JP2011086453A - High frequency inspection socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high frequency inspection socket, capable of reducing a manufacturing cost more than a conventional one, and capable of suppressing generation of electric obstacle by cross talk and electromagnetic wave obstacle or the like. <P>SOLUTION: The high frequency inspection socket 100 includes a grounding connection conductive member 21, a connecting member 22, a contact probe 30, and a circuit board 40. The grounding connection conductive member 21 is constructed of an electric conductive material and has a through-hole having an inner diameter larger than the outer diameter of an outer case of the contact probe 30, and is connected to a grounding circuit of the circuit board 40 through the connecting member 22. The inner diameter of the through-hole is determined taking into considerations variations in component dimensions and assembling process so that the inner wall face of the through-hole of the grounding connection member 21 and the outer periphery of the outer case of the contact probe 30 may be as close as possible within a range to maintain electric insulation. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a high-frequency inspection socket used when, for example, inspecting the electrical characteristics of a semiconductor integrated circuit.

  In recent years, in semiconductor devices and semiconductor integrated circuits (hereinafter referred to as “IC etc.”) whose electrical characteristics are inspected through this type of high-frequency test socket, analog ICs have become higher in frequency of analog signals, and digital In an IC or the like, the speed of digital signals is increasing. Along with this, an electrical failure due to crosstalk, electromagnetic interference or the like occurs in the high-frequency inspection socket, and there is a problem that the electrical characteristics of the IC or the like cannot be inspected stably and with high accuracy. Conventionally, various proposals have been made for the purpose of solving this problem.

  For example, a contact probe that contacts each electrode such as an IC, an insulating block provided with a through hole that penetrates the contact probe, and a metal casing that includes the contact probe and the insulating block are provided. A device that suppresses external noise due to electromagnetic waves or the like by grounding a housing is known.

  However, in the above-described configuration, a grounded conductive layer cannot be provided in the vicinity of the contact probe, and the contact probe through which the high-frequency signal flows is not individually electromagnetically shielded. There is a problem that crosstalk occurs between contact probes.

  In response to this problem, Patent Document 1 includes a contact probe that contacts each of a signal electrode such as an IC, a power supply electrode, and a ground electrode, and an insulating block provided with a through hole that passes through each contact probe. An inspection unit in which a metal plating film is formed on the surface of the insulating block and the inner wall of the through hole is described. According to Patent Document 1, it is described that this inspection unit can perform characteristic inspection almost equivalently to a case in which a casing is formed of metal.

JP 2007-178165 A

  However, in the prior art described in Patent Document 1, (1) selective metal plating film treatment is performed so as not to form a metal plating film on the inner wall of the through hole into which the contact probe for supplying power to the IC or the like is inserted. Necessary (2) It becomes difficult to manage the thickness of the metal plating film formed on the inner wall of the through-hole as the pitch between the electrodes of IC etc. becomes narrower. (3) The contact probe and the metal plating film are electrically connected It is necessary to insulate the outer periphery of the contact probe so as not to be short-circuited. (4) It is necessary to prepare and mount different types of contact probes for power supply, grounding, and signal, making assembly complicated. There was a problem, and there was a problem that the manufacturing cost increased.

  The present invention has been made in view of the circumstances as described above, and is a high-frequency inspection socket capable of reducing the manufacturing cost as compared with the conventional one and suppressing the occurrence of an electrical failure due to crosstalk, electromagnetic interference or the like. The purpose is to provide.

  The high-frequency inspection socket according to the present invention includes a contact terminal that contacts an electrode provided on an object to be inspected, a contact terminal holding plate that holds the contact terminal, and a through hole that penetrates the contact terminal. One or more ground connection conductive members connected to a ground circuit, a circuit board for inputting and outputting an electrical signal to the device under test via the contact terminals, the contact terminals, the contact terminal holding plate, and the ground connection And a housing provided on the circuit board, the inner wall surface of the through hole of the ground connection conductive member and the outer peripheral surface of the contact terminal are brought close to each other within a range that maintains electrical insulation. It has a configuration.

  Thereby, the high frequency test socket of the present invention can be realized with a simple and easy-to-manufacture structure in which the ground connection conductive member surrounds the periphery of the contact terminal in the immediate vicinity of the electrode of the device under test. Therefore, the high-frequency inspection socket of the present invention can be manufactured at a lower cost than conventional ones, and can suppress the occurrence of electrical failure due to crosstalk or electromagnetic interference.

  The high-frequency inspection socket according to the present invention includes at least one power connection conductive member formed with a through hole penetrating the contact terminal and connected to a power circuit of the circuit board, the ground connection conductive member, and the power connection. A capacitor connected between the conductive member and the inner wall surface of the through hole of the power connection conductive member and the ground connection conductive member and the outer peripheral surface of the contact terminal are brought close to each other as long as electrical insulation is maintained. It has the structure which has a structure.

  With this configuration, the high-frequency test socket according to the present invention can remove noise components entering from the power supply line by providing the capacitor in the immediate vicinity of the electrode of the device under test.

  In the high-frequency inspection socket of the present invention, it is preferable that at least one of the ground connection conductive members is disposed on the inspected object side with respect to any of the power connection conductive members.

  Furthermore, the high-frequency inspection socket of the present invention has a configuration in which the casing is formed of a conductive member and connected to a ground circuit of the circuit board.

  With this configuration, the high-frequency inspection socket according to the present invention includes a conductive casing connected to the ground circuit, so that it is possible to further suppress the occurrence of electrical failure due to electromagnetic interference or the like.

  Furthermore, the high-frequency inspection socket of the present invention has a configuration in which the ground connection conductive member is formed by laminating a plurality of conductive members.

  With this configuration, the high-frequency inspection socket of the present invention can arbitrarily set the thickness of the conductive member by changing the number of stacked conductive members.

  The present invention can provide a high-frequency inspection socket having effects that the manufacturing cost can be reduced as compared with the conventional one and the occurrence of an electrical failure due to crosstalk or electromagnetic interference can be suppressed.

Sectional drawing which shows the structure in 1st Embodiment of the high frequency test | inspection socket based on this invention. Sectional drawing which shows the state which the solder ball for IC and the contact probe contacted in 1st Embodiment of the high frequency test | inspection socket based on this invention In the first embodiment of the high-frequency inspection socket according to the present invention, a view of the ground connection conductive member in a state in which the mounting plate and the presser plate are removed from the IC mounting direction. Sectional drawing which shows the structure in 2nd Embodiment of the high frequency test | inspection socket based on this invention. Sectional drawing which shows the structure in 3rd Embodiment of the high frequency test | inspection socket based on this invention. Sectional drawing which shows the structure in 4th Embodiment of the high frequency test | inspection socket based on this invention. Sectional drawing which shows the structure in 5th Embodiment of the high frequency test | inspection socket based on this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The high-frequency inspection socket of the present invention will be described with reference to an example in which an IC is used as an object to be inspected for inspecting electrical characteristics.

(First embodiment)
1st Embodiment of the high frequency test | inspection socket based on this invention is described using FIGS.

  As shown in FIG. 1, the high-frequency inspection socket 100 in this embodiment is for inspecting the electrical characteristics of a BGA (Ball Grid Array) type IC 90. On the bottom surface of the IC 90, for example, signal solder balls 91 for inputting and outputting a high frequency signal of about 5 GHz are formed in a lattice point shape. In FIG. 1, illustration of a power supply solder ball for supplying power to the IC 90 and a grounding solder ball to be grounded is omitted.

  The high frequency inspection socket 100 includes a housing 11, a mounting plate 12, a holding plate 13, a spring 14, a probe holding plate 15, a ground connection conductive member 21, a connection member 22, a contact probe 30, and a circuit board 40.

  The housing 11 is configured as an outer case of the high-frequency inspection socket 100 using an electrically insulating material such as an insulating resin or ceramics. The housing 11 is screwed to the circuit board 40.

  The mounting plate 12 is made of an electrically insulating material, and on which the IC 90 is mounted. The presser plate 13 is made of an electrically insulating material, and is disposed to face the mounting plate 12 with an interval. A spring 14 is provided between the mounting plate 12 and the holding plate 13. For example, when the IC 90 is pressed against the mounting plate 12 from above by a pressing plate (not shown), the spring 14 contracts, and the signal for the IC 90 is used. The solder ball 91 comes into contact with the contact probe 30.

  FIG. 2 shows a state where the signal solder ball 91 and the contact probe 30 are in contact with each other. As shown in FIG. 2, the contact probe 30 includes a body case 31, a plunger 32 that contacts the signal solder ball 91, a plunger 33 that contacts an electrode pad 41 formed on the circuit board 40, and plungers 32 and 33. And a spring 34 provided therebetween. The plunger 32 is movable in the penetrating direction (vertical direction in the figure) with respect to the through hole 12 a formed in the mounting plate 12 and the through hole 13 a formed in the holding plate 13, and contacts the signal solder ball 91. It is like that. Here, the contact probe 30 constitutes a contact terminal according to the present invention.

  In the present embodiment, the contact probe 30 including the spring 34 is used. However, the present invention is not limited to this. For example, the main body case 31 is not provided, and a contact pin with an exposed spring is used. Also good. 1 and 2, illustration of a contact probe that contacts a power supply solder ball for supplying power to the IC 90 and a grounding solder ball is omitted.

  The probe holding plate 15 is made of an electrically insulating material and includes a through hole 15a into which the contact probe 30 is inserted. The through hole 15 a is formed to hold the lower end portion of the body case 31 of the contact probe 30. The probe holding plate 15 constitutes a contact terminal holding plate according to the present invention.

  The ground connection conductive member 21 is made of an electrically conductive material, includes a through hole 21 a having an inner diameter larger than the outer diameter of the main body case 31 of the contact probe 30, and surrounds the outer periphery of the main body case 31. FIG. 3 shows a shape of the ground connection conductive member 21 as seen from the mounting direction of the IC 90 with the mounting plate 12 and the presser plate 13 removed.

  Here, in consideration of variations in component dimensions and assembly processes, the inner wall surface of the through hole 21a of the ground connection conductive member 21 and the outer peripheral surface of the main body case 31 are as close as possible within a range in which electrical insulation is maintained. Thus, it is preferable to determine the inner diameter of the through hole 21a. For example, when the outer diameter of the main body case 31 is φ0.83 mm, the inner diameter of the through hole 12a of the ground connection conductive member 21 is preferably about φ0.93 mm. In this case, the inner diameter of the through hole 15a of the probe holding plate 15 is preferably about φ0.85 mm.

  In addition, the ground connection conductive member 21 is preferably formed as an etching plate having a thickness of about 50 μm to 1 mm using a metal material such as copper, stainless steel, or white and white. In this case, the ground connection conductive member 21 may be formed by one etching plate, or a plurality of etching plates may be stacked.

  Note that the position where the ground connection conductive member 21 is provided is preferably near the upper end of the main body case 31 as shown in FIG. 2 when the ground connection conductive member 21 is as close as possible to the IC 90, but the present invention is not limited to this. Not. For example, there are a configuration in which one ground connection conductive member 21 is provided within a range in the length direction of the main body case 31, a configuration in which a plurality of ground connection conductive members 21 are provided at a predetermined interval, and the like. Alternatively, the ground connection conductive member 21 may be provided at the position of the outer peripheral surface of the plunger 32, and the through hole 21 a of the ground connection conductive member 21 may be as close as possible to the outer peripheral surface of the plunger 32.

  The connection member 22 is made of an electrically conductive material, and is configured to electrically connect the ground connection conductive member 21 to a ground electrode pad formed on the circuit board 40. For example, when the surface of the connection member 22 on the side of the circuit board 40 protrudes from the surface of the housing 11 on the side of the circuit board 40 by more than 10 μm, and the housing 11 is screwed to the circuit board 40, the connection member 22. However, the ground connection conductive member 21 and the ground electrode pad of the circuit board 40 may be electrically connected.

  The circuit board 40 is formed with a signal circuit for inputting and outputting a high-frequency signal, a power supply circuit for supplying power, and a ground circuit at a ground potential, and each circuit is an inspection device for inspecting the electrical characteristics of the IC 90 ( (Not shown). The signal circuit, the power supply circuit, and the ground circuit formed on the circuit board 40 are each provided with a signal electrode pad, a power supply electrode pad, and a ground electrode pad. A predetermined contact probe 30 is provided on each electrode pad. The plunger 32 is electrically connected.

  As described above, the high-frequency test socket 100 is configured to electrically connect the signal solder balls 91 and the electrode pads of the circuit board 40 via the contact probe 30. The positions of the through hole 12a of the mounting plate 12, the through hole 13a of the holding plate 13, the through hole 15a of the probe holding plate 15 and the through hole 21a of the ground connection conductive member 21 are determined with high accuracy in accordance with the position 91. It has been.

  As described above, according to the high frequency test socket 100 of the present embodiment, the ground connection conductive member 21 surrounds the periphery of the main body case 31 of the contact probe 30 in the immediate vicinity of the signal solder ball 91 provided in the IC 90. It can be realized with a simple and easy to manufacture structure. Therefore, the high-frequency test socket 100 according to the present embodiment can be manufactured at a lower cost than conventional ones, and can suppress the occurrence of an electrical failure due to crosstalk, electromagnetic interference, or the like.

  In addition, the conventional high-frequency inspection socket having the metal plating film described in the background art cannot be configured with only the same type of contact probe, and a contact probe discrimination process is required at the time of mounting. Since the high-frequency inspection socket 100 can be composed of the same type of contact probe 30, assembly is facilitated and manufacturing cost can be reduced.

  In the above-described embodiment, the BGA type IC 90 has been described as a measurement target. However, the present invention is not limited to this, and is applied to, for example, a dual inline package type or a quad flat package type IC. The same effect can be obtained.

(Second Embodiment)
As shown in FIG. 4, the high-frequency inspection socket 200 according to the second embodiment of the present invention is obtained by partially changing the configuration of the high-frequency inspection socket 100 (see FIG. 1) according to the first embodiment. Therefore, the same components as those of the high-frequency inspection socket 100 are denoted by the same reference numerals, and redundant description is omitted.

  The high frequency inspection socket 200 in this embodiment includes a presser plate 16, a probe holding plate 17, a ground connection conductive member 23, and a connection member 24. As shown in the drawing, the high-frequency inspection socket 200 in this embodiment includes a ground connection conductive member 23 that is thicker than the ground connection conductive member 21 in the first embodiment.

  The presser plate 16 is made of an electrically insulating material, and is disposed so as to face the mounting plate 12 with an interval. The presser plate 16 is formed with a through hole through which the plunger 32 (see FIG. 2) of the contact probe 30 passes.

  The probe holding plate 17 is made of an electrically insulating material and includes a through hole into which the contact probe 30 is inserted. The probe holding plate 17 constitutes a contact terminal holding plate according to the present invention.

  The ground connection conductive member 23 is sandwiched and fixed between the presser plate 16 and the probe holding plate 17 and is electrically connected to the ground circuit of the circuit board 40 through the connection member 24.

  The ground connection conductive member 23 is made of an electrically conductive material and includes a through hole having an inner diameter larger than the outer diameter of the body case 31 (see FIG. 2) of the contact probe 30. As in the first embodiment, the inner diameter of the through hole is such that the inner wall surface of the through hole and the outer peripheral surface of the main body case 31 of the contact probe 30 are as close as possible within a range in which electrical insulation is maintained. And the variation in the assembly process.

  The ground connection conductive member 23 is made of a metal material such as copper, stainless steel, or white and has a thickness on the order of submillimeters or millimeters. The ground connection conductive member 23 may be composed of a single metal plate, or a structure in which a plurality of etching plates are stacked. As the thickness of the ground connection conductive member 23 increases, the variation in the capacitance between the contact probe 30 and the ground connection conductive member 23 can be reduced, and the inspection accuracy of the electrical characteristics can be improved. . If the ground connection conductive member 23 is formed by laminating a plurality of etching plates, it is preferable that the ground connection conductive member 23 can have a desired thickness by changing the number of stacked layers.

  The connection member 24 is made of an electrically conductive material, and is configured to electrically connect the ground connection conductive member 23 to a ground electrode pad formed on the circuit board 40.

  As described above, according to the high-frequency inspection socket 200 of the present embodiment, the ground connection conductive member 23 is configured by laminating one metal body or a plurality of etching plates. It is possible to stabilize the capacitance between the two. Therefore, the high frequency test socket 200 according to the present embodiment can improve the test accuracy of electrical characteristics.

  In particular, in the conventional high-frequency inspection socket having the metal plating film described in the background art, the metal plating film thickness is on the order of micrometers, and there is a limit to increasing this film thickness. Although it is difficult to reduce the influence of the fluctuation of the capacitance between the probe and the probe, the high-frequency inspection socket 200 according to this embodiment can solve this problem with a simple and easy-to-manufacture structure.

(Third embodiment)
As shown in FIG. 5, the high-frequency inspection socket 300 according to the third embodiment of the present invention is obtained by partially changing the configuration of the high-frequency inspection socket 100 (see FIG. 1) according to the first embodiment. Therefore, the same components as those of the high-frequency inspection socket 100 are denoted by the same reference numerals, and redundant description is omitted.

  The high frequency inspection socket 300 in this embodiment includes a housing 18 and a probe holding plate 19. The probe holding plate 19 constitutes a contact terminal holding plate according to the present invention.

  The housing 18 is formed of an electrically conductive material (for example, an aluminum alloy), and is configured as an outer case of the high frequency inspection socket 300. The casing 18 is in contact with the ground connection conductive member 21. When the casing 18 is screwed to the circuit board 40, the electrode pad of the ground circuit formed on the circuit board 40 and the ground connection conductive member 21 are connected. It is designed to be electrically connected.

  As described above, according to the high-frequency inspection socket 300 in this embodiment, the ground connection conductive member 21 is provided around the contact probe 30 in the immediate vicinity of the signal solder ball 91 provided in the IC 90. It is possible to suppress the occurrence of electrical failure due to crosstalk, electromagnetic interference or the like with a simpler structure than that of the above. Therefore, the high-frequency inspection socket 300 in the present embodiment can be manufactured at a lower cost than the conventional one.

  Further, since the high-frequency inspection socket 300 in this embodiment includes the housing 18 formed of an electrically conductive material, the high-frequency inspection socket 300 is more susceptible to electromagnetic interference than the high-frequency inspection socket 100 in the first embodiment (see FIG. 1). The occurrence of electrical disturbance can be further suppressed.

(Fourth embodiment)
As shown in FIG. 6, the high frequency test socket 400 according to the fourth embodiment of the present invention is obtained by partially changing the configuration of the high frequency test socket 100 (see FIG. 1) according to the first embodiment. Therefore, the same components as those of the high-frequency inspection socket 100 are denoted by the same reference numerals, and redundant description is omitted.

  The high-frequency inspection socket 400 in this embodiment includes a ground connection conductive member 25, a power connection conductive member 26, contact probes 51 to 53, a capacitor 71, a spacing plate 81, and a probe holding plate 82.

  The IC 90 to be inspected in this embodiment includes a signal solder ball 91 that inputs and outputs a high-frequency signal, a power supply solder ball 92 that is supplied with power, and a grounding solder ball 93 that is grounded.

  The contact probe 51 is configured to electrically connect the signal solder balls 91 of the IC 90 and the signal electrode pads of the circuit board 40. Further, the contact probe 52 electrically connects the power supply solder ball 92 and the power supply conductive member 26 of the IC 90 and the power supply electrode pad of the circuit board 40. In addition, the contact probe 53 is configured to electrically connect the grounding solder ball 93 and the ground connection conductive member 25 of the IC 90 and the grounding electrode pad of the circuit board 40. Each of the contact probes 51 to 53 constitutes a contact terminal according to the present invention.

  The ground connection conductive member 25 and the power supply connection conductive member 26 are made of an electrically conductive material. The spacing plate 81 and the probe holding plate 82 are made of an electrically insulating material.

  The ground connection conductive member 25 includes a through hole that penetrates close to each of the contact probes 51 and 52 while maintaining an electrical insulation state, and a through hole that electrically connects and penetrates the contact probe 53. Have.

  The power connection conductive member 26 has a through hole that penetrates close to each of the contact probes 51 and 53 while maintaining an electrical insulation state, and a through hole that electrically connects and penetrates the contact probe 52. Have.

  In the interval plate 81, a through hole for providing the capacitor 71 is formed in addition to the through hole through which the contact probes 51 to 53 pass. One electrode of the capacitor 71 is electrically connected to the ground connection conductive member 25, and the other electrode is electrically connected to the power supply connection conductive member 26.

  The probe holding plate 82 includes a through hole that allows the contact probes 51 to 53 to pass therethrough and hold them. The probe holding plate 82 constitutes a contact terminal holding plate according to the present invention.

  As described above, according to the high-frequency inspection socket 400 in this embodiment, the ground connection conductive member 25 is provided around the contact probe 51 in the immediate vicinity of the signal solder ball 91 provided in the IC 90. It is possible to suppress the occurrence of electrical failure due to crosstalk, electromagnetic interference or the like with a simpler structure than that of the above. Therefore, the high-frequency inspection socket 400 in the present embodiment can be manufactured at a lower cost than the conventional one.

  Further, according to the high frequency inspection socket 400 in the present embodiment, the capacitor 71 is disposed between the ground connection conductive member 25 and the power connection conductive member 26, that is, in the immediate vicinity of the power solder ball 92 and the ground solder ball 93 of the IC 90. Since it is configured to be provided, it is possible to remove noise components entering from the power supply line. Therefore, the high frequency test socket 400 according to the present embodiment can prevent the influence of noise components entering from the power supply line and improve the test accuracy of electrical measurement.

  In the above-described embodiment, the high-frequency inspection socket 400 has the housing 11 formed of an electrically insulating material. However, the present invention is not limited to this, and the third embodiment (FIG. It is good also as a structure which has the electroconductive housing | casing 18 as demonstrated in 5).

  In FIG. 6, the thicknesses of the ground connection conductive member 25 and the power supply connection conductive member 26 are the same, but the thicknesses of the two may be different from each other. In this case, it is preferable that the thickness of the ground connection conductive member 25 is larger than the thickness of the power supply connection conductive member 26.

  A plurality of each of or one of the ground connection conductive member 25 and the power supply connection conductive member 26 may be provided. In the case of this configuration, it is preferable to provide the ground connection conductive member 25 at a position closest to the IC 90.

(Fifth embodiment)
As shown in FIG. 7, a high frequency test socket 500 according to the fifth embodiment of the present invention is obtained by partially changing the configuration of the high frequency test socket 400 (see FIG. 6) according to the fourth embodiment. Therefore, the same components as those of the high-frequency inspection socket 400 are denoted by the same reference numerals, and redundant description is omitted.

  The high-frequency inspection socket 500 in this embodiment includes a ground connection conductive member 27, a power connection conductive member 28, contact probes 54 to 57, a capacitor 72, an upper spacing plate 83, a lower spacing plate 84, and a probe holding plate 85. . Note that the contact probes 54 and 55 and the contact probes 56 and 57 respectively constitute contact terminals according to the present invention.

  The ground connection conductive member 27 and the power supply connection conductive member 28 are made of an electrically conductive material. The upper spacing plate 83, the lower spacing plate 84, and the probe holding plate 85 are made of an electrically insulating material.

  The ground connection conductive member 27 has a through-hole penetrating close to the contact probe 51 in an electrically insulated state and a through-hole penetrating the plunger of the contact probe 54 in an electrically insulated state. The ground connection conductive member 27 is electrically connected to one plunger of each of the contact probes 56 and 57.

  The power connection conductive member 28 has a through hole that penetrates the contact probe 51 while maintaining an electrical insulation state, and a through hole that penetrates the plunger of the contact probe 57 in an electrical insulation state. The power connection conductive member 28 is electrically connected to one plunger of each of the contact probes 54 and 55.

  The upper spacing plate 83 is formed with a through hole that allows the contact probes 51, 54, and 56 to pass therethrough.

  The lower spacing plate 84 is formed with a through hole for providing the capacitor 72 in addition to the through hole through which the contact probe 51 and the plunger of the contact probe 54 penetrate. One electrode of the capacitor 72 is electrically connected to the ground connection conductive member 27, and the other electrode is electrically connected to the power supply connection conductive member 28.

  The probe holding plate 85 includes a through hole that allows the contact probes 51, 55, and 57 to pass therethrough and hold them. The probe holding plate 85 constitutes a contact terminal holding plate according to the present invention.

  With the configuration described above, the contact probe 51 electrically connects the signal solder balls 91 of the IC 90 and the signal electrode pads of the circuit board 40. The contact probes 54 and 55 are configured to electrically connect the power supply solder balls 92 and the power supply connection conductive member 28 of the IC 90 to the power supply electrode pads of the circuit board 40. The contact probes 56 and 57 are configured to electrically connect the grounding solder ball 93 and the ground connection conductive member 27 of the IC 90 to the grounding electrode pad of the circuit board 40.

  As described above, according to the high frequency inspection socket 500 of the present embodiment, the ground connection conductive member 27 is provided around the contact probe 51 in the immediate vicinity of the signal solder ball 91 provided in the IC 90. It is possible to suppress the occurrence of electrical failure due to crosstalk, electromagnetic interference or the like with a simpler structure than that of the above. Therefore, the high-frequency inspection socket 500 in this embodiment can be manufactured at a lower cost than the conventional one.

  Further, according to the high frequency inspection socket 500 of the present embodiment, the capacitor 72 is disposed between the ground connection conductive member 27 and the power connection conductive member 28, that is, in the immediate vicinity of the power solder ball 92 and the ground solder ball 93 of the IC 90. Since it is configured to be provided, it is possible to remove noise components entering from the power supply line. Therefore, the high frequency test socket 500 according to the present embodiment can prevent the influence of noise components entering from the power supply line and improve the test accuracy of electrical measurement.

  As described above, the high-frequency inspection socket according to the present invention has an effect that the manufacturing cost can be reduced as compared with the conventional one, and the occurrence of electrical failure due to crosstalk or electromagnetic interference can be suppressed. It is useful as a high-frequency inspection socket used when inspecting the electrical characteristics of an integrated circuit.

11, 18 Housing 12 Mounting plate 12a, 13a, 15a, 21a Through hole 13, 16 Holding plate 14, 34 Spring 15, 17, 19, 82, 85 Probe holding plate (contact terminal holding plate)
21, 23, 25, 27 Ground connection conductive member 22, 24 Connection member 26, 28 Power connection conductive member 30, 51-57 Contact probe (contact terminal)
31 Main body case 32, 33 Plunger 40 Circuit board 41 Electrode pad 71, 72 Capacitor 81 Space plate 83 Upper space plate 84 Lower space plate 90 IC (inspection object)
91 Solder balls for signals 92 Solder balls for power supplies 93 Solder balls for grounding 100, 200, 300, 400, 500 High frequency inspection socket

Claims (5)

One contact terminal that contacts an electrode provided on the object to be inspected, a contact terminal holding plate that holds the contact terminal, and a through-hole that penetrates the contact terminal are connected to the ground circuit of the circuit board. The circuit including the above ground connection conductive member, the circuit board for inputting and outputting an electric signal to the object to be inspected via the contact terminal, the contact terminal, the contact terminal holding plate, and the ground connection conductive member. A housing provided on the substrate,
A high-frequency inspection socket having a configuration in which an inner wall surface of a through hole of the ground connection conductive member and an outer peripheral surface of the contact terminal are close to each other within a range in which electrical insulation is maintained. One or more power connection conductive members formed with through holes penetrating the contact terminals and connected to the power circuit of the circuit board, and a capacitor connected between the ground connection conductive member and the power connection conductive member And
2. The structure according to claim 1, wherein an inner wall surface of a through hole of the power connection conductive member and the ground connection conductive member and an outer peripheral surface of the contact terminal are close to each other within a range in which electrical insulation is maintained. High frequency inspection socket. The high-frequency inspection socket according to claim 2, wherein at least one of the ground connection conductive members is disposed closer to the object to be inspected than any of the power connection conductive members. The high frequency inspection socket according to any one of claims 1 to 3, wherein the casing is formed of a conductive member and is connected to a ground circuit of the circuit board. 5. The high-frequency inspection socket according to claim 1, wherein the ground connection conductive member is formed by laminating a plurality of conductive members.

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