KR101786782B1 - Film for testing panel - Google Patents

Abstract

The present invention relates to a film for testing a panel which is used in a probe device for testing a panel. The present invention provides the film for testing a panel, which includes a first film including a plurality of first wiring patterns for receiving test signals from the probe device; and a second film including a plurality of second wiring patterns for transferring the test signals received from the plurality of first wiring patterns to the panel and bonded to the first film so that each of the plurality of second wiring patterns corresponds to each of the plurality of first wiring patterns. At least a part of the plurality of second wiring patterns is made of materials with higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns. Accordingly, the present invention can secure the reliability of a test.

Description

{Film for testing panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel test film, and more particularly, to a panel test film capable of stably performing an electrical test on a panel.

2. Description of the Related Art In general, a flat panel display panel refers to a display device such as an organic light emitting diode (OLED), a liquid crystal display (LCD), and a plasma display panel (PDP) There are two types of panels: one is a film transistor, the other is a twisted nematic (TN), the other is a super twisted nematic (STN), the other is a color super twisted nematic (CSTN) And is employed in a liquid crystal display panel of a communication device such as a cellular phone, for example.

A panel test film having a plurality of contact lines which are in contact with lead wires of a plurality of wirings and panels when a voltage for a characteristic test is applied to such a panel or a bias voltage for ensuring stability is applied by a probe device, .

FIG. 1 is a schematic view showing a conventional panel test film, and FIG. 2 is a view showing a conventional panel test film. 1 (a) is a schematic view showing a copper film deposited on a bottom film, and FIG. 1 (b) is a schematic view showing a wiring pattern formed by patterning a copper film on the bottom film of FIG. 1 .

As shown in Fig. 1, the prior art panel test film has a plurality of copper film patterns 13a sandwiched between flexible materials such as polyimide, as wiring patterns constituting wiring lines and contact lines.

Here, the copper film patterns 13a can be collectively formed at intervals set on the bottom film 11 by photolithography.

That is, as shown in Fig. 1 (a), the copper film 13 deposited on the bottom film 11 is provided.

Thereafter, as shown in Fig. 1 (b), the copper film 13 is patterned by photolithography to form a plurality of copper film patterns 13a on the bottom film 11 at predetermined intervals. Here, the predetermined interval may mean an interval at which the adjacent copper film patterns 13a do not interfere with each other with electrical signals.

However, since the panel test film of the prior art forms wiring and contact lines in a plurality of copper film patterns, the copper that forms each copper film pattern is weak in corrosion resistance and abrasion resistance, There is a problem in that it can not cope with pattern trends.

That is, the wiring and the contact line made of the copper film pattern having weak corrosion resistance and abrasion resistance can be formed by burning due to electric current generated when a voltage for characteristic test is applied to the panel and electric influence, In the case of a printed circuit board (hereinafter, referred to as 'FPC'), there is a problem that the wire diameter is often reduced due to frequent bending or the like.

In addition, the prior art panel test film absorbs the impact generated when the contact line made of the copper film pattern having weak corrosion resistance and abrasion resistance is in contact with the lead wire of the panel during the characteristic test, And the contact is unstable, resulting in an error as a result of the test, so that the stability of the electrical test on the panel is deteriorated.

3 is a schematic view showing a prior art panel test film used in the test of the panel. As shown in FIG. 3, the prior art panel test film is made of a copper film pattern having weak corrosion resistance and abrasion resistance, so that the end portion of the panel and the panel test film repeatedly contact with each other during the characteristic test on the panel, As a result, cracks (J) are generated in the copper film pattern having low corrosion resistance and abrasion resistance of the panel test film and are cut or the panel test film of the prior art tests thousands to tens of thousands of panels with one probe block, And abrasion of a contact line made of a copper film pattern having a weak abrasion resistance. Therefore, there is a problem that the replacement cycle is fast and the service life is shortened.

It is an object of the present invention to provide a panel test film which can stably perform an electrical test on a panel by improving the corrosion resistance and abrasion resistance of each of a plurality of contact lines for transmitting test signals to the leads of the panel .

A panel test film according to one aspect of the present invention is a panel test film used for a panel test probe apparatus, comprising: a first film having a plurality of first wiring patterns for receiving test signals from the probe apparatus; And a plurality of second wiring patterns for transmitting the test signals received from the plurality of first wiring patterns to the panel, wherein each of the plurality of second wiring patterns includes a plurality of first wiring patterns, And a second film bonded to the first film, wherein at least a part of the plurality of second wiring patterns is formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns.

The second film may be formed by providing a wiring layer made of a material having higher corrosion resistance and wear resistance than the plurality of first wiring patterns and etching the wiring layer to form the second plurality of second wiring patterns separated to correspond to the pitches of the leads of the panel. A bottom film is formed under the plurality of second wiring patterns, and a cover layer is bonded to the bottom film, and the outer supporting portion is bonded to the outer bottom supporting portion, As shown in FIG.

In addition, at least a part of the plurality of second wiring patterns may be made of any one of beryllium copper, beryllium nickel, and stainless steel (SUS).

Also, at least a part of the plurality of second wiring patterns may be plated with any one of beryllium copper, beryllium nickel, and SUS.

The plurality of second wiring patterns may include a plurality of signal transmission patterns corresponding to each of the plurality of first wiring patterns and extended to each of the plurality of signal transmission patterns so as to correspond to lead wires of the panel, And a plurality of contact lines for transmitting the test signals received from the signal transfer pattern to the leads of the corresponding panel.

The plurality of contact lines may be formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns.

The plurality of signal transmission patterns and the plurality of contact lines may be formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns.

The second film may include a bottom film, the plurality of signal transmission patterns may be disposed on the bottom film, the plurality of contact lines may be disposed under the bottom film, And a plurality of vias formed in a via hole formed through the bottom film so as to be electrically connected to the plurality of contact lines, the plurality of vias being formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns have.

The panel test film according to another aspect of the present invention is a panel test film used for a panel test probe apparatus, comprising: a first film having a plurality of first wiring patterns for receiving test signals from the probe apparatus; And a plurality of second wiring patterns transmitting the test signals received from the plurality of first wiring patterns to the panel, wherein each of the plurality of second wiring patterns corresponds to each of the plurality of first wiring patterns And a second film bonded to the first film. The plurality of first wiring patterns and the plurality of second wiring patterns are integrally formed of a material having higher corrosion resistance and abrasion resistance than the copper material of the copper film.

The present invention is characterized in that a plurality of contact lines for transmitting the test signals to the leads of the panel are formed of a material having high corrosion resistance and wear resistance than a plurality of wiring patterns for receiving test signals from the probe apparatus, The corrosion resistance and the abrasion resistance are improved. Therefore, it is possible to form a contact line having a small outer diameter, and it is possible to cope with a highly integrated pattern trend, thereby ensuring the reliability of the test.

Further, according to the present invention, since the corrosion resistance and the wear resistance of each of the plurality of contact lines are improved, it is possible to suppress warpage or deformation of the contact line when the panel is in contact with the lead wire in a characteristic test, The stability of the electrical test on the panel can be improved.

Further, according to the present invention, the corrosion resistance and the wear resistance of each of the plurality of wiring patterns are improved, so that even if the end portion of the panel and the panel test film are repeatedly contacted during the characteristic test on the panel, The frequency of occurrence of abrasion of the contact line can be lowered even in the case of thousands to tens of thousands of panel tests with one probe block. Therefore, the replacement period is long and the service life can be secured.

1 is a schematic view showing a prior art panel test film.
2 is a view showing a conventional panel test film.
3 is a schematic view showing a prior art panel test film used in the test of the panel.
4 is a view showing a panel test film of the present invention.
5 is a schematic view showing a second film according to the first embodiment of the panel test film of the present invention.
6 is a schematic view showing a second film according to a second embodiment of the panel test film of the present invention.
7 is a schematic view showing a second film according to a third embodiment of the panel test film of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the following embodiments. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an," and "the" include plural forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, regions and / or regions, it should be understood that these elements, components, regions, layers and / Do. These terms do not imply any particular order, top, bottom, or top row, and are used only to distinguish one member, region, or region from another member, region, or region. Thus, the first member, region or region described below may refer to a second member, region or region without departing from the teachings of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the present invention should not be construed as limited to any particular shape of the regions illustrated herein, including, for example, variations in shape resulting from manufacturing.

First, the panel test film of the present invention includes a plurality of wires for receiving test signals from a probe apparatus as a test apparatus, and a plurality of contact lines for transmitting the test signals in contact with lead wires of the panel, And a wiring pattern forming a contact line interposed between the materials, wherein the wiring pattern is made of a material having higher corrosion resistance and abrasion resistance than the copper film pattern (13a).

At this time, the panel test film of the present invention may include the wiring pattern made of a material such as beryllium copper, beryllium nickel, and stainless steel (SUS). The wiring pattern may be plated with any one of beryllium copper, beryllium nickel, and SUS.

That is, FIG. 4 is a view showing the panel test film of the present invention. As shown in FIG. 4, first, the panel test film of the present invention includes a first film 10 and a second film 30 that is bonded onto the first film 10.

Here, the panel test film of the present invention is composed of the contact member A composed of the second film 30 and the first film 10 of the first film 10 which is bonded to the second film 30 And a signal receiving portion D composed of a signal transmitting portion C including the joining member B and the first film 10 outside the joining member B. At this time, the first film 10 is composed of a plurality of copper film patterns 13a as a plurality of first wiring patterns to be described later, and the second film 30 includes a plurality of second wiring patterns 31a to be described later , The length of the second wiring pattern 31a of the contact member A may be shorter than the length of the copper film pattern 13a of the bonding member B. [ The length of the second wiring pattern 31a of the contact member A may be longer than the length of the copper film pattern 13a of the bonding member B. [ In addition, the plurality of second wiring patterns 31a can constitute the entire signal transmitting portion C.

The first film 10 and the second film 30 can be thermally bonded and bonded by an ACF (anisotropic conductive film) in which particles of a conductive material are dispersed in a resin as an adhesive.

Subsequently, the first film 10 constituting the panel test film of the present invention includes a plurality of first wiring patterns formed on the bottom film 11 as the first bottom film and receiving test signals from the probe apparatus do.

Here, the plurality of first wiring patterns comprise a plurality of copper film patterns 13a. Although not shown in the drawings, the probe device is connected to lead wires of a panel to be inspected. The probe device applies an inspection signal to the panel and detects an output signal according to an inspection signal to determine whether the panel has normal electrical characteristics And is connected to the lead wire of the panel through the contact line 33 of the second film 30, which will be described later, with the panel test film of the present invention mounted thereon.

The second film 30 includes a plurality of second wiring patterns 31a for transmitting the test signals received from the plurality of copper film patterns 13a to the panel. Here, the plurality of second wiring patterns 31a are formed with a plurality of signal transmission patterns corresponding to each of the plurality of copper film patterns 13a, and a plurality of signal transmission patterns corresponding to the lead wires of the panel, And a plurality of contact lines (33) for transmitting the test signals received from the plurality of signal transmission patterns to the leads of the corresponding panel. At this time, the plurality of signal transmission patterns and the contact line 33 may be integrally formed.

The second film 30 is bonded to the upper side of the first film 10 such that each of the plurality of signal transmission patterns of the plurality of second wiring patterns 31a corresponds to each of the plurality of the copper film patterns 13a.

At this time, at least a part of the plurality of second wiring patterns 31a is formed of a material having higher corrosion resistance and abrasion resistance than the plurality of copper film patterns 13a.

That is, the plurality of signal transmission patterns and the plurality of contact lines 33, which are the plurality of second wiring patterns 31a, are formed of a material having higher corrosion resistance and abrasion resistance than the plurality of copper film patterns 13a. For example, the plurality of signal transmission patterns and the plurality of contact lines 33 may be made of beryllium copper, beryllium nickel, SUS, or the like. The plurality of signal transmission patterns and the plurality of contact lines 33 may be plated with any one of beryllium copper, beryllium nickel, and SUS.

Although the panel test film of the present invention is not shown, only a plurality of contact lines 33, which are part of the plurality of second wiring patterns 31a, are formed of a material having higher corrosion resistance and abrasion resistance than the plurality of copper film patterns 13a do. For example, the plurality of contact lines 33 may be made of a material such as beryllium copper, beryllium nickel, SUS, or the like. In addition, the plurality of contact lines 33 may be plated with any one of beryllium copper, beryllium nickel, and SUS.

Although not shown, the first wiring patterns and the plurality of second wiring patterns 31a may be integrally formed of a material such as beryllium copper, beryllium nickel, SUS, or the like .

Hereinafter, a method of forming the second film 30 will be described in detail.

First Embodiment

5 is a schematic view showing a second film according to the first embodiment of the panel test film of the present invention. 5A is a schematic view showing a wiring layer, FIG. 5B is a schematic view showing a plurality of second wiring patterns connected to each other, FIG. 5C is a schematic view showing a state in which a gap between the second bottom film and the cover layer FIG. 5D is a perspective view showing a second wiring pattern spaced apart from each other. FIG.

As shown in Fig. 5A, first, a wiring layer 31 is provided. Here, the wiring layer 31 is made of a material having higher corrosion resistance and abrasion resistance than the copper film pattern 13a.

As shown in FIG. 5 (b), the wiring layer 31 is formed of a plurality of spaced apart and separated portions having a regular or irregular shape through etching, pressing, forging, CNC or the like and corresponding to the pitch of the lead wires of the panel A bridge 31b for connecting the plurality of second wiring patterns 31a to each other and fixing the second wiring patterns 31a is formed as an outer brim part for supporting the plurality of second wiring patterns 31a at the edge, ).

5 (c), a second bottom film 35 is formed below the plurality of second wiring patterns 31a, and a cover layer 37 is formed over the plurality of second wiring patterns 31a. Respectively.

Then, as shown in Fig. 5 (d), the bridge 31b connected to each of the plurality of second wiring patterns 31a is removed. Here, the removal of the bridge 31b can be removed by various methods such as CNC, forging or etching. In addition, the plurality of contact lines 33 of the second film 30 are exposed downward from the edge of the second film 30 in a certain area so as to be in contact with the lead wire of the panel.

Second Embodiment

6 is a schematic view showing a second film according to a second embodiment of the panel test film of the present invention. 6 (b) is a schematic view showing the second bottom film, and Fig. 6 (c) is a schematic view showing a wiring layer deposited on the second bottom film. Fig. 6 And FIG. 6 (d) is a schematic view showing a plurality of second wiring patterns formed by patterning the wiring layer on the second bottom film.

As shown in Fig. 6 (a), first, a wiring layer 31 is provided.

Then, as shown in Fig. 6 (b), the second bottom film 35 is provided.

6 (c), the wiring layer 31 is deposited on the second bottom film 35. Next, as shown in Fig.

6 (d), the wiring layer 31 is patterned by photolithography to form a plurality of second wiring patterns 31a on the second bottom film 35 at predetermined intervals . Here, the predetermined interval may mean an interval in which the adjacent second wiring patterns 31a do not interfere with each other with electrical signals.

Although not shown on the upper side of the plurality of second wiring patterns 31a, the cover layer 37 is bonded. Here, the plurality of contact lines 33 of the second film 30 are exposed downward from the edge of the second film 30 through a certain area so as to be in contact with the lead wire of the panel.

Third Embodiment

7 is a schematic view showing a second film according to a third embodiment of the panel test film of the present invention. As shown in Fig. 7, first, a second bottom film 35 is provided.

A plurality of second wiring patterns 31a are disposed on the second bottom film 35 and a plurality of contact lines 33 separated from each other to correspond to the pitches of the leads of the panel are formed on the second bottom film 35 are formed in a via hole formed through the second bottom film 35 such that each of the plurality of second wiring patterns 31a and the plurality of contact lines 33 are electrically connected to each other, Via (V) is formed by plating with copper, beryllium copper, beryllium nickel, SUS, etc., which have higher corrosion resistance and abrasion resistance than copper copper material.

Thereafter, although not shown on the upper side of the plurality of second wiring patterns 31a, the cover layer 37 is bonded.

Here, the plurality of contact lines 33 of the second film 30 are exposed downward from the edge of the second film 30 through a certain area so as to be in contact with the lead wire of the panel.

The plurality of copper film patterns 13a, the plurality of second wiring patterns 31a and the vias V as the first wiring pattern are formed by forming a plurality of via holes in predetermined portions of the second bottom film 35, It is made of a material having higher corrosion resistance and abrasion resistance than the copper material of the copper film and can be integrally formed.

As described above, since the panel test film of the present invention includes the wiring pattern made of a material having higher corrosion resistance and abrasion resistance than the copper film pattern 13a, the corrosion resistance and the wear resistance of the copper film pattern 13a are improved more than the copper film pattern 13a, When a voltage for characteristic test is applied to the panel, generation of burning due to current and electric influence is suppressed to prevent occurrence of disconnection, and in the case of FPC, disconnection does not occur frequently. Thus, a fine contact line is formed It is possible to cope with pattern trends that are highly integrated, and the reliability of the test can be ensured.

Further, since the panel test film of the present invention has improved corrosion resistance and abrasion resistance of each of a plurality of contact lines, it is possible to suppress warpage or deformation of the contact line when the panel is in contact with the lead wire in a characteristic test , The stability of the electrical test on the panel can be improved as the contact becomes stable.

Further, since the panel test film of the present invention has improved corrosion resistance and wear resistance of each of a plurality of wiring patterns, even if the end of the panel and the panel test film are repeatedly contacted during the characteristic test on the panel, Cracks are not generated in the pattern, and the frequency of occurrence of abrasion of the contact line can be lowered even in the case of thousands to tens of thousands of panel tests with one probe block, so that the replacement period is long and the service life can be secured.

Although the embodiments of the panel test film of the present invention have been described above, it is apparent that various modifications can be made without departing from the scope of the present invention.

Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

10: first film 11: bottom film
13: Copper film 13a: Copper film pattern
30: second film 31: wiring layer
31a: second wiring pattern 33: contact line
35: second bottom film 37: cover layer

Claims (9)

A panel test film used for a panel test probe apparatus,
A first film having a plurality of first wiring patterns for receiving test signals from the probe device; And
And a plurality of second wiring patterns for transmitting the test signals received from the plurality of first wiring patterns to a panel, wherein each of the plurality of second wiring patterns includes a plurality of second wiring patterns, A second film bonded to the first film; / RTI >
Wherein at least a part of the plurality of second wiring patterns is formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns. The film according to claim 1,
A wiring layer made of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns is provided and is etched to form the plurality of second wiring patterns separated to correspond to the pitch of the leads of the panel, A bottom film is formed under the plurality of second wiring patterns, a cover layer is bonded to the bottom film, and a plurality of second wiring patterns are formed, film. The semiconductor device according to claim 1, wherein at least a part of the plurality of second wiring patterns
Beryllium copper, beryllium nickel, and stainless steel (SUS). The semiconductor device according to claim 1, wherein at least a part of the plurality of second wiring patterns
Wherein the film is plated with a material selected from beryllium copper, beryllium nickel, and stainless steel (SUS). The semiconductor device according to claim 1, wherein the plurality of second wiring patterns
A plurality of signal transmission patterns corresponding to each of the plurality of first wiring patterns; And
A plurality of contact lines extending from each of the plurality of signal transmission patterns to correspond to lead wires of the panel and transmitting the test signals received from the plurality of signal transmission patterns to the leads of the corresponding panel;
And,
Wherein the plurality of contact lines are formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns. The semiconductor device according to claim 1, wherein the plurality of second wiring patterns
A plurality of signal transmission patterns corresponding to each of the plurality of first wiring patterns; And
A plurality of contact lines extending from each of the plurality of signal transmission patterns to correspond to lead wires of the panel and transmitting the test signals received from the plurality of signal transmission patterns to the leads of the corresponding panel;
And,
Wherein the plurality of signal transmission patterns and the plurality of contact lines are formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns. The method according to claim 1,
Wherein the plurality of second wiring patterns
A plurality of signal transmission patterns corresponding to each of the plurality of first wiring patterns; And
A plurality of contact lines extending from each of the plurality of signal transmission patterns to correspond to lead wires of the panel and transmitting the test signals received from the plurality of signal transmission patterns to the leads of the corresponding panel;
And,
Wherein the second film comprises:
A plurality of signal transmission patterns are disposed on the bottom film, a plurality of contact lines are disposed under the bottom film, and each of the plurality of signal transmission patterns and each of the plurality of contact lines A via hole formed through the bottom film so as to be electrically connected to each other; and a plurality of vias formed of a material having higher corrosion resistance and abrasion resistance than the plurality of first wiring patterns. A panel test film used for a panel test probe apparatus,
A first film having a plurality of first wiring patterns for receiving test signals from the probe device; And
And a plurality of second wiring patterns for transmitting the test signals received from the plurality of first wiring patterns to the panel, wherein each of the plurality of second wiring patterns includes a plurality of first wiring patterns, A second film bonded to the first film; / RTI >
Wherein the plurality of first wiring patterns and the plurality of second wiring patterns are integrally formed of a material having higher corrosion resistance and abrasion resistance than the same material. The semiconductor device according to claim 8, wherein the plurality of first wiring patterns and the plurality of second wiring patterns
Beryllium copper, beryllium nickel, and SUS.

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