JP2010166074A - Wiring board with built-in electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board with built-in electronic components of high reliability in mechanical strength and humidity resistance, in which a wiring pattern is formed on the entire surface of a multilayer substrate to improve the integration. <P>SOLUTION: The board has a first wiring pattern containing an electrode pad, an electronic component connected to the electrode pad, and a first insulating board arranged in lamination on the first wiring pattern so that the height direction of the electronic component is penetrated. The board has a core board, which has first and second surfaces equipped with the wiring pattern, an electrically conductive bump on the wiring pattern of the first surface, and an opening into which the height direction of the electronic component can rush, and is arranged in lamination on the first insulating board, so that the height direction of the electronic component rushes into the opening, and the electrically conductive bump penetrates the first insulating board to establish electrical conduction to the first wiring pattern. The board also has a second insulating board arranged in lamination on the second surface of the core board, and a second wiring pattern arranged in lamination on the second insulating board. Resin of the first insulating board exudes in the clearance with the electronic components in the opening of the core board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component built-in wiring board.

  2. Description of the Related Art Conventionally, a so-called embedded electronic component built-in wiring board in which an electronic component such as a semiconductor element is embedded in a multilayer board in which a plurality of printed wiring boards are stacked in multiple stages is known. FIG. 15 is a vertical sectional view of a typical embedded type electronic component built-in wiring board 100. As shown in FIG. 15, in this electronic component built-in wiring board 100, three layers of printed wiring boards 101, 102, 103 are laminated, and a total of four layers of wiring patterns 104, 105, 106, 107 are arranged, The respective wiring patterns 104 to 107 are interlayer-connected by interlayer connection members such as through holes 108A to 108E. The semiconductor element 120 is mounted on a wiring pad 109 disposed between the printed wiring boards 101 and 102, and the semiconductor element 120 is placed in a space 110 in which a part of the printed wiring boards 102 and 103 is cut out. Buried.

  By the way, in order to manufacture such an embedded type electronic component built-in wiring board 100, a part 110 of the printed wiring boards 102 and 103 is cut out from one side to provide a space 110 for embedding the semiconductor element 120. In general, after mounting 120, a gap around the semiconductor element 120 is filled with an insulating sealing material 130 such as epoxy resin and then cured to embed the semiconductor element 120.

  However, if a part of the printed wiring boards 102 and 103 is mechanically cut out in this way, the mechanical strength of the printed wiring boards 102 and 103 is reduced, or the cut surface when the printed wiring boards 102 and 103 are cut out, There is a problem that moisture easily enters from the boundary surface with the filled insulating sealing material 130 and the moisture resistance is lowered.

  Furthermore, since the wiring pattern cannot be formed in the portion where the insulating sealing material 130 is filled in the hollowed portion of the printed wiring board 103, there is a problem in that the wiring pattern cannot be formed using this portion and the degree of integration cannot be increased. is there.

  The present invention has been made to solve the above conventional problems. That is, the present invention provides a wiring board with a built-in electronic component that is highly reliable as a wiring board with a built-in electronic component, such as mechanical strength and moisture resistance, and can improve the degree of integration by forming a wiring pattern over the entire surface of the multilayer board. The purpose is to provide.

  A wiring board with a built-in electronic component according to one embodiment of the present invention includes a first wiring pattern including an electrode pad and an electrode, and the electrode is electrically connected to the electrode pad of the first wiring pattern. An electronic component, and a first insulating substrate made of resin including a reinforcing material and positioned on the side of the first wiring pattern on which the electronic component is connected so that the height direction of the electronic component penetrates; A wiring pattern provided on each of the first and second surfaces, and the wiring patterns electrically connected to each other. An electronic component having an interlayer connection member provided so as to penetrate the conductive layer, and a conductive bump derived from a conductive paste provided on the wiring pattern on the first surface. Provided with an opening into which the height direction of the The height of the electronic component enters, and in addition, the first insulating substrate includes the first insulating substrate such that the conductor bump penetrates the first insulating substrate and is electrically connected to the first wiring pattern. A core substrate laminated on a surface opposite to the surface on which the one wiring pattern is provided, and the core substrate on the second surface laminated on the second surface of the core substrate A second insulating substrate having a second interlayer connection member that is electrically connected to the wiring pattern, and a laminated position on a surface of the second insulating substrate opposite to the surface on which the core substrate is located; A second wiring pattern electrically connected to the second interlayer connection member, and the resin of the first insulating substrate is provided in a gap between the opening and the electronic component in the core substrate. Is characterized by a oozing position.

  The wiring board with a built-in electronic component further includes a conductor bump provided on the electrode pad of the first wiring pattern, the electronic component is a semiconductor element, and the electrode of the electronic component is the conductor bump. And electrically connected to the electrode pad of the first wiring pattern.

  Here, the conductive bumps provided on the electrode pads of the first wiring pattern are bumps derived from a conductive paste, and a nickel layer and a gold layer formed by plating on the surface of the bumps. And a laminated film.

  In the electronic component built-in wiring board, the second insulating substrate may be made of a resin including a reinforcing material.

  Here, the second interlayer connection member can be a conductor bump derived from a conductive paste.

  According to the present invention, the electronic component is accommodated in the opening of the core substrate, and the insulating substrate is further stacked thereon to completely cover it, so that the reliability as a wiring substrate with a built-in electronic component such as mechanical strength and moisture resistance is achieved. In addition, it is possible to obtain a wiring board with a built-in electronic component in which the wiring pattern can be formed on the entire surface of the multilayer board and the degree of integration can be improved.

It is a flowchart of the manufacturing method of the electronic component built-in wiring board which concerns on 1st Embodiment. It is a vertical sectional view in the middle of manufacture of a wiring board with a built-in electronic component according to the first embodiment. It is a vertical sectional view in the middle of manufacture of a wiring board with a built-in electronic component according to the first embodiment. It is a vertical sectional view in the middle of manufacture of a wiring board with a built-in electronic component according to the first embodiment. It is a flowchart of the manufacturing method of the electronic component built-in wiring board which concerns on 2nd Embodiment. It is a vertical sectional view in the middle of manufacture of an electronic component built-in wiring board according to a second embodiment. It is a vertical sectional view in the middle of manufacture of an electronic component built-in wiring board according to a second embodiment. It is a vertical sectional view in the middle of manufacture of an electronic component built-in wiring board according to a second embodiment. It is a vertical sectional view in the middle of manufacture of an electronic component built-in wiring board according to a second embodiment. It is a vertical sectional view of an electronic component built-in wiring board according to a third embodiment. It is a vertical sectional view of an electronic component built-in wiring board according to a fourth embodiment. It is a vertical sectional view of an electronic component built-in wiring board according to a fifth embodiment. It is a vertical sectional view of an electronic component built-in wiring board according to a sixth embodiment. It is a vertical sectional view of an electronic component built-in wiring board according to a seventh embodiment. It is a vertical sectional view of a conventional electronic component built-in wiring board.

(First embodiment)
Hereinafter, the manufacture of the electronic component built-in wiring board according to the first embodiment of the present invention will be described. FIG. 1 is a flowchart of a method for manufacturing an electronic component built-in wiring board according to the present embodiment, and FIGS. 2, 3 and 4 are vertical cross-sectional views of the electronic component built-in wiring board according to the present embodiment during manufacturing.

  In order to manufacture the electronic component built-in wiring board according to the present embodiment, first, a so-called two-layer board in which wiring patterns are formed on both surfaces of an insulating substrate is prepared. This two-layer plate is produced by stacking copper foil on both sides of a prepreg impregnated with a thermosetting resin such as an epoxy resin in a reinforcing material sheet such as glass fiber, and pressurizing under heating.

  The conductive plates 14 and 16 on the surface of the two-layer wiring board 10 are patterned. As a patterning method, for example, a photosensitive resin is applied, and a mask pattern (not shown) is formed by a photolithographic method in which a mask pattern is overlaid, exposed, and developed (step 1). Next, an etching process is performed on the masking (step 2). Thus, as shown in FIG. 2B, the two-layer board 10 on which the wiring patterns 14a and 16a are formed is formed.

  Next, a through-hole 17 is formed in the insulating substrate 12 as shown in FIG. 2C by an optical method such as machining such as drilling or laser beam irradiation at a position where a through hole is to be formed on the two-layer board 10. A two-layer plate 10a is obtained (step 3). Next, by performing electroless plating or electrolytic plating, a metal layer is deposited on the surface of the two-layer plate 10a and the inner wall of the through hole 17 (step 4). Thus, the core substrate 10b having the through-hole metal layer 18 as shown in FIG. 2D is formed.

  On the other hand, a bumped copper foil is formed separately from the two-layer board 10. In order to form the copper foil with bumps, first, a mask screen (not shown) provided with holes is set on the surface of the copper foil 20 as shown in FIG. 3E (step 1a). Next, a conductive paste such as a silver paste in which silver fine particles are dispersed in a resin is printed on the mask screen (step 2a) to form paste bumps 22. Next, the paste bump 22 is dried and semi-cured (step 3a). Thus, a bumped copper foil 20a as shown in FIG. 3 (f) is obtained.

  Next, as shown in FIG. 3G, the prepreg 24 and the bumped copper foil 20a are overlaid on the lower surface side of the core substrate 10b formed as described above (step 5). Similarly, another prepreg 25 is also stacked on the upper surface side of the core substrate 10b, and another bumped copper foil 21a formed thereon by the same method as the above bumped copper foil 20a is as shown in FIG. 3 (g). (Step 5). Next, pressure is applied under heating in the superposed state (step 6). Then, the paste bumps 22 and 23 penetrate the prepregs 24 and 25, and come into contact with the wiring patterns 14a and 16a on the surface of the core substrate 10b as shown in FIG. At the same time, the paste bumps 22 and 23 and the prepregs 24 and 25 are completely cured by heat. Thus, a multilayer board intermediate 30 in which the copper foils 20 and 21 and the wiring patterns 14a and 16a are electrically connected as shown in FIG.

  Next, the copper foils 20 and 21 on the surface of the multilayer board intermediate 30 are patterned (step 7). In this way, as shown in FIG. 3 (i), the multilayer board intermediate 30a having the wiring patterns 20a, 21a and 21b formed on the surface is obtained. Next, among the surface wiring patterns of the multilayer board intermediate 30a, as shown in FIG. 4 (j), silver paste bumps 26, 26,... Are formed on the electrode pads 21b, 21b,. Are formed (step 8). The method for forming the silver paste bumps 26, 26,... Is substantially the same as the method for forming the conductor bumps 20, 20,.

  That is, a mask pattern in which through holes are provided in a bump forming portion is set (step 1a), and a conductive paste, for example, metal paste such as silver dispersed in a liquid resin such as an epoxy resin in the through holes. This is a method comprising filling the composition, squeegeeing from the upper surface of the mask pattern (step 2a), peeling off the mask pattern, drying, heating and semi-curing (step 3a).

  However, the silver paste bumps 26, 26,... Formed here have a height of 10 to 30 μm and a bottom surface radius of 20 to 50 μm. This is to correspond to the size of the semiconductor element 28 described later.

  Next, after the bumps are formed, the silver paste bumps 26, 26,. Thereafter, Ni plating treatment such as electrolytic plating or electroless plating is performed to form a Ni layer 27a as a barrier metal layer on the surface of the silver paste bumps 26, 26,... Next, an Au layer 27b is formed by performing an Au plating process on the Ni layer 27a. In this way, the multilayer board intermediate 30b is obtained.

  Next, as shown in FIG. 4 (k), an ACF (anisotropic conductive adhesive layer) 29 is formed on the formation surface of the silver paste bumps 26, 26,. The semiconductor element 28 is aligned so that the electrode plates 28a, 28a, ... face the electrode pads 21b, 21b, .... Next, when the semiconductor element 28 and the multilayer board intermediate 30b are pressed in this state, the silver paste bumps 26, 26,... Penetrate through the ACF (anisotropic conductive adhesive layer) 29 as shown in FIG. The electrode plates 28a, 28a,. At this time, Au layers 27b, 27b, ... are formed on the surface of the silver paste bumps 26, 26, ..., and the electrode plates 28a, 28a, ... are made of Al. Therefore, an Al-Au bond is formed between the silver paste bumps 26, 26, ... and the electrode plates 28a, 28a, ..., and between the electrode pads 21b, 21b, ... and the electrode plates 28a, 28a, ... They are electrically joined and mounted via the Au layer 27b, Ni layer 27a, silver paste bump 26, and ACF (anisotropic conductive adhesive layer) 29 (step 9). Thus, a multilayer board intermediate 30c on which the semiconductor element 28 as shown in FIG. 4 (k) is mounted is obtained.

  Next, as shown in FIG. 4 (l), the multilayer board intermediate 30c thus obtained has a prepreg 32 with a hole and a double-layer board 40 with bumps on the upper surface side, and a prepreg 42 and a double-layer board 50 with bumps on the lower surface side. (Step 10). The perforated prepreg 32 used here is formed by impregnating a reinforcing material such as glass fiber with an insulating liquid thermosetting resin such as an epoxy resin, and punching out a portion corresponding to a semiconductor element (step 1b) to provide an opening 32a. It is a thing. The two-layer boards 40 and 50 with bumps are formed, for example, by forming a wiring pattern on both surfaces of an insulating material layer through which an interlayer connection member is inserted, and forming a conductor bump on the wiring pattern.

  Next, in this state, the multilayer board intermediate 30c, the perforated prepreg 32, the prepreg 42, and the two-layer boards 40 and 50 with bumps are heated and pressed under pressure (step 11). Thus, as shown in FIG. 4 (m), the conductor bump 39 of the bumped double-layer board 40 penetrates the perforated prepreg 32 to electrically connect the multilayer board intermediate 30c and the bumped double-layer board 40. Join.

  Similarly, the conductor bumps 49 of the two-layer board 50 with bumps penetrate the prepreg 42 to electrically connect the multilayer board intermediate 30c and the two-layer board 50 with bumps.

  At the same time, the epoxy resin impregnated in the perforated prepreg 32 oozes out and air is expelled from the gap between the opening 32a of the perforated prepreg 32 and the semiconductor element 28 accommodated therein to seal the gap. . Further, the epoxy resin is cured by the heat during the heat pressing, so that a so-called 8-layer wiring type semiconductor element built-in wiring board 52 with built-in electronic components as shown in FIG.

  As described above, in the electronic component built-in wiring substrate 52 according to this embodiment, the core substrate 30 is formed of the core substrate in which the interlayer connection is formed by the through-hole metal layer 18. Can be adjusted freely. In the electronic component built-in wiring board 52 according to the present embodiment, the semiconductor element 28 is embedded in the multilayer board, and a resin that seals the periphery of the semiconductor element 28 and a multilayer board that surrounds the outer periphery of the resin. Since the boundary surface is not exposed on the surface of the electronic component built-in wiring board 1, it is possible to prevent moisture from entering through the boundary surface, and as a result, a highly moisture-resistant electronic component built-in wiring substrate can be obtained. .

  Further, in the electronic component built-in wiring board 52 according to the present embodiment, the mounted semiconductor element is embedded inside, and the surfaces of the two-layer plates 40 and 50 are exposed on the surface of the electronic component built-in wiring board 52. Therefore, it is possible to mount further wiring patterns and semiconductor elements using the surfaces of the two-layer plates 40 and 50, and to further improve the integration degree of the electronic component built-in wiring board. .

(Second Embodiment)
Hereinafter, the manufacture of the electronic component built-in wiring board according to the second embodiment of the present invention will be described. FIG. 5 is a flowchart of a method for manufacturing a wiring board with a built-in electronic component according to the present embodiment, and FIGS. 6, 7 and 8 are vertical sectional views of the wiring board with a built-in electronic component according to the present embodiment.

  In order to manufacture the electronic component built-in wiring board according to the present embodiment, first, a so-called two-layer board in which wiring patterns are formed on both surfaces of an insulating substrate is prepared. To manufacture this two-layer plate, first, a conductor plate 60 such as a copper foil is prepared as shown in FIG. The conductor bumps 62, 62,... Are formed on the conductor plate 60 using a printing technique.

  As a method of forming the conductor bumps 62, 62,..., For example, a mask screen having through holes in the bump forming portion is set on the conductor plate 60 (step 1), and the conductive is placed in the through holes of the mask screen. A method comprising squeegeeing a paste-like composition in which fine metal particles such as silver are dispersed in a liquid resin such as an epoxy resin and peeling the mask screen (step 2). After forming the substantially conical conductor bumps 62, 62,... As shown in FIG. 6B in this way, the conductor bumps 62, 62,... Are dried and semi-cured (step 3).

  Next, as shown in FIG. 6C, a prepreg (insulating substrate precursor) 64 on the conductor bumps 62, 62,..., That is, an insulating resin such as an epoxy resin in a reinforcing material such as a glass fiber mat. Then, another conductor plate 66 such as a copper foil is placed on the prepreg 64 (step 4), and in this state, heat press, that is, pressurizing under heating (step 5). . By this heat pressing, the conductor bumps 62, 62,... Pass through the prepreg 64, and the conductor plate 60 and the conductor plate 66 are electrically connected, and at the same time, the prepreg 64 is cured, and FIG. A two-layer wiring board 70 as shown in FIG.

  Next, the conductive plates 60 and 66 on the surface of the two-layer wiring board 70 are patterned (step 6). As a patterning method, for example, a photosensitive resin is applied, and a mask pattern (not shown) is formed by a photolithographic method or the like in which a mask pattern is overlaid and exposed and developed. Next, an etching process is performed on the masking. Thus, as shown in FIG. 6E, the two-layer board 70a on which the wiring patterns 60a, 66a, 66b are formed is formed.

  Next, among the surface wiring patterns of the two-layer board 70a, as shown in FIG. 7 (f), silver paste bumps 68, 68,... Are formed on electrode pads 66b, 66b,. Is formed (step 7). The method for forming the silver paste bumps 68, 68,... Is substantially the same as the method for forming the conductor bumps 62, 62,.

  That is, a mask screen having through holes provided in bump forming portions is set (step 1), and a conductive paste, for example, metal fine particles such as silver dispersed in a liquid resin such as an epoxy resin in the through holes. This is a method comprising filling the composition, squeegeeing from the upper surface of the mask pattern (step 2), peeling off the mask pattern, drying, heating and semi-curing (step 3).

  However, the silver paste bumps 68, 68,... Formed here have a height of 10 to 80 μm and a bottom surface radius of 20 to 50 μm. This is to correspond to the size of the semiconductor element 74 described later.

  Next, after the bumps are formed, the silver paste bumps 68, 68,. Thereafter, Ni plating such as electrolytic plating or electroless plating is performed, so that the barrier metal as shown in FIG. 7G is formed on the surface of the silver paste bumps 68, 68,. A Ni layer 69a as a layer is formed. Next, an Au layer 69b is formed by performing an Au plating process on the Ni layer 69a. In this way, a multilayer board intermediate 70d as shown in FIG. 7 (h) is obtained.

  Next, as shown in FIG. 7 (i), an ACF (anisotropic conductive adhesive layer) 72 is formed on the formation surface of the silver paste bumps 68, 68,. The semiconductor element 74 is aligned so that the electrode plates 74a, 74a,... Face the electrode pads 66b, 66b,. Next, when the semiconductor element 74 and the multilayer plate intermediate 70d are pressed in this state, the silver paste bumps 68, 68,... Penetrate through the ACF (anisotropic conductive adhesive layer) 72 as shown in FIG. And pressed by the electrode plates 74a, 74a,. At this time, Au layers 69b, 69b,... Are formed on the surfaces of the silver paste bumps 68, 68,..., And the electrode plates 74a, 74a,. Are formed between the electrode pads 66a, 74a,... And the electrode plates 74a, 74a,... And the Au layers 69b, Ni layer 69a, and silver paste. The bumps 68 and ACF (anisotropic conductive adhesive layer) 72 are electrically connected. Thus, the semiconductor element 74 is mounted (step 10). In this way, a multilayer board intermediate body 70e on which the semiconductor element 74 as shown in FIG. 7J is mounted is obtained.

  On the other hand, a two-layer board with bumps is formed separately from the multilayer board intermediate 70e. For the two-layer board with bumps, the same operation as in steps 1 to 5 of the present embodiment is performed to form a two-layer board as shown in FIG. 6D (steps 1a to 5a). Next, patterning is performed in step 6a. Thereafter, a conductor bump 162 is formed on the wiring pattern of the two-layer board to form a two-layer board 82 with bumps as shown at 82 in FIG.

  Further, a core substrate 78 is formed separately from the multilayer board intermediate 70e and the two-layer board 82 with bumps. In order to form the core substrate 78 according to the present embodiment, the core substrate as shown in FIG. 2D is formed by performing the same operations as in Steps 1 to 4 of the first embodiment (Step 2). 1b-4b). Next, a conductor bump 163 is formed on the surface wiring pattern of the core substrate by the same method as described above (step 5b), and further, the vicinity of the center of the core substrate is punched (step 6b), which is shown by 78 in FIG. 8 (k). A core substrate 78 with punching bumps as described above is formed.

  Next, on the upper surface side of the multilayer board intermediate body 70e thus obtained, a two-layer board 82 with bumps, in which a perforated prepreg 76, a core board 78 with a punched bump, a prepreg 80, and a conductor bump 162 are inserted, is shown in FIG. k) (step 11). The perforated prepreg 76 used here is one in which a reinforcing material such as glass fiber is impregnated with an insulating liquid thermosetting resin such as an epoxy resin, and a portion corresponding to a semiconductor element is punched to provide an opening 76a. .

  Next, in this state, the multilayer board intermediate body 70e, the perforated prepreg 76, the core board 78 with punching bumps having the opening 78a, the prepreg 80, and the two-layer board 82 with bumps are heated and pressed under pressure (step 12). ). Thus, a multilayer board intermediate 84 as shown in FIG. 8 (l) is formed. Next, the two-layer plates 90 and 94 with bumps through which the prepregs 88 and 92 and the conductor bumps 162 and 165 are inserted are superimposed on the upper and lower surfaces of the multilayer board intermediate body 84 (step 13). Thereafter, when heat-pressing (step 14), a so-called 10-layer type electronic component built-in wiring board 86 as shown in FIG. 9 (m) is obtained.

  As described above, in the electronic component built-in wiring board 86 according to the present embodiment, the perforated core board is used as the core board, so that the semiconductor element 74 having a large thickness can be incorporated.

(Third embodiment)
In the wiring board with a built-in electronic component according to the present embodiment, a semiconductor element is embedded in one of a plurality of laminated insulating substrates. FIG. 10 is a vertical sectional view of the electronic component built-in wiring board according to the present embodiment. In the electronic component built-in wiring substrate 150 according to this embodiment, a semiconductor element 281 is embedded in an insulating substrate 123 that is one of the insulating substrates 121 to 127 stacked in seven layers. A wiring pattern 141 is disposed on the surface of each of the insulating substrates 121 to 127. Paste bumps 141 are inserted in the thickness direction of each of the insulating substrates 121 to 127 to electrically connect the wiring patterns 141 on the surface of the insulating substrate.

  In order to manufacture the electronic component built-in wiring board 150 according to the present embodiment, for example, the prepreg and the copper foil with bumps are stacked on the both sides of the core substrate 121 formed with the wiring pattern 141 and pressed under heating to form a multilayer. A method of forming the wiring pattern 141 by stacking and etching the copper foil on the surface is mentioned. In order to embed the semiconductor element 281, a method is conceivable in which the semiconductor element 281 is mounted on the wiring pattern 141 on the surface of the insulating substrate 122, a perforated prepreg and a copper foil with bumps are stacked, and pressure is applied under heating. According to the present embodiment, it is possible to form the electronic component built-in wiring board 150 with a built-in semiconductor element 281 without forming a through-hole plating layer.

(Fourth embodiment)
In the electronic component built-in wiring substrate according to the present embodiment, a thick semiconductor element is embedded in the core substrate at the center of the insulating substrate stacked in multiple layers. FIG. 11 is a vertical sectional view of the electronic component built-in wiring board according to the present embodiment. In the electronic component built-in wiring board 152 according to the present embodiment, a thick semiconductor element 741 is embedded in a core substrate 121 located at the center of seven layers of insulating substrates 121 to 127.

  In order to manufacture the electronic component built-in wiring board 152 according to the present embodiment, for example, a prepreg and a copper foil with bumps are stacked on a surface of the insulating substrate 126 on which the wiring pattern 141 is formed, and pressed under heating to form a multilayer. A method of forming the wiring pattern 141 by stacking and etching the copper foil on the surface is mentioned. In order to embed the semiconductor element 741, the semiconductor element 741 is mounted on the wiring pattern 141 on the surface of the insulating substrate 126, a perforated prepreg, an opening near the middle of the core substrate 121, and a paste bump 221 are further formed. A method may be considered in which printed and cured materials are stacked and pressed under heating. According to the present embodiment, it is possible to form the electronic component built-in wiring board 152 in which the thick semiconductor element 741 is embedded in the vicinity of the center of the multilayer board.

(Fifth embodiment)
In the wiring board with a built-in electronic component according to this embodiment, a plurality of semiconductor elements are embedded in different layers of an insulating substrate stacked in multiple layers. FIG. 12 is a vertical sectional view of the electronic component built-in wiring board according to the present embodiment. In the electronic component built-in wiring substrate 154 according to the present embodiment, a thick semiconductor element 741 is embedded in the insulating substrates 121 and 125 among the insulating substrates 121 to 127 stacked in seven layers. A thin semiconductor element 281 is embedded in the insulating substrate 123. On the other hand, a thin semiconductor element 283 is also mounted on the upper surface of the uppermost insulating substrate 124. In the core substrate 121 at the center in the thickness direction, an interlayer connection is formed through a through-hole layer 181. On the other hand, in the other insulating substrates 122 to 127, interlayer connections are formed by paste bumps 221 that are inserted in the thickness direction.

  In order to manufacture the electronic component built-in wiring substrate 154 according to the present embodiment, for example, the wiring pattern 141 is formed on both surfaces of the insulating substrate 126, and the prepreg and the bumped copper foil are overlapped on the layers connected by the paste bump 221. There is a method of forming a wiring pattern 141 by pressurizing under heating and laminating in multiple layers and etching the copper foil on the surface. In order to embed the semiconductor element 741, the semiconductor element 741 is mounted on the wiring pattern 141 on the surface of the insulating substrate 126, and an opening is formed near the center of the core substrate 121 including the perforated prepreg and the through-hole layer 181. A method is also possible in which the paste bumps 221 printed and cured are stacked and pressed under heating. The semiconductor element 281 is embedded in the same manner as in the third embodiment. In order to mount the semiconductor element 283, after seven layers of insulating substrates 121 to 127 are stacked, paste bumps are formed on the wiring pattern 141 on the upper surface of the uppermost insulating substrate 124. After the Ni plating and the Au plating are performed thereon, the semiconductor element 283 is pressurized and mounted under heating.

  According to this embodiment, it is possible to form the electronic component built-in wiring board 154 in which a plurality of semiconductor elements 741 and 281 including a thick semiconductor element 741 are embedded in an insulating substrate.

  Further, since the interlayer connection of the core substrate 121 is formed through the through-hole layer 181, a thick core substrate 121 can be used. Accordingly, a thick semiconductor element 741 can be embedded in the core substrate 121.

(Sixth embodiment)
In the electronic component built-in wiring board according to the present embodiment, paste bumps 221 are used for interlayer connection of the core substrate 121 in the electronic component built-in wiring board 154 according to the fifth embodiment. FIG. 13 is a vertical sectional view of the electronic component built-in wiring board according to the present embodiment. In the electronic component built-in wiring substrate 156 according to the present embodiment, paste bumps 221 are provided in the thickness direction instead of the through-hole layer 181 for the interlayer connection of the core substrate 121 located at the center in the thickness direction of the insulating substrates 121 to 127. It was inserted. To manufacture the electronic component built-in wiring substrate 156 according to the present embodiment, the manufacturing procedure of the fifth embodiment is followed except that the paste bump 221 is inserted instead of forming the through-hole layer 181 as the core substrate 121. According to the present embodiment, it is possible to form the electronic component built-in wiring substrate 156 in which the plurality of semiconductor elements 741 and 281 are embedded in the insulating substrate without forming the through-hole layer 181.

(Seventh embodiment)
In the wiring board with a built-in electronic component according to the present embodiment, in addition to the plurality of semiconductor elements of the fifth embodiment, a plurality of passive elements are embedded in an insulating substrate stacked in multiple layers. FIG. 14 is a vertical sectional view of the electronic component built-in wiring board according to the present embodiment. In the electronic component built-in wiring board 158 according to the present embodiment, the same insulating substrates 125, 122, and 124 as the semiconductor element mounting surface of the electronic component built-in wiring board 154 according to the fifth embodiment are formed on the wiring pattern 141 on the upper surface. Passive elements such as capacitors and resistors are mounted and embedded in the insulating substrates 125, 121, and 123.

  In order to manufacture the electronic component built-in wiring board 158 according to the present embodiment, when the semiconductor elements 281, 741, and 283 are mounted in the manufacturing process of the fifth embodiment, the passive elements 231, 232, and 233 are mounted. Are implemented respectively. Other manufacturing processes are the same as those of the fifth embodiment. According to the electronic component built-in wiring board 158 according to the present embodiment, an electronic component built-in wiring board in which a plurality of semiconductor elements and passive elements are embedded in multiple stages can be formed.

  18 ... through-hole plating layer, 14a ... first wiring pattern, 16a ... second wiring pattern, 21a ... third wiring pattern, 38 ... fourth wiring pattern, 12 ... first substrate, 25 ... second 32 ... third substrate, 34 ... fourth substrate, 22 ... conductor bump, 23 ... conductor bump, 37 ... conductor bump, 47 ... conductor bump, 39 ... conductor bump, 49 ... conductor bump, 27a ... Ni Layer (barrier metal layer), 27b ... Au layer, 29 ... ACF, 28 ... semiconductor element.

Claims (5)

A first wiring pattern including an electrode pad;
An electronic component having an electrode, the electrode being electrically connected to the electrode pad of the first wiring pattern;
A first insulating substrate made of a resin including a reinforcing material, which is laminated on the side of the first wiring pattern to which the electronic component is connected so that the height direction of the electronic component penetrates;
A first surface and a second surface opposite to the first surface, the wiring patterns provided on the first and second surfaces, respectively, and the wiring patterns electrically An interlayer connection member provided so as to penetrate, and a conductive bump derived from a conductive paste provided on the wiring pattern on the first surface, and of the electronic component The first wiring is provided with an opening into which the height direction can enter, and the height direction of the electronic component enters into the opening, and the conductor bump penetrates through the first insulating substrate. A core substrate positioned on the surface of the first insulating substrate on the side opposite to the surface on which the first wiring pattern is provided so as to be electrically connected to the pattern;
A second insulating substrate having a second interlayer connection member that is laminated on the second surface of the core substrate and electrically conductive to the wiring pattern on the second surface;
A second wiring pattern that is laminated on the surface of the second insulating substrate opposite to the surface on which the core substrate is located and is electrically connected to the second interlayer connection member. ,
The wiring board with a built-in electronic component, wherein the resin of the first insulating substrate oozes out in a gap between the opening of the core substrate and the electronic component. Further comprising conductor bumps provided on the electrode pads of the first wiring pattern;
The electronic component is a semiconductor element, and the electrode of the electronic component is electrically connected to the electrode pad of the first wiring pattern via the conductor bump. Electronic component built-in wiring board.   The conductor bump provided on the electrode pad of the first wiring pattern is a bump derived from a conductive paste, and a nickel layer and a gold layer laminated film formed by plating on the surface of the bump; The wiring board with a built-in electronic component according to claim 2, wherein:   2. The electronic component built-in wiring board according to claim 1, wherein the second insulating substrate is made of a resin including a reinforcing material.   5. The electronic component built-in wiring board according to claim 4, wherein the second interlayer connection member is a conductor bump derived from a conductive paste.

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