KR101265570B1 - Film for testing lcd panel, test device for testing lcd panel and method for manufacturing test device for testing lcd panel - Google Patents

Abstract

The manufacturing method of the film for liquid crystal panel inspection, a liquid crystal panel inspection apparatus, and a liquid crystal panel inspection apparatus is disclosed. The liquid crystal panel inspection apparatus for inspecting a panel of liquid crystal according to an exemplary embodiment of the present invention may include: first wirings receiving test signals, and the test signal received separately from the first wirings; A plurality of second wirings which branch each of them to n (n is a natural number) to transfer the branched test signals to corresponding input lines of the liquid crystal panel; A wire connection part formed on a substrate and having metal lines for transmitting a signal received through the first wires to corresponding second wires; And bumps electrically connecting the first wires and the second wires to the metal lines.

Description

Manufacturing method of film for liquid crystal panel inspection, liquid crystal panel inspection apparatus and liquid crystal panel inspection apparatus {FILM FOR TESTING LCD PANEL, TEST DEVICE FOR TESTING LCD PANEL AND METHOD FOR MANUFACTURING TEST DEVICE FOR TESTING LCD PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal panel inspection film, a liquid crystal panel inspection device, and a liquid crystal panel inspection device, and in particular, a liquid crystal panel inspection film and a liquid crystal panel inspection device capable of reducing the manufacturing process and manufacturing cost of the liquid crystal panel inspection device. And a method for producing a liquid crystal panel inspection device.

Due to the wide variety of uses of the display device, research on the liquid crystal panel mounted on the display device and a method of inspecting the same has been actively conducted. The normal liquid crystal panel, which has been inspected for defects, is mounted on a module and used for a display device such as a TV or a monitor.

1 is a view showing an inspection apparatus of a liquid crystal panel according to the prior art, Figure 2 is a view showing a plane of the test device of FIG.

1 and 2, the liquid crystal panel inspecting apparatus TD according to the related art receives a test signal applied from a flexible printed circuit FPC and converts the test signal into an analog voltage used to drive the liquid crystal panel PAN. A driving part DRV including a driving IC DIC and a probe PRB contacting the liquid crystal panel PAN and transmitting the test signal converted into an analog voltage to the input lines PILIN of the liquid crystal panel PAN. can do. In this case, the driving unit DRV may be a TAB IC, and the probe PRB may be provided as a needle or a blade type. TAB IC refers to a packaged driving IC (DIC) in the form of a film. The test signal is received from the flexible printed circuit FPC and transmitted to the driving unit DRV through the first lines LIN1 disposed on the film FIL, and the driving unit DRV is converted into an analog voltage. The converted test signal is transferred to the probe PRB through the second lines LIN2 disposed on the film FIL.

3 is a view showing another liquid crystal panel inspection device according to the prior art, Figure 4 is a view showing a plane of the test device of FIG.

3 and 4, the driving unit DRV of another liquid crystal panel inspecting apparatus TD according to the related art does not include a separate driving IC, and directly connects the liquid crystal panel PAN from the flexible printed circuit FPC. The driving image signals (analog voltages) are received as test signals, copied as many as necessary to inspect the liquid crystal panel PAN, and transmitted to the liquid crystal panel PAN.

3 and 4 particularly show examples in which the drive unit DRV receives six image signals from the flexible printed circuit FPC. The six image signals may be color signals of R, G, B, R ', G', and B 'required for driving the liquid crystal panel PAN. The driving unit DRV of FIGS. 3 and 4 has a wiring structure capable of repeatedly outputting six test signals TET received from the flexible printed circuit FPC.

Although the liquid crystal panel inspecting apparatus TD of FIGS. 3 and 4 is difficult to inspect whether the liquid crystal panel PAN is defective for a specific pattern, unlike the liquid crystal panel inspecting apparatus TD of FIGS. 1 and 2. The same color may be applied to the entirety of the PAN to be suitable for inspecting defective cells.

It is a figure which shows the structure of the wiring formed in the film used for the liquid crystal panel inspection apparatus of FIG. 3 and FIG.

Referring to FIG. 5, first lines LIN1 are formed on a first surface of the film FIL, which is an insulator, and second lines LIN2 are formed on a second surface of the film FIL. The first lines LIN1 receive the test signal received from the flexible printed circuit FPC, and the second lines LIN2 receive the test signals received through the first lines LIN1 of the liquid crystal panel PAN. It can be transmitted to the corresponding input line. In this case, the first lines LIN1 and the second lines LIN2 may be electrically connected through the through holes VIA. By the way, as shown in FIG. 5, the film FIL in which wiring is formed on both surfaces has a problem that the shorter the distance between wirings, the larger the number of wirings, the more complicated the manufacturing process and the higher the manufacturing cost.

It is therefore an object of the present invention to provide a method for manufacturing a liquid crystal panel inspection film, a liquid crystal panel inspection apparatus, and a liquid crystal panel inspection apparatus which can reduce the production cost by simplifying the manufacturing process of an expensive double-sided film.

The liquid crystal panel inspection apparatus for inspecting a panel of liquid crystal according to an embodiment of the present invention for solving the technical problem, the first wirings for receiving test signals, and the first wirings are separated from the first wirings A plurality of second wirings for branching the test signals received to each of n (n is a natural number) and transferring the branched test signals to corresponding input lines of the liquid crystal panel; A wire connection part formed on a substrate and having metal lines for transmitting a signal received through the first wires to corresponding second wires; And bumps electrically connecting the first wires and the second wires to the metal lines.

The first wires and the second wires are formed on the first surface of the film, respectively. The first wires are provided in the same number as the number of the test signals, and the second wires are provided in n times the number of the first wires. The metal lines are provided in the same number as the number of the first wires.

The metal lines are each provided in a closed rectangular shape in which four sides are connected, and the first wires are connected to one of the four sides of the corresponding metal lines, respectively, and the second wires are respectively And the other side of the four sides of the corresponding metal lines. The other side is positioned to face the one side.

A first metal line corresponding to a first test signal of the test signals is positioned at the outermost part of the metal lines, and the remaining metal lines except for the first metal line are respectively located inside the first metal line. The farther the distance from the first metal line is, the smaller the sum of the lengths of the sides formed.

A first metal line corresponding to a first test signal of the test signals is positioned at the innermost corner of the metal lines, and the remaining metal lines except for the first metal line are respectively located outside the first metal line. The greater the distance from the first metal line, the larger the sum of the lengths of the sides. The first wires are also connected to the other side, respectively.

Each of the metal lines may have a quadrangular shape in which at least one side of four sides is broken, and each of the first lines may be connected to one side of the four sides of the corresponding metal lines, and the second lines Each of the four sides of the corresponding metal lines is connected to the other side.

The metal lines are each provided in a shape in which the other side is broken. Each of the first wires is branched into x (x is a natural number) with respect to the corresponding test signals. The wiring connection part is provided with the x sub wiring connection parts.

Test signals output from the second wires connected to each of the x sub-wire connection parts are applied to the plurality of liquid crystal panels.

Test signals output from the second wires connected to each of the x sub-wire connection parts are applied to one liquid crystal panels.

The test signals received through the first wires are six color signals of R, G, B, R ', and G'B' for driving the liquid crystal panel. Probes are further provided for electrically connecting branched test signals transmitted from the second wires to corresponding input lines of the liquid crystal panel. The second wires are directly connected to corresponding input lines of the liquid crystal panel.

The method of manufacturing the liquid crystal panel inspection apparatus which inspects the panel of liquid crystal for achieving the said another technical subject. On the substrate, first wirings for receiving test signals and each of the test signals received through the first wirings are divided into n (n is a natural number) to branch test signals to corresponding input lines of the liquid crystal panel. Forming metal lines electrically connected to the second wires through the bumps, respectively; Forming an insulating layer by applying an insulator over the substrate and the metal lines; Etching a pad region in which the bumps are bonded to the metal lines on the insulating layer; Forming the bumps in the pad area; And bonding the bumps to each of the first wires and the second wires of the film.

According to the method for manufacturing a liquid crystal panel inspection film, a liquid crystal panel inspection device, and a liquid crystal panel inspection device according to the present invention, there is an advantage of improving the wiring method of the film to simplify the manufacturing process of the film and reduce the manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS In order to better understand the drawings cited in the detailed description of the invention, a brief description of each drawing is provided.
1 is a view showing an inspection apparatus of a liquid crystal panel according to the prior art.
FIG. 2 is a diagram illustrating a plane of the test apparatus of FIG. 1. FIG.
3 is a view showing another liquid crystal panel inspection device according to the prior art.
4 is a diagram illustrating a plane of the test apparatus of FIG. 3.
It is a figure which shows the structure of the wiring formed in the film used for the liquid crystal panel inspection apparatus of FIG. 3 and FIG.
6 is a view showing a liquid crystal panel inspection device according to a first embodiment of the present invention.
FIG. 7 is a view illustrating in detail the connection of the wires and the metal lines of FIG. 6.
8 is a view showing a liquid crystal panel inspection device according to a second embodiment of the present invention.
9 is a view showing a liquid crystal panel inspection device according to a third embodiment of the present invention.
10 is a view showing a liquid crystal panel inspection device according to a fourth embodiment of the present invention.
11 is a view showing a liquid crystal panel inspection device according to a fifth embodiment of the present invention.
12 is a view showing a liquid crystal panel inspection device according to a sixth embodiment of the present invention.
FIG. 13 is a diagram illustrating a part of a cross section of the liquid crystal panel inspection apparatus according to the exemplary embodiment of FIGS. 6 to 12.
14 is a view showing a method of manufacturing a liquid crystal panel inspection device according to an embodiment of the present invention.
FIG. 15 is a diagram illustrating a first embodiment of a connection structure of second lines and liquid crystal panel of the liquid crystal panel inspection apparatus according to the exemplary embodiment of FIGS. 6 to 12.
FIG. 16 is a diagram illustrating a second embodiment of a connection structure of second lines and liquid crystal panels of the liquid crystal panel inspection apparatus according to the exemplary embodiment of FIGS. 6 to 12.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

6 is a view showing a liquid crystal panel inspection device according to a first embodiment of the present invention.

Referring to FIG. 6, the liquid crystal panel inspecting apparatus TD according to the exemplary embodiment of the present invention includes a film FIL, first wirings LIN1s, second wirings LIN2s, and a wiring connection part CNLIN. . The first lines LIN1s receive the test signals XTET from the flexible printed circuit FPC, and the second lines LIN2s transfer the test signals XTET to the input line of the corresponding panel. The test signals XTET may have an analog voltage value as described above.

The first interconnections LIN1s and the second interconnections LIN2s may be formed on the first surface of the film FIL, respectively. On the film FIL, the first interconnections LIN1s and the second interconnections LIN2s are respectively separated from each other. That is, unless they are electrically connected by the wire connection part CNLIN, which will be described later, the first wires LIN1s and the second wires LIN2s are electrically separated from each other and formed on the film FIL.

The wire connection part CNLIN includes metal lines MLs electrically connecting the first wires LIN1s to the corresponding second wires LIN2s, respectively. The second lines LIN2s may be electrically connected to the corresponding first lines, thereby copying (branching) the test signals XTET received through the first lines LIN1s and transmitting the same to the liquid crystal panel PAN. . Accordingly, the metal lines MLs are provided in the number corresponding to the number of the first lines LIN1s, and the second lines LIN2s are n of the number of the first lines LIN1s (n is a natural number). Can be provided by ship.

However, in FIG. 6, for convenience of illustration, the second lines LIN2s are shown as being provided twice as much as the first lines LIN1s. In the example of FIG. 6, the flexible printed circuit FPC uses six color signals of R, G, B, R ', and G' B 'as test signals to drive the liquid crystal panel PAN. ), Six first interconnections LIN1s are provided. Therefore, the metal lines MLs may be provided as six metal lines MLs of the first to sixth metal lines ML1 to ML6. However, the present invention is not limited thereto, and when the test signals are provided in different numbers from six, the number of the first wires, the second wires, and the metal lines may be provided differently.

The metal lines MLs may be connected to first and second wirings and bumps BUMs, respectively. For example, the first metal line ML1 may include the eleventh wire LIN11 for receiving the first test signal XTET1 and the twenty-first wires for applying the first test signal XTET1 to the liquid crystal panel PAN. The second metal line ML2 is connected to the LIN21 and the bump BUM, and the second metal line ML2 connects the twelfth wiring LIN12 and the second test signal XTET2 to the liquid crystal panel PAN to receive the second test signal XTET2. The third metal line ML3 is connected to the 22nd lines LIN22 to be applied to the bump BUM, and the third metal line ML3 is connected to the thirteenth line LIN13 and the third test signal XTET3 to receive the third test signal XTET3. Is connected to the twenty-third lines LIN23 to which the liquid crystal panel PAN is applied to the bump BUM. Similarly, the fourth metal line ML4 may include the fourteenth wire LIN14 that receives the fourth test signal XTET4 and the twenty-fourth wires LIN24 that apply the fourth test signal XTET4 to the liquid crystal panel PAN. And bumps BUM, and the fifth metal line ML5 applies the fifteenth line LIN15 and the fifth test signal XTET5 to receive the fifth test signal XTET5 to the liquid crystal panel PAN. The sixth metal line ML6 is connected to the twenty-fifth lines LIN25 through the bump BUM, and the sixth metal line ML6 receives the sixteenth line LIN16 and the sixth test signal XTET6 that receive the sixth test signal XTET6. The 26th wiring LIN26 applied to the panel PAN is connected to the bump BUM.

Referring to FIG. 7, which illustrates the connection of the wires and the metal lines in more detail, the bumps BUM are respectively located in contact with only the corresponding metal line among the metal lines MLs electrically separated using the insulating layer ISO. By doing so, the corresponding metal line and the wiring are electrically connected.

In this way, without the VIA process and the wiring lamination process of the semiconductor FAB of the existing technology that separates and crosses the wirings by layers, the bumps are VIA in the rear bump process, and the lower metal lines and the upper film wirings of the bumps are cross-wired. It is possible to manufacture TAB IC (film) which is used for LCD inspection that can output the output signal of n times. In addition, the cost is reduced because the CNLIN is manufactured by using the bump process, which is a post process without using the semiconductor FAB shear process, and the decision of n times of n times of radiant output is determined at the time of manufacturing the second lines (LIN2s). In addition, if the output is formed in a sufficient number of times in the CNLIN, there is no need to go through the bump process every time to manufacture the TAB IC. Therefore, when manufacturing a new n-times TAB IC, only the assembly process of the second wirings (LIN2s) and the wiring connection part (CNLIN) is used, which significantly reduces the time and cost for the manufacturing process of the separate wiring connection part (CNLIN). It works.

Referring back to FIG. 6, the metal lines MLs may be provided in the shape of a closed rectangle in which four sides are connected. In this case, the first interconnections LIN1s may be connected to one side of the corresponding metal line, and the second interconnections LIN2s may be connected to the other side of the corresponding metal line. The other side of the metal line may be positioned to face one side. For example, in FIG. 6, the first metal line ML1 has a quadrangular shape in which four sides 1 to 4 are connected to each other, and the first wire LIN11 has a first metal line ML1. The second wires LIN21 and LIN22 are connected to the other side 3 of the first metal line ML1, respectively.

6, the first metal line ML1 is positioned at the outermost side of the metal lines, and the second metal line ML2 is located adjacent to the inside of the first metal line ML1, and the third metal line ML3 is located. ) Is illustrated to be located adjacent to the inside of the second metal line ML2. Similarly, the fourth metal line ML4 is positioned adjacent to the inside of the third metal line ML3, and the fifth metal line ML5 is positioned adjacent to the inside of the fourth metal line ML4, and the sixth metal line ML4 is located in the fourth metal line ML4. The ML6 is positioned adjacent to the inside of the fifth metal line ML5, so that the sixth metal line ML6 is positioned at the innermost angle of the metal lines MLs.

However, the present invention is not limited thereto. Referring to FIG. 8, which shows a liquid crystal panel inspecting apparatus TD according to a second exemplary embodiment of the present invention, a first metal line ML1 connected to an eleventh line LIN11 that receives a first test signal XTET1. The sixth metal line ML6 positioned at the innermost corner and connected to the sixteenth line LIN16 receiving the sixth test signal XTET6 may be formed at the outermost corner.

6 illustrates an example in which the metal lines MLs are provided in the shape of a closed rectangle, but are not limited thereto. Referring to FIG. 9, which shows a liquid crystal panel inspecting apparatus TD according to a third exemplary embodiment of the present invention, one side of four sides forming a quadrangle is not a rectangular shape in which metal lines MLs are closed. It may be formed in a broken shape. In particular, the metal lines MLs of FIG. 9 illustrate an example in which a part of the other side positioned to face one side to which the first wires LIN1s are connected is cut in consideration of noise and the like.

In addition, referring to FIG. 10 showing the liquid crystal panel inspecting apparatus TD according to the fourth exemplary embodiment of the present invention, the metal lines MLs may be provided in the shape of closed circles.

11 is a view showing a liquid crystal panel inspection device according to a fifth embodiment of the present invention. Referring to FIG. 11, the liquid crystal panel inspecting apparatus TD according to the fifth exemplary embodiment of the present invention is located on one side of the metal lines MLs provided in a closed quadrangle shape and facing the one side. First wires LIN1s are connected to the other side, respectively. For example, the eleventh line LIN1 is connected to one side 1 and the other side 2 of the first metal line ML1, respectively (see FIG. 6 for reference numerals of one side and the other side). When the metal lines MLs and the first lines LIN1s are connected as in the liquid crystal panel inspecting apparatus TD of FIG. 11, the first lines on the metal lines are positioned relatively close to the first lines LIN1s. Distance between the test signals transmitted to the second wires close to the second wires and the test signals (distant from the first wire on the metal line) located relatively far from the first wires LIN1s. The difference due to the difference can be prevented from occurring.

12 is a view showing a liquid crystal panel inspection device according to a sixth embodiment of the present invention. Referring to FIG. 12, the liquid crystal panel inspecting apparatus TD according to the sixth embodiment of the present invention uses the test signals XTET received from the flexible printed circuit FPC, respectively, where x is a natural number and the example of FIG. 12. In FIG. 2, first wirings LIN1s may be connected to the metal lines MLs by branching by x = 2. The wire connection part CNLIN of FIG. 12 includes x sub wire connection parts receiving the x branched first wires LIN1s, respectively (in the example of FIG. 12, the first sub wire connection part CNLIN1 and the second sub wire connection part). (CNLIN2)).

FIG. 12 illustrates that a test signal output from the second interconnections LIN2s connected to the sub interconnection connections CNLIN1 and CNLIN2 is transmitted to one of the two liquid crystal panels PAN, respectively. In this case, the plurality of separated liquid crystal panels PAN may be part of one liquid crystal panel or may be a separate liquid crystal panel.

The structure and operation of each sub wire connection unit may be the same as the structure and operation of the wire connection unit of FIGS. 6 to 11 described above. Therefore, detailed description thereof will be omitted.

FIG. 13 is a diagram illustrating a part of a cross section of the liquid crystal panel inspection apparatus according to the exemplary embodiment of FIGS. 6 to 12.

Referring to FIG. 13, as described above, each of the metal lines MLs of the driving part DRV according to the exemplary embodiment of the present invention is formed on the substrate SUB with the insulating layer ISO interposed therebetween. The metal lines MLs are also connected to the bumps BUM with the first lines LIN1s and the second lines LIN2s disposed on the first surface of the film FIL.

The driving unit DRV having the structure as shown in FIG. 13 may be manufactured by the process as shown in FIG. 14.

In the method of manufacturing the liquid crystal panel inspecting apparatus TD according to the exemplary embodiment of the present invention, first, metal lines MLs are formed on the substrate SUB as shown in FIG. 14A. Next, as shown in FIG. 14B, an insulator is applied to form an insulating film ISO. Bumps BUM in the insulating layer ISO etch a region of the pad PAD to be in contact with the metal lines MLs (14 (c)). Then, bumps BUMs are formed on the pads PAD (14 (d)), and the bumps BUMs are bonded to the film FIL on which the wirings LIN1 and LIN2 are formed to be bonded to each other (FIG. 14 (e)).

In the process of manufacturing a TAB IC according to the prior art, the cost increases with the recovery of the photo mask. However, according to the manufacturing method of the driving unit DRV according to the embodiment of the present invention, except for forming the wiring lines LIN1 and LIN2 on the film FIL, the metal lines MLs on the substrate SUB. In total, only three masks are used, a mask for forming a pad), a mask for etching a pad PAD area, and a mask for forming a bump BUM. Therefore, according to the manufacturing method of the driving unit DRV according to the embodiment of the present invention, the manufacturing process can be simplified and the manufacturing cost can be reduced.

FIG. 15 is a view illustrating a first embodiment of a connection structure between liquid crystal panels and second wirings of the liquid crystal panel inspection apparatus of FIGS. 6 to 12, and FIG. 16 is a second embodiment thereof. It is a figure which shows an example.

Referring to FIG. 15, in the liquid crystal panel inspecting apparatus TD according to the exemplary embodiment of the present invention, the input lines of the liquid crystal panel PAN may be formed through contact means such that the second lines LIN2s are connected to the probe PRB. Electrical connection with the PILIN). On the other hand, in the case of FIG. 16, the liquid crystal panel inspecting apparatus TD according to the exemplary embodiment of the present invention has no second contact line LIN2s of the film FIL without the secondary contact means such as the probe PRB of FIG. 15. It is directly connected to the input lines PILIN of the liquid crystal panel PAN. Although not shown in FIGS. 15 and 16, the liquid crystal panel PAN may include a pad or the like so that test signals XTET transmitted from the second lines LIN2s may be applied to the input lines PILIN. have. In addition, although FIG. 15 and FIG. 16 illustrate the case in which the wiring connection part CNLIN is an example of FIG. 6, the present invention is not limited thereto and may be applied to the wiring connection part CNLIN having the structure shown in FIGS. 8 to 12. have.

As described above, optimal embodiments have been disclosed in the drawings and the specification. Although specific terms are employed herein, they are used for purposes of describing the present invention only and are not used to limit the scope of the present invention. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

LCD Panel Inspection-TD Probe-PRB Flexible Printed Circuit-FPC

Claims (16)

In the liquid crystal panel inspection device for inspecting a panel of liquid crystal,
First wirings for receiving test signals and second test signals received from the first wirings, each of which is divided into n (n is a natural number) to transfer branched test signals to a corresponding input line of the liquid crystal panel. A film in which wiring lines are formed on the same surface; And
A wire connection part connected to the first wires and the second wires to transfer the test signals from the first wires to the second wires;
The wiring connection portion,
Board;
Metal lines formed on the substrate in the same number as the number of the first wires;
A plurality of bumps formed at positions corresponding to positions electrically connected to the first wires and the second wires among the metal lines; And
An insulating layer covering an area where the bumps are not formed among the metal lines on the substrate,
The first wirings and the second wirings contact each of the bumps at corresponding positions to branch the n test signals to the n lines, and transmit the test signals to the liquid crystal panel.
The first wires and the second wires are cross-wired with the metal lines, and each of the first wires and the second wires are electrically connected only to a metal line connected through the bump among the metal lines. Liquid crystal panel inspection device, characterized in that. delete The method of claim 1,
The metal lines are each,
Four sides are provided in the shape of a closed square that is connected,
The first wires are formed on one of the four sides of the corresponding metal lines, respectively.
And the second wires are connected to the one side or the other side of the four sides of the corresponding metal lines, respectively. The method of claim 3,
The other side is positioned facing the one side, the liquid crystal panel inspection device. The method of claim 3,
A first metal line corresponding to a first test signal of the test signals is positioned at the outermost part of the metal lines,
The remaining metal lines except for the first metal lines, respectively,
The liquid crystal panel inspection apparatus, wherein the sum of the lengths of the sides formed in the first metal line and the greater the distance from the first metal line is. The method of claim 3,
A first metal line corresponding to a first test signal of the test signals is located at the innermost corner of the metal lines,
The remaining metal lines except for the first metal line, respectively,
The liquid crystal panel inspection apparatus, wherein the sum of the lengths of the sides formed on the outside of the first metal line and the greater the distance from the first metal line is. The method of claim 1,
The metal lines are each,
At least one of the four sides is provided in the shape of a broken rectangle,
The first wires are formed on one of the four sides of the corresponding metal lines, respectively.
And the second lines are connected to the one side or the other side of the four sides of the corresponding metal lines, respectively. The method of claim 7, wherein
The metal lines are each,
Liquid crystal panel inspection device characterized in that the other side is provided in a broken shape. The method of claim 1,
The first wirings, respectively,
And x (x is a natural number) with respect to the corresponding test signals. 10. The method of claim 9,
The wiring connection part has sub wiring connection parts,
And the number of the sub wiring connections is x. The method of claim 10,
And a plurality of test signals output from the second wires connected to each of the sub wire connection parts provided in the number of x are applied to a plurality of liquid crystal panels. The method of claim 10,
And a plurality of test signals output from the second wires connected to each of the sub-wire connection parts provided in the number of x are applied to one liquid crystal panel. The method of claim 1,
Test signals received through the first wires,
And six color signals of R, G, B, R ', G', and B 'for driving the liquid crystal panel. The method of claim 1,
And probes for electrically connecting branched test signals transmitted from the second wires to corresponding input lines of the liquid crystal panel. The method of claim 1,
And the second wires are directly connected to corresponding input lines of the liquid crystal panel. The method of claim 1,
In each of the metal lines,
And the bumps are further formed by the number of m and the number of n differences so that the test signals can be applied to each of m (m is a natural number, m> n).

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