KR102041182B1

KR102041182B1 - Method for testing semiconductor package

Info

Publication number: KR102041182B1
Application number: KR1020130095893A
Authority: KR
Inventors: 김운식; 이재동
Original assignee: 세메스 주식회사
Priority date: 2013-08-13
Filing date: 2013-08-13
Publication date: 2019-11-06
Also published as: KR20150019262A

Abstract

A method of inspecting a semiconductor package using a test handler, the method comprising: transferring the semiconductor package accommodated in a customer tray to a loading standby unit by using a first loading picker; Transferring the semiconductor package transferred to the loading waiter to a loading moving part using a second loading picker and aligning using vision; Performing inspection by transferring the semiconductor package transferred to the loading moving part to an inspection chamber; Transferring the inspected semiconductor package to an unloading moving part; Transferring the semiconductor package transferred to the unloading moving part to an unloading waiting part by using a first unloading picker; And transferring the semiconductor packages, which are transferred to the unloading standby part and classified according to a test result, to a customer tray using a second unloading picker.

Description

Method for testing semiconductor package

The present invention relates to a method for inspecting a semiconductor package, and more particularly, to a method for inspecting a semiconductor package using a test handler.

In general, in the manufacture of semiconductor packages, the electrical characteristics are examined during the manufacturing process to determine whether there is a defect. In this case, an electrical property of the semiconductor package mainly uses an inspection apparatus called a test handler.

In the inspection of the semiconductor package using the test handler, the semiconductor package is transferred from the customer tray to the test tray. At this time, the transfer from the customer tray to the test tray is transferred to the loading standby section and the test tray using the first loading picker and the second loading picker, respectively. Then, the semiconductor package is accommodated in the test tray in the order of a soak chamber, an inspection chamber, and an exit chamber. In addition, the inspected semiconductor package is transferred from the test tray to the customer tray. At this time, the transfer from the test tray to the customer tray is transferred to the unloading standby part and the customer tray by using each of the first unloading picker and the second unloading picker.

In this case, since the semiconductor package is formed in the order of the inner chamber, the inspection chamber, and the seat chamber in the state of being accommodated in the test tray, the inner time and the seat time are additionally generated. There is a problem extending.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for inspecting a semiconductor package that can shorten the time required for inspecting the semiconductor package and can perform more easily alignment.

According to one or more exemplary embodiments, a method of inspecting a semiconductor package according to an embodiment of the present invention is a method of inspecting a semiconductor package using a test handler, wherein the semiconductor package accommodated in a customer tray is loaded by using a first loading picker. Transferring to negative; Transferring the semiconductor package transferred to the loading waiter to a loading moving part using a second loading picker and aligning using vision; Performing inspection by transferring the semiconductor package transferred to the loading moving part to an inspection chamber; Transferring the inspected semiconductor package to an unloading moving part; Transferring the semiconductor package transferred to the unloading moving part to an unloading waiting part by using a first unloading picker; And transferring the semiconductor packages, which are transferred to the unloading standby part and classified according to a test result, to a customer tray using a second unloading picker.

In the method for inspecting a semiconductor package according to an embodiment of the present invention, the inspection of the semiconductor package using the inspection chamber may be performed by absorbing the semiconductor package transferred to the loading moving unit using a chuck and loading the moving mass. Positioning a part out of the test chamber; Performing inspection by aligning the connection terminals of the semiconductor package adsorbed on the chuck using vision and connecting them to a test board; The semiconductor package subjected to the inspection is lifted from the test board by using the chuck, and the unloading moving part is positioned below the chuck, and the loading moving part on which the other semiconductor package is mounted is placed on the test board. step; And transferring the semiconductor package absorbed by the chuck to the unloading moving part, and using the unloading moving part to position the outside of the inspection chamber, and placing the other semiconductor package mounted on the loading moving part to the chuck. The adsorption step can be repeated.

According to the present invention mentioned, the transfer of the semiconductor package is carried out using the loading moving part and the unloading moving part, and since the alignment of the semiconductor package can be achieved by using vision, It can omit, and as a result, the time according to the transfer of a semiconductor package can fully be shortened.

1 is a view for explaining a method of inspecting a semiconductor package according to an embodiment of the present invention.
FIG. 2 is a diagram for describing a method of inspecting a semiconductor package in the test chamber of FIG. 1.

As the inventive concept allows for various changes and numerous embodiments, the embodiments will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "consist of" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Example

1 is a view for explaining a method of testing a semiconductor package according to an embodiment of the present invention, Figure 2 is a view for explaining a method of testing a semiconductor package made in the test chamber of FIG.

1 and 2, a test handler may be used in the method of inspecting a semiconductor package of the present invention. In particular, in the inspection method of the semiconductor package of the present invention, the loading moving portion 21 and the unloading moving portion 25 can be used without using a test tray, and the semiconductor packages 41 and 47 in the inspection chamber 23. ) May be used a chuck 45 capable of vacuum adsorption. In addition, the transfer of the semiconductor packages 41 and 47 may include a first loading picker 13, a second loading picker 17, a first unloading picker 27, a second unloading picker 31, and a loading table. Base 15 and unloading wait 29 may be used. That is, in the inspection of the semiconductor package of the present invention, the first loading picker 13, the second loading picker 17, the first unloading picker 27, and the first loading picker 13, which are members capable of transferring the semiconductor packages 41 and 47, are made. A loading moving part 21 and an unloading picker 31, a loading waiting part 15, and an unloading waiting part 27, which are members capable of transferring the semiconductor package to the inspection chamber 23. An inspection apparatus having a loading moving part 25 can be used. In addition, the inspection apparatus which can be used for the inspection method of the semiconductor package of the present invention may include vision members 19 and 24 that can align the semiconductor packages 41 and 47, and the inspection apparatus includes a loading moving part. 21 and the unloading moving part 25 may be provided with a member capable of heating and cooling the semiconductor packages 41 and 47.

Hereinafter, the inspection method of the semiconductor package using the inspection apparatus mentioned above is as follows.

First, the semiconductor package 41 accommodated in the customer trays 10a and 10b is transferred to the loading standby unit 15 using the first loading picker 13. The semiconductor package 41 transferred to the loading standby part 15 is transferred to the loading moving part 21 using the second loading picker 17. Particularly, in the present invention, when the semiconductor package 41 is transferred to the loading moving part 21 using the second loading picker 17, the vision member 19 is transferred to the loading moving part 21. The semiconductor package 41 may be aligned.

The semiconductor package 41 transferred to the loading moving part 21 is transferred to the test chamber 23 to perform the test. The inspection using the inspection chamber 23 will be described later.

Subsequently, the inspected semiconductor package 41 is transferred to the unloading moving part 25, and then transferred to the unloading moving part 25 using the first unloading picker 27. ) Is transferred to the unloading standby part 29, and subsequently transferred to the unloading waiting part 29, and the second semiconductor unloading picker 31 is used to classify the semiconductor package 41 according to a test result. The semiconductor package 41 can be inspected by transferring the same to the customer trays 10c and 10d.

As described above, in the present invention, the semiconductor package 41 may be transferred to the inspection chamber 23 by using the loading moving part 21 and the unloading moving part 25. The speed time and the sheet time required for the use can be omitted, resulting in a sufficiently short time for inspection. In addition, since the semiconductor package 41 may be transferred to the loading moving part 21 using the second loading picker 17, the vision member 19 may be used to align the inspection. Can be.

In particular, in the inspection of the semiconductor packages 41 and 47 using the inspection chamber 23, the chuck 45 is used to transfer the semiconductor package 41 transferred to the loading moving part 21 as shown in FIG. 2. In addition to adsorption, the loading moving part 21 is positioned outside the test chamber 23.

In addition, the connection terminal of the semiconductor package 41 adsorbed by the chuck 45 is electrically connected to the test board 43 to perform the inspection. In this case, when the connection terminal of the semiconductor package 41 adsorbed to the chuck 45 and the socket of the test board 43 are not aligned, the connection terminal of the semiconductor package 41 and the test board 43 are not aligned. In the present invention, since the socket of is not connected correctly and, as a result, the inspection of the semiconductor package 41 is not performed correctly, the semiconductor package 41 is attached to the chuck 45 when the semiconductor package 41 is attracted to the chuck 45. A process of aligning the absorbed semiconductor package 41 using the vision member 24 is performed.

Subsequently, the semiconductor package 41 on which the inspection was performed is lifted from the test board 43 using the chuck 45, and the unloading moving part 25 is positioned below the chuck 45. The loading moving part 21 on which the other semiconductor package 47 is mounted is placed on the test board 43.

Subsequently, the semiconductor package 41 adsorbed by the chuck 45 is transferred to the unloading moving part 25, and the outside of the inspection chamber 23 using the unloading moving part 25. The semiconductor package 47 mounted on the loading moving part 21 is repeatedly adsorbed using the chuck 45.

As described above, in the inspection method of the semiconductor package of the present invention, the chuck 45 is used to connect the semiconductor packages 41 and 47 to the test board 43, so that inspection can be achieved in a shorter time, and at the same time, unloading is performed. By adding a heating function to the moving part 25, it is possible to perform the inspection more easily.

Therefore, the aforementioned inspection method of the semiconductor package of the present invention can sufficiently shorten the time required for inspection of the semiconductor package, and therefore, it is expected to improve productivity due to the manufacture of the semiconductor package.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

10a, 10b, 10c, 10d: semiconductor package
13: first loading picker 15: loading standby
17: second loading picker 19, 24: vision member
21: loading moving part 23: inspection chamber
25: unloading moving part 27: first unloading picker
29: unloading waiting portion 31: the second unloading picker
41, 47: semiconductor package 43: test board
45: Chuck

Claims

In the inspection method of a semiconductor package using a test handler,
Transferring the semiconductor package contained in a customer tray to a loading wait using a first loading picker;
Transferring the semiconductor package transferred to the loading waiter to a loading moving part using a second loading picker and aligning using vision;
Performing a test by transferring the semiconductor package transferred to the loading moving part to a test chamber;
Transferring the inspected semiconductor package to an unloading moving part;
Transferring the semiconductor package transferred to the unloading moving part to a unloading waiting part by using a first unloading picker; And
Transferring the semiconductor packages, which are transferred to the unloading waiting part and sorted according to a test result, to a customer tray using a second unloading picker,
Inspection of the semiconductor package using the inspection chamber,
Sucking the semiconductor package transferred to the loading moving part using a chuck and positioning the loading moving part outside the inspection chamber;
Arranging the connection terminals of the semiconductor package adsorbed on the chuck using vision and connecting the test terminals to a test board to perform inspection;
The semiconductor package subjected to the inspection is lifted from the test board by using the chuck, and the unloading moving part is positioned below the chuck, and the loading moving part on which the other semiconductor package is mounted is placed on the test board. step; And
The semiconductor package adsorbed by the chuck is transferred to the unloading moving part, and is positioned outside of the inspection chamber using the unloading moving part, and the other semiconductor package mounted on the loading moving part is used by the chuck. Method of inspecting a semiconductor package, characterized in that to perform the step of adsorption repeatedly.

delete

According to claim 1,
And heating or cooling the semiconductor package transferred to the loading moving part.

According to claim 1,
And heating or cooling the semiconductor package transferred to the unloading moving part.