JP3494642B2 - IC test equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] The present invention relates to a semiconductor integrated circuit device.
IC test equipment for testing ICs (hereinafter referred to as ICs)
You. More specifically, it transports the IC and electrically connects it to the test head.
And let the test equipment perform the test.
Remove the IC from the test head and make a good decision based on the test results.
A so-called handler that sorts out defective and defective products
Invention in the technical field. [0002] 2. Description of the Related Art A conventional IC test equipment will be described with reference to FIGS.
A schematic configuration of the device will be described. FIG. 4 shows a schematic plan view.
You. In the figure, reference numeral 100 denotes a chamber section including a test head;
0 stores the IC under test to be tested from now on.
An IC storage unit for classifying and storing tested ICs,
A loader unit for sending the test IC into the chamber unit 100;
0 is an IC that has been tested in the chamber 100
Unloader unit that classifies and extracts the data, TST is the loader unit 30
At 0, the IC under test is loaded and sent to the chamber 100.
The IC is tested in the chamber unit 100 and the tested I
Test for transporting IC that carries C to unloader section 400
Show the tray. [0003] The chamber section 100 is mounted on a test tray TST.
The target high or low temperature for the loaded IC under test.
Thermostat 101 which gives a degree stress and this thermostat 101
Test the IC that has been subjected to thermal stress
Test chamber 102 to be brought into contact with
Thermal stress given from IC tested at bus 102
And a heat removal tank 103 that removes heat. Toes
When a high temperature is applied in the constant temperature bath 101,
Then, the temperature is returned to the room temperature and carried out to the unloader section 400. Ma
A low temperature of, for example, about −30 ° C. was applied in the constant temperature bath 101.
In such a case, heat with hot air or a heater, etc.
The temperature is returned to the normal temperature and is carried out to the unloader unit 400. [0004] The constant temperature bath 101 and the heat removal bath 103 are
It is arranged so as to protrude above the chamber 102. Constant temperature bath
As shown in FIG.
105, and the test tray is transported to the substrate 105.
The feeding means 108 is mounted, and the test tray conveying means 1
08 indicates that the test tray TST is on the heat removal tank 103 side.
To the constant temperature bath 101. Test tray TS
T loads the IC under test in the loader unit 300, and
It is carried to 1. The constant temperature bath 101 is equipped with a vertical transport means.
A plurality of test pieces are
The test chamber 102 is empty with the tray TST supported.
Wait till During this standby, the IC under test
A temperature stress of temperature is applied. In the test chamber 102
Has a test head 104 at the center of the
Test tray TST is carried on the pad 104 and tested.
The test is performed by bringing the IC into electrical contact with the test head 104.
Now. The test tray TST after the test is completed
3, the temperature of the IC is returned to room temperature, and the unloader section 4
Discharge to 00. [0005] The IC storage unit 200 stores the IC under test.
The IC stocker 201 to be tested is separated according to the test result.
The tested IC stocker 202 that stores the classified ICs
Provided. The IC under test
Are stacked and held.
This general-purpose tray KST is carried to the loader unit 300,
From the general-purpose tray KST carried to the loader unit 300
Place the IC under test in the test tray TST stopped at 00
Transship. General purpose tray KST to test tray TST
As shown in FIG. 5, the IC transport means for transporting ICs to
In addition, two rails 301 installed on the upper part of the substrate 105
And the test tray TS by these two rails 301
Reciprocating between T and general-purpose tray KST (this direction is Y direction)
And a movable arm 302 capable of
Supported by the moving arm 302,
Movable head 303 that can move in the X direction along
XY transport means 304 can be used.
You. A suction head is attached to the movable head 303 downward.
This suction head moves while sucking air,
Adsorb IC from tray KST and test IC
-Transport to TST. The suction head is attached to the movable head 303
For example, about eight ICs are mounted, and eight ICs are
It is transported to the storage tray TST. [0006] The installation position and test of the general-purpose tray KST
Position of IC called Precisor between tray TST
Correction means 305 (FIG. 5) is provided. This position correction hand
Step 305 has a relatively deep recess, into which suction head
The IC adsorbed on the chip is dropped. The periphery of the recess is an inclined surface
The falling position of the IC is defined by this slope.
You. Therefore, the mutual positions of the eight ICs are defined, and the positions are
The specified IC is sucked again to the suction head and the test tray
-Deliver to TST. In other words, I
The recess holding C is formed relatively larger than the IC shape.
Have been. Therefore, it is stored in the general-purpose tray KST.
IC positions vary greatly. This state
To the test tray TST.
When it comes off, the IC storage recess formed in the test tray TST
It will not be possible to drop directly into the department. For this reason
Is provided with a position correcting means 305.
Array of IC storage recesses formed in test tray TST
The arrangement precision of the IC is adjusted to the precision. FIG. 6 shows the structure of the test tray TST.
The test tray TST has a plurality of
3 are formed in parallel and at equal intervals.
On the side 12a of the frame 12 facing the side 13
Each of the plurality of mounting pieces 14 is formed to project at equal intervals,
Between these 13 or between 3 and side 12a
And the two mounting pieces 14 make the carrier storage portion 15
It is arranged in an array. In each carrier storage section 15
One IC carrier 16 is housed, and two mounting pieces 1
Attach to Floating state 4 by fastener 17
It is. IC carrier 16 in one test tray TST
About 16 × 4 can be attached. The external shape of the IC carrier 16 is the same shape and the same
The IC carrier 16 contains IC elements.
It is. The IC accommodating portion 19 is provided according to the shape of the IC to be accommodated.
I can decide. In this example, the IC accommodating portion 19 is a rectangular recess.
Have been. Attach to both ends of IC carrier 16
Hole 21 for mounting on the piece 14 and hole for inserting the pin for positioning
22 are formed. [0009] The displacement or jump of the IC in the IC carrier 16
For example, as shown in FIG.
It is mounted on an IC carrier 16. Latch 23 is I
Latch 23 integrally projects upward from the bottom surface of C storage portion 19
Utilizing the elasticity of the resin material constituting the IC carrier 16
Then, when accommodating the IC element in the IC accommodating portion 19,
An IC that adsorbs an IC element when it is taken out from the C storage unit 19.
Latch release that moves simultaneously with suction pad 24 as a whole
After increasing the distance between the two latches 23 by the release mechanism 25, the IC
To be stored or removed. Latch latch release mechanism 25
23, it returns to its original state by its elastic force,
The latched IC is held in a state where it is
You. The IC carrier 16 is an IC carrier as shown in FIG.
Pin 18 is exposed and held on the lower surface side. Test head
At 104, the pins 18 of the exposed IC are connected to an IC socket.
Of the IC to the test head.
Gently contact. For this purpose, the test head 104
The part is provided with a pressure contact 20 for holding down the IC,
This press contactor is used for the IC stored in each IC carrier 16.
Is pressed down from above and brought into contact with the test head 104.
You. The number of ICs connected to the test head at one time
Are, for example, ICs arranged in 4 rows and 16 columns as shown in FIG.
The test is performed once every four rows (shaded area).
In other words, the first time is 16 pieces arranged in 1,5,9,13 rows
Test IC, the second time, one row of test tray TST
Move and test ICs arranged in 2, 6, 10, 14 rows
And repeat this four times to test all ICs. test
Is the identification number attached to the test tray TST
And the IC number assigned inside the test tray TST
The test result is stored at the complete address. The unloader section 400 includes a loader section 300
Transport means having the same structure as the provided XY transport means 304
404 is provided, and the XY transport means 404
Test tray TST carried out to unloader section 400
The tested IC is transferred to the general-purpose tray KST. Figure
In the example shown in FIG. 4 and FIG.
Stockers STK-1, STK-2, ..., STK-8
And sort them into up to eight categories according to the test results.
This shows a case in which storage is possible. In other words,
In addition to the defective product, the operation speed is also high among the good products
Retest even if it is medium-speed, low-speed, or defective
Are sorted into necessary items. Sortable categories
Even if the maximum number of the
Only one universal tray can be placed. others
Conventionally, a general-purpose tray placed in the unloader section 400
Classified into categories other than those assigned to KST
From the unloader unit 400
Return one general-purpose tray KST to IC storage unit 200, and
Instead, store the newly generated category IC.
Transfer the general-purpose tray KST to the unloader section 400,
Is stored. Test IC Stocker 201 and Tested IC
The stocker 202 supports a frame-shaped tray as shown in FIG.
Frame 203 and the lower part of the tray support frame 203
And an elevator 204 capable of ascending and descending upward.
It is prepared for. The tray support frame 203 has a general-purpose tray
A plurality of KSTs are stacked and supported, and
General purpose tray KST moves up and down by elevator 204
Is done. Test IC Stocker 201 and Tested IC
The upper part of the stocker 202 is covered with the substrate 105.
Test IC stocker 201 and tested IC stocker 202
The tray that moves over the entire range in the arrangement direction of FIG. 5
Transport means 205 is provided. To tray transport means 205
Is equipped with a gripper for gripping the general purpose tray downward. Test
Tray transfer means 205 on the top of the test IC stocker 201
The elevator 204 is driven in this state,
Raise the stacked general-purpose tray KST. Coming up
Hold the top tray of the general-purpose tray KST with a gripper
You. The IC under test is stored in the tray transport means 205.
When the general-purpose tray KST is delivered, the elevator 204
Descend and return to the original position. At the same time, tray transport means 2
05 moves horizontally and is carried to the position of the loader unit 300
It is. At this position, the tray conveying means 205
Remove the tray for the tray
Deposit the general-purpose tray KST once. For tray tray
The tray transport means 205 that has deposited the general-purpose tray KST
It moves to a position other than the die section 300. In this state,
-Elevator 2 from the bottom where the KST is mounted
04 rises, general purpose tray K with IC under test mounted
The ST is raised upward to a window 106 formed in the substrate 105.
It is supported so that the general-purpose tray KST faces. In other words, the window
A grip holding general-purpose tray KST around the lower surface of 106
Means (not particularly shown) are provided.
The general-purpose tray KST storing the test IC is gripped. The window 106 of the unloader section 400 has an empty pan.
Tray is held and this empty general-purpose tray KST is
Sort tested ICs according to categories assigned to general-purpose trays
Classify and store. The general purpose tray held at the window 106
-When the tray is full, the general-purpose tray KST
The window 204 is pulled down from the position of the window 106 by the
Of the category assigned to itself by the transport means 205
Stored in the tray storage position. In addition, 206 shown in FIG.
Indicates an empty trace stocker. This empty trace stocker 206
Empty tray is placed at the position of each window 106 of the unloader section 400
And placed in a storage for the tested IC. [0016] As described above, the conventional IC
The test equipment is a loader between the constant temperature bath 101 and the heat removal bath 103.
300 and the unloader section 400 are arranged, so that the width W
(FIG. 5) is disadvantageously large. That is,
This type of handler is a single IC tester as shown in FIG.
Connect two handlers HM1 and HM2 to the
It is operated continuously. Width W of handlers HM1 and HM2₁
Is large, the width W of the IC tester body TES_TwoWithin the range of
The two handlers HM1 and HM2 cannot be placed.
The width W of the IC tester body TES_TwoProtrude larger
Will be. As a result, many IC test systems have been set up.
When installing, the useless space increases and the number of
Limited inconveniences arise. An object of the present invention is to provide an IC test
Reduce the width of the equipment (handler) and install it in a narrow space
The purpose of the present invention is to provide an IC test apparatus that can perform the test. [0018] According to claim 1 of the present invention,
A test tray with an IC mounted on a test tray
Through the thermostat, test chamber and heat removal tank in this order.
In an IC tester for testing C,
2 sets in front of the test chamber and heat removal tank
And a structure in which the unloader section is arranged. [0019]ConstantPlace the loader in front of the hot water tank and test
Place the heat removal tank in front of the chamber, and
Structure with loader sectionCan also be considered. Proposed in claim 1
According to the IC test equipment, the temperature chamber and the test chamber
And the heat removal tank are arranged, and the width is regulated by this arrangement.
Is determined. As a result, constant temperature bath, test chamber, heat removal bath
It is assumed that the test trays are held one by one.
The width can be limited to about three trays. Follow
In comparison with the conventional device where the unloader section is
It can be narrowed by the size of one sheet tray. [0020]sideOnly the temperature chamber and test chamber
And place the heat removal tank in front of the test chamber.
And the loader section in front of the thermostat.
Placeif, The width is about 2 test trays
Become. Therefore, the advantage that the width can be further reduced is obtained.Te
Select the insertion and discharge ports of the storage tray on surfaces that are orthogonal to each other.
The test tray inserted from the front side
And test in a test chamber placed next to the side
Send the tray and insert it from the test chamber in the heat removal tank.
Drain the inserted test tray in a direction perpendicular to the insertion direction.
Configuration, and with these configurations,
Place the unloader section in front of the heat removal tank.
WhenIs preferred. [0021]TeBefore the storage chamber and heat removal tank
XY transfer to the two unloader units
Arrange over the feeding means and take out to two unloader parts
XY transfer from both test trays
ICs are distributed to general-purpose trays by means according to the test results.
Configuration to take out and transfer asPreferably. [0022]2Take out tested IC from two unloaders
Close to each unloader section when transferring
Classification operation only for general-purpose trays installed in
Configured to doPreferably.X-Y transport means
Is shared by the two unloader sectionsIfSimplifies the configuration
Can expect a downdown. eachClose to the unloader
Since the sorting operation was performed only on the placed general-purpose tray,
Classification speed can be increased. As a result, the processing speed
It is possible to provide an IC test apparatus that can operate at high speed.
it can. [0023]ALoader test tray and general-purpose tray
And a buffer for temporarily storing ICs classified between
SuccessPreferably.ABuffer section in the loader section
By installing, the amount of IC taken out of the test tray
There is a general-purpose tray assigned to the category
Even if there is no IC, buffer the IC taken out of the test tray.
You can leave it in the temporary department. Therefore, the classification operation
The universal tray can be replaced without interruption
You. In this regard, we can expect an increase in processing speed.
You. [0024] DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a first embodiment of the present invention.
1 shows an embodiment of an IC test apparatus that performs the test. Parts corresponding to FIG.
Minutes are given the same reference numerals. In FIG.
The chamber section, 200 is an IC storage section, 300 is a loader section, 4
00 indicates an unloader section. In the present invention, the chamber section 1
The loader unit 300 and the unloader unit 400
Are arranged. In other words, a thermostat
The loader unit 300 is placed before the
An unloader unit 400 is provided before the bath 102 and the heat removal tank 103.
Deploy. Therefore, the test chamber 102
One test tray TST in the transport direction of TST
Plus room to move four rows of ICs described in FIG.
Would be good. In the embodiment shown in FIG.
The test tray TST loaded with test ICs is
1 into the thermostat 101 from the insertion port provided on the front side
Is done. Test tray TST inserted in thermostat 101
Is transported downward by the transport means, and
It is sent to the test chamber 102 connected to the bottom side.
You. The test chamber 102 has an insertion port for the thermostat 101
The plane is connected to a plane orthogonal to the plane formed. Therefore,
The insertion direction and the discharge direction of the storage tray TST are bent at a right angle.
Will be. In the test chamber 102, the thermostat 101
It is held at the same temperature and mounted on the test tray TST
Test the IC that is present. Test tray TS after the test
T is removed by the vertical transfer means while removing heat in the heat removal tank 103.
It is transported upward and inserted from the test chamber 102.
Is discharged in a direction orthogonal to the direction of the unloader unit 400.
Stop at the first position A. The unloader section 400 includes a tester in the present invention.
Totley TST can be stopped in two positions A and B
The first position A and the second position B
A common XY transporting means 404 is disposed over the
The first position A and the second position A
Tested from test tray TST stopped at position B
ICs are classified according to the test results, and the general-purpose tray KST₁~
KST_FourTo be stored. As a method of classificationPreferably, Test tray
-Sorting operation only for general-purpose trays near the TST stop position
Let them do it. In other words, the first position A
KST₁And KST_TwoIs arranged. These general purpose
Leh KST₁And KST_TwoAre assigned categories 1 and 2
The test tray TST is in the first position
ICs belonging to these categories 1 and 2
Pick up only each and general purpose tray KST₁And KS
T_TwoTransport to Test tray with 1st position stopped
ICs belonging to categories 1 and 2 disappear from TST
And the test tray TST is moved to the second position B.
You. The second position B is opposed to the general position.
Tray KST_ThreeAnd KST_FourAre arranged and prepared. This
These general purpose trays KST_ThreeAnd KST_FourCategory 3
4 is assigned, the test tray TS
Picking up ICs belonging to categories 3 and 4 from T
General-purpose tray KST_ThreeAnd KST_FourTo be stored. 2nd position
During the sorting in the process B, the next heat is removed from the heat removal tank 103.
Discharge the test tray TST and stop at the first position A
Stop and wait. As described above, the XY transport means 404 is shared.
Even if the above configuration is adopted, the test tray TST is stopped.
General-purpose tray KST placed close to positions A and B₁, K
ST_TwoAnd KST_Three, KST_FourSorting work only for
The distance required for sorting can be reduced.
Wear. At this point, the XY transport means 404
Even when performing minute work, the sorting processing time can be shortened.
A clear effect is obtained. Incidentally, it can be arranged in the unloader section 400.
The number of general-purpose trays is four in this example due to space limitations.
It will be a limit. Therefore, categories that can be sorted in real time
Lee is restricted to four categories, 1-4. In general,
High-speed response element, medium-speed response element, low-speed response element
Categorized into three categories, and the category of defective products is added to the four categories.
Are sufficient, but sometimes they fall into these categories.
ICs that do not occur may occur. Categories like this
If an IC occurs, the category is assigned
A general-purpose tray is called from the IC storage unit 200,
It will be stored in the tray. Replacement of the general-purpose tray during the sorting operation
And the sorting work must be interrupted in the meantime
Gone. For this reason, TeStop position of the storage TST and
General-purpose tray KST₁~ KST_FourBuff between the installation positions
A buffer section 405 is installed, and the buffer section 405 is occasionally provided.
Temporary deposit of IC belonging to category that does not occur
Configuration to allowPreferably. For example, 20 to 30 buffer units 405
It has enough capacity to store ICs and buffers
The IC to which the IC stored in each IC storage location of the
A storage unit for storing the category is provided, and the buffer unit 405
Stores the category and position of temporarily stored ICs for each IC
Between the sorting operations, or when the buffer unit 405 becomes full.
At this time, the IC stored in the buffer unit 405 belongs to the
A general-purpose tray of the category to be called from the IC storage unit 200.
And store it in its general purpose tray. Buffer unit 405
When multiple categories of ICs are temporarily deposited
There is also. Therefore, when calling the general-purpose tray, several types at a time
Call the general-purpose tray to the unloader section 400.
You. FIG. 2IsThe loader unit 30 is located in front of the hot tank 101.
0, and the test chamber is
Connect the tub 102 and remove heat before the test chamber 102
A tank 103 is arranged, and an unloader section is provided above the heat removal tank 103.
400 is arranged. In FIG. 2,
XY transporter of the loader unit 300 and the unloader unit 400
The step arm and the like are omitted. According to the structure shown in FIG.
It can be reduced to about two trays TST. still,
In this embodiment, the test chamber 102
After the test, the test tray TST is raised one step from the loading position.
The heat is carried out to the heat removal tank 103. like this
The test position by making the carry-in position and the carry-out position different.
The loading and unloading of the tray TST can be performed simultaneously.
Wear. As a result, the test tray TST can be replaced in a short time.
Can be completed. A state is shown in FIGS. FIG.
A: Test tray TST carried into test chamber 102
Immediately after the test was completed or the test was completed. Test tray
-When the TST is loaded into the test chamber 102, the test
And stops. Its stop position
3A, the cylinder 115 contracts the rod.
The pressing means 116 is placed on the test tray TST and the test tray
-TST is pressed against the test head 104. This crimping
The IC mounted on the test tray TST by
Contact the IC socket provided on the
The test is performed by being electrically connected to the device. At the end of the test, the cylinder 115
The pressing means 116 is pulled up and returned to the state shown in FIG. 3A.
You. Next, the cylinder 117 projects the hook 118 downward.
And its tip is engaged with the test tray TST (FIG. 3).
B). Hook 118 engages test tray TST
And the cylinder 115 extends the rod and the test tray T
The ST and the pressing means 116 are pulled up (FIG. 3C). The test tray TST is lifted upward.
Then, the next test tray TST is carried to the position shown in FIG. 3A.
Is done. The tip of the hook 118 also serves as a rail.
Therefore, the raised test tray TST is hook 1
It is carried out in the vertical direction of the paper on the rails of No. 18 and heat is removed.
It is delivered to the tank 103. [0039] As explained above, according to the present invention,
According to the IC test apparatus proposed in 1, the width W is set to the constant temperature bath 10
1, the test chamber 102, and the width of the heat removal tank 103
It can be defined as a combined dimension. As a result,
Make the dimension about three times the longitudinal dimension of the storage tray TST.
Can be Conventionally, it is 5 sheets of test tray TST
It is possible to reduce the size by two sheets as compared with the case where there was.
Further, as described in the related art, the unloader unit 400
Test Tray TS
One T can be reduced. [0040]sideThermostat 101 and test chamber 1 in the direction
02 and a loader unit 300 and an unloader unit 400 are provided.
Begiven that, The overall width W is about the same as the test tray TST
It can be reduced to two sheets. As a result, the width I
A C test apparatus can be provided.2Stop positions A
X and Y transporters common to the unloader unit 400 having
A configuration provided with a step 404;if, The number of XY conveyance means
Can be reduced. Therefore, cost reduction is expected
Wear. AThe first position A and the second position
Tested I from test tray TST stopped at location B
When sorting C, a general purpose tray close to the stop position
A configuration to sort only to KSTif, Shorten sorting work
This has the advantage of saving time. [0041]ABuffer unit 405 to the loader unit 400
EstablishmentIf, General purpose tray KST₁~ KST_FourAssigned to
When an IC belonging to a category other than the category occurs
Even if it is, buffer until it is stored in the general-purpose tray KST.
The IC can be temporarily stored in the storage unit 405.
Therefore, a general-purpose tray is called from the IC storage unit 200.
Until the sorting operation can be continued.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic plan view showing an embodiment of an IC test apparatus proposed in claim 1 of the present application. [Figure 2] a diagrammatic perspective view showing the preferred IC test equipment. FIG. 3 is a side view for explaining an operation of a part of the embodiment shown in FIG. 2; FIG. 4 is a schematic plan view for explaining a conventional technique. FIG. 5 is a perspective view specifically showing the schematic plan view shown in FIG. 4; FIG. 6 is an exploded perspective view for explaining the structure of a test tray. FIG. 7 is a perspective view for explaining a storage state of ICs in a test tray. FIG. 8 is an enlarged sectional view for explaining an electrical connection state between an IC stored in a test tray and a test head. FIG. 9 is a plan view for explaining the order of testing ICs stored in a test tray. FIG. 10 is a perspective view for explaining the structure of an IC stocker under test and a tested IC stocker. FIG. 11 is a plan view for explaining an operation method of the entire IC test apparatus. DESCRIPTION OF REFERENCE NUMERALS 100 chamber unit 101 constant temperature bath 102 test chamber 103 heat removal tank 200 IC storage unit 201 IC stocker under test 202 tested IC stocker 300 loader unit 304 XY transfer unit 400 unloader unit 404 XY transfer unit 405 Buffer section TST Test tray KST General-purpose tray

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takeshi Yamashita 1-32-1 Asahicho, Nerima-ku, Tokyo Stock Company Advantest Co., Ltd. (72) Inventor Yoshiyuki 1-32-1 Asahimachi, Nerima-ku Tokyo Advantest Co., Ltd. (72) Inventor Makoto Nemoto 1-32-1 Asahicho, Nerima-ku, Tokyo Co., Ltd. Advantest Co., Ltd. (56) References JP-A-6-43212 (JP, A) JP-A-6-503883 (JP) , A) (58) Field surveyed (Int. Cl. ⁷ , DB name) G01R 31/26 G01R 31/28-31/3193 H01L 21/66

Claims (1)

(57) [Claims] [Claim 1] A plurality of ICs are mounted in a plane from a general-purpose tray on a test tray sent to a loader portion and stopped, and the test tray is placed adjacent to the loader portion. The test tray is moved to a test chamber provided adjacent to the constant temperature bath, while applying a desired temperature thermal stress to the IC in the constant temperature bath.
The IC mounted on the test tray is sequentially brought into electrical contact with a test head provided in a test chamber to test the operation of the IC, and the test result is stored for each IC.
The test tray is moved to a heat removal tank provided adjacent to the test chamber, and the high or low temperature given by the constant temperature bath is removed in the heat removal tank, and the removed test tray is taken out to the unloader section, An IC test apparatus configured to classify ICs mounted on the test tray according to the storage of the test results in the unloader unit, sort the non-defective products and defective products, and transfer them to a general-purpose tray. An IC test apparatus comprising: a heat removal tank arranged in a line; a loader section disposed in front of a constant temperature bath; and two unloader sections disposed in front of a test chamber and a heat removal tank.