WO2007135710A1

WO2007135710A1 - Electronic component testing apparatus

Info

Publication number: WO2007135710A1
Application number: PCT/JP2006/309955
Authority: WO
Inventors: Koya Karino; Yoshihito Kobayashi; Kazuyuki Yamashita; Akihiko Ito
Original assignee: Advantest Corporation
Priority date: 2006-05-18
Filing date: 2006-05-18
Publication date: 2007-11-29
Also published as: KR20090015938A; KR101042652B1; TWI327224B; TW200804839A

Abstract

A handler (1) is provided for testing IC devices by bringing the IC devices into electrical contact with the contact sections (51-54) of a test head (5) in a status where the IC devices are mounted on a test tray (TST). The handler can bring the IC devices, which are mounted on the four test trays (TST), into electrical contact with the contact sections (51-54) of the test head (5), in a status where the test trays (TST) are arranged two by two by arranging two trays (TST) along a Y axis direction and two test trays (TST) along an X axis direction.

Description

Specification

Electronic component testing equipment

Technical field

The present invention relates to an electronic component testing apparatus used for testing various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices typically).

Background art

In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of the Ic device in the knocked state.

[0003] A handler that constitutes an electronic component testing apparatus includes a loader unit, a chamber unit, and an unloader unit.

[0004] The loader section of the handler circulates and conveys the electronic device testing apparatus from a tray (hereinafter referred to as a customer tray) for accommodating the pre-test IC device or the tested IC device. IC devices are reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.

[0005] Next, in the soak chamber, the chamber portion applies high-temperature or low-temperature thermal stress to the IC device mounted on the test tray, and then, in the test chamber, each IC device is electrically connected to the contact portion of the test head. The electronic component testing device body (hereinafter referred to as a tester) performs the test.

[0006] Next, through the unsoak chamber, the test tray loaded with each IC device for which the test has been completed is unloaded from the chamber portion to the unloader portion, and the IC device is remounted on the customer tray according to the test result in the unloader portion. In this way, good products are classified into defective products and sorted into categories.

[0007] As an electronic component testing apparatus of this type, for the purpose of improving the test efficiency, two test trays are arranged in the depth direction of the handler in the test section, and the IC chips mounted on the two test trays are simultaneously mounted. A device that is in electrical contact with the socket of the test head is known (for example, see Patent Document 1).

[0008] In order to further improve the test efficiency of the handler having the above-described configuration, the depth of the test unit If the number of test trays is increased to 3 or 4 in the direction, only the depth dimension increases according to the increased number of sheets. The depth dimension of the handler is subject to restrictions such as setting the rear side force tester, and the required specifications are stricter than the height dimension and width dimension, so if only the depth dimension increases, it will be difficult to satisfy user needs. Become.

[0009] Further, in the handler with the above configuration, in order to shorten the index time (time for setting the test tray in the test unit), two test trays are also transported side by side in the depth direction in the soak unit! Even in the unsoak section, two test trays are arranged and transported in the depth direction.

[0010] Therefore, if the number of test trays in the test unit is increased in the depth direction in order to further improve the test efficiency, not only the test unit, but also the soak unit and the unsoak unit are increased in the depth direction accordingly. Therefore, there is a problem that the occupied space of the handler becomes large.

[0011] Patent Document 1: International Publication No. WO99Z01776 Pamphlet

Disclosure of the invention

[0012] An object of the present invention is to provide an electronic component testing apparatus capable of improving test efficiency.

[0013] In order to achieve the above object, according to the present invention, in a state where the electronic device under test is mounted on a test tray, the electronic device under test is electrically contacted with the contact portion of the test head. An electronic component test apparatus used for testing the electronic device under test, wherein the test unit is in a direction substantially perpendicular to the direction of travel of the test tray in the test unit. The test trays are arranged in m rows along the direction N, the test trays are arranged in n columns along a direction substantially parallel to the traveling direction, and the test trays are arranged in m rows and n columns. There is provided an electronic component testing apparatus that makes an electronic component to be tested mounted on X n) test trays electrically contact a contact portion of the test head (see claim 1). However, m is an integer greater than or equal to 1, and n is an integer greater than or equal to 2.

[0014] In the present invention, in the test section, the test trays are arranged substantially along the direction substantially orthogonal to the direction of travel of the test tray. Arrange test trays along different directions. As a result, the number of simultaneous measurements in the test section can be increased, so that the test efficiency of the electronic component test apparatus can be improved.

[0015] Although not particularly limited in the above invention, an application unit that applies thermal stress at a predetermined temperature to the electronic device under test in a state where the electronic device under test is mounted on the test tray is further provided. The unit arranges the test trays in m rows along a direction substantially perpendicular to the traveling direction, and arranges the test trays in a row in a direction substantially parallel to the traveling direction. It is preferable to have a first moving means for moving the (m X 1) test trays arranged in a row and 1 column in a direction approaching the test section (see claim 2).

[0016] Although not particularly limited in the above invention, the first moving means has the (m X 1) test trays arranged in n stages at predetermined intervals along a direction approaching the test unit. It is preferable to move them in order (see claim 3).

[0017] In the test unit, the test tray is arranged in m rows and n columns, whereas in the application unit, the test tray is arranged in m rows and 1 column, thereby minimizing the increase in the space occupied by the electronic component test apparatus. The test efficiency of the electronic component test apparatus can be improved.

[0018] The first moving means may move (m X 1) test trays in each stage at the same time, or may move them independently of each other.

[0019] When the electronic component test apparatus is a type that tests the test tray in a horizontal posture, the first moving means sequentially moves the test tray along the vertical direction. When the electronic component test apparatus is of a type that tests the test tray in a vertical posture, the first moving means sequentially moves the test tray along the horizontal direction.

[0020] Although not particularly limited in the above invention, (m X 1) pieces of the test tray in which the side force close to the test portion in the first moving means is also arranged in the P-stage are used as the test tray in the test portion. It is preferable to include first transport means for transporting to the p column or the (n + 1-p) column of the m-row / n-column arrangement (see claim 4). Where p is an integer l≤p≤n

[0021] Although not particularly limited in the above invention, the first transport means is the first transfer means.

It is preferable that the (m X n) test trays arranged in the first to n-th stages from the side close to the test unit are transported to the test unit substantially simultaneously (see claim 5). .

[0022] Although not particularly limited in the above invention, the electronic device further includes a removing unit that removes thermal stress from the electronic device under test in a state where the electronic device under test is mounted on the test tray. The removing unit arranges the test trays in m rows along a direction substantially perpendicular to the traveling direction, and arranges the test trays in one column along a direction substantially parallel to the traveling direction. It is preferable to have a second moving means for moving the (m X 1) test trays arranged side by side and arranged in m rows and 1 column in a direction away from the test force (see claim 6).

[0023] Although not particularly limited in the above invention, the second moving means is a state in which the (m X 1) test trays are arranged in n stages at predetermined intervals along a direction away from the test unit. It is preferable to move sequentially with (see claim 7).

[0024] In the test unit, the test tray is arranged in m rows and n columns, while in the removal unit, the test tray is arranged in m rows and 1 column, thereby minimizing the increase in the space occupied by the electronic component test equipment. The test efficiency of the electronic component test apparatus can be improved.

[0025] The second moving means may move (m X 1) test trays in each stage at the same time, or may move them independently of each other.

[0026] When the electronic component testing apparatus is of a type that tests the test tray in a horizontal posture, the second moving means sequentially moves the test tray along the vertical direction. When the electronic component test apparatus is a type that tests the test tray in a vertical posture, the second moving means sequentially moves the test tray along the horizontal direction.

[0027] Although not particularly limited to the above invention, (m X 1) of the test trays arranged in the q column of the m-row n-column arrangement in the test unit, It is preferable that the second moving means includes second conveying means for conveying the second moving means so as to be arranged in the q-th or (n + 1-q) -th order from the side close to the test unit. 8). However, q is an integer of l≤q≤n.

[0028] Although not particularly limited in the above invention, the second transport means includes the test unit. In addition, it is preferable that (m X n) test trays arranged in m rows and n columns are transported substantially simultaneously to the second moving means (see claim 9).

[0029] Although not particularly limited in the above invention, the test electronic component is mounted on the test tray, a loader unit that carries the test tray into the application unit, the test tray is received from the removal unit, and a test result And an unloader unit that classifies the electronic components to be tested. The loader unit carries the test tray one by one into the application unit, and the unloader unit It is preferable to carry out the test trays one by one from the removal unit (see claim 10).

Brief Description of Drawings

FIG. 1 is a schematic cross-sectional view showing an electronic component test apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 3 is a conceptual diagram showing tray handling in the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 4 is an exploded perspective view showing an IC stock force used in the electronic component testing apparatus according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the first embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a test tray used in the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 7 is a side view of the vertical transfer device provided in the soak chamber of the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 8A is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state before supplying a test tray to the test chamber.

FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A.

FIG. 9A is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state in which a test tray is supplied to the test chamber.

FIG. 9B is a cross-sectional view taken along the line IXB-IXB in FIG. 9A. [10A] FIG. 10A is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state in which the IC device is pressed against the test head.

FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. 10A.

FIG. 11 is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state in which the test tray is being unloaded from the test chamber.

FIG. 12 is a schematic cross-sectional view showing the order of transport of test trays in the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 13 is a schematic cross-sectional view showing the order of transport of test trays in the chamber portion of the electronic device test apparatus according to the second embodiment of the present invention.

FIG. 14 is a schematic cross-sectional view showing the order of transport of test trays in the chamber portion of the electronic device test apparatus according to the third embodiment of the present invention.

FIG. 15 is a conceptual diagram showing tray handling in the electronic device test apparatus according to the fourth embodiment of the present invention.

FIG. 16 is a plan view showing an example of a structure for connecting test trays in the fourth embodiment of the present invention.

FIG. 17 is a perspective view showing another example of a structure for connecting test trays in the fourth embodiment of the present invention.

FIG. 18 is a perspective view showing a transport path of a test tray in a soak chamber of an electronic device test apparatus according to a fifth embodiment of the present invention.

Explanation of symbols

1 ... Nondra

100 ... Chamber part

110 ··· Soak chamber

111 ... Vertical conveyor

112 ... Extrusion equipment

120 ... Test Channo

130 ··· Shaft drive

140 ... First tray transfer device 141 ... 1st upper conveyor

143… First lower conveyor

144: First connecting member

145 ... first support member

150 ... Second tray transfer device

160 ... Third tray transfer device

170 ··· Unsoak chamber

200 ... storage

300 ··· Loader

400 ... unloader

5 ... Test head

50 "socket

51 to 54 ... 1st to 4th contact part

6 ... Tester

KST ... Customer train

TST ... Test tray

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing an electronic component testing apparatus according to the first embodiment of the present invention, FIG. 2 is a perspective view showing the electronic component testing apparatus according to the first embodiment of the present invention, and FIG. FIG. 3 is a conceptual diagram showing a tray handling method in the electronic device test apparatus according to the first embodiment of the invention.

[0034] The electronic device test apparatus according to the first embodiment of the present invention tests (inspects) whether or not the IC device operates properly in a state where high temperature or low temperature stress is applied to the IC device. This device classifies IC devices based on test results, and consists of handler 1, test head 5, and tester 6. The IC device test using this electronic component test equipment is performed by replacing the IC device from the customer tray KST (see Fig. 5) to the test tray TST (see Fig. 6). The IC device is indicated by the symbol IC in the figure. As shown in FIGS. 1 to 3, the handler 1 in this embodiment includes a storage unit 200 that stores a pre-test IC device and a customer tray KST loaded with a post-test IC device, and a storage unit 200. A loader unit 300 that loads the IC device to be sent onto the test tray TST and sends it to the chamber unit 100, a chamber unit 100 that includes the test head 5 and tests the IC device while mounted on the test tray TST, and a test It consists of an unloader unit 400 that unloads existing IC devices from the chamber unit 100 and transfers them to the customer tray KST while sorting them. In particular, the handler 1 according to the present embodiment is capable of pressing the IC device against the socket 50 of the test head 5 in a state where the four test trays TST are arranged in two rows and two columns in the chamber unit 100. The

A socket 50 provided in the test head 5 is connected to a tester 6 through a cable 7 shown in FIG. 1, and an IC device is tested by a test signal from the tester 6. As shown in FIG. 1, a space is formed in a part of the lower portion of the handler 1, and a test head 5 is replaceably disposed in this space, and a through hole formed in the device base of the handler 1 is formed. Through this, the IC device and the socket 50 on the test head 5 can be brought into electrical contact. When changing the type of IC device, the test device is replaced with another test head that has a socket suitable for the shape and pin count of that type of IC device.

[0037] Each part of the handler 1 will be described in detail below.

[0038] <Storage unit 200>

4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the first embodiment of the present invention, and FIG. 5 is a customer tray used in the electronic component testing apparatus according to the first embodiment of the present invention. It is a perspective view shown.

[0039] The storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices, and a tested IC stocker 202 that stores IC devices classified according to test results. .

As shown in FIG. 4, these stockers 201 and 202 include a frame-like tray support frame 203 and an elevator 204 that can be moved up and down by the lower force of the tray support frame 203 also entering the upper part. And. A plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204. In the customer tray KST in this embodiment, as shown in FIG. 5, 60 accommodating portions 31 for accommodating IC devices are arranged in 10 rows × 6 columns. Actually, there are various array variations depending on the type of IC device.

[0042] Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the numbers of the pre-test IC stocker 201 and the tested IC stocker 202 are appropriately set as necessary. can do.

In this embodiment, as shown in FIG. 2 and FIG. 3, two pre-test IC stockers 201 are provided with two stock forces STK-B, and two empty tray stocks STK-E are provided next to them. It has been. Each empty tray stock strength STK-E is obtained by stacking empty customer trays KST sent to the unloader section 400! /.

[0044] Eight tray stockers STK-1, STK-2, ..., STK-8 are installed in the tested IC stocker 202 next to the empty tray stock force STK-E. It is configured so that it can be sorted and stored in up to 8 categories. In other words, in addition to non-defective products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become.

[0045] <Loader unit 300>

FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the first embodiment of the present invention.

[0046] The above-described customer tray KST is transported from the lower side of the device base 101 to the two window portions 306 of the loader unit 300 by the tray transfer arm 205 provided between the storage unit 200 and the device base 101. It is. Then, in the loader unit 300, the IC device loaded in the customer tray KST is transferred by the device transfer device 304 to the precursor 305, where the mutual positional relationship of the IC devices is corrected. Thereafter, the IC device transferred to the precursor 305 is reloaded on the test tray TST stopped on the device transporter 304 force loader unit 300 again.

[0047] As shown in FIG. 6, the test tray TST has bars 13 provided in parallel to the square frame 12 at equal intervals. Both sides of the bars 13 and the side 12a of the frame 12 facing the bars 13 are A plurality of mounting pieces 14 are formed so as to protrude at equal intervals. Between these bars 13 or An insert accommodating portion 15 is configured by the space between the cross 13 and the side 12a and the two mounting pieces 13.

[0048] Each insert accommodating portion 15 accommodates one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. . For this purpose, attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16. As shown in Fig. 6, 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.

Each insert 16 has the same shape and the same dimensions, and an IC device is accommodated in each insert 16. The IC accommodating portion 18 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular concave portion in the example shown in FIG.

[0050] The loader unit 300 includes a device transfer device 304 that transfers an IC device from the customer tray KST to the test tray TST. As shown in FIG. 2, the device transport device 304 reciprocally moves between the test tray TST and the customer tray KST by means of the two rails 301 installed on the device base 101 and the two rails 301 ( This direction is defined as the Y direction.) A movable arm 302 that can be), a movable head 303 that is supported by the movable arm 302 and is movable in the X-axis direction along the movable arm 302, and a force are also configured.

[0051] A suction pad (not shown) is mounted downward on the movable head 303 of the device transport device 304. The suction head moves while sucking to hold the IC device from the customer tray KST. Then, transfer the IC device to the test tray TST. For example, about eight suction pads are attached to one movable head 303, and eight IC devices can be loaded onto the test tray TST at one time.

[0052] <Chamber part 100>

FIG. 7 is a side view showing the vertical transfer device provided in the soak chamber of the electronic component testing apparatus according to the first embodiment of the present invention, and FIGS. 8A, 9A, 10A and 11 are the first embodiment of the present invention. FIG. 8A is a cross-sectional view of the chamber portion of the electronic component test apparatus according to the embodiment, FIG. 8A is a diagram showing a state before supplying the test tray to the test chamber, and FIG. 9A is a diagram showing a state in which the test tray is supplied to the test chamber. 10A is a state where the IC device is pressed against the test head FIG. 11 is a diagram showing a state where the test tray is unloaded from the test chamber. 8B is a cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A, FIG. 9B is a cross-sectional view taken along line IXB-IXB in FIG. 9A, and FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. is there. Further, FIG. 12 is a schematic cross-sectional view showing the order in which the test tray is conveyed in the chamber portion of the electronic component testing apparatus according to the first embodiment of the present invention.

[0053] After the IC device is loaded in the loader unit 300, the test tray TST described above is sent to the chamber unit 100, and the test of each IC device is executed with the IC device mounted on the test tray TST. The

[0054] The chamber section 100 includes a soak chamber 110 that applies a thermal stress of about 55 ° C to 150 ° C to an IC device loaded on the test tray TST, and an IC device in a state in which this thermal stress is applied. The test chamber 120 is configured to make electrical contact with the test head 5, and the unsoak chamber 170 is configured to remove the applied thermal stress from the IC device tested in the test chamber 120.

[0055] It is preferable that the unsoak chamber 170 is thermally insulated from the soak chamber 110 and the test chamber 120. Actually, a predetermined thermal stress is applied to the region between the soak chamber 110 and the test chamber 120. Are applied, and the unsoak chamber 170 is thermally insulated from these. For convenience, these are collectively referred to as the chamber portion 100.

[0056] The soak chamber 110 is provided with a vertical transfer device 111 for sequentially moving a plurality of test trays TST downward as shown in FIG. The TST waits while being supported by the vertical transfer device. Mainly, thermal stress is applied to IC devices during this standby.

[0057] As shown in the figure, the vertical transfer device 111 includes a plurality of clamps 11 lb capable of holding the test tray TST in a horizontal posture, and an endless in which the clamps 11 lb are provided at substantially equal intervals. The belt conveyor 112a can be moved along the vertical direction by the belt conveyor 11lb.

[0058] When the test tray TST is supplied from the loader unit 300, the vertical transport device 111 is lowered over a certain time while holding the test tray TST in a horizontal posture by the clamp 1 ib. During this time, thermal stress is applied to multiple IC devices mounted on the test tray TST. It is.

In the present embodiment, each clamp 11 lb of the vertical conveyance device 111 can hold two test trays TST arranged in two rows and one column along the Y-axis direction.

In addition, as shown in FIG. 8A, the soak chamber 110 is configured to push out the test trays TST stacked in the second and bottom stages from the bottom of the vertical transfer device 111 toward the test chamber 120 side. An extrusion device 112 capable of performing the above is further provided.

[0061] A test head 5 is arranged at the center of the test chamber 120. The test tray TST is carried on the test head 5, and the IC device is mounted on the test tray TST with the test head 5 mounted thereon. The IC device is tested by pressing it against the socket 50 and bringing the input / output terminals of each IC device into electrical contact with the contact pins of the socket 50.

In the present embodiment, as shown in FIG. 3, a direction (handler 1) that is substantially orthogonal to the traveling direction (X-axis direction) of the test tray TST in the test chamber 120 is provided in the test chamber 120. The test tray TST is arranged in two rows along the depth direction), and two test trays TST are arranged in a direction substantially parallel to the X-axis direction, and the test tray TST is arranged in two rows and two columns. In this state, the IC devices mounted on the four test trays can be simultaneously pressed against the socket 50 of the test head 5. In the present invention, the arrangement of the test trays TST in the test chamber 120 is not particularly limited to 2 rows and 2 columns, but m rows and n columns (provided that m is an integer of 1 or more and n is 2 or more). If it is an integer, it may be 1 row and n columns, 3 rows or more, or 3 columns or more.

[0063] For convenience of explanation, in this embodiment, the test tray arranged in one row and one column in the test chamber 120 is referred to as a first test tray TST, and the test tray arranged in one row and two columns in the test chamber 120. Is called the second test tray TST and the test chamber 120

2

The test tray placed in 2 rows and 2 columns is called the third test tray TST.

Three

The test tray arranged in 2 rows and 1 column in the chamber 120 is connected to the fourth test tray TST.

Called 4.

[0064] As described above, the test chamber 120 has four test trays TST that can be arranged in two rows and two columns. -Fourth contact parts 51-54 are provided. [0065] The first contact portion 51 is arranged on the test head 5 so as to face the first test tray TST ^, and the second contact portion 52 goes to the test so as to face the second test tray TST. Tsu

2

The third contact part 53 is placed on the terminal 5 so that the third contact portion 53 faces the third test tray TST.

Three

The fourth contact portion 54 is arranged on the strike head 5 and faces the fourth test tray TST.

4 is placed on the test head 5 as shown.

[0066] The first to fourth contact portions 51 to 54 are mounted on test trays TST to TST, which face each other.

1 4 Each is composed of an assembly of the same number (64) of sockets 50 as the mounted IC devices.

[0067] In the test chamber 120, as shown in FIGS. 8A and 8B, a Z-axis drive device 130 for simultaneously pressing each IC device mounted on the test tray TST against the socket 50 of the test head 5, and First to fourth tray transfer devices 140 to 160 for loading and unloading the test tray TST are provided. Note that the fourth tray transport device is hidden behind the first tray transport device 140 in FIG. 8A, and V is hidden behind the third tray transport device 160 in FIG. 8B. Also shown in the figure.

The Z-axis drive device 130 includes a drive shaft 131 that can move along the Z-axis direction by driving an actuator (not shown), a drive plate 132 that is supported at the lower end of the drive shaft 131, and a drive plate 132. The first to fourth pusher groups 133 to 135 mounted on the lower surface of the drive plate 132 and the first to fourth abutting members 136 to 138 also mounted on the lower surface of the drive plate 132 are tested. It is provided above the head 5. Note that the fourth pusher group and the fourth abutting member are hidden behind the first pusher group and the first abutting member in FIG. 8A, and the third pusher group and the third abutting member in FIG. 8B. Because it is hidden behind the abutting member, it is shown in any figure.

[0069] The first pusher group 133 is used to press the 64 IC devices mounted on the first test tray TST against the sockets 50 of the first contact portion 51 at the same time. The drive plate 132 is disposed on the lower surface so as to face the contact portion 51. The first pusher group 133 is composed of a collection of pushers that come into contact with and press against the upper surface of the IC device, and the same number of IC devices (that is, 64 in this embodiment) mounted on the first test tray TST. ) Pusher! / [0070] Around the first pusher group 133, four first abutting members 136 for abutting a first upper conveyor 141 described later to push down the first tray transport device 140 are provided. The Each first contact member 136 protrudes downward from the lower surface of the drive plate 132.

[0071] The second pusher group 134 also has 64 IC devices mounted on the second test tray TST.

2

In order to simultaneously press the sockets 50 of the second contact portion 52 against each other, the lower surface of the drive plate 132 is disposed so as to face the second contact portion 52 of the test head 5. The number of second pusher groups 134 is the same as the number of IC devices mounted on the second test tray TST.

2

In other words, in this embodiment, it is made up of a collection of pushers that can be 64)!

[0072] Around the second pusher group 134, four second abutting members 137 for abutting a second upper conveyor 151 described later to push down the second tray conveying device 150 are provided. The Each second contact member 137 projects downward from the lower surface of the drive plate 132.

[0073] It should be noted that the amount of push-down of second tray transport device 150 when pressed by Z-axis drive device 130 is relative to the amount of push-down of first tray transport device 140 or fourth tray transport device. Therefore, the second abutting member 137 is relatively shorter than the first abutting member 136 and the fourth abutting member (not shown).

[0074] The third pusher group 135 also has 64 IC devices mounted on the third test tray TST.

Three

In order to simultaneously press the sockets 50 of the third contact portion 53 against each other, the drive plate 132 is disposed on the lower surface of the test head 5 so as to face the third contact portion 53. The number of third pusher groups 135 is the same as the number of IC devices mounted on the third test tray TST.

Three

[0075] Around the third pusher group 135, four third abutting members 138 for abutting a third upper conveyor 161 described later to push down the third tray conveying device 160 are provided. The Each third contact member 138 protrudes downward from the lower surface of the drive plate 132. [0076] As in the case of the second contact member 137, the amount of depression of the third tray conveyance device 160 during pressing is compared with the amount of depression of the first tray conveyance device 140 or the fourth tray conveyance device. In order to make it relatively smaller, the third contact member 138 is relatively shorter than the first contact member 136 and the fourth contact member (not shown).

[0077] The fourth pusher group is not particularly shown, but 64 pieces mounted on the fourth test tray TST.

Four

The IC device is disposed on the lower surface of the drive plate 132 so as to face the fourth contact portion of the test head 5 in order to simultaneously press the IC device against each socket of the fourth contact portion. This fourth group of pushers is the same as the number of IC devices mounted on the fourth test tray TST (

Four

That is, in this embodiment, the pusher is composed of 64 pushers.

[0078] Although not specifically shown, a fourth abutting member cap for abutting a fourth upper conveyor (not shown), which will be described later, to push down the fourth tray conveying device is provided around the fourth pusher group. It is installed. Each of the fourth contact members protrudes downward from the lower surface of the drive plate 132.

[0079] As shown in FIGS. 8A and 8B, the first tray transport device 140 includes a first upper conveyor 141 and a first lower conveyor 143 for horizontally transporting the test tray TST in the test chamber 120. The first support member 145 supports the conveyors 141 and 143 so as to be movable up and down.

[0080] The first upper conveyor 141 is provided to convey the test tray TST, which is located in the first row and the first column of the second row from the bottom in the vertical conveyance device 111, into the test chamber 120. ing.

On the other hand, the first lower conveyor 143 is provided in the vertical transport device 111 to be located at the lowest row in the first row and in the first column and to transport the test tray TST into the test chamber 120. Yes.

[0082] As shown in FIGS. 8A and 8B, the first upper conveyor 141 and the first lower conveyor 143 are each composed of, for example, a pair of belt conveyors provided to support both sides of the test tray TST. ing. An interval through which the first contact portion 51 can pass is provided between the pair of belt conveyors. As shown in FIG. 8A, a stopper 142 for stopping the test tray TST conveyed by the conveyor 141 is provided on the first upper conveyor 141.

The stopper 142 has an air cylinder or the like that can be expanded and contracted along the Y-axis direction. Then, when stopping the test tray TST on the first upper conveyor 141, the air cylinder is extended so that the stopper 142 is positioned on the conveyor and passes the test tray TST on the first upper conveyor 141. To prevent this, retract the air cylinder and retract the stopper 142 from the conveyor.

[0085] The first upper conveyor 141 and the first lower conveyor 143 are fixed by a first connecting member 144. Since the first connecting member 144 cannot be expanded and contracted, a space through which the test tray TST can pass is formed between the first upper conveyor 141 and the first lower conveyor 143.

[0086] The first conveyors 141 and 143 integrated together by the first connecting member 144 are supported by the first support member 145 so as to be movable in the vertical direction.

[0087] The first support member 145 is composed of an elastic body such as a coil spring, for example, and the first support member 145 is pushed downward when the first conveyors 141 and 143 are pushed downward by the Z-axis drive device 130. When the 145 contracts and the pressing by the Z-axis driving device 130 is released, the first support member 145 returns the first conveyors 141 and 143 to their original positions by the elastic force.

[0088] The second tray transport device 150 also allows the second upper conveyor 151 and the second lower conveyor 152 to horizontally transport the test tray in the test chamber 120, and the conveyors 151 and 152 can be moved up and down. The supporting second support member 155 and the force are also configured.

[0089] The second upper conveyor 151 further moves the test tray TST carried by the first upper conveyor 141 of the first tray transfer device 140 toward the unsoak chamber 170 side, and the unsoak chamber 170 Is provided to deliver the test tray TST to the position of the first row and the first column in the second row from the bottom.

[0090] On the other hand, the second lower conveyor 152 further pushes the test tray TST conveyed by the first lower conveyor 143 of the first tray transfer device 140 toward the unsoak chamber 170, and further. It is provided to move the test tray TST to the position of 1 row and 1 column at the lowest level in the vertical transfer device of the unsoak chamber 170. [0091] As shown in FIGS. 8A and 8B, both the second upper conveyor 151 and the first lower conveyor 152 are configured by a pair of belt conveyors provided so as to support both sides of the test tray TST, for example. ing. Between the pair of belt conveyors, as shown in FIGS. 8B and 10B, an interval through which the second contact portion 52 can pass is provided.

As shown in FIG. 8A, a stopper 153 for stopping the test tray TST conveyed by the conveyor 152 is provided on the second lower conveyor 152.

[0093] This stocker 153 has an air cylinder or the like that can expand and contract along the Y-axis direction. When the test tray TST is stopped on the second lower conveyor 152, the air cylinder is extended. When the stopper 153 is positioned on the conveyor and the second lower conveyor 152 is passed through the test tray TST, the air cylinder is contracted so that the stopper 153 also retracts the force on the conveyor.

The second upper conveyor 151 and the second lower conveyor 152 are fixed by the second connecting member 154. Since the second connecting member 154 is not extendable, a predetermined interval is formed between the second upper conveyor 151 and the second lower conveyor 152 so that the test tray TST can pass therethrough. Yes.

The second conveyors 151 and 152 integrated together by the second connecting member 154 are supported by the second support member 155 so as to be movable in the vertical direction.

[0096] The second support member 155 is made of an elastic body such as a coil spring, for example. When the second conveyors 151 and 152 are pushed downward by the Z-axis drive device 130, the second support device When 155 contracts and the pressing by the Z-axis drive device 130 is released, the first support member 155 returns the second conveyors 151 and 152 to their original positions by the elastic force.

[0097] The third tray transport device 160 has basically the same configuration as the second tray transport device 150, and includes a third upper conveyor 161, a third lower conveyor 162, a stopper (not shown), The third connecting member 164 and the third supporting member 165 are configured.

[0098] The third upper conveyor 161 moves the test tray TST transported by the fourth upper conveyor of the fourth tray transport device further toward the unsoak chamber 170, so that the vertical transport device of the unsoak chamber 170 is moved. In order to deliver the test tray TST to the 2nd row, 1st column, 2nd from the bottom. [0099] On the other hand, the third lower conveyor 162 further moves the test tray TST conveyed by the fourth lower conveyor of the fourth tray transport device toward the unsoak chamber 170 side, and the unsoak In the vertical transfer device of the chamber 170, it is provided to deliver the test tray TST to the position of 2 rows and 1 column at the bottom.

[0100] Both the third upper conveyor 161 and the third lower conveyor 162 are composed of, for example, a pair of belt conveyors provided so as to support both sides of the test tray TST. As shown in FIG. 8B and FIG. 10B, an interval through which the third contact portion 53 can pass is provided between the pair of belt conveyors.

[0101] Similar to the stopper 153 of the second tray conveying device 150, the third lower conveyor 162

Although not shown in particular, a stagger is provided for stopping the test tray TST conveyed by the conveyor 162! /

[0102] The third upper conveyor 161 and the third lower conveyor 162 are fixed by a third connecting member 164. Since the third connecting member 164 is not expandable / contractable, an interval through which the test tray TST can sufficiently pass is formed between them. Third connecting member 1

The third conveyors 161 and 162 integrated together by 64 are supported by a third support member 165 so as to be movable in the vertical direction.

[0103] Although not specifically shown, the fourth tray transport device has basically the same configuration as the first tray transport device 140, and includes a fourth upper conveyor, a stagger, a fourth lower conveyor, It is composed of a connecting member and a fourth supporting member.

[0104] The fourth upper conveyor is located in the second row and the second column of the second row from the bottom in the vertical conveyance device 111, and is provided to convey the test tray TST into the test chamber 120! /

[0105] In contrast, the fourth lower conveyor is located in the lowest row in two rows and one column in the vertical conveyance device 111 and is provided to convey the test tray TST into the test chamber 120.

[0106] The fourth upper conveyor and the fourth lower conveyor are each composed of a pair of belt conveyors provided so as to support both sides of the test tray TST, for example. An interval through which the fourth contact portion 54 can pass is provided between the pair of belt competitors.

[0107] Similar to the stopper 142 of the first tray transfer device 140, the fourth upper conveyor A stover for stopping the test tray TST conveyed by the conveyor is provided.

[0108] The fourth upper conveyor and the fourth lower conveyor are fixed by the fourth connecting member! Since the fourth connecting member is not extendable, an interval through which the test tray TT can pass is formed between them. The fourth conveyor integrated by the fourth connecting member is supported by the fourth support member so as to be movable in the vertical direction.

[0109] The unsoak chamber 170 is also provided with a vertical transfer device having the same structure as the vertical transfer device 111 provided in the soak chamber 110, and this vertical transfer device sequentially moves a plurality of test trays TST upward. IC device force is also removed from thermal stress.

[0110] In this unsoak chamber 170, when a high-temperature heat stress is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air. On the other hand, when a low temperature is applied in the soak chamber 110, the IC device is heated with warm air or a heater to a temperature at which condensation does not occur, and then the removed IC device is removed from the unloader section. Carry out to 400.

[0111] The soak chamber 110 and the unsoak chamber 170 are arranged so as to protrude above the test chamber 120. In the upper part of the soak chamber 110, an inlet for carrying the test tray TST from the apparatus base 101 is formed. Similarly, an outlet for unloading the test tray TST from the apparatus base 101 is also formed in the upper part of the unsoaked tank 170. As shown in FIG. 2, the apparatus base 101 is provided with a tray transfer apparatus 102 for taking the test tray TST out and in and out of the chamber section 100 through these inlets and outlets. The tray transfer device 102 is constituted by, for example, a rotary loader. The test tray TST unloaded from the unsoak chamber 170 by the tray transport device 102 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300. In the present embodiment, one test tray TST is carried into the chamber unit 100 from the loader unit 300 one by one, and one test tray TST is carried out from the chamber unit 100 to the unloader unit 400 one by one.

[0112] In the chamber section 100 configured as described above, from the state shown in FIGS. 8A and 8B, the two test stacks stacked in the second stage from the bottom in the vertical transfer device 111 of the soak chamber 110 are used. The lay TST and the two test trays TST stacked at the bottom are pushed out to the test chamber 120 side by the extrusion device 112.

[0113] As shown in FIGS. 9A and 9B, the test tray TST located in the first row and the first column of the second row from the bottom of the vertical transfer device 111 is placed in the test chamber 120 by the first upper conveyor 141. The stopper 142 is stopped on the first upper conveyor 141 by the stopper 142, and is positioned between the first contact portion 51 and the first pusher group 133 as the first test tray TST.

[0114] The test tray TST located in the first row and the first column of the vertical stage of the vertical transfer device 111 is taken into the test chamber 120 by the first lower conveyor 143 and unsoaked by the second lower conveyor 152. Further moved to the chamber 170 side, stopped on the second lower conveyor 152 by the stopper 153, and connected to the second contact portion 52 as the second test tray TST.

2

Located between second pusher group 134.

[0115] The test tray TST located in the bottom two rows and one column of the vertical transfer device 111 is taken into the test chamber 120 by the fourth lower conveyor, and the unsoak chamber 170 by the third lower conveyor 162. Is stopped on the third lower conveyor 162 by the stopper, and the third contact portion 53 and the third plug are used as the third test tray TST.

Three

It is located between the squash group 135.

[0116] The test tray TST located in the second row and the second column of the second stage from the bottom of the vertical transport device 111 is taken into the test chamber 120 by the fourth upper conveyor, and the fourth upper conveyor by the stopper. Stop on the 4th contact tray 54 and 4th as the 4th test tray TST

Four

Located between pusher groups.

Next, as shown in FIGS. 10A and 10B, when the drive shaft 131 of the Z-axis drive device 130 expands and the drive plate 132 moves downward in the Z-axis, each pusher of the first pusher group 133

1S 1st test tray Touch each IC device held in TST,

The C device is pressed against each socket 50 of the first contact portion 51, and the input / output terminals of each IC device are brought into electrical contact with the contact pins of each socket 50.

[0118] At the same time, each pusher force of the second pusher group 134 is kept in the second test tray TST.

2 Hold each IC device in contact with each other, press each IC device against each socket 50 in the second contact section 52, and connect the input / output terminals of each IC device to the contacts in each socket 50. Make electrical contact with the pins.

[0119] Each pusher force of the third pusher group 135 is held on the third test tray TST.

Three

Each IC device is contacted to each IC device, and each IC device is pressed against each socket 50 of the third contact portion 53, and the input / output terminals of each IC device are brought into electrical contact with the contact pins of each socket 50.

[0120] Similarly, each pusher force of the fourth pusher group contacts each IC device held on the fourth test tray TST4, and each IC device is connected to each socket of the fourth contact portion 54. Press to 50 and make the input / output terminals of each IC device electrically contact the contact pins of each socket 50.

[0121] Since 64 IC devices are mounted on each test tray TST as described above, in this embodiment, a total of 256 ICs mounted on the four test trays TST to TST.

14

Device testing can be performed simultaneously.

As shown in FIGS. 10A and 10B, the lengths of the first contact member 136 and the fourth contact member are the same as those of the second contact member 137 and the third contact member 138. Since it is relatively long compared to the length, each IC device mounted on the first and fourth test trays TST and TST held on the upper conveyor and the lower conveyor Second and

14

3rd test tray TST, each device mounted on TST can be pressed simultaneously

twenty three

It is possible.

[0123] The test result of the IC device is stored, for example, in an address determined by the identification number assigned to each test tray TST and the number of the IC device assigned in the test tray TST.

[0124] When the test of the IC device is completed, as shown in FIG. 11, the Z-axis drive device 130 is raised, and the first test tray TST is moved by the first upper conveyor 141 and the second upper conveyor 151. And is delivered to the second row, first column from the bottom of the vertical transport device in the unsoak chamber 170.

[0125] The second test tray TST is conveyed by the second lower conveyor 152, and is unsoaked.

2

Passed to 1 row and 1 column at the bottom of number 170.

[0126] The third test tray TST is conveyed by the third lower conveyor 162, and is unsoaked. Passed to 2 rows and 1 column at the bottom of number 170.

[0127] The fourth test tray TST is obtained by the fourth upper conveyor 161 and the third upper conveyor 161.

Four

It is transported and delivered from the bottom of the unsoak chamber 170 to the second row, the second row and the first column.

[0128] The first to fourth test trays TST to TST are heated in the unsoak chamber 170.

14

Is removed and then unloaded to the unloader section 400. In addition, the test tray TST is carried out one by one to the unloader section 400 as the unsoak chamber 170 force.

As described above, in the present embodiment, as shown in FIG. 12, the two test trays TST, TST stacked in the second stage from the bottom of the vertical transport device 111 of the soak chamber 110, Tess

1 4 Transport to 1 row 1 column and 2 rows 1 column position in chamber 120. At the same time, the two test trays TST and TST stacked at the bottom of the vertical transfer device 111 are

2 3 In Yamba 120, transport to 1 row 2 columns and 2 rows 2 columns.

[0130] After the test, the first and fourth test trays TST, TST are placed in the unsoak chamber.

14

Lower force of 170 vertical conveyors Transports to the second stage. At the same time, the second and third test trays TST, TST are transported to the lowest stage of the vertical transport device of the unsoak chamber 170.

twenty three

The

[0131] FIG. 13 is a schematic cross-sectional view showing the order of transport of the test tray in the chamber section of the electronic component testing apparatus according to the second embodiment of the present invention, and FIG. 14 is an electronic component testing apparatus according to the third embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing a test tray transporting order in the chamber portion.

In the present invention, the first to fourth test trays TST to TST may be transported in the transport order as shown in FIGS. 13 and 14, for example, without being limited to the transport order described above.

14

In the example shown in FIG. 13, two test trays TST, TST stacked at the bottom of the vertical transfer device 111 of the soak chamber 110 are arranged in the test chamber 120 in one row, one column, and two.

14

Transport to row 1 column position. At the same time, the two test trays TST and TST stacked in the second row from the bottom of the vertical transfer device 111 are placed in one row and two columns in the test chamber 120.

twenty three

And 2 rows and 2 columns.

[0134] After the test, the first and fourth test trays TST, TST are unsoaked.

14

It is transported to the bottom of the 170 vertical transport device. At the same time, the second and third test test Ray TST, TST is transported to the second stage from the bottom of the vertical transport device of the unsoak chamber 170

twenty three

To do.

In the example shown in FIG. 14, two test trays TST and TST stacked at the lowest level of the vertical transfer device 111 of the soak chamber 110 are arranged in the test chamber 120 in one row, one column, and two.

14

Transport to row 1 column position. At the same time, two test trays TST and TST stacked in the second stage from the bottom of the vertical transfer device 111 are placed in the test chamber 120 in one row and two columns.

twenty three

Transport to 2 rows and 2 columns.

[0136] After the test, the first and fourth test trays TST, TST are unsoaked.

14

It is transported to the second stage from the bottom of the vertical transport device. At the same time, the second and third test trays TST and TST are transported to the lowest level of the vertical transport device of the unsoak chamber 170.

twenty three

To do.

FIG. 15 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the fourth embodiment of the present invention.

[0138] In the first embodiment, four test trays TST to TST are divided into the test chamber 120.

However, the present invention is not particularly limited to this. For example, as shown in FIG. 15, with the two test trays TST aligned in the Y-axis direction being mechanically connected, the soak chamber 110, the test chamber 120, and the unsoak chamber 170 are transported. Also good.

[0139] Examples of the structure for connecting the test trays TST to each other include the examples shown in Figs.

[0140] In the example shown in FIG. 16, a convex portion 20 protruding from the side surface of one test tray TST is formed, and a concave portion 21 having a shape corresponding to the convex portion 20 is formed on the side surface of the other test tray TST. The test trays TST are connected to each other by inserting the protrusions 20 into the recesses 21 and engaging them.

[0141] In the example shown in FIG. 17, step portions 22 and 23 are formed on the side surfaces of the test tray TST, respectively, and the protruding portion 22a is formed on the step portion 22 of one test tray TST, while the other side is formed. A hole 23a having a shape corresponding to the protrusion 22a is formed in the step 23 of the test tray TST, the protrusion 22a is inserted into the hole 23a, and the steps 22 and 23 are overlapped with each other. They are linked together.

FIG. 18 is a perspective view showing the transport path of the test tray in the soak chamber of the electronic device test apparatus according to the fifth embodiment of the present invention.

[0143] In the first embodiment, in the vertical transfer device of the soak chamber 110, the force in which the test trays TST are arranged in two rows and one column in all the stages from the uppermost stage to the lowermost stage. Is not particularly limited to this. For example, as shown in FIG. 18, the test trays TST are arranged in two rows and one column only in the second and bottom rows from the bottom, and one test tray TST is placed in the third row and above from the bottom. good. Alternatively, although not particularly shown, the test tray TST may be arranged in 2 rows and 1 column only in the lowermost stage, and one test tray TST may be arranged in the second and higher stages.

[0144] <Unloader section 400>

In the first embodiment of the present invention, the unloader section 400 is also provided with two device transport apparatuses 404 having the same structure as the device transport apparatus 304 provided in the loader section 300. By this device transport apparatus 404, The test tray TST force carried to the unloader unit 400 is also reloaded into the customer tray KST according to the tested IC device force test results.

[0145] As shown in FIG. 2, the device base 101 in the unloader unit 400 has a pair of windows in which the customer tray KST carried from the storage unit 200 to the unloader unit 400 is arranged as desired on the upper surface of the device base 101. Two sets of parts 406 are formed.

[0146] Although not shown in the drawing, an elevating table for elevating and lowering the customer tray KST is provided below each window 406. Here, a full load of tested IC devices is loaded. The customer tray KST, which has become, is lowered and transferred to the tray transfer arm 205.

[0147] The embodiment described above is described in order to facilitate understanding of the present invention, and is not described in order to limit the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

[0148] For example, in the above-described embodiment, the electronic component test apparatus tests the test tray in a horizontal posture. However, the present invention is not particularly limited to this. For example, the present invention is also applicable to an electronic component testing apparatus that tests a test tray in a vertical posture. can do.

Claims

The scope of the claims

[1] With the electronic device under test mounted on the test tray, the electronic device under test is equipped with a test section for electrically contacting the electronic device under test to the contact portion of the test head, and the electronic device under test is tested. An electronic component testing apparatus used for

The test unit arranges the test trays in m rows along a direction substantially perpendicular to the traveling direction of the test tray in the test unit, and along a direction substantially parallel to the traveling direction. With the test trays arranged in n columns and the test trays arranged in m rows and n columns, the electronic components to be tested mounted on the (m X n) test trays are electrically connected to the contact portion of the test head. Electronic component testing equipment to be contacted.

However, m is an integer greater than or equal to 1, and n is an integer greater than or equal to 2.

[2] In the state where the electronic device under test is mounted on the test tray, the electronic device further includes an applying unit that applies thermal stress at a predetermined temperature to the electronic device under test,

The application unit includes:

The test trays are arranged in m rows along a direction substantially perpendicular to the traveling direction, and the test trays are arranged in one column along a direction substantially parallel to the traveling direction. 2. The electronic component testing apparatus according to claim 1, further comprising: first moving means for moving (m X 1) of the test trays arranged in a direction close to the test unit.

[3] The method according to claim 2, wherein the first moving means sequentially moves the (m X 1) test trays in a state where n stages are arranged at predetermined intervals along a direction approaching the test unit. Electronic component testing equipment.

[4] The (m X 1) pieces of the test trays arranged in the p-th row from the side closer to the test unit in the first moving unit are p of the m-row n-column arrangement in the test unit. 4. The electronic component testing apparatus according to claim 3, further comprising a first transport means for transporting to the row or the (n + 1-p) row.

Where p is an integer l≤p≤n.

[5] The first transport means substantially includes (m X n) pieces of the test trays arranged in the 1st to n-th stages from the side close to the test part in the first moving means in the test part. The electronic component testing device according to claim 4, wherein the electronic component testing device is transported simultaneously.

[6] In the state where the electronic device under test is mounted on the test tray, the electronic device under test force further includes a removing unit for removing thermal stress,

The removing unit is

The test trays are arranged in m rows along a direction substantially orthogonal to the traveling direction, and the test trays are arranged in one column along a direction substantially parallel to the traveling direction. 6. The electronic component testing apparatus according to claim 1, further comprising second moving means for moving the (m X 1) test trays arranged in a row in a direction away from the test unit.

7. The second moving means sequentially moves the (m X 1) test trays in a state where n stages are arranged at predetermined intervals along a direction away from the test unit. Electronic component testing equipment.

[8] The (m X 1) pieces of the test trays arranged in the q column of the m-row n-column arrangement in the test unit are q-th from the side closer to the test unit in the second moving unit. The electronic component testing apparatus according to claim 7, further comprising a second conveying unit that conveys the n-th and n-th first-to-q-th elements.

However, q is an integer l≤q≤n.

[9] The second transport means transports (m X n) test trays arranged in m rows and n columns to the test unit substantially simultaneously to the second moving means. The electronic component test apparatus according to claim 8.

[10] A loader unit that mounts the electronic device under test on the test tray and carries the test tray into the application unit;

An unloader that receives the test tray from the removal unit and classifies the electronic device under test based on a test result; and

The loader unit carries the test tray one by one into the application unit, and the unloader unit carries the test tray one by one with the removal unit force.

The electronic component test apparatus according to any one of 6 to 8.