TW200804839A - Electronic component testing apparatus - Google Patents

Abstract

A handler (1) is provided for testing IC devices by bringing the IC devices into electrical contact with the contact sections (51-54) of a test head (5) in a status where the IC devices are mounted on a test tray (TST). The handler can bring the IC devices, which are mounted on the four test trays (TST), into electrical contact with the contact sections (51-54) of the test head (5), in a status where the test trays (TST) are arranged two by two by arranging two trays (TST) along a Y axis direction and two test trays (TST) along an X axis direction.

Description

[Technical Field] The present invention relates to an electronic component testing apparatus for testing various electronic components (hereinafter collectively referred to as ic components) of a semiconductor integrated circuit component or the like. [Prior Art] In the manufacturing of electronic components such as iC components, an electronic component testing device is used to test the performance or function of an IC component in a packaged state. The processor constituting the electronic component testing device includes a loading unit, a empty chamber, and an unloading unit. The loading unit of the processor transfers the IC component from the Ic component for accommodating the test or the carrier disk (hereinafter referred to as the guest carrier disk) storing the tested IC component to the electronic component testing device for circulating transportation. A carrier disk (hereinafter referred to as a test carrier disk) is carried and the test carrier disk is carried into the department.

Following the 'impact chamber of the processor, #Ic carrying the Ic element of the test carrier plate to apply high temperature or low temperature heat pressure, in the thermal shock chamber, the Ic parts are in electrical contact with the contact portion of the test head, in the electron The component test device body (hereinafter referred to as a test device) performs the test. The dust chamber carries the impact chamber that has completed the test from the empty chamber to the unloading portion, which corresponds to the customer's bearing capacity of the test results. The test carrier of the 1C component is further modified by the 'transfer 1C component to 'in the unloading section to perform good and bad products to test the electronic component test device, 2247-8848-PF; Ahddub 5 200804839 For the purpose of the test, the two test carriers are arranged side by side in the depth direction of the processor of the test unit, so that the ic wafers carried on the two test-bearing τ-bearing disks are simultaneously in electrical contact with the test socket of the test head (for example See patent document 1). In order to further improve the test efficiency of the processor constructed as described above, the number of test carriers in the depth direction of the test portion is increased to three, and 4 n corresponds to the increased number and only the depth dimension is increased. The deep sound size of the processor has restrictions on the installation of the tester from the back side, and the requirements are stricter than the size and width dimensions. Therefore, it is difficult to satisfy the user if only the depth = inch is increased. Demand. Furthermore, in the processor of the above configuration, in order to shorten the test time, the test unit sets the phase of the test carrier, the two test carriers are also transported side by side in the impact center, and also in the impact portion; Carry two test carriers in parallel in the direction. Therefore, in order to further improve the test efficiency, in the test section, the number of test carriers is increased, resulting in not only the test portion, but also the impact portion in the depth direction, and the volume is increased. Patent Document 1: International Publication No. WO99/01776 [Draft] [IV] It is an object of the present invention to provide an electronic component capable of improving test efficiency, which includes the test portion 2247-8848-PF; Ahddub' According to the present invention, the electronic component test component is provided on the tested electronic device 6 to be carried on the test carrier 200804839. I: Shape: 2: making the contact portion of the tested electronic component and the test head electrically test the carrier. Test, the test department, the quality of the test carrier in the test section: the forward side by side m line 'and the test carrier disk along the real configuration ... column two = the tested electronic element ...,. |: The contact of the (_) test carrier on the test head of the m test head (see the encyclopedia 1 item Bu Huai "an integer above 1, and the integer above ... ~ ^ Μ :: invention t ' at In the test part, not only the test bearing side is arranged side by side in the direction perpendicular to the direction in which the test carrier disk is perpendicular to the direction, and the test carrier disk is arranged along the actual row. Thereby, the test part can be tested; The direction and the test efficiency of the sub-element test device (4) The number of turns is measured, so that it is not particularly limited in the above invention, but it is preferable that the package is carried on the test carrier. The temperature is also applied to the electronic component under test, and (4) the addition-partial device, which parallels the test carrier along the direction in which the fish directly intersects each other and performs the test. The carrier disk;: the spirit shell is arranged side by side in the direction parallel to the direction of the direction, and the test bearing (4) arranged in one column is directed to the test portion (see the second item of the patent application scope). The invention is not particularly limited, but Preferably, the first action device places (mxl) test carriers along the side of the test portion 2247-884 8-PF; Ahddub 7 200804839, at the third interval of the patent interval of the specific interval). The segments are moved side by side in the same state (see the application in Test 4, the test device is configured to be sunny in the application portion with respect to the test carrier, and the test for the sub-component test device of the electronic component test device is increased. Efficiency. Set to inline η column, column, thereby, can minimize, and improve electricity, "屎,, 丄 y

When moving, or you can move it so that it moves independently of each other. Furthermore, in the case where the electronic component testing device causes the test carrier to be tested in the horizontal posture, the first moving device sequentially moves in the straight direction (4), and the electronic component testing device causes the test carrier to perform the test in the vertical posture. Next, the first % # device / σ moves the test carrier in sequence in the horizontal direction. $ is not particularly limited in the above invention, but it is preferable to have a work carrying device' which will be side by side in the flute.

:=Multi-motion:= The test carrier of each segment (m__ carried in the P segment of the mobile device in the vicinity of the test portion) can be transported to the test portion. The HWn+1_p) column in the configuration (see item 4 of the patent scope) 1P is an integer greater than or equal to and less than or equal to n. In the above invention, it is not particularly limited, but it is preferable that the first carrier device is arranged side by side in the first to nth segments of the first moving device from the first to the nth of the test portion. The disk is transported to the test portion at substantially the same time (see item 5 of the patent application). The division is not particularly limited in the above invention, and it is carried out in the state in which the electronic component to be tested is carried out, and the state in which the test carrier is further included, 2247-8848-PF; Ahddub 8 200804839 The tested electronic element is described as follows. The removal portion includes the second mobile clothing set.

Ln Λ/ Μ is read side by side with the direction perpendicular to the direction of the 5 hai, and Τ + 丄 This measures the carrier plate along a direction substantially parallel to the direction of the entrance and exit, mg, mg # μ will be configured as m line 1 column (mxi) "" type carrier tray to the test section far from the scope of the sixth item). Door private movement (see application is not specifically limited in the above invention, but it is better: the second movement mourns the (mxl) test carrier, the ray #16 / / / mouth the test The direction of the far side is parallel to the specific interval of n. "The next step is to move (see the application test section, the test carrier is configured to read and the test carrier is equipped with 7 rows of horses in the removal section, thereby enabling the electronic component tester The work-&j~ is added to take the small, and improve the test efficiency of the electronic parts test device. The second mobile device can make the slaves (like 1) test the carrier disk move together. It is also possible to move them independently of each other. Further, in the case where the electronic component testing device causes the test carrier to perform the horizontal posture test, the second mobile device is moved in the direction of the ilf ^^^^ port. The second carrier I. In the case where the electronic component testing device causes the test carrier to be in the vertical posture: the test is performed, the second mobile device sequentially moves the test carrier in the horizontal direction. In the above invention, it is not particularly limited. Having a second transport device 'transporting the test trays arranged in the m rows and n columns of the test portion (fflxl) of the test carrier, so that the test portion is adjacent to the 2247-8848-PF; Ahddub 9 200804839 Side q or the (n + L_q) (see the scope of the patent application 帛 8 items). However, q is an integer greater than or equal to 1 and less than or equal to Ή. In the above invention, it is not particularly limited, and ... is limited, but this is better. The first private device will be disposed in the test (4×°卩111仃η(mxn) of the test carrier trays, and is substantially transported to the ninth item of the profit range at the same time.) The device (see the application is not particularly limited in the above invention, but it is preferred that the inclusion/loading portion] carries the tested electronic component to the test carrier, and the test carrier is Transported to the application portion; unloading. 卩, which receives the test carrier from the removal portion, and according to the test result, the (four) test component _, the loader moves each time the test carrier to the The application portion, and the unloading portion, carries out one test carrier tray from the removal portion each time (see claim 10). [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1 is a ride of an electronic component testing apparatus according to a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a perspective view showing an electronic component testing apparatus according to a first embodiment of the present invention, and FIG. 3 is a conceptual view showing processing of a carrier disk of an electronic component κ device according to the present invention. According to the electronic component testing apparatus of the first embodiment of the present invention, in the state in which the Ic π component % is added or the temperature is low, the test (check) 1C 70 pieces is appropriately operated 'according to the test result The 4C component classification 4 is composed of the processor test head 5 and the test device 6. The ic component is carried from the client by the test of the IC component of the electronic component test device by the 10 2247-8848-PF; Ahddub 200804839 The disk KST (see Fig. 5) is moved to the test carrier TST (see Fig. 6) and implemented. Moreover, the ic element is indicated by the symbol Ic in the figure. Therefore, the processor 1 of the present embodiment, as shown in the third to third figures, is composed of the following: a storage unit 200 that houses a guest carrier KST carrying the IC component before the test or the IC component after the test; The input unit 3 moves the iC component transferred from the accommodating unit 200 to the test carrier TST and sends it to the empty chamber portion _100, including the test head 5, and executes the 1C component in the state of being carried on the test carrier TST. The empty chamber portion of the test is unloaded, and the empty portion 1 of the IC component that has been tested is carried out, sorted, and simultaneously moved to the guest tray KST. In the processor 1 of the present embodiment, in the empty chamber portion (10), the test unit 5 of the test head 5 can be pushed to the test stand 5 in a state where the four test carriers TST are arranged in two rows and two columns. on. The test stand 50 provided on the test head 5 is connected to the test device 6 through the electric wire 7 shown in the figure, and the test signal of the test device 6 is used to measure the 忒1C component. Moreover, as shown in the figure, a space is provided in a portion of the lower portion of the processor, and the test head 5 is disposed in a replaceable manner in the space, and the through hole formed through the device of the processor 1 can be The IC component and the test socket 50 on the test head 5 are electrically contacted. When the type of the element is alternated (1), the test head having a test socket having a shape and a number of pins suitable for the type of the 丨c element of the type is replaced. The following is a detailed description of each part of the processing unit. [Storage unit 200] FIG. 4 shows a 2247-8848~PF of the electronic component testing device of the embodiment of the present invention; Ahddub 11 200804839, a knife-dissolving perspective view of the opening, and FIG. 5 shows an initial β-type device using the first embodiment of the present invention. The accommodating part 200 includes: a pre-test IC warehouse 2 〇 用以 用以 用以 用以 用以 用以 用以 用以 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; And the test tray of the classified ig component. The storage 20b 202, as shown in FIG. 4, includes: a frame-shaped carrier support frame 203; from the lower portion of the carrier support frame 2〇3, the upper portion can be lifted up and down The lifting platform 204 overlaps and accumulates a plurality of guest carrying trays KST in the carrying tray support frame 203, and only the overlapping accumulated carrier carrying trays kst are moved up and down by the lifting platform 204. In this embodiment, the guest bearers are carried. Disk KST, as shown in Figure 5, There are 6 rows of storage units for storing IC components in 10 rows and 6 columns. There are various variations in the configuration of the actual teeth and the types of IC components. 1C warehousing 201 before testing and 1C warehousing 2测试2 Generally, the same configuration is used. Therefore, the appropriate number can be set as the number of individual pre-test jc storage 2 01 and test bi-c storage 2 〇 2 as needed. In this embodiment, as shown in Fig. 2 and Fig. 3 As shown, there are 2 storage STK_Bs on the IC storage 201 before the test, and there is an empty carrier tray storage TK E next to it. The individual king carrier tray storage stk-E accumulates the overlapping passengers transmitted by the unloading unit 4〇〇 Carrying tray KST. Jade carrying tray storage STK-E next to it, in the test Bi I ◦ Warehousing 2 02 with 8 storage STK-1, STK-2, ..., STK-8, can correspond to the test results, the most points For the 8 types of storage, in addition to the difference between good and bad products 2247-8848-PF; Ahddub 12 200804839 outside the 'good products can be divided into high-speed products, medium-speed defective products can be divided into the need for testers, etc. - speed (10) Or, [Loading Unit 300] Fig. 6 shows the use of the present invention mn ^ ^ , the target of the electricity An exploded perspective view of the test carrier of the sub-component testing device. The above-mentioned guest carrier KST is moved by the carrier disk disposed between the substrates, f2G5, and is placed on the chassis side to the two window portions 3 of the loading unit. Further, in the loading unit 300, when the component handling device 3G4 transfers the K-pieces accumulated in the guest carrier tray to the aligner 3〇5, the correction is made here (the mutual position of the components) After the relationship, the component carrying device 3〇4 accumulates the IC carrier element transferred to the aligner 305 to the test carrier disk τα stopped at the loading unit 3 . The carrier tray TST is tested, as shown in Fig. 6, 'the pallet 13 is laid flat and equally spaced in the square frame 12, the sides of the pallet 13 and the side 12a of the square frame 12 opposite the pallet 13 are The insert receiving portion 15 is formed by the two mounting pieces 14 at a time interval between the stacking plates 14 and between the pallets 13 and the sides 12a. Each of the insert accommodating portions 15 accommodates one insert 16 which is provided in a floating state on the mounting piece 14 by using the fastener 17. Therefore, the mounting holes 19 for mounting the insert 16 to the mounting piece 14 are formed at both end portions of the insert 16. This insert 16, as shown in Fig. 6, is provided with 64 rows on one test carrier TST, and is arranged in four rows and 16 columns. Further, the inserts 16 have the same shape and the same size, and the IC elements are housed in the individual inserts 16 respectively. The I c housing portion 18 of the insert 16 , 2247-8848-PF; Ahddub 13 200804839 corresponds to the housing i P ; is a square recess. In the example shown in Fig. 6, the passenger terminal (10)' has the component carrier 3G4, and the IC component is transferred from the device to the test carrier TST. The component handling device d (J4', such as the second cabinet-- along the "by" is composed of the following: on the device base 101, the two tracks 3G1 of the if are γ-squares TST according to the two tracks a movable arm 302 that reciprocates with the passenger carrier KST (in the Y direction) and a movable head 303 supported by the movable arm 302 and moves along the X-axis glaze direction along the movable arm 302. The component handling device 304 The movable head 303 is disposed downwardly with an adsorption pad (not shown), and the 1C element is maintained by the suction and the attached movement, and the 承载τγ - is shifted from the '70 piece. It is placed on the test carrier TST. For example, for a movable head 303, the J port is placed with about 8 adsorption pads, and the 8 ic elements can be placed at one time on the test carrier TST. The empty chamber portion 100] FIG. 7 shows a side view of the Panji t, Fu & straight handling device provided in the impact chamber according to the electronic component of the present invention. 8A, 9th, 1st, 8th, and 11th Gangyue 5th. The 11th figure shows that the electronic element is not implemented according to the third aspect of the present invention. The air chamber part of the test device is further illustrated, the picture 8A is the sound w picture before the test carrier is supplied to the test room, and the picture 9A is the schematic view of the test disk being supplied to the test room, the first one 10 Figure A shows the I c component pushed to the gas,

The schematic diagram of the state of the head, the i i picture is 'A mouth horse will test the carrier disk from the test room. Again, Chu. m βίτ 口丹有弟 (10) The figure shows a section along the IB IB-VII line of Figure 8 筮〇 筮〇 口 Β Β Β Β Β 247 247 247 247 247 2247-8848-PF; Ahddub 200804839

σ 彳 彳 , , , , , , 友 沿着 沿着 沿着 沿着 沿着 沿着 沿着 沿着 沿着 沿着 沿着 沿着 ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° A schematic cross-sectional view of the transport sequence of the test tray in the empty chamber portion of the garment. The test carrier tray TST described above is loaded into the IC component after the loading unit 300 is loaded into the empty portion 100, and each of the 1c components is tested while being carried on the test carrier tray TST. The empty chamber portion 100 is composed of the following: an impact chamber 110, for a component mounted on the test carrier TST W 1C, applying a thermal pressure of -55 degrees to 15 degrees Celsius, measuring to 120, will be The 1C element in the state in which the impact chamber 1 1 is subjected to the heat pressure is in contact with the test head 5; the impact chamber 17 is removed, and the applied heat pressure is removed. Moreover, it is preferable to go to the impact chamber 170 to be thermally insulated from the impact chamber 110 or the test chamber 12, and in fact, apply specific heat pressure to the impact chamber 11A and the test chamber 12A, to the impact chamber 17 and its Thermal insulation, however, is conveniently referred to as the empty chamber portion 10 for convenience. The impact chamber 110, as shown in FIG. 7, is provided with a vertical transport device m to sequentially move a plurality of test carriers TST to the bottom, until the test chamber 120 is vacated, the test carrier TST is supported by the vertical carrier Standby. Mainly in this standby, thermal pressure is applied to the IC component. As shown in the same figure, the vertical conveyance device 111 is composed of the following: The clamp 11b which can maintain the test carrier TST in the horizontal posture, and the belt conveyor U2a which is provided with the clamp 111b at equal intervals. The plurality of clamps 111 b can be moved in the vertical direction by the belt transfer v 112 a '. 2247-8848-PF; Ahddub 15 200804839 Vertical handling device HI, you Panyu ΟΛη TST 日士 + Tian from the loading part 300 supply test carrier disk ¥, hunting by the clamp 111] b will be tested under the state, cost - The fixed time gate = the carrier is maintained in a horizontal position, ._ ^, and drops. During this time, thermal pressure is applied to the plurality of ic elements carried on the test carrier TST. In each of the clamps inb of the (4) m transporting device (1), it is possible to maintain the test carrier T lamp in the γ-axis direction in two rows. And the 'impingement chamber 110, as shown in FIG. 8 , is further provided with an ejection device 112 ′ which can face the second and lowermost test test trays TST of the vertical movement of the dream unit 1 彳 1 μ transport device 111 The test chamber 12 is pushed out on the side. In the middle of the τ^=Γ20, the test head 5 is provided at the central portion thereof, and the test carrier TST is carried to the test head 5, and is carried on the test socket 50 of the test carrier 5 to be pushed onto the test socket 50 of the test head 5 The input/output of the component is electrically contacted with the contact pin of the test socket 50 to perform the measurement of the Μ component. In the present embodiment, as shown in FIG. 3, the test chamber 12 is tested along the carrier tray TST substantially The test section 12, the direction in which the direction of the entrance direction of the V-bearing disk ST (X-axis direction) intersects vertically 廿媸9 > ^ The depth direction of the V-stack 1 is side by side, and the test carrier is to be tested The TST is arranged in two rows along the direction parallel to the X-axis direction of the disk. In the state where the test receiving tray TST is arranged in 2 rows and 2 columns, the 仃 element carried on the four test carriers can be pushed to the test at the same time. The head of the head 5 is on the 5D. Further, regarding the arrangement of the test-carrying tray TST in the test chamber 120, the present invention is not particularly limited to 2 columns and 2 columns in the */month, but only the integers above and 2 is an integer. 2 rows, n columns, 3 rows or more, or 3 columns or more can be 2247-8848-PF; Ahddub 16 200804839 For convenience of description, in the present embodiment, in the test room 120, test carriers arranged in 1 row and 1 column The disk is the first test carrier TST!, in the test room 120, the test carrier disposed in the row 2 is the second test carrier TST2, and the test room is 12" The test carrier of the two columns is the third test carrier TST "in the test room 12", the test carrier disposed in the 2 #1 column is the fourth test carrier TST4. As described above, along with The four test carriers tst can be arranged in two rows and two columns in the test chamber 120. In the present embodiment, the first to fourth contact portions 51 to 54 are provided on the test head 5. The first contact portion 51 and The first test carrier TSTi is oppositely disposed on the test head 5, and the second contact portion 52 is disposed on the test head 5 opposite to the second test carrier disk muscle. The third contact portion 53 is disposed on the test head 5 opposite to the third test carrier tray tst3, and the fourth contact portion 54 is disposed on the test head 5 opposite to the first measurement: the carrier tray TST4. • 1st to 4th contacts The portions 51 to 54 are each composed of an assembly of the same number (64) of test pieces f of the 1C elements carried by the opposing test devices TST1 to TST4. In the test room 120, as shown in Figs. 8A and 8B As shown, the z-axis driving device is configured to push the Ic components carried on the test carrier TST to the test socket 50 of the contact portion 5; the first to the fourth carrier trays are mounted ^ 140 to 160 It is used to carry the test carrier TST into and out. Moreover, the μ 4 carrier tray handling device is hidden in the ith carrier tray handling in the 8th drawing: behind the 140, and hidden in the 3rd carrier tray handling ^ 2247-8848~PF in the 8B diagram; Ahddub 17 200804839 160 The back of the picture is therefore not shown in either figure. The Z-axis driving device 130 is configured by the following, and is disposed above the contact portion 5. The driving shaft 131 that can be privately moved in the Z-axis direction by an actuator not specifically shown in the drawing is supported by the driving shaft 丨The drive plate 132 at the lower end of the 31; the i-th to fourth pusher groups 133 to 135 mounted on the lower surface of the drive plate 132; and the j-th to fourth connection elements 136 138 mounted on the lower surface of the drive plate 132. Further, the fourth pusher group and the fourth connecting element are hidden behind the first pusher group and the ith connecting element in the eighth figure, and are hidden in the third pusher group and the third connecting member in FIG. 8B. In the following, therefore, the β first pusher group 133' is not shown in both figures in order to simultaneously push the 64 ic elements carried on the "test bearing A Jrct Ύ γλ -.. - - X ^ ΙΟΙ to the jth Each of the test sockets π of the contact portion 5i is disposed opposite the first contact portion 51 of the test head 5 on the lower surface of the drive plate 132. The pusher group 133 is composed of an assembly of pushers for contact push; the upper portion of the IC 70 has the same number of (1 in the present embodiment) 1C of the 1C bulls carried on the test carrier TST. . 136, four first connecting elements are provided around the two-pusher group 133, and the first upper-stage transfer belt 141, which will be described later, is coupled to push the first carrier-carrying device 14''' to push down. The bottom below stands out. The 1st-element 136 of the Tsi from the driver board 132 is similar to the R4 & group 134 of the Tsi in order to be carried under the second test carrier. ¥ gh ' 邛 52 is oppositely disposed on the drive board 1 32 The 2 pusher group 134 is included in the same number as the 1C τ pieces carried on the test carrier TST2 2247~8848~PF; Ahdclub 18 200804839 (in this embodiment In the vicinity of the second pusher group 134, four second link elements 137' are connected to the second upper transfer belt 151, which will be described later, to = The carrier transport device 150 is pushed down. Each of the second connecting elements 137 protrudes downward from the lower surface of the drive plate 132. Further, compared with the downward push amount of the first carrier transport device 140 or the fourth carrier # transport device, Z is When the amount of pushing down of the air carrier transporting device 15A when the shaft driving device 130 is pressed is relatively small, the second connecting member m is relatively opposed to the seventh connecting member 136 or the fourth connecting member (not shown). In the case of the short TST: the same as the group 135, in order to push the 64 1U pieces carried in the 3rd test loader 2 to the test 2 of the 3rd contact part 53, the 3rd of the 2nd head 5 The contact portion 53 is opposed to the IC driver group 135 provided for driving, and is included and carried on the test carrier TST3 at 苐3 Is group I "in mm, +, Free shrouded third coupling element 4 brother 3 ~ 161 connecting the upper conveyor for pushing the bearer disc 3 under conveyance device 160. Each mth ‘ 乂 弟 3 3 3 3 3 3 3 3 3 3 3 3 3 The connecting member 138 is the same as the push-down device of the first carrier-carrying device 140 or the fourth carrier-carrying device, as in the case of the drive plate 132 and the second brother-in-law. The thrust of the 3rd 3rd carrier-carrying device 16〇 at the time of 130 presses 2247-8848-PF; Ahddub 19 200804839 is smaller, therefore, compared to the first element i36 or the figure) The joining element 138 is relatively short. Even 4 pieces (not the 4th pusher group, although not specifically shown, the fi/1 plus on the 4th test carrier τςτ, and the 64 IC components that will be the water warfare TST At the same time, the test seats of the pusher portion are called the Xue I and the fourth contact portion of the test head 5 opposite to the movable plate 132. The fourth push and write ΤςΤ & Tr - 1 The same number (in this embodiment, 64) pusher assembly of the pusher is used to test the core of the carrier.

Although not specifically illustrated, four fourth connecting elements are provided around the fourth pusher group, which are coupled to a fourth upper conveyor belt (not shown), which will be described later, for pushing the fourth carrier transporting device. under. Each of the fourth connecting elements protrudes downward from the lower surface of the drive plate 132. The first carrier-carrying device 140, as shown in the first and eighth views, is composed of the first upper-stage conveyor belt 141 and the first lower-stage conveyor belt 143 for horizontally transporting the test carrier tray TST in the test chamber 120; 141, 143 A third support member 145 that allows it to move up and down: The first upper transfer belt 141 is provided for placing one line from the lower second stage in the vertical transport device 111! The column of test carriers TST is transported into the test chamber 120. On the other hand, the first lower stage conveyor belt 143 is provided for transporting the test carrier tray TST located in the first row and the first row of the vertical conveyance device 111 to the test chamber 120. As shown in FIGS. 8A and 8B, the first upper conveyor belt 141 and the first lower conveyor belt 143 are each provided, for example, to support both sides of the test carrier TST 20 2247-8848-PF; Ahddub 200804839 r • one of the belt conveyor belts Constructed.料士条# . W偁成. The interval between the pair of belt conveyors allows the first contact portion 51 to pass. As shown in Fig. 8A, on the 〗 〖i i; L Qu,,, Mule 1 on the slave pass 141, there is a stop to fast 1 42 'to make the 笫 μ μ μ μ 、,,, brother 1 The test carrier TST carried by the slave slave gong 141 stops. The stop II 142 includes a cylinder or the like that can expand and contract in the γ-axis direction. Moreover, in the case where the test carrier tray TST is stopped on the ith upper belt ΐ4ΐ, the cylinder is extended to allow the stopper 142 to be positioned on the conveyor belt, and in the case where the test carrier tray TST is passed through the ith upper belt 141, the cylinder Shrinking causes the stopper 142 to retreat from the conveyor belt. / 1st upper section conveyor belt 141 and the first! The lower stage conveyor belt 143 is fixed by the first coupling member 144. Since the first connecting element 144 cannot be shrunk, the first upper stage conveyor belt 141 and the first! Between the lower conveyor belts 143, an interval through which the test carrier tray TST can pass is formed. The Jth conveyor belts 141 and 143' integrated by the first coupling element 144 are supported by the first support member 145 and are movable in the vertical direction. The first support member 145 is constituted by, for example, a coil spring. When the first conveyor belts 141 and 143 are pushed downward by the z-axis driving device 130, the i-th support member 145 is contracted and released by the Z-axis driving device 130. The first support member 145 returns the first conveyor belts i 41, 143 to their original positions by their elasticity. The second carrier-carrying device 15 is also composed of a second upper cymbal, a **, a second feeding belt 151 and a second lower conveying belt 152 for horizontally transporting the test carrier TST in the test chamber 120. Support these conveyor belts 15] 丄it) Z to make 2247-8848-PF; Ahddub 21 200804839 The second support member 155 which can move up and down. The second upper conveyance belt 151 is provided to further move the test carrier tray tst conveyed by the first upper conveyance belt 141 of the first pallet conveyance device 140 toward the impact-to-170 side, and the test carrier tray TST is sent to the impact chamber 170. The position of the j-row and one-column in the second vertical conveyance device from the lower side. In contrast to the '帛2 lower section conveyor belt 152 is set to be used by the first! Carrier tray handling f 140! The test carrier tray TST carried by the lower conveyor belt 143 is moved further toward the impact chamber 7 and the test carrier TST is transported to the impact chamber side! The position of the first row and the first column of the lowermost section of the 7G vertical transport device. As shown in Fig. 8, the second lower stage conveyor 153 is used to stop the second lower stage conveyor tray TST. As shown in Figs. 8A and 8B, the second upper conveyor belt 151 and the second lower conveyor belt 152 are each constituted by, for example, a belt conveyor belt which is provided to support both sides of the test carrier m. As shown in Figs. 8B and (10), the "interval between the π readings π" allows the second contact portion 52 to pass.

On the 152, a test bearing for stopping the transport is provided. The stopper 15 13 has a cylinder that can expand and contract in the Y-axis direction of ν & Further, in the case where the test carrier TST is stopped 1 and the lower conveyor belt 152 is stopped, the cylinder is extended and the stop is stopped at 153 on the conveyor belt, and the test carrier TST is passed through the second lower section. In the case of the tributary 152, the cylinder contraction causes the stopper 153 to retreat from the conveyor. The second upper section of the conveyor belt 151 and the second ^ slave belt 15 2 by the second company 2247-8848-PF; Ahddub 22 200804839

The knot element 154 is fixed. Since the second connecting member 丨 54 I is contracted, the interval between the second upper transfer belt 151 and the second lower transfer belt 152 is such that the test carrier TST can pass. The second conveyors 151 and 152', which are integrated by the second connecting member 154, are supported by the second supporting member 155 and are movable along the upper and lower sides. The second supporting member 15 5 is constituted by, for example, a coil spring. When the z-axis driving device 130 pushes the second conveyor belts 151 and 152 downward, the second supporting member 155 contracts and is pushed by the Z-axis driving device 13 When released, the second _ support member I55 returns the second conveyors ι 51, 152 to the original position by their elasticity. The 帛3 carrier tray conveying device 16A basically has the same configuration as the second carrier tray conveying device 150, and the third upper conveying belt 16 is the third lower conveying belt 162, the stopper (not shown), and the third coupling member. The 164 and the younger 3 support components 16 5 are constructed. The first 3 upper conveyor belt 16 is provided for moving the test carrier tray TST carried by the fourth upper conveyor belt of the fourth carrier transporting device φ toward the 'shock chamber side 170, and sending the test carrier tray TST to the impact chamber The position of the 2nd row and the i column of the second segment from the lower vertical conveyance device. On the other hand, the third lower stage conveyor belt 162 is provided to further move the test carrier tray tst conveyed by the fourth lower stage conveyor of the fourth carrier to the impact chamber side 17〇, and the test carrier tray is taken. The position of the lowermost row of 2 rows and 1 column in the vertical conveying device of the impact chamber side 170 is removed. , the third upper conveyor belt 161 and the third lower conveyor belt 162 are, for example, 2247-8848-PF; Ahddub 23 200804839 ~ both sides of the fTST - the belt conveyor belt - ▼ the interval between the tribute, such as The 8B and 1 〇β maps are such that the third contact portion 53 can pass. The stopper 153 of the tray-carrying device 150 is not specifically -2, although: on the third lower-stage conveyor belt 162, a stopper is provided for stopping the test carrier tray TST carried by the conveyor belt 162. . The third upper conveyor belt 161 and the third lower conveyor belt 162 are fixed by the third link 164. Since the third joining member 164 cannot be shrunk, the space between which the test bearing #TST can pass is formed. The third conveyor (8) and the detachment, which are formed by the third connecting member 164, are supported by the third supporting member #165 and can be moved in the vertical direction. Although not specifically illustrated, the fourth carrier-carrying device basically has the same configuration as the first carrier-carrying device 14, and the fourth upper-stage conveyor, the stopper, the fourth lower-stage conveyor, the 帛4 connecting member, and the fourth Support component composition. φ 4th upper conveyor belt, set to be used in the vertical handling device U1

The test carrier tray tst of the second row and the first column of the second paragraph is transported to the test chamber 120. In contrast, the fourth lower stage conveyor belt is provided for transporting the test carrier tray TST located in the second row and the first row of the lowermost stage of the vertical transport device 111 into the test chamber 120. The upper conveyor belt 4 and the fourth lower conveyor belt are each constituted by, for example, one of the side portions of the test carrier tray TST. The interval between the pair of belt conveyors enables the fourth contact portion 5 to pass through 2247-8848-PF; Ahddub 24 200804839 ? 0: the stopper i42 of the first carrier tray handling device 140 - on the slave conveyor belt , with a stop test test carrier m stop. The fourth upper conveyor belt and the lower portion of the lower belt conveyed by the transfer belt are fixed by the fourth joint element by the same -i ^. Since the fourth connecting element has no fineness, the test carrier tray TST formed between the beans can be separated by /, ^. The fourth conveyor belt integrated by the fourth connecting element is supported by the first printing fork 70 and can be moved in the vertical direction. The vertical impact device is also provided in the impact chamber 170, which is constructed in the same manner as the vertical transport device (1) which is in the vicinity of the impact t 1Η. The vertical transport device moves the plurality of jobs « TST sequentially, (4) pressure from κ Component removal. In the de-impact i Ϊ 70, in the case where the element is subjected to two-temperature heat pressure in the impact chamber 11A, the air is cooled by the air supply 1 (the element is returned to the room and the temperature is warmed. When a low temperature is applied to the impact chamber no, the IC element is returned to the unloading unit 4A by heating the IC element to a temperature at which no condensed water is generated by warm air or a heater, etc. The impact chamber 110 is carried out. And the impact chamber 170 is disposed to protrude above the test chamber 12A. In the upper portion of the impact chamber 11A, an inlet for carrying the test carrier TST from the device base 101 is formed. Similarly, in the impact chamber 17〇 The upper portion forms an outlet for carrying the test carrier TST out to the device base 101. Moreover, as shown in Fig. 2, on the device base 1〇1, a carrier tray handling device 102 is provided for transmitting the inlets and outlets. The test carrier 2247-8848-PF; Ahddub 25 200804839 -tst is taken in and out from the empty chamber portion 1. For example, the carrier tray handling device ι 2 is constituted by a rotary roller or the like. 2. The test carrier TST carried out from the impact chamber 170, The unloading unit 4〇〇 and the load L unit 300 are returned to the impact chamber. In the present embodiment, one load carrier TST to the empty chamber portion 1〇〇 is loaded from the loading unit 300 each time, and each The test tray TST is unloaded from the empty chamber portion 1 to the unloading portion 4A. The empty chamber portion 100 configured as described above is accumulated in the vertical conveyance device U1 from the state shown in Figs. The two test drive trays TST in the lower 帛2 segment and the two test carrier trays TST accumulated in the lowermost stage are pushed to the test chamber 120 side by the ejection device 112. As shown in the figures 9A and 9B, the vertical position is shown. The test carrier TST of the first row of the second stage from the lower side of the transport device I is entered into the test chamber 120 by the second upper conveyor belt 141, and the second upper conveyor belt 141 is stopped by the stopper 142. The test tray TSTi is placed between the first contact portion 51 and the first pusher group 133. The test tray TST' of the first row and the first row of the vertical conveyance device m is used. The ith lower conveyor belt 143 enters the test chamber 12A and is further moved by the second lower conveyor belt 152. On the side of the impact chamber, the second lower conveyor belt 15 is stopped by the stopper 15 3 and is located between the second contact portion 52 and the second pusher group 134 as the second test carrier TSTz. The test tray TST of the second row of the lowermost section of the device n1 enters the test chamber 12〇 by the fourth lower conveyor belt: and further moves to the impact chamber j 26 2247-8848 by the third lower conveyor belt 162 The -PF; Ahddub 200804839 side is stopped by the third lower stage conveyor 162 by the stopper, and is located between the third contact portion 53 and the third pusher group 135 as the third test carrier TST3. The test carrier m of the second row and the i column located in the second stage from the lower side of the vertical conveying device ln enters the test chamber (10) by the fourth upper conveyor belt, and stops on the fourth upper conveyor belt by the stopper. As the fourth test carrier TST4, it is located between the fourth contact portion 54 and the fourth pusher group. 〇

Then, as shown in the figure (10), the z-axis driving device 130 is driven by the white drive shaft 131. The driving plate 132 is moved below the z-axis, and the i-th pushes the pushers of the group 13 3 respectively. The cutter J is in contact with the IC component held on the first test carrier tsi, and each of the Ic components is pushed to the respective test sockets 50 of the contact portion 51, so that the output of each ic component is input into ^^. ^ 5 feet of each scorpion is connected to the foot. At the same time, each of the pushers of the second pusher group 134 is held by the second (fourth) test load TST2±1 (: element contact, and each piece is pushed to each test stand 5 of the second contact part 52, Each of the ic: input terminals and the contact pins of the test sockets 50 are electrically contacted. Then, 1 on the m_«TST3 (: element contact, == to the test seats 5 of the third contact portion 53, so that '兀The bearing of the L 7G piece and the contact pin of each test stand 50 are electrically contacted. 1 'The respective 1C elements are pushed and held respectively. Similarly, the test carrier of each pusher 4 of the 4th pusher group Ic component contact on TS1%, 27 2247-8848-PF; Ahddub 200804839 The test terminals 5〇 of the fourth contact portion 54 of the turn-in terminal of the IC component are electrically contacted with the contact pins of each test socket 50. In the above, 64 pieces are carried on each test carrier TST. Therefore, in this embodiment, the test/remaining test of the total number of IC components carried on the plurality of carrier disks TST1 to T4 can be simultaneously performed. As shown in Fig. 10A and Fig. 10β, the length of the component H7 M u is not compared with the length of the second connecting member (3) and the 苐3 connecting member 138.

: The length of the fourth connecting element is relatively long, so that it can be pushed at the same time; the IG elements of the test carrying trays TSTi and 47 of the 〗 VII of the upper section of the conveyor belt are held on the conveyor belt of the lower stage 2 And the third (four) test of the «grab and grasp the bearing (four) components.

The test result of the IC component is, for example, based on the address attached to the test carrier TST = the other number ' and the number of the specified component in the test carrier m' (4) in the storage device in which the electronic component is placed. The test of the tJIC component is completed. As shown in Fig. 11, the Z-axis driving device 130 is raised, and the first bit is sprinkled!仫 仫 141 141 and the second upper conveyor belt 151 _ = test carrier TSTl' is sent to the vertical handling device of the impact chamber m from the next paragraph! Row! Column. The second test carrier tst2 is transported by the second lower conveyor belt 152, and sent to the first #11 column of the lowermost stage of the strike S 170. The first slave transfer ▼ 162 carries the third test carrier TST3 and sends it to the second row of the lowermost stage of the impact chamber 170. From the fourth upper conveyor belt and the third trial carrier TST4, to the upper chamber of the impact chamber, the conveyor belt 1 61 carries the fourth inspection 170 in the vertical handling device from the bottom 28 2247-8848-PF; Ahddub 200804839 column IX line 2 segment 2 The fourth test bearing trays TSTi to m4 are carried out to the unloading portion 4GQe after removing the heat pressure in the impact chamber i7, and transporting one test carrier TST to the unloading portion 4 from the impact chamber m at a time ( ^ As described above, in the present embodiment, as shown in FIG. 12, 'the two test carriers tst!, tst4 of the second stage from the lower side of the vertical conveyance 奘罟in & It is transported to the position of the test chamber 12 () column. At the same time, it will accumulate in the lowermost section of the vertical transport device m:; test test tray TST" TST3 is transported to the test chamber 12, i row 2 rows and 2 rows and 2 columns. Further, after the type 5 is tested, the i-th and fourth test carriers TSUSh are transported to the second stage below the vertical transport device of the impact chamber 17G. At the same time, the second and third test carriers TST2, TST3 are vertically moved. The lowermost section of the handling device. Fig. 13 is a view showing an electronic element according to a second embodiment of the present invention. Test equipment

A schematic cross-sectional view of the handling sequence of the test carrier in the empty chamber portion, and the U-shaped diagram shows the empty chamber of the electronic test device of the third example of the invention according to the third aspect of the present invention. A schematic cross-sectional view of the transport sequence of the test carrier in the section. In the present invention, it is not limited to the above-described conveyance order. For example, the second to fourth carrier trays TSTi to TST4 may be conveyed according to the conveyance (10) of the 13th or 14th sheet. In the example shown in the figure of Fig. 13, accumulated in the impact chamber. The two test carriers TSTi and TST4 at the lowermost stage of the 11-inch vertical transport device 111 are transported to the 1st row, 1 row and 2 rows of the test room 120! The position of the column. At the same time, it will be accumulated in 2247-8848-PF; Ahddub 29 200804839, and the two test carriers TST2, TST3 in the second stage from the lower side of the conveying device 111 are transported to the position of one row, two columns and two rows and two columns of the test chamber 120. Further, after the test, the first and fourth test carriers TST! and TST4 are transported to the lowermost portion of the vertical transport device of the impact chamber 170. At the same time, the second and third test carriers TST2, TST3 are transported to the second stage from below the vertical transport device of the impact chamber 170. In the example shown in Fig. 14, the two test carriers TST! and TST4 of the lowermost stage of the vertical conveyance device 111 accumulated in the impact chamber are transported to the test chamber 12 0 1 column and the 2 row 1 column. position. At the same time, the two test carriers TST2, TST3 accumulated in the second stage below the vertical conveyance device 111 are transported to the position of the test chamber 120 in one row and two columns and two rows and two columns. Further, after the test, the first and fourth test carriers TSTi and TST4 are transported to the second stage below the vertical conveyance device of the impact chamber 170. At the same time, the second and third test carriers TST2, TST3 are transported to the lowermost portion of the vertical transport device of the impact chamber i7〇. Fig. 15 is a conceptual diagram showing the processing of the carrier tray of the electronic component testing apparatus according to the fourth embodiment of the present invention. In the first embodiment, in the test chamber 120, the four test carriers TSTi to TST4 are disposed, but the present invention is not limited thereto. For example, as shown in Fig. 15, the two test carriers TST which are arranged side by side in the Y-axis direction may be mechanically coupled to the impact chamber 110, the test chamber 120, and the impact chamber 170. The configuration ' between the connection test carriers TST' may be, for example, the example shown in Fig. 16 or 17. 2247-8848-PF; Ahddub 30 200804839 The example shown in Fig. 16 is such that a convex portion 20 is formed on the side of one of the test carriers tst, and on the side of the other test carrier tray tst, corresponding to The concave portion 21 of the shape of the convex portion 20 is coupled to the test portion TST by inserting the convex portion 20 into the concave portion 21 and engaging with each other. In the example shown in Fig. 17, on the side of the test carrier tray tst Each of the segments 22, 23 is formed, a protruding projection 22a is formed in the segment portion 22 of one of the test carriers TST, and a hole corresponding to the shape of the projection 22a is formed on the segment portion 23 of the other test carrier TST. 2, for example, by inserting the protrusions 22a into the holes 23a, the segments 22, 23 are overlapped with each other, and the test carriers TST are connected to each other. Fig. 18 is a perspective view showing the conveyance path of the test carrier in the impact chamber of the electronic component testing apparatus according to the fifth embodiment of the present invention. In the first embodiment, in the vertical conveyance device m of the impact chamber 11A, the test carrier is configured to be 2 frames in all the segments from the uppermost portion to the lowermost portion, but the present invention does not Limited. For example, if the second image and the lowermost segment are only the bottom, the test carrier is configured as 2 rows! If the third paragraph is below the column, it is configured as a test carrier. Or, although not specifically illustrated, only the test carrier TST is configured to be 2 rows and 1 column in the lowermost segment, and the test carrier TST may be configured in more than 2 segments. [Unloading Unit 400] In the embodiment φ, + ^ # of the present invention, the unloading unit 400 is also provided with two component transporting units 2247 having the same structure as the component transporting unit 304 provided in the loading unit 300. -8848-PF; Ahddub 31 200804839. Set 404, by the component handling device 404, the (4) unloading (4) 4_ test carrier tray tst moves the tested IC component to the guest carrier disk KST corresponding to the setting result. As shown in Fig. 2, the two sets of the pair of window portions 4〇6 are formed on the device base 1〇1 of the p-loading unit 4〇〇, and are transported from the storage unit to the passenger carrying tray kst of the unloading unit. The visible way is configured on the device base ι〇ι. Further, although the illustration is omitted, the lower side of each window portion is provided with an elevating table for elevating and lowering the passenger carrying tray KST, whereby the carrier carrying the component after the full load of the displacement is carried. The disk KST is lowered, and the fully loaded carrier is transported to the carrier transfer arm 2 Q 5. Further, the above-described embodiments are described for making it easy to understand, and the description is not intended to limit the present invention. Therefore, each element of the above-mentioned embodiment includes all the more or equal items belonging to the technical field of the present invention. D|, for example, 'in the above implementation, (4) testing with electronic components. Testing the carrier to the level The case of the type of posture execution test will be described, but the present invention is not particularly useful, and is also applicable to an electronic component test device of a type that tests a vertical vertical load. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing an electronic device according to the first embodiment of the present invention. The first perspective view shows the electronic component test fixture 2247-B848-PF of the first embodiment according to the present invention; Ahddub 32 200804839 3 shows the carrier tray according to the first embodiment of the present invention. Conceptual diagram of the processing. Fig. 4 shows an exploded perspective view of the 1C layer of the electronic component test apparatus using the τγα yarn of the present invention. Fig. 5 is an exploded perspective view showing the passenger carrying tray using the electronic device of the first embodiment of the present invention. H-type mounting Fig. 6 is an exploded perspective view showing the test carrier disk using the electronic component of the i-th embodiment of the present invention. ^

Fig. 7 is a side elevational view showing the vertical transporting device provided in the impact chamber of the electronic component testing apparatus according to the jth embodiment of the present invention. " Fig. 8A shows the second embodiment of the electronic component testing apparatus according to the i-th embodiment of the present invention.剖面 Sectional view, before the test carrier is supplied to the test room = not intended. Fig. 8B shows a cross-sectional view taken along line VIIIB-VniB of Fig. 8A. Fig. 9 is a cross-sectional view showing the empty chamber portion of the electronic component test apparatus according to the second embodiment of the present invention, to which the test carrier is supplied to the test chamber. Fig. 9B is a cross-sectional view showing the ιχβ-πβ line along the ninth. Fig. 10A is a cross-sectional view showing the empty chamber portion of the electronic component testing apparatus according to the first embodiment of the present invention, showing the state in which the IC component is pushed to the test head. Fig. 10B shows a cross-sectional view taken along line XB-XB of Fig. 10A. Fig. 11 is a cross-sectional view showing the empty chamber portion of the electronic component testing apparatus according to the first embodiment of the present invention, 2247-8848^PF of the state in which the test carrier is carried out from the test chamber; Ahddub 33 200804839. Fig. 12 is a schematic cross-sectional view showing the transport procedure of the test carrier in the empty chamber portion of the electronic component test I according to the first embodiment of the present invention. Fig. 13 is a schematic cross-sectional view showing the procedure of transporting the electronic component in accordance with the second embodiment of the present invention and the transporting procedure of the type 5 carrying tray in P. Fig. 14 is a schematic cross-sectional view showing the transport procedure of the test carrier in the empty chamber portion of the electronic component test f according to the third embodiment of the present invention. Fig. 15 is a conceptual view showing the processing of the carrier of the electronic component in accordance with the fourth embodiment of the present invention. '襄 Fig. 16 is a plan view showing an example of the connection structure between the test carriers in the fourth embodiment of the present invention. Fig. 17 is a perspective view showing another example of the connection structure between the test carriers in the fourth embodiment of the present invention. Fig. 18 is a perspective view showing the conveyance path of the impact-to-medium test carrier of the electronic component testing apparatus according to the fifth embodiment of the present invention. Description of the components: 1 processor; 100 empty chamber; 110 impact chamber; 111 vertical handling device; 112 ejection device; 120 test chamber; 130 Z-axis drive; 140 first carrier handling device; 141 1st upper conveyor belt; 145 1st support element; 143 1st lower section conveyor belt; 170 de-impact chamber; 150 2nd carrier tray handling device; 2247-8848-PF; Ahddub 34 200804839 200 storage section; 160 3rd carrier tray Handling device; 300 loading section; 400 unloading section; 5 test head; 50 test socket; 6 test device; 51~54 1st to 4th contact; KST passenger carrier; TST test carrier. 2247-8848-PF; Ahddub 35

Claims (1)

200804839 φ. X. Patent application scope: 1. An electronic s-piece testing device, comprising a testing portion, which enables the electronic component to be tested to contact the test head while the electronic component to be tested is carried on the test carrier. Electrically contacting to perform the test of the tested electronic component, (4) m, when the test carrier is side by side in a direction perpendicular to the direction in which the test carrier is perpendicularly intersected in the test portion, and the test carrier is along the edge The n-column is arranged side by side substantially parallel to the direction of progress, and the test electronic component carried on the test carrier is contacted with the test carrier in a state of m rows and n columns. Electrical contact, Χ where m is an integer of 1 or more, and 11 is an integer of 2 or more. 2. The electronic component testing device according to item i of the patent application scope has a 3% addition, which applies a specific temperature of thermal pressure to the quilt under the condition that the electronic component to be tested is carried on the test carrier. Testing the electronic component, φ the application portion has a first moving device that parallels the test carrier disk in a direction substantially perpendicular to the direction of the direction of intersection, and the test carrier disk is substantially along the direction of progress Parallel directions side by side, will be configured as! The (mxl) test trays of the 1 row i column are moved in the direction of the near side of the test portion. 3. The electronic component testing device according to claim 2, wherein the first moving device positions the (mxl) test carriers along the near side of the test portion side by side at intervals of n intervals Move in order. 4. The electronic component testing device described in claim 3, 2247-8848-PF; Ahddub 36 200804839 has the first transporting device, and the clothing is placed side by side in the first mobile device. The (mxl) test carrier of the P segment of the e-section is transferred to the test section, and the p-column or (n+1 -p) in the configuration of the n-column is set. Column, where p is an integer greater than or equal to 1 and less than or equal to n. 2*5. The electronic component testing device according to claim 4, wherein the swallowing device is disposed side by side (mxn) of the first to nth segments from the first moving device in the vicinity of the test portion The test carrier trays are transported to the test portion substantially simultaneously. The electronic component testing device according to any one of claims 1 to 5, further comprising a removing portion, wherein the electronic component to be tested is carried on the test carrier, the hot star force Removed from the tested electronic component, the private portion includes a second mobile device that parallels the test carrier in a direction substantially perpendicular to the direction of the direction of intersection, and the measured " The discs are arranged side by side in a direction parallel to the direction of progress in the real f, and (mxl) of the test carriers arranged in the array are moved in the direction of the far side of the test portion. The electronic component engraving device of claim 6, wherein the second mobile device places the (mxl) test carriers along the far side of the test portion side by side at intervals of n intervals In the state of the order to move. 8. The electronic component testing device according to claim 7, comprising a second handling device that transports the q-column of the q-column disposed in the configuration of the n-row of the test portion. 'Making side by side q or (10)-q) adjacent to the test portion, where q is greater than or equal to the work and less than an integer specific to Γ2. The electronic component testing device of claim 8, wherein the second mobile device configures the test carrier in the m rows and n columns of the testing portion. The disk is transported to the second mobile device substantially simultaneously. 1 0. The electronic component test apparatus described in claim 6 of the patent application scope further includes a loading unit for carrying the tested electronic component on the test tray and carrying the test The disk is transported to the application portion; and the unloading portion receives the test carrier disk from the removal portion, and classifies the tested electronic component according to the test result, ^ the loading portion moves into the test carrier disk each time The applying portion, and the P-loading each of the humans < the removing portion carries out one of the test carriers. 2247-8848-PF/Ahddub 38