JP6317270B2 - Electrical connection device and pogo pin - Google Patents

Description

  The present invention relates to an electrical connection device and a pogo pin that can stably realize an electrical test of a flat test object.

  Prior to shipment, an integrated circuit formed on a semiconductor wafer is subjected to an electrical test to determine whether it has predetermined electrical characteristics (that is, whether the integrated circuit is good or bad). In such a test, all the integrated circuits on one wafer are divided into one time or multiple times at the same time by using an electrical connection device that electrically connects the electrodes of the integrated circuit and the electrical circuit of the test apparatus. Done.

  The electrical connection device used for this electrical test is, for example, as shown in Patent Document 1, a chip unit (wiring board) that is electrically connected to the testing apparatus, and a connection unit that is disposed below the wiring board. And a probe unit (probe substrate) electrically connected to the wiring board via the connection pins, and a contact attached to the lower surface of the probe board and electrically connected thereto. Then, the contactor is electrically connected to the integrated circuit formed on the semiconductor wafer, and the quality of the integrated circuit is determined by the test apparatus.

  Patent Document 2 discloses a technique related to an inspection contact having two conductive cylindrical members (an inner cylindrical body and an outer cylindrical body) having different outer diameters and inner diameters. Each of the inner cylinder body and the outer cylinder body has a cutout portion and a fixing portion, and the inner cylinder body and the outer cylinder body are fixed by the fixing portion.

JP 2011-89891 A International Publication No. 2011-132613 Pamphlet

  However, with the techniques described in Patent Document 1 and Patent Document 2, it is difficult to appropriately electrically connect the electrodes of the integrated circuit and the electric circuit of the test apparatus.

  In the technique described in Patent Document 1, in order to electrically connect the connection pin of the connection unit to the connection land provided in the chip unit, the connection pin is given an elastic force. However, if the connecting pin has a strong elastic force, the probe unit is bent toward the semiconductor wafer by the elastic force. As a result, the distance from the contact tip to the semiconductor wafer varies, and the contact cannot properly contact the integrated circuit on the semiconductor wafer.

  On the other hand, if the elastic force of the connection pin is weak, the connection pin of the connection unit cannot be electrically connected to the connection land provided in the chip unit.

  Therefore, in order to stably and electrically connect both the connection land provided in the chip unit and the connection pin of the connection unit, and between the contact and the integrated circuit on the semiconductor wafer, the connection pin is provided. It is necessary to design to have an appropriate elastic force. However, it has been extremely difficult to determine the elastic force of the connection pin that stably and electrically connects both.

  Further, in the technique described in Patent Document 2, the inner cylinder and the outer cylinder have elastic force due to the cutout portion, but the inner cylinder and the outer cylinder are fixed by the fixing portion. Therefore, since an elastic force is generated in proportion to the elastic compression of the notch, it is extremely difficult to design the inspection contact so as to have an appropriate elastic force as in the technique described in Patent Document 1. Met.

  The present invention has been made in view of such problems, and improves electrical connectivity between a connection land and a connection pin of a connection unit, and between a contact and an integrated circuit on a semiconductor wafer. It is to provide an electrical connection device and a pogo pin.

  In order to achieve the above object, the first feature of the electrical connecting device of the present invention is that an electrical connection device that holds an inspected object having an electrode on its surface on a work surface and electrically connects the electrode and the tester. A connection device, wherein a connection portion to the tester is provided on one surface and a land portion connected to the connection portion is provided on the other surface, and on the inspected side of the wiring substrate And a probe board provided with a pogo pin having one end in contact with the land portion and the other end projecting toward the object to be inspected, the pogo pin comprising a contact terminal to the electrode and the A plunger portion having a plunger body portion provided coaxially with the contact terminal and contacting the land portion; and a barrel portion provided on an outer peripheral side of the plunger portion, wherein the barrel portion is arranged in an axial direction of the contact terminal. Telescopically provided A plurality of elastic bodies and a barrel main body portion provided with one or more stop members between the plurality of elastic bodies, and the plunger portion is elastically compressed by a predetermined length of each of the plurality of elastic bodies. Sometimes, one or more stop receiving members are provided so as to come into contact with the corresponding stop member among the one or more stop members.

  In addition, a second feature of the electrical connecting device of the present invention is that the one or more retaining members are arranged in order from the elastic body provided on the contact terminal side when the plurality of elastic bodies are respectively elastically compressed. It exists in the position which contacts a corresponding stop member.

  According to a third feature of the electrical connecting device of the present invention, the plurality of elastic bodies are elastic coils, and the elastic constants provided on the contact terminal side are arranged so that the spring constant becomes smaller. It is in.

  According to a fourth feature of the electrical connecting device of the present invention, the one or more stopper members are provided on the plunger body.

  Further, a fifth feature of the electrical connecting device of the present invention is that the plurality of elastic bodies are elastic coils provided so that the spiral directions are the same.

  According to a sixth feature of the electrical connecting apparatus of the present invention, the plurality of elastic bodies are elastic coils provided so that spiral directions are alternately reversed.

  According to a seventh feature of the electrical connecting apparatus of the present invention, the barrel portion is formed by integrally molding the plurality of elastic bodies and the barrel main body portion.

  The first feature of the pogo pin of the present invention is an electrical connection device for holding an object to be inspected having an electrode on its surface on the work surface and electrically connecting the electrode and the tester. A wiring board provided with a connection portion to the tester, and a land portion connected to the connection portion on the other surface, and an electric probe board provided on the inspection object side of the wiring board. And a pogo pin provided on the probe board so that one end thereof is in contact with the land portion and the other end protrudes toward the object to be inspected, and is a contact terminal to the electrode And a plunger portion having a plunger main body portion that is provided coaxially with the contact terminal and contacts the land portion, and a barrel portion provided on an outer peripheral side of the plunger portion, wherein the barrel portion of the contact terminal Axially A plurality of elastic bodies provided in a contractible manner and a barrel main body portion provided with one or more stop members between the plurality of elastic bodies, and the plunger portion includes a plurality of elastic bodies each having a predetermined length. It is to have one or more stop receiving members provided so as to come into contact with a corresponding stop member among the one or more stop members when elastically compressed.

  According to the electrical connection device and the pogo pin of the present invention, the electrical connectivity can be improved in the electrical test of the plate-shaped object.

It is the figure which showed the whole structure containing the electrical connection apparatus which is Embodiment 1 of this invention. It is the figure which showed typically the state before the electrical test of IC on a semiconductor wafer by the electrical connection apparatus which is Embodiment 1 of this invention. It is the figure which showed typically the state in the electrical test of IC on a semiconductor wafer by the electrical connection apparatus which is Embodiment 1 of this invention. It is the figure which showed the structure of the pogo pin with which the electrical connection apparatus which is Embodiment 1 of this invention is provided. (A) shows the pogo pin in a free state before being assembled and is not subjected to elastic compression, and (b) is after assembly, and the lower end (the other end) hits the IC on the semiconductor wafer. The pogo pin in a state where it is not in contact is shown, and (c) shows the pogo pin in a state where the lower end (the other end) is in contact with the IC on the semiconductor wafer. The elastic force of the pogo pin with respect to the overdrive value of the electrical connection apparatus which is Embodiment 1 of this invention is shown. The elastic force of the pogo pin with respect to the overdrive value of the electrical connection apparatus which is Embodiment 2 of this invention is shown. It is the figure which showed the structure of the pogo pin with which the electrical connection apparatus which is Embodiment 3 of this invention is provided. It is the figure which showed the structure of the pogo pin with which the electrical connection apparatus which is Embodiment 4 of this invention is provided.

  Hereinafter, an electrical connection device according to an embodiment of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a diagram showing an entire structure including an electrical connection device according to Embodiment 1 of the present invention, and FIG. 2 shows an IC on a semiconductor wafer by the electrical connection device according to Embodiment 1 of the present invention. FIG. 3 is a diagram schematically showing a state before an electrical test, and FIG. 3 schematically shows a state during an electrical test of an IC on a semiconductor wafer by the electrical connection device according to the first embodiment of the present invention. It is a figure.

  As shown in FIGS. 1 to 3, the electrical connection device 1 according to the first embodiment of the present invention includes a flat plate-like support member (stiffener) 12 serving as an attachment reference surface having a flat lower surface, and an attachment surface of the support member 12. And a wiring board 14 having a circular flat plate shape, and an electrical connection portion 16 for electrically connecting the semiconductor wafer 28 to be inspected and the wiring board 14, and held by a holder 20. ing.

  The holder 20 is supported by the prober base 23 and has a crank-shaped cross-sectional structure so as to receive the electrical connection device 1. The holder 20 has a support pin 20 a for supporting the support member 12 and the wiring board 14 of the electrical connection device 1.

  The support member 12 is provided with a through hole 12b penetrating vertically, and the wiring board 14 is provided with a through hole 14b penetrating vertically. The support member 20 and the wiring board 14 are supported by the holder 20 by fitting the support pins 20a into the through holes 12b and the through holes 14b.

  For example, the electrical connection apparatus 1 is configured to connect each connection pad (electrode), which is a connection terminal of an IC, to the electrical circuit of the tester 11 for electrical testing of a large number of ICs (integrated circuits) built in the semiconductor wafer 28. Used to connect to.

  Therefore, the upper surface of the semiconductor wafer 28 provided with each connection pad (electrode) serving as a connection terminal of the IC is received on the upper surface, and the chuck mechanism 21 adsorbs the chuck top 21 so that it can be released in vacuum, and the stage mechanism 22 that moves the chuck top 21 up and down. And. The electrical test by the tester 11 is executed by bringing the IC on the semiconductor wafer 28 into contact with the electrical connection portion 16 of the electrical connection device 1 by moving the stage mechanism 22 up and down.

  Further, the chuck top 21 is provided with a heat source 24 for heating or cooling the semiconductor wafer 28 placed on the upper surface. The semiconductor wafer 28 is heated or cooled by the heat source 24, and electric power is generated by the radiant heat of the heat source 24. The connection 16 is heated or cooled.

  The wiring substrate 14 is made of, for example, a polyimide resin plate having a circular plate shape as a whole, and a connection wiring 12a to the tester 11 is provided on the upper surface (one surface).

  As shown in FIGS. 2 and 3, the lower surface (the other surface) of the wiring substrate 14 has a plurality of lands for electrical connection with the IC on the semiconductor wafer 28 via the electrical connection portion 16. A portion 141 is provided.

  The support member 12 includes a plate-like frame member made of, for example, a stainless steel plate, which is disposed with its mounting surface in contact with the upper surface of the wiring board 14.

  The electrical connection portion 16 includes a probe substrate 18 formed in a circular flat plate shape and a support member 19, and the probe substrate 18 and the support member 19 are connected by a connection support member 17 arranged in contact with both ends. It is fixed.

  A large number of through holes 191 formed in the thickness direction are formed in the support member 19, and a large number of through holes 181 are also formed in the probe substrate 18 at positions facing the through holes 191.

  The electrical connection portion 16 is provided with a large number of pogo pins 100 penetrating through the through holes 191 and the through holes 181.

  As shown in FIG. 2, the upper end portion 103 (one end portion) of the pogo pin 100 is in pressure contact with the land portion 141 by the elastic force of the pogo pin 100 to be described later, whereby the pogo pin 100 is connected to the wiring board. It is electrically connected to 14 corresponding land portions.

  Further, the lower end portion 101 (the other end portion) of the pogo pin 100 is attached to the probe substrate 18 so as to protrude downward (on the semiconductor wafer 28 side) from the lower surface of the probe substrate 18.

  At this time, if the pogo pin 100 has a strong elastic force, the pogo pin 100 is sufficiently pressed against the land portion 141, so that the pogo pin 100 is appropriately electrically connected to the land portion 141. 18 is curved toward the semiconductor wafer 28 (downward). As a result, the distance from the lower end 101 (the other end) of the pogo pin 100 to the semiconductor wafer 28 varies, and an electrical connection failure may occur between the pogo pin 100 and the IC on the semiconductor wafer 28. .

  Therefore, as shown in FIG. 2, in a state where the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28, the probe substrate 18 is bent toward the semiconductor wafer side (downward). In addition, the upper end portion 103 (one end portion) of the pogo pin 100 needs to be pressed with a relatively weak pressing force so that the land portion 141 can be electrically connected.

  As shown in FIG. 3, when the stage mechanism 22 moves the chuck top 21 upward (electrical connection portion 16 side), the lower end portion 101 (the other end portion) of the pogo pin 100 is adsorbed onto the chuck top 21. It abuts against the semiconductor wafer 28.

  At this time, if the elastic force of the pogo pin 100 is weak, the pressing force when the lower end portion 101 (the other end portion) of the pogo pin 100 comes into contact with the IC on the semiconductor wafer 28 becomes weak. An electrical connection failure may occur with the IC.

  Therefore, in a state where the lower end portion 101 (the other end portion) of the pogo pin 100 is in contact with the IC on the semiconductor wafer 28 as shown in FIG. It is necessary to press-contact with a relatively strong pressing force so that it can be connected.

  As described above, when the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28, the elastic force of the pogo pin 100 is small and the lower end portion 101 ( In a state in which the other end portion is in contact with the IC on the semiconductor wafer 28, the pogo pin 100 needs to be changed depending on the state so as to increase the elastic force.

  In the electrical connection device 1 according to the first embodiment of the present invention, when the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28, the elastic force of the pogo pin 100 is small. In addition, when the lower end portion 101 (the other end portion) of the pogo pin 100 is in contact with the IC on the semiconductor wafer 28, the pogo pin 100 has a structure that changes depending on the state so that the elastic force of the pogo pin 100 is increased. Yes.

  FIG. 4 is a diagram illustrating the structure of the pogo pin 100 provided in the electrical connection device 1 according to the first embodiment of the present invention. (A) shows the pogo pin 100 in a free state before being assembled and not subjected to elastic compression, (b) is after being assembled, and the lower end 101 (the other end) is on the semiconductor wafer 28. The pogo pin 100 in a state where it is not in contact with the IC is shown, and (c) shows the pogo pin 100 in a state where the lower end portion 101 (the other end portion) is in contact with the IC on the semiconductor wafer 28.

  As shown in FIGS. 4A to 4C, the pogo pin 100 includes a plunger portion 110 and a barrel portion 120 provided on the outer peripheral side of the plunger portion 110 so as to cover a part of the side surface of the plunger portion 110. It has.

  The plunger portion 110 is provided with a contact terminal 111 including a lower end portion 101 (the other end portion) that contacts the IC on the semiconductor wafer 28, and an upper end that is provided coaxially with the contact terminal 111 and contacts the land portion 141 of the wiring board 14. And a columnar plunger main body 112 including a portion 103 (one end portion).

  The barrel portion 120 includes a fixing portion 121 that is fixed to the plunger portion 110 on the lower end portion 101 (the other end portion) side, a first elastic coil 122 that is extendable in the axial direction of the contact terminal 111, and a contact terminal. 111, a second elastic coil 124 that is extendable in the axial direction, a barrel main body 123 that connects the first elastic coil 122 and the second elastic coil 124, and an upper end 103 (one end) ) Side and a fixed portion 125 fixed to the plunger portion 110.

  The barrel main body 123 has a stop member 127 provided in a protruding shape along the inner periphery of the hollow cylindrical shape.

  The contact terminal 111 of the plunger portion 110 has a small diameter portion 115 whose diameter is reduced so as not to contact the stop member 127 and a large diameter portion 116 whose diameter is increased so as to contact the stop member 127. The joint portion between the small diameter portion 115 and the large diameter portion 116 is provided with an inclined surface that is inclined in the outer peripheral direction from the shaft in the circumferential direction, and this joint portion serves as a stopper member 113.

  As shown in FIG. 4B, when the pogo pin 100 is pressed in the X1 direction, the first elastic coil 122 and the second elastic coil 124 are elastically compressed. As a result, the stop receiving member 113 comes into contact with the stop member 127, and this contact restricts further elastic compression of the first elastic coil 122.

  When the pogo pin 100 is further pressed in the X1 direction, as shown in FIG. 4C, the first elastic coil 122 is not elastically compressed while the stop receiving member 113 is in contact with the stop member 127. The second elastic coil 124 is elastically compressed.

  In this way, from the free state shown in FIG. 4A where the elastic member is not subjected to compression, the pogo pin 100 is pressed in the X1 direction until the stop receiving member 113 shown in FIG. 4B comes into contact with the stop member 127. During this time, both the first elastic coil 122 and the second elastic coil 124 are elastically compressed.

  When the pogo pin 100 is further pressed in the X1 direction as shown in FIG. 4C from the state in which the stop receiving member 113 shown in FIG. 4B is in contact with the stop member 127, the first elasticity The coil 122 is elastically compressed by the same length as the state shown in FIG. 4B, and only the second elastic coil 124 is elastically compressed according to the distance of pressing the pogo pin 100 in the X1 direction.

  FIG. 5 shows the elastic force of the pogo pin with respect to the overdrive value of the electrical connecting apparatus 1 according to the first embodiment of the present invention. Here, the overdrive value refers to a distance of pressing the pogo pin 100 in the X1 direction from the free state that is not subjected to the elastic compression shown in FIG.

  As shown in FIG. 5, the elastic force line 203 of the pogo pin 100 provided in the electrical connecting device 1 according to the first embodiment of the present invention has an overdrive value of “0” (μm), that is, FIG. From a free state not subjected to elastic compression to a state where the overdrive value has reached “100” (μm), that is, a state where the stop receiving member 113 shown in FIG. It rises with an inclination S1.

  When the spring constant of the first elastic coil 122 is k1 and the spring constant of the second elastic coil 124 is k2, the first elastic coil 122 and the second elastic coil 124 are connected in series. Therefore, the slope S1 is k1 · k2 / (k1 + k2), and the elastic force F1 at this time is expressed by the following (Formula 1). Here, x represents an overdrive value. Here, it is assumed that the spring constant k2 is larger than the spring constant k1.

F1 = (k1 · k2 / (k1 + k2)) · x (Formula 1)
After that, the elastic force line 203 of the pogo pin 100 included in the electrical connecting device 1 according to the first embodiment of the present invention is shown in FIG. 4B, in which the overdrive value has reached “100” (μm). From the state in which the stop receiving member 113 is in contact with the stop member 127, it rises at an inclination S2.

  At this time, when the distance from the stop receiving member 113 to the stop member 127 in a free state not subjected to the elastic compression shown in FIG. 4A is t, the stop receiving member 113 is in contact with the stop member 127 and thereafter. The elastic force F2 is expressed by the following (Formula 2). Here, K = k1 · k2 / (k1 + k2).

F2 = k2 * x + (K-k2) * t (Formula 2)
For comparison, the elastic force line 201 in FIG. 5 indicates the elastic force in the pogo pin having only the first elastic coil 122, and the elastic force line 202 in the pogo pin having only the second elastic coil 124. The elastic force line 205 indicates the elastic force of the pogo pin in which the first elastic coil 122 and the second elastic coil 124 are simply connected in series without providing the stop receiving member 113 and the stop member 127. Is shown.

  Until the overdrive value reaches “100” (μm), the spring constant of the elastic force line 203 of the pogo pin 100 included in the electrical connecting device 1 according to the first embodiment of the present invention is k1 · k2 / (k1 + k2). As a result, the spring constant of each of the elastic force lines 201 and 202 becomes smaller, thereby reducing the inclination. Therefore, in the state where the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28 as shown in FIG. 2, the overdrive value of the pogo pin 100 is “100” (μm). What is necessary is just to support the pogo pin 100 to the probe board | substrate 18 so that it may become less. Thereby, in a state where the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28, the elastic force of the pogo pin 100 can be reduced, so that the probe substrate 18 is positioned on the semiconductor wafer 28 side ( It is possible to prevent bending downward. Thereby, the distance from the lower end 101 (the other end) of the pogo pin 100 to the semiconductor wafer 28 does not vary, and the electrical connection between the pogo pin 100 and the IC on the semiconductor wafer 28 is made good. Can do.

  Further, even when the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28, the pogo pin 100 is pressed against the land portion 141 by the elastic force of the pogo pin 100. It can be electrically connected to the part.

  On the other hand, after the overdrive value reaches “100” (μm), the spring constant of the elastic force line 203 of the pogo pin 100 included in the electrical connecting device 1 according to the first embodiment of the present invention is the second elastic coil. Since it is the same as the spring constant k2 of 124, the inclination is the same as that of the elastic force line 202.

  Therefore, for example, when it is desired to bring the lower end portion 101 (the other end portion) of the pogo pin 100 into contact with the IC on the semiconductor wafer 28 with an elastic force of 4 (gf), as shown in FIG. The stage mechanism 22 may be moved upward (to the electrical connection portion 16 side) so that the overdrive value of becomes “170” (μm).

  As described above, according to the electrical connection device 1 according to the embodiment of the present invention, the pogo pin 100 is the contact terminal 111 to the IC on the semiconductor wafer 28 and the cylindrical plunger provided coaxially with the contact terminal 111. The first elastic coil is provided with a plunger part 110 having a main body part 112 and a barrel part 120 provided on the outer peripheral side of the plunger part 110, and the barrel part 120 is provided to be extendable in the axial direction of the contact terminal 111. 122, the second elastic coil 124, and a barrel main body 123 provided with a stop member 127 between the first elastic coil 122 and the second elastic coil 124. When the elastic coil 122 and the second elastic coil 124 are each elastically compressed by a predetermined length, there is a stop receiving member 113 that the stop member 127 contacts. Therefore, when the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28, the elastic force of the pogo pin 100 is small, and the lower end portion 101 (the other end portion) of the pogo pin 100 In the state where the end of the contact portion is in contact with the IC on the semiconductor wafer 28, it can be changed depending on the state so that the elastic force of the pogo pin 100 is increased. Thereby, both the land part 141 and the pogo pin 100 and between the pogo pin 100 and the IC on the semiconductor wafer 28 can be electrically connected well.

  In the electrical connection device 1 according to the first embodiment of the present invention, the first elastic coil 122 having a small spring constant (spring constant: k1) is arranged on the lower end 101 side, and the spring constant is large (spring constant: k2) Although the second elastic coil 124 is disposed on the upper end portion 103 side, the present invention is not limited to this, and the spring constant is small (spring constant: k1). The second elastic coil 124 may be arranged on the lower end 101 side (the spring constant: k2).

  In the electrical connection device 1 according to the first embodiment of the present invention, the barrel portion 120 includes the fixed portion 121, the first elastic coil 122, the second elastic coil 124, the barrel main body 123, and the fixed portion. However, they may be manufactured by connecting those manufactured, or may be manufactured by integral molding.

  When manufacturing by integral molding, since connection parts are not required at the respective connection locations, the apparatus can be simplified and manufacturing costs can be reduced.

  Further, the spiral directions of the first elastic coil 122 and the second elastic coil 124 may be the same or opposite.

  When the pogo pin 100 is pressed in the X1 direction shown in FIG. 4A, the first elastic coil 122 and the second elastic coil 124 are elastically compressed. At this time, when the spiral directions of the first elastic coil 122 and the second elastic coil 124 are the same, the contact terminal 111 is moved along with the elastic compression of the first elastic coil 122 and the second elastic coil 124. Rotate around an axis.

  For example, when aluminum is used on the surface of the IC on the semiconductor wafer 28, an oxide film is formed on the surface. Therefore, when the contact terminal 111 of the pogo pin 100 contacts the IC on the semiconductor wafer 28, this oxide film Need to break. When the spiral directions of the first elastic coil 122 and the second elastic coil 124 are the same, the contact terminal 111 of the pogo pin 100 contacts the IC on the semiconductor wafer 28 while rotating, so that it is formed on the surface. By breaking the oxide film, better electrical connection can be achieved.

  As described above, when the oxide film is formed on the surface of the IC on the semiconductor wafer 28, the first elastic coil 122 and the second elastic coil 124 are more preferably electrically connected if the spiral directions are the same. can do.

  On the other hand, when an oxide film is not formed on the surface of the IC on the semiconductor wafer 28 such as solder, it is not necessary to rotate the contact terminal 111 of the pogo pin 100, so that the first elastic coil 122 and the second elastic coil 124 The spiral directions can be arranged to be opposite to each other.

(Embodiment 2)
In the electrical connection device 1 according to the first embodiment of the present invention, the first elastic coil 122 having a small spring constant (spring constant: k1) and the second elastic coil 124 having a large spring constant (spring constant: k2) However, the present invention is not limited to this, and elastic coils having the same spring constant may be used.

  In the second embodiment of the present invention, the electrical connection device 1 in which the spring constants of the first elastic coil 122 and the second elastic coil 124 are the same will be described as an example. In addition, since it has the same structure as the electrical connection apparatus 1 which is Embodiment 1 of this invention except a spring constant, description is abbreviate | omitted.

  FIG. 6 shows the elastic force of the pogo pin with respect to the overdrive value of the electrical connection device 1 according to the second embodiment of the present invention.

  As shown in FIG. 6, the elastic force line 303 of the pogo pin 100 provided in the electrical connecting device 1 according to the second embodiment of the present invention has an overdrive value of “0” (μm), that is, FIG. From a free state not subjected to elastic compression to a state where the overdrive value has reached “100” (μm), that is, a state where the stop receiving member 113 shown in FIG. It rises with a predetermined slope S3.

  If the spring constants of the first elastic coil 122 and the second elastic coil 124 are k3, the first elastic coil 122 and the second elastic coil 124 are connected in series. K3 / 2, and the elastic force F3 at this time is expressed by the following (Equation 3). Here, x represents an overdrive value.

F3 = (k3 / 2) · x (Formula 3)
Thereafter, the elastic force 202 of the pogo pin 100 according to the second embodiment of the present invention is such that the overdrive value has reached “100” (μm), that is, the stop receiving member 113 shown in FIG. From the state of contact, it rises at a predetermined slope S4.

  At this time, the elastic force F4 after the stop receiving member 113 is in contact with the stop member 127 is expressed by the following (Equation 4).

F4 = k3 · x (Formula 4)
For comparison, the elastic force line 301 in FIG. 6 indicates the elastic force in the pogo pin having only the first elastic coil 122, and the elastic force line 302 in the pogo pin having only the second elastic coil 124. It shows the elastic force. In the second embodiment, since the spring constants of the first elastic coil 122 and the second elastic coil 124 are the same, they are the same straight line as the elastic force lines 301 and 302. The elastic force line 305 indicates the elastic force of the pogo pin in which the first elastic coil 122 and the second elastic coil 124 are simply connected in series without providing the stopper receiving member 113 and the stopper member 127.

  Until the overdrive value reaches “100” (μm), the spring constant of the elastic force line 303 of the pogo pin 100 included in the electrical connecting device 1 according to the second embodiment of the present invention is k3 / 2. It becomes smaller than the spring constant of the force lines 301 and 302, and the inclination is thereby reduced. Therefore, similarly to the electrical connection device 1 according to the first embodiment of the present invention, the pogo pin 100 is in a state where the lower end 101 (the other end) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28. Since the elastic force can be reduced, the probe substrate 18 can be prevented from bending toward the semiconductor wafer 28 (downward). Accordingly, the pogo pins 100 and the IC on the semiconductor wafer 28 can be electrically connected without variation in the distance from the lower end 101 (the other end) of the pogo pins 100 to the semiconductor wafer 28. .

  Further, even when the lower end portion 101 (the other end portion) of the pogo pin 100 is not in contact with the IC on the semiconductor wafer 28, the pogo pin 100 is pressed against the land portion 141 by the elastic force of the pogo pin 100. The portion 141 can be electrically connected.

  On the other hand, after the overdrive value reaches “100” (μm), the spring constant of the elastic force line 303 of the pogo pin 100 included in the electrical connecting device 1 according to the second embodiment of the present invention is the second elastic coil. Since it is the same as the spring constant k3 of 124, the inclination is the same as the elastic force lines 301 and 302.

  Therefore, for example, when it is desired to bring the lower end portion 101 (the other end portion) of the pogo pin 100 into contact with the IC on the semiconductor wafer 28 with an elastic force of 3 (gf), as shown in FIG. The stage mechanism 22 may be moved upward (to the electrical connection portion 16 side) so that the overdrive value of the output becomes “200” (μm).

  That is, the lower end portion 101 (the other end portion) of the pogo pin 100 is formed between the first elastic coil 122 and the second elastic coil 124 according to the elastic force required when contacting the IC on the semiconductor wafer 28. What is necessary is just to determine a spring constant.

  As described above, according to the electrical connection device 1 of Embodiment 2 of the present invention, the lower end portion 101 (the other end portion) of the pogo pin 100 is similar to the electrical connection device 1 of Embodiment 1 of the present invention. In a state where it is not in contact with the IC on the semiconductor wafer 28, the elastic force of the pogo pin 100 is small, and in a state where the lower end portion 101 (the other end portion) of the pogo pin 100 is in contact with the IC on the semiconductor wafer 28. Can be changed depending on the state so that the elastic force of the pogo pin 100 is increased. Thereby, both the land part 141 and the pogo pin 100 and between the pogo pin 100 and the IC on the semiconductor wafer 28 can be electrically connected well.

(Embodiment 3)
In the electrical connection device 1 according to the first embodiment of the present invention, the two elastic coils of the first elastic coil 122 and the second elastic coil 124 are arranged in series. The elastic coil may be used.

  In the third embodiment of the present invention, an electrical connection device 1 including three elastic coils will be described as an example. Note that the spring constants of the three elastic coils may be the same or different.

  FIG. 7 is a view showing the structure of the pogo pin 100 provided in the electrical connection device 1 according to the third embodiment of the present invention. FIG. 7 shows the pogo pin 100 in a free state before being assembled and not subjected to elastic compression.

  As shown in FIG. 7, the pogo pin 100 includes a plunger portion 110a and a barrel portion 120a provided on the outer peripheral side of the plunger portion 110a so as to cover a part of the side surface of the plunger portion 110a.

  The plunger portion 110 a is provided with a contact terminal 111 a including a lower end portion 101 (the other end portion) that contacts the IC on the semiconductor wafer 28, and an upper end that is provided coaxially with the contact terminal 111 a and contacts the land portion 141 of the wiring board 14. And a columnar plunger main body 112 including a portion 103 (one end portion).

  The barrel portion 120a includes a fixing portion 121 that is fixed to the plunger portion 110a on the lower end portion 101 (the other end portion) side, a first elastic coil 122 that is extendable in the axial direction of the contact terminal 111a, and a contact terminal The second elastic coil 124 provided to be extendable in the axial direction of 111a, the third elastic coil 132 provided to be extendable in the axial direction of the contact terminal 111a, the first elastic coil 122, and the second elastic coil The barrel main body 123 that connects the elastic coil 124, the barrel main body 131 that connects the second elastic coil 124 and the third elastic coil 132, and the plunger 110 on the upper end 103 (one end) side. And a fixing portion 125 to be fixed to.

  The barrel main body 123 has a stop member 127 provided in a protruding shape along the inner periphery of the hollow cylindrical shape, and the barrel main body 131 has a protruding shape along the inner periphery of the hollow cylindrical shape. A stop member 128 is provided.

  The contact terminal 111a of the plunger portion 110a has a small-diameter portion 115 having a small diameter so as not to contact the stop members 127 and 128, and a large-diameter portion 116 having a large diameter so as to contact the stop members 127 and 128. ing. The joint portion between the small diameter portion 115 and the large diameter portion 116 is provided with an inclined surface that is inclined in the outer peripheral direction from the shaft in the circumferential direction, and the joint portions serve as stopper receiving members 113 and 114.

  When the pogo pin 100 is pressed in the X1 direction, the first elastic coil 122, the second elastic coil 124, and the third elastic coil 132 are elastically compressed. As a result, the stop receiving member 113 comes into contact with the stop member 127, and this contact restricts further elastic compression of the first elastic coil 122.

  When the pogo pin 100 is further pressed in the X1 direction, the second elastic coil 124 and the third elastic coil 132 are not compressed by the first elastic coil 122 in a state where the stop receiving member 113 is in contact with the stop member 127. Elastically compresses.

  When the pogo pin 100 is further pressed in the X1 direction, the stop receiving member 114 comes into contact with the stop member 128, and this contact restricts further elastic compression of the second elastic coil 124.

  When the pogo pin 100 is further pressed in the X1 direction, the first elastic coil 122 and the second elastic coil 124 are not elastically compressed while the stop receiving member 114 is in contact with the stop member 128, and the third elastic coil 132 is pressed. Only elastically compresses.

  Thus, in the electrical connection apparatus 1 which is Embodiment 3 of this invention, since the 1st elastic coil 122, the 2nd elastic coil 124, and the 3rd elastic coil 132 are arrange | positioned in series, the pogo pin 100 When it is necessary to switch the elastic force of the three to three stages, an advantageous effect can be obtained.

  In the electrical connection device 1 according to the third embodiment of the present invention, when an oxide film is formed on the surface of the IC on the semiconductor wafer 28, the first elastic coil 122, the second elastic coil 124, and the third The spiral direction of the elastic coil 132 may be alternately provided in the opposite direction.

(Embodiment 4)
In the electrical connection device 1 according to the first embodiment of the present invention, the contact terminal 111 of the plunger portion 110 includes the stop receiving member 113. However, the present invention is not limited thereto, and the plunger main body portion of the plunger portion includes the stop receiving member. You may do it.

  In the fourth embodiment of the present invention, an electrical connection device 1 provided with a stopper member on the plunger main body portion of the plunger portion will be described as an example.

  FIG. 8 is a view showing the structure of the pogo pin 100 provided in the electrical connection device 1 according to the fourth embodiment of the present invention. FIG. 8 shows the pogo pin 100 in a free state before being assembled and not subjected to elastic compression.

  As shown in FIG. 8, the pogo pin 100 includes a plunger portion 110b and a barrel portion 120b provided on the outer peripheral side of the plunger portion 110b so as to cover a part of the side surface of the plunger portion 110b.

  The plunger portion 110b is provided coaxially with the contact terminal 111b including the lower end portion 101 (the other end portion) that contacts the IC on the semiconductor wafer 28, and the upper end that contacts the land portion 141 of the wiring board 14. And a columnar plunger main body 112b including a portion 103 (one end portion).

  The barrel portion 120b includes a fixing portion 121b that is fixed to the plunger portion 110b on the lower end portion 101 (the other end portion) side, a first elastic coil 122 that is extendable in the axial direction of the contact terminal 111b, and a contact terminal 111b, a second elastic coil 124 that is extendable in the axial direction, a barrel main body 123 that connects the first elastic coil 122 and the second elastic coil 124, and an upper end 103 (one end) ) Side and a fixing portion 125b for fixing to the plunger portion 110.

  The barrel main body 123 has a stop member 127 provided in a protruding shape along the inner periphery of the hollow cylindrical shape.

  The plunger main body portion 112 b of the plunger portion 110 b includes a small diameter portion 115 whose diameter is reduced so as not to contact the stop member 127 and a large diameter portion 116 whose diameter is increased so as to contact the stop member 127. The joint portion between the small diameter portion 115 and the large diameter portion 116 is provided with an inclined surface that is inclined in the outer peripheral direction from the shaft in the circumferential direction, and this joint portion serves as a stopper member 113.

  When the pogo pin 100 is pressed in the X1 direction, the first elastic coil 122 and the second elastic coil 124 are elastically compressed. As a result, the stop receiving member 113 comes into contact with the stop member 127, and this contact restricts further elastic compression of the first elastic coil 122.

  When the pogo pin 100 is further pressed in the X1 direction, the second elastic coil 124 is elastically compressed without elastically compressing the first elastic coil 122 in a state where the stopper receiving member 113 is in contact with the stopper member 127.

  Thus, in the electrical connection apparatus 1 which is Embodiment 4 of this invention, the 1st elastic coil 122 and the 2nd elastic coil 124 are arrange | positioned in series, and a stop receiving member is attached to the plunger main-body part 112b of the plunger part 110b. 113 is provided, the contact terminal 111b can be made smaller, that is, shorter in the axial direction of the contact terminal 111b than the contact terminal 111 provided in the electrical connection device 1 according to the first embodiment of the present invention. . Thereby, since material cost can be reduced, manufacturing cost can be reduced.

DESCRIPTION OF SYMBOLS 1 ... Electrical connection apparatus 11 ... Tester 12 ... Support member 14 ... Wiring board 16 ... Electrical connection part 17 ... Connection support member 18 ... Probe board 19 ... Support member 20 ... Holder 21 ... Chuck top 22 ... Stage mechanism 23 ... Prober Base 24 ... Heat source 28 ... Semiconductor wafer 100 ... Pogo pin 101 ... Lower end portion 103 ... Upper end portion 110, 110a, 110b ... Plunger portion 111, 111a, 111b ... Contact terminal 112, 112b ... Plunger main body portion 113, 114 ... Stop receiving member 120 , 120a, 120b ... barrel portion 121, 121b ... fixed portion 122 ... first elastic coil 123, 131 ... barrel main body portion 124 ... second elastic coil 125, 125b ... fixed portion 127, 128 ... stop member 132 ... third Elastic coil 141 ... Land part

Claims (8)

An electrical connection device for holding an object to be inspected having an electrode on its surface on a work surface and electrically connecting the electrode and a tester,
A wiring board provided with a connection portion to the tester on one surface and a land portion connected to the connection portion on the other surface;
A probe board disposed on the inspection object side of the wiring board, provided with a pogo pin having one end in contact with the land portion and the other end protruding to the inspection object side,
The pogo pin is
Contact terminals to the electrodes, and a plunger portion comprising a plunger body portion contacting to the land portions provided coaxially spaced the contact terminals and intervals, and a barrel portion provided on the outer peripheral side of the plunger portion Prepared,
The barrel portion includes a plurality of elastic bodies provided to be extendable in the axial direction of the contact terminals and a barrel main body portion provided with one or more stop members between the plurality of elastic bodies,
The plunger portion has one or more stop receiving members provided so as to come into contact with a corresponding stop member among the one or more stop members when the plurality of elastic bodies are elastically compressed by a predetermined length. An electrical connection device characterized by the above. The one or more stop receiving members are:
2. The electrical connection according to claim 1, wherein when the plurality of elastic bodies are each elastically compressed, the elastic bodies are provided at positions that come into contact with corresponding stop members in order from the elastic bodies provided on the contact terminal side. apparatus. The plurality of elastic bodies are elastic coils,
The electrical connection device according to claim 2, wherein the elastic coil provided on the contact terminal side is arranged so that the spring constant is smaller. The electrical connection device according to any one of claims 1 to 3, wherein the one or more stopper receiving members are provided on the plunger main body. The electrical connection device according to claim 1, wherein the plurality of elastic bodies are elastic coils provided so that spiral directions are the same. The electrical connection device according to claim 1, wherein the plurality of elastic bodies are elastic coils provided so that spiral directions are alternately reversed. The electrical connection device according to claim 1, wherein the barrel portion is formed by integrally molding the plurality of elastic bodies and the barrel main body portion. An electrical connection device for holding an object to be inspected having an electrode on a work surface on a work surface and electrically connecting the electrode and a tester, wherein a connection portion to the tester is provided on one surface, and the other Applied to an electrical connection device comprising a wiring board provided with a land portion connected to the connection portion on the surface and a probe board disposed on the object side of the wiring board, Is a pogo pin provided on the probe substrate so that the other end portion protrudes toward the object to be inspected,
Contact terminals to the electrodes, and a plunger portion comprising a plunger body portion that contacts the land portion provided coaxially spaced the contact terminals and intervals, and a barrel portion provided on the outer peripheral side of the plunger portion Prepared,
The barrel portion includes a plurality of elastic bodies provided to be extendable in the axial direction of the contact terminals and a barrel main body portion provided with one or more stop members between the plurality of elastic bodies,
The plunger portion has one or more stop receiving members provided so as to come into contact with a corresponding stop member among the one or more stop members when the plurality of elastic bodies are elastically compressed by a predetermined length. Pogo pin characterized by that.

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