KR101362652B1 - Test handler - Google Patents

Abstract

A test handler for inspecting electronic components, the test handler comprising: a test module having test sockets for connection with the electronic components to perform an inspection process on a plurality of electronic components; A first load / unload module and a second load / unload module for loading and unloading the electronic components with respect to the test module, respectively, and the test module and the first and second load / unload modules, respectively; And a first transfer module and a second transfer module for transferring the electronic components therebetween. Since the electronic components may be alternately supplied at both sides of the test module, the inspection time for the electronic components may be greatly shortened.

Description

Test handler {Test handler}

Embodiments of the invention relate to test handlers. More particularly, it relates to a test handler for handling the electronic components to inspect the plurality of electronic components.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be formed using semiconductor packages through a dicing process, a bonding process, and a packaging process. It can be prepared as.

The semiconductor packages manufactured as described above may be determined to be good or defective through an electrical property test. The electrical property test may include a test handler for handling the semiconductor packages and a tester for inspecting the semiconductor packages.

Electronic components such as the semiconductor packages may have terminals for external connection such as solder balls, and may perform an electrical inspection process in a state in which the external connection terminals and the tester are electrically connected. The test handler may include a plurality of test sockets having contact pins electrically connected to terminals for external connection of the electronic components.

As described above, the test handler for performing the inspection process for the electronic components includes a test handler for performing the inspection process for general memory devices and a test for performing the inspection process for the large scale integrated circuit (LSI) devices. Can be divided into handlers. An example of a test handler for performing the inspection process for the LSI devices is disclosed in Korean Patent Publication No. 10-2011-0113554.

In general, in the test handler, a load module for loading the electronic components and an unload module for unloading the electronic components may be disposed on both sides with a test module in which the inspection process for the electronic components is performed therebetween. Can be.

On the other hand, the inspection process for the LSI devices generally require a relatively longer inspection time compared to the inspection process for the memory devices. In particular, when using a hot plate for preheating the electronic components for high temperature inspection of the electronic components, the time required for the inspection process may be increased due to the preheating time of the electronic components, and also solves the problem. In order to operate the plurality of hot plates in order to increase the overall size of the test handler may further occur.

Embodiments of the present invention have an object to provide a test handler that can significantly reduce the inspection process time for electronic components.

The test handler according to the embodiments of the present invention for achieving the above object is a test module provided with test sockets for connection with the electronic components to perform the inspection process for a plurality of electronic components, and A first load / unload module and a second load / unload module for loading and unloading the electronic components, the test module and the first and second load / unload, respectively, disposed on both sides of a test module; A first transfer module and a second transfer module for transferring the electronic components between the modules, an unload buffer tray disposed between the first and second load / unload modules, and the first and second load / unload An unload pickup unit for transferring the electronic components from modules to the unload buffer tray, and the electronics from the unload buffer tray. A second unload buffer tray for receiving goods, a middle pickup unit for transferring the electronic component from the unload buffer tray to the second unload buffer tray, and the electronic components delivered to the second unload buffer tray; It may include a sorting pick-up unit for sorting according to the test result in the module to be stored in the customer trays.

According to embodiments of the present disclosure, each of the first and second load / unload modules may include a load tray in which electronic components for performing the inspection process and an electronic component inspected in the test module. It may include an unload tray.

According to embodiments of the present disclosure, the load tray and the unload tray may unload the electronic components from a load / unload region adjacent to the test module and a load region for loading the electronic components into the load tray and the unload tray. It can be configured to be movable between the unloaded region for.

According to embodiments of the present invention, the conveying direction of the electronic component with respect to the test module may be configured perpendicular to the conveying direction of the load and unload trays.

According to embodiments of the present invention, the load tray and the unload tray may be arranged in a multi-layered form and may be configured to be movable in parallel with each other.

According to embodiments of the present invention, a hot plate disposed adjacent to the load region and configured to preheat the electronic components may be further provided.

According to embodiments of the present invention, a first rod pickup unit for transferring the electronic components from the customer tray to the hot plate, and a second rod pickup unit for transferring the electronic components from the hot plate to the load tray This may be further provided.

According to embodiments of the present disclosure, the unload pickup unit may transfer the electronic components to the unload buffer tray from the unload trays located in the unload regions of the first and second load / unload modules.

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According to embodiments of the present invention, the first and second transfer modules pick up the electronic components and transfer them to the test module and press the electronic components to electrically connect the electronic components to the test sockets. Each contact pickup unit may be included.

According to the embodiments of the present invention as described above, the electronic component to the test module alternately through the first and second load / unload modules disposed on both sides of the test module for performing the inspection process for the electronic components Can be provided, the inspection time for the electronic components can be greatly shortened.

Further, the first and second load / unload modules are disposed on both sides of the test module, and first and second hot plates for preheating the electronic components are respectively provided in the first and second load / unload modules. Are disposed adjacent to each other, and components for sorting and storing the electronic components are disposed between the first and second hot plates, thereby greatly increasing the throughput per unit time of the test handler without increasing the overall size of the test handler. It is possible to improve.

1 is a schematic block diagram illustrating a test handler according to an embodiment of the present invention.
FIG. 2 is a schematic diagram illustrating the test module illustrated in FIG. 1.
FIG. 3 is a schematic diagram illustrating a load tray and an unload tray shown in FIG. 1.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

1 is a schematic diagram illustrating a test handler according to an embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating the test module illustrated in FIG. 1.

Referring to FIG. 1, a test handler 100 according to an embodiment of the present invention may be used to perform an inspection process on a plurality of electronic components 10 (see FIG. 2). In particular, it can be used to perform a high temperature inspection process for electronic components 10, such as LSI devices.

The test handler 100 may include a test module 110 for performing an inspection process on the electronic components 10. As illustrated in FIG. 2, the test module 110 may include a plurality of test sockets 112 for connecting to external connection terminals of the electronic components 10, and the test sockets ( 112 may be connected to a tester (not shown) for performing the inspection process.

The first load / unload module 120 and the second load / unload module 130 for loading and unloading the electronic components 10 with respect to the test module 110 are provided at both sides of the test module 110. Each can be arranged. For example, as illustrated, the first load / unload module 120, the test module 110, and the second load / unload module 130 may be arranged in a first direction.

According to an embodiment of the present invention, after the inspection process for the electronic components 10 is completed in the test module 110, the inspected electronic components 10 by the first load / unload module 120 are completed. Inspection time for the electronic components 10 since subsequent electronic components 10 may be loaded into the test module 110 by the second load / unload module 130 immediately following the unload operation This can be greatly shortened.

The load and unload operation of the electronic components 10 may be performed to transfer the electronic components 10 between the test module 110 and the first and second load / unload modules 120 and 130. It may be performed by the first and second transfer modules (140, 150).

The first and second transfer modules 140 and 150 are connected between the first load / unload module 120 and the test module 110 and the test module 110 and the second load / unload module 130. The contact pickup units 142 and 152 may be disposed to be movable between the respective ones. The first and second transfer modules 140 and 150 will be described later.

Each of the first and second load / unload modules 120 and 130 may be inspected by the test tray 110 and the load trays 122 and 132 in which the electronic components 10 for performing the inspection process are accommodated. And unload trays 124 and 134 for accommodating the completed electronic components 10.

FIG. 3 is a schematic diagram illustrating a load tray and an unload tray shown in FIG. 1.

1 and 3, each of the first and second load / unload modules 120 and 130 may perform a load and unload operation of the electronic components 10 with respect to the test module 110. The electrons from the load / unload regions 126 and 136 and the load regions 128 and 138 and the unload trays 124 and 134 for loading the electronic components 10 into the load trays 122 and 132. Unload regions 129 and 139 for unloading the components 10 may be included.

In particular, the load trays 122 and 132 and the unload trays 124 and 134 may include the load / unload regions 126 and 136 and the load regions 128 and 138 and the unload region adjacent to the test module 110. It can be configured to be movable between (129, 139). In this case, the load regions 128 and 138 and the unload regions 129 and 139 are separately divided, but may share the same region.

On the other hand, in the embodiments of the present invention that the components are configured to be movable means that each component can be moved by a drive for linear reciprocating motion, the drive is a general single axis robot or rectangular coordinates using a linear motion guide It may be configured in the form of a robot or the like.

The load and unload trays 122, 124, 132, and 134 are in a second direction perpendicular to the conveying direction of the electronic components 10 with respect to the test module 110, that is, as shown. Can be moved.

As an example, as shown in FIG. 3, the load trays 122 and 132 and the unload trays 132 and 134 may be arranged in a multi-layered form and may be configured to be movable in parallel with each other. This is to reduce the overall size of the test handler 100 and also to shorten the time required for the transfer of the electronic components 10 by loading and unloading the electronic components 10 at the same place. For sake.

Referring back to FIG. 1, the load trays 122 and 132 may include a plurality of sockets to accommodate the plurality of electronic components 10. For example, 32 electronic components 10 may be stored in the load trays 122 and 132, and the electronic components 10 may be provided by the first or second transfer module 140 or 150. It may be transferred to the test module 110.

The first and second transfer modules 140 and 150 may include contact pick-up units 142 and 152 including a plurality of pickers 144 and 154 for picking up the electronic components, as shown in FIG. 2. Each can be provided. For example, 32 pickers 144 and 154 may be provided, and the electronic components 10 may be simultaneously picked up and transferred to the test module 110. In addition, the electronic components 10 may be pressed in the vertical direction to electrically connect the electronic components 10 to the test sockets 112 in the test module 110.

The unload trays 124 and 134 may include a plurality of sockets to accommodate the plurality of electronic components 10. For example, the unload trays 124 and 134 may be configured to accommodate 32 electronic components 10 in the same way as the load trays 122 and 132, and the test module 110 may inspect the unload trays 124 and 134. The completed electronic components 10 may be transferred to the unload tray 124 or 134 by the first or second transfer module 140 or 150.

Meanwhile, the sockets of the load trays 122 and 132, the pickers of the contact pickup units 142 and 152, and the test sockets 112 of the test module 110 all have the same X direction pitch and Y direction. May have a pitch. However, as shown in FIG. 1, the sockets of the unloading trays 124 and 134 may have a Y pitch smaller than the Y pitch of the load trays 122 and 132. Accordingly, the size of the unload regions 129 and 139 may be relatively reduced, thereby reducing the size of the test handler 100 as a whole.

According to one embodiment of the invention, the test handler 100 is the first and second hot preheating the electronic components 10 before the electronic components 10 are transferred to the test module 110 Plates 160, 162 may be included. The first and second hot plates 160 and 162 may be disposed to be adjacent to the first and second load / unload modules 120 and 130, respectively. For example, as shown, the first and second hot plates 160, 162 may be disposed in the load regions 128, 138 of the first and second load / unload modules 120, 130, respectively. It may be arranged to be adjacent.

In addition, the customer trays 20 and 22 containing the plurality of electronic components 10 for performing the inspection process may be disposed to be adjacent to the first and second hot plates 160 and 162. . At this time, the test handler 100 first pick-up for transferring the electronic components 10 from the customer trays 20, 22 to the first and second hot plates 160, 162, respectively. Second rod pickup for transferring units 164 and the preheated electronic components 10 from the first and second hot plates 160, 162 to the load trays 122, 132, respectively. Units 166 may be included.

Each of the first and second rod pickup units 164 and 166 may include a plurality of pickers to simultaneously pick up and transport the plurality of electronic components 10, and the electronic components 10. It may be configured to be movable as shown for the pickup and storage of.

According to an embodiment of the present invention, the electronic components 10 preheated in the first and second hot plates 160 and 162 may replace the first and second load / unload modules 120 and 130. Through the test module 110 may be provided alternately. For example, the second hot plate 162 may be preheated while the inspection process for the electronic components 10 transferred to the test module 110 through the first load / unload module 120 is performed. The electronic components 10 may be in a state of being accommodated in the load tray 132 of the second load / unload module 130, and the electronic components 10 inspected by the test module 110 may be The unloaded tray 124 of the first load / unload module 120 may be unloaded and then immediately transferred to the test module 110.

As a result, since the time required for the subsequent electronic components 10 to be loaded after the inspection process for the electronic components 10 in the test module 110 is completed, the test handler 100 may be greatly reduced. The throughput per unit time of can be greatly increased.

The load trays 122 and 132 have heaters (not shown) for preventing the temperature of the electronic components 10 preheated from the first and second hot plates 160 and 162 from decreasing. It may be provided.

As described above, the electronic components 10 transferred from the test module 110 to the unload tray 124 or 134 of the first or second load / unload module 120 or 130 are transferred to the unload trays 124 and 134. By the unloaded regions 129 and 139.

Unload buffer trays 170 and 172 for receiving the inspected electronic components 10 are disposed between the unload regions 129 and 139 of the first and second load / unload modules 120 and 132. Can be. According to an embodiment of the present invention, a plurality of unload buffer trays 170 and 172 may be disposed between the unload regions 129 and 139.

The unload buffer trays 170 and 172 may separate the second unload region 180 and the inspected electronic components 10 to receive the electronic components 10 from the unload trays 124 and 134. It may be configured to be movable between the sorting area 182 for sorting and storing in the customer trays (30). For example, the unload buffer trays 170 and 172 may be configured to be movable in the second direction, and the customer trays 30 may be disposed adjacent to the sorting area 182.

According to an embodiment of the present invention, the inspected electronic components 10 are transferred from the unload trays 124 and 134 to the unload buffer trays 170 and 172 in the second unload region 180. The unload pickup unit 184 may be disposed, and the sorted area 182 may be configured to move the inspected electronic components 10 from the unload buffer trays 170 and 172 to the test module 110. The sorting pickup unit 186 may be disposed to separately classify and store the sorting according to the inspection result in the customer trays 30.

According to another embodiment of the present invention, in consideration of the time required for sorting and storing the inspected electronic components 10, the test handler 100 is disposed in the second unload region 180. And an unload buffer tray 170 and a second unload buffer tray 172 disposed in the sorting area 182, and between the first unload buffer tray 170 and the second unload buffer tray 172. A middle pickup unit 188 for transferring the electronic components 10 may be included. In this case, the inspected electronic components 10 may be classified and stored in the customer trays 30 via the first unload buffer tray 170 and the second unload buffer tray 172. The first unload buffer tray 170 may be configured to be movable in the second direction as necessary.

According to the embodiments of the present invention as described above, the first and second load / unload modules 120 disposed on both sides of the test module 110 for performing the inspection process for the electronic components 10, Since the electronic components 10 may be alternately provided to the test module 110 through the 130, the inspection time of the electronic components 10 may be greatly shortened.

In addition, the first and second load / unload modules 120 and 130 are disposed at both sides of the test module 110, and first and second hot plates for preheating the electronic components 10. 160 and 162 are disposed to be adjacent to the first and second load / unload modules 120 and 130, respectively, and components for sorting and storing the electronic components 10 may be provided in the first and second portions. Since it is disposed between the two hot plates (160, 162) it is possible to greatly improve the throughput per unit time of the test handler 100 without increasing the overall size of the test handler (100).

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: electronic component 20, 22, 30: customer tray
110: test module
120, 130: first and second load / unload module
122, 132: load tray 124, 134: unload tray
126, 136: load / unload area 128, 138: load area
129 and 139: unloading area 140 and 150: first and second transfer modules
160, 162: first and second hot plates 170, 172: unload buffer tray
180: second unloading area 182: sorting area

Claims (12)

A test module provided with test sockets for connection with the electronic components to perform an inspection process on a plurality of electronic components;
A first load / unload module and a second load / unload module, respectively disposed on both sides of the test module, for loading and unloading the electronic components with respect to the test module;
A first transfer module and a second transfer module for transferring the electronic components between the test module and the first and second load / unload modules;
An unload buffer tray disposed between the first and second load / unload modules;
An unload pickup unit for transferring the electronic components from the first and second load / unload modules to the unload buffer tray;
A second unload buffer tray for receiving the electronic components from the unload buffer tray;
A middle pickup unit for transferring the electronic component from the unload buffer tray to the second unload buffer tray; And
And a sorting pickup unit for sorting the electronic components delivered to the second unload buffer tray according to the test result of the test module and storing the electronic components in the customer trays. The electronic device of claim 1, wherein each of the first and second load / unload modules comprises a load tray accommodating electronic components for performing the inspection process and an unload tray for accommodating electronic components inspected by the test module. And a test handler comprising: The load and unload trays of claim 2, wherein the load trays and the unload trays are disposed in a load / unload area adjacent to the test module, a load area for loading the electronic parts into the load tray, and an unload for unloading the electronic parts from the unload tray. And a test handler configured to be movable between regions. The test handler of claim 3, wherein a conveying direction of the electronic component with respect to the test module and a conveying direction of the load and unload trays are perpendicular to each other. The test handler of claim 3, wherein the load tray and the unload tray are arranged in a multi-layered form and configured to be movable in parallel with each other. 4. The test handler of claim 3 further comprising a hot plate disposed adjacent the load region and for preheating the electronic components. The apparatus of claim 6, further comprising: a first rod pickup unit for transferring the electronic components from the customer tray to the hot plate; And
And a second rod pick-up unit for transferring the electronic components from the hot plate to the load tray. The test handler of claim 3, wherein the unload pickup unit delivers the electronic components to the unload buffer tray from the unload trays located in the unload regions of the first and second load / unload modules. . delete delete delete The contact pickup unit of claim 1, wherein the first and second transfer modules pick up the electronic components and transfer them to the test module and press the electronic components to electrically connect the electronic components to the test sockets. Each test handler comprising a.

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