KR101258512B1 - Film for testing lcd panel, test device for testing lcd panel and method for manufacturing test device for testing lcd panel - Google Patents

Abstract

PURPOSE: A liquid crystal panel inspection film, a liquid crystal panel inspection apparatus and a manufacturing method of a liquid crystal inspection apparatus are provided to simplify a manufacturing process and to reduce manufacturing costs by improving a structure of a film. CONSTITUTION: A liquid crystal inspection film(100) includes a first film(120) and a second film(140). An input end pad receives a test signal from a flexible circuit board and an output end pad replicates a test signal and outputs to a liquid crystal panel. The liquid crystal inspection film branches the test signals applied from the flexible circuit board into n number of signals, replicates a set of test signals applied to the output end contacting to the liquid crystal panel by n, and transfers the test signals to the liquid crystal panel.

Description

FILM FOR TESTING LCD PANEL, TEST DEVICE FOR TESTING LCD PANEL AND METHOD FOR MANUFACTURING TEST DEVICE FOR TESTING LCD PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal panel inspection film, a liquid crystal panel inspection device, and a liquid crystal panel inspection device, and more particularly, to a liquid crystal panel inspection in which a source and a gate signal are mixed and driven on one side of a panel in a driving mode of the panel. The present invention relates to a liquid crystal panel inspection film, a liquid crystal panel inspection apparatus, and a liquid crystal panel inspection apparatus, which can simplify the manufacturing process of the inspection apparatus used and reduce the manufacturing cost.

Due to the wide variety of uses of the display device, research on the liquid crystal panel mounted on the display device and a method of inspecting the same has been actively conducted. The normal liquid crystal panel, which has been inspected for defects, is mounted on a module and used for a display device such as a TV or a monitor.

1 is a view showing an inspection apparatus of a liquid crystal panel according to the prior art, Figure 2 is a view showing a plane of the test device of FIG.

1 and 2, the wire connection unit 125 according to the related art includes a test applied from a flexible printed circuit (FPC). The driving unit DRV including a driving IC DIC for receiving a signal and converting the same into an analog voltage used to drive the liquid crystal panel PAN and a test signal converted into an analog voltage in contact with the liquid crystal panel PAN. The probe PRB may be provided to the input lines PILIN of the PAN. In this case, the driving unit DRV may be a TAB IC, and the probe PRB may be provided as a needle or a blade type. TAB IC refers to a packaged driving IC (DIC) in the form of a film. The test signal is received from the flexible printed circuit FPC and transmitted to the driving unit DRV through the first lines LIN1 disposed on the film FIL, and the driving unit DRV is converted into an analog voltage. The converted test signal is transferred to the probe PRB through the second lines LIN2 disposed on the film FIL.

3 is a view showing another liquid crystal panel inspection device according to the prior art, Figure 4 is a view showing a plane of the test device of FIG.

3 and 4, the driving unit DRV of another liquid crystal panel inspecting apparatus TD according to the related art does not include a separate driving IC, and directly connects the liquid crystal panel PAN from the flexible printed circuit FPC. The driving image signals (analog voltages) are received as test signals, copied as many as necessary to inspect the liquid crystal panel PAN, and transmitted to the liquid crystal panel PAN.

3 and 4 particularly show examples in which the drive unit DRV receives six image signals from the flexible printed circuit FPC. The six image signals may be color signals of R, G, B, R ', G', and B 'required for driving the liquid crystal panel PAN. The driving unit DRV of FIGS. 3 and 4 has a wiring structure capable of repeatedly outputting six test signals TET received from the flexible printed circuit FPC.

Although the liquid crystal panel inspection apparatus TD of FIGS. 3 and 4 is difficult to inspect whether the liquid crystal panel PAN is defective for a specific pattern, unlike the liquid crystal panel inspection apparatus TD of FIGS. 1 and 2. The same color may be applied to the entirety of the PAN to be suitable for inspecting defective cells.

The wiring structure of the film used in the liquid crystal panel inspection device of FIG. 4 has a structure in which wires formed on one surface and the other surface of the film, which are insulators, are electrically connected through a via hole. In this case, the shorter the distance between the wires, the more complicated the manufacturing process and the higher the manufacturing cost.

In addition to the inspection methods shown in FIGS. 3 and 4, not only R, G, B, R ', G', and B 'but also gates are mixed with R, G, B, R', G ', and B' in recent years. A panel driving method in which repeatability is further complicated is proposed, and therefore, there exists a technical problem which is not solved by the conventional method also in manufacture of an inspection apparatus. That is, there are problems such as complicated manufacturing process and increased manufacturing cost.

The present invention has been made to solve the above problems, the source signal such as R, G, B, R ', G' and B 'as well as the gate signal is R, G, B, R', G ' And a method for manufacturing a liquid crystal panel inspection film, a liquid crystal panel inspection apparatus, and a liquid crystal panel inspection apparatus capable of simplifying the manufacturing process and reducing the manufacturing cost of the panel inspection film mixed with B 'and having more repeatability. There is this.

To this end, in the driving form of the panel according to an embodiment of the present invention, the liquid crystal panel inspection film, in which a source and a gate signal are mixed and driven on one surface of the panel, includes: first wirings for receiving first test signals; Second wires for branching the first test signals received from the first wires into n (n is a natural number), respectively, and transferring the branched test signals to corresponding input lines of the liquid crystal panel; A wire connection part connected to wires and the second wires to connect the first test signals from the first wires to the second wires, third wires receiving second test signals, and the third wires; The fourth wires for branching the second test signals received from the three wires into m (m is a natural number) respectively and transferring the branched test signals to corresponding input lines of the liquid crystal panel are identical. A sixth film for branching the first film formed on the surface, fifth wires for connecting with the third wires, and the second test signals received through the fifth wires to m (m is a natural number), respectively Wirings are formed on one surface, and seventh wirings are formed on the other surface to have the same number as the number of the fifth wirings and cross the sixth wirings, and the seventh wirings respectively correspond to the via holes. A second film configured to be electrically connected to fifth wirings and the sixth wirings, wherein the first wirings, the second wirings, the third wirings, and the fourth wirings of the first film And portions of the fifth wires, the sixth wires, and the seventh wires of the second film except the contact pads are covered by an insulator, and the pads formed on the fifth wires of the second film The first The second film so as to contact a pad formed in the third wires of the first wire, and the pad formed in the sixth wires formed in the second film to contact a pad formed in the fourth wires of the first film. It may be configured to be seated on the first film.

The second wires and the fourth wires may be arranged in an order corresponding to corresponding input lines of the liquid crystal panel.

The second film may be bonded and bonded to the first film, or may be contacted by pressure by a fixing member.

The wire connection part may be electrically connected to a substrate, metal lines formed on the substrate in the same number as the number of the first wires, and the first wires and the second wires on the metal lines. A plurality of bumps formed at a position corresponding to the position, and the first test signal is branched to the n by contacting each of the bumps and a position corresponding to each of the first wirings and the second wirings. The first wires and the second wires may be electrically connected to only a metal line connected to the bump among the metal lines.

The wiring connection part may further include an insulating layer covering the metal lines on which the bumps on the substrate are not formed.

The first test signal may be a source signal, and the second test signal may be a gate signal.

In addition, in the driving mode of the panel according to an embodiment of the present invention, a liquid crystal panel inspection apparatus in which a source and a gate signal are mixed and driven on one surface of the panel is a body block and a liquid crystal panel inspection attached to a bottom of the body block. And a flexible circuit board connected to the rear end of the film for inspecting the liquid crystal panel and transmitting a test signal, wherein the film for inspecting the liquid crystal panel may have a configuration as described above.

In addition, according to an embodiment of the present invention, a method of manufacturing a liquid crystal panel inspection apparatus in which a source and a gate signal are mixed and driven on one surface of a panel may include: first wirings receiving first test signals And second wires for transmitting the first test signals received from the first wires to corresponding input lines of the liquid crystal panel, and the first wires and the second wires connected to the first wires. A wire connection part connecting first test signals from the first wires to the second wires, third wires receiving second test signals, and the second test signals received from the third wires, respectively. a first step of forming fourth wirings on the same side of the first film by branching into n (n is a natural number) and passing branched test signals to corresponding input lines of the liquid crystal panel; Fifth wires connected to the third wires on one surface of a second film, and sixth wires for branching the second test signals received through the fifth wires into n (n is a natural number), respectively. And forming seventh wires on the other surface of the second film to have the same number as the fifth wires and intersect the sixth wires, and respectively corresponding to the seventh wires through via holes. And a third step of electrically connecting a wiring and the sixth wires; and a third step of mounting the second film on the first film, wherein the third step comprises: forming the second film on the first film; Contacting a pad formed on the wirings with a pad formed on the third wirings of the first film; and forming a pad formed on the sixth wirings on the second film by the fourth wiring of the first film. On the pads formed in the field Contacting may be included.

The third step may be performed by bonding the second film by bonding to the first film or by contact bonding by pressure by a fixing member.

In addition, the manufacturing method of the liquid crystal panel inspection apparatus according to an embodiment of the present invention may further comprise a fourth step of connecting the flexible circuit board for applying a test signal to the rear end of the first film.

According to the method for manufacturing a liquid crystal panel inspection film, a liquid crystal panel inspection device, and a liquid crystal panel inspection device according to the present invention, there is an advantage in that the structure of the film can be improved to simplify the manufacturing process of the film and reduce the manufacturing cost.

1 is a view showing an inspection apparatus of a liquid crystal panel according to the prior art.
FIG. 2 is a diagram illustrating a plane of the test apparatus of FIG. 1. FIG.
3 is a view showing another liquid crystal panel inspection device according to the prior art.
4 is a diagram illustrating a plane of the test apparatus of FIG. 3.
5 is a view showing a liquid crystal panel inspection film according to an embodiment of the present invention.
6 is a view showing a first film of the film for inspecting a liquid crystal panel according to an embodiment of the present invention.
7 is a view showing a second film of the liquid crystal panel inspection film according to an embodiment of the present invention.
FIG. 8 is a diagram illustrating a side view of the second film of FIG. 7.
9 is a view showing a first embodiment of a wire connection portion of the first film according to an embodiment of the present invention.
FIG. 10 is a view illustrating in detail the connection of the wires and the metal lines of FIG. 9.
11 is a view showing a wiring connection part according to a second embodiment.
12 is a diagram illustrating a wire connection unit according to a third embodiment.
13 is a diagram illustrating a wire connection unit according to a fourth embodiment.
14 is a diagram illustrating a wire connection unit according to a fifth embodiment.
15 is a diagram illustrating a wire connection unit according to a sixth embodiment.
16 is a diagram illustrating a part of a cross section of a wire connection unit according to an exemplary embodiment of the present invention of FIGS. 9 to 15.
17 is a view illustrating a method of manufacturing a wire connection unit according to an embodiment of the present invention of FIGS. 9 to 15.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the following embodiments. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an," and "the" include plural forms unless the context clearly dictates otherwise. Also, " comprise " and / or " comprising " as used herein specify the presence of stated shapes, numbers, steps, operations, elements, elements, and / , But does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups. As used herein, the term " and / or " includes any and all combinations of any of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, regions and / or regions, it should be understood that these elements, components, regions, layers and / Do. These terms do not imply any particular order, top, bottom, or top row, and are used only to distinguish one member, region, or region from another member, region, or region. Thus, the first member, region or region described below may refer to a second member, region or region without departing from the teachings of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the present invention should not be construed as limited to any particular shape of the regions illustrated herein, but should include variations in shape resulting from, for example, manufacture.

5 is a view showing a liquid crystal panel inspection film according to an embodiment of the present invention.

Referring to FIG. 5, the liquid crystal panel inspection film 100 according to the exemplary embodiment of the present invention includes a first film 120 and a second film 140, and the input end pad includes a flexible circuit board ( The test signal XTET is applied from the FPC 10, and the test signal is copied to the liquid crystal panel PAN 20 and output to the output terminal pad. The test signals XTET may have an analog voltage value.

The liquid crystal panel inspection film 100 divides the test signals XTET applied from the flexible circuit board 10 into n and sets a set of test signals XTET applied to an output terminal contacting the liquid crystal panel 20. The test signals are transmitted to the liquid crystal panel 20 by copying a total of n times.

For example, the test signals XTET for the liquid crystal panel test may be composed of six color signals of R, G, B, R ', G', and B ', and may be a source chip or a gate. ) May be a combination of signals applied to the chip. As will be described later, the source signal and the gate signal may be separately input to the input terminal.

It is possible to copy and output the set of test signals XTET input in FIG. 5 by n times by the structure of the first film 120 and the second film 140. Referring to FIGS. 6 and 7 below. It will be described with respect to the specific configuration.

6 is a view showing a first film of the liquid crystal panel inspection film according to an embodiment of the present invention, Figure 7 is a view showing a second film of the liquid crystal panel inspection film according to an embodiment of the present invention.

Referring to FIG. 6, it can be seen that a plurality of signal lines and pads are formed on the first film 120. The left side of the first film 120 of FIG. 6 corresponds to an input terminal to which the test signals XTET are applied, and the right side corresponds to an output terminal to which a set of test signals XTET is copied n times.

Pads 121 and 122 are formed on the left side of the first film 120 to receive test signals XTET applied from the flexible circuit board 10. The pads 121 and 122 may be in contact with the signal line of the flexible circuit board 10 to receive the test signals XTET.

The pad 121 and the pad 122 may each receive different kinds of test signals XTET. For example, the pad 121 may receive gate signals, and the pad 122 may receive a source signal. Can be authorized.

The source signals are connected to the wire connection unit 125 through the first wires LIN1 through the pad 122, and the wire connection unit 125 branches the n source signals into n signals, i.e., the n signal sets. It is connected to the lines LIN2.

The wire connection unit 125 functions to copy and output the test signals XTET, that is, the source signals applied through the first wires LIN1 by n times, and a detailed configuration thereof will be described later.

The gate signals are applied to the pad 121 and transmitted to the pad 122a formed at the opposite end via the third lines LIN3. The second wiring LIN2 is formed between the second wirings LIN2 in an area corresponding to the right portion of the pad 122a of the third wirings LIN3 among the regions where the second wirings LIN2 of the first film 120 are formed. Fourth wirings LIN4 to which the gate signal is applied are formed to match the arrangement of the corresponding signal lines of the panel.

Gate signals applied to the pad 122a are connected to correspond to the fourth wires LIN4 through the second film 140, respectively.

In FIG. 7, the second film 140 is shown. The second film 140 includes fifth lines LIN5 142, sixth lines LIN6 143, and seventh lines LIN7 145. As illustrated in FIG. 7, a pad is formed at the end of the fifth wires 142 to contact the pad 122a, and each of the sixth wires 143 is connected to the fifth wires 142. In order to provide a plurality of sets in advance.

The fifth wires 142 and the sixth wires 143 are both formed on the same surface of the second film 140, and the seventh wires 145 are formed on the other surface of the second film 140. As shown in FIG. 7, the seventh wires 145 are formed to cross the sixth wires 143 perpendicularly. Each of the seventh wires 145 is connected to the fifth wires 142 and the sixth wires 143 so as to correspond to each other through the via hole VIA.

That is, a side view of the second film 140 is illustrated in FIG. 8, in which a plurality of via holes VIA are formed in the insulating film 144, so that the seventh wires 145 are located on opposite sides of the sixth wire. Is electrically connected to the field 143.

Although not specifically illustrated in FIG. 8, the seventh wires 145 are connected to the sixth wires 143 through via holes so as to correspond to each of the fifth wires 142 and each other. In FIG. 7, the fifth wirings 142 are illustrated as four, and the seventh wirings 145 are also four, and are electrically connected to each of the fifth wirings 142 and via holes. It can be seen that the seventh wires 145 can be electrically connected to the sixth wires 143 through the via hole repeatedly so as to copy the gate signal applied to the four lines n times.

5 illustrates a form in which the second film 140 is attached to the first film 120. That is, the source signal is copied and output to n sets through the wire connection part 125 through the first wires LIN1, and the gate signals are output from the second film 140 through the third wires LIN3. The seventh wiring 145 and the sixth wiring 143, and as a result, are electrically connected to the fourth wirings LIN4 pre-formed on the first film 120, so that a source signal and a gate signal are finally applied to the liquid crystal panel. It is output in a certain order.

In this case, the wiring structure of the second film 140 and the arrangement of the fourth wirings LIN4 may be determined to correspond to the arrangement of the source and gate signals required to be applied to the liquid crystal panel.

In addition, the wirings of the first film 120 and the second film 140 may be covered by an insulator (not shown), and the pads may be formed to be exposed from the insulator for electrical contact.

A liquid crystal panel inspection apparatus having the liquid crystal panel inspection film 100 as described above may be provided. The liquid crystal panel inspection apparatus may include a body block (not shown), and the liquid crystal panel inspection film 100 having the above structure may be attached to the bottom of the body block. A flexible circuit board (FPC) for applying a test signal may be connected to a rear end of the liquid crystal panel inspection film 100, specifically, a rear end of the first film 120. The body block may also be configured to be connected to the manipulator to perform contact and separation operations with the liquid crystal panel.

In FIG. 5, the structure in which the second film 140 is bonded to the first film 120 is illustrated, but a separate fixing member (not shown) may be provided to press the second film 140 to maintain a contact state. Could be At this time, damage to the film can be prevented by using an elastic member such as a rubber. As such, in the case of adopting a form of pressure fixing rather than bonding, there is an advantage in that the separation is easy when the film needs repair.

In addition, the first film 120 and the second film 140 in the present invention may be formed of a material of a flexible printed circuit board (FPC), or may be a film manufactured by a chip on flim (COF) method. Here, the film manufactured by the COF method is the same as the COF film except that a chip is mounted. Preferably, the first film 120 is a film manufactured by the COF method, the second film 140 may be an FPC film.

In addition, although the gate signal and the source signal are exemplified as the test signals applied to the two pads 121 and 122 above, any signal may be used as long as the above structure can be used.

Hereinafter, the structure of the wire connection unit 125 will be described in detail with reference to FIGS. 9 to 17.

9 is a view showing the wiring connection portion 125 in the first embodiment of the present invention.

Referring to FIG. 9, the wire connection unit 125 according to an embodiment of the present invention includes a film FIL, first wires LIN1s, second wires LIN2s, and a wire connection unit CNLIN. The first lines LIN1s receive the test signals XTET from the flexible printed circuit FPC, and the second lines LIN2s transfer the test signals XTET to the input line of the corresponding panel. The test signals XTET may have an analog voltage value as described above.

The first interconnections LIN1s and the second interconnections LIN2s may be formed on the first surface of the film FIL, respectively. On the film FIL, the first interconnections LIN1s and the second interconnections LIN2s are respectively separated from each other. That is, unless they are electrically connected by the wire connection part CNLIN, which will be described later, the first wires LIN1s and the second wires LIN2s are electrically separated from each other and formed on the film FIL.

The wire connection part CNLIN includes metal lines MLs electrically connecting the first wires LIN1s to the corresponding second wires LIN2s, respectively. The second lines LIN2s may be electrically connected to the corresponding first lines, thereby copying (branching) the test signals XTET received through the first lines LIN1s and transmitting the same to the liquid crystal panel PAN. . Accordingly, the metal lines MLs are provided in the number corresponding to the number of the first lines LIN1s, and the second lines LIN2s are n of the number of the first lines LIN1s (n is a natural number). Can be provided by ship.

However, in FIG. 9, for convenience of illustration, the second lines LIN2s are shown as being provided twice as much as the first lines LIN1s. In the example of FIG. 6, in order to drive the liquid crystal panel PAN, the flexible printed circuit FPC uses six color signals of R, G, B, R ', and G' B 'as source signals as first test wirings. The first wirings LIN1s are provided in six because the first lines LIN1s are applied. Therefore, the metal lines MLs may be provided as six metal lines MLs of the first to sixth metal lines ML1 to ML6. However, the present invention is not limited thereto, and when the test signals are provided in different numbers from six, the number of the first wires, the second wires, and the metal lines may be provided differently.

The metal lines MLs may be connected to first and second wirings and bumps BUMs, respectively. For example, the first metal line ML1 may include the eleventh wire LIN11 for receiving the first test signal XTET1 and the twenty-first wires for applying the first test signal XTET1 to the liquid crystal panel PAN. The second metal line ML2 is connected to the LIN21 and the bump BUM, and the second metal line ML2 connects the twelfth wiring LIN12 and the second test signal XTET2 to the liquid crystal panel PAN to receive the second test signal XTET2. The third metal line ML3 is connected to the 22nd lines LIN22 to be applied to the bump BUM, and the third metal line ML3 is connected to the thirteenth line LIN13 and the third test signal XTET3 to receive the third test signal XTET3. Is connected to the twenty-third lines LIN23 to which the liquid crystal panel PAN is applied to the bump BUM. Similarly, the fourth metal line ML4 may include the fourteenth wire LIN14 that receives the fourth test signal XTET4 and the twenty-fourth wires LIN24 that apply the fourth test signal XTET4 to the liquid crystal panel PAN. And bumps BUM, and the fifth metal line ML5 applies the fifteenth line LIN15 and the fifth test signal XTET5 to receive the fifth test signal XTET5 to the liquid crystal panel PAN. The sixth metal line ML6 is connected to the twenty-fifth lines LIN25 through the bump BUM, and the sixth metal line ML6 receives the sixteenth line LIN16 and the sixth test signal XTET6 that receive the sixth test signal XTET6. The 26th wiring LIN26 applied to the panel PAN is connected to the bump BUM.

Referring to FIG. 10, which illustrates the connection between the wires and the metal lines in detail, the bumps BUM are respectively located in contact with only the corresponding metal line among the metal lines MLs electrically separated using the insulating layer ISO. By doing so, the corresponding metal line and the wiring are electrically connected.

In this way, without the VIA process and the wiring lamination process of the semiconductor FAB of the existing technology that separates and connects the interconnected wires by layers, it is possible to cross wiring the lower metal line and the upper film wiring of the bump through the bump in the rear end bump process. It is possible to manufacture TAB IC (film) which is used for LCD inspection that can output the output signal of n times. In addition, the cost is reduced because the CNLIN is manufactured by using the bump process, which is a post-process, without using the semiconductor FAB shear process. In addition, if the output is formed in a sufficient number of times in the CNLIN, there is no need to go through the bump process every time to manufacture the TAB IC. Therefore, when manufacturing a new n-times TAB IC, only the assembly process of the second wirings (LIN2s) and the wiring connection part (CNLIN) is used, which significantly reduces the time and cost for the manufacturing process of the separate wiring connection part (CNLIN). It works.

Referring back to FIG. 9, the metal lines MLs may be provided in the shape of a closed rectangle in which four sides are connected. In this case, the first wires LIN1s may be connected to one side of the corresponding metal line, and the second wires LIN2s may be connected to one side and the other side of the corresponding metal line, respectively. The other side of the metal line may be positioned to face one side. For example, in FIG. 6, the first metal line ML1 has a quadrangular shape in which four sides 1 to 4 are connected to each other, and the first wire LIN11 has a first metal line ML1. The second wires LIN21 and LIN22 are connected to the other side 3 of the first metal line ML1, respectively.

In particular, FIG. 9 illustrates that the first metal line ML1 is positioned at the outermost position among the metal lines, and the second metal line ML2 is positioned adjacent to the inside of the first metal line ML1. ) Is illustrated to be located adjacent to the inside of the second metal line ML2. Similarly, the fourth metal line ML4 is positioned adjacent to the inside of the third metal line ML3, and the fifth metal line ML5 is positioned adjacent to the inside of the fourth metal line ML4, and the sixth metal line ML4 is located in the fourth metal line ML4. The ML6 is positioned adjacent to the inside of the fifth metal line ML5, so that the sixth metal line ML6 is positioned at the innermost angle of the metal lines MLs.

However, the present invention is not limited thereto. Referring to FIG. 11, which shows the wire connection unit 125 according to the second embodiment of the present invention, the first metal line ML1 connected to the eleventh wire LIN11 that receives the first test signal XTET1 is best. The sixth metal line ML6 positioned in the cabinet and connected to the sixteenth line LIN16 that receives the sixth test signal XTET6 may be formed at the outermost position.

FIG. 9 illustrates an example in which the metal lines MLs are provided in closed rectangular shapes, respectively, but are not limited thereto. Referring to FIG. 12, which shows the wire connection unit 125 according to the third exemplary embodiment of the present invention, a shape in which one side of four sides constituting the rectangle is broken, not a rectangular shape in which the metal lines MLs are closed. It can be formed as. In particular, the metal lines MLs of FIG. 12 illustrate an example in which a part of the other side positioned to face one side to which the first wires LIN1s are connected is cut in consideration of noise and the like.

In addition, referring to FIG. 13 illustrating the wire connection unit 125 according to the fourth embodiment of the present invention, the metal lines MLs may be provided in the shape of closed circles.

14 is a diagram illustrating a wire connection part 125 according to a fifth embodiment of the present invention. Referring to FIG. 14, the wire connection unit 125 according to the fifth embodiment of the present invention has one side of the metal lines MLs provided in a closed rectangular shape and the other side facing the one side. First wires LIN1s are respectively connected to the first and second lines LIN1s. For example, the eleventh line LIN1 is connected to one side 1 and the other side 2 of the first metal line ML1, respectively (see FIG. 9 for reference numerals of one side and the other side). When the metal lines MLs and the first lines LIN1s are connected to each other as in the wire connection unit 125 of FIG. 14, the metal lines MLs and the first lines LIN1s are relatively close to the first lines LIN1s (with the first lines on the metal line). The difference in the transmission distance between the test signals transmitted to the second wires close to each other and the test signals (distant from the first wire on the metal line) located relatively far from the first wires LIN1s. It is possible to prevent the difference caused by.

15 is a view showing a liquid crystal panel inspection device according to a sixth embodiment of the present invention. Referring to FIG. 15, the wire connection unit 125 according to the sixth embodiment of the present invention may respectively test the test signals XTET received from the flexible printed circuit FPC, where x (x is a natural number and x in the example of FIG. 12). = 2) first wirings LIN1s that are branched from each other and connected to the metal lines MLs. The wire connection part CNLIN of FIG. 12 includes x sub wire connection parts receiving the x branched first wires LIN1s, respectively (in the example of FIG. 12, the first sub wire connection part CNLIN1 and the second sub wire connection part). (CNLIN2)).

FIG. 15 illustrates that the test signal output from the second interconnections LIN2s connected to the sub interconnection connections CNLIN1 and CNLIN2 is transmitted to one of two separated liquid crystal panels PAN. In this case, the plurality of separated liquid crystal panels PAN may be part of one liquid crystal panel or may be a separate liquid crystal panel.

The structure and operation of each sub wire connection unit may be the same as the structure and operation of the wire connection unit of FIGS. 9 to 14 described above. Therefore, detailed description thereof will be omitted.

FIG. 16 is a view illustrating a part of a cross section of the wire connection parts according to the exemplary embodiment of FIGS. 9 to 15.

Referring to FIG. 16, as described above, each of the metal lines MLs of the driving part DRV according to the exemplary embodiment of the present invention is formed on the substrate SUB with the insulating layer ISO interposed therebetween. The metal lines MLs are also connected to the bumps BUM with the first lines LIN1s and the second lines LIN2s disposed on the first surface of the film FIL.

The driving unit DRV having the structure as shown in FIG. 16 may be manufactured by the process as shown in FIG. 17.

In the method of manufacturing the wire connection unit 125 according to the exemplary embodiment of the present invention, first, metal lines MLs are formed on the substrate SUB as shown in FIG. 17A. Next, as shown in FIG. 17B, an insulator is applied to form an insulating film ISO. Bumps BUM in the insulating layer ISO etch a region of the pad PAD to be in contact with the metal lines MLs (17 (c)). Then, bumps BUMs are formed on the pads PAD (14 (d)), and the bumps BUMs are bonded to the film FIL on which the wirings LIN1 and LIN2 are formed to be bonded to each other (FIG. 17 (e)).

In the process of manufacturing a TAB IC according to the prior art, the cost increases with the recovery of the photo mask. However, according to the manufacturing method of the driving unit DRV according to the embodiment of the present invention, except for forming the wiring lines LIN1 and LIN2 on the film FIL, the metal lines MLs on the substrate SUB. In total, only three masks are used, a mask for forming a pad), a mask for etching a pad PAD area, and a mask for forming a bump BUM. Therefore, according to the manufacturing method of the driving unit DRV according to the embodiment of the present invention, the manufacturing process can be simplified and the manufacturing cost can be reduced.

The embodiment of the present invention has been described above with reference to the drawings. However, this is only for the purpose of describing the present invention and is not described to limit or limit the contents of the present invention. Therefore, those skilled in the art can make various modifications and equivalents therefrom. It will be possible to implement one other embodiment, therefore, the true technical protection scope of the invention should be defined by the technical details of the appended claims.

100: film for liquid crystal inspection 120: first film
140: second film

Claims (15)

In the liquid crystal panel inspection film for inspecting a liquid crystal panel in which a source and a gate signal are mixed and driven on one side of the panel in the driving form of the panel,
First wirings receiving first test signals and branching of the first test signals received from the first wirings into n (n is a natural number), respectively, and branching test signals to corresponding input lines of the liquid crystal panel. Second wires to be connected to the wires; a wire connection part connected to the first wires and the second wires to connect the first test signals from the first wires to the second wires; Third wirings receiving test signals and the second test signals received from the third wirings, respectively, m (m is a natural number), and branched test signals to corresponding input lines of the liquid crystal panel. A first film having fourth wires to be formed on the same surface; And
Fifth wires for branching the fifth wires to be connected to the third wires and the second test signals received through the fifth wires to m (m is a natural number) are formed on one surface, and on the other side. Seventh wiring lines having the same number as the fifth wiring lines and formed to intersect the sixth wiring lines are formed, and the seventh wiring lines respectively correspond to the fifth and sixth wiring lines through via holes. A second film configured to be electrically connected with the second film,
The first wires, the second wires, the third wires and the fourth wires of the first film, the fifth wires, the sixth wires, and the seventh wire of the second film. Wires are covered by an insulator, except for the contact pads.
The pads formed on the fifth wires of the second film contact the pads formed on the third wires of the first film, and the pads formed on the sixth wires formed on the second film are the first film. And the second film is configured to be seated on the first film so as to contact a pad formed on the fourth wirings of the liquid crystal panel inspection film. The method of claim 1,
And the second wires and the fourth wires are arranged in a sequence corresponding to corresponding input lines of the liquid crystal panel. The method of claim 1,
The second film is bonded to the first film is bonded, or a liquid crystal panel inspection film, characterized in that the contact bonding by pressure by the fixing member. The method of claim 1,
The wiring connection portion,
Board;
Metal lines formed on the substrate in the same number as the number of the first wires;
A plurality of bumps formed at positions corresponding to positions electrically connected to the first wires and the second wires among the metal lines; And
The first wirings and the second wirings contact each of the bumps at corresponding positions, thereby branching the first test signals into the n lines, and transferring the first test signals to the liquid crystal panel. Each of the two wires is electrically connected to only a metal line connected through the bump among the metal lines. 5. The method of claim 4,
The wiring connection portion,
And an insulating layer covering the metal lines on which the bumps are not formed on the substrate. The method of claim 1,
And the first test signal is a source signal and the second test signal is a gate signal. In a liquid crystal panel inspection apparatus for inspecting a liquid crystal panel in which a source and a gate signal are mixed and driven on one surface of the panel in a driving form of the panel,
Body blocks;
A liquid crystal panel inspection film attached to a bottom surface of the body block; And
A flexible circuit board connected to a rear end of the film for inspecting the liquid crystal panel and transmitting a test signal,
The film for inspecting the liquid crystal panel,
First wirings receiving first test signals and branching of the first test signals received from the first wirings into n (n is a natural number), respectively, and branching test signals to corresponding input lines of the liquid crystal panel. Second wires to be connected to the wires; a wire connection part connected to the first wires and the second wires to connect the first test signals from the first wires to the second wires; Third wirings receiving test signals and the second test signals received from the third wirings, respectively, m (m is a natural number), and branched test signals to corresponding input lines of the liquid crystal panel. A first film having fourth wires to be formed on the same surface; And
Fifth wires for branching the fifth wires to be connected to the third wires and the second test signals received through the fifth wires to each of n (n is a natural number) are formed on one surface, and on the other surface. Seventh wiring lines having the same number as the fifth wiring lines and formed to intersect the sixth wiring lines are formed, and the seventh wiring lines respectively correspond to the fifth and sixth wiring lines through via holes. A second film configured to be electrically connected with the second film,
The first wires, the second wires, the third wires and the fourth wires of the first film, the fifth wires, the sixth wires, and the seventh wire of the second film. Wires are covered by an insulator, except for the contact pads.
The pads formed on the fifth wires of the second film contact the pads formed on the third wires of the first film, and the pads formed on the sixth wires formed on the second film are the first film. And the second film is mounted on the first film so as to contact a pad formed in the fourth wirings of the first film. The method of claim 7, wherein
And arranging the second wirings and the fourth wirings in a sequence corresponding to corresponding input lines of the liquid crystal panel. The method of claim 7, wherein
The second film is bonded to the first film is bonded, or a liquid crystal panel inspection device, characterized in that the contact by the pressure by the fixing member. The method of claim 7, wherein
The wiring connection portion,
Board;
Metal lines formed on the substrate in the same number as the number of the first wires;
A plurality of bumps formed at positions corresponding to positions electrically connected to the first wires and the second wires among the metal lines; And
The first wirings and the second wirings contact each of the bumps at corresponding positions, thereby branching the first test signals into the n lines, and transferring the first test signals to the liquid crystal panel. Each of the two wires is electrically connected to only a metal line connected through the bump among the metal lines. The method of claim 10,
The wiring connection portion,
And an insulating layer covering the metal lines on which the bumps are not formed on the substrate. The method of claim 7, wherein
And the first test signal is a source signal and the second test signal is a gate signal. In the manufacturing method of the liquid crystal panel test | inspection apparatus which inspects the panel of the liquid crystal by which the source and the gate signal are mixed and driven in one surface of a panel in the drive form of a panel,
First wires for receiving first test signals, second wires for transmitting the first test signals received from the first wires to corresponding input lines of the liquid crystal panel, and the first wires And a wire connection part connected to the second wires to connect the first test signals from the first wires to the second wires, third wires receiving second test signals, and third wires. Branching each of the second test signals received from each of the plurality of second test signals to n (n is a natural number) to form fourth wirings on the same side of the first film to transfer the branched test signals to corresponding input lines of the liquid crystal panel. First step;
Fifth wires connected to the third wires on one surface of a second film, and sixth wires for branching the second test signals received through the fifth wires into n (n is a natural number), respectively. And forming seventh wires on the other surface of the second film to have the same number as the fifth wires and intersect the sixth wires, and respectively corresponding to the seventh wires through via holes. A second step of electrically connecting wirings and the sixth wirings;
A third step of seating the second film on the first film,
In the third step,
Contacting a pad formed on the fifth wires of the second film with a pad formed on the third wires of the first film; And
And contacting pads formed on the sixth wires formed on the second film with pads formed on the fourth wires of the first film. The method of claim 13,
In the third step,
And the second film is bonded to the first film and bonded or contact-bonded by pressure by a fixing member. The method of claim 13,
And a fourth step of connecting the flexible circuit board applying a test signal to a rear end of the first film.

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