, the insulating member between the boards, and the printed circuit board to bond them.

According to the method of manufacturing a multilayer board with built-in electronic components according to the present invention, an insulating member for inter-substrate can be provided around every corner of the electronic components on the electronic component mounting board.
The electronic component can be sealed between the electronic component mounting board and the printed circuit board with good reproducibility. Therefore, it is possible to reduce the number of processes, to further increase the mounting area of the electronic component three-dimensionally in the stacking direction, and to perform high-density mounting of the electronic component.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a multilayer substrate with a built-in electronic component and a method of manufacturing the same according to the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view illustrating a configuration example of a multilayer board with built-in electronic components as an embodiment. In this embodiment, in the step of applying heat and pressure to a circuit board on which electronic components such as an LSI, a resistor, and a capacitor are mounted and a wiring circuit board for an inner layer, an insulating member for the board is provided at every corner of these electronic components. An electronic component is sealed so as to be wrapped around, so that the mounting area of a further electronic component can be three-dimensionally increased in the stacking direction, and the electronic component can be mounted at a high density.

The electronic component built-in multilayer substrate 100 shown in FIG. 1 is a device on which electronic components 3A and 3B such as a semiconductor integrated circuit device (LSI) and resistors and capacitors are mounted at a high density. The electronic components 3A and 3B have a thickness of about several hundred μm.
The thickness of the electronic component built-in multilayer substrate 100 is t0, and the thickness t0 is 1 m depending on the number of electronic components 3A and 3B stacked.
It is about m to several mm.

In the example of the multilayer board 100 with a built-in electronic component shown in FIG. 1, an electronic component mounting board 1A having a thickness t1 on one surface of which an electronic component 3A is mounted is a prepreg (multilayer bonding prepreg) as an inter-substrate insulating layer. The electronic component mounting board 1 </ b> A and the inner wiring board 2 are bonded by the prepreg 4 while being laminated on one surface of the inner wiring board 2 having a thickness t <b> 2 as a printed circuit board with the layer 4 interposed therebetween.

In this example, the other surface of the inner wiring board 2 has a similar thickness with another prepreg 5 interposed therebetween,
The other electronic component mounting board 1B is laminated, and the electronic component mounting board 1B and the inner layer wiring board 2 are bonded by the prepreg (layer) 5, and between the electronic component mounting board 1A and the inner layer wiring board 2, Between the inner wiring board 2 and the electronic component mounting board 1B, inter-board wiring members 7, 8 as conductive members are provided so as to penetrate the respective prepregs 4, 5, and the inter-board wiring members 7, 8 are provided. 8 form a multilayer structure electrically connected.

Here, the multilayer means a layer on which a wiring pattern is formed. In this example, the multilayer board 100 with a built-in electronic component is 6
It has a layered structure. The prepregs 4 and 5 are made of glass cloth impregnated with an epoxy resin or a polyimide resin material. Copper, silver, or the like is used for the inter-substrate wiring members 7 and 8.

In this example, the prepreg 4 is provided with a storage area having a depth substantially equal to the thickness thereof in a state of an insulating material between the substrates in the heat pressing step, and the electronic component 3A is inserted into the storage area. Thus, the electronic component mounting board 1A and the inner wiring board 2 are thermally deformed in a self-aligned manner by being thermally pressed. In the state of the insulating material, the prepreg 5 is also provided with a storage area having a depth substantially equal to the thickness thereof. When the electronic component 3B is inserted into the storage area, the electronic component mounting board 1B and the inner layer wiring board 2 are heated. It is thermally deformed in a self-aligned manner by being pressed.

As described above, according to the electronic component built-in multilayer board 100 of the present embodiment, the electronic component mounting board 1A,
In the step of applying heat to the internal wiring board 2 by pressing the electronic components 3A and 3B, the electronic components 3A and 3B can be sealed so that the prepregs 4 and 5 are wrapped around the corners of the electronic components 3A and 3B. Therefore, the mounting area of the electronic components 3A and 3B can be three-dimensionally increased in the stacking direction, and the electronic components 3A and 3B can be mounted at a high density. Thus, more electronic components 3A and 3B can be mounted, and at the same time, the size of the multilayer substrate 100 with built-in electronic components can be reduced, and the electronic device to which the electronic component is applied can be reduced in size and multifunctional. .

Next, a description will be given of a method of manufacturing the multilayer board 100 with a built-in electronic component. FIG. 2A, FIG. 2B, FIG. 3A and FIG.
FIG. 10 is a process cross-sectional view showing a forming example (Nos. 1 and 2) of No. 00;
FIG. 4 is an image diagram showing an operation inspection example of the electronic component mounting board 1 when the electronic component built-in multilayer board 100 is formed. FIG. 5 is a process sectional view showing an example (part 3) of forming the electronic component built-in multilayer substrate 100.

In this example, the two electronic components 3 shown in FIG.
A, 3B mounted multilayer board 1 with built-in electronic components of 6-layer structure
Assume that 00 is formed. For example, a case where the electronic component built-in multilayer substrate 100 in which the electronic component mounting substrate 1A, the prepreg 4, the inner layer wiring substrate 2, the prepreg 5, and the electronic component mounting substrate 1B are sequentially laminated is formed. For the electronic component 3, a flip-chip type LSI having a plurality of bump electrodes 9A, 9B and the like provided on the back surface is used.
As an example, a case where a wiring pattern or the like is formed in advance is used.

On the premise of this, first, a circuit board 1 for mounting electronic components shown in FIG. 2A is prepared. As the circuit board 1, one having copper foils 11A and 11B on both sides of an insulating material 18, for example, a glass cloth base epoxy resin copper-clad laminate (FR-4) or the like is used. This substrate is processed to form a predetermined wiring pattern, a round electrode, and the like, thereby completing the circuit substrate 1.

For example, a resist material is applied to one of the copper foils 11A of the substrate, and then the resist material is exposed using a reticle (eg, a negative film or a dry plate) shaped like a wiring pattern or a round electrode. Thereafter, the copper foil 11 is etched using the resist film as a mask to form a wiring pattern, a round electrode, a chip mounting electrode, and the like. Desired wiring patterns, round electrodes, and the like are also formed on the other copper foil 11B.

Also, electrodes for operation inspection are drawn from the circuit board 1. The operation test electrode is used for applying a test voltage, supplying test data, and extracting data as a result. A terminal may be provided as a dedicated test electrode, but from the viewpoint of minimizing the number of terminals, an electrode connected to the original signal input line or signal output line, for example, as a wiring member to another circuit board, A through-hole is formed in the round electrode, and a conductive member 1 is formed inside the through-hole.
Fill 2 The conductive member 12 is also used as an operation inspection electrode. For the conductive member 12, copper,
Silver or the like is used. Of course, the conductive material 12 is not limited to these types. As the double-sided copper foil substrate as the circuit board 1, a polyimide resin copper-clad laminate or a bismaleimide-triazine (BT resin) resin copper-clad laminate may be used in addition to the epoxy resin. These substrates are excellent in heat resistance and dimensional stability.

Thereafter, the electronic component 3 is mounted on the circuit board 1 shown in FIG. 2B to form the electronic component mounting substrate 1. The electronic component 3 has a plurality of bump electrodes 9A, 9
B is electrically and structurally joined after the position of the chip mounting electrode (not shown) provided on the surface of the electronic component mounting board 1A is aligned. The above-described conductive material 1
The order of filling 2 and connecting the electronic component 3 may be reversed. Two electronic component mounting boards A and B are formed.

On the other hand, at predetermined positions of the inner wiring board 2 shown in FIG. 3A, that is, at positions where input / output points of signal lines to the electronic component mounting board 1 are provided, predetermined wiring members 7 and 8 are provided as inter-board wiring members. A metallic convex protrusion having a length is formed. Regarding the inter-substrate wiring members 7 and 8, first, a through hole is formed in a round electrode or the like, and the through hole is filled with a conductive member such as silver or gold. It is formed so as to protrude. At this time, an electroplating method or the like may be applied. It is sufficient that the length of the protruding portion has such a degree as to penetrate the prepregs 4 and 5 as an insulating material between the substrates. The protrusion is also used as an electrode for inspecting conduction of the inner wiring board 2. Of course, this projection may be provided on the electronic component mounting board side.

Thereafter, a prepreg 4 having a storage area 4A substantially equal in size to the electronic component 3 and having a film thickness of about several hundred μm.
Is laminated on one surface of the inner wiring substrate 2, and a prepreg 5 having a storage area 5 </ b> A and having a thickness of about several hundred μm is laminated on the other surface of the inner wiring substrate 2. At this time, they are laminated so as to penetrate the prepregs 4 and 5 by the projections of the inter-board wiring members 7 and 8. As a result, the inner wiring board 2 having the prepregs 4 and 5 on both surfaces shown in FIG. 3B can be formed.

After the electronic component mounting board 1 and the inner wiring board 2 are formed, before the electronic component mounting board 1 and the inner wiring board 2 are overlapped, the electronic component mounting is performed by the IC tester 10 shown in FIG. An electrical inspection is performed for each substrate. In this example, one electronic component mounting board 1 can be handled as one circuit block, and when a failure occurs in the electronic component mounting board 1 after mounting the electronic component built-in multilayer board 100, the failure is determined. Only the raised electronic component mounting board 1 can be replaced, and maintenance and repair thereof are facilitated.

In this example, a plurality of conductive members 12 and the like exposed on the electronic component mounting board 1 are used as the electrodes for operation inspection. The probes 13 and 14 of the IC tester 10 are simultaneously brought into contact with the conductive member 12, and a local mounting test is performed for each circuit block. Of course, for this mounting test, test data created in advance exclusively for the electronic component mounting board 1 or the like is used. In this example, the inner wiring board 2
Since no active element is mounted on the substrate, the probes 13 and 14 are brought into contact with the inter-board wiring members 7 and 8 (not shown), and only the continuity test is performed.

Therefore, before the electronic component mounting board 1 and the inner wiring board 2 are stacked, defects of the electronic component mounting board 1 can be removed at an early stage. Only the electronic component mounting board 1 and the inner wiring board 2 determined to be non-defective in this inspection result can be laminated with the prepregs 4 and 5 interposed therebetween. The production yield of the electronic component built-in multilayer substrate 100 can be improved as compared with the case where the electrical inspection is performed after the electronic component mounting substrate 1 and the inner layer wiring substrate 2 are all stacked.

Thereafter, as shown in FIG. 5, the electronic component 3A of the electronic component mounting board 1A and the storage area 4A of the prepreg 4 are provided.
And the inter-board wiring member 7 from the inner layer wiring board 2 and the round electrode such as the electronic component mounting board 1A are aligned. In addition, the electronic component 3B of the electronic component mounting board 1B and the storage area 5A of the prepreg 5 are aligned, and the inter-board wiring member 8 from the inner wiring board 2 and the round electrode of the electronic component mounting board 1B are aligned. I do.

The prepreg 4 is sandwiched between the electronic component mounting board 1A and the inner wiring board 2, and the prepreg 5 is sandwiched between the inner wiring board 2 and the electronic component mounting board 1B. And heat and pressure bonding. Regarding the bonding process at this time, the electronic component mounting board 1
A, 1B, the inner wiring board 2, and the prepregs 4, 5 are press-bonded by the same heat treatment process. For example, a laminate composed of the electronic component mounting board 1A, the prepreg 4, the inner layer wiring board 2, the prepreg 5, and the electronic component mounting board 1B is divided into 17 layers.
Heat at about 0 ° C. Then, the laminate is pressed to about 40 kg / cm ² by a vacuum press or the like.

As a result, the electronic component mounting board 1A and the inner wiring board 2 are structurally joined by the prepreg 4.
The electronic component mounting board 1 </ b> A and the inner wiring board 2 are electrically joined by crushing the metal constituting the inter-board wiring member 7. At the same time, the inner wiring board 2 and the electronic component mounting board 1
B are joined in a self-aligned manner by the prepreg 5, and the inner layer wiring board 2 and the electronic component mounting board 1 </ b> B are electrically joined by crushing the metal forming the inter-board wiring member 8.

The stress caused by the pressurized thermal bonding process during the lamination of the substrates causes the prepreg 4 to forcibly wrap around the corners of the electronic component 3A under the electronic component mounting substrate 1A, and at the same time, mount the electronic component. The prepreg 5 works so as to forcibly wrap around the corners of the electronic component 3B on the substrate 1B. Accordingly, the substrates are electrically connected to each other, and the respective members are thermally joined in a self-aligned manner, so that the electronic component built-in multilayer substrate 100 shown in FIG. 1 can be formed. On the outer surface of the electronic component built-in multilayer substrate 100 thus obtained,
Components such as a capacitor are further mounted.

As described above, according to the method for manufacturing a multilayer board with built-in electronic components according to the present embodiment, the electronic component mounting board 1
A, 1B prepreg 4, in every corner of electronic components 3A, 3B
5, the electronic component 3A is sealed between the electronic component mounting board 1A and the inner wiring board 2 with good reproducibility, and the gap between the electronic component mounting board 1B and the inner wiring board 2 is increased. The electronic component 3B can be sealed with good reproducibility.

According to the results of the simulation of the substrate area by the present inventors, when five LSIs are surface-mounted on a mounting substrate on a plane (current CSP: Chip Size Packa).
Compared with the conventional method using ge), the method of the present invention in which five LSIs are built in the substrate is 40 to 50% of the conventional method.
It has been clarified that the size can be reduced. Therefore, it is possible to three-dimensionally increase the mounting area of the electronic component in the stacking direction and to perform the high-density mounting of the electronic component.

[0035]

As described above, according to the multilayer board with built-in electronic component according to the present invention, the multilayer board including the electronic component mounting board, the inter-substrate insulating layer and the wiring circuit board has a laminated structure. Is provided in advance with a storage area substantially equal to the size of the electronic component in the insulating member between the boards, and the electronic component mounting board and the printed circuit board are heated and pressed with the electronic component inserted in the storage area. It consists of With this configuration, in the step of applying heat to the electronic component mounting board and the printed circuit board, the electronic component can be sealed such that the insulating member for the board is wrapped around every corner of the electronic component. Therefore, it is possible to three-dimensionally increase the mounting area of the electronic component in the stacking direction and to perform the high-density mounting of the electronic component.

According to the method of manufacturing a multilayer board with a built-in electronic component according to the present invention, an insulating member between boards having a storage area substantially equal to the size of the electronic component is formed. The insulating member for the board and the wiring circuit board are sequentially laminated on the electronic component mounting board by aligning with the electronic component mounting board, and then the electronic component mounting board, the insulating member for the board and the wiring circuit board are thermally pressed. It is made to stick. With this configuration, the insulating member for the board can be wrapped around every corner of the electronic component on the electronic component mounting board, so that the electronic component is sealed with good reproducibility between the electronic component mounting board and the printed circuit board. Can be included. This invention is L
It is extremely suitable to be applied to a portable terminal device or the like on which an SI, a resistor, a capacitor, and the like are mounted at a high density.

[Brief description of the drawings]

FIG. 1 is a multilayer board 100 with a built-in electronic component as an embodiment.
It is sectional drawing which shows the structural example of.

FIGS. 2A and 2B are process cross-sectional views illustrating an example (part 1) of forming a multilayer board 100 with a built-in electronic component as an embodiment.

3A and 3B are process cross-sectional views illustrating an example (part 2) of forming the electronic component-embedded multilayer substrate 100 as an embodiment.

FIG. 4 is an image diagram showing an operation inspection example of the electronic component mounting board 1 when the electronic component built-in multilayer board 100 is formed.

FIG. 5 is a multilayer board 100 with a built-in electronic component as an embodiment.
It is sectional drawing which shows the example of formation (No. 3).

[Explanation of symbols]

1, 1A, 1B ... electronic component mounting board (circuit board),
2 ... Inner wiring board (wiring circuit board), 3A, 3B
..Electronic components, 4,5 ... prepreg (insulating layer between substrates, insulating material), 7,8 ... Wiring member between substrates (conductive member), 100 ... Multilayer substrate with built-in electronic components

Claims (7)

[Claims] 1. An electronic component, an electronic component mounting board on which the electronic component is mounted, an inter-substrate insulating layer stacked on the electronic component mounting board and enclosing the electronic component, and the inter-substrate insulating layer And a wiring circuit board electrically connected to the electronic component mounting board, wherein the inter-substrate insulating layer is a storage area that is approximately equal to the size of the electronic component in the insulating member between the boards in advance. Wherein the electronic component mounting board and the printed circuit board are heat-pressed while the electronic component is inserted into the storage area. A step of mounting the electronic component on a circuit board to form an electronic component mounting board; and a step of forming an inter-substrate insulating member having a storage area substantially equal to the size of the electronic component. A step of aligning the storage area and the electronic component and laminating the insulating member for inter-substrate on the electronic component mounting board; and a step of laminating a printed circuit board on the insulating member for inter-substrate. Bonding the electronic component mounting board, the insulating member between the boards, and the printed circuit board by applying heat and pressure. 3. A protruding metallic projection having a length that penetrates the insulating member between the substrates is formed at a predetermined position on the printed circuit board or the electronic component mounting board in advance. The electronic component mounting board and the printed circuit board are electrically connected by deformation of the projections in the mounting substrate, the insulating member for the board and the printed circuit board by the heat pressing process. A method for manufacturing the multilayer board with a built-in electronic component according to claim 2. 4. An insulating member for inter-substrate is wrapped around every corner of an electronic component on the electronic component mounting substrate by utilizing a stress caused by deformation of the projecting portion. 5. The method for manufacturing a multilayer board with a built-in electronic component according to claim 1. 5. The multi-layer board with a built-in electronic component according to claim 2, wherein the electronic component mounting board, the insulating member between the boards, and the printed circuit board are pressure-bonded by the same heat treatment process. Production method. 6. The electronic component built-in multilayer board according to claim 2, wherein after the electronic components are mounted to form an electronic component mounting board, an electrical inspection is performed for each of the electronic component mounting boards. Manufacturing method. 7. The method for manufacturing a multilayer board with built-in electronic components according to claim 2, wherein electrodes for operation inspection are drawn from the electronic component mounting board on which the electronic components are mounted.