JP2006292456A - Device and method for inspection of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To restrain contact resistance between bump electrodes and contacts from increasing due to an increase in the number of times that the bump electrodes of a semiconductor device make contact with the contactors. <P>SOLUTION: In order to perform electrical inspection for the semiconductor device 1 with its external terminal equipped with the bump electrodes 2, this inspection device for semiconductor devices is equipped with the contacts 3 being harder than the bump electrodes 2 and making contact with the bump electrodes 2, and a socket body 8 for therein housing the contactors 3, with the contactors 3 capable of making contact with the bump electrodes 2 at a number of specific positions. In a plurality of inspection processes for semiconductor devices, positions at which the contactors make contact with the bump electrodes in each inspection process are kept from overlapping with those in another inspection process as far as possible, thereby making it possible to lower and stabilize contact resistance with the bump electrodes in inspection. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inspection apparatus and an inspection method for a semiconductor device, and more particularly to an inspection apparatus and an inspection method for a semiconductor device that contact and inspect a spherical electrode forming an external electrode of a semiconductor device represented by a BGA type IC package.

  In recent years, so-called BGA type packages in which external terminals are formed by solder balls protruding in a hemispherical shape from the lower surface of a semiconductor device have been used.

  Conventionally, in such a BGA type inspection socket, a spring probe is generally used for testing.

  The spring probe has a structure in which the tip of the probe rotates freely.

  As semiconductor devices have higher functionality, higher frequency, and lower voltage, the contact resistance generated between the contacts connecting the external terminals of the semiconductor device and the test board is kept low and stable in order to carry out stable electrical characteristic inspection. It is required to make it.

  In the semiconductor device inspection process, high temperature inspection (burn-in inspection), DC inspection, and final inspection are performed a plurality of times. Further, in recent years, with the increase in functionality of semiconductor devices, the number of inspection items tends to increase, and the number of inspections increases.

  Patent Document 1 is an invention as a terminal structure in an inspection socket, and an example of a structure of a conventional spring probe is shown in FIG.

  The spring probe 30 includes slidable plungers 5 a and 5 b disposed at both ends in the axial direction in a conductor tube 4 formed of metal loaded in the case 8. The plungers 5a and 5b are provided with a protrusion behavior by a spring 7 disposed on the opposing surfaces of the terminals, can move while contacting the inner surface of the conductor tube 4, and oppose each other. The tube opening 11 is squeezed by caulking, and the plungers 5a and 5b are configured to be slidable in the axial direction, and the ball side contact portion 6 protrudes without the large diameter portions 12a and 12b coming out. .

  When inspecting the semiconductor device, the BGA package 1 is pressurized from above and is electrically connected to the inspection substrate 13.

  The tube 4 of the spring probe 30 can be rotated in the case 8 and can also be rotated by the plungers 5 a and 5 b attached to the tube 4.

Due to the above structure, in the spring probe, the contact position of the solder ball is an unspecified position, and at the same time, when a plurality of inspections are performed, the contact to the same position is repeated.
JP 2001-255340 A

  However, by performing the inspection a plurality of times, contact marks are formed on the solder bumps of the semiconductor device, and the contact resistance between the contacts connecting the external terminals of the semiconductor device and the inspection substrate increases.

  This is presumably because when the contact that is harder than the solder ball terminal hits the solder ball terminal, the solder ball terminal is deformed and solder adheres to the contact and an oxide film is generated on both. Further, it is considered that when the contact is applied to the deformed solder ball terminal, the contact pressure cannot be obtained and the oxide film is deposited by the attached solder and cannot be removed.

  FIG. 12 shows a graph in which the number of contacts and the contact resistance value are collected with a plunger using a BeCu material as a plunger against a solder ball terminal formed of the material SnAgCu on the external terminal of the semiconductor device. It turns out that the resistance value increases in proportion to the number of contacts. Due to this increase in contact resistance, there is a problem that accurate inspection cannot be performed.

  Accordingly, an object of the present invention is to provide a semiconductor device inspection apparatus and inspection capable of suppressing an increase in the contact resistance between the bump electrode and the contact due to an increase in the number of contacts between the bump electrode and the contact in the semiconductor device. Is to provide a method.

  In order to solve the above-mentioned problems, a semiconductor device inspection apparatus according to claim 1 of the present invention is in contact with a bump electrode to perform electrical inspection of a semiconductor device having a bump electrode on an external terminal. An inspection apparatus for a semiconductor device comprising a hard contact and a socket body for housing the contact, wherein the contact can contact several specific positions of the bump electrode.

  3. The semiconductor device inspection apparatus according to claim 2, wherein the contact has a plunger that contacts the bump electrode, and the socket body slides through the plunger. An upper lid guide plate provided with a hole to be provided, the tip of the plunger is formed in a shape protruding from the center toward the square portion, and the intersection angle of diagonal lines is formed at a predetermined angle. The hole has a plurality of types in which the radial direction of the hole is different from the predetermined angle.

  4. The semiconductor device inspection apparatus according to claim 3, wherein the semiconductor device has a contact that is in contact with the bump electrode and is harder than the bump electrode in order to perform an electrical inspection of the semiconductor device having the bump electrode on the external terminal. It is a socket, The contact position of the said bump electrode and the said contactor can be changed.

  The semiconductor device inspection apparatus according to claim 4 is the semiconductor device inspection apparatus according to claim 3, wherein the contact is positioned in the circumferential direction of the conductor tube accommodated in the socket body and the conductor tube. And a plunger that is inserted in a state and is in contact with the bump electrode, and is disposed on the socket body so as to be able to advance and retreat in contact with the side surface of the conductor tube, thereby providing a wire that can rotate the conductor tube.

  The semiconductor device inspection apparatus according to claim 5 is the semiconductor device inspection apparatus according to claim 3, wherein the contact includes a spiral guide portion provided in a range of a predetermined angle on the circumference of the inner peripheral surface. A conductor tube; a spring disposed in the conductor tube; and a plunger that is inserted into the conductor tube and is in contact with the bump electrode while being biased by the spring. A plurality of protrusions that are guided and arranged on the circumference of the outer peripheral surface are provided.

  According to a sixth aspect of the present invention, there is provided a method for inspecting a semiconductor device, wherein a contact position between the bump electrode and the contact is specified in a plurality of inspection steps using the semiconductor device inspection apparatus according to the first aspect.

  The method for inspecting a semiconductor device according to claim 7 is an inspection step using the device for a semiconductor device according to claim 3, wherein each time the bump electrode and the contact are in contact with each other, a fixed amount, and the bump electrode The connection point of the contact moves.

  According to the inspection apparatus for a semiconductor device according to the first aspect of the present invention, the contact can contact several specific positions of the bump electrode, so that fluctuation in contact resistance between the bump electrode and the contact is suppressed. Accurate inspection.

  According to a second aspect of the present invention, the distal end of the plunger is formed in a shape protruding from the center toward the square portion, the intersection angle of the diagonal lines is formed at a predetermined angle, and the radial direction of the hole of the upper lid guide plate is equal to or larger than the predetermined angle. Since there are different types, the plunger can contact several specific positions of the bump electrode by changing the top lid guide plate.

  According to the semiconductor device inspection apparatus of the third aspect of the present invention, since the contact position between the bump electrode and the contact can be changed, the contact resistance in the inspection can be kept low.

  In claim 4, since the plunger of the contactor is positioned in the circumferential direction on the conductor tube, and provided with a wire that allows the conductor tube to rotate by being disposed in the socket body so as to be movable in contact with the side surface of the conductor tube, The contact is rotated by moving the wire, and the contact position of the bump electrode and the plunger can be changed.

  According to a fifth aspect of the present invention, a spiral guide portion is provided in a range of a predetermined angle on the circumference of the inner peripheral surface of the conductor tube of the contact, and the plunger is guided by the guide portion and arranged on the circumference of the outer peripheral surface. Since a plurality of protrusions are provided, for example, when the plunger is lowered, the protrusion is fitted to the guide part, and when the plunger is raised, the protrusion part is guided to the guide part, so that the contact position between the bump electrode and the plunger Can be changed.

  According to the semiconductor device inspection method of the sixth aspect of the present invention, the contact position between the bump electrode and the contact is specified in a plurality of inspection steps using the semiconductor device inspection apparatus according to the first aspect. Each process has a specific contact position that does not overlap, and the contact resistance in the inspection can be kept low.

  According to a method for inspecting a semiconductor device according to a seventh aspect of the present invention, in the inspection step using the semiconductor device according to the third aspect, a fixed amount of bumps are provided each time the bump electrode contacts the contact. Since the connection point between the electrode and the contact moves, the inspection yield can be expected to be improved without being affected by the contact resistance of the contact for each number of inspections such as during re-inspection.

Embodiments of the present invention will be described below with reference to the drawings (first embodiment).
A first embodiment of the present invention will be described with reference to FIGS. 1A is a plan view of a semiconductor device inspection apparatus according to a first embodiment of the present invention, FIG. 1B is a cross-sectional view, FIG. 1C is an exploded perspective view, and FIG. 2A is a first embodiment. FIG. 4B is a front view, FIG. 4B is a front view, FIG. 4C is a front end detail view, and FIG.

  As shown in FIG. 1 and FIG. 2, in order to perform electrical inspection of the semiconductor device 1 having the bump electrode 2 on the external terminal, the bump electrode 2 is contacted. A socket body 8 is provided. Further, the contact 3 has a plunger 5 that contacts the bump electrode 2, and an upper lid guide plate 9 provided with a hole 20 that passes through the plunger 5 and slides in the socket body 8. The distal end of the plunger 5 is formed in a shape projecting from the center toward the square portion, the diagonal intersection angle θ1 is formed at a predetermined angle, and the radial direction of the hole 20 of the upper lid guide plate 9 differs by a predetermined angle or more. Has multiple types.

  In this case, in the spring probe (contactor) 3 that contacts the external electrode of the BGA package (semiconductor device) 1, the contact portion 6 that the solder ball 2 contacts is smaller than the longitudinal length Y1 in the lateral length X1. The tip is formed in a crown shape with four protrusions. At this time, by forming the diagonal intersection angle θ1 of the plunger 5 in contact with the solder ball 2 at 22.5 °, four contact points can be secured at 180 °, and inspection at new contact points can be performed up to four steps. Can be implemented.

When the pitch of the solder balls is 0.5 mm, the outer shape of the conductor tube 3 is 0.4 mm,
When the opening diameter of the conductor tube 3 through which the plunger 5 passes is 0.25 mm,
When configured with Y1 = 0.25 mm and X1 = Y1 / 2 = 0.125 mm,
Plunger tip dimension is X2 = 0.25mm × sin (22.5 / 2) = 0.049mm ≒ 0.05mm
Y2 = 0.25 mm × cos (22.5 ° / 2) = 0.245 mm≈0.25 mm
The horizontal length X2 is about 0.05 mm, and the vertical length Y2 is the terminal diameter.

  The spring probe 3 is housed in a case (socket body) 8, the upper lid guide plate 9 is pressed by the outer frame 301, fixed to the case 8 with screws 302, and the conductor tube 4 is housed in the case 8.

  The upper lid guide plate 9 has a structure in which the tips of the contacts 3 having different vertical and horizontal sizes penetrate, slide, and do not rotate. Thereby, the inspection socket which makes the position which contacts the solder ball 2 a specific position can be obtained.

  Next, a method for inspecting a semiconductor device using this socket will be described.

  FIG. 5 shows a process from the end of assembly of a general semiconductor device to package shipment. A case where the external terminal of the semiconductor device is contacted a plurality of times will be described with reference to FIGS. 3 (a-1 to 3) is an explanatory view showing the type of the upper lid guide plate in the first embodiment of the present invention, (b-1 to 3) is an explanatory view showing the contact position of the solder ball, and FIG. It is a perspective view which shows the plunger of the contactor in embodiment of this invention.

  As shown in FIG. 3 (a-1 to 3), a plurality of upper lid guide plates 9 in which the direction of the hole 20 is different by a predetermined angle, in this case, 45 degrees and 90 degrees, are manufactured.

  As shown in FIGS. 3 to 5, in the first inspection process (characteristic inspection 1), the upper lid guide plate 9 of FIG. 3 (a-1) is used, and the solder ball contact portion of FIG. 3 (b-1). The contact portion 402 of the plunger 5 is applied to the position 401, and the inspection is performed.

  In the second inspection step (characteristic inspection 2), the upper lid guide plate 9 of FIG. 3 (a-2) is used, and the contact portion of the plunger 5 is located at the position of the solder ball contact portion 401 of FIG. 3 (b-2). 402 is applied to perform the inspection.

  In the third inspection step (characteristic inspection 3), the upper lid guide plate 9 in FIG. 3 (a-3) is used, and the contact portion of the plunger 5 is located at the position of the solder ball contact portion 401 in FIG. 3 (b-3). 402 is applied to perform the inspection.

  In the fourth inspection step (final inspection), the upper lid guide plate 9 of FIG. 3A-4 is used, and the contact portion 402 of the plunger 5 is positioned at the position of the solder ball contact portion 401 of FIG. 3B-4. To conduct the inspection.

In each of the first, second, third, and fourth inspection steps, a specific contact position that does not overlap is obtained, and stable inspection can be performed.
(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. 6A is an exploded perspective view of a semiconductor device inspection apparatus according to a second embodiment of the present invention, FIG. 6B is a cross-sectional view, FIG. 7C is a plan view, and FIG. 7 is a contact in the second embodiment. FIG.

  As shown in FIGS. 6 and 7, the contact 3 is in contact with the bump electrode 2 and is harder than the bump electrode 2 in order to perform electrical inspection of the semiconductor device 1 (see FIG. 1) having the bump electrode 2 on the external terminal. And a socket body 8 for accommodating the contact 3. The contact 3 includes a conductor tube 4 housed in the socket body 8 and a plunger 5 a that is inserted into the conductor tube 4 while being positioned in the circumferential direction and contacts the bump electrode 2. A wire 504 is provided so that the conductor tube 4 can be rotated by being disposed so as to be able to advance and retreat in contact with the side surface.

  In this case, the spring probe (contactor) 3 has a conductor tube 4 integral with the plunger 5b that contacts the inspection board, the spring 7 is disposed therein, and the plunger 5a that is in contact with the solder ball is disposed therein. Configured. The conductor tube portion 4 is provided with a notch groove 501 vertically, and the plunger 5 a is provided with a protrusion 502 that fits into the notch of the conductor tube 4.

  The spring probe pin 3 is housed in an upper lid guide plate 9 and a case (socket body) 8.

  Further, every other row of metal wires 504 coated with an elastic body is arranged between the spring probes 3 arranged in the X direction 503, whereby the rotation of the spring probe 3 is fixed. The metal wire 504 is connected to the operation lever 505.

Next, a method for inspecting a semiconductor device using this socket will be described. FIG. 6 shows the operation. As shown in FIG. 6, by moving the operation lever 505, the metal wire 504 moves, and the spring probe 3 with which the metal wire 504 is in contact rotates. When the outer diameter of the conductor tube portion is 0.4 mm, when rotating 45 °, 0.4 mm × 3.14 × 45 ° / 360 ° ≈0.16 mm from the circumference.
Just operate. By these, the contact position of the solder ball and plunger of the semiconductor device can be changed.
(Third embodiment)
A third embodiment of the present invention will be described with reference to FIGS. FIG. 9A is a perspective view of a contact in the third embodiment of the present invention, FIG. 9B is an internal explanatory view, FIG. 9C is a front view of a plunger, FIG. 9D is a front view of a pedestal, and FIG. Is an explanatory view of the contact portion between the plunger and the pedestal, (f) is an explanatory view in which the contact portion between the plunger and the pedestal rotates, and FIG. 10 (a) is a cross-sectional view of the semiconductor device inspection apparatus according to the third embodiment of the present invention. , (B) is a plan view.

  Also in this embodiment, the next contact position is changed after the contact of the solder ball. That is, as shown in FIGS. 9 and 10, the contact 3 includes a conductor tube 4 in which a spiral guide portion 702 is provided in a range of a predetermined angle on the circumference of the inner peripheral surface, and the conductor 3 is disposed in the conductor tube 4. And a plunger 5 that is inserted into the conductor tube 4 and is in contact with the bump electrode 2 while being urged by the spring 7. The plunger 5 is guided by the guide portion 702 on the circumference of the outer circumferential surface. A plurality of protrusions 703 are provided.

  In this case, as a configuration of the spring probe (contactor) 3, a plunger 5 b and a spring 7 that are in contact with the test substrate 13 are arranged in the conductor tube 4, and between the spring 5 and the plunger 5 a that is in contact with the solder ball 2. A pedestal 701 is disposed. The conductor tube 4 is provided with a groove (guide portion) 702 including a spiral opening.

  The spiral groove 702 is formed at an angle of 360 ° / (number of protrusions 703) to 120 ° or more.

  The package-side plunger 5a to be inspected has a protrusion 703 disposed on the circumference inside the conductor tube 4. The conductor tube 4 has a protrusion 704 on the side surface and does not rotate due to a groove 801 provided in the socket body 8.

  The spring probe 3 is housed inside the case 8 by the upper lid guide plate 9.

  In the spring probe 3, the BAG package 1 is lowered, and the solder ball 2 and the plunger 5a are also lowered. When the plunger 5a is lowered, the protrusion 703 of the plunger 5a is moved to the groove 702 side of the conductor tube 4 by the base 701, and the protrusion 703 is fitted into the groove 702 by the base 701.

  When the contact between the solder ball 2 of the BGA package 1 and the plunger 5a is released and the spring probe 3 rises, the protrusion 703 rises while rotating along the spiral groove 702.

  When the tip of the plunger 5a is formed in a crown shape that is divided into four parts, three protrusions 703 are provided. As a result, when the same semiconductor device is inspected continuously, the spring probe 3 can contact the solder ball 2 at different positions up to three times.

  Moreover, it becomes possible to increase a new contact part by increasing the projection part 703.

  Although the spring probe for BGA inspection has been described in the above embodiment, it can be applied to a terminal harder than a solder ball, such as a leaf spring type probe pin, and can be applied by changing the contact position for each inspection process.

  As described above, the inspection apparatus and inspection method for a semiconductor device according to the present invention are useful for a method for manufacturing and inspecting a semiconductor device.

(A) is a top view of the test | inspection apparatus of the semiconductor device of the 1st Embodiment of this invention, (b) is sectional drawing, (c) is a disassembled perspective view. (A) is a top view of the contact in 1st Embodiment, (b) is a front view, (c) is explanatory drawing. (A-1-4) is explanatory drawing which shows the kind of upper cover guide plate in the 1st Embodiment of this invention, (b-1-4) is explanatory drawing which shows the contact position of a solder ball. It is a perspective view which shows the plunger of the contactor in embodiment of this invention. (A) is a figure which shows each process from assembly of a general semiconductor device to shipment, (b) is a figure which shows each process from assembly to high-performance semiconductor device to shipment. (A) is a disassembled perspective view of the test | inspection apparatus of the semiconductor device of the 2nd Embodiment of this invention, (b) is sectional drawing, (c) is a top view. It is a disassembled perspective view of the contact in the 2nd Embodiment of this invention. It is explanatory drawing of the test | inspection method of the semiconductor device of the 2nd Embodiment of this invention. (A) is a perspective view of a contact in a third embodiment of the present invention, (b) is an internal explanatory view, (c) is a front view of a plunger, (d) is a front view of a base, and (e) is a plunger. FIG. 6 is an explanatory view of a contact portion between the pedestal and the pedestal, and FIG. (A) is sectional drawing of the inspection apparatus of the semiconductor device of the 3rd Embodiment of this invention, (b) is a top view. It is sectional drawing of the conventional test | inspection socket. It is a graph showing the frequency | count of contact and the raise value of resistance value.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 BGA package 2 Solder ball 3 Spring probe 4 Conductor tube 5, 5a, 5b Plunger 6 Ball contact part 7 Spring 8 Case 9 Upper cover guide plate 10 Projection part 11 Tube opening part 12a, 12b Large diameter part 13 Inspection board 301 Outer frame 302 Screw 501 Cut groove 502 Projection 503 X direction 504 Metal wire 505 Operation lever 701 Base 702 Spiral groove 703 Projection 704 Projection

Claims (7)

  A semiconductor device inspection apparatus comprising a contact that is in contact with the bump electrode and harder than the bump electrode, and a socket body that houses the contact for electrical inspection of the semiconductor device including the bump electrode on an external terminal An inspection apparatus for a semiconductor device, wherein the contactor can contact some specific positions of the bump electrode. The contact has a plunger that contacts the bump electrode;
An upper lid guide plate provided with a hole that passes through and slides through the plunger in the socket body,
The distal end of the plunger is formed in a shape protruding from the center toward the square part, the intersection angle of diagonal lines is formed at a predetermined angle, and the radial direction of the hole of the upper lid guide plate is different from the predetermined angle or more The semiconductor device inspection apparatus according to claim 1, wherein the apparatus has a plurality of types.   A semiconductor device inspection apparatus comprising a contact that is in contact with the bump electrode and harder than the bump electrode, and a socket body that houses the contact for electrical inspection of the semiconductor device including the bump electrode on an external terminal An inspection apparatus for a semiconductor device, wherein a contact position between the bump electrode and the contact can be changed. The contact has a conductor tube accommodated in the socket body, and a plunger that is inserted in a circumferentially positioned state in the conductor tube and contacts the bump electrode,
4. The inspection apparatus for a semiconductor device according to claim 3, further comprising a wire that is disposed in contact with a side surface of the conductor tube so as to be movable forward and backward. The contactor includes a conductor tube having a spiral guide portion provided in a range of a predetermined angle on the circumference of the inner peripheral surface, a spring disposed in the conductor tube, and a state in which the contact is biased by the spring. A plunger inserted into the conductor tube and in contact with the bump electrode;
The semiconductor device inspection apparatus according to claim 3, wherein the plunger is provided with a plurality of protrusions that are guided by the guide portion and arranged on a circumference of an outer peripheral surface.   2. A method for inspecting a semiconductor device, wherein a contact position between the bump electrode and the contact is specified in a plurality of inspection steps using the inspection device for a semiconductor device according to claim 1.   4. The inspection step using the semiconductor device device according to claim 3, wherein each time the bump electrode and the contactor come into contact, a fixed amount and a connection point of the bump electrode and the contact element move. A method for inspecting a semiconductor device.

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