KR101227744B1 - Apparatus and method for unloading a semiconductor device - Google Patents

Abstract

The semiconductor device unloading apparatus includes an unloader unit, a first buffer unit, a first transfer unit, a second buffer unit, a second transfer unit, and a third transfer unit. In the unloader unit, a test tray in which a plurality of semiconductor elements on which a test is performed is stored is unloaded from a test apparatus. The first buffer part is positioned adjacent to the unloader part, and at least one first buffer tray capable of accommodating semiconductor elements is disposed therein. The first transfer unit transfers the semiconductor elements accommodated in the test tray between the unloader unit and the first buffer unit to the first buffer tray. The second buffer unit is positioned adjacent to the first buffer unit, and a second buffer tray capable of accommodating semiconductor elements is disposed therein. The second transfer unit transfers the semiconductor elements, which are defective or re-tested, among the semiconductor elements accommodated in the first buffer tray between the first and second buffer units to the second buffer tray. The third transfer unit transfers the good semiconductor devices remaining in the first buffer tray and the defective or retested semiconductor devices transferred to the second buffer tray to the customer trays as they are separated.

Description

Semiconductor device unloading device and method {APPARATUS AND METHOD FOR UNLOADING A SEMICONDUCTOR DEVICE}

The present invention relates to an apparatus and method for unloading semiconductor devices, and more particularly, to an apparatus and method for unloading semiconductor devices that have been tested through a test apparatus.

In general, a semiconductor device is one of electronic components having a structure in which chips are connected on a substrate. The semiconductor device may include, for example, a memory device such as DRAM, SRAM, or the like.

The semiconductor device is manufactured based on a wafer made of a thin single crystal substrate made of silicon. In detail, the semiconductor device may include a fab process for forming a plurality of chips patterned with a circuit pattern on the wafer, a bonding process for electrically connecting each of the chips formed in the fab process to each of the substrates, and a chip connected to the substrate. It is manufactured by performing a molding process or the like to protect it from the outside. The semiconductor devices thus manufactured are subjected to a separate test process to check their electrical functions.

In this case, the test process is substantially performed through a test apparatus for performing a test on the semiconductor elements and a test handler for transferring the semiconductor elements to the test apparatus while being connected.

The test handler first includes a loading device for loading the semiconductor devices into the test device in the previous step based on the test device, and an unloading device for selecting and unloading the semiconductor devices tested from the test device.

However, the unloading apparatus sorts and unloads the semiconductor elements at the same time through only one transfer mechanism, thereby unnecessarily stacking the tested semiconductor elements, thereby increasing the overall unloading time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device unloading apparatus capable of quickly unloading a tested semiconductor device without a stack.

In addition, another object of the present invention is to provide a semiconductor device unloading method capable of quickly unloading the semiconductor devices through the unloading apparatus.

In order to achieve the above object of the present invention, a semiconductor device unloading apparatus according to one aspect includes an unloader portion, a first buffer portion, a first transfer portion, a second buffer portion, a second transfer portion, and a third transfer portion.

The unloader unit is unloaded from the test position with a test tray containing a plurality of tested semiconductor devices. The first buffer part is positioned adjacent to the unloader part, and at least one first buffer tray capable of accommodating the semiconductor elements is disposed therein. The first transfer unit transfers the semiconductor elements accommodated in the test tray between the unloader unit and the first buffer unit to the first buffer tray. The second buffer part is positioned adjacent to the first buffer part, and a second buffer tray capable of accommodating the semiconductor elements is disposed therein. The second transfer unit transfers the semiconductor elements, which are defective or re-tested, among the semiconductor elements accommodated in the first buffer tray between the first and second buffer units to the second buffer tray. The third transfer unit transfers the good semiconductor devices remaining in the first buffer tray and the defective or re-tested semiconductor devices transferred to the second buffer putter to the customer trays as they are separated.

In this case, the first buffer unit may be disposed adjacent to the unloader unit along the x-axis. Accordingly, the first transfer part may include a pickup part configured to pick up semiconductor elements received along the y axis of the test tray at one time and a driving part to move the pickup part in the x axis direction. Here, the pickup unit may move while changing the pitch of the semiconductor elements.

The apparatus may further include first and second buffer transfer units configured to transfer each of the first and second buffer trays in a y-axis direction. Accordingly, the second transfer part may include a second pickup part for picking up the semiconductor elements stored in the first buffer tray, and first and second transfer parts of the second pickup part by the first and second buffer transfer parts, respectively. It may include a second driving unit for moving in the x-axis direction so as to intersect with each of the buffer trays at different points.

On the other hand, the second pickup unit may be configured to be able to pick up the semiconductor elements accommodated along the x-axis of the first buffer tray at one time.

The first buffer unit may include a plurality of first buffer trays divided along an x-axis or a y-axis.

In order to achieve the above object of the present invention, a method of unloading semiconductor devices according to one aspect comprises the steps of: unloading a test tray containing a plurality of tested semiconductor devices from a test position; Transferring the semiconductor devices stored in the test tray to at least one first buffer tray disposed at an adjacent position, and storing the semiconductor devices that are defective or retested as a result of a test of the semiconductor devices stored in the first buffer tray Transferring to the second buffer tray disposed at the position and accommodating the semiconductor tray and the good quality semiconductor elements remaining in the first buffer tray and the defective or retested semiconductor elements transferred to the second buffer tray as they are. Transporting and receiving the same.

In this case, the step of transferring to the first buffer tray may include picking up the semiconductor devices accommodated along the y-axis of the unloaded test tray at once and transferring the pick-up semiconductor devices along the x-axis to the first buffer. And accommodating the tray. In the storing of the semiconductor devices in the first buffer tray, the semiconductor devices may be stored while changing the pitch of the picked-up semiconductor devices.

The second buffer tray may be divided into a first region and a second region for accommodating the defective or retested semiconductor devices. In this case, the transferring method further includes the step of picking up the good semiconductor elements of the accommodated semiconductor elements and transferring the picked up good semiconductor elements to the second area of the second buffer tray. can do.

The transferring method may further include picking up a good semiconductor device of at least one of the accommodated semiconductor devices and removing the picked up semiconductor device from the defective or retested semiconductor devices of the first buffer tray. The method may further include transferring to the empty space and accommodating the buffer buffer.

Meanwhile, in the transferring and accommodating the defective or retested semiconductor devices to the second buffer tray, the defective semiconductor devices and the retested semiconductor devices may be separately stored in the first buffer tray.

According to the semiconductor device unloading apparatus and method, semiconductor devices that are tested or defective as a result of testing among semiconductor devices to be tested are sorted through a separate second transfer part, and then another third transfer part selects the semiconductor elements. By accommodating the customer trays as it is, it is possible to prevent the semiconductor elements subjected to the test from being unnecessarily accumulated.

Accordingly, the overall process time for unloading the semiconductor devices subjected to the test can be shortened, thereby improving the efficiency of the process.

1 is a configuration diagram schematically showing a test handler according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating an unloading apparatus for unloading semiconductor devices that have been tested by the test handler illustrated in FIG. 1.
3A through 3E are diagrams for describing a process of unloading semiconductor devices through the unloading apparatus illustrated in FIG. 2.

Hereinafter, a semiconductor device unloading apparatus and method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a configuration diagram schematically showing a test handler according to an embodiment of the present invention.

Referring to FIG. 1, a test handler 1000 according to an embodiment of the present invention includes a loading device 100, a chamber module 200, and an unloading device 300.

The loading device 100 transfers and loads the semiconductor devices SD, which are waiting for a test, in a state of being accommodated in the plurality of first customer trays CT1 to a position where the test device 10 is docked. The loading device 100 includes a loading stacker 110, a loader 120, and a loading transfer unit 130.

The first customer trays CT1 are disposed in the loading stacker 110. In the first customer trays CT1, the semiconductor devices SD waiting to be tested are received at first intervals.

The test tray TT is disposed in a horizontal state in the loader 120. The semiconductor elements SD transferred from the first customer trays CT1 are transferred to the test tray TT and stored at a second interval.

In this case, the test tray TT may be configured to accommodate, for example, 32 rows in the x-axis direction and 16 columns in the y-axis direction, that is, 512 semiconductor devices SD. In contrast, two test trays TT having 16 rows and 16 columns may be arranged side by side in the x-axis direction in the loader 120.

The loading transfer unit 130 transfers the semiconductor elements SD between the loading stacker 110 and the loader unit 120 to the loader unit 120 while changing the semiconductor elements SD from the first interval to the second interval. To be stored in the test tray TT.

The chamber module 200 is disposed adjacent to the loader unit 120. The chamber module 200 includes an inner chamber 210, a test chamber 220, and a desorption chamber 230.

The inner chamber 210 is connected to the loader 120. The test tray TT may be transferred from the loader chamber 120 to the vertical chamber from the horizontal state to the vertical state. In this case, two test trays TT may be transferred to the inner chamber 210 to be disposed up and down. The inner chamber 210 is connected to a cooling device (not shown) or a heating device (not shown) to provide a space for cooling or heating before testing the semiconductor device (SD).

The test chamber 220 is connected to the inner chamber 210. The test tray TT is transferred from the inner chamber 210 to the test chamber 220 in a vertical state. In the test chamber 220, a test device 10 for substantially testing the semiconductor devices SD is docked to test the semiconductor devices SD. In this case, a match plate 222 may be disposed in the test chamber 220 to accurately push the semiconductor devices SD to the test device 10.

The desorption chamber 230 is connected to the test chamber 220. The test tray TT in which the semiconductor devices SD, which have been subjected to the test process, are stored is transferred to the desorption chamber 230 as it is. In the di-chamber chamber 230, the semiconductor devices SD cooled or heated in the sub-chamber 210 are restored to room temperature.

The unloading device 300 is connected to the desorption chamber 230. Hereinafter, the unloading device 300 will be described in more detail with reference to FIG. 2.

FIG. 2 is a diagram illustrating an unloading apparatus for unloading semiconductor devices that have been tested by the test handler illustrated in FIG. 1.

2, the unloading apparatus 300 may include an unloader 310, a first buffer 320, a first unloading transfer 330, a second buffer 340, and a second unloading apparatus. A loading transfer unit 350, an unloading stacker 360, and a third unloading transfer unit 370 are included.

The unloader unit 310 is connected to the desorption chamber 230. The test tray TT, in which the semiconductor devices SD at a room temperature, are stored, is transferred from the desorption chamber 230 to the unloader 310. In this case, the test tray TT may be switched to a horizontal state again.

Thus, for example, one test tray TT containing 16 rows, 32 columns, that is, 512 semiconductor devices SD may be arranged in the unloader 310 in a horizontal state. In contrast, the test loaders TT in which 16 semiconductor elements SD are accommodated may be arranged side by side along the x axis in the unloader 310.

The first buffer unit 320 is disposed adjacent to the unloader unit 310. In detail, the first buffer unit 320 is disposed adjacent to the unloader unit 310 along the x-axis to serve as an intermediate buffer in the unloading process. At least one first buffer tray 322 in which the semiconductor devices SD may be accommodated is disposed in the first buffer unit 320.

The first unloading transfer part 330 may include the semiconductor elements SD stored in the test tray TT between the unloader 310 and the first buffer part 320. Transfer it to) and store it.

In this case, the first unloading transfer part 330 and the first buffer tray 322 are in a state in which the pitches of the semiconductor devices SD arranged in the test tray TT at a second interval are changed at the first interval. It may be configured to be received.

The first unloading transfer part 330 includes a first pickup part 332 and a first driving part 334. The first pickup unit 332 may be configured to be capable of picking up the semiconductor devices SD stored along the y axis of the test tray TT at one time. For example, since 16 rows are disposed in the test tray TT, the first pickup unit 332 may include 16 rows. Thus, the first pickup unit 332 may be composed of 16 rows, 4 columns in terms of installation space and ease of manufacture. In addition, the first pickup unit 322 may be configured to change the pitch of the semiconductor elements SD from the second interval to the first interval due to the configuration of the first buffer tray 322.

The first driving unit 334 is connected to the first pickup unit 332. The first driving unit 334 moves the first pickup unit 332 in the x-axis direction so that the semiconductor devices SD stored in the test tray TT through the first pickup unit 332 may be formed. 1 is accommodated in the buffer tray 322.

As such, the first pick-up unit 332 picks up the semiconductor devices SD stored in the test tray TT at one time along the y-axis, so that the first driving unit 334 is in the x-axis direction except for the y-axis direction. By only designing, it is possible to expect the effect of reducing the installation space and the manufacturing cost of the first drive unit 334.

On the other hand, the first buffer unit 320 can receive the semiconductor elements (SD) picked up from the first pick-up unit 332 at one time and two first to eight rows in order to easily implement the role as the buffer The buffer trays 322 may be arranged side by side in the y-axis direction. In this case, each of the first buffer trays 322 may be configured in eight columns to efficiently perform a role as a buffer.

In addition, the first buffer tray 320 has a plurality of first buffer trays 322 along the x-axis so as to receive the transfer of the semiconductor devices SD continuously from the first unloading transfer part 330. Multiple can be arranged in parallel form. That is, the plurality of first buffer trays 322 may be arranged in a divided structure along the x-axis and the y-axis in the first buffer unit 320.

The unloading device 300 may further include a first buffer transfer part 380 for moving the first buffer tray 322. The first buffer transfer unit 380 may transfer the first buffer tray 322 in the y-axis direction so that the first buffer tray 322 is out of a section in which the first pickup unit 332 moves. . In this case, since the first buffer transfer unit 380 only needs to be out of a section in which the first buffer tray 322 moves, the first buffer tray 322 may have an x-axis. There is no need to be configured to feed in the direction.

The second buffer unit 340 is disposed adjacent to the first buffer unit 320. In detail, the second buffer unit 340 is disposed adjacent to the first buffer tray 322 deviating from the section in which the first pickup unit 332 moves by the first buffer transfer unit 380. Like the first buffer unit 320, the second buffer unit 340 serves as another intermediate buffer in an unloading process. A second buffer tray 342 capable of accommodating the semiconductor devices SD is disposed in the second buffer unit 340.

In this case, the unloading device 300 may further include a second buffer transfer unit 390 for moving the second buffer tray 342. The second buffer transfer unit 390 may transfer the second buffer tray 342 in a y-axis direction at a position different from that of the first buffer transfer unit 380.

The second unloading transfer part 350 transfers the semiconductor devices SD stored in the first buffer tray 322 between the first and second buffer parts 340 to the second buffer tray 342. Transfer it and store it.

In detail, the second unloading transfer part 350 is a defective or retested semiconductor device SD as a result of a test by the test apparatus 10 among the semiconductor devices SD stored in the first buffer tray 322. ) May be selectively transported and stored in the second buffer tray 342.

In addition, the second unloading transfer unit 350 may fill the space of the first buffer tray 322, which is empty as the defective or retest target semiconductor elements SD are filled, with other good semiconductor elements SD. .

In addition, the second unloading transfer part 350 is generally less than about 5% of the number of semiconductor devices SD which are defective or re-inspected, and thus, the second unloading transfer part 350 is less than about 2%. The good semiconductor devices SD may be transported and stored in an area that is separated from an area in which the defective or retested semiconductor devices SD are accommodated in the buffer tray 342.

In addition, the second unloading transfer part 350 may change the semiconductor device SD stored in the first buffer tray 322 at the first interval so as to be accommodated in the second buffer tray 342 without changing the pitch. Can be configured.

The second unloading transfer part 350 may include a second pickup part 352 and a second driving part 354. The second pickup unit 352 picks up the semiconductor devices SD stored in the first buffer tray 322. In this case, the second pickup unit 352 may be configured to be able to pick up the semiconductor devices SD accommodated along the x-axis of the first buffer tray 322 at one time. For example, when the first buffer tray 322 is configured in eight rows and eight columns, the second pickup unit 352 may include eight columns. Thus, the second pickup unit 352 may be configured in two rows, eight columns in terms of process efficiency.

The second driver 354 is connected to the second pickup unit 352. The second driving unit 354 moves the second pickup unit 352 in the x-axis direction so that the semiconductor devices SD stored in the first buffer tray 322 through the second pickup unit 352 may be formed. The second buffer tray 342 is accommodated in the second buffer tray 342.

In this case, the second driver 354 is transported by each of the first and second buffer transfer units 380 and 390 to enable the operation of the second pickup unit 352 as described above. Each of the buffer trays 322 and 342 may be configured to intersect at different points.

Accordingly, the second buffer tray 342 is configured to accommodate the semiconductor devices SD picked up by the second pickup unit 352 at one time. Specifically, when the second pickup unit 352 is composed of two rows and eight columns, the second buffer tray 342 is configured to include the two rows and eight columns, for example, four rows and sixteen columns. Can be.

The unloading stacker 360 is disposed adjacent to the first and second buffer trays 322 and 342 at a position deviating from a section in which the first pick-up unit 332 transfers. The unloading stacker 360 includes a plurality of second customer trays CT2 in which the semiconductor devices SD which have been tested are stored. Here, the space in which the semiconductor elements SD of the second customer trays CT2 are accommodated is arranged at the first interval like the first customer tray CT1.

The third unloading transfer part 370 may be a defective or retested semiconductor device SD stored in the first buffer tray 322 and the second buffer tray 342. Are transferred to the second customer trays CT2 as they are in a separated state. In addition, the third unloading transfer unit 370 transfers the second unloaded transfer unit 370 to the second customer trays CT2 in a state in which the third unloading transfer unit 370 is divided into good quality semiconductor elements SD stored in a portion of the second buffer tray 342. Can be stored.

The third unloading transfer part 370 may include a third pick-up part 372 and a third pick-up part 372 for picking up the semiconductor elements SD stored in the first and second buffer trays 322 and 342. ) Is a third driver 374 for moving the first buffer tray 322 or the second buffer tray 342 from the first buffer tray 342 to the second customer tray CT2.

The third pick-up unit 372 transfers the semiconductor devices SD stored in the first and second buffer trays 322 and 342 at first intervals to the second customer trays CT2 without changing the pitch. I receive it. In addition, when each of the first and second buffer trays 322 and 342 includes eight rows, eight columns, and four rows and sixteen columns, the third pickup unit 372 may include the first and second buffer trays ( In order to efficiently pick up the semiconductor devices SD accommodated in the 322 and 342, it may be configured in four rows and eight columns.

As such, the semiconductor devices SD that are defective or retested as a result of the test among the semiconductor devices SD performing the test are sorted through a separate second unloading transfer part 350 and then another third unloading transfer part. Since the semiconductor device SD is accommodated in the second customer trays CT2 in a state where the semiconductor device SD is selected, the semiconductor devices SD on which the test is performed are unnecessarily accumulated in the unloader unit 310. Can be prevented.

Accordingly, the overall process time for unloading the semiconductor devices SD subjected to the test can be shortened, thereby improving the efficiency of the process. For example, if one transfer mechanism takes about 55 seconds when the same transfer mechanism is used for sorting and transferring the above, the cycle time is about 40 seconds according to the configuration of the present invention described above. It can be shortened.

Hereinafter, a process of substantially unloading the semiconductor devices SD through the unloading device 300 will be described in more detail with reference to FIGS. 3A to 3E.

3A through 3E are diagrams for describing a process of unloading semiconductor devices through the unloading apparatus illustrated in FIG. 2.

Referring to FIG. 3A, first, a test tray TT in which the tested semiconductor devices SD are accommodated is unloaded from the test position to the unloader 310. In this case, the semiconductor devices GSD and BSD that have been tested have a good quality, a retest target, and a defective ratio of about 95: 3: 2.

Subsequently, the semiconductor devices GSD and BSD stored in the test tray TT are picked up through the first pick-up unit 332, and the pitches of the semiconductor devices are at least one of the first buffer trays 322 at a second interval. The change is transported and stored at the first interval.

Here, the first buffer tray 322 may be disposed adjacent to the unloader 310 along the x axis. In this case, the first pick-up unit 332 is configured to pick up the semiconductor devices GSD and BSD stored in the test tray TT at one time along the y-axis so that the first pick-up unit 332 may receive the x-axis through the first driver 334. The semiconductor devices GSD and BSD are accommodated in the first buffer tray 322 by only moving in the direction. For example, when the test tray TT is configured in 16 rows and 32 columns, the first pickup unit 332 may be configured in 16 rows and 4 columns. In this case, the first buffer tray 322 has two rows consisting of eight rows and eight columns so that the semiconductor elements GSD and BSD picked up from the first pickup unit 332 can be accommodated twice. It can be arranged side by side.

Referring to FIG. 3B, the first buffer tray 322 is then transferred in the y-axis direction through the first buffer transfer unit 380 so as to leave the section in which the first pickup unit 332 moves.

Subsequently, the second pickup unit 352 is transferred to the transferred first buffer tray 322 in the x-axis direction. Here, the second pickup unit 352 may be configured to accommodate the semiconductor devices GSD and BSD stored in the first buffer tray 322 at one time along the x-axis. For example, when the first buffer tray 322 has eight rows and eight columns, the second pickup unit 352 may have two rows and eight columns.

Referring to FIG. 3C, among the semiconductor devices GSD and BSD stored in the first buffer tray 322, defective or retested semiconductor devices BSD are picked up through the second pickup unit 352. Subsequently, the pitch of the picked-up second pick-up unit 352 is moved through the second driving unit 354 in the x-axis direction to vary the pitch of the semiconductor devices BSD that are the defective or retest targets in the second buffer tray 342. It is stored at the first interval without.

Referring to FIG. 3D, while the second pickup unit 352 is repeatedly moved, the defective or re-examined semiconductor devices BSD stored in the plurality of first buffer trays 322 may be transferred to the second buffer tray ( 342). In this case, the second buffer tray 342 may be divided into two first and second regions A1 and A2 to store the semiconductor devices BSD that are the defective or retest targets only in the first region A1. have. For example, the second buffer tray 342 may be configured as four rows and sixteen columns, and the first and second regions A1 and A2 may be divided into four rows and eight columns, respectively.

Subsequently, good semiconductor devices GSD are stored in the second area A2 of the second buffer tray 342 through the second pickup unit 352. At this time, the second pickup picks up the good semiconductor devices (GSD) from the other first buffer tray 322 into a space vacant by picking up the semiconductor devices (BSD) that are the defective or retest target of the first buffer tray 322. It may be transported and received through the unit 352. The reason for this is to maximize the utilization of the second buffer tray 342 since the number of the defective or retested semiconductor devices BSD is significantly smaller than that of the good semiconductor devices GSD.

Referring to FIG. 3E, the first buffer tray 322 in which only the good semiconductor devices GSD are stored and the semiconductor devices BSD that are the defective or retest targets are stored in the first area A1. In the second area A2, a second buffer tray 342 containing the good semiconductor devices GSD is received along the y-axis direction through each of the first and second buffer transfer parts 380 and 390. The feeder moves away from the loader 310. In other words, the first and second buffer trays 322 and 342 are transferred to be adjacent to the unloading stacker 360 in which the second customer trays CT2 are disposed.

Subsequently, the third and second buffer trays 322 and 342 are separately stored in the semiconductor device GSD and the semiconductor devices BSD that are defective or retested through the third pickup unit 372. After picking up as it is, the second customer tray CT2 is transferred to and stored in the third driving unit 374. In this case, the second customer trays CT2 may also be classified according to the good semiconductor device GSD and the bad or retested semiconductor device BSD.

The third pick-up unit 372 accommodates the pitches of the semiconductor devices SD in the second customer trays CT2 without changing the pitches at the first intervals. The second pickup unit 352 may be configured in four rows and eight columns to efficiently pick up the first buffer tray 322 having eight rows and eight columns and the second buffer tray 342 having four rows and sixteen columns.

As such, the semiconductor devices BSD that are defective or retested as a result of the testing among the semiconductor devices SD performing the test may be selected through a separate process, thereby shortening the overall unloading process time.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

SD: Semiconductor Device CT1: First Customer Tray
CT2: second customer tray TT: test tray
10: test device 100: loading device
110: loading stacker 120: loader
130: loading transfer unit 200: chamber module
210: inner chamber 220: test chamber
230: match plate 300: unloading device
310: unloader unit 320: first buffer unit
322: first buffer tray 330: first unloading transfer part
332: first pickup part 334: first drive part
340: second buffer unit 342: second buffer tray
350: second unloading transfer part 352: second pickup part
354: second driving unit 360: unloading stacker
370: third unloading transfer portion 372: third pickup portion
374: third driver 380: first buffer transfer part
390: second buffer transfer unit 1000: test handler

Claims (12)

An unloader unit in which a test tray containing a plurality of semiconductor elements on which a test is performed is unloaded from a test position;
A first buffer unit having at least one first buffer tray configured to accommodate the semiconductor elements at a position adjacent to the unloader unit;
A first transfer unit transferring the semiconductor elements accommodated in the test tray between the unloader unit and the first buffer unit to the first buffer tray;
A second buffer unit in which a second buffer tray which accommodates the semiconductor elements is disposed at a position adjacent to the first buffer unit;
A second transfer unit configured to transfer, among the semiconductor elements stored in the first buffer tray between the first and second buffer units, semiconductor devices, which are defective or retested, to the second buffer tray; And
And a third transfer unit configured to transfer the good semiconductor devices remaining in the first buffer tray and the defective or retested semiconductor devices transferred to the second buffer tray to the customer trays in a separated state.
The first buffer portion is disposed adjacent to the unloader portion along the x-axis,
The first transfer unit
A pickup unit configured to be able to pick up semiconductor elements received along the y-axis of the test tray at one time; And
And a driving unit for moving the pickup unit in the x-axis direction. delete The semiconductor device unloading apparatus of claim 1, wherein the pickup unit moves while changing a pitch of the semiconductor devices. The display apparatus of claim 1, further comprising first and second buffer transfer parts configured to transfer each of the first and second buffer trays in a y-axis direction.
The second transfer unit
A second pickup unit which picks up the semiconductor elements accommodated in the first buffer tray; And
And a second driving unit which moves the second pick-up unit in the x-axis direction so as to intersect with each of the first and second buffer trays transported by each of the first and second buffer transfer units at a different point. A semiconductor element unloading device. The semiconductor device unloading apparatus of claim 4, wherein the second pickup unit is configured to be able to pick up semiconductor elements received along an x-axis of the first buffer tray at one time. The semiconductor device unloading apparatus of claim 1, wherein the first buffer unit comprises a plurality of first buffer trays divided along an x-axis or a y-axis. Unloading, from a test position, a test tray containing a plurality of semiconductor elements on which the test was performed;
Transferring the semiconductor elements stored in the unloaded test tray to at least one first buffer tray disposed at an adjacent position;
Transferring the semiconductor devices, which are defective or retested, from the semiconductor devices stored in the first buffer tray to a second buffer tray disposed in an adjacent position; And
And transferring the good semiconductor devices remaining in the first buffer tray and the semiconductor devices, which are defective or retested objects transferred to the second buffer tray, to the customer trays as they are separated,
Transferring to the first buffer tray and accommodating
Picking up the semiconductor devices accommodated along the y-axis of the unloaded test tray at once; And
And transferring the picked-up semiconductor elements along the x-axis and storing them in the first buffer tray. delete The semiconductor device unloading method of claim 7, wherein the storing of the semiconductor devices in the first buffer tray comprises storing the semiconductor devices while changing the pitch of the picked-up semiconductor devices. 8. The display device of claim 7, wherein the second buffer tray is divided into a first area accommodating the defective or retested semiconductor elements and a second area different from the first area,
Picking up good semiconductor elements among the received semiconductor elements; And
And transferring the picked-up good semiconductor devices to a second area of the second buffer tray and accommodating the semiconductor devices. The method of claim 7, wherein
Picking up a semiconductor device, which is a good product of at least one of the semiconductor devices; And
And transferring the picked-up good semiconductor device into a vacant space as the defective or retested semiconductor devices of the first buffer tray are transferred to the second buffer tray. Unloading way. 8. The method of claim 7, wherein the transferring of the semiconductor devices, which are the defective or retested objects, to the second buffer tray and storing the defective semiconductor devices and the semiconductor devices that are the retested objects, are separately stored in the first buffer tray. A semiconductor device unloading method, characterized in that.

Images