TW200823471A - Electronic component test equipment and method for conveying tray - Google Patents

Abstract

An electronic component test equipment (1) comprises a test section (120) for allowing an IC device to electrically touch a socket (52) provided in a high fix (51) attached to the upper portion of a test head (5) with the IC device mounted on a test tray (TST) in order to test the IC device. The test section (120) has a conveyor (124) for conveying the test tray (TST) in the horizontal direction, and a height adjuster (125) for varying the height of the conveyor (124) relative to the high fix (51).

Description

200823471 IX. Description of the Invention: [Technical Fields of the Invention] This month, the electronic device is related to a plurality of electronic components (hereinafter also referred to as IC components) such as semiconductor integrated circuit components and a test interface. The contact portion is electrically contacted, and the electronic component test 4 for measuring the 1c7° member is placed, and the carrier for transporting the carrier in the electronic component testing device and the interface facing the interface is carried out. [Prior Art] In the manufacturing process of an electronic component such as a 1C component, an electronic component testing device is used in order to test the performance, function, and the like of the 1C component in the package completion state. In the carrier (Handle) constituting the electronic component testing device, a plurality of cymbal components are placed from a bracket for accommodating the 1C component before the test or the IC component after the test (hereinafter referred to as a customer tray). The test tray is transported to the carrier in a tray (hereinafter referred to as a test tray) that is circulated in the electronic component test device, and the IC component is placed in the test state while being stored in the test tray. The slot of the head of the head (hereinafter also referred to as the positioning portion) is electrically contacted, and the type 4 is tested on the body of the electronic component testing device (hereinafter referred to as a tester). Then, when the test is completed, each of the 1 (the component's measuring carriages) is carried out from the test head, and placed on the customer's tray according to the test results, thereby classifying the so-called good and defective products.

However, there are many types of slots provided on the positioning portion. For example, a type having a leaf spring-like contact as shown in Fig. 10A is known, such as the first 〇B 2247-9206-PF; Ahddub 5 200823471 - the spring pin (so-called P0G0 pin) is not used as a contact The type to use, etc. Further, as shown in Fig. 10C, there is a configuration in which a whole body is formed of a spring body, and a metal thin wire or gold powder embedded in the spring body is used as a contact. In the slot 52A shown in Fig. 10A, the degree of face from the upper surface of the positioning portion 51 to the upper portion of the slot 52A is referred to as the height jjA, which is the highest among the three slots. On the other hand, in the slot 52B shown in FIG. 10B, the height from the upper surface of the positioning portion 51 to the upper portion of the slot 52B is referred to as the height Hb, which is lower than the slot shown in the first ι Φ map. (Hb<Ha). Further, in the slot 52C shown in Fig. 10C, the height from the upper surface of the positioning portion 51 to the upper portion of the slot 52C is the height hc which is the lowest among the three slots. Thus, there are a wide variety of slot heights. Generally, the transport position L of the test tray TST transported to the positioning portion 51 is matched with the highest slot 52A, and is set to a fixed height H from the top of the positioning portion 52. . . Therefore, when the slot 52A is replaced with the other slots 52B, 52C, the interval between the test tray TST and the slots 52B, 52C is expanded to Sbi, Sci (refer to the ι〇β图 and the •, respectively) Figure). Therefore, the stroke required for the push member to push the 1C component toward the slot becomes longer. Therefore, the time required for the test of the ic component to the next Ic component can be started (hereinafter referred to as the index time). long. Also, as shown in Figures 10 to 10C, the IC component is pushed toward the test head.

The thickness of the pushers 122A to 122C of the slots 52A to 52C is inversely proportional to the height of the slots 52A to 52C. In other words, in the test using the slot 52 shown in Fig. 1, the thinnest pusher 122A is used, and the test is performed using the slot 52B shown in the first 〇β diagram. The pusher 2247-9206-PF having a medium thickness; Ahddub 6 200823471 122B, the thickest pusher 122C is used in the test conducted using the slot 52C shown in Fig. 。C. On the other hand, the waiting position of the pusher during the conveyance of the test tray TST to the positioning portion 52 is matched with the pusher 122c having the thickest thickness, and is set to a constant position. Therefore, the interval between the pusher and the test bracket becomes the narrowest SC2 in the case shown in Fig. 10c, whereas the case shown in Fig. 1A and Fig. 1B is the opposite. Next, it becomes a wider SA2, SB2. Therefore, the stroke required for the push member to push the 1C component becomes long, so that the index time is finally changed. [The present invention] The object of the present invention is to provide an electronic component test device and a carrier for shortening the index time. method. In order to achieve the above object, the present invention provides an electronic component test kit comprising a test portion that allows the test component to be placed on the test head while the test electronic component is mounted on the carrier. The contact portion of the face is electrically contacted to test the test of the electronic component, and the transfer device of the above-mentioned test portion having the VL荽~ _ ^ m σ in the direction of the test is movable and can be changed. The adjusting device for transporting the relative distance of the Μ relative to the interface surface (refer to the patent application scope (4). In the present invention, the first device is placed on the first side of the test portion, and the device is disposed. In the case of the relative distance between the % and the face, the contact is changed, and the contact is replaced, touched, and touched twice. In this case, the distance between the carrier and the face can be changed by the second adjustment device of 2247-9206-PF; Ahddub 200823471, so that the gap between the truss and the contact portion is the best. , thus shortening the indicator time In the above invention, although there is no particular limitation, it is preferable to apply a load and a load on the bracket, and apply a shoulder force m and a #w force to the above-mentioned test electronic component. The application unit has a second adjustment device for changing the distance between the loading device and at least a portion of the upper surface portion by the loading device and the loading device. Item 2). Where 'Use the second adjustment of the 軎 軎 μ 1Α ^, so that the distance of the loading device relative to the interface is matched with 箆 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Therefore, it is possible to carry out the transfer between the U and the transporting device. The U-mounting and the transporting device are smoothly carried out. Although the invention is not particularly limited, it is preferable that the electronic component to be tested is mounted on the carrier. In the state of the above-mentioned test electronic component, the thermal stress is removed; the removal portion has a carry-out device for carrying out the tray from the test portion, and the carry-out device can be changed in accordance with the conveyance change. And a third adjusting device for the distance between the device and the at least one portion of the face portion (application number (4). For the 'using the third adjusting device', the carrying device is matched with the distance The relative distance between the transfer device and the transfer device can be transferred between the transfer device and the carry-out device: 托架 The transfer of the cradle. In order to achieve the above object, the present invention provides an electronic component, including a test portion. The test unit performs electronic contact between the test electronic component and the contact portion disposed on the interface of the test head by mounting the electronic component under test in the holder of the bracket = 2247-9206-PF; Ahddub 8 200823471 - In the test of the electronic component to be tested, wherein the test portion has a pressing portion on the electronic component to be tested in a state of being mounted on the carrier to push the electronic component to be tested The pressing means of the contact portion and the fourth adjusting means for changing the relative distance of the pressing portion with respect to the dielectric surface (refer to item 4 of the patent application). In the present invention, the fourth adjusting means is provided on the test portion, whereby the fourth adjusting means changes the relative distance of the pressing means with respect to the face portion. Thereby, even when the contact portion is replaced and the height of the contact portion is changed as the type of the electronic component to be tested is changed, the distance of the pressing device relative to the face portion can be changed by the fourth adjusting device. So that the interval between the pusher and the bracket is the shortest, so the index time can be shortened. In order to achieve the above object, the present invention provides a method for transporting a carrier, wherein the test electronic component Φ is electrically contacted with a contact portion provided on a face portion of the test head in a state in which the test electronic component is mounted on the carrier. In the electronic component testing device for testing the electronic component to be tested, the carrier is transported by the transport device to face the interface, wherein when the height of the contact portion changes, the transport device is relatively The relative distance to the above-mentioned face is also changed (patent item 5). In the present description, when the height of the contact portion changes, the relative distance of the carrying device relative to the face portion also changes. Therefore, even if the contact portion is replaced and the contact portion is changed as the type of the tested electronic component is changed, the transfer device can be changed with respect to the interface 9 2247-9206-PF; The distance between Ahddub 200823471 is an indicator time between the bracket and the contact. a, the interval is the shortest, so that although it is not particularly special in the above invention, it is preferable that the structure is such that when the height of the contact portion changes, the relative position of the conveying device with respect to the face portion is The distance is also the shortest distance between the bracket and the contact portion, which is the same as the distance between the brackets (the sixth item of the patent range). In the above invention, there is no particular limitation or limitation, but it is preferable in structure that when the height of the contact portion becomes low, the relative distance of the upper worker transporting device with respect to the above-mentioned face portion becomes short (patent pending) Item 7).

In the above invention, although there is no particular limitation, the structure is preferably such that when the height of the contact portion becomes higher, the relative distance between the upper surface and the medium surface is longer (application) Article 8 of the patent scope). In the above invention, although there is no particular limitation, the test portion preferably has a pressing portion for hunting the test electronic component under the condition of being pressed on the d-wood mounted on the bracket. a pressing device for pushing the electronic component to be tested to the contact portion; and when a height of the contact portion changes, a relative distance of the pressing portion with respect to the interface portion is also changed (Japanese Patent Application No. 9) ). In the present invention, when the height of the contact portion changes, the relative distance of the pressing portion with respect to the face portion also changes. Therefore, even when the contact portion is replaced and the height of the contact portion is changed as the type of the β-type electronic component is changed, the pusher and the pusher can be changed by changing the distance of the pressing portion from the face portion. The interval between the brackets is the shortest, thus shortening the indicator time. 2247-9206-PF; Ahddub 10 200823471 Although there is no particular limitation in the above invention, it is preferable in structure that when the southness of the contact changes, the relative distance of the pressing portion with respect to the face portion also changes. As a result, the relative distance between the pressing portion and the bracket is the shortest (the tenth item of the application range). In the above invention, although it is not particularly limited, it is preferable in structure to be the above contact. When the southness of the crucible becomes low, the relative distance of the pressing portion with respect to the interfacial portion becomes short (the patent application section). In the above invention, although it is not particularly limited, it is preferable that the relative distance of the pressing portion with respect to the dielectric surface becomes longer when the height of the contact portion becomes higher (Patent Patent Application No. 2) . [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing an electronic component test _i according to an embodiment of the present invention. FIG. 3 is a view showing an embodiment of the present invention. A conceptual diagram of a transfer carriage in an electronic component test device. Further, Fig. 3 is a view for explaining a method of transporting a carriage in the electronic component testing apparatus of the present embodiment, and also has a portion in which the elements are juxtaposed in the lower 2 direction by a + surface. Therefore, regarding the mechanical structure (three-dimensional structure), it will be explained with reference to FIG. The function of the electronic component testing device 1 of the present invention is to test (detect) whether the IC component is appropriate by using the test head 5 and the measuring device 6 in a state in which high temperature or low temperature stress is applied to several pieces of I c . Ground action, then classify the ic component according to the 2247-9206-PF; Ahddub 11 200823471 test results. The c-element test using the electronic component test apparatus 1 is carried out from a customer carrier (see FIG. 5) in which a plurality of 1C components as test objects are loaded, and the 1C component is placed in a test in which the carrier 1 is subjected to cyclic conveyance. Test on the bracket TST (refer to Figure 6). Further, the I ◦ element is indicated by the symbol 1C in the figure. As shown in FIGS. 2 and 3, the carrier 1 of the present embodiment includes a storage unit 200 that accommodates an IC component to be tested and sorts and stores the tested 1C component, and the storage unit 200 from the storage unit 200. The sent IC component is fed to the loading unit 3 that is operating to 邛100, the studio portion 1 including the test head 5, and the release and removal of the Ic component that has been tested in the studio 丨00 Out of 400. As shown in Fig. 1, on the upper portion of the test head 5, a positioning portion 51 (intermediate face) for relaying electronic contact between the test head 5 and the slot 52 is provided. Above the positioning portion 51, a slot 52 is provided which includes a plurality of contact pins for making electrical contact with the wheel terminals of the IC component. Test head 5 passes the cable shown in Figure 1

The wire 7 is connected to the tester 6 so that the connector 1 is connected to the slot 52 (the component is electrically connected to the test portion 5, the test head 5, and the cable 7 and the tester 6 according to the U-shaped device 6 Test signal test 〖c component. Further, as shown in the figure, a space 8 is provided below the handling benefit 1, in which the test head 5 is arranged in a replaceable type, and is formed on the carrier 1 Device base 1 οι opening

The P and 1C components are in electrical contact with the slots 5 on the test head 5. When replacing the 1C 70-piece type, the slot suitable for the shape and number of stitches of the 1C component of this type can be replaced. Foot Each part of the carrier 1 will be described below. 2247-9206-pp; Ahddub 12 200823471 <Storage part 2 0 0 &gt; FIG. 4 is an exploded perspective view showing a 1C storage case used in the electronic component testing device according to the embodiment of the present invention. Fig. 5 is a perspective view showing an Ic client holder used in the electronic component testing device of the embodiment of the present invention. The accommodating portion 200 includes a pre-test storage box 201 for pre-testing and a post-test storage box 202 for accommodating the ic elements classified according to the test results. φ These storage boxes 201, 202 are as shown in Fig. 4. As shown, the frame-shaped bracket support frame 203 and the lift 204 that enters from the lower portion of the bracket support frame 2〇3 and lifts upwards upwards. Over the bracket support frame 2〇3, a plurality of customers are overlapped. Only the overlapping customer carrier KST of the carriage kst' is moved up and down by the elevator 2〇4. Further, in the customer carrier KST in the present embodiment, as shown in Fig. 5, the ic component is accommodated. The concave accommodating portions are arranged in a column of 13 rx 14. The test accommodating case 201 and the post-test storage box 2 〇 2 have the same configuration, so that the number of the pre-test storage case 201 and the post-test storage box 2 〇 2 can be respectively _ In the present embodiment, as shown in Fig. 2 and Fig. 3, two storage compartments STK_B are provided on the storage box 2〇1 before the test, and two vacancies are provided next to it. Tomu storage box STK-E. Each empty tray storage box 5] [Bu 5: Overlap will be The customer tray KST that is vacated to the release unit 400. Eight storage boxes STK-1 are provided on the side 202 of the vacant tray storage case STK_E, and STEM can be separated among the good products. The speed is classified into high-speed test results and stored as up to 8 types of defective products. After the test, the storage box STK-8 can be used according to the measurement. That is, in addition to the good and medium speed, 2247-9206-PF; Ahddub 13 200823471 * A category of low speed or a category that needs to be tested again in a defective product. <Loading unit 300> Fig. 6 is an exploded view showing a test bracket used in an electronic component testing apparatus according to an embodiment of the present invention. The above-described customer tray KST is transported from the apparatus base ι to the two window portions 370 of the loading unit 300 by the tray transfer arm 205 disposed between the storage unit 2 and the apparatus base 101. Then, in the loading unit 3, the 1C element placed in the φ customer carrier KST is transferred by the component conveying device 310 to the positioner 360 at a time, where the mutual positional relationship of the IC elements is corrected. After that, the 1C component transferred to the locator 360 is again transported. The device 31 is placed in the test tray rpgτ where the loading unit 3 is stopped. In the test tray TST, as shown in Fig. 6, parallel on the square frame 7〇1 The crosspieces 702 are disposed in a spaced manner, and on each side of the crosspieces 7〇2 and the sides 701a of the square frame 701 facing the crosspieces 702, a plurality of mounting pieces 703 are formed at equal intervals, respectively. Between 7〇2 or between the crosspiece 7〇2 and the side•701a, the two insertion pieces 703 constitute the insertion receiving portion 7〇4. Each of the embedded receiving portions 704 respectively accommodates an insert member 710 which mounts the snap fastener member 705 on the two mounting sheets in a floating state. Therefore, at both end portions of the insert 710, mounting holes 706 for mounting the insert 71 to the mounting piece 703 are formed. Such inserts 71 are as shown in Fig. 6, and 64 are mounted on one test tray TST and arranged in a row of rows. Further, each of the inserts 71 has the same shape and the same size, and each insert The 710 accommodates the 1C component. The insert 71 is 1 (the receptacle is determined according to the shape of the ICtl to be accommodated, and in the example shown in Fig. 6, it is a square 2247-9206-PF; Ahddub 14 200823471 # , The loading unit 300 includes a component handling device 310 that transports the IC component from the customer carrier kst to the test carrier m. The % component handling device 31, as shown in FIG. 2, is configured to be mounted on the device base 101. The two rails 311 can be reciprocated by the two rails between the test bracket TST and the customer bracket KST (the direction is here set to the gamma direction) and supported by the movable arm 312. The movable head 313 that moves in the X-axis direction. φ A suction piece (not shown) is attached to the movable head 313 of the element conveying device 31 so as to face downward, and the attached piece moves while being sucked. Thereby, the 1C component is supported from the client tray KST, and then the I The C component is placed on the test tray TST. The adsorption sheet can be mounted on one movable head 31 3, and eight 1C components can be placed on the test tray TST at a time. <Studio part 100> Fig. 7 is a schematic cross-sectional view showing the inside of the working chamber portion of the electronic component testing device according to the embodiment of the present invention. Φ After the 1C component is placed in the test tray TST by the loading unit 300, it is fed. The studio unit 100 performs testing of each IC component in a state in which the 1C component is mounted on the test tray TST. The studio section 100 is shown in Fig. 2, Fig. 3, and Fig. 7, and includes the opposite arrangement. The 1C element of the test tray TST is given a hot dip chamber 11 作为 as a target high temperature or low temperature temperature stress, and the hot dip chamber 11 is placed on the 1C element and the positioning portion 51 in a state in which thermal stress is imparted. The chamber 52 is electrically contacted by the test chamber 120 and the heat removal chamber 130 for removing thermal stress from the 1C element tested in the test chamber 120. 2247-9206-PF; Ahddub 15 200823471 The hot dip chamber 110 is as shown in Fig. 2, The way is to stand above the test room (2). In addition, conceptually as shown in Figure 3 and As shown in Fig. 7, a vertical conveying device is provided inside the hot dip chamber 110, and the plurality of test trays TST_ are supported by the vertical conveying device while waiting for the test chamber 12 to be emptied. During the standby period, the high-temperature or low-temperature thermal stress is applied to the 1C element. In the hot dip chamber 110, as shown in Fig. 7, the loading device lu that carries the test tray m into the test unit! 20 is provided and The height adjustment device 112 that changes the relative height of the loading device (1) with respect to the positioning portion 51 and is fixed to the height. Further, the height adjusting device 112 of the hot dip chamber (1) provided in the present embodiment corresponds to one of the second adjusting devices of the present invention: The loading device 111 has a plurality of rotating rollers 111a arranged in a straight line. Each of the rollers nia can be driven in red by a device such as a motor (not shown), and through the inlet formed between the hot dip chamber 11A and the test chamber 12A, the test tray TST is horizontally oriented. Move it and move it into the measurement unit 120. As shown in the same figure, the loading device U1 is supported by the spring element 111b so as to be movable up and down. The height adjusting device 112 includes a gantry 1123, a stepping motor lm, a boring shaft 112c, and a ball screw adapter 112 (1, an upper plate and a shaft 1). The table 112a is disposed above the hot dip chamber 110. The upper plate of the n2a is provided with a motor 112b. On the drive shaft of the motor 112b, a threaded shaft 112c is connected. The screw shaft 丨"" passes through the table 112& upper plate, at the lower end thereof, through the rotary bearing (not shown) Illustrated) rotatably supported by the lower plate of the gantry u2a. On the outer peripheral surface of the screw shaft 112c, 2247~9206-PF is formed across the entire surface; Ahddub 16 200823471 - male screw portion, in contrast, in the ball The screw adapter 112d is formed with a female screw portion 'screw shaft 112c and a ball screw adapter U2d screwed. The ball screw adapter 112d is fixed to an approximately central portion of the upper plate 11 2e, and is fixed under the upper plate 112e. The upper end of the shaft ll2f. The shaft 112f penetrates the upper surface of the hot dip chamber 110, and is connected at its lower end to the loading device 丨u. The damper adjusting device 112 is connected to the driving control of the motor 112b as shown in Fig. 7. Control device 14〇. When the height of the slot 52 is changed due to the type φ replacement of the IC component, the command signal is transmitted from the control device 140 to the height adjusting device 112. When the motor 11 2b is rotationally driven according to the command signal, the upper plate 112e passes through the ball. The screw mechanisms 112c and U2d move up and down, whereby the loading device 111 also moves up and down through the shaft 112f fixed to the upper flat plate 1126, and the relative height of the loading device π1 with respect to the positioning portion 5丨 changes. When the degree is changed to the desired height, the motor 112b is stopped, and the loading device 11 is fixed at the height. At the center of the test chamber 120, the positioning portion 51 of the upper portion of the test head 5 is disposed. As shown in Fig. 7, On the positioning portion 51, a plurality of slots 52 are disposed to face the inserts 70 0 of the test tray TST. In contrast, in the test chamber 120, as shown in the same figure, κ is used during the test. The plurality of pushing members 12 2 pushed toward the slot 52 are disposed to face the respective slots 50 on the positioning portion 52. The respective pushing members 122 are supported by the mating board 121, and the mating board 121 can be The z-axis driving device 123 moves up and down. Further, the pushing member 122 in the present embodiment corresponds to an example of the pressing portion in the present invention, and the Z-axis driving device 123 in the present embodiment corresponds to the pushing in the present invention. An example of the pressure device and the fourth height adjusting device is 2247-9206-PF; Ahddub 17 200823471. The Z-axis driving device 123, as shown in Fig. 7, includes a gantry 123a, a stepping motor 123b, a screw shaft 123c, and a ball screw. The adapter i23d, the upper flat plate 123e, the shaft 123f, and the drive plate I23g. The gantry 123a is disposed above the test chamber 123, and a motor 123b is provided on the upper plate of the gantry 123a. A screw shaft 123c is connected to the drive shaft of the motor 123b. The screw shaft 123 (the upper plate of the through-frame 1233, at the lower end thereof is rotatably supported by the lower plate of the gantry 123a through the rotary bearing. 10 on the outer peripheral surface of the screw shaft 123c, the male screw is formed across the entire surface And, a female screw portion is formed on the ball screw adapter 123d, and the screw shaft i23c and the ball screw adapter 123d are screwed together. The ball screw adapter 123d is fixed to an approximately central portion of the upper flat plate 123e at the upper plate. Below the 11 2e, the upper end of the shaft 123f is fixed. The shaft 123f penetrates the upper wall surface of the test chamber 120, and is fixed at the lower end thereof to the drive plate 123. The drive plate 12 is opposed to the mating plate 121 supporting the push member 12 2 . The Z-axis driving device 12 3 is also connected to the control device 140 for driving control of the motor 123b as shown in Fig. 7. When testing, the driving plate 123g can be lowered by the pushing member 122. The ic element is pushed toward the slot 52, and when the height of the slot 52 is changed, the drive board i23g is moved up and down to change the standby position of the pusher 122. In other words, when the 1C component is tested, the slave control unit ι4〇 The command signal is sent to the Z-axis driving device 123. At this time, the motor i23b is rotationally driven, whereby the driving plate 123g is lowered by the ball screw mechanisms 123C, 123d, the upper flat plate 123e, and the shaft 123f, and is pushed by the mating plate 121. 122, the IC components mounted on the test tray TST are respectively pushed to the insertion portion 2247-9206-PF of the positioning portion 5; Ahddub 18 200823471 '52. Thereby, the input and output terminals of the iCtl member and the contacts of the slot 52 The electronic component is tested by the measuring device 6. The test result can be stored at the address, which can be allocated by the identification number attached to the test tray TST and distributed inside the test tray TST. The number of the IC component is determined. In addition, when the type of the 1C component is replaced or the like, the height of the slot 52 is changed, the command signal is transmitted from the control device 140 to the z-axis driving device 123, and the motor 123b is rotated. Driven, the drive plate 12A passes through the ball_screw mechanism 123c, and the cymbal 23 (1, the upper plate 1236 and the shaft 123f move up and down, and the relative height of the pusher 122 relative to the positioning portion 5A changes. When the pusher 122 Height When the desired height is reached, the motor 12 is stopped, and the standby position of the pusher is fixed at the height. Also, in the test chamber 12, as shown in Fig. 7, the test tray TST is horizontally oriented from the heat. The conveyance device 124 that is conveyed toward the side of the heat removal chamber (10) on the side of the dip chamber 1 has a belt conveyor 124a disposed from the side of the hot dip chamber 11 toward the heat removal chamber 130. This belt conveyor The machine 124& can carry the test tray TST of the IC component before the load test from the inlet 11 〇a to the top of the fixed P 51, and when the test of the rich IC component ends, the test tray tst is carried to the outlet 120a. As shown in the same figure, the conveying device 124 is supported by the spring member 124b so as to be movable in the up and down direction. Further, in the test chamber 12A of the present embodiment, there is provided an interval-leveling device 125 which changes the height of the conveying device 124 with respect to the positioning portion 51 and fixes it to the degree of return. Further, in the present embodiment, the height adjusting means 125 provided in the test chamber 120 corresponds to an example of the first adjusting means of the present invention. 19 2247-9206-PF; Ahddub 200823471 - This height adjustment device 125 includes a stepping motor 125a, a screw shaft 125b, a ball screw adapter 125c, an upper plate 1254, and a shaft. The motor 125a is provided on the upper frame of the Z-axis drive unit 丨23. A screw shaft 125 is connected to the drive shaft of the motor 125a. The screw shaft 12 is inserted through the upper plate of the frame 123a at its lower end, and is rotatably received by the lower plate of the frame 123a through a rotary bearing (not shown). stand by. On the outer peripheral surface of the screw shaft 125b, a male screw portion is formed across the entire surface, and a female screw portion is formed on the rolling bevel screw adapter 125c, and the screw shaft 125b and the ball screw adapter 125c are screwed. The ball screw adapter 125c is fixed to the upper plate 125d, and the upper end of the shaft 1256 is fixed below the upper plate i25d. The shaft 125e penetrates the upper wall surface of the test chamber 12b and is connected at its lower end to the transporting device 124. The height adjusting device 125 is also connected to the control device 14 for performing the drive control of the motor 125a as shown in Fig. 7. Then, when the face of the exclusive slot 52 is replaced by the type of the c component, the command signal is transmitted from the control device 1 to the interval adjusting device 125. When the motor 125a is rotationally driven in accordance with the command signal, the conveying device 124 also moves up and down through the ball screw mechanisms 125b, 125c, the upper plate 125d, and the shaft 125e, and the relative height of the conveying device 124 with respect to the positioning portion 51 changes. When the height of the handling device 124 changes to a desired height, the motor 125a is stopped and the handling device 124 is fixed at that height. The heat removal chamber 130 is also the same as the hot dip chamber 110. As shown in Fig. 2, the arrangement is such that it protrudes above the test chamber 120. Conceptually, as shown in Figs. 3 and 7, a vertical transport device is provided. In this heat removal chamber 130, if a high temperature is applied to the hot dip chamber 11b, the 2c element is cooled by air supply and returned to room temperature by means of 2 24 7-92 0 6-PF; Ahddub 20 200823471 ^. On the other hand, if a low temperature is applied to the hot dip chamber 110, the IC element is heated by a warm air, a heater, or the like to return to a temperature at which no condensation occurs, and then 1 (: component is moved to release) after heat removal. In the case of removing heat to 130, as shown in FIG. 7, a carry-out device ι31 for carrying out the test tray τST from the test portion 120 and a relative height of the carry-out device ι31 with respect to the positioning portion 51 are provided. The height adjusting device 132 is fixed to the height. In the present embodiment, the temperature adjusting device 132 provided in the heat removing chamber j 3 is equivalent to one of the third adjusting devices in the present invention. The unloading device 131 and the hot dip chamber 1 i are similar to the loading device ,, and have a plurality of rotating rollers 131a arranged in a straight line. These rollers 131 & in particular, can be rotationally driven by a device such as a motor (not shown). And the test tray TST is moved in the horizontal direction through the outlet 12〇a formed between the test pin 120 and the heat removal chamber 13A, and is carried out from the test portion 12〇. The carry-in device ΐ3ι如如同- The figure does not 'have to move up and down The height adjustment device 132 is the same as the height adjustment device 112 of the hot dip chamber 110, and includes a gantry 132a, a stepping motor (3), a screw shaft (10), a ball screw adapter 132d, an upper plate J32e, and a shaft 132f. The gantry 132a is disposed above the heat removal chamber 13A. On the upper surface of the gantry 132&amp;, a motor 132b is disposed. On the drive shaft of the motor 132b, a screw shaft 132c is connected. The screw shaft 13 passes through the gantry 132a. The upper plate, at the lower end, is rotatably supported by the lower plate of the gantry through a rotary bearing (not shown). On the outer surface of the screw shaft 132c, a 2247-9206-PF is formed across the signing surface; Ahddub 21 200823471 'The male screw portion, on the other hand, the female screw portion is formed on the ball screw adapter 132d, and the screw shaft 132〇 and the ball screw adapter 132d are screwed together. The ball screw adapter 132d is fixed to the upper plate I32e The upper end portion of the upper plate 132e is fixed to the upper end of the shaft 132f. The shaft 132f passes through the upper wall surface of the heat removal chamber 130, and is connected to the carry-out device 131 at the lower end thereof. The height adjusting device 132 is the seventh. As shown, it is connected to the control device 14 that performs the drive control of the motor 132b. Then, when the height of the slot 52 is changed due to the type φ replacement of the κ element, the command signal is transmitted from the control device 140 to the time of the message. The device 132. When the motor 1 32b is rotationally driven according to the command signal, the carry-out device 131 moves up and down through the ball screw mechanisms 132c, 132d, the upper flat plate 132e, and the shaft I32f, and the relative height of the carry-out device 131 relative to the positioning portion 51 changes. . When the height of the unloading device 131 is changed to a desired height, the motor 132b is stopped, and the unloading device 131 is fixed at the height. At the upper portion of the hot dip chamber 110, an inlet for carrying the test tray TST from the apparatus base is formed. Similarly, at the upper portion of the heat removing chamber 130, an outlet for carrying out the test tray TST to the apparatus base 101 is formed. Further, the apparatus base 101 is provided with a tray transporting device i 〇 2 for carrying in and out the test tray TST from the studio unit 110 through the inlet and the outlet. This carriage transporting device 102 can be constituted by a rotating roller or the like. By the tray conveyance device 102, the test tray tst carried out from the heat removal chamber 130 is returned to the hot dip chamber no through the discharge portion 400 and the loading portion 30 0. Fig. 8 is a schematic cross-sectional view showing the inside of a working chamber portion of an electronic component testing device according to another embodiment of the present invention. In the above embodiment, height adjustment means 112, ; ! 23, 2247-9206-PF; Ahddub 22 200823471 ▲ 132 change the relative heights of the devices 111, 124, 131 with respect to the positioning portion 51, but in the present In another embodiment of the invention, the spacers 1 1 1 d 124d, 131 d may be used instead of the height adjustment means 112, 123, 132 to adjust the relative heights of the devices ln 124, 131. In other words, in the loading device 1 provided in the hot dip chamber 110, as shown in Fig. 8, in order to regulate the upper limit of the vertical movement by the spring element 111b, the stopper 111c is provided, but the loading device hi and the stop are provided. Between the devices 11c, _ is provided with a spacer 111d of a predetermined thickness, whereby the relative height of the loading device 111 with respect to the positioning portion 51 can be fixed at a desired height. Similarly, spacers 124d, 1 31d are provided between the conveying device 124 and the stopper 124c and between the unloading device 131 and the stopper 1 31 c, respectively, whereby the respective devices 124, 131 are opposed to the positioning portion. The relative height of 51 can be fixed at the desired height. <Release unit 400> In the present embodiment, the same transfer device 410 is provided on the delivery unit 4, and the same transfer device 410 as the component transfer device 310 provided in the loading unit is provided. The component carrying device 41 turns the IC component from the test tray TST carried out to the discharge unit 400 to the customer tray KST classified according to the test result. As shown in Fig. 2, the pair of 13⁄4 portions 470' are formed on the apparatus base 1 in the release portion 4, so that the arrangement is carried out from the storage portion 2 into the delivery portion 4 The customer's bracket KST faces the top of the base of the unit. Further, although not shown in the drawings, a lift table for lifting and lowering each of the holders KST is provided on the lower side of each of the window portions 47, and here, the load is lowered and placed 2247-9206-PF/Ahddub 23 200823471 'And the customer carrier KST of the IC component after the full load test, this full load carrier is transferred to the carriage transfer arm 205. Next, a method of adjusting the electronic component testing device i when the height of the slot 52 on the positioning portion 51 is changed in accordance with the replacement of the ic component type or the like will be described. 9A to 9C are cross-sectional views respectively showing the positional relationship between the pusher, the test bracket, and the slot when the three types of slots having different heights are mounted on the test head in the embodiment of the present invention. Further, the slot #5 shown in Fig. 9A is in the form of a leaf spring-like contact, and the slot 52B shown in Fig. 9B is a type in which a spring pin is used as a contact, as shown in Fig. 9C. The socket 5% is entirely composed of an elastic body, and is a type in which a metal thin wire or gold powder is buried in the elastic body as a contact. When the slot on the positioning portion 51 is changed from the slot 52A shown in FIG. 9A to the slot 52B shown in FIG. 9B as the type of the ic component is replaced, from the top of the positioning portion 51 to the slot The height is reduced from 匕 to Hb (Ha &gt; Hb). Therefore, in the present embodiment, the transporting device I24 is lowered by the height adjusting device #125 provided in the test chamber 12A so that the lower end of the test tray TST and the upper end of the slot 52B where the transport position L· is located The interval between them is the optimum value Si. Further, the optimum value Si is the shortest value in the range in which the test tray TST and the slot 52B do not interfere with each other, for example, 〇·5~1. 〇_. Further, the adjustment is performed by the temperature adjustment device 125, and the standby position of the pusher 122B is lowered by the z-axis driving device 123 so that the upper end of the test tray TST and the lower end of the pusher 122B where the transport position L is located ( The interval between the pressing faces is the optimum value S2. Further, the optimum value s2 is the shortest value of the range in which the test tray TST and the pusher 122B do not interfere with each other, and for example, may be 2 2 4 7-92 0 6-PF; Ahddub 24 200823471 - 〇·5~1·Omm Further, as the height adjusting device 125 changes the transport position 1 of the test tray TST, the loading device ill is lowered by the height adjusting device 112 of the hot dip chamber 110 so that the height of the loading device 111 is aligned with the height of the transport device 124. Thereby, the test tray TST can be smoothly transferred from the loading device 111 to the conveying device 124. Similarly, the carry-out device 131 is lowered by the height adjusting device 132 of the heat removing chamber 130 so that the height of the carrying device 131 is aligned with the height of the carrying device 124. Thereby, the test tray TST can be smoothly transferred from the conveying device 124 to the unloading device 131. When the slot on the positioning portion 51 is replaced with the slot 52A shown in FIG. 9A and the slot 52B shown in FIG. 9B, the slot 52C shown in FIG. 9C, from the top of the positioning portion 51 to the slot. The height is lowered from Ha or Ηβ to Hc(Ha>Hc, ηβ&gt;η〇. Therefore, in the present embodiment, the conveying device 124 is lowered by the height adjusting device 25 so that the carrying position of the carrying position l is The spacing between the end of the frame tst and the upper end of the slot 52C is the optimum value S!. Further, the adjustment is performed by the height adjusting means 125, and the standby position of the pushing member 122C is made by the 2-axis driving means 123. The lowering is such that the interval between the upper end of the test tray tst where the transport position L is located and the lower end of the pusher 122C (the push surface) is the optimum value S2. Further, the test bracket TST is changed with the height adjustment device 125. At the conveyance position L, the load adjustment device 112, 132 lowers the carry-in device π ΐ and the carry-out device 131 so that the heights of the carry-in device lu and the carry-out device 131 are aligned with the height of the transport device 124. Thereby, the loading device can be smoothly moved in. Device 丨 i, handling 22 4 7-92 0 6-PF; Ahddub 25 200823471 - The test tray TST is transferred between the holder 124 and the carry-out device 131. When the slot on the positioning portion 51 is changed from the slot 52C shown in FIG. 9C to the slot 52B shown in FIG. 9B, the positioning portion 51 is removed. The height from the upper side to the slot is raised from EU to Hb (Hc &lt; Hb). Therefore, in the present embodiment, the carrying device 124 is raised by the height adjusting device 125 so that the test tray TST where the carrying position L is located The interval between the lower end and the upper end of the slot 52B is an optimum value Si 〇 _ again, adjusted by the height adjusting device 125, and the standby position of the pusher 122B is raised by the z-axis driving device 123 so that The interval between the upper end of the test tray TST where the transport position check L is located and the lower end of the pusher 122B (the push surface) is the optimum value S2. Further, as the height adjustment device 125 changes the transport position L of the test tray TST The loading device ill and the unloading device 131 are raised by the height adjusting devices 112 and 132 so that the heights of the loading device in and the carrying device ι 31 are aligned with the height of the conveying device 124. Thereby, the loading device 1 can be smoothly carried. Transfer between the φ device 124 and the carry device 131 Test tray TST. When the slot on the positioning portion 51 is replaced with the slot 52B shown in FIG. 9B and the slot 52C shown in FIG. 9C to the slot 52A shown in FIG. 9A, the slave positioning portion 51 The height from the top to the slot is lowered from Hb or Hc to Ha (h, Hc &lt; th). Therefore, in the present embodiment, the handling device 124 is raised by the height adjusting device 125 so that the carrying position l is The interval between the lower end of the test tray tst and the upper end of the slot 52C is an optimum value Si. In addition, the adjustment is performed by the height adjusting device 125, and the standby position of the pushing member 12 2 C is raised by the z-axis driving device 12 3 so that the carrying position 2247-9206-PF; Ahddub 26 200823471 L is in the test tray The interval between the upper end of the frame TST and the lower end of the pusher member 122 (the pressing surface) is an optimum value Si. Further, as the height adjusting device 125 changes the transport position L of the test tray TST, the loading device "132" raises the loading device "丨 and the carrying device 131 so that the heights of the loading device lu and the carrying device 131 are aligned. The height of the conveying device 124 can smoothly transfer the test tray TST between the loading device (1), the conveying device 124, and the unloading device 131.

As described above, in the present embodiment, when the height of the slot changes with the replacement of the π component type, the handling position L of the carrier device 124 is changed by the height adjusting device 125 to make the test tray The interval between m and the slot is an optimum value S1, and the standby position of the pusher 122 is changed by the ice driving device 124 so that the interval between the pusher and the test carrier is optimal. In this way, even if the height of the slot is changed, the test component can be tested for the index time. In addition, the embodiments described above are described for easy understanding of the present invention, and are not intended to limit the present invention. Therefore, the various elements disclosed in the above embodiments include all design changes or equivalents falling within the technical scope of the present invention. [Simplified Schematic] FIG. 1 is an electronic component showing an embodiment of the present invention. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention; 2247-9206-PF; Ahddub 27 200823471. Fig. 3 is a view showing an electronic element in an embodiment of the present invention. Fig. 4 is an exploded perspective view showing an IC storage case used for measuring electronic components according to an embodiment of the present invention. Fig. 5 is a perspective view showing a 1C customer carrier used for measuring an electronic component according to an embodiment of the present invention.

Fig. 6 is an exploded perspective view showing a test holder used in the electronic component testing device according to the embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing the inside of a working portion of an electronic component according to an embodiment of the present invention. Component Test Apparatus Fig. 8 is a schematic cross-sectional view showing the inside of a working chamber portion of an electronic device according to another embodiment of the present invention.

Fig. 9 is a cross-sectional view having a leaf spring-like contact between the test bracket and the socket, showing the positional relationship of the pusher when the slot is mounted on the test head in the embodiment of the present invention. When the 测 测 9 为 为 为 为 为 为 为 为 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置 位置: and Figure 9C is the cross-sectional view of the positional relationship between the slotted slots of the elastomer type. It is placed in the implementation mode of this service, and it is reported to the test head when Shi,, #, 田守之推The piece, the test bracket and the 10th drawing are sectional views, in which the slot device with the leaf spring-like contact (4) electronic element phase test device is pushed in the test 2247-9206-PF/Ahddub 200823471 , the positional relationship between the test tray and the slot. Figure 10B is a cross-sectional view of the table is not in the conventional electricity +; electric 卞 7 ^ piece test device

In the middle, when the slot with the spring pin is placed on the test head, the positional relationship between the pusher, the test bracket and the slot. Fig. 10C is a cross-sectional view showing the positional relationship between the slot of the elastomer type, the pusher, the test carriage and the slot when the slot of the elastomer type is mounted on the conventional electric + cow tester. ❿ Main component symbol description 1 carrier; test head; tester; 7 cable 'line; part setting space; 100 studio part; device base; 102 carrier handling device · hot dip room; 111 loading device; Llld spacer; height adjustment device; 120 test chamber; outlet; 121 mating plate; 122A~122C pusher; 123 Z-axis drive. stand; 123b stepper motor; screw shaft; 123d ball screw adapter; upper Flat plate; 123f pregnancy, drive plate; 124 handling device; belt conveyor; 124b spring element; stopper; 124d spacer; 2247-9206-PF; Ahddub 29 200823471

125 height adjustment device; 125b screw shaft; 125d upper plate; 130 heat removal chamber; 131a rotating roller; 1 31 c stopper; 132 height adjustment device; 132b stepping motor; 132d ball screw adapter; 132f shaft; , 202 storage box; 204 lift; 31 0 handling device; 312 movable arm; 360 positioner; 400 release; 470 window; 5 0 slot; 52, 52A ~ 52C slot; 7 01 a side; Mounting tab; 705 fastener; 710 insert; TST test bracket. 125a stepper motor; 125c ball screw adapter 125e shaft; 131 carry-out device; 131b spring element; 131d spacer; 132a mount; 132c screw shaft; 132e upper plate; 200 storage; 203 bracket support frame; 311 track; 313 movable head; 370 window, 410 handling device; 5 test head; 51 positioning part; 701 square frame; 702 crossbar; 704 housing; * 706 mounting hole; KST customer bracket; 2247-9206 -PF;Ahddub 30

Claims (1)

200823471 X. Patent application scope: 1 · An electric power; - Test device for cracking electronic components, including a test part, which is placed on the test and placed on the test: In the above test, the test unit has: a transport device, wherein the 4/0 is in a predetermined direction to carry the bracket; and the second peripheral device can change the transport device relative to The relative distance to the upper part. The following is the second interface of the above-mentioned interface: The electronic component testing device of the first aspect of the patent, wherein the method further comprises: τ 脱 下 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Applying thermal stress to the electronic component of the test article; the applying portion has a loading device for carrying the tray into the test portion; and the second adjusting device is movable with respect to at least a portion of the transfer device Relative distance. 1. In the case of the electronic component testing device of the first or second item of the patent scope, the application further includes: · the removal part 'in the above-mentioned test mine; the sub-piece is mounted on the above-mentioned bracket Sadly, the thermal stress is removed from the electronic component under test; the removal portion has: the unloading device 'used to carry out the bracket 2 adjustment device from the test portion, and the change device can be changed with the above-mentioned transport device The carrying out 224 7-9206-PF/Ahddub 31 200823471 is placed relative to at least a portion of the above-mentioned face. ☆ ^4. An electronic component testing device, comprising a testing portion, wherein the testing portion is in a state in which the component is mounted on the carrier, and the test electronic component and the touch surface of the test head are placed again. The dot portion is electrically contacted to perform the test of the electronic component to be tested, wherein the test portion has: a pressing device that presses the test electronic component in a state of being mounted on the carrier a portion that pushes the test element to the contact portion; and a fourth adjustment device that changes a relative distance of the press portion relative to the face portion. A method for transporting a carrier, wherein the test electronic component and the contact portion provided on the face portion of the test head are in electronic contact with the test electronic component in a state where the test electronic component is mounted on the carrier to perform the test of the test electronic component In the electronic component testing device, the tray is transported to face the interface surface by transporting the wearing device, and wherein the carrier is opposite to the height of the contact portion. The relative distance of the above-mentioned face is also changed. 6. The method of transporting a carrier according to claim 5, wherein when the height of the contact portion changes, the relative distance of the transport device relative to the upper surface is also changed, and as a result, the bracket is caused The relative distance with respect to the above contact portion is the shortest. 7. The method according to claim 6, wherein when the height of the contact portion becomes lower, a relative distance of the transport device relative to the interface 2247-9206-PF/Ahddub 32 200823471 - Shortened. 8. The method of transporting a carrier according to the sixth aspect of the invention, wherein the relative distance of the conveying device with respect to the interface portion is increased when the degree of orientation of the contact cymbal is increased. The method of handling a carrier according to any one of claims 5 to 8, wherein the test portion has: a pressing device, which is pressed by being mounted on the bracket. The pressing portion on the electronic component to be tested pushes the electronic component to be tested toward the contact portion; and when the height of the contact portion changes, the relative distance of the pressing portion with respect to the dielectric surface also changes. The method of transporting a carrier according to claim 9, wherein when the height of the contact portion is changed, a relative distance of the pressing portion with respect to the face is also changed, and as a result, the pressing portion is relatively The relative distance to the above bracket is the shortest. The method of transporting a carrier according to the first aspect of the invention, wherein, when the height of the contact portion is lowered, a relative distance of the pressing portion with respect to the interface portion is shortened. The method of transporting a carrier according to the first aspect of the invention, wherein, when the height of the contact portion is increased, a relative distance of the pressing portion with respect to the interface portion is increased. 2247-9206-PF; Ahddub 33