JPH0843482A - Temperature-regulating device - Google Patents

Temperature-regulating device

Info

Publication number
JPH0843482A
JPH0843482A JP6200139A JP20013994A JPH0843482A JP H0843482 A JPH0843482 A JP H0843482A JP 6200139 A JP6200139 A JP 6200139A JP 20013994 A JP20013994 A JP 20013994A JP H0843482 A JPH0843482 A JP H0843482A
Authority
JP
Japan
Prior art keywords
inspected
mounting
mounting plate
temperature control
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6200139A
Other languages
Japanese (ja)
Inventor
Junichi Hagiwara
順一 萩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Tokyo Electron Yamanashi Ltd
Original Assignee
Tokyo Electron Ltd
Tokyo Electron Yamanashi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron Yamanashi Ltd filed Critical Tokyo Electron Ltd
Priority to JP6200139A priority Critical patent/JPH0843482A/en
Priority to US08/509,284 priority patent/US5708222A/en
Priority to KR1019950023666A priority patent/KR100274310B1/en
Priority to TW084108150A priority patent/TW286364B/zh
Publication of JPH0843482A publication Critical patent/JPH0843482A/en
Pending legal-status Critical Current

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  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To provide a temperature-regulating device in which a mounting-plate part with reference to different kinds of devices is used in common when every device formed by packaging an object to be inspected such as, e.g. a semiconductor integrated circuit, by which every device can be heated or cooled with good efficiency and which is used for the inspection apparatus of every device. CONSTITUTION:A mounting-plate part 3 on which a plurality of devices 10 are arranged and mounted is installed on a heating unit 4 so as to be freely detachable, and a recessed part 5 in which every device 10 is housed is formed on the surface part of the mounting-plate part 3. Then, a mounting-stand part 6 having a height at which every lead terminal R for every device 10 does not come into contact with the bottom face is formed in the central part on the bottom face of the recessed part 5, and a suction hole 43 which is used to vacuum-suck every device 10 is formed in the center of the mounting-stand part 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば半導体集積回路
をパッケージングしたデバイスを検査する検査装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for inspecting a device in which, for example, a semiconductor integrated circuit is packaged.

【0002】[0002]

【従来の技術】例えば半導体集積回路をパッケージング
したデバイスは、電気的特性が試験されるが、この種の
検査装置としては、リード端子のピッチが比較的広い場
合にはソケット部を用いて、またリード端子のピッチが
比較的狭い場合にはプローブカードのプローブ針を用い
てリード端子とテストヘッドとの電気的接触を図ってい
る。そして上述の試験は通常デバイスを加熱した状態で
行われ、このためデバイスの予備加熱装置が用いられて
いる。検査装置におけるデバイスの搬送について述べる
と、ローダにより搬入側トレーから例えば4個同時にデ
バイスの上面が吸着保持されて第1の供給整列部に搬送
され、整列部内の凹部の形状により位置合わせが行われ
る。次いでデバイスは、前記ローダにより整列部から予
備加熱装置に搬送されて予備加熱され、しかる後第2の
供給整列部に搬送され、例えばソケット式の検査ではそ
の後吸着保持機能を有する搬送機構によりソケット部ま
で搬送されて電気的特性の試験が行われる。
2. Description of the Related Art For example, a device in which a semiconductor integrated circuit is packaged is tested for electrical characteristics. As an inspection apparatus of this type, a socket portion is used when lead terminals have a relatively wide pitch. When the pitch of the lead terminals is relatively narrow, the probe terminals of the probe card are used to make electrical contact between the lead terminals and the test head. And, the above-mentioned test is usually carried out while the device is heated, and for this reason, a device preheating apparatus is used. Describing the transportation of the device in the inspection apparatus, for example, four device upper surfaces are simultaneously suction-held from the loading tray by the loader and transported to the first supply alignment unit, and the alignment is performed by the shape of the recess in the alignment unit. . Next, the device is carried by the loader from the aligning unit to the preheating device and preheated, and then carried to the second supply aligning unit. It is transported to and tested for electrical characteristics.

【0003】ここで予備加熱装置は多数のデバイスを配
列して同時に加熱できるように構成されており、デバイ
ス一個一個を加熱する単位領域の構造について図5及び
図6を参照しながら述べる。71は載置部であり、この
載置部71の周縁には位置決め用のリブ72が形成され
ると共にその周囲の面はデバイス10のリード端子Rが
伸び出せるように一段低く形成されている。リブ72
は、デバイス10が例えばローダの吸着から解放される
ときに位置ずれして傾いたりすると次に当該デバイス1
0を吸着した際に10のリード端子を曲げてしまうの
で、位置ずれしないように設けられている。そしてデバ
イス10の形状によって載置部71の載置領域(リブ7
2に囲まれた領域)の大きさが異なるので種々のデバイ
ス10に対応できるように共通の加熱ユニット73の上
に、載置部71を備えたデバイスの載置板部74を交換
可能に重ねて設けて予備加熱装置を構成している。
Here, the preheating device is constructed so that a large number of devices can be arranged and heated at the same time. The structure of a unit region for heating each device will be described with reference to FIGS. 5 and 6. Reference numeral 71 denotes a mounting portion, and a positioning rib 72 is formed on the peripheral edge of the mounting portion 71, and the peripheral surface thereof is formed so that the lead terminals R of the device 10 can be extended. Rib 72
When the device 10 is displaced and tilted when the device 10 is released from adsorption of the loader, for example, the device 1
Since the lead terminals of 10 are bent when 0 is adsorbed, they are provided so as not to be displaced. Then, depending on the shape of the device 10, the placement area (rib 7
Since the size of the area surrounded by 2 is different, the mounting plate portion 74 of the device including the mounting portion 71 is replaceably stacked on the common heating unit 73 so as to be compatible with various devices 10. Are provided to form a preheating device.

【0004】[0004]

【発明が解決しようとする課題】ところで品種が同じデ
バイスであってもユーザに応じてそのサイズが微少に異
なるため実際にはデバイス一品種において複数種類のデ
バイスが存在する。一方予備加熱装置においてリブ72
で囲まれる載置領域は、デバイスのサイズに正確に対応
する大きさであることが必要であるから、一品種のデバ
イスについて、複数の載置板部74を用意しなければな
らず、デバイスの種類が変わる度に載置板部74の交換
作業が必要であるし、コストも高くなっていた。
Even if devices of the same type are slightly different in size depending on the user, there are actually a plurality of types of devices in one device type. On the other hand, in the preheating device, the rib 72
Since the mounting area surrounded by is required to have a size that accurately corresponds to the size of the device, it is necessary to prepare a plurality of mounting plate portions 74 for one type of device. Every time the type is changed, the work of replacing the mounting plate 74 is required, and the cost is high.

【0005】更にデバイスは自重だけで載置板部74の
載置部71上に置かれているため、デバイスと載置面と
の密着性が悪く、加熱ユニット73よりの熱が効率よく
デバイスに伝熱されないという問題もあった。そしてま
たデバイスをリブ72で囲まれた載置領域の中に確実に
載置するために、予備加熱装置に搬送する前に整列台に
一旦置いてデバイスの位置合わせを行う必要があり、そ
のための整列部が必要であり処理時間も長くなるという
不都合もあった。
Further, since the device is placed on the placing part 71 of the placing plate part 74 only by its own weight, the adhesion between the device and the placing face is poor, and the heat from the heating unit 73 is efficiently applied to the device. There was also the problem of not being able to transfer heat. In addition, in order to securely mount the device in the mounting area surrounded by the ribs 72, it is necessary to temporarily place the device on the alignment table before carrying it to the preheating device, and for that purpose, There is also an inconvenience that the alignment section is required and the processing time becomes long.

【0006】本発明は、このような事情の下になされた
ものであり、その目的は、被検査物を効率よく加熱また
は冷却することのできる、検査装置に用いられる温調装
置を提供することにある。本発明の他の目的は種類の異
なる被検査物に対して載置板部を共通化できる温調装置
を提供することにある。
The present invention has been made under such circumstances, and an object thereof is to provide a temperature control device used for an inspection device, which can efficiently heat or cool an inspection object. It is in. Another object of the present invention is to provide a temperature control device capable of using a common mounting plate portion for different types of inspection objects.

【0007】[0007]

【課題を解決するための手段】請求項1の発明は、端子
部を備えた被検査物を加熱または冷却する装置であっ
て、加熱または冷却された被検査物を検査位置にて電気
的特性について検査する検査装置に用いられる温調装置
において、被検査物が配置される凹部が表面部に形成さ
れた載置板部と、この載置板部を加熱または冷却する温
調ユニットと、を備え、前記凹部の中には、真空吸着用
の吸引孔が開口し被検査物を載置するための載置台部が
形成されていることを特徴とする。
According to a first aspect of the present invention, there is provided an apparatus for heating or cooling an inspected object having a terminal portion, wherein the heated or cooled inspected object has an electrical characteristic at an inspection position. In a temperature control device used in an inspection device for inspecting, a mounting plate part having a recess in which an object to be inspected is formed is formed on a surface part, and a temperature control unit for heating or cooling the mounting plate part. The apparatus is characterized in that a suction hole for vacuum suction is opened in the concave portion and a mounting table portion for mounting an object to be inspected is formed.

【0008】請求項2の発明は、請求項1記載の発明に
おいて、被検査物は搬送機構により上面が吸着保持され
て載置台部に搬送されることを特徴とする。
According to a second aspect of the present invention, in the first aspect of the invention, the object to be inspected is conveyed to the mounting table portion with its upper surface sucked and held by the conveying mechanism.

【0009】請求項3の発明は、請求項1または2記載
の発明において、被検査物の端子部は、被検査物の本体
の下方側に伸びるリード端子よりなり、載置台部は、被
検査物の本体よりも狭く、かつ周囲の底面にリード端子
が接触しないように周囲よりも高く構成されていること
を特徴とする。
According to a third aspect of the present invention, in the first or second aspect of the present invention, the terminal portion of the object to be inspected is a lead terminal extending to the lower side of the body of the object to be inspected, and the mounting table portion is to be inspected. It is characterized in that it is narrower than the main body of the object and is higher than the surroundings so that the lead terminals do not contact the bottom surface of the surroundings.

【0010】請求項4の発明は、請求項1、2または3
記載の発明において、被検査物が載置板部の表面より突
出しないように凹部の深さが設定されていることを特徴
とする。
The invention of claim 4 is the invention of claim 1, 2 or 3.
In the invention described above, the depth of the concave portion is set so that the inspection object does not protrude from the surface of the mounting plate portion.

【0011】請求項5の発明は、請求項1、2、3また
は4記載の発明において、載置板部の表面部には、複数
の被検査物が夫々配置される複数の凹部が形成されてい
ることを特徴とする。
According to a fifth aspect of the present invention, in the first, second, third, or fourth aspect of the present invention, a plurality of recesses, in which a plurality of objects to be inspected are arranged, are formed on the surface portion of the mounting plate portion. It is characterized by

【0012】請求項6の発明は、請求項1、2、3、4
または5記載の発明において、載置板部は温調ユニット
に着脱自在に取り付けられていることを特徴とする。
The invention of claim 6 is the invention of claims 1, 2, 3, 4
Alternatively, in the invention described in the fifth aspect, the mounting plate portion is detachably attached to the temperature control unit.

【0013】[0013]

【作用】被検査物は搬送機構の例えば真空吸着により上
面が保持された状態で載置板部の凹部内の載置部上に搬
送され、ここで例えば予備加熱(あるいは冷却)された
後搬送機構により例えば整列部を介して検査位置に送ら
れ、例えば加熱(あるいは冷却)された状態で電気的特
性の試験が行われる。被検査物は載置台部上に真空吸着
されるので高い密着性で載置され、このため効率よく加
熱される。この場合凹部の深さを請求項3のように設定
すれば外気の影響を小さくでき、常に被検査物を一定温
度に温度調整できる。そして載置台部には被検査物が真
空吸着されるので搬送機構からの解放時の衝撃などによ
っても被検査物が動いたりすることがなく、従って位置
決め用のリブが不要であるから種類の異なる被検査物に
対して載置部を共通化できる。
The object to be inspected is transferred onto the mounting portion in the recess of the mounting plate portion while the upper surface is held by the transfer mechanism, for example, by vacuum suction, and is then preheated (or cooled) and then transferred. It is sent to the inspection position by the mechanism, for example, via the alignment section, and the electrical characteristics are tested in the heated (or cooled) state. Since the object to be inspected is vacuum-adsorbed on the mounting table portion, it is mounted with high adhesion, and therefore is efficiently heated. In this case, if the depth of the recess is set as in claim 3, the influence of the outside air can be reduced, and the temperature of the object to be inspected can be adjusted to a constant temperature. Since the object to be inspected is vacuum-sucked to the mounting table portion, the object to be inspected does not move due to an impact at the time of release from the transport mechanism, and therefore, a positioning rib is not necessary, so that different types are used. The mounting portion can be made common to the inspection object.

【0014】[0014]

【実施例】以下に本発明を、半導体集積回路チップをパ
ッケージングしてなるデバイスの検査装置に適用した一
例について述べる。先ず検査装置の全体の概要について
図1を参照しながら簡単に説明する。装置の正面側(図
1では裏側)には4個のトレー載置部1A〜1DがX方
向に沿って配置されている。ただし実際には各トレー載
置部1A〜1Dには複数のトレーが載置されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example in which the present invention is applied to a device inspection device in which a semiconductor integrated circuit chip is packaged will be described below. First, an overview of the entire inspection apparatus will be briefly described with reference to FIG. On the front side (back side in FIG. 1) of the apparatus, four tray mounting portions 1A to 1D are arranged along the X direction. However, actually, a plurality of trays are mounted on each of the tray mounting portions 1A to 1D.

【0015】前記トレー載置部1A、1Bの奥側にはこ
れらに対向して本発明の実施例である温調装置例えば予
備加熱装置2が設けられ、予備加熱装置2の横には、供
給用整列部12及び収納用整列部13が一体的にXレー
ル14にガイドされつつ図示しない駆動機構により移動
されるようになっている。なおトレーTにはデバイス1
0を収納する凹部Taが形成されており、前記整列部1
2、13は、凹部15を備えていて、この中にデバイス
10が入れられると自動的に水平姿勢で所定の向きにア
ライメント(位置合わせ)された状態に置かれることに
なる。
A temperature adjusting device, for example, a preheating device 2 according to an embodiment of the present invention is provided on the back side of the tray mounting portions 1A and 1B so as to face them, and a supply device is provided beside the preheating device 2. The aligning section 12 for storage and the aligning section 13 for storage are integrally guided by the X rail 14 and moved by a drive mechanism (not shown). In addition, the device 1 is installed in the tray T.
The concave portion Ta for accommodating 0 is formed, and the alignment portion 1
2 and 13 are provided with a concave portion 15, and when the device 10 is put into the concave portion 15, the device is automatically placed in a horizontal posture and aligned (aligned) in a predetermined direction.

【0016】トレー載置部1A、1B上のトレーT内の
デバイス10は、4個の吸着保持部16aを備えた搬送
機構であるローダ16により4個同時に予備加熱装置2
に移載されて予備加熱され、次いで供給整列部12に搬
送される。前記整列部12、13の移動領域からトレー
載置部1A〜1Dとは反対側のY方向に離れた検査位置
には、リング状の保持体20に保持されたソケット部S
が配設されている。前記ソケット部Sは、デバイス10
のリード端子Rが接触してその下方のテストヘッド(図
示せず)にリード端子Rを電気的に接続する役割を有す
るものである。そしてこの検査装置は、デバイス10を
上面から保持し、このソケット部Sと整列部12、13
との間で搬送する搬送機構21を備えている。検査後の
デバイス10は収納用整列部13に搬送された後、前記
ローダ16と同様に4個の吸着保持部17aを備えたア
ンローダ17により検査結果に応じてトレー載置部1
C、1D上のトレーTに分類して搬送される。
As for the devices 10 in the tray T on the tray placing parts 1A and 1B, four devices 10 at the same time are preheated by the loader 16 which is a transfer mechanism having four adsorption holding parts 16a.
And is preheated, and then conveyed to the supply alignment unit 12. The socket portion S held by the ring-shaped holder 20 is located at the inspection position away from the moving area of the aligning portions 12, 13 in the Y direction on the side opposite to the tray mounting portions 1A to 1D.
Is provided. The socket S is the device 10
The lead terminals R come into contact with each other to electrically connect the lead terminals R to a test head (not shown) therebelow. The inspection apparatus holds the device 10 from the upper surface, and the socket section S and the alignment sections 12 and 13 are held.
It is provided with a transport mechanism 21 for transporting between and. After the inspection, the device 10 is conveyed to the storage aligning unit 13 and then, similarly to the loader 16, an unloader 17 having four suction holding units 17a is used to detect the tray mounting unit 1 according to the inspection result.
The trays C on C and 1D are sorted and transported.

【0017】次に本発明の実施例である前記予備加熱装
置2について詳述する。この予備加熱装置2は図2〜図
4に示すように、被検査物を載置するための例えばアル
ミニウムやステンレスなどからなる載置板部3と、この
載置板部3の下面側に例えばネジ止めなどにより着脱自
在に取り付けられた温調ユニット例えば加熱ユニット4
とを備えており、載置板部3の表面部には夫々1個ずつ
のデバイス10が収納される大きさの例えば多数の凹部
5が縦横に配列して形成され、多数のデバイス10が同
時に加熱できるように構成されている。
Next, the preheating device 2 which is an embodiment of the present invention will be described in detail. As shown in FIGS. 2 to 4, the preheating device 2 includes a mounting plate portion 3 for mounting an inspection object, for example, made of aluminum or stainless steel, and a lower surface side of the mounting plate portion 3, for example. A temperature control unit such as a heating unit 4 which is detachably attached by screwing or the like.
And a plurality of recesses 5 each having a size for accommodating one device 10 are formed vertically and horizontally on the surface of the mounting plate 3. It is configured to be heated.

【0018】前記凹部5の底面中央には、周囲の底面よ
りもデバイス10の載置面が高くなるようにデバイスの
載置台部6が形成されており、周囲の底面に対する載置
面の高さは、載置面にデバイス10の本体を置いたとき
にリード端子Rが前記底面から浮いた状態となるように
設定されている。ここでデバイスが同じ品種例えば0.
5mmピッチで配列された208ピンのリード端子を有
する28mm×28mmサイズのデバイスであってもメ
ーカによりサイズが僅かではあるが異なり、従って同一
品種でありながら種類の異なるものとなる。載置板部3
が当該品種のデバイスを予備加熱するものである場合前
記載置台部6の載置面は、検査対象となる種類のデバイ
スの中でデバイスの本体の最も小さいものよりも狭く例
えば22mm×22mmのサイズに作られると共に、凹
部5については、縦×横が38mm×38mmの寸法に
設定され、デバイスを載置台部6に置いたときにデバイ
スの上面が載置板部3の表面から例えば約3mm沈むよ
うに設定されている。更に前記載置台部6の中央部には
真空吸着のための吸引孔61が穿設されている。一方前
記加熱ユニット4は、肉厚の板状のユニット本体41内
に例えば抵抗発熱体よりなるヒータ42が埋設されると
共に、前記載置台部6の吸引孔61に対して夫々載置板
部3の裏面側で連通する吸引路43が形成されている。
この吸引路43の吸引側の端部は、例えば図示しない吸
引手段から伸びる吸引管に連通している。
At the center of the bottom surface of the recess 5, a device mounting table 6 is formed so that the mounting surface of the device 10 is higher than the surrounding bottom surface, and the height of the mounting surface with respect to the surrounding bottom surface. Is set so that the lead terminal R floats from the bottom surface when the main body of the device 10 is placed on the mounting surface. Here, the devices are the same type, for example, 0.
Even a device of 28 mm × 28 mm size having 208-pin lead terminals arranged at a pitch of 5 mm is slightly different in size depending on the manufacturer, and therefore the same product type but different types. Mounting plate part 3
Is a device for preheating a device of the type, the mounting surface of the mounting table 6 is narrower than the smallest device body of the types of devices to be inspected, for example, a size of 22 mm × 22 mm. In addition, the recess 5 is set to have a size of length × width of 38 mm × 38 mm, and when the device is placed on the mounting table part 6, the upper surface of the device sinks from the surface of the mounting plate part 3 by, for example, about 3 mm. It is set to Further, a suction hole 61 for vacuum suction is formed in the central portion of the mounting table portion 6 described above. On the other hand, in the heating unit 4, a heater 42 made of, for example, a resistance heating element is embedded in a thick plate-shaped unit body 41, and the mounting plate portions 3 are respectively inserted into the suction holes 61 of the mounting table portion 6. A suction path 43 communicating with the back surface side of is formed.
The end of the suction path 43 on the suction side communicates with, for example, a suction tube extending from a suction means (not shown).

【0019】次いで上述の予備加熱装置2に対するデバ
イス10の受け渡し及び予備加熱装置2の作用について
述べる。先ず既述したようにローダ16(図1及び図4
参照)がトレーT上のデバイス10の上面を吸着保持し
て4個のデバイス10を同時に搬送する。そして予備加
熱装置2において、ローダ16はデバイス10を載置台
部6の上に載置し、一方吸引孔61によりデバイス10
の下面を真空吸着すると共にローダ16側の真空吸着を
解除する。これによりローダ16からデバイス10が予
備加熱装置2側に安定して受け渡され載置台部6上に載
置される。
Next, the delivery of the device 10 to the above-mentioned preheating device 2 and the operation of the preheating device 2 will be described. First, as described above, the loader 16 (see FIGS. 1 and 4)
(Refer to FIG. 4) sucks and holds the upper surface of the device 10 on the tray T and simultaneously conveys the four devices 10. Then, in the preheating device 2, the loader 16 mounts the device 10 on the mounting table portion 6, while the suction holes 61 allow the device 10 to move.
The lower surface of the loader is vacuum-sucked and the vacuum suction on the loader 16 side is released. As a result, the device 10 is stably transferred from the loader 16 to the preheating device 2 side and placed on the mounting table 6.

【0020】そして載置台部6はヒータ42により加熱
されており、その熱がデバイス10に伝熱されてデバイ
ス10は例えば150℃に予備加熱される。続いて載置
台部6側の真空吸着を解除すると共に前記ローダ16に
より予備加熱装置2内の4個のデバイス10が同時に吸
着保持されて供給整列部12内に搬送される。即ち前記
トレーTにおいてデバイス10の向きはある程度揃って
おり、また予備加熱装置2においてもデバイス10の向
きは概ね揃っているが、ソケット部Sにてデバイス10
の各リード端子Rとソケット部Sの電極とを確実に接触
させるために、予備加熱されたデバイス10は、逆角錐
台状に形成された位置合わせ用の凹部を有する供給整列
部12上に一旦搬送される。
The mounting table 6 is heated by the heater 42, and the heat is transferred to the device 10 to preheat the device 10 to 150 ° C., for example. Then, the vacuum suction on the mounting table portion 6 side is released, and at the same time, the four devices 10 in the preheating device 2 are suction-held by the loader 16 and conveyed to the supply alignment portion 12. That is, the orientations of the devices 10 are aligned to some extent in the tray T, and the orientations of the devices 10 are also aligned in the preheating device 2, but the devices 10 are aligned in the socket S.
In order to ensure the contact between each lead terminal R and the electrode of the socket portion S, the preheated device 10 is temporarily placed on the supply aligning portion 12 having an inverted pyramid-shaped recess for alignment. Be transported.

【0021】このような予備加熱装置2によれば、載置
台部6にてデバイス10を真空吸着した後ローダ16の
真空吸着を解除するので、デバイス10の受け渡しが安
定し、デバイス10が載置台部6からずれ落ちて傾くな
どといったおそれもない。そして載置台部6の周縁には
従来のようにリブが設けられていないので、予備加熱装
置2に搬送する前にプリアライメントを行わなくてもよ
く、つまり整列部を設けなくてよいしかつ搬送工程がそ
の分少なくなり、また同一品種のデバイス10において
複数の種類が存在しても(デバイス10の本体のサイズ
が多少異なっても)、各種類のデバイス10と載置台部
6の載置面の大きさとを1対1で対応づけなくてよく、
載置面を各種類のデバイスに対して共通化できる。従っ
てデバイスの品種毎に載置板部3を共通化でき、従来の
ようにリブの寸法が僅かに異なる品種交換部品(載置板
部)を多数用意しなくて済み、品種交換部品を削減でき
る。
According to such a preheating device 2, since the device 10 is vacuum-sucked by the mounting table portion 6 and then the vacuum suction of the loader 16 is released, the delivery of the device 10 is stabilized and the device 10 is mounted. There is no fear of slipping from the portion 6 and tilting. Since ribs are not provided on the periphery of the mounting table portion 6 as in the conventional case, pre-alignment does not have to be performed before the transportation to the preheating device 2, that is, the alignment portion does not have to be provided and the transportation is required. Even if there are a plurality of types of devices 10 of the same type (even if the size of the body of the device 10 is slightly different), the number of steps is reduced, and the types of devices 10 and the mounting surface of the mounting table 6 are different. You don't have to make one-to-one correspondence with the size of
The mounting surface can be made common to each type of device. Therefore, the mounting plate portion 3 can be made common for each device type, and it is not necessary to prepare a large number of product type replacement parts (mounting plate parts) having slightly different rib dimensions, which can reduce the number of product type replacement parts. .

【0022】そして載置板部3は高価なものであるか
ら、共通化を図ることによりコストを低く抑えることが
できるし、また載置板部3の交換作業も少なくなる。更
にデバイス10を載置台部6に真空吸着しているのでデ
バイス10と載置台部6とが高い密着性をもって接触
し、このため加熱ユニット4の熱が効率よくデバイス1
0に伝熱され、加熱ユニット4の電力を節約できる。ま
たデバイス10は凹部の中に置かれるため外気の影響が
少なくなり、外気の温度によるデバイス10の加熱温度
のばらつきが小さくなる。
Since the mounting plate 3 is expensive, the cost can be kept low by making it common, and the replacement work of the mounting plate 3 can be reduced. Further, since the device 10 is vacuum-adsorbed on the mounting table portion 6, the device 10 and the mounting table portion 6 come into contact with each other with high adhesion, so that the heat of the heating unit 4 is efficiently supplied to the device 1.
The heat is transferred to 0, and the electric power of the heating unit 4 can be saved. Further, since the device 10 is placed in the recess, the influence of the outside air is reduced, and the variation in the heating temperature of the device 10 due to the temperature of the outside air is reduced.

【0023】以上において本発明の温調装置は被検査物
を加熱するものに限らず、加熱ユニットの代りに冷却ユ
ニットを用い、被検査物を所定温度に冷却するものであ
ってもよい。
In the above, the temperature control device of the present invention is not limited to the one for heating the inspection object, but a cooling unit may be used instead of the heating unit to cool the inspection object to a predetermined temperature.

【0024】[0024]

【発明の効果】本発明によれば、被検査物を加熱あるい
は冷却するにあたって種類の異なる被検査物に対して載
置板部を共通化でき、また被検査物を効率よく加熱ある
いは冷却することができる。
According to the present invention, when heating or cooling an object to be inspected, the mounting plate portion can be made common to the objects to be inspected of different types, and the object to be inspected can be efficiently heated or cooled. You can

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例の温調装置を用いた検査装置の
全体構成を示す概観斜視図である。
FIG. 1 is a schematic perspective view showing an overall configuration of an inspection device using a temperature control device according to an embodiment of the present invention.

【図2】本発明の温調装置を予備加熱装置に適用した実
施例を示す平面図である。
FIG. 2 is a plan view showing an embodiment in which the temperature control device of the present invention is applied to a preheating device.

【図3】前記予備加熱装置の要部を示す断面図である。FIG. 3 is a sectional view showing a main part of the preheating device.

【図4】前記予備加熱装置の要部を示す斜視図である。FIG. 4 is a perspective view showing a main part of the preheating device.

【図5】検査装置に用いられる予備加熱装置の従来例の
要部を示す斜視図である。
FIG. 5 is a perspective view showing a main part of a conventional example of a preheating device used in an inspection device.

【図6】検査装置に用いられる予備加熱装置の従来例の
要部を示す断面図である。
FIG. 6 is a cross-sectional view showing a main part of a conventional example of a preheating device used in an inspection device.

【符号の説明】[Explanation of symbols]

10 デバイス 2 予備加熱装置 3 載置板部 4 加熱ユニット 42 ヒータ 5 凹部 6 載置台部 61 吸引孔 R リード端子 10 device 2 preheating device 3 mounting plate part 4 heating unit 42 heater 5 recessed part 6 mounting table part 61 suction hole R lead terminal

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 端子部を備えた被検査物を加熱または冷
却する装置であって、加熱または冷却された被検査物を
検査位置にて電気的特性について検査する検査装置に用
いられる温調装置において、 被検査物が配置される凹部が表面部に形成された載置板
部と、この載置板部を加熱または冷却する温調ユニット
と、を備え、 前記凹部の中には、真空吸着用の吸引孔が開口し被検査
物を載置するための載置台部が形成されていることを特
徴とする温調装置。
1. A device for heating or cooling an inspected object having a terminal portion, which is used as an inspecting device for inspecting a heated or cooled inspected object for electrical characteristics at an inspection position. In the above, there is provided a mounting plate part having a concave part formed on the surface part for arranging an object to be inspected, and a temperature control unit for heating or cooling the mounting plate part. A temperature adjusting device, wherein a suction hole for use is opened and a mounting table for mounting an object to be inspected is formed.
【請求項2】 被検査物は搬送機構により上面が吸着保
持されて載置台部に搬送されることを特徴とする請求項
1記載の温調装置。
2. The temperature controller according to claim 1, wherein the object to be inspected is conveyed to the mounting table portion with its upper surface being sucked and held by a conveying mechanism.
【請求項3】 被検査物の端子部は、被検査物の本体の
下方側に伸びるリード端子よりなり、載置台部は、被検
査物の本体よりも狭く、かつ周囲の底面にリード端子が
接触しないように周囲よりも高く構成されていることを
特徴とする請求項1または2記載の温調装置。
3. The terminal part of the object to be inspected comprises a lead terminal extending to the lower side of the body of the object to be inspected, the mounting table part is narrower than the body of the object to be inspected, and the lead terminals are provided on the peripheral bottom surface. The temperature control device according to claim 1 or 2, wherein the temperature control device is configured to be higher than the surroundings so as not to come into contact with each other.
【請求項4】 被検査物が載置板部の表面より突出しな
いように凹部の深さが設定されていることを特徴とする
請求項1、2または3記載の温調装置。
4. The temperature control device according to claim 1, wherein the depth of the recess is set so that the object to be inspected does not protrude from the surface of the mounting plate.
【請求項5】 載置板部の表面部には、複数の被検査物
が夫々配置される複数の凹部が形成されていることを特
徴とする請求項1、2、3または4記載の温調装置。
5. The temperature according to claim 1, 2, 3 or 4, wherein a plurality of recesses in which a plurality of objects to be inspected are arranged are formed on a surface portion of the mounting plate portion. Adjustment device.
【請求項6】 載置板部は温調ユニットに着脱自在に取
り付けられていることを特徴とする請求項1、2、3、
4または5記載の温調装置。
6. The mounting plate portion is detachably attached to the temperature control unit.
The temperature control device according to 4 or 5.
JP6200139A 1994-08-01 1994-08-01 Temperature-regulating device Pending JPH0843482A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6200139A JPH0843482A (en) 1994-08-01 1994-08-01 Temperature-regulating device
US08/509,284 US5708222A (en) 1994-08-01 1995-07-31 Inspection apparatus, transportation apparatus, and temperature control apparatus
KR1019950023666A KR100274310B1 (en) 1994-08-01 1995-08-01 Inspection device, conveying device and temperature controller
TW084108150A TW286364B (en) 1994-08-01 1995-08-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6200139A JPH0843482A (en) 1994-08-01 1994-08-01 Temperature-regulating device

Publications (1)

Publication Number Publication Date
JPH0843482A true JPH0843482A (en) 1996-02-16

Family

ID=16419444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6200139A Pending JPH0843482A (en) 1994-08-01 1994-08-01 Temperature-regulating device

Country Status (1)

Country Link
JP (1) JPH0843482A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002214288A (en) * 2000-12-20 2002-07-31 Hanmi Co Ltd Handler system for cutting semiconductor package device
JP2007059727A (en) * 2005-08-25 2007-03-08 Nidec-Read Corp Substrate inspection device and substrate inspection method
JP2007057442A (en) * 2005-08-25 2007-03-08 Nidec-Read Corp Substrate holding table
JP2014202659A (en) * 2013-04-08 2014-10-27 富士電機株式会社 Semiconductor measurement device and semiconductor measurement method
KR20180052906A (en) * 2016-11-11 2018-05-21 세메스 주식회사 Chuck for supporting semiconductor devices and apparatus for testing the semiconductor devices having the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002214288A (en) * 2000-12-20 2002-07-31 Hanmi Co Ltd Handler system for cutting semiconductor package device
JP2007059727A (en) * 2005-08-25 2007-03-08 Nidec-Read Corp Substrate inspection device and substrate inspection method
JP2007057442A (en) * 2005-08-25 2007-03-08 Nidec-Read Corp Substrate holding table
JP2014202659A (en) * 2013-04-08 2014-10-27 富士電機株式会社 Semiconductor measurement device and semiconductor measurement method
KR20180052906A (en) * 2016-11-11 2018-05-21 세메스 주식회사 Chuck for supporting semiconductor devices and apparatus for testing the semiconductor devices having the same

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